Chip burn-in test equipment and test process

Abstract

The application relates to a chip aging test equipment and a test process. An aging box comprises a test chamber and a switching chamber in communication, the height of the switching chamber is smaller than that of the test chamber, a sealable sealing curtain is arranged between the test chamber and the switching chamber, and a cabinet door is rotationally connected to the switching chamber; a test assembly comprises a base and a test frame, the test frame is movably arranged on the base, the test frame is provided with a plurality of test plates, each test plate is provided with a plurality of mounting positions for mounting chips; when the test frame is in a test state, the plurality of test plates are arranged in an up-down direction; when the test frame is in a switching state, the plurality of test plates are arranged in the up-down direction, and the interval between two adjacent test frames is smaller than that in the test state; when the test frame is in a stacking state, the plurality of test plates are flush on a horizontal plane; and a driving mechanism is arranged on the base to drive the test frame to switch between the test state and the switching state. The application has the effect of reducing the waste of resources in the aging test process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor aging test, in particular to a chip aging test device and test process. BACKGROUND

[0002] With the continuous development of semiconductor technology, the application field of chips begins to extend, and the reliability requirement of chips is also higher and higher. In order to ensure the reliability of chips, almost all products are subjected to burn-in test before leaving the factory. Burn-in test is to simulate the working state of the chip, to accelerate the electrical failure of the chip under high temperature, to obtain the failure rate of the chip in a period of time, to make the chip work under given load to make its defects appear in a short time, so as to obtain the approximate failure rate of the chip in the life cycle and avoid failure in the early use.

[0003] The burn-in test device in the related art mostly adopts a side door opening mode, a plurality of test boards are arranged in the burn-in test device, and the plurality of test boards are arranged along the height direction of the burn-in test device. In each burn-in test, the side door needs to be opened to pull out the test board, the semiconductor chip to be tested is installed on the test board, and then the test board and the semiconductor chip are inserted into the burn-in test device, and the side door is closed for burn-in test. After the burn-in test is completed, the side door is opened to pull out the test board and the semiconductor chip from the burn-in test device, and the next batch of semiconductor chips is subjected to burn-in test, and the burn-in test is repeated.

[0004] The inside of the burn-in test device is in a high temperature environment, and the replacement speed of the test board is slow in the process of opening the side door to take out the plurality of test boards one by one and then inserting the plurality of new test boards one by one. The heat loss in the burn-in test device is caused, the temperature in the burn-in device is reduced, and the inside of the burn-in test device needs to be heated to the test temperature again, causing waste of resources. SUMMARY

[0005] In order to reduce the waste of resources in the burn-in test process, the present application provides a chip burn-in test device and test process.

[0006] The chip burn-in test device and test process provided by the present application adopt the following technical scheme:

[0007] In a first aspect, the chip burn-in test device provided by the present application comprises:

[0008] The aging box comprises a test chamber and an adapter chamber in communication, the height of the adapter chamber is smaller than the height of the test chamber, a sealable sealing curtain is arranged between the test chamber and the adapter chamber to isolate or communicate the test chamber and the adapter chamber, and the adapter chamber is rotatably connected with a cabinet door.

[0009] A test assembly comprises a base and a test rack movably mounted on the base, the test rack having a plurality of test boards, each of the test boards being provided with a plurality of mounting positions for mounting chips, the test rack having a test state, a switching state and a stacking state;

[0010] When the test rack is in the test state, the plurality of test boards are arranged in an up-down direction with intervals; when the test rack is in the switching state, the plurality of test boards are arranged in the up-down direction with intervals, and the interval between two adjacent test boards is smaller than that in the test state; and when the test rack is in the stacking state, the plurality of test boards are flush on a horizontal plane; and

[0011] A driving mechanism is mounted on the base and drives the test rack to switch between the test state and the switching state.

[0012] By adopting the above technical scheme, after the chips are tested, the test rack is switched to the switching state, so as to reduce the height of the test rack, thereby reducing the gravity center of the test assembly, enhancing the stability of the movement of the test assembly, taking out the test assembly from the test chamber and the switching chamber, so that all the test boards can be taken out at the same time, and the operation of taking out the test boards layer by layer is avoided; after the test assembly is taken out from the switching chamber, the test rack is switched to the stacking state, so as to facilitate the disassembly of the chips and the installation of the next batch of chips; after the installation of the next batch of chips is completed, the test rack is switched to the switching state, and the test rack is sent into the test chamber, so that the installation of all the test boards can be completed, and the operation of stacking the test boards one by one is avoided; the taking-out time of the test boards is saved, on the one hand, the test efficiency is improved, and on the other hand, the opening time of the cabinet door of the switching chamber is reduced, the heat exchange time between the inside of the aging chamber and the outside is reduced, so as to reduce the temperature drop of the inside of the aging chamber, when the next batch of chips is tested, the heating time of the aging chamber is shortened, the test efficiency is further improved, and the waste of resources is reduced.

[0013] The plurality of test boards are arranged on the test rack, so as to reduce the risk of loss of the test boards and facilitate the storage of the test boards. The chips can be installed on the test boards by rotating the test rack, the mounting positions are provided for the test boards, and the problem that a person with insufficient height cannot take out the test boards on the upper side is solved.

[0014] The switching chamber is arranged on one side of the test chamber, the sealing curtain is in the closed state after the test rack is moved from the test chamber to the switching chamber, so as to isolate the test chamber and the switching chamber, only the cabinet door of the switching chamber needs to be opened, the heat exchange between the test chamber and the outside environment is reduced, and the waste of resources is further reduced.

[0015] Optionally, the test rack further comprises four connecting assemblies.

[0016] Each of the test boards is connected with an L-shaped connecting piece at two opposite ends, the connecting piece comprises a mounting portion and a bending portion, and is fixed to the test board through the mounting portion, and a plurality of the test boards are arranged in sequence, so that the connecting pieces are parallel to each other and arranged in two mirror image rows;

[0017] Each of the connecting assemblies comprises a plurality of connecting rods, a plurality of sleeves and a plurality of elastic members, the connecting rods are arranged at intervals in the arrangement direction of the connecting pieces, and each of the adjacent connecting rods is connected by the elastic member, the end portions of each of the adjacent connecting rods are located in the same sleeve and can move axially along the sleeve, and the elastic member is located in the corresponding sleeve;

[0018] The end portions of the mounting portions of the same row away from the bending portions correspond to the middle portions of the connecting rods in the same connecting assembly one by one and are connected by a rotating shaft, and the end portions of the bending portions of the same row away from the mounting portions correspond to the connecting rods in the same connecting assembly one by one and are connected by a rotating shaft.

[0019] By adopting the above technical solution, after the test assembly is taken out from the switching chamber, the operator rotates the test rack to the stacking state, without the need to set other driving mechanisms, thereby reducing the production cost and the failure rate of the equipment.

[0020] The end portions of the connecting assemblies are pushed to make the spacing between each of the adjacent test boards larger. The test rack is switched to the test state by the driving mechanism, so that the elastic member is in a stretched state, and after the driving mechanism is removed, the test rack can be automatically switched to the switching state under the elastic recovery action of the elastic member. On the other hand, due to the setting of the elastic member, the elastic member can provide a buffering effect for the test board during the recovery process, thereby avoiding the damage to the chip caused by the large impact force of the falling test board.

[0021] Optionally, the base is arranged in a U shape and has two mounting frames, the bottom portions of the two mounting portions connected with the middle test board are connected with a sliding plate, the sliding plate is located between the two connecting assemblies, the mounting frame is provided with a sliding groove extending upward and downward, and the end portions of the sliding plate slide in the sliding groove.

[0022] By adopting the above technical solution, the sliding plate can only move in the sliding groove and cannot rotate, so that the direction of the test board provided with the sliding plate cannot be changed, the test board serves as a reference, and the other test boards are rotated to the two sides of the test board. The setting of the sliding groove can guide the extension and retraction of the test rack and enhance the stability of the test rack. When the test rack is switched from the test state to the switching state, in addition to the fact that the spacing between the adjacent test boards is smaller, the middle test rack can move downward, thereby further lowering the gravity center of the test rack, so that the height of the test rack in the stacking state is lowered and can be suitable for operators of different heights.

[0023] Optionally, the end of the driving rod of the driving mechanism is provided with a clamping groove, the test board at the most end is provided with a protrusion corresponding to the clamping groove, and the driving rod is extended to drive the test frame to switch from the switching state to the testing state; when the test frame is in the testing state, the protrusion is located in the clamping groove;

[0024] The base is provided with a supporting part corresponding to the connecting assembly, the supporting part is used for supporting the bottom of the connecting assembly when the test frame is in the switching state, the sliding plate is located at the bottom of the sliding groove, and the clamping groove is away from the protrusion.

[0025] By adopting the above technical scheme, the supporting part supports the connecting assembly, so that each elastic member is in a compressed state under the pressure of the test board, and the test board at the bottom is prevented from being suspended, thereby avoiding the effect that the distance between adjacent test boards is reduced; the driving rod of the driving mechanism is extended to drive the test board at the most top to move, and all the connecting assemblies can be simultaneously elongated; when the test frame is in the switching state, the clamping groove is away from the protrusion, and the test frame is prevented from interfering with the protrusion when rotating, so that the driving mechanism does not affect the rotation of the test frame.

[0026] Optionally, the cabinet door is arranged on one side of the switching chamber adjacent to the test chamber, and a first pushing mechanism is arranged on the inner side wall opposite to the test chamber of the switching chamber, and the first pushing mechanism is used for pushing the test assembly from the switching chamber into the test chamber.

[0027] By adopting the above technical scheme, the need for an operator to push the test assembly into the test chamber is eliminated, and the high temperature in the test chamber is prevented from forming a safety hazard to the operator.

[0028] Optionally, a second pushing mechanism is arranged on the side of the test chamber opposite to the switching chamber, and the second pushing mechanism is used for pushing the test assembly from the test chamber into the switching chamber.

[0029] By adopting the above technical scheme, the operation of the operator to pull the test assembly out of the test chamber is eliminated, and the high temperature in the test chamber is prevented from forming a safety hazard to the operator.

[0030] Optionally, each test board is provided with a plug, the inner side wall adjacent to the test chamber and the switching chamber is provided with a plurality of sockets matched with the plug, and the inner side wall opposite to the socket of the test chamber is provided with a third pushing mechanism, and the third pushing mechanism is used for pushing the test assembly, so that the plug of the test board is inserted into the socket.

[0031] By adopting the technical scheme, the plug of each test board is electrically connected with the socket by moving the whole test assembly, thereby simplifying the operation of electrical connection, avoiding the operation of electrical connection by the operator, and avoiding the high temperature in the test chamber from forming a safety hazard to the operator.

[0032] Optionally, one side of the test chamber provided with the socket is provided with a fourth pushing mechanism, and the fourth pushing mechanism pushes the test assembly to separate the plug of the test assembly from the socket.

[0033] By adopting the technical scheme, the operator is avoided from pulling the test assembly to separate the plug from the socket, thereby avoiding the high temperature in the test chamber from forming a safety hazard to the operator.

[0034] Optionally, the sealing curtain is movably arranged on the inner side wall of the test chamber in the up-down direction, one side of the test chamber provided with the sealing curtain is provided with a switching mechanism, a driving rod of the switching mechanism is fixedly connected with the sealing curtain, and the sealing curtain is driven to move up and down to communicate or isolate the test chamber and the adapter chamber.

[0035] By adopting the technical scheme, when the test assembly enters the adapter chamber, the switching mechanism is used to timely push the sealing curtain to the closed position to isolate the test chamber and the adapter chamber, thereby reducing the heat exchange between the test chamber and the outside.

[0036] In a second aspect, the application further provides a chip aging test process based on the chip aging test device, and the chip aging test process comprises the following steps:

[0037] Switching the test assembly to the stacking state to stack the chips in the mounting positions of the test boards;

[0038] Switching the test assembly to the adapter state to place the test assembly in the test chamber through the adapter chamber, and driving the test assembly to the test state by the driving mechanism; and

[0039] After the chip test is completed, the test assembly is switched to the adapter state by the driving mechanism, the test rack is transferred to the test chamber and then to the outside of the adapter chamber, the test rack is switched to the stacking state, and the tested chips are removed.

[0040] By adopting the technical scheme, the chips can be conveniently removed from the test boards by people of different heights, the speed of placing the test boards in the test chamber and removing the test boards from the test chamber can be accelerated, the time of heat exchange between the inside of the aging box and the outside is reduced, the temperature drop in the inside of the aging box is reduced, the heating time of the aging box is shortened when the next batch of chips is tested, the test efficiency is improved, and the waste of resources is reduced.

[0041] In summary, the present application includes at least one of the following beneficial technical effects:

[0042] 1. The test frame is switched from the test state to the switching state, facilitating movement to a switching chamber with a smaller height, reducing the time for heat exchange between the inside and outside of the aging box, thereby reducing the degree of temperature drop inside the aging box, shortening the heating time of the aging box when the next batch of chips is tested, further improving the test efficiency, and reducing the waste of resources;

[0043] 2. When the test frame is in the stacking state, the height of each test board is reduced, suitable for operators of different heights, and the chip stacking efficiency is also improved;

[0044] 3. When the test frame is in the switching state, the test board can be taken out from the switching chamber at the same time, and the height of the test frame is reduced, which can enhance the stability of the test assembly. BRIEF DESCRIPTION OF DRAWINGS

[0045] Figure 1 is a structural schematic diagram of a chip aging test equipment in embodiment 1 of the present application;

[0046] Figure 2 is a structural schematic diagram of a test assembly (located in a stacking position) in embodiment 1 of the present application from a first perspective;

[0047] Figure 3 is a structural schematic diagram of a test assembly in embodiment 1 of the present application from a second perspective;

[0048] Figure 4 is a structural schematic diagram of a test assembly in embodiment 1 of the present application from a first perspective; Figure 3 is a partial enlarged view of position A in

[0049] Figure 5 is a structural schematic diagram of a test assembly in embodiment 1 of the present application from a second perspective; Figure 3

[0050] is a structural schematic diagram of a test assembly (located in a test position) in embodiment 1 of the present application from a first perspective; Figure 6

[0051] is a partial enlarged view of position C in Figure 7 Figure 6 is a structural schematic diagram of a test assembly (located in a test position) in embodiment 1 of the present application from a second perspective;

[0052] Figure 8 is a partial enlarged view of the circle in

[0053] Figure 9 Figure 8 is a partial enlarged view of the circle in

[0054] Figure 10 ​​is a structural schematic diagram of a test assembly (located in a switching position) in Embodiment 1 of the present application;

[0055] Figure 11 is Figure 10 is a partial enlarged schematic view at D in FIG. 1.

[0056] Legend: 100, aging oven; 110, test chamber; 120, switching chamber; 130, switching mechanism; 121, cabinet door; 200, test assembly; 210, base; 211, mounting rack; 212, sliding slot; 213, stop portion; 220, test rack; 1, test board; 11, mounting position; 12, sliding plate; 13, protrusion; 14, plug; 2, connecting assembly; 21, connecting rod; 21a, annular protrusion; 22, sleeve; 22a, annular limiting portion; 22b, clearance hole; 23, elastic member; 24, rotating shaft; 3, connecting piece; 31, mounting portion; 32, bent portion; 230, universal wheel; 300, driving mechanism; 310, driving rod; 320, clamping groove; 400, pushing mechanism. DETAILED DESCRIPTION

[0057] The accompanying drawings are included to provide a further understanding of the present application, and are incorporated herein and constitute a part of the detailed description. The embodiments described and pictured herein are described and pictured only as possible embodiments. Any other embodiments falling within the scope of the present application obtained by those skilled in the art without creative work should be within the scope of the present application. Figures 1-11 The technical solutions in the embodiments of the present application are described clearly and completely. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work should be within the scope of the present application.

[0058] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "transverse", "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0059] The embodiments of the present application provide a chip aging test device and a test process. The test process is based on the chip aging test device. The chip aging test device and the test process are described in detail below.

[0060] Embodiment 1

[0061] The chip aging test device is disclosed by the embodiments of the present application. Referring to Figure 1 , the chip aging test device comprises an aging box 100, a test assembly 200 (combined Figure 2 ), a driving mechanism 300 and a plurality of pushing mechanisms 400.

[0062] The aging box 100 comprises a test chamber 110 and an adapter chamber 120 in communication, the height of the adapter chamber 120 is smaller than that of the test chamber 110, the test assembly 200 is used for carrying the chip to be tested, the height of the test assembly 200 is variable, and the test assembly 200 is movable between the test chamber 110 and the adapter chamber 120. When the test assembly 200 moves into the test chamber 110, the test chamber 110 is a high-temperature environment, and the chip to be tested can be subjected to aging test. When the test assembly 200 moves into the adapter chamber 120, the operator can take out the test assembly 200 from the adapter chamber 120.

[0063] The adapter chamber 120 is rotationally connected with a cabinet door 121, the operator can open the cabinet door 121 to move the test assembly 200 into the adapter chamber 120. A sealable curtain is arranged between the test chamber 110 and the adapter chamber 120 to isolate or communicate the test chamber 110 and the adapter chamber 120.

[0064] In an optional embodiment, the sealable curtain can be a magnetic soft curtain, which can be automatically closed after being opened. In the embodiment, the sealable curtain is made of hard material, a sealing ring is arranged around the sealable curtain, and the sealable curtain is movably installed on the inner side wall of the adapter chamber 120 in the up-down direction. The outer side wall of the test chamber 110 is provided with a switching mechanism 130, a driving rod of the switching mechanism 130 is fixedly connected with the sealable curtain, and the sealable curtain is driven to move up and down to communicate or isolate the test chamber 110 and the adapter chamber 120. The switching mechanism 130 can be a one-way air cylinder, a ball screw mechanism or the like.

[0065] Opening the sealable curtain facilitates the movement of the test assembly 200 from the adapter chamber 120 to the test chamber 110, and then the sealable curtain is driven by the switching mechanism 130 to move to the closed position, which facilitates the aging test of the chip and reduces the heat exchange between the test chamber 110 and the outside. After the aging test of the chip is completed, the sealable curtain is opened, the test assembly 200 enters the adapter chamber 120, and the switching mechanism 130 is used to timely push the sealable curtain to the closed position to isolate the test chamber 110 and the adapter chamber 120 and reduce the heat exchange between the test chamber 110 and the outside.

[0066] Since the test assembly 200 needs to move between the test chamber 110 and the adapter chamber 120, if the operator pushes the test assembly 200 from the adapter chamber 120 to the test chamber 110, or pulls the test assembly 200 from the test chamber 110 to the adapter chamber 120, the high temperature in the test chamber 110 can cause harm to the operator.

[0067] In order to facilitate the movement of the test assembly 200, the cabinet door 121 is arranged on the side of the adapter chamber 120 adjacent to the test chamber 110, and the inner side wall of the adapter chamber 120 opposite to the test chamber 110 is provided with a first pushing mechanism 400. The first pushing mechanism 400 (i.e. Figure 1 the pushing mechanism 400 on the left side in the middle) is used to push the test assembly 200 from the adapter chamber 120 into the test chamber 110. The first pushing mechanism 400 can be a one-way air cylinder, an electric push rod, etc. By providing the first pushing mechanism 400, the need for the operator to push the test assembly 200 into the test chamber 110 is eliminated, and the high temperature in the test chamber 110 is avoided to form a safety hazard to the operator.

[0068] The side of the test chamber 110 opposite to the adapter chamber 120 is provided with a second pushing mechanism 400 (i.e. Figure 1 the pushing mechanism 400 on the right side in the middle), and the second pushing mechanism 400 is used to push the test assembly 200 from the test chamber 110 into the adapter chamber 120. The second pushing mechanism 400 can be a one-way air cylinder, an electric push rod, etc., which eliminates the operation of the operator pulling the test assembly 200 out of the test chamber 110, and avoids the high temperature in the test chamber 110 to form a safety hazard to the operator.

[0069] Referring to Figure 2 , the test assembly 200 includes a base 210 and a test rack 220. The test rack 220 is movably installed on the base 210. The base 210 can be provided with universal wheels 230 at the bottom to facilitate the movement of the entire test assembly 200. The test rack 220 has a plurality of test boards 1 and four connecting assemblies 2. Each test board 1 is provided with a plurality of mounting positions 11 for mounting chips. The test rack 220 has a test state, an adapter state and a stacking state.

[0070] Referring to Figure 2 , each test board 1 is connected with an L-shaped connecting piece 3 at opposite ends, and the two connecting pieces connected with the same test board 1 are mirror images. Referring to Figure 3 and Figure 4 , the connecting piece 3 includes a mounting portion 31 and a bent portion 32, and is fixed to the test board 1 through the mounting portion 31. The bent portion 32 is perpendicular to the test board 1. A plurality of test boards 1 are arranged in sequence, so that a plurality of connecting pieces 3 are parallel to each other and arranged in two rows which are mirror images.

[0071] Figures 2 to 5All test racks 220 are in the stacking state. When the test racks 220 are in the stacking state, each test plate 1 is located on the same plane, and there is a gap between adjacent test plates 1. Multiple connectors 3 located on the same side of multiple test plates 1 are at the same height and parallel.

[0072] Figures 6 to 9 All test fixtures 220 are in the testing state. Figure 10 and Figure 11 All test fixtures 220 are in the transition state. When the test fixture 220 is in the test state and the transition state, each test plate 1 is set at vertical intervals, and multiple connectors 3 located on the same side of multiple test plates 1 are spaced at vertical intervals and parallel.

[0073] Reference Figure 5 Each connecting component 2 includes multiple connecting rods 21, multiple sleeves 22, and multiple elastic elements 23. The multiple connecting rods 21 are arranged at intervals in the direction of the connecting component 3, and each pair of adjacent connecting rods 21 are connected by an elastic element 23. The ends of each pair of adjacent connecting rods 21 are confined to the same sleeve 22 and can move axially along the sleeve 22. The elastic element 23 is located in the corresponding sleeve 22.

[0074] The sleeve 22 has through holes at the midpoint of both end faces to form annular limiting portions 22a. The end of the connecting rod 21 has annular protrusions 21a that move within the sleeve 22. The inner sidewall of the sleeve 22 provides guidance for the annular protrusions 21a. When the test frame 220 is in the testing state and the transition state, the annular limiting portions 22a support the annular protrusions 21a located above and adjacent to it. In other embodiments, the inner sidewall of the sleeve 22 may have multiple guide grooves, and the end of the connecting rod 21 may have guide blocks that move within the guide grooves.

[0075] One end of each of the multiple mounting portions 31 in the same row away from the bending portion 32 corresponds to the middle of the connecting rod 21 in the same connecting assembly 2, and they are connected by a pivot 24.

[0076] In this embodiment, a strip-shaped clearance hole 22b is provided on the side of the sleeve 22 facing the connector 3. When the distance between adjacent connectors 3 increases or decreases, the rotating shaft 24 slides in the clearance hole 22b.

[0077] Reference Figure 6 The base 210 is U-shaped and has two mounting brackets 211. A sliding plate 12 is connected to the bottom of the two mounting parts 31 that are connected to a test plate 1 in the middle. The sliding plate 12 is located between the two connecting components 2 (in conjunction with...). Figure 5The mounting rack 211 is provided with a sliding groove 212 extending in the up-down direction, and the end of the sliding plate 12 can slide in the sliding groove 212.

[0078] When the test rack 220 is in the test state, the plurality of test boards 1 are arranged in the up-down direction, and the sliding plate 12 slides to the upper part of the sliding groove 212 (refer to Figure 6 When the test rack 220 is in the switching state, the plurality of test boards 1 are arranged in the up-down direction, and the distance between the adjacent two test racks 220 is smaller than that in the test state. At this time, the sliding plate 12 slides to the bottom of the sliding groove 212, and the bottom wall of the sliding groove 212 can support the sliding plate 12 (refer to Figure 10 and Figure 11 When the test rack 220 is in the stacking state, the plurality of test boards 1 are flush in the horizontal plane, and at this time, the sliding plate 12 is located at the bottom of the sliding groove 212 (refer to Figure 2 and Figure 4 ).

[0079] The driving mechanism 300 is used to drive the test rack 220 to switch between the test state and the switching state. Specifically, the driving mechanism 300 drives each connecting assembly 2 to elongate, so that the distance between the adjacent two connecting rods 21 in the same connecting assembly 2 increases, thereby increasing the distance between the adjacent two test boards 1, and the elastic member 23 is in a stretched state.

[0080] The driving mechanism 300 is used to drive the test rack 220 to switch to the test state, so that the elastic member 23 is in a stretched state. After the driving mechanism 300 is removed, the test rack 220 can automatically switch to the switching state under the elastic recovery action of the elastic member 23. On the other hand, due to the arrangement of the elastic member 23, the elastic member 23 can provide a buffering effect for the test board 1 during the recovery process, so as to avoid the damage to the chip caused by the large impact force of the falling test board 1.

[0081] Specifically, the driving mechanism 300 is installed on the base 210 and drives the test rack 220 to switch between the test state and the switching state. Refer to Figure 7 The end of the driving rod 310 of the driving mechanism 300 is provided with a clamping groove 320, the test board 1 located at the end is provided with a protrusion 13 corresponding to the clamping groove 320, and the piston rod drives the test rack 220 to switch from the switching state to the test state; when the test rack 220 is in the test state, the protrusion 13 is located in the clamping groove 320. The driving mechanism 300 can be a one-way air cylinder or an electric push rod.

[0082] The driving rod 310 of the driving mechanism 300 extends and pushes the topmost test board 1 to move upwards, thereby driving the multiple test boards 1 below to move upwards. At this time, the sliding plate 12 moves in the sliding groove 212, and the driving rod 310 of the driving mechanism 300 supports the entire test rack 220. In order to improve the stability of the test rack 220, the protruding block 13 can be provided with two protruding blocks 13 located on the opposite sides of the topmost test board 1, and the driving mechanism 300 is provided with two driving mechanisms 300 corresponding to the two protruding blocks 13.

[0083] After the test assembly 200 is taken out of the switching chamber 120, the operator rotates the test rack 220 to place the test rack 220 in the stacking state, without the need to set other driving mechanisms 300, thereby reducing the production cost and reducing the failure rate of the equipment. In order to make the test board 1 stably placed in the stacking state, the friction between the test board 1 and the connecting rod 21 can be increased.

[0084] The sliding plate 12 can only move in the sliding groove 212 and cannot rotate, so that the direction of the test board 1 provided with the sliding plate 12 cannot be changed. The test board 1 serves as a reference, and the other test boards 1 are rotated to the two sides of the test board 1. The sliding groove 212 can guide the extension and retraction of the test rack 220, thereby enhancing the stability of the test rack 220. When the test rack 220 is switched from the test state to the switching state, in addition to the fact that the distance between the adjacent test boards 1 is reduced, the middle test rack 220 can move downwards, thereby further lowering the center of gravity of the test rack 220 as a whole, so that the height of the test rack 220 in the stacking state is lowered, and the test rack 220 can be applied to operators of different heights.

[0085] Further, referring to Figure 6 , the base 210 is provided with a blocking portion 213. When the test rack 220 is in the test state, the blocking portion 213 abuts against the top surface of the bottommost test board 1. The blocking portion 213 can limit the upward movement of the bottommost test board 1, thereby increasing the distance between the multiple test boards 1 below. Referring to Figure 8 , when the test rack 220 is in the switching state, there is a distance between the top surface of the bottommost test board 1 and the blocking portion 213. During the process of rotating the test rack 220 from the switching state to the stacking state, the blocking portion 213 does not interfere with the rotation of the bottommost test board 1.

[0086] The base 210 is provided with a supporting portion corresponding to the connecting assembly 2. The supporting portion can be the surface of the base 210. When the test rack 220 is in the switching state, the supporting portion supports the bottom of the connecting assembly 2. The sliding plate 12 is located at the bottom of the sliding groove 212, and the clamping groove 320 is away from the protruding block 13.

[0087] The supporting part supports the connecting assembly 2, so that each elastic piece 23 is in a compressed state under the pressure of the test plate 1, and the test plate 1 at the bottom is prevented from being suspended to fail to reduce the spacing between adjacent test plates 1; when the test frame 220 is in the switching state, the clamping groove 320 is away from the protrusion 13, and the clamping groove 320 and the protrusion 13 do not interfere with each other when the test frame 220 rotates, so that the driving mechanism 300 does not affect the rotation of the test frame 220.

[0088] In order to facilitate the electrical connection between each test plate 1 and the test circuit board and to achieve the burn-in test of the chip to be tested, referring to Figure 5 The test plate 1 is provided with a plug 14, and the plug 14 on each test plate 1 can be one or more. The plug 14 is provided with a line between the plug 14 and the mounting position 11, so as to achieve the electrical connection between the plug 14 and the chip to be tested in the mounting position 11. The inner side wall adjacent to the switching chamber 120 of the test chamber 110 is provided with a socket matched with the plug 14, and the socket is electrically connected with the test circuit board (which is prior art and will not be described in detail here). The plug 14 and the socket are one-to-one corresponding, and the plug 14 of the test plate 1 is inserted into the socket, so as to achieve the electrical connection between the test plate 1 and the test circuit board.

[0089] In order to facilitate the insertion of the plug 14 of the test plate 1 into the socket, the inner side wall opposite to the socket of the test chamber 110 is provided with a third pushing mechanism 400, and the third pushing mechanism 400 is used to push the test assembly 200, so that the plug 14 of the test plate 1 is inserted into the socket.

[0090] It should be noted that after the test assembly 200 is pushed into the test chamber 110 by the first pushing mechanism 400, the test assembly 200 abuts against the inner side wall of the test chamber 110, and at this time, the plug 14 on the test plate 1 abuts against the socket one by one. Then, the third pushing mechanism 400 is used to push the test assembly 200, so that the plug 14 can be accurately inserted into the socket.

[0091] In this way, the electrical connection between the plug 14 of each test plate 1 and the socket can be achieved by moving the entire test assembly 200, thereby simplifying the operation of electrical connection; and the operation of the operator to achieve the electrical connection of the test plate 1 is avoided, thereby avoiding the safety hazard of high temperature in the test chamber 110 to the operator.

[0092] Further, the side of the test chamber 110 provided with the socket is provided with a fourth pushing mechanism 400, and the fourth pushing mechanism 400 pushes the test assembly 200, so that the plug 14 of the test assembly 200 is separated from the socket, thereby avoiding the operation of the operator to pull the test assembly 200 to separate the plug 14 from the socket, and avoiding the safety hazard of high temperature in the test chamber 110 to the operator.

[0093] The implementation principle of the chip burn-in test equipment in the embodiment 1 of the present application is as follows:

[0094] When the test frame 220 is idle, the plurality of test boards 1 are in the transfer state under the action of gravity, and the spacing between adjacent test boards 1 is small. On the one hand, the occupied volume of the test frame 220 can be reduced, and the height of the test frame 220 can be reduced, thereby reducing the center of gravity of the test assembly 200 and enhancing the stability of the test assembly 200. On the other hand, the test frame 220 is provided with a plurality of test boards 1, which can reduce the risk of loss of the test boards 1 and facilitate storage of the test boards 1.

[0095] When the chip needs to be aged, the operator rotates the test frame 220 to the stacking state, and all test frames 220 are located in the same plane. On the one hand, it is convenient for the operator to stack the chips on each test board 1. On the other hand, the base 210 provides a mounting position 11 for each test board 1, so that the test board 1 does not need to be placed on the ground (if placed on the ground, there is a possibility that the chip will be damaged by being pressed) or on other workbenches (if a workbench is needed). On the third hand, the overall height of the test frame 220 is reduced, which is suitable for operators of different heights and solves the problem that the upper test board 1 is too high and people who are not tall enough cannot remove the chip.

[0096] After stacking the chips, the test frame 220 is rotated to the transfer state, the cabinet door 121 is opened, the test frame 220 is sent into the test chamber 110, the sealing curtain is opened by the switch mechanism 130, and the test frame 220 is moved to the test chamber 110 by the first pushing mechanism 400. The installation of all test boards 1 is completed, and the operation of stacking one by one is eliminated, thereby improving the installation efficiency of the test boards 1. After closing the sealing curtain, the aging test of the chips to be tested can be started.

[0097] The adapter chamber 120 is arranged on one side of the test chamber 110. After the chip is tested, the test rack 220 is switched to the adapter state, the height of the test rack 220 is reduced, the gravity center of the test assembly 200 is reduced, the stability of the movement of the test assembly 200 is enhanced, the sealing curtain is opened, the test rack 220 is moved from the test chamber 110 to the adapter chamber 120 by using the second pushing mechanism 400, the sealing curtain is closed, the test chamber 110 and the adapter chamber 120 are isolated, and only the cabinet door 121 of the adapter chamber 120 needs to be opened, so that all the test boards 1 can be taken out at the same time. In the first aspect, the adapter chamber 120 with small space is in contact with the external environment, the heat exchange between the test chamber 110 and the external environment is reduced, and the waste of resources is further reduced. In the second aspect, the operation of taking out the test boards 1 layer by layer is avoided, the taking-out time of the test boards 1 is saved, and the test efficiency is improved. In the third aspect, the opening time of the cabinet door 121 of the adapter chamber 120 is reduced, the heat exchange time between the inside of the aging box 100 and the external environment is reduced, the temperature drop of the inside of the aging box 100 is reduced, the heating time of the aging box 100 is shortened when the next batch of chips is tested, the test efficiency is further improved, and the waste of resources is reduced.

[0098] After the test assembly 200 is taken out from the adapter chamber 120, the test rack 220 is switched to the stacking state, and the chip is disassembled and the next batch of chips is installed.

[0099] Embodiment 2

[0100] Embodiment 2 of the present application provides a chip aging test process based on the chip aging test equipment in embodiment 1, including the following steps: switching the test assembly 200 to the stacking state, stacking the chips in the mounting positions 11 of the test boards 1; switching the test assembly 200 to the adapter state, placing the test assembly 200 in the test chamber 110 through the adapter chamber 120, and driving the test assembly 200 to the test state by using the driving mechanism 300; after the chip is tested, the test assembly 200 is taken out from the test chamber 110 and the adapter chamber 120 by using the driving mechanism 300, the test rack 220 is switched to the stacking state, and the tested chip is taken off.

[0101] The chip can be taken off from the test board 1 by people with different heights, the speed of placing and removing the test board 1 in the test chamber 110 can be accelerated, the heat exchange time between the inside of the aging box 100 and the external environment is reduced, the temperature drop of the inside of the aging box 100 is reduced, the heating time of the aging box 100 is shortened when the next batch of chips is tested, the test efficiency is improved, and the waste of resources is reduced.

[0102] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: all equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. A chip aging test device, characterized in that, include: An aging chamber (100) includes a connected test chamber (110) and a transfer chamber (120). The height of the transfer chamber (120) is smaller than that of the test chamber (110). An openable and closable sealing curtain is provided between the test chamber (110) and the transfer chamber (120) to isolate or connect the test chamber (110) and the transfer chamber (120). The transfer chamber (120) is rotatably connected to a cabinet door (121). The test assembly (200) includes a base (210) and a test frame (220). The test frame (220) is movably mounted on the base (210). The test frame (220) has multiple test boards (1). Each test board (1) is provided with multiple mounting positions (11) for mounting chips. The test frame (220) has a test state, a transfer state, and a stacking state. When the test rack (220) is in the test state, the plurality of test boards (1) are arranged at vertical intervals; when the test rack (220) is in the transition state, the plurality of test boards (1) are arranged at vertical intervals, and the distance between two adjacent test boards (1) is smaller than the distance when in the test state; when the test rack (220) is in the stacking state, the plurality of test boards (1) are flush on the horizontal plane; and A drive mechanism (300), mounted on the base (210), drives the test frame (220) to switch between the test state and the switching state.

2. The chip aging test equipment according to claim 1, characterized in that, The test fixture (220) also includes four connecting components (2); Each of the test plates (1) has an L-shaped connector (3) connected to both ends opposite to each other. The connector (3) includes a mounting part (31) and a bending part (32), and is fixed to the test plate (1) through the mounting part (31). The multiple test plates (1) are arranged in sequence so that the multiple connectors (3) are parallel to each other and arranged in two mirror rows. Each of the connecting components (2) includes multiple connecting rods (21), multiple sleeves (22) and multiple elastic elements (23). The multiple connecting rods (21) are arranged at intervals in the direction of the connecting components (3), and each pair of adjacent connecting rods (21) is connected by the elastic element (23). The ends of each pair of adjacent connecting rods (21) are confined in the same sleeve (22) and can move axially along the sleeve (22). The elastic element (23) is located in the corresponding sleeve (22). One end of each of the mounting portions (31) in the same row away from the bending portion (32) corresponds to the middle of the connecting rod (21) in the same connecting assembly (2) and is connected by a pivot (24).

3. The chip aging test equipment according to claim 2, characterized in that, The base (210) is U-shaped and has two mounting brackets (211). The bottom of the two mounting parts (31) connected to the test plate (1) in the middle is connected to a sliding plate (12). The sliding plate (12) is located between the two connecting components (2). The mounting bracket (211) is provided with a groove (212) extending in the vertical direction. The end of the sliding plate (12) slides in the groove (212).

4. The chip aging test equipment according to claim 3, characterized in that, The drive rod (310) of the drive mechanism (300) is provided with a snap-fit ​​groove (320) at its end. The test plate (1) at the far end is provided with a protrusion (13) corresponding to the snap-fit ​​groove (320). The drive rod (310) extends to drive the test frame (220) to switch from the transition state to the test state. When the test frame (220) is in the test state, the protrusion (13) is located in the snap-fit ​​groove (320). The base (210) is provided with a support portion corresponding to the connecting component (2). When the test frame (220) is in the transition state, the support portion is used to support the bottom of the connecting component (2). The slide plate (12) is located at the bottom of the slide groove (212), and the snap-fit ​​groove (320) is away from the protrusion (13).

5. The chip aging test equipment according to claim 1, characterized in that, The cabinet door (121) is located on the side of the transfer chamber (120) adjacent to the test chamber (110). The inner wall of the transfer chamber (120) opposite to the test chamber (110) is provided with a first pushing mechanism (400). The first pushing mechanism (400) is used to push the test assembly (200) from the transfer chamber (120) into the test chamber (110).

6. The chip aging test equipment according to claim 1, characterized in that, A second pushing mechanism (400) is provided on the side of the test chamber (110) opposite to the transfer chamber (120). The second pushing mechanism (400) is used to push the test assembly (200) from the test chamber (110) into the transfer chamber (120).

7. The chip aging test equipment according to claim 1, characterized in that, Each of the test boards (1) is provided with a plug (14). The inner sidewall of the test chamber (110) adjacent to the adapter chamber (120) is provided with a plurality of sockets adapted to the plug (14). The inner sidewall of the test chamber (110) opposite to the socket is provided with a third pushing mechanism (400). The third pushing mechanism (400) is used to push the test assembly (200) so that the plug (14) of the test board (1) is inserted into the socket.

8. The chip aging test equipment according to claim 7, characterized in that, The test chamber (110) has a fourth pushing mechanism (400) on one side of the socket. The fourth pushing mechanism (400) pushes the test component (200) to separate the plug (14) of the test component (200) from the socket.

9. The chip aging test equipment according to claim 1, characterized in that, The sealing curtain can be moved vertically and installed on the inner wall of the test chamber (110). A switching mechanism (130) is provided on the side of the test chamber (110) where the sealing curtain is located. The drive rod of the switching mechanism (130) is fixedly connected to the sealing curtain and drives the sealing curtain to move vertically to connect or isolate the test chamber (110) and the transfer chamber (120).

10. A chip aging test process, characterized in that, Based on the chip aging test equipment as described in any one of claims 1 to 9, the process includes the following steps: Switch the test component (200) to the stacking state and stack the chips in the mounting positions (11) of each test board (1); Switching the test component (200) to the transition state, placing the test component (200) in the test chamber (110) through the transition chamber (120), and using the drive mechanism (300) to drive the test component (200) to switch to the test state; and After the chip test is completed, the test component (200) is switched to the transfer state by the drive mechanism (300), the test rack (220) is transferred from the test chamber (110) to the transfer chamber (120), and then transferred to the outside of the transfer chamber (120). The test rack (220) is switched to the stacking state, and the tested chip is removed.

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