Chip overheating early warning method and device of a relay protection device

Abstract

The application discloses a kind of chip overheating early warning method and device of relay protection equipment.Therein, method includes: every interval preset unit monitoring time period is monitored chip by temperature sensor collection ambient temperature;Based on chip junction temperature model, according to ambient temperature, the junction temperature of monitored chip is calculated;Junction temperature is compared with the multiple junction temperature thresholds that are set in advance, determine whether relay protection equipment is monitored chip early warning prompt, wherein multiple junction temperature thresholds include first junction temperature threshold, second junction temperature threshold, third junction temperature threshold and fourth junction temperature threshold, between first junction temperature threshold and second junction temperature threshold is normal working temperature interval;Between second junction temperature threshold and third junction temperature threshold is life acceleration attenuation temperature interval;Between third junction temperature threshold and fourth junction temperature threshold is allowable short-time running temperature interval: fourth junction temperature threshold is the highest temperature allowed.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip overheating early warning, and more particularly, to a chip overheating early warning method and device for a relay protection device. BACKGROUND

[0002] The relay protection device is one of the key devices in the power grid dispatching communication field, and is the first line of defense for ensuring the safe and stable operation of the power grid. Overheating of components may cause the device performance to decline or become unstable, and in severe cases, will affect the correct action of the relay protection device, causing power outages or accidents such as personnel injuries.

[0003] Device manufacturers mainly rely on design experience and post-production high and low temperature testing to ensure the thermal reliability of the device. After passing the test, it is considered that the thermal reliability meets the requirements. However, after being put into operation, there have been cases of device failure caused by overheating of components, affecting the reliable operation of the power grid. With the full application of domestic chips in protection devices, the device heating problem has gradually emerged.

[0004] At present, State Grid Corporation installs temperature sensors on the CPU board and power board of the relay protection device in operation to sense the device ambient temperature, lacks effective means for judging the temperature and life status of high heat loss components such as the main control chip and FPGA chip, and lacks effective early warning prompt strategies for overheated chips. The operating personnel cannot know the abnormal state of the chip in the first time. Long-term high-temperature operation of high-heat-loss components will cause abnormal performance of the chip, causing abnormal operation of the protection device, even refusal to act or misoperation, which seriously affects the safe and reliable operation of the power grid. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application provides a chip overheating early warning method and device for a relay protection device.

[0006] According to one aspect of the present application, a chip overheating early warning method for a relay protection device is provided, comprising:

[0007] Collecting the ambient temperature of the monitored chip through the temperature sensor every interval preset unit monitoring time period;

[0008] Based on the chip junction temperature model, calculating the junction temperature of the monitored chip according to the ambient temperature;

[0009] Comparing the junction temperature with a plurality of pre-set junction temperature thresholds to determine whether the relay protection device needs to give a warning prompt to the monitored chip, wherein the plurality of junction temperature thresholds include a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold and a fourth junction temperature threshold,

[0010] The first junction temperature threshold and the second junction temperature threshold form a normal working temperature interval;

[0011] The second junction temperature threshold value and the third junction temperature threshold value are a life acceleration decay temperature interval;

[0012] The third junction temperature threshold value and the fourth junction temperature threshold value are an allowable short-time operation temperature interval:

[0013] The fourth junction temperature threshold value is the highest allowable temperature.

[0014] Optionally, the junction temperature and the plurality of preset junction temperature threshold values are compared to determine whether the relay protection device gives a warning prompt to the monitored chip, comprising:

[0015] In the case that the junction temperature is higher than the fourth junction temperature threshold value, the relay protection device sends an alarm signal to the monitored chip.

[0016] Optionally, the junction temperature and the plurality of preset junction temperature threshold values are compared to determine whether the relay protection device gives a warning prompt to the monitored chip, comprising:

[0017] In the case that the junction temperature is in the third junction temperature threshold value and the fourth junction temperature threshold value interval, the running time of the monitored chip is calculated, and in the case that the running time exceeds a preset maximum value of the running time allowed in the temperature interval, the relay protection device sends an alarm signal to the monitored chip.

[0018] Optionally, the junction temperature and the plurality of preset junction temperature threshold values are compared to determine whether the relay protection device gives a warning prompt to the monitored chip, comprising:

[0019] In the case that the junction temperature is in the second junction temperature threshold value and the third junction temperature threshold value interval, a monitoring time period of the monitored chip is set, and the average junction temperature of the monitored chip in the monitoring time period is calculated.

[0020] According to the Arrhenius model, a first characteristic life of the monitored chip at the second junction temperature threshold value and a second characteristic life of the monitored chip at the average junction temperature are calculated.

[0021] According to the first characteristic life and the second characteristic life, a life decay acceleration ratio of the monitored chip in the monitoring time period is determined.

[0022] A protection warning time of the monitored chip in the life acceleration decay temperature interval is set, and in the protection warning time, the junction temperature calculation and the life decay acceleration ratio calculation of the monitored chip are performed at a preset unit monitoring time interval to determine an average life decay acceleration ratio of the monitored chip in the protection warning time.

[0023] According to the average life decay acceleration ratio, it is determined whether the relay protection device gives a warning prompt to the monitored chip.

[0024] Optionally, according to the average life attenuation acceleration ratio, it is determined whether the relay protection device gives a pre-warning prompt to the monitored chip, comprising:

[0025] In the case that the average life attenuation acceleration ratio is greater than a preset threshold, the relay protection device does not give a pre-warning prompt to the monitored chip;

[0026] In the case that the average life attenuation acceleration ratio is less than or equal to the preset threshold, the relay protection device gives an alarm signal to the monitored chip.

[0027] According to another aspect of the present application, a chip overheating pre-warning device of a relay protection device is provided, comprising:

[0028] The acquisition module is configured to acquire, by a temperature sensor, an ambient temperature of the monitored chip every interval of a preset unit monitoring time period;

[0029] The calculation module is configured to calculate, based on a chip junction temperature model, a junction temperature of the monitored chip according to the ambient temperature;

[0030] The determination module is configured to compare the junction temperature with a plurality of preset junction temperature thresholds, and determine whether the relay protection device gives a pre-warning prompt to the monitored chip, wherein the plurality of junction temperature thresholds comprise a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold and a fourth junction temperature threshold,

[0031] The first junction temperature threshold and the second junction temperature threshold are between a normal working temperature range;

[0032] The second junction temperature threshold and the third junction temperature threshold are between a life attenuation acceleration temperature range;

[0033] The third junction temperature threshold and the fourth junction temperature threshold are between an allowed short-time running temperature range:

[0034] The fourth junction temperature threshold is an allowed maximum temperature.

[0035] According to still another aspect of the present application, a computer readable storage medium is provided, the storage medium storing a computer program, the computer program being used to execute the method according to any one of the above aspects of the present application.

[0036] According to still another aspect of the present application, an electronic device is provided, the electronic device comprising: a processor; a memory for storing executable instructions of the processor; the processor is configured to read the executable instructions from the memory and execute the instructions to implement the method according to any one of the above aspects of the present application.

[0037] Therefore, the chip overheating early warning method of the relay protection device provided by the application can reliably identify the actual operation state of the chip by setting different temperature thresholds and cooperating with corresponding alarm strategies. When the chip is at an abnormally high temperature, the device abnormal light is lit and the alarm information is sent to the station monitoring background, prompting the operator to check the protection abnormal state at the first time, so that timely measures are taken to avoid device failure caused by chip overheating and affect the safe and reliable operation of the power grid. The application can change the current situation that there is no effective supervision means for chip overheating of the relay protection device, and effectively improve the reliability of the relay protection device. BRIEF DESCRIPTION OF DRAWINGS

[0038] The exemplary embodiments of the present application can be more fully understood with reference to the following drawings:

[0039] Figure 1 is a flowchart of the chip overheating early warning method of the relay protection device provided by an exemplary embodiment of the application;

[0040] Figure 2 is another flowchart of the chip overheating early warning method of the relay protection device provided by an exemplary embodiment of the application;

[0041] Figure 3 is a structural diagram of the chip overheating early warning device of the relay protection device provided by an exemplary embodiment of the application;

[0042] Figure 4 is a structure of an electronic device provided by an exemplary embodiment of the application. DETAILED DESCRIPTION

[0043] Hereinafter, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all embodiments of the present application, and it should be understood that the present application is not limited to the described exemplary embodiments.

[0044] It should be noted that: the relative arrangement, numerical expression and numerical value of the components and steps set forth in these embodiments do not limit the scope of the application, unless otherwise specified.

[0045] Those skilled in the art can understand that the terms "first", "second" and the like in the embodiments of the application are only used to distinguish different steps, devices or modules, and do not represent any specific technical meaning, nor do they represent the inevitable logical sequence between them.

[0046] It should also be understood that in the embodiments of the application, "a plurality of" can mean two or more, and "at least one" can mean one, two or more.

[0047] It should also be understood that, whenever used in the present disclosure, a description of one aspect as comprising certain components or steps in no way excludes additional components or steps from being claimed as part of that aspect, and vice versa, unless specifically recited differently in a particular claim.

[0048] In addition, the term "and / or" in the present application is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent the three cases of A existing alone, A and B existing together, and B existing alone. In addition, the character " / " in the present application generally represents an "or" relationship between the front and rear associated objects.

[0049] It should also be understood that the description of the present application for each embodiment emphasizes the differences between each embodiment, and the same or similar parts can be referred to each other, and for the sake of brevity, will not be repeated.

[0050] At the same time, it should be understood that, for the convenience of description, the size of each part shown in the drawings is not drawn according to the actual proportion relationship.

[0051] The following description of at least one example embodiment is merely illustrative in nature and is in no way intended to limit the application or its application or use.

[0052] Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but where appropriate, the techniques, methods, and devices should be considered as part of the specification.

[0053] It should be noted that: similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0054] Embodiments of the present application can be applied to terminal devices, computer systems, servers and other electronic devices, which can operate with many other general or special computing system environments or configurations. Examples of well-known terminal devices, computing systems, environments, and / or configurations suitable for use with terminal devices, computer systems, servers and other electronic devices include, but are not limited to: personal computer systems, server computer systems, thin clients, thick clients, handheld or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, network personal computers, small computer systems, large computer systems, and distributed cloud computing technology environments including any of the above systems, and the like.

[0055] Electronic devices such as terminal devices, computer systems, servers, and the like can be described in the general context of computer system-executable instructions, such as program modules, being executed by a computer system. Generally, program modules can include routines, programs, objects, components, logic, data structures, and the like that perform particular tasks or implement particular abstract data types. Computer systems / server can be practiced in distributed cloud computing environments with other computer systems coupled via communication networks. The program modules can be located in local or remote computer system storage media including memory storage devices.

[0056] Exemplary method

[0057] Figure 1 is a flowchart of a chip overheating early warning method of a relay protection device provided by an exemplary embodiment of the present application. The present embodiment can be applied to electronic devices, such as Figure 1 As shown in the figure, the chip overheating early warning method 100 of the relay protection device includes the following steps:

[0058] Step 101: Collect the ambient temperature of the monitored chip through a temperature sensor every preset unit monitoring time period;

[0059] Step 102: Calculate the junction temperature of the monitored chip according to the ambient temperature based on a chip junction temperature model;

[0060] Step 103: Compare the junction temperature with a plurality of pre-set junction temperature thresholds to determine whether the relay protection device needs to issue a warning prompt for the monitored chip, wherein the plurality of junction temperature thresholds include a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold, and a fourth junction temperature threshold,

[0061] The first junction temperature threshold and the second junction temperature threshold are within a normal working temperature range;

[0062] The second junction temperature threshold and the third junction temperature threshold are within a life-accelerated decay temperature range;

[0063] The third junction temperature threshold and the fourth junction temperature threshold are within an allowable short-time operation temperature range:

[0064] The fourth junction temperature threshold is the highest allowable temperature.

[0065] Optionally, comparing the junction temperature with the plurality of pre-set junction temperature thresholds to determine whether the relay protection device needs to issue a warning prompt for the monitored chip includes:

[0066] In the case where the junction temperature is higher than the fourth junction temperature threshold, the relay protection device issues an alarm signal for the monitored chip.

[0067] Optionally, the junction temperature is compared with a plurality of preset junction temperature thresholds to determine whether the relay protection device gives a warning prompt to the monitored chip, including:

[0068] In the case that the junction temperature is in the third junction temperature threshold and the fourth junction temperature threshold interval, the running time of the monitored chip is calculated, and in the case that the running time exceeds a preset maximum time allowed for running in the temperature interval, the relay protection device sends an alarm signal to the monitored chip.

[0069] Optionally, the junction temperature is compared with a plurality of preset junction temperature thresholds to determine whether the relay protection device gives a warning prompt to the monitored chip, including:

[0070] In the case that the junction temperature is in the second junction temperature threshold and the third junction temperature threshold interval, a monitoring time period of the monitored chip is set, and the average junction temperature of the monitored chip in the monitoring time period is calculated;

[0071] According to the Arrhenius model, a first characteristic lifetime of the monitored chip at the second junction temperature threshold and a second characteristic lifetime of the monitored chip at the average junction temperature are calculated;

[0072] According to the first characteristic lifetime and the second characteristic lifetime, a life decay acceleration ratio of the monitored chip in the monitoring time period is determined;

[0073] A protection warning time of the monitored chip in the life acceleration decay temperature interval is set, and in the protection warning time, the junction temperature calculation and the life decay acceleration ratio calculation of the monitored chip are performed at a preset unit monitoring time interval to determine an average life decay acceleration ratio of the monitored chip in the protection warning time;

[0074] According to the average life decay acceleration ratio, it is determined whether the relay protection device gives a warning prompt to the monitored chip.

[0075] Optionally, according to the average life decay acceleration ratio, it is determined whether the relay protection device gives a warning prompt to the monitored chip, including:

[0076] In the case that the average life decay acceleration ratio is greater than a preset threshold, the relay protection device does not give a warning prompt to the monitored chip;

[0077] In the case that the average life decay acceleration ratio is less than or equal to the preset threshold, the relay protection device sends an alarm signal to the monitored chip.

[0078] Specifically, according to the working requirements of the monitored chip, different junction temperature thresholds are set, which are T 1m , T 2m , T 3m , and T 4m from small to large.

[0079] T 1m ~T 2m : The normal working temperature range of the monitored chip, and the expected service life is not affected.

[0080] T 2m ~T 3m : The accelerated degradation temperature range of the service life of the monitored chip.

[0081] T 3m ~T 4m : The short-time operating temperature range of the monitored chip.

[0082] T 4m : The maximum junction temperature of the chip, and the chip may be irreversibly damaged if the temperature exceeds this temperature.

[0083] The main steps are as follows:

[0084] Step 1: Calculate the characteristic life of the monitored chip at the maximum allowable temperature T 2m under normal working conditions according to the Arrhenius model:

[0085]

[0086] Step 2: Collect the chip environment temperature every unit time △t using a temperature sensor, and calculate the junction temperature T j of the monitored chip based on the chip junction temperature model.

[0087] Step 3: Determine the temperature range of the junction temperature.

[0088] When the junction temperature T j is greater than T 4m , directly light the protection device abnormality lamp and send an alarm signal to the monitoring background;

[0089] When the junction temperature T j is greater than T 3m and less than T 4m , calculate the cumulative operating time h of the monitored chip, and when the cumulative operating time exceeds the allowable time h max , light the protection device abnormality lamp and send an alarm signal to the monitoring background.

[0090] When the junction temperature T j is less than T 3m , calculate the average junction temperature T jav of the monitored chip within a certain temperature monitoring time interval △T(n·△t) and the characteristic life of the chip at this temperature.

[0091]

[0092] Calculate the accelerated degradation ratio of the service life of the monitored chip:

[0093]

[0094] Step 4: set the protection warning time of the chip in the life acceleration decay period as N times of △T, then repeat steps 2-3 in the chip protection warning time, and calculate λ i (i=1,2,3....).

[0095] Step 5: calculate the average value of the life decay acceleration ratio during the protection warning time N·△T:

[0096]

[0097] If μ>1 during the protection warning time N·△T, it indicates that the monitored chip is mostly working in the normal working allowable temperature range, which does not affect the expected life of the chip;

[0098] If μ≤1 during the protection warning time N·△T, it indicates that the monitored chip is mostly working outside the normal working allowable temperature range, and the chip is in the life acceleration decay period, that is, the life decay rate of the monitored chip is large, at this time the protection device abnormal light should be lit, and the alarm signal should be sent to the monitoring background.

[0099] Thus, 1, the application provides a relay protection device component overheating early warning method, corresponding overheating alarm strategies are proposed based on different temperature thresholds, which can reliably identify the actual running state of the chip; 2, the application provides a life acceleration decay model based on the Arrhenius equation and a partition interval early warning strategy, which can avoid false alarms of the relay protection system in thermal oscillation and EMC environment, and is stable and reliable; 3, the application belongs to the soft protection category, and the temperature monitoring function of the current relay protection device is used, and the judgment strategy proposed in the application is added, to complete the overheating early warning of the monitored chip.

[0100] Thus, the chip overheating early warning method of the relay protection device provided by the application can reliably identify the actual running state of the chip by setting different temperature thresholds and cooperating with corresponding alarm strategies. When the chip is at an abnormally high temperature, the device abnormal light is lit and the alarm information is sent to the station monitoring background, prompting the operator to check the protection abnormal state at the first time, so that timely measures are taken to avoid device failure caused by chip overheating and affect the safe and reliable operation of the power grid. The application can change the current situation of no effective supervision means for chip overheating of the relay protection device, and effectively improve the reliability of the relay protection device.

[0101] Exemplary apparatus

[0102] Figure 3 is a structural schematic diagram of the chip overheating early warning device of the relay protection device provided by an exemplary embodiment of the application. As Figure 3As shown, the device 300 comprises:

[0103] The acquisition module 310 is configured to acquire the ambient temperature of the monitored chip by the temperature sensor every preset unit monitoring period.

[0104] The calculation module 320 is configured to calculate the junction temperature of the monitored chip according to the ambient temperature based on a chip junction temperature model.

[0105] The determination module 330 is configured to compare the junction temperature with a plurality of preset junction temperature thresholds to determine whether the relay protection device gives a warning to the monitored chip, wherein the plurality of junction temperature thresholds comprise a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold and a fourth junction temperature threshold.

[0106] The first junction temperature threshold and the second junction temperature threshold are within a normal working temperature range.

[0107] The second junction temperature threshold and the third junction temperature threshold are within a life-accelerated decay temperature range.

[0108] The third junction temperature threshold and the fourth junction temperature threshold are within an allowed short-time running temperature range.

[0109] The fourth junction temperature threshold is the highest allowed temperature.

[0110] Optionally, the determination module 330 comprises:

[0111] The first warning issuing sub-module is configured to issue an alarm signal to the monitored chip by the relay protection device when the junction temperature is higher than the fourth junction temperature threshold.

[0112] Optionally, the determination module 330 comprises:

[0113] The second warning issuing sub-module is configured to calculate the running time of the monitored chip when the junction temperature is within the third junction temperature threshold and the fourth junction temperature threshold, and issue an alarm signal to the monitored chip by the relay protection device when the running time exceeds a preset maximum running time allowed at the temperature range.

[0114] Optionally, the determination module 330 comprises:

[0115] The first calculation sub-module is configured to set a monitoring period of the monitored chip when the junction temperature is within the second junction temperature threshold and the third junction temperature threshold, and calculate the average junction temperature of the monitored chip within the monitoring period.

[0116] The second calculation sub-module is configured to calculate a first characteristic life of the monitored chip at the second junction temperature threshold and a second characteristic life of the monitored chip at the average junction temperature according to an Arrhenius model.

[0117] The first determining sub-module is configured to determine a life attenuation acceleration ratio of the monitored chip in the monitoring time period according to the first characteristic life and the second characteristic life.

[0118] The second determining sub-module is configured to set a protection warning time of the monitored chip in the life acceleration attenuation temperature interval, and perform junction temperature calculation and life attenuation acceleration ratio calculation on the monitored chip in the preset unit monitoring time period within the protection warning time to determine an average life attenuation acceleration ratio of the monitored chip within the protection warning time.

[0119] The third determining sub-module is configured to determine whether the relay protection device gives a warning prompt to the monitored chip according to the average life attenuation acceleration ratio.

[0120] Optionally, the third determining sub-module comprises:

[0121] The first judging unit is configured to, in a case where the average life attenuation acceleration ratio is greater than a preset threshold, not give a warning prompt to the monitored chip by the relay protection device.

[0122] The second judging unit is configured to, in a case where the average life attenuation acceleration ratio is less than or equal to the preset threshold, send an alarm signal to the monitored chip by the relay protection device.

[0123] Exemplary electronic device

[0124] Figure 4 The electronic device 40 includes one or more processors 41 and memory 42. Figure 4 As shown in FIG. 1, the electronic device 40 includes one or more processors 41 and memory 42.

[0125] The processor 41 can be a central processing unit (CPU) or other form of processing unit that has data processing capability and / or instruction executing capability, and can control other components in the electronic device to perform desired functions.

[0126] The memory 42 can include one or more computer program products that can include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory, for example, can include random access memory (RAM), cache memory, and / or the like. The non-volatile memory, for example, can include read only memory (ROM), hard disk, flash memory, and / or the like. One or more computer program instructions can be stored on the computer-readable storage media, which the processor 41 can execute to implement the methods of the software programs of the various embodiments of the present application described above and / or other desired function. In one example, the electronic device can further include an input device 43 and an output device 44, which are interconnected through a bus system and / or other forms of connection mechanisms (not shown).

[0127] In addition, the input device 43 can include, for example, a keyboard, a mouse, and / or the like.

[0128] The output device 44 can output various information to the outside. The output device 44 can include, for example, a display, a speaker, a printer, a communication network and a remote output device connected thereto, and / or the like.

[0129] Of course, in order to simplify, Figure 4 Only some of the components of the electronic device related to the present application are shown in FIG. 1, and components such as a bus, an input / output interface, and / or the like are omitted. In addition, the electronic device can include any other appropriate components according to the specific application.

[0130] Exemplary computer program product and computer readable storage medium

[0131] In addition to the methods and devices described above, embodiments of the present application can also be a computer program product including computer program instructions that, when executed by a processor, cause the processor to perform steps of the methods according to various embodiments of the present application described in the above "Exemplary Methods" section of the specification.

[0132] The computer program product can be written in any combination of one or more programming languages, including an object oriented programming language such as Java, C++, and / or the like, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code can execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device or entirely on the remote cloud device or server.

[0133] In addition, an embodiment of the present application can also be a computer-readable storage medium, having stored thereon computer program instructions, which, when executed by a processor, cause the processor to perform the steps of the method described in the above “Exemplary Method” section of the specification for information mining on historical change records according to various embodiments of the present application.

[0134] The computer-readable storage medium can take the form of one or more combinations of any type of computer-readable media. The computer-readable media can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can include, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, system, or device, or any suitable combination thereof. More specific examples (a non-exhaustive list) of the computer-readable storage medium include an electrical connection having one or more wires, a portable disc, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof.

[0135] The above describes the basic principles of the present application in combination with specific embodiments, but it should be noted that the advantages, benefits, effects, etc. mentioned in the present application are only examples and are not limiting, and these advantages, benefits, effects, etc. cannot be considered as necessary for each embodiment of the present application. In addition, the above specific details are only for the purpose of example and for the purpose of understanding, and the above details do not limit the present application to the above specific details.

[0136] Each embodiment in the specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between each embodiment can be mutually referred to. For system embodiments, since they basically correspond to method embodiments, the description is relatively simple, and the relevant parts can be referred to the part of the method embodiment.

[0137] The block diagrams of the devices, systems, apparatuses, systems involved in the present application are only illustrative examples and are not intended to require or imply that the connections, arrangements, configurations must be as shown in the block diagrams. As those skilled in the art will recognize, these devices, systems, apparatuses, systems can be connected, arranged, configured in any manner. Words such as “include”, “contain”, “have” are open-ended words, mean “include but not limited to”, and can be used interchangeably. The words “or” and “and” used herein mean the word “and / or”, and can be used interchangeably unless the context clearly indicates otherwise. The word “such as” used herein means the phrase “such as but not limited to”, and can be used interchangeably.

[0138] The methods and systems of the present application can be implemented in a number of ways. For example, the methods and systems of the present application can be implemented via software, hardware, firmware, or any combination of software, hardware, and firmware. The above described order of steps for the methods is merely illustrative, and the steps of the methods of the present application are not limited to the order specifically described above unless otherwise specifically stated. Furthermore, in some embodiments, the present application can also be implemented as a program recorded on a recording medium, which includes machine readable instructions for implementing the methods according to the present application. Thus, the present application also covers recording media storing programs for executing the methods according to the present application.

[0139] It is also important to note that the systems, devices and methods of the present application can be embodied in a variety of forms without departing from the spirit of the application. Specifically, the systems, devices and methods of the present application can be implemented using hardware, software, firmware, or any combination thereof. In some embodiments, the systems, devices and methods of the present application can be implemented as computer programs or program code containing instructions for implementing the methods of the present application. It will be appreciated that such computer programs or program code can be implemented in a plurality of forms, including, but not limited to, a prior art programming language, such as assembly language, a higher level procedural language such as C, or higher level object oriented language such as C++. Additionally, it will be appreciated that the present application can be implemented as a program or programs stored on a recording medium, which includes machine readable instructions for implementing the methods according to the present application.

[0140] The above description is given for the purpose of illustration and description. It is not intended to limit the embodiments of the present application to the form described. Although various example aspects and embodiments have been discussed, those skilled in the art will recognize that certain modifications, substitutions, changes, additions and rearrangements can be made without departing from the scope of the present application.

Claims

1. A chip overheating early warning method of a relay protection device, characterized in that, The method comprises the following steps: acquiring the ambient temperature of the monitored chip through the temperature sensor every preset unit monitoring period; calculating the junction temperature of the monitored chip according to the ambient temperature based on a chip junction temperature model; comparing the junction temperature with a plurality of preset junction temperature thresholds to determine whether the relay protection device gives a warning prompt to the monitored chip, wherein the plurality of junction temperature thresholds comprise a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold and a fourth junction temperature threshold, the first junction temperature threshold and the second junction temperature threshold form a normal working temperature interval; the second junction temperature threshold and the third junction temperature threshold form a life acceleration and attenuation temperature interval; the third junction temperature threshold and the fourth junction temperature threshold form an allowable short-time running temperature interval; the fourth junction temperature threshold is the highest allowable temperature; comparing the junction temperature with the plurality of preset junction temperature thresholds to determine whether the relay protection device gives a warning prompt to the monitored chip comprises: in the case that the junction temperature is higher than the fourth junction temperature threshold, the relay protection device sends an alarm signal to the monitored chip; comparing the junction temperature with the plurality of preset junction temperature thresholds to determine whether the relay protection device gives a warning prompt to the monitored chip comprises: in the case that the junction temperature is in the interval between the third junction temperature threshold and the fourth junction temperature threshold, the running time of the monitored chip is calculated, and in the case that the running time exceeds a preset maximum value of the running time in the temperature interval, the relay protection device sends an alarm signal to the monitored chip; comparing the junction temperature with the plurality of preset junction temperature thresholds to determine whether the relay protection device gives a warning prompt to the monitored chip comprises: in the case that the junction temperature is in the interval between the second junction temperature threshold and the third junction temperature threshold, the monitoring period of the monitored chip is set, and the average junction temperature of the monitored chip in the monitoring period is calculated; according to the Arrhenius model, the first characteristic life of the monitored chip at the second junction temperature threshold and the second characteristic life of the monitored chip at the average junction temperature are calculated; according to the first characteristic life and the second characteristic life, the life attenuation acceleration ratio of the monitored chip in the monitoring period is determined; the protection warning time of the monitored chip in the life acceleration and attenuation temperature interval is set, and in the protection warning time, the junction temperature calculation and the life attenuation acceleration ratio calculation of the monitored chip are performed at the preset unit monitoring period to determine the average life attenuation acceleration ratio of the monitored chip in the protection warning time; according to the average life attenuation acceleration ratio, it is determined whether the relay protection device gives a warning prompt to the monitored chip.

2. The method of claim 1, wherein, according to the average life attenuation acceleration ratio, it is determined whether the relay protection device gives a warning prompt to the monitored chip comprises: in the case that the average life attenuation acceleration ratio is greater than a preset threshold, the relay protection device does not give a warning prompt to the monitored chip; in the case that the average life attenuation acceleration ratio is less than or equal to the preset threshold, the relay protection device gives a warning prompt to the monitored chip. In a case where the average life attenuation acceleration ratio is less than or equal to the preset threshold, the relay protection device sends an alarm signal to the monitored chip.

3. A device for early warning of overheat of a chip of a relay protection device for implementing the method of any one of claims 1-2, characterized in that, Comprise: The acquisition module is used for collecting the ambient temperature of the monitored chip through the temperature sensor every interval preset unit monitoring time period; The calculation module is used for calculating the junction temperature of the monitored chip according to the ambient temperature based on the chip junction temperature model; The determination module is used for comparing the junction temperature with a plurality of preset junction temperature thresholds to determine whether the relay protection device gives a warning prompt to the monitored chip, wherein the plurality of junction temperature thresholds comprise a first junction temperature threshold, a second junction temperature threshold, a third junction temperature threshold and a fourth junction temperature threshold, The first junction temperature threshold and the second junction temperature threshold are a normal working temperature interval; The second junction temperature threshold and the third junction temperature threshold are a life attenuation temperature interval; The third junction temperature threshold and the fourth junction temperature threshold are an allowed short-time running temperature interval: The fourth junction temperature threshold is the highest allowed temperature.

4. The apparatus of claim 3, wherein, The determination module comprises: The first warning sending submodule is used for sending an alarm signal to the monitored chip by the relay protection device in a case where the junction temperature is higher than the fourth junction temperature threshold.

5. The apparatus of claim 3, wherein, The determination module comprises: The second warning sending submodule is used for calculating the running time of the monitored chip in a case where the junction temperature is in the interval of the third junction temperature threshold and the fourth junction temperature threshold, and sending an alarm signal to the monitored chip by the relay protection device in a case where the running time exceeds a preset maximum value of the running time allowed in the temperature interval.

6. A computer-readable storage medium, characterized in that, The storage medium stores a computer program, and the computer program is used to execute the method in any one of claims 1-2.

7. An electronic device, comprising: The electronic device comprises: A processor; A memory for storing executable instructions of the processor; The processor is used to read the executable instructions from the memory and execute the instructions to realize the method in any one of claims 1-2.

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