Phase change cold plate, high heat flux electronic device heat dissipation assembly, system, and method

Abstract

The application discloses a phase change cold plate, a high heat flux density electronic equipment heat dissipation assembly, a system and a method. The phase change cold plate is provided with at least two cavities which are not communicated with each other, and each cavity is communicated with an energy storage device. When the high heat flux density electronic equipment operates in a first mode, the working medium in the input cavity absorbs heat from the high heat flux density electronic equipment, and the working medium flowing from the cavity into the energy storage device transmits the heat absorbed by the working medium to the energy storage device to recover cold. When the high heat flux density electronic equipment operates in a second mode, the working medium flowing from the cavity into the energy storage device absorbs heat of the energy storage device to make the energy storage device recover heat accumulation. For the heat dissipation system adopting the phase change cold plate, the volume, weight and power consumption of the system can be reduced, the compactness, light weight and low power consumption of the system can be realized, the mobility of the system can be improved, the system can be applied to mobile equipment, and the system is more convenient to adapt to the variable operating mode of working conditions.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the field of heat dissipation, and in particular to a phase change cold plate. Embodiments of the present application also relate to a high heat flux electronic device heat dissipation assembly employing the phase change cold plate, a high heat flux electronic device heat dissipation system comprising the high heat flux electronic device heat dissipation assembly, and a high heat flux electronic device heat dissipation method employing the high heat flux electronic device heat dissipation system. BACKGROUND

[0002] The continuous development of electronic technology has led to the continuous improvement of the integration and performance of electronic devices, and in turn, the continuous increase of the power and heat flux density thereof. Therefore, a high heat flux electronic device will generate a large amount of heat during operation. In order to avoid the high temperature affecting the performance and operational stability of the high heat flux electronic device, the existing solution employs liquid cooling technology, such as a heat dissipation system using single-phase liquid cooling plate heat exchange or gas-liquid two-phase boiling heat exchange based on the phase change principle, to dissipate heat from the high heat flux electronic device, which can meet the heat dissipation requirements of the high heat flux electronic device.

[0003] In the process of implementing the present application, the inventors have found that at least the following problems exist in the prior art:

[0004] In the existing solution, the system still needs to be configured with the maximum cooling capacity. For the heat dissipation system of the high heat flux electronic device, the volume, weight and power consumption of the system are large, the mobility of the system is limited, and great inconvenience is brought to the user. SUMMARY

[0005] In view of the problem of the large volume, weight and power consumption of the heat dissipation system of the high heat flux electronic device in the prior art, embodiments of the present application provide a phase change cold plate, a high heat flux electronic device heat dissipation assembly, system and method, which can reduce the volume, weight and power consumption of the system and improve the mobility of the system.

[0006] In a first aspect, embodiments of the present application provide a phase change cold plate applied to a heat dissipation system, wherein the heat dissipation system is used to dissipate heat from a high heat flux electronic device.

[0007] The phase change cold plate is provided with at least two cavities that are not in communication with each other, and each cavity is in communication with an energy storage device of the heat dissipation system.

[0008] The phase change cold plate and the heat dissipation system are connected to form a loop, and the heat dissipation system is filled with a working medium.

[0009] When the high heat flux density electronic device is operating in the first mode, the working fluid input into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device from the cavity transfers the absorbed heat to the energy storage device to restore the cooling capacity.

[0010] When the high heat flux density electronic device is operating in the second mode, the working fluid input into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device from the cavity absorbs the heat from the energy storage device, so that the energy storage device can restore its stored heat.

[0011] The phase change cold plate provided in this embodiment has at least two non-communicating cavities. When the phase change cold plate is applied to a heat dissipation system, each cavity of the phase change cold plate is connected to the energy storage device of the heat dissipation system, so that the working fluid can flow from the cavity into the energy storage device and / or flow from the energy storage device into the cavity. When the high heat flux density electronic device is operating in the first mode, the working fluid in the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing from the cavity into the energy storage device transfers the absorbed heat to the energy storage device to restore the cooling capacity, so that the working fluid flowing out of the phase change cold plate does not have to take away all the heat generated by the high heat flux density electronic device, so the circulation volume of the working fluid does not have to reach the maximum cooling capacity. When the high heat flux density electronic device is operating in the second mode, the working fluid flowing from the cavity into the energy storage device absorbs the heat of the energy storage device, so that the energy storage device restores the stored heat. In this way, throughout the entire operating cycle, not only can the maximum temperature of high heat flux density electronic equipment be controlled within a certain range to meet the heat dissipation requirements of high heat flux density electronic equipment, but also the system equipment does not need to be configured with maximum cooling capacity, allowing for the use of smaller system equipment and reducing the amount of working fluid charged into the system. Therefore, for the heat dissipation system using the phase change cold plate provided in the embodiments of this application, the system volume, weight and power consumption can be reduced, which is conducive to achieving system compactness, lightweighting and low power consumption, improving system portability, making it suitable for mobile devices, and making it easier to adapt to the changing operating modes of working conditions.

[0012] Secondly, embodiments of this application provide a heat dissipation component for a high heat flux density electronic device, which is applied to a heat dissipation system for a high heat flux density electronic device. The heat dissipation component for the high heat flux density electronic device includes: at least one phase change cold plate and at least one energy storage device; the phase change cold plate is the phase change cold plate described in the first aspect.

[0013] Each of the energy storage devices is in communication with at least one of the cavities of the phase change cold plate;

[0014] Wherein: the phase change cold plate and the high heat flux density electronic device heat dissipation system are connected to form a circuit, and the high heat flux density electronic device heat dissipation system is filled with working fluid;

[0015] When the high heat flux density electronic device is operating in the first mode, the working fluid input into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device from the cavity transfers the absorbed heat to the energy storage device to restore the cooling capacity.

[0016] When the high heat flux density electronic device is operating in the second mode, the working fluid input into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device from the cavity absorbs the heat from the energy storage device, so that the energy storage device can restore its stored heat.

[0017] The high heat flux density electronic device heat dissipation assembly provided in this application includes at least one phase change cold plate and at least one energy storage device. Each phase change cold plate is provided with at least two non-communicating cavities, and each energy storage device is connected to at least all cavities of one phase change cold plate, allowing working fluid to flow from the cavities into the energy storage device and / or allowing working fluid to flow from the energy storage device into the cavities. When the high heat flux density electronic device heat dissipation assembly provided in this application is applied to a high heat flux density electronic device heat dissipation system, when the high heat flux density electronic device is operating in a first mode, the working fluid entering the cavity absorbs the heat from the high heat flux density electronic device, while the working fluid flowing from the cavity into the energy storage device transfers its heat to the energy storage device to restore cooling capacity. This ensures that the working fluid flowing out of the phase change cold plate does not have to carry away all the heat generated by the high heat flux density electronic device, thus the circulation rate of the working fluid does not have to reach the maximum cooling capacity. When the high heat flux density electronic device is operating in the first mode, the working fluid flowing from the cavity into the energy storage device absorbs the heat from the energy storage device, allowing the energy storage device to restore its stored heat. In this way, throughout the entire operating cycle, not only can the maximum temperature of high heat flux density electronic devices be controlled within a certain range to meet the heat dissipation requirements of high heat flux density electronic devices, but also the system equipment does not need to be configured with maximum cooling capacity, allowing for the use of smaller system equipment. Furthermore, the amount of working fluid charged in the system can be reduced. Therefore, for the heat dissipation system using the heat dissipation components of high heat flux density electronic devices provided in the embodiments of this application, the system's volume, weight, and power consumption can be reduced, which is conducive to achieving system compactness, lightweighting, and low power consumption, improving system portability, making it suitable for mobile devices, and making it easier to adapt to the changing operating modes of working conditions.

[0018] Optionally, there are multiple phase change cold plates and multiple energy storage devices;

[0019] Each of the phase change cold plates is connected to only one of the energy storage devices, and each of the energy storage devices is connected to only one of the phase change cold plates.

[0020] Optionally, the number of phase change cold plates is multiple, and the number of energy storage devices is one;

[0021] Each of the phase change cold plates is connected to the energy storage device.

[0022] Optionally, the number of both the phase change cold plate and the energy storage device is one.

[0023] Thirdly, embodiments of this application provide a heat dissipation system for high heat flux density electronic devices, including: a compressor, a condenser, a throttling device, and a heat dissipation component, wherein the heat dissipation component is a high heat flux density electronic device heat dissipation component according to any one of the second aspects;

[0024] The compressor, the condenser, the throttling device, and the heat dissipation assembly are connected in sequence through pipelines to form a circulation loop, and the working fluid circulates in the circulation loop;

[0025] Each phase change cold plate has at least one cavity connected to the output end of the throttling device, and each phase change cold plate has at least one cavity connected to the inlet end of the compressor;

[0026] The compressor is used to draw in, compress, and deliver the working fluid;

[0027] The throttling device is used to adjust the saturation temperature of the working fluid.

[0028] Optional features also include: an oil separator;

[0029] The oil separator is located between the compressor and the condenser and is used to separate the lubricating oil from the working fluid.

[0030] Optionally, it may also include: an on / off control device;

[0031] The compressor is provided with an oil return port, and the oil separator is provided with an oil separation port;

[0032] One end of the on / off control device is connected to the oil return port, and the other end is connected to the oil separator port.

[0033] Optional features also include: a liquid storage tank;

[0034] The liquid storage tank is located between the condenser and the throttling device, and is used to adjust the circulation rate of the working fluid when the operating conditions change.

[0035] Optional features also include: a gas-liquid separator;

[0036] The gas-liquid separator is disposed between the phase change cold plate and the compressor, and is used to separate the gaseous and liquid components of the working fluid.

[0037] The high heat flux density electronic device heat dissipation system provided in this application embodiment has the same beneficial effects as the high heat flux density electronic device heat dissipation component provided in the application embodiment because it has the high heat flux density electronic device heat dissipation component described in any of the second aspects.

[0038] Fourthly, embodiments of this application provide a heat dissipation method for high heat flux density electronic devices, employing the high heat flux density electronic device heat dissipation system described in the third aspect. The heat dissipation system includes an energy storage device and a throttling device. The high heat flux density electronic device heat dissipation method includes:

[0039] When a high heat flux density electronic device is overclocked, the first temperature of the high heat flux density electronic device is obtained.

[0040] Determine whether the first temperature exceeds the first preset threshold;

[0041] If so, the throttling device is adjusted based on the first temperature and the second temperature of the material or working fluid inside the energy storage device, so that the saturation temperature of the working fluid is lower than the first temperature and higher than the second temperature.

[0042] or,

[0043] When the high heat flux density electronic device is operating at its rated speed, the third temperature of the high heat flux density electronic device is obtained;

[0044] Determine whether the third temperature exceeds the second preset threshold;

[0045] If the temperature exceeds the specified value, the throttling device is adjusted based on the third temperature and the fourth temperature of the material or working fluid inside the energy storage device, so that the saturation temperature of the working fluid is lower than the third temperature and lower than the fourth temperature.

[0046] The heat dissipation method for high heat flux density electronic devices provided in this application embodiment, by applying the heat dissipation system described in any of the third aspects, enables the high heat flux density electronic device heat dissipation system provided in this application embodiment to have the same beneficial effects as the high heat flux density electronic device heat dissipation component provided in this application embodiment. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of one embodiment of the heat dissipation component of this application;

[0048] Figure 2 This is a schematic diagram of one embodiment of the heat dissipation system of this application;

[0049] Figure 3 This is a schematic diagram of another embodiment of the heat dissipation system of this application;

[0050] Figure 4This is a schematic diagram of another embodiment of the heat dissipation system of this application;

[0051] Figure 5 This is a schematic diagram of another embodiment of the heat dissipation system of this application. Detailed Implementation

[0052] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0053] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0054] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0055] The continuous development of electronic technology has led to increased integration and performance of electronic devices, resulting in higher power and heat flux densities. Consequently, high heat flux density electronic devices generate enormous amounts of heat during operation. To prevent excessive temperature from affecting the performance and operational stability of these devices, heat dissipation is necessary. Common heat dissipation methods include air cooling and liquid cooling. Air cooling, due to its inherent physical properties, has low heat dissipation capacity and is highly susceptible to environmental influences, making it unsuitable for the heat dissipation needs of high heat flux density electronic devices. Liquid cooling offers superior heat dissipation capabilities and is gaining increasing attention; however, common components in water systems, such as water tanks, pumps, and heat exchangers, are large and heavy, resulting in a large system size and weight, poor mobility, and thus limiting its use and failing to meet the heat dissipation requirements of mobile devices. While liquid cooling systems utilizing single-phase liquid cooling plates or the phase change principle through gas-liquid two-phase boiling heat exchange can meet the heat dissipation needs of high heat flux density electronic devices, they present the following problems:

[0056] 1. Liquid cooling systems that utilize single-phase liquid cooling plates for heat dissipation require a large flow rate of cooling medium to meet the high heat flux density of heat dissipation, and the system equipment must be configured with maximum cooling capacity. Therefore, the system has a large size and weight, which limits its application in mobile devices and inevitably increases the system power consumption.

[0057] 2. Liquid cooling systems that utilize the phase change principle to dissipate heat through gas-liquid two-phase boiling heat exchange are suitable for high heat flux density electronic devices operating under variable conditions, such as intermittent operation in rated mode and overclocking mode. If only gas-liquid two-phase boiling heat exchange is used, the system still needs to be configured with maximum cooling capacity. For small systems of high heat flux density electronic devices, the system's size, weight, and power consumption are still excessive. In other words, the system's size, weight, and power consumption are relatively large, which limits its portability and restricts its application in mobile devices.

[0058] Therefore, the liquid cooling system in the existing solution still needs to be configured with the maximum cooling capacity. For small systems of high heat flux density electronic devices, the system size, weight and power consumption are large, the portability of the system is restricted, and it causes great inconvenience to users.

[0059] To reduce the size, weight, and power consumption of liquid cooling systems and improve system portability, this application provides a phase change cold plate for use in cooling systems for high heat flux density electronic devices. While meeting the heat dissipation requirements of high heat flux density electronic devices, the cooling system using the phase change cold plate provided in this application does not need to be configured with maximum cooling capacity, thereby achieving system compactness, lightweighting, and low energy consumption.

[0060] The phase change cold plate provided in this application is described below.

[0061] The phase change cold plate provided in this application is used in a heat dissipation system for dissipating heat from electronic devices with high heat flux density. The phase change cold plate has at least two non-communicating cavities, which can be used to absorb the heat generated by high heat flux density electronic devices and exchange heat with the working fluid flowing into the cavities, so that the working fluid carries away the heat from the high heat flux density electronic devices during the flow process. Each cavity is connected to the energy storage device of the heat dissipation system, that is, there is a connecting branch between the energy storage device and each cavity, so that the working fluid can flow from the cavity into the energy storage device and / or flow from the energy storage device into the cavity. It can be understood that each cavity of the phase change cold plate has a working fluid inlet and a working fluid outlet for the working fluid to flow into and out of the cavity. Correspondingly, the energy storage device has an input port and an output port to cooperate with the phase change cold plate. The energy storage device can be a phase change energy storage device or a non-phase change energy storage device, which can be used for heat storage. The energy storage device provided in this application is preferably a phase change energy storage device, that is, the energy storage device is preferably a phase change energy storage device, and heat storage is achieved through the phase change reaction of the phase change energy storage device.

[0062] Among them: the heat dissipation system is filled with working fluid. When the phase change cold plate is applied to the heat dissipation system, the phase change cold plate and the heat dissipation system are connected to form a loop, and the working fluid circulates in the loop.

[0063] When the high heat flux density electronic device is operating in the first mode, the working fluid in the input cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing from the cavity into the energy storage device transfers the heat it has absorbed to the energy storage device to restore the cooling capacity.

[0064] When the high heat flux density electronic device is operating in the second mode, the working fluid in the input cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing from the cavity into the energy storage device absorbs the heat from the energy storage device, so that the energy storage device can restore its stored heat.

[0065] Understandably, the first mode here can be an overclocking mode. High heat flux density electronic devices operating in the first mode means that the high heat flux density electronic devices are operating in overclocking mode. Overclocking mode refers to the mode of operation beyond the rated frequency / power. Correspondingly, the second mode here can be the rated mode. High heat flux density electronic devices operating in the second mode means that the high heat flux density electronic devices are operating in the rated mode. Rated mode refers to the mode of operation at the rated frequency / power.

[0066] Furthermore, the heat dissipation system has a working fluid output end and a working fluid return end. The working fluid output end is connected to the working fluid inlet of at least one cavity of the phase change cold plate, and the working fluid return end is connected to the working fluid outlet of at least one cavity of the phase change cold plate. The heat dissipation system is filled with working fluid. Driven by the heat dissipation system, the working fluid first flows into at least one cavity through the working fluid output end for heat exchange, then flows into the energy storage device through the working fluid outlet of the corresponding cavity for heat exchange, and then flows from the energy storage device into the corresponding cavity for heat exchange, and then flows into the working fluid outlet of the corresponding cavity. The working fluid flows into the energy storage device or into the working fluid return end. The working fluid eventually flows into the cavity connected to the working fluid return end and flows from the working fluid outlet of the cavity back into the working fluid return end to realize the working fluid return of the heat dissipation system for the next cycle. It can be understood that the heat dissipation system here, in addition to the energy storage device, generally also has a compressor, condenser and throttling device connected in sequence by pipelines. Therefore, the working fluid output end can be the output end of the throttling device, and the working fluid return end can be the intake end of the compressor. The specifics are not limited here.

[0067] When high heat flux density electronic equipment is overclocked, the working fluid flowing from the cavity into the energy storage device stores at least a portion of the heat it absorbs in the energy storage device so that the working fluid can recover at least a portion of its cooling capacity.

[0068] When high heat flux density electronic equipment is operating at its rated capacity, the working fluid flowing from the cavity into the energy storage device absorbs the heat stored in the energy storage device, thereby restoring the stored heat. Here, high heat flux density electronic equipment refers to equipment with a heat flux density higher than 100 W / cm², which can be lasers, IGBT modules, etc., but is not specifically limited here.

[0069] In one specific embodiment, please refer to Figure 1The phase change cold plate 4 has two cavities, which are not interconnected and each has a working fluid inlet and an outlet. For ease of understanding, the two cavities are divided into a first cavity 41 and a second cavity 42. The working fluid inlet of the first cavity 41 is connected to the working fluid output end of the heat dissipation system, and its working fluid outlet is connected to the energy storage device 5. The working fluid inlet of the second cavity 42 is connected to the energy storage device 5, and its working fluid outlet is connected to the working fluid return end of the heat dissipation system. When the high heat flux density electronic device is overclocked, driven by the heat dissipation system, the working fluid first flows into the first cavity 41 through the working fluid output end and the working fluid inlet of the first cavity 41 for heat exchange. The working fluid absorbs heat from the high heat flux density electronic device, and then flows into the energy storage device 5 through the working fluid outlet of the first cavity 41 for heat exchange. The working fluid stores at least a portion of the absorbed heat in the energy storage device 5, restoring at least a portion of the cooling capacity, and then flows from the energy storage device 5 into the second cavity 42. During heat exchange, the working fluid absorbs heat from the high heat flux density electronic device again, and then flows into the working fluid return end through the working fluid outlet of the second cavity 42 to realize the working fluid return of the heat dissipation system for the next cycle. When the high heat flux density electronic device is running at its rated speed, driven by the heat dissipation system, the working fluid first exchanges heat in the first cavity 41 through the working fluid output end and the working fluid inlet of the first cavity 41, absorbing heat from the high heat flux density electronic device. Then, it flows into the energy storage device 5 through the working fluid outlet of the first cavity 41 for heat exchange, absorbing the heat stored in the energy storage device 5 to restore the heat storage capacity of the energy storage device 5. Then, it flows from the energy storage device 5 into the second cavity 42 for heat exchange, absorbing heat from the high heat flux density electronic device again, and then flows into the working fluid return end through the working fluid outlet of the second cavity 42 to realize the working fluid return of the heat dissipation system for the next cycle. In other words, for the overclocking operation of high heat flux density electronic devices, the working fluid flowing from the first cavity 41 into the energy storage device 5 stores (transfers) at least a portion of the heat it absorbs into the energy storage device 5, so that the working fluid can restore at least a portion of its cooling capacity, thereby improving the heat dissipation capacity of the working fluid to the second cavity 42; while for the rated operation of high heat flux density electronic devices, the working fluid flowing from the first cavity 41 into the energy storage device 5 absorbs the heat stored in the energy storage device 5, so that the energy storage device 5 can restore its stored heat. In this way, throughout the entire operating cycle, not only can the maximum temperature of the high heat flux density electronic devices be controlled within a certain range, but the system equipment does not need to be configured with maximum cooling capacity to cope with the overclocking operation of high heat flux density electronic devices. Therefore, for the heat dissipation system using the phase change cold plate provided in this application, the system volume, weight and power consumption can be reduced, which is conducive to achieving system compactness, lightweighting and low power consumption, improving system portability, making it suitable for mobile devices, and making it easier to adapt to the changing operating modes of the operating conditions.

[0070] In another specific embodiment, the phase change cold plate is provided with three cavities, which are not interconnected and each has a working fluid inlet and a working fluid outlet. For ease of understanding, the three cavities are divided into a first cavity, a second cavity, and a third cavity. Specifically, the working fluid inlets of the first and second cavities can be connected to the working fluid output end of the heat dissipation system, and the working fluid outlets of the first and second cavities can be connected to the energy storage device. The working fluid inlet of the third cavity is connected to the energy storage device, and its working fluid outlet is connected to the working fluid return end. In this case, the working fluid provided by the heat dissipation system will be divided into two parts, flowing into the first and second cavities respectively for heat exchange. After heat exchange, the working fluid in the first cavity flows into the energy storage device through the working fluid outlet of the first cavity for heat exchange, and the working fluid in the second cavity flows into the energy storage device through the working fluid outlet of the second cavity for heat exchange. Then, the working fluid flows from the energy storage device into the third cavity for heat exchange, and after heat exchange, the working fluid flows out of the third cavity... The working fluid flows from the outlet of the first cavity into the working fluid return end to achieve working fluid return of the heat dissipation system for the next cycle; alternatively, the working fluid inlet of the first cavity is connected to the working fluid output end of the heat dissipation system, and its working fluid outlet is connected to the energy storage device. The working fluid inlets of the second and third cavities are both connected to the energy storage device, and the working fluid outlets of the second and third cavities are both connected to the working fluid return end. In this case, the working fluid provided by the heat dissipation system flows into the first cavity for heat exchange through the working fluid output end and the working fluid inlet of the first cavity, and then flows into the energy storage device for heat exchange. After heat exchange in the energy storage device, the working fluid is divided into two parts and flows into the second and third cavities respectively for heat exchange. After heat exchange, the working fluid in the second cavity flows into the working fluid return end through the working fluid outlet of the second cavity, and the working fluid in the third cavity flows into the working fluid return end through the working fluid outlet of the third cavity, thus achieving working fluid return of the heat dissipation system for the next cycle. Of course, in other specific embodiments, the phase change cold plate can be configured with four or more independent plates, each with a working fluid inlet and a working fluid outlet. The connection method and working principle can be found in the preceding text and will not be repeated here. The shape and specific structural form of the phase change cold plate can be adaptively adjusted according to the high heat flux density electronic equipment being used to meet actual needs; specific details are not limited here.

[0071] To reduce the size, weight, and power consumption of liquid cooling systems and improve system portability, this application provides a heat dissipation component for high heat flux density electronic devices. This heat dissipation component is applied to heat dissipation systems for high heat flux density electronic devices and can achieve system compactness, lightweighting, and low energy consumption without configuring maximum cooling capacity while meeting the heat dissipation requirements of high heat flux density electronic devices.

[0072] The high heat flux density electronic device heat dissipation component provided in this application is described below.

[0073] Please see Figure 1The heat dissipation component 10 for high heat flux density electronic devices provided in this application is applied to a heat dissipation system for high heat flux density electronic devices. The heat dissipation system for high heat flux density electronic devices is used to dissipate heat for high heat flux density electronic devices. The heat dissipation component 10 includes: at least one phase change cold plate 4 and at least one energy storage device 5. The phase change cold plate 4 is the phase change cold plate described above.

[0074] Each energy storage device 5 is connected to at least all cavities of a phase change cold plate 4 to allow working fluid to flow from the cavities into the energy storage device 5 and / or to allow working fluid to flow from the energy storage device 5 into the cavities; it is understood that the energy storage device 5 here has an inlet and an outlet to be used in conjunction with the phase change cold plate 4.

[0075] Wherein: the phase change cold plate 4 is connected to the heat dissipation system of high heat flux density electronic equipment to form a loop. The heat dissipation system of high heat flux density electronic equipment is filled with working fluid, which circulates in the loop.

[0076] When the high heat flux density electronic device is operating in the first mode, the working fluid in the input cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing from the cavity into the energy storage device transfers the heat it has absorbed to the energy storage device to restore the cooling capacity.

[0077] When the high heat flux density electronic device is operating in the second mode, the working fluid in the input cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing from the cavity into the energy storage device absorbs the heat from the energy storage device, so that the energy storage device can restore its stored heat.

[0078] Furthermore, the high heat flux density electronic device heat dissipation system has an output end and a return end. Each phase change cold plate 4 has at least one cavity with a working fluid inlet connected to the output end, and each phase change cold plate 4 has at least one cavity with a working fluid outlet connected to the return end. The high heat flux density electronic device heat dissipation system is filled with a working fluid. Driven by the high heat flux density electronic device heat dissipation system, the working fluid first flows through the output end into the corresponding cavity of the phase change cold plate 4 for heat exchange, then flows through the working fluid outlet of the corresponding cavity into the corresponding energy storage device 5 for heat exchange, and then flows from the energy storage device 5 into the corresponding phase change cold plate 4. The heat exchange occurs in the corresponding cavity, and then the working fluid flows into the energy storage device 5 or into the return end through the working fluid outlet of the corresponding cavity. The working fluid eventually flows into the cavity connected to the return end and flows into the working fluid return end from the working fluid outlet of that cavity, so as to realize the working fluid return of the high heat flux density electronic device heat dissipation system for the next cycle. It can be understood that the high heat flux density electronic device heat dissipation system here generally has a compressor, condenser and throttling device connected in sequence. Therefore, the output end here can be the output end of the throttling device, and the return end can be the air inlet end of the compressor. The specifics are not limited here.

[0079] When high heat flux density electronic equipment is overclocked, the working fluid flowing from the cavity into the energy storage device 5 stores at least a portion of the heat it absorbs in the energy storage device 5, so that the working fluid can recover at least a portion of its cooling capacity.

[0080] When the high heat flux density electronic device is running at its rated speed, the working fluid flowing from the cavity into the energy storage device 5 absorbs the heat stored in the energy storage device 5, so that the energy storage device 5 can restore its stored heat.

[0081] The phase change cold plate 4 here is used to absorb the heat generated by high heat flux density electronic devices and exchange heat with the working fluid entering the phase change cold plate 4, so that the working fluid carries away the heat from the high heat flux density electronic devices during the flow process. Each phase change cold plate 4 is provided with at least two non-communicating cavities, each with a working fluid inlet and a working fluid outlet. "Non-communicating" here means not directly connected, allowing the working fluid to flow from the working fluid outlet of the phase change cold plate 4 into the energy storage device 5 and / or from the energy storage device 5 into the cavity of the phase change cold plate 4. That is, each cavity of the phase change cold plate 4 with a working fluid inlet and outlet can be connected to the energy storage device 5, so that the working fluid can flow from the cavity of the phase change cold plate 4 into the energy storage device 5 and / or from the energy storage device 5 into the cavity of the phase change cold plate 4. For ease of understanding, the description uses only two cavities of the phase change cold plate 4 as an example; this is only for illustrative purposes and does not mean that the number of cavities of the phase change cold plate 4 is limited to two. Specifically, the two cavities are divided into a first cavity 41 and a second cavity 42, both of which are provided with a working fluid inlet and a working fluid outlet. Here, the working fluid inlet of the first cavity 41 can be regarded as the working fluid inflow end of the phase change cold plate 4. The working fluid inlet of the first cavity 41 can be connected to the output end of the heat dissipation system of a high heat flux density electronic device. This output end can supply working fluids with different saturation temperatures, that is, the working fluid can enter the phase change cold plate 4 through the working fluid inlet of the first cavity 41. The working fluid outlet of body 41 can be connected to the input port of energy storage device 5, that is, the working fluid that has absorbed heat from high heat flux density electronic equipment in the first cavity 41 can enter the energy storage device 5 through the working fluid outlet of the first cavity 41 and the input port of energy storage device 5. The working fluid inlet of the second cavity 42 can be connected to the output port of energy storage device 5, that is, the working fluid after heat exchange in energy storage device 5 can re-enter the phase change cold plate 4 through the output port of energy storage device 5 and the working fluid inlet of the second cavity 42. The working fluid outlet of the second cavity 42 can... The working fluid outlet of the second cavity 42, which is considered the working fluid outlet of the phase change cold plate 4, can be used to connect to the return end of the heat dissipation system for high heat flux density electronic devices. This return end can be used to allow the working fluid to flow back to the compressor of the heat dissipation system for high heat flux density electronic devices. That is, the working fluid flowing out of the working fluid outlet of the second cavity 42 can flow back to the compressor of the heat dissipation system for high heat flux density electronic devices through this return end. Thus, the working fluid that has absorbed the heat of the high heat flux density electronic devices in the second cavity 42 can flow into the return end of the heat dissipation system for high heat flux density electronic devices through the working fluid outlet of the second cavity 42, so that the working fluid can flow back to the compressor of the heat dissipation system for high heat flux density electronic devices, thereby realizing the return of the working fluid of the heat dissipation system for high heat flux density electronic devices for the next cycle. In other words, each phase change cold plate 4 can be used to absorb the heat generated by the high heat flux density electronic devices and exchange heat with the working fluid entering it, so that the working fluid carries away the heat generated by the high heat flux density electronic devices during the flow process.High heat flux density electronic equipment refers to equipment with a heat flux density higher than 100W / cm2, which can be lasers, IGBT modules, etc., but is not specifically limited here.

[0082] The energy storage device 5 is used to absorb the heat of the working fluid flowing into the energy storage device 5 when the high heat flux density electronic device is overclocked, and to transfer the heat to the working fluid flowing into the energy storage device 5 when the high heat flux density electronic device is running at its rated speed. The energy storage device 5 is provided with an input port and an output port. The input port of the energy storage device 5 is connected to the working fluid outlet of the first cavity 41, and the output port of the energy storage device 5 is connected to the working fluid inlet of the second cavity 42. After the high heat flux density electronic device heat dissipation component provided in this application is connected to the high heat flux density electronic device heat dissipation system, that is, the working fluid inlet of the first cavity 41 of the phase change cold plate 4 of the heat dissipation component 10 is connected to the output end of the high heat flux density electronic device heat dissipation system, and the working fluid outlet of the second cavity 42 of the phase change cold plate 4 is connected to the return end of the high heat flux density electronic device heat dissipation system, when the working fluid output from the output end enters the phase change cold plate 4 through the working fluid inlet of the first cavity 41 of the phase change cold plate 4, the working fluid absorbs heat from the high heat flux density electronic device in the first cavity 41 and vaporizes into a low temperature and low pressure working fluid (steam) or a gas-liquid mixture working fluid (gas-liquid mixture), and then passes through the working fluid inlet of the first cavity 41. The working fluid enters the energy storage device 5 through the outlet and the inlet of the energy storage device 5. The working fluid exchanges heat with the energy storage device 5. When the high heat flux density electronic device is overclocked, the working fluid stores at least a portion of the heat it absorbs in the energy storage device 5 to achieve cooling of the working fluid. Alternatively, when the high heat flux density electronic device is running at its rated speed, the working fluid absorbs at least a portion of the heat from the energy storage device 5 to carry away the heat stored in the energy storage device 5. Then, it enters the second cavity 42 through the outlet of the energy storage device 5 and the working fluid inlet of the second cavity 42. The working fluid absorbs the heat from the high heat flux density electronic device again in the second cavity 42 and vaporizes into a low-temperature, low-pressure working fluid (steam). Then, it flows to the return end through the working fluid outlet of the second cavity 42 so that the working fluid returns to the compressor of the high heat flux density electronic device heat dissipation system through the return end. This allows the high heat flux density electronic device to be cooled without configuring the system equipment with maximum cooling capacity. The description here is based on the phase change cold plate 4 having two non-communicating cavities, each with a working fluid inlet and outlet, and the energy storage device 5 being adapted to the structure of the phase change cold plate 4. It should be understood that each phase change cold plate 4 of the heat dissipation assembly 10 is provided with at least two non-communicating cavities, each with a working fluid inlet and outlet. In addition to the structure of having two non-communicating cavities, the phase change cold plate 4 may also have other structural forms, such as having three non-communicating cavities, each with a working fluid inlet and outlet, or having four non-communicating cavities, etc. Correspondingly, the energy storage device 5 can be adapted according to the structural form of the phase change cold plate 4. Specific details are not limited or elaborated here.

[0083] The energy storage device 5 provided in this application can be a phase change energy storage device or a non-phase change energy storage device, and can be used for heat storage. The best choice for the energy storage device 5 provided in this application is a phase change energy storage device, that is, the preferred energy storage device 5 is a phase change energy storage device. Heat storage is achieved through the phase change reaction of the phase change energy storage device. The following description takes the energy storage device 5 using a phase change energy storage device as an example.

[0084] Taking the phase change cold plate 4 as an example, which has two non-communicating cavities (divided into a first cavity 41 and a second cavity 42) each with a working fluid inlet and a working fluid outlet, the operating principle of the heat dissipation component for high heat flux density electronic devices provided in this application is described as follows: When the high heat flux density electronic device is operating intermittently in rated mode and overclocking mode, during the overclocking operation of the high heat flux density electronic device, the flow rate of the working fluid is lower than the maximum working fluid flow rate required for heat dissipation of the high heat flux density electronic device, and the saturation temperature of the working fluid is higher than the temperature (phase change temperature) of the material or working fluid in the energy storage device 5; the working fluid enters the phase change cold plate 4 through the working fluid inlet of the first cavity 41 of the phase change cold plate 4, and the working fluid in the first cavity 42... After absorbing heat from the high heat flux density electronic device in the first cavity 41, it vaporizes into a low-temperature, low-pressure working fluid (steam) or a gas-liquid mixture (gas-liquid mixture). Then, it enters the energy storage device 5 through the working fluid outlet of the first cavity 41 and the inlet of the energy storage device 5 to release at least a portion of the heat to store at least a portion of the heat absorbed by the working fluid in the energy storage device 5. After releasing the heat, the working fluid re-enters the phase change cold plate 4 through the outlet of the energy storage device 5 and the working fluid inlet of the second cavity 42, and undergoes boiling heat exchange in the second cavity 42. It then absorbs heat from the high heat flux density electronic device again and vaporizes into a low-temperature, low-pressure working fluid (steam). Finally, it flows to the return end through the working fluid outlet of the second cavity 42. After the high heat flux density electronic device operates at overclocked frequency for a certain period of time, it switches to the rated operating mode. At this time, the flow rate of the working fluid is higher than the flow rate required for the high heat flux density electronic device to dissipate heat, and the saturation temperature of the working fluid is lower than the temperature (phase change temperature) of the material or working fluid in the energy storage device 5. The working fluid enters the phase change cold plate 4 through the working fluid inlet of the first cavity 41. After absorbing the heat of the high heat flux density electronic device in the first cavity 41, the working fluid vaporizes into a gas-liquid mixture. Then, it enters the energy storage device 5 through the working fluid outlet of the first cavity 41 and the input port of the energy storage device 5 and absorbs at least a portion of the heat stored in the energy storage device 5 to continue vaporizing. Then, the working fluid re-enters the phase change cold plate 4 through the output port of the energy storage device 5 and the working fluid inlet of the second cavity 42, and boils and exchanges heat in the second cavity 42. It absorbs the heat of the high heat flux density electronic device again and vaporizes into a low temperature and low pressure working fluid (steam). Then, it flows back to the return end through the working fluid outlet of the second cavity 42.Understandably, when the working fluid flow rate of the energy storage device 5 is lower than the working fluid flow rate required for heat dissipation of the high heat flux density electronic device, and the saturation temperature of the working fluid is higher than the phase change temperature of the material or working fluid in the energy storage device 5, it can store the heat brought by the working fluid, thus playing a role in heat storage. Conversely, when the working fluid flow rate of the energy storage device 5 is higher than the working fluid flow rate required for heat dissipation of the high heat flux density electronic device, and the saturation temperature of the working fluid is lower than the phase change temperature of the material or working fluid in the energy storage device 5, the heat stored in the energy storage device 5 can be carried away by the working fluid, allowing the energy storage device 5 to resume its heat storage function. By setting up the phase change cold plate 4 and the energy storage device 5, the working fluid flow rate required by the heat dissipation system with this high heat flux density electronic device heat dissipation component is lower than the high heat flux density... The maximum working fluid flow rate required for heat dissipation during overclocking of electronic devices is higher than that required for heat dissipation during rated operation of high heat flux density electronic devices. During overclocking, at least a portion of the heat is stored by the energy storage device 5. This allows the system to be configured with only slightly more cooling capacity than required for rated operation. Thus, throughout the entire operating cycle, not only can the maximum temperature of the high heat flux density electronic devices be controlled within a certain range, but the system does not need to be configured with maximum cooling capacity to handle overclocking. This not only meets the heat dissipation needs of intermittently operating high heat flux density electronic devices but also facilitates adaptation to different operating conditions. In other words, for the heat dissipation system of high heat flux density electronic devices, using the heat dissipation components provided in this application can reduce the system's size, weight, and power consumption, facilitating system compactness, lightweight design, low power consumption, and improved portability. It is suitable for mobile devices and more easily adapts to varying operating conditions. Here, rated operation of high heat flux density electronic devices refers to operation at rated frequency / power, while overclocking operation refers to operation at a frequency / power higher than the rated frequency / power.

[0085] In addition, the quantitative and connection relationships between the phase change cold plate 4 of the heat dissipation assembly 10 and the energy storage device 5 are at least as follows: 1. Please refer to Figure 4 There are multiple phase change cold plates 4 and energy storage devices 5. Each phase change cold plate 4 is connected to only one energy storage device 5, meaning that all cavities of each phase change cold plate 4 are connected to only one energy storage device 5, and each energy storage device 5 is connected to only one phase change cold plate 4, meaning that each energy storage device 5 is connected to all cavities of only one phase change cold plate 4. II. Please refer to... Figure 5 There are multiple phase change cold plates 4 and one energy storage device 5, and each phase change cold plate 4 is connected to the energy storage device 5, that is, all cavities of each phase change cold plate 4 are connected to the energy storage device 5; III. Please refer to Figure 2 or Figure 3The phase change cold plate 4 and the energy storage device 5 are both one, meaning that all cavities of the phase change cold plate 4 are connected to the energy storage device 5. Its working principle and beneficial effects are similar to those described above, and will not be repeated here.

[0086] The high heat flux density electronic device heat dissipation system provided in this application is described below. Please refer to... Figure 2 The high heat flux density electronic device heat dissipation system provided in this application is used to dissipate heat for high heat flux density electronic devices; the high heat flux density electronic device heat dissipation system includes: compressor 1, condenser 2, throttling device 3 and heat dissipation component 10; wherein, heat dissipation component 10 is the high heat flux density electronic device heat dissipation component described in any of the preceding claims;

[0087] Compressor 1, condenser 2, throttling device 3, and heat dissipation assembly 10 are sequentially connected by pipelines to form a circulation loop. The working fluid, under the action of the compressor, can circulate within the circulation pipeline; specifically...

[0088] The heat dissipation assembly 10 includes at least one phase change cold plate 4 and at least one energy storage device 5;

[0089] The discharge end of compressor 1 is connected to the input end of condenser 2, the output end of condenser 2 is connected to the input end of throttling device 3, the output end of throttling device 3 is connected to all phase change cold plates 4, each phase change cold plate 4 has at least one cavity connected to the output end of throttling device 3, and all phase change cold plates 4 are connected to the intake end of compressor 1. Each phase change cold plate 4 has at least one cavity connected to the intake end of compressor 1, and each energy storage device 5 is connected to all cavities of at least one phase change cold plate 4, so that the working fluid can flow from the cavity of phase change cold plate 4 into energy storage device 5 and / or flow from energy storage device 5 into the cavity of phase change cold plate 4. It can be understood that each phase change cold plate 4 has at least one cavity with a working fluid inlet connected to the output end of throttling device 3, so that the working fluid can be input into the cavity of phase change cold plate 4, and each phase change cold plate 4 has at least one cavity with a working fluid outlet connected to the intake end of compressor 1, so that the working fluid in the cavity of phase change cold plate 4 can flow back to compressor 1.

[0090] Compressor 1 is the power unit of the entire heat dissipation system, and plays the role of sucking in, compressing and transporting the working medium. That is, the compressor can be used to suck in, compress and transport the working medium (steam).

[0091] As a heat exchange device, condenser 2 uses the ambient cooling medium (air or water) to remove the heat from the high-temperature and high-pressure working fluid (steam) from compressor 1, so that the high-temperature and high-pressure working fluid (steam) is condensed into a working fluid (liquid, i.e., liquid working fluid) at room temperature and high pressure. In other words, condenser 2 can be used to condense the high-temperature and high-pressure working fluid from compressor 1 into a liquid working fluid at room temperature and high pressure.

[0092] The throttling device 3 acts as a throttling and pressure-reducing device for the working fluid. By reducing the pressure of the working fluid (liquid), the saturation temperature of the working fluid (liquid) is reduced. At the same time, the flow rate, velocity and other parameters of the working fluid entering the phase change cold plate 4 are controlled and adjusted. In other words, the throttling device 3 can be used to reduce the saturation temperature of the working fluid (liquid).

[0093] Each phase change cold plate 4 can absorb the heat generated by high heat flux density electronic devices and exchange heat with the working fluid entering it, so that the working fluid carries away the heat generated by high heat flux density electronic devices during the flow process.

[0094] Each energy storage device 5 can exchange heat with the working fluid flowing into the cavity of the phase change cold plate 4, allowing the working fluid to release at least a portion of its heat and store it in the energy storage device 5 to achieve cooling of the working fluid, or allowing the working fluid to absorb at least a portion of the heat stored in the energy storage device 5 to achieve heat dissipation of the energy storage device 5, so that the energy storage device 5 can restore its heat storage function. That is, each energy storage device 5 can play a role in heat storage. When high heat flux density electronic equipment is overclocked, at least a portion of the heat from the working fluid stored in the energy storage device 5 is used to cool the working fluid, so that the working fluid can restore its heat dissipation capacity. During operation, at least a portion of the heat stored in the energy storage device 5 is carried away by the working fluid, so that the energy storage device 5 can restore its ability to store heat. In this way, throughout the entire operating cycle, not only can the maximum temperature of the high heat flux density electronic equipment be controlled within a certain range, but also the system equipment does not need to be configured with maximum cooling capacity to cope with the overclocking operation of the high heat flux density electronic equipment. Therefore, for the heat dissipation system of high heat flux density electronic equipment, the system size, weight and power consumption can be reduced, which is conducive to the compactness, lightweight and low power consumption of the system, improving the portability of the system, making it suitable for mobile devices, and making it easier to adapt to the changing operating modes of the working conditions.

[0095] The working principle of the heat dissipation system for high heat flux density electronic devices provided in this application is described below. It is understood that when the high heat flux density electronic device operates intermittently in rated mode and overclocking mode, and during overclocking, the temperature (first temperature) of the high heat flux density electronic device is detected to see if it exceeds a first preset threshold. If it does, the real-time temperature of the surface in contact with the phase change cold plate 4 and the surface of the high heat flux density electronic device, and the temperature of the material or working fluid in the energy storage device 5 (i.e., inside) are collected (second temperature). The throttling device 3 is controlled based on these two temperatures. Since the temperature of the surface in contact with the phase change cold plate 4 and the surface of the high heat flux density electronic device is similar to the temperature of the high heat flux density electronic device, for practical purposes, the temperature of the high heat flux density electronic device is used instead. The throttling device 3 adjusts the pressure of the working fluid, thereby adjusting the saturation temperature of the working fluid so that its saturation temperature is lower than the temperature of the high heat flux density electronic device but higher than the temperature of the material or working fluid in the energy storage device 5. For ease of understanding, the following description uses a phase change cooling plate 4 with two separate cavities (a first cavity 41 and a second cavity 42), each with a working fluid inlet and outlet. The working fluid flows into the first cavity 41, absorbs heat, and vaporizes into steam or a gas-liquid mixture. Since the saturation temperature of the steam or gas-liquid mixture is higher than the temperature of the material or working fluid inside the energy storage device 5, it releases heat in the energy storage device 5, liquefies into a liquid state, and then re-enters the second cavity 42 of the phase change cooling plate 4. Because the saturation temperature of the working fluid is lower than the temperature of the second cavity 42, the working fluid absorbs heat from the second cavity 42, boils, and vaporizes into steam, which then flows back to the compressor 1. The compressor 1 provides the driving force to send the working fluid (high-temperature, high-pressure steam) to the condenser 2, where it is condensed into a liquid state. The liquid then flows through the throttling device 3 and the phase change cooling plate 4, absorbs heat, vaporizes into steam, and returns to the compressor 1 for the next cycle. The circulation rate of the working fluid does not need to reach the maximum cooling capacity; the circulation rate is lower than the maximum cooling capacity. For example, when high heat flux density electronic equipment is overclocked, assuming a heat generation of 1KW, without the energy storage device 5, a working fluid with a flow rate of 1L / min is needed to undergo a phase change to absorb the heat; with the energy storage device 5, the working fluid undergoes a phase change, and the steam or gas-liquid mixture releases heat and condenses in the energy storage device 5 to become liquid again, and then enters the phase change cold plate 4 a second time, requiring only a flow rate of 0.7L / min.

[0096] When the high heat flux density electronic device operates intermittently in rated mode and overclocking mode, and during rated operation, the temperature of the high heat flux density electronic device (third temperature) is detected to see if it exceeds a second preset threshold. If it does, the real-time temperature of the surface in contact with the phase change cold plate 4 and the surface of the high heat flux density electronic device, and the temperature of the material or working fluid inside the energy storage device 5 (fourth temperature) are collected. The throttling device 3 is controlled based on these two temperatures. Since the temperature of the surface in contact with the phase change cold plate 4 and the surface of the high heat flux density electronic device is similar to the temperature of the high heat flux density electronic device, the temperature of the high heat flux density electronic device is used as a substitute for the high heat flux density electronic device temperature for practical purposes. The throttling device 3 adjusts the pressure of the working fluid, thereby adjusting the saturation temperature of the working fluid so that its saturation temperature is lower than the temperature of the high heat flux density electronic device and also lower than the temperature of the material or working fluid inside the energy storage device 5. For ease of understanding, the following description uses a phase change cold plate 4 with two non-communicating cavities (divided into a first cavity 41 and a second cavity 42), each with a working fluid inlet and outlet. The working fluid flows into the first cavity 41, absorbs heat, and vaporizes into a gas-liquid mixture. Since the temperature of the gas-liquid mixture is lower than that of the material or working fluid inside the energy storage device 5, it continues to absorb heat in the energy storage device 5, carrying away at least a portion of the heat from the energy storage device 5. It then re-enters the second cavity 42 of the phase change cold plate 4. Because the saturation temperature of the working fluid is lower than that of the second cavity 42, the working fluid continues to absorb heat from the second cavity 42, boils, exchanges heat, and vaporizes into steam, which then flows back to the compressor 1. The circulation rate of the working fluid is lower than the maximum cooling capacity but higher than the cooling capacity required by the phase change cold plate 4 in the rated operating mode for cooling high heat flux density electronic equipment.

[0097] The high heat flux density electronic device heat dissipation system provided in this application has a compressor 1 that drives the working fluid to flow through the first cavity 41 of the phase change cold plate 4, the energy storage device 5, and the second cavity 42 of the phase change cold plate 4 to absorb the heat from the phase change cold plate 4, thereby removing the heat generated by the high heat flux density electronic device. The working fluid absorbs heat in the first cavity 41 and stores at least a portion of the absorbed heat in the energy storage device 5. The working fluid then enters the second cavity 42 to absorb heat from the phase change cold plate 4. This ensures that at least a portion of the heat from the phase change cold plate 4 is stored in the energy storage device 5. Therefore, the working fluid does not need to be configured with maximum cooling capacity, meaning that the system equipment does not need to be configured with maximum cooling capacity. Smaller compressors, condensers, and other system components can be used, thus keeping the size and weight of the heat dissipation system from being excessive. This also helps to control the power consumption of the system, achieving a compact, lightweight, and low-power system, providing a better user experience.

[0098] Please see Figure 3In another embodiment of the high heat flux density electronic device heat dissipation system provided in this application, the heat dissipation system includes: a compressor 1, a condenser 2, a throttling device 3, a phase change cold plate 4, and an energy storage device 5; for ease of understanding, the phase change cold plate 4 is described as having two non-communicating cavities (divided into a first cavity 41 and a second cavity 42) that each have a working fluid inlet and a working fluid outlet.

[0099] The discharge end of compressor 1 is connected to the input end of condenser 2, the output end of condenser 2 is connected to the input end of throttling device 3, the output end of throttling device 3 is connected to the working fluid inlet of the first cavity 41 of phase change cold plate 4, and the working fluid outlet of the second cavity of phase change cold plate 4 is connected to the air inlet of compressor 1. The input port of energy storage device 5 is connected to the working fluid outlet of the first cavity 41, and the output port of energy storage device 5 is connected to the working fluid inlet of the second cavity 42.

[0100] Compressor 1 is the power unit of the entire heat dissipation system, and plays the role of sucking in, compressing and transporting the working medium. That is, the compressor can be used to suck in, compress and transport the working medium (steam).

[0101] As a heat exchange device, condenser 2 uses the ambient cooling medium (air or water) to remove the heat from the high-temperature and high-pressure working fluid (steam) from compressor 1, so that the high-temperature and high-pressure working fluid (steam) is condensed into a high-pressure and room-temperature working fluid (liquid). In other words, condenser 2 can be used to condense the high-temperature and high-pressure working fluid (steam) from compressor 1 into a high-pressure and room-temperature working fluid (liquid).

[0102] The throttling device 3 acts as a throttling and pressure-reducing device for the working fluid. By reducing the pressure of the working fluid (liquid), the saturation temperature of the working fluid (liquid) is reduced. At the same time, the flow rate, velocity and other parameters of the working fluid entering the phase change cold plate 4 are controlled and adjusted. In other words, the throttling device 3 can be used to reduce the saturation temperature of the working fluid (liquid).

[0103] The phase change cold plate 4 is used to absorb the heat generated by high heat flux density electronic devices and exchange heat with the working fluid entering it, so that the working fluid can carry away the heat generated by high heat flux density electronic devices during the flow process.

[0104] The energy storage device 5 is used to exchange heat with the working fluid flowing through the first cavity 41, so that at least a portion of the heat released by the working fluid is stored in the energy storage device 5 to achieve cooling of the working fluid, or to allow the working fluid to absorb at least a portion of the heat stored in the energy storage device 5 to achieve heat dissipation of the energy storage device 5, so that the energy storage device 5 can restore its heat storage function, that is, the energy storage device 5 can play the role of heat storage.

[0105] In this specific embodiment, during the overclocking operation of the high heat flux density electronic device, at least a portion of the heat generated by the working fluid can be stored in the energy storage device 5 to achieve cooling of the working fluid, thereby improving the heat dissipation capacity of the working fluid in the second cavity 42. During the rated operation of the high heat flux density electronic device, at least a portion of the heat stored in the energy storage device 5 can be carried away by the working fluid, allowing the energy storage device 5 to restore its heat storage capacity. Through the combined structure of the phase change cold plate 4 and the energy storage device 5, the required working fluid flow rate of this heat dissipation system is lower than the maximum working fluid flow rate required for heat dissipation during the overclocking operation of the high heat flux density electronic device, but higher than the working fluid flow rate required for heat dissipation during the rated operation of the high heat flux density electronic device. During the overclocking operation of the high heat flux density electronic device, the heat is stored by the energy storage device 5. This allows the system to be configured with only slightly more cooling capacity than required for the rated operating mode of high heat flux density electronic devices. This means that throughout the entire operating cycle, the maximum temperature of the high heat flux density electronic devices can be controlled within a certain range. Furthermore, it eliminates the need for maximum cooling capacity to handle overclocking modes of these devices, thus removing components commonly found in water systems such as water tanks, pumps, and heat exchangers. Therefore, for the cooling system of high heat flux density electronic devices, this is beneficial for controlling the system's size, weight, and power consumption. The system can be made smaller, achieving compactness, lightweight design, and low power consumption, making it suitable for mobile devices and more adaptable to varying operating conditions. Here, rated operating mode refers to the high heat flux density electronic devices operating at rated frequency / power, while overclocking mode refers to operating at a frequency / power higher than rated.

[0106] Furthermore, the cooling system also includes an oil separator 6 and an on / off control device 7;

[0107] The oil separator 6 is located between the compressor 1 and the condenser 2, specifically between the discharge end of the compressor 1 and the input end of the condenser 2. It is used to separate the lubricating oil in the working fluid from the working fluid, so as to prevent the lubricating oil from entering the subsequent condenser 2 and phase change cold plate 4 and thus affecting the heat exchange.

[0108] The compressor 1 is equipped with an oil return port, and the oil separator 6 is equipped with an oil separation port. One end of the on / off control device 7 is connected to the oil return port, and the other end is connected to the oil separation port. That is, the oil separation port of the oil separator 6 is connected to one end of the on / off control device 7, and the other end of the on / off control device 7 is connected to the oil return port of the compressor 1, so that when the on / off control device 7 is turned on, the lubricating oil in the oil separator 6 can flow back to the compressor 1. Specifically, the on / off control device 7 can be a solenoid valve.

[0109] Furthermore, the heat dissipation system also includes a liquid storage tank 8;

[0110] The liquid storage tank 8 is located between the condenser 2 and the throttling device 3, specifically between the output end of the condenser 2 and the input end of the throttling device 3, and is used to adjust the circulation volume of the working fluid when the operating conditions change.

[0111] Furthermore, the heat dissipation system also includes a gas-liquid separator 9;

[0112] The gas-liquid separator 9 is located between the phase change cold plate 4 and the compressor 1. Specifically, it is located between the working fluid outlet of the second cavity 42 of the phase change cold plate 4 and the air inlet of the compressor 1. It is used to separate the gaseous and liquid components in the working fluid to prevent the liquid working fluid from entering the compressor 1 and to prevent the compressor 1 from being liquid-sluged.

[0113] The following is about Figure 3 The working principle of the corresponding specific embodiment is described as follows: When the high heat flux density electronic device operates intermittently in rated mode and overclocking mode, and during overclocking operation, the temperature (first temperature) of the high heat flux density electronic device is detected to see if it exceeds a first preset threshold. If it does, the real-time temperature of the surface in contact with the phase change cold plate 4 and the surface of the high heat flux density electronic device, and the temperature of the material or working fluid inside the energy storage device 5 (second temperature) are collected. The throttling device 3 is controlled based on these two temperatures. Since the temperature of the surface in contact with the phase change cold plate 4 and the surface of the high heat flux density electronic device is similar to the temperature of the high heat flux density electronic device, the temperature of the high heat flux density electronic device is collected instead for practical purposes. The throttling device 3 adjusts the pressure of the working fluid, thereby adjusting the saturation temperature of the working fluid so that the saturation temperature of the working fluid is lower than the temperature of the high heat flux density electronic device but higher than the temperature of the material or working fluid inside the energy storage device 5. The working fluid flows into the first chamber 41, absorbs heat, and vaporizes into steam or a gas-liquid mixture. Since the temperature of the gas-liquid mixture is higher than that of the materials or working fluid inside the energy storage device 5, it releases heat in the energy storage device 5, liquefies into a liquid state, and then re-enters the second chamber 42 of the phase change cooling plate 4. Because the saturation temperature of the working fluid is lower than the temperature of the second chamber 42, the working fluid absorbs heat from the second chamber 42, boils, and vaporizes into steam (a low-temperature, low-pressure working fluid, i.e., a gaseous working fluid). It then flows into the gas-liquid separator 9, where the circulation rate of the working fluid does not need to reach the maximum cooling capacity; the circulation rate is lower than the maximum cooling capacity. The gas-liquid separator 9 only sends the gaseous portion of the working fluid to the compressor 1, preventing the compressor 1 from being liquid-slugged. The compressor 1 provides the driving force, sending the working fluid to the oil separator 6 for filtration, then to the condenser 2 where it is condensed into a liquid state. It then flows through the throttling device 3 and the phase change cooling plate 4 for the next cycle. For example, during overclocking, assuming a heat output of 1KW, without the energy storage device 5, a working fluid with a flow rate of 1L / min is required to undergo a phase change to absorb the heat; with the energy storage device 5, the working fluid undergoes a phase change, and the gas-liquid mixture releases heat and condenses in the energy storage device 5, becoming liquid again, and then re-enters the phase change cold plate 4, requiring only a flow rate of 0.7L / min.

[0114] When the high heat flux density electronic device operates intermittently in rated mode and overclocking mode, and during rated operation, the temperature of the high heat flux density electronic device (third temperature) is detected to see if it exceeds a second preset threshold. If it does, the real-time temperature of the surface in contact with the phase change cold plate 4 and the surface of the high heat flux density electronic device, and the temperature of the material or working fluid inside the energy storage device 5 (fourth temperature) are collected. The throttling device 3 is controlled based on these two temperatures. Since the temperature of the surface in contact with the phase change cold plate 4 and the surface of the high heat flux density electronic device is similar to the temperature of the high heat flux density electronic device, for practical purposes, the temperature of the high heat flux density electronic device is used instead. The throttling device 3 adjusts the pressure of the working fluid, thereby adjusting the saturation temperature of the working fluid so that its saturation temperature is lower than the temperature of the high heat flux density electronic device and also lower than the temperature of the material or working fluid inside the energy storage device 5. The working fluid flows into the first chamber 41, absorbs heat, and becomes a gas-liquid mixture. Since the temperature of this mixture is lower than that of the materials or the working fluid inside the energy storage device 5, it continues to absorb heat within the energy storage device 5, carrying away at least a portion of its heat. It then re-enters the second chamber 42 of the phase change cold plate 4. Because the saturation temperature of the working fluid is lower than the temperature of the second chamber 42, it absorbs heat from the second chamber 42, boils, and becomes steam, which then flows into the gas-liquid separator 9. The circulation rate of the working fluid is lower than the maximum cooling capacity but higher than the cooling capacity required by the phase change cold plate 4 in its rated operating mode for high heat flux density electronic equipment. The gas-liquid separator 9 only sends the gaseous portion of the working fluid to the compressor 1, preventing liquid slugging. The compressor 1 provides the driving force, sending the working fluid to the oil separator 6 for filtration, then to the condenser 2 where it is condensed into a liquid state. It then flows through the throttling device 3 and the phase change cold plate 4 for the next cycle.

[0115] When high heat flux density electronic devices operate continuously only in overclocking mode, the heat stored in the energy storage device 5 needs to be removed periodically by an additional cold source. Here, the additional cold source is not limited and can be either air cooling or liquid cooling, depending on the actual needs.

[0116] In this specific embodiment, the compressor 1 can drive the working fluid in the circulation loop to flow through the first cavity 41, the energy storage device 5 and the second cavity 42 to absorb the heat of the phase change cold plate 4, thereby removing the heat of the high heat flux density electronic device. The working fluid absorbs heat from the phase change cold plate 4 in the first chamber 41, and then stores at least a portion of the absorbed heat in the energy storage device 5. The working fluid then enters the second chamber 42 to absorb heat from the phase change cold plate 4. This allows a portion of the heat from the phase change cold plate 4 to be stored in the energy storage device 5. The working fluid does not need to carry all the heat from the phase change cold plate 4, so the working fluid does not need to be configured with maximum cooling capacity, i.e., the system equipment does not need to be configured with maximum cooling capacity. Compared with conventional liquid cooling systems, the cooling system provided in this specific embodiment can use a small compressor or a micro compressor as the power unit for the entire cooling system. The maximum flow rate of the working fluid circulating in the system is smaller, and the specifications of the condenser can also be made smaller. In this way, the volume and weight of the cooling system will not be too large, which is also beneficial to controlling the power consumption of the system. It achieves system compactness, lightweight and low power consumption, is suitable for mobile devices, and is more convenient to adapt to the changing operating modes of working conditions, bringing a better user experience.

[0117] In addition, in miniaturized systems with low total power of high heat flux density electronic devices, micro compressors can be directly used, and the condenser can be selected to match the compressor, so as to better meet the requirements of compactness, lightweight and low power consumption of the system.

[0118] Please see Figure 4 , Figure 4 The corresponding specific embodiments and their composition structure and working principle are as follows: Figure 3 Similar to the corresponding specific embodiments, the difference is that there are multiple phase change cold plates 4 and multiple energy storage devices 5. Each phase change cold plate 4 is connected to only one energy storage device 5, and each energy storage device 5 is connected to only one phase change cold plate 4. For ease of understanding, the following description is based on a phase change cooling plate 4 having two non-interconnected cavities (divided into a first cavity 41 and a second cavity 42), each with a working fluid inlet and a working fluid outlet. The working fluid outlet of the first cavity 41 of each phase change cooling plate 4 is connected to the input port of one energy storage device 5, and the working fluid inlet of the second cavity 42 of each phase change cooling plate 4 is connected to the output port of one energy storage device 5. The working fluid inlets of all first cavities 41 of the phase change cooling plates 4 are connected to the output end of the throttling device 3, and the working fluid outlets of all second cavities 42 of the phase change cooling plates 4 are connected to the intake end of the compressor 1. The input port of each energy storage device 5 is connected to the working fluid outlet of one first cavity 41 of the phase change cooling plate 4, and the output port of each energy storage device 5 is connected to the working fluid inlet of one second cavity 42 of the phase change cooling plate 4.

[0119] Figure 4 The principle of the corresponding embodiment is the same as that of the heat dissipation system provided in this application. Figure 3The corresponding embodiments are similar in principle and have the same beneficial effects, and can be referred to accordingly. Figure 3 The description of the corresponding embodiments will not be repeated here.

[0120] Please see Figure 5 , Figure 5 The corresponding specific embodiments and their composition structure and working principle are as follows: Figure 3 Similar to the corresponding embodiment, the difference lies in that the number of phase change cold plates 4 is still multiple, but the number of energy storage devices 5 is only one, and each phase change cold plate 4 is connected to the energy storage device 5. For ease of understanding, the example described is that each phase change cold plate 4 has two separate cavities (divided into a first cavity 41 and a second cavity 42) that are not interconnected. The working fluid outlet of the first cavity 41 of each phase change cold plate 4 is connected to the input port of the energy storage device 5, and the working fluid inlet of the second cavity of each phase change cold plate 4 is connected to the output port of the energy storage device 5. The working fluid inlets of all first cavities 41 of the phase change cold plates 4 are connected to the output end of the throttling device 3, and the output ports of all second cavities 42 of the phase change cold plates 4 are connected to the intake end of the compressor 1. In this specific embodiment, the ratio of the number of phase change cold plates 4 to the number of energy storage devices 5 is not... Figure 3 The 1:1 example shown is a specific embodiment where one energy storage device 5 corresponds to multiple phase change cold plates 4 to fully utilize the heat dissipation performance of the energy storage device 5.

[0121] Figure 5 The principle of the corresponding embodiment is the same as that of the high heat flux density electronic device heat dissipation system provided in this application. Figure 3 The corresponding embodiments are similar in principle and have the same beneficial effects, and can be referred to accordingly. Figure 3 The description of the corresponding embodiments will not be repeated here.

[0122] The phase change cold plate, high heat flux density electronic device heat dissipation component, system and method provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A phase change cold plate, used in a heat dissipation system, characterized in that, The heat dissipation system is used to dissipate heat from electronic devices with high heat flux density. The phase change cold plate is provided with at least two non-communicating cavities, and each cavity is connected to the energy storage device of the heat dissipation system. Wherein: the phase change cold plate and the heat dissipation system are connected to form a circuit, and the heat dissipation system is filled with working fluid; When the high heat flux density electronic device is operating in the first mode, the working fluid input into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device from the cavity transfers the absorbed heat to the energy storage device to restore the cooling capacity. When the high heat flux density electronic device is operating in the second mode, the working fluid input into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device from the cavity absorbs the heat from the energy storage device, so that the energy storage device can restore its stored heat.

2. A heat dissipation component for high heat flux density electronic devices, characterized in that, A heat dissipation system for high heat flux density electronic devices is provided, wherein the heat dissipation component for high heat flux density electronic devices comprises: at least one phase change cold plate and at least one energy storage device; wherein the phase change cold plate is the phase change cold plate as described in claim 1. Each of the energy storage devices is in communication with at least one of the cavities of the phase change cold plate; Wherein: the phase change cold plate and the high heat flux density electronic device heat dissipation system are connected to form a circuit, and the high heat flux density electronic device heat dissipation system is filled with working fluid; When the high heat flux density electronic device is operating in the first mode, the working fluid input into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device from the cavity transfers the absorbed heat to the energy storage device to restore the cooling capacity. When the high heat flux density electronic device is operating in the second mode, the working fluid input into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device from the cavity absorbs the heat from the energy storage device, so that the energy storage device can restore its stored heat.

3. The high heat flux density electronic device heat dissipation assembly according to claim 2, characterized in that, The number of phase change cold plates and energy storage devices are both multiple; Each of the phase change cold plates is connected to only one of the energy storage devices, and each of the energy storage devices is connected to only one of the phase change cold plates.

4. The high heat flux density electronic device heat dissipation assembly according to claim 2, characterized in that, The number of phase change cold plates is multiple, and the number of energy storage devices is one; Each of the phase change cold plates is connected to the energy storage device.

5. The high heat flux density electronic device heat dissipation assembly according to claim 2, characterized in that, The number of the phase change cold plate and the energy storage device is one.

6. A heat dissipation system for high heat flux density electronic devices, characterized in that, include: A compressor, a condenser, a throttling device, and a heat dissipation assembly; wherein the heat dissipation assembly is the high heat flux density electronic device heat dissipation assembly according to any one of claims 2 to 5; The compressor, the condenser, the throttling device, and the heat dissipation assembly are connected in sequence through pipelines to form a circulation loop, and the working fluid circulates in the circulation loop; Each phase change cold plate has at least one cavity connected to the output end of the throttling device, and each phase change cold plate has at least one cavity connected to the inlet end of the compressor; The compressor is used to draw in, compress, and deliver the working fluid; The throttling device is used to adjust the saturation temperature of the working fluid.

7. The high heat flux density electronic device heat dissipation system according to claim 6, characterized in that, Also includes: Oil separator; The oil separator is located between the compressor and the condenser and is used to separate the lubricating oil from the working fluid.

8. The high heat flux density electronic device heat dissipation system according to claim 7, characterized in that, Also includes: On / off control device; The compressor is provided with an oil return port, and the oil separator is provided with an oil separation port; One end of the on / off control device is connected to the oil return port, and the other end is connected to the oil separator port.

9. The high heat flux density electronic device heat dissipation system according to claim 6, characterized in that, Also includes: Storage tank; The liquid storage tank is located between the condenser and the throttling device, and is used to adjust the circulation rate of the working fluid when the operating conditions change.

10. The high heat flux density electronic device heat dissipation system according to claim 6, characterized in that, Also includes: Gas-liquid separator; The gas-liquid separator is disposed between the phase change cold plate and the compressor, and is used to separate the gaseous and liquid components of the working fluid.

11. A heat dissipation method for high heat flux density electronic devices, characterized in that, The high heat flux density electronic device heat dissipation system according to any one of claims 6 to 10, wherein the high heat flux density electronic device heat dissipation method comprises: When a high heat flux density electronic device is overclocked, the first temperature of the high heat flux density electronic device is obtained. Determine whether the first temperature exceeds the first preset threshold; If so, the throttling device is adjusted based on the first temperature and the second temperature of the material or working fluid inside the energy storage device, so that the saturation temperature of the working fluid is lower than the first temperature and higher than the second temperature. or, When the high heat flux density electronic device is operating at its rated speed, the third temperature of the high heat flux density electronic device is obtained; Determine whether the third temperature exceeds the second preset threshold; If the temperature exceeds the specified value, the throttling device is adjusted based on the third temperature and the fourth temperature of the material or working fluid inside the energy storage device, so that the saturation temperature of the working fluid is lower than the third temperature and lower than the fourth temperature.

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