Reflective sheet, light-emitting substrate, and display device

Abstract

The embodiment of the present disclosure provides a reflective sheet, a light-emitting substrate and a display device. The reflective sheet comprises a first reflective film, a first adhesive layer and a first release film which are sequentially stacked, a first exhaust groove is arranged on the side surface of the first adhesive layer close to the first release film, and the first exhaust groove is communicated with the edge of the first adhesive layer. In the process of attaching the reflective sheet and the light-emitting substrate, the technical scheme of the present disclosure can realize full attachment of the two, improve the attachment effect of the reflective sheet and the light-emitting substrate, avoid the accumulation of gas to form bubbles, and improve the optical effect.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a reflective sheet, a light-emitting substrate, and a display device. Background Technology

[0002] Liquid crystal displays (LCDs) were the earliest and most mature display technology, but with increasing demands on panel performance, LCDs are struggling to meet future needs. Organic light-emitting diodes (OLEDs) are the next-generation display technology following LCDs, and their technology is already quite mature. Mini LEDs (sub-millimeter light-emitting diodes) and Micro LEDs (micro-light-emitting diodes) offer superior performance characteristics such as lower power consumption, faster response times, longer lifespan, and better color saturation and contrast. With further technological breakthroughs, Mini LEDs and Micro LEDs are poised to become the next-generation display technology after LCDs and OLEDs.

[0003] Mini LED backlighting can be applied to display products such as televisions, monitors, and computers. To improve the reflectivity of the light-emitting substrate surface, related technologies involve attaching a reflective sheet to the surface of the substrate. However, due to limitations in the existing reflective sheet attachment process, some gas is trapped between the reflective sheet and the substrate after attachment. As the process continues, this trapped gas polymerizes to form bubbles. During reliability testing, these bubbles enlarge, affecting both the product's appearance and the appearance of bulges in the bubble area after reliability testing, thus impacting the product's optical performance. Summary of the Invention

[0004] This disclosure provides a reflective sheet, a light-emitting substrate, and a display device to solve or alleviate one or more technical problems in the prior art.

[0005] As a first aspect of the present disclosure, the present disclosure provides a reflective sheet, including a first reflective film, a first adhesive layer and a first release film stacked sequentially, wherein a first venting groove is provided on the side surface of the first adhesive layer near the first release film, and the first venting groove communicates with the edge of the first adhesive layer.

[0006] In some embodiments, the width of the first venting groove is 0.05mm to 0.2mm.

[0007] In some embodiments, the depth of the first venting groove is less than the thickness of the first adhesive layer.

[0008] In some embodiments, the depth of the first venting groove is 25% to 75% of the thickness of the first adhesive layer.

[0009] In some embodiments, there are multiple first exhaust channels, and the multiple first exhaust channels are interconnected.

[0010] In some embodiments, a plurality of first exhaust channels are connected to form a grid.

[0011] In some embodiments, the length of the first exhaust groove is 0.5mm to 2mm.

[0012] In some embodiments, the thickness of the first adhesive layer is 15μm to 30μm; and / or, the tack of the first adhesive layer is 1500 (g / 25mm) to 2200 (g / 25mm).

[0013] In some embodiments, a transparent film and a second adhesive layer are disposed between the first adhesive layer and the first reflective film, the second adhesive layer being close to the first reflective film.

[0014] As a second aspect of this disclosure, this disclosure provides a light-emitting substrate, comprising:

[0015] The wiring substrate includes a substrate, multiple metal traces disposed on one side of the substrate, and a second reflective layer disposed on the side of the multiple metal traces facing away from the substrate. The second reflective layer is provided with multiple openings, and the openings expose a portion of the surface of the metal traces.

[0016] Electronic components are coupled to the exposed surfaces of metal traces;

[0017] The first reflective layer includes a reflective sheet in any embodiment of the present disclosure, and the reflective sheet is attached to the surface of the second reflective layer of the wiring substrate on which electronic components are disposed through a first adhesive layer.

[0018] As a third aspect of this disclosure, this disclosure provides a light-emitting substrate, comprising:

[0019] The wiring substrate includes a substrate, multiple metal traces disposed on one side of the substrate, and a second reflective layer disposed on the side of the multiple metal traces away from the substrate. The second reflective layer has multiple openings that expose a portion of the surface of the metal traces. A second venting groove is disposed on the surface of the second reflective layer away from the substrate, and the second venting groove is connected to the edge of the second reflective layer.

[0020] Electronic components are coupled to the exposed surfaces of metal traces;

[0021] The first reflective layer includes a third adhesive layer and a second reflective film stacked together. The second reflective film is attached to the surface of the second reflective layer of the wiring substrate on which electronic components are disposed through the third adhesive layer.

[0022] In some embodiments, the width of the second exhaust groove is 0.05mm to 0.2mm; and / or the depth of the second exhaust groove is 5μm to 15μm.

[0023] In some embodiments, there are multiple second exhaust channels, which are interconnected and connected to form a grid. The length of the second exhaust channel is 0.5mm to 2mm.

[0024] In some embodiments, the electronic component includes a bridging portion coupled to two metal traces;

[0025] The first reflective layer includes a first functional area, and the orthographic projection of the bridging portion on the substrate is located within the range of the orthographic projection of the first functional area on the substrate; the first reflective layer has a plurality of first linear slots, each of the first linear slots penetrating the first reflective layer in a direction perpendicular to the substrate, and the edge of the first functional area is formed by a plurality of mutually spaced first linear slots.

[0026] The first reflective layer also has a plurality of third linear slits located within the first functional area, and the plurality of third linear slits are arranged at intervals along at least a portion of the edge of the first functional area.

[0027] In some embodiments, the length of the first linear slit is greater than twice the interval between two adjacent first linear slits.

[0028] In some embodiments, the first reflective layer is further provided with a second linear slit located within the first functional area. The second linear slit penetrates the first reflective layer in a direction perpendicular to the substrate. The orthographic projection of the edge of the second linear slit on the substrate at least partially overlaps with the orthographic projection of the bridging portion on the substrate. The second linear slit divides the first functional area into a first sub-region and a second sub-region. A third linear slit is located in at least one of the first sub-region and the second sub-region.

[0029] In some embodiments, the edge of the first functional area includes a first edge, a second edge, a third edge and a fourth edge connected in sequence. The first edge and the third edge are arranged opposite to each other and both extend along a first direction. The second edge and the fourth edge are arranged opposite to each other and both extend along a second direction. The first direction is the extension direction of the bridging portion, and the second direction is perpendicular to the first direction.

[0030] The first linear slot includes a first sub-linear slot and a second sub-linear slot. Multiple first sub-linear slots are spaced apart from each other along the first edge and the third edge. The second sub-linear slots are arranged along the second edge and the fourth edge. The third linear slot corresponds to the first sub-linear slots one by one and is parallel to each other. The size of the third linear slot is the same as the size of the first sub-linear slot.

[0031] In some embodiments, the light-emitting substrate further includes a first encapsulation portion located on the side of the bridging portion away from the substrate, the orthographic projection of the bridging portion on the substrate being within the orthographic projection range of the first encapsulation portion on the substrate; a first reflective layer located on the side of the first encapsulation portion away from the substrate, the distance between the orthographic projection of the third linear slit on the substrate and the edge of the orthographic projection of the first encapsulation portion on the substrate being greater than or equal to 0.5 mm, and the distance between the third linear slit and the corresponding first sub-linear slit being 0.8 mm to 1.2 mm.

[0032] As a fourth aspect of the present disclosure, the present disclosure provides a display device, characterized in that it includes a light-emitting substrate as described in any embodiment of the present disclosure.

[0033] The technical solution of this disclosure embodiment can achieve full bonding between the reflective sheet and the light-emitting substrate during the bonding process, which improves the bonding effect between the reflective sheet and the light-emitting substrate, avoids gas accumulation and the formation of bubbles, and improves the optical effect.

[0034] The above overview is for illustrative purposes only and is not intended to be limiting in any way. Further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description, in addition to the illustrative aspects, embodiments, and features described above. Attached Figure Description

[0035] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this disclosure and should not be construed as limiting the scope of this disclosure.

[0036] Figure 1 This is a planar schematic diagram of a wiring substrate;

[0037] Figure 2 This is a partial schematic diagram of the wiring substrate in one embodiment;

[0038] Figure 3 for Figure 2 A cross-sectional schematic diagram of CC;

[0039] Figure 4 for Figure 2 An enlarged schematic diagram of section M in the middle;

[0040] Figure 5 This is a planar schematic diagram of a light-emitting substrate;

[0041] Figure 6A This is a schematic diagram of the cross-sectional structure of a reflective sheet in related technologies;

[0042] Figure 6B This is a schematic diagram of a planar structure of a reflective sheet in related technologies;

[0043] Figure 7 A schematic diagram of the process for attaching a reflective sheet;

[0044] Figure 8 This is a cross-sectional schematic diagram of the reflector sheet in one embodiment of the present disclosure;

[0045] Figure 9A This is a planar schematic diagram of the reflector sheet in one embodiment of the present disclosure;

[0046] Figure 9B This is a planar schematic diagram of the reflector in another embodiment of the present disclosure;

[0047] Figure 10 For including Figure 2 The wiring substrate shown and Figure 6A A schematic diagram of the EE cross-section of the light-emitting substrate of the reflective sheet shown;

[0048] Figure 11 For including Figure 2 A schematic diagram of the EE cross-section of the wiring substrate and the light-emitting substrate of the reflector sheet in one embodiment of the present disclosure.

[0049] Figure 12 This is a cross-sectional schematic diagram of the reflector in another embodiment of the present disclosure;

[0050] Figure 13 for Figure 5 The light-emitting substrate shown is a schematic cross-sectional view along D1-D1 in one embodiment of this disclosure.

[0051] Figure 14 for Figure 5 The light-emitting substrate shown is a schematic cross-sectional view along D1-D1 in another embodiment of this disclosure.

[0052] Figure 15 This is a planar schematic diagram of a light-emitting substrate according to an embodiment of the present disclosure;

[0053] Figure 16 for Figure 15 An enlarged diagram of the first functional area in the diagram;

[0054] Figure 17A for Figure 16 Schematic diagram of section F1-F1 in the diagram;

[0055] Figure 17B for Figure 16 Schematic diagram of section F2-F2 in the diagram;

[0056] Figure 18 for Figure 15 A schematic diagram of the D1-D1 cross section of the light-emitting substrate shown;

[0057] Figure 19 for Figure 15 A schematic diagram of the D2-D2 cross section in the light-emitting substrate shown;

[0058] Figure 20 This is a planar schematic diagram of the light-emitting substrate according to another embodiment of the present disclosure.

[0059] Explanation of reference numerals in the attached figures:

[0060] 10. Substrate; 11. Buffer layer; 12. Metal trace; 120. Electronic component; 121. Light-emitting element; 1210. Second package; 122. Micro driver chip; 1220. Third package; 123. Bridging part; 1230. First package; 13. Passivation layer; 131. First opening; 14. Second reflective layer; 141. Window; 21. First pad group; 22. Second pad group; 23. Third pad group; 30. First reflective layer; 41. First reflective film; 42. First adhesive layer; 421. First venting groove; 43. First release film; 44. Transparent film; 45. Second adhesive layer; 51. Second reflective film; 52. Third adhesive layer; 53. Second release film; 61. First linear slot; 62. Second linear slot; 63. Third linear slot; 80. Reflective part. Detailed Implementation

[0061] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure, and different embodiments can be combined arbitrarily without conflict. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0062] In this article, the light-emitting diode can be a mini light-emitting diode (Mini LED) or a micro light-emitting diode (MicroLED).

[0063] In related technologies, the substrate incorporating light-emitting diodes can be an FR4 type printed circuit board (PCB), or any of the following: glass substrate, quartz substrate, sapphire substrate, ceramic substrate, etc. Several light-emitting diode chips are divided into multiple lamp zones, each of which can be independently controlled, thereby enabling precise local dimming and improved high dynamic range (HDR) effects when combined with the liquid crystal display panel.

[0064] Specifically, each light zone can be driven by a micro driver chip.

[0065] Figure 1 This is a planar schematic diagram of a wiring substrate; Figure 2 This is a partial schematic diagram of the wiring substrate in one embodiment; Figure 3 for Figure 2 A cross-sectional schematic diagram of CC; Figure 4 for Figure 2 An enlarged schematic diagram of section M. (See attached image.) Figures 1-4 As shown, the wiring substrate includes a substrate 10 and multiple metal traces 12 located on one side of the substrate 10. The metal traces 12 may include a first voltage line (VLED) 112, a second voltage line (GND) 111, a power signal line (PWR) 103, an address signal line (ADDR) 108, a cascade line 109, and a feedback signal line (FB) 110. Figure 1 As shown, the wiring substrate has multiple rows of component placement areas, and each row of component placement areas has multiple lamp areas 104. Each lamp area 104 corresponds to a third pad group 23, and each lamp area 104 includes one or at least two second pad groups 22. Exemplarily, the third pad group 23 is used for coupling with a micro driver chip. Each second pad group 22 includes a second pad 221 and a second pad 222, and the second pad group 22 is used for coupling with a light-emitting element such as an LED.

[0066] like Figure 3 As shown, the wiring substrate may include a buffer layer 11 and a passivation layer 13. The buffer layer 11 is located between the substrate 10 and the metal trace 12, and the passivation layer 13 is located on the side of the metal trace 12 facing away from the substrate 10. The buffer layer 11 and the passivation layer 13 may be made of inorganic materials, such as at least one of silicon oxide, silicon nitride, and silicon oxynitride. The passivation layer 13 can protect the metal trace 12. The passivation layer 13 is provided with a plurality of first openings 131, which expose a portion of the surface of the metal trace 12.

[0067] like Figure 3 As shown, the wiring substrate may further include a second reflective layer 14, which is located on the side of the metal trace facing away from the substrate 10. Exemplarily, the second reflective layer 14 is located on the side of the passivation layer 13 facing away from the substrate 10. The passivation layer 13 is provided with a plurality of first openings 131. The second reflective layer 14 is provided with a plurality of windows 141. The windows 141 expose a portion of the surface of the metal trace. Exemplarily, the orthographic projection of the first openings 131 onto the substrate 10 falls within the orthographic projection of the windows 141 onto the substrate 10, thereby, the first openings 131 and the windows 141 together expose a portion of the surface of the metal trace 12. Figure 3 In the designation 131, an arrow is used to indicate the edge of the first opening 131, and in the designation 141, an arrow is used to indicate the edge of the window 141.

[0068] Understandably, the plan view of the wiring substrate only shows the metal trace 12 and its exposed area, which can form a pad. The pad is used to couple electronic components via die bonding. The electronic components may include light-emitting elements such as LEDs, micro-driver chips, and bridging components.

[0069] like Figure 2 As shown, the wiring substrate may further include a first pad group 21, which includes a first pad 211 and a second pad 212. The first pad group 21 is used for coupling with the bridging portion 123.

[0070] In one implementation, such as Figure 2 and Figure 4 As shown, the wiring substrate may include a third pad group 23. The third pad group 23 includes a power supply pad Pwr and an output pad Out. Optionally, the third pad group 23 is coupled to a micro driver chip. The power signal line 103 is coupled to the power supply pad Pwr. The second pad group 22 is coupled to a light-emitting diode chip. The lamp area 104 includes a plurality of interconnected second pad groups 22, each second pad group 22 including at least a second pad 221 and a second pad 222, where the second pad 221 can be a positive electrode and the second pad 222 can be a negative electrode. The second pad 221 of the first second pad group 22 in each lamp area 104 is coupled to a first voltage line 112, and the second pad 222 of the last second pad group 22 in each lamp area 104 is coupled to the output pad Out in the corresponding third pad group 23 of that lamp area. The power supply pad Pwr of each third pad group 23 in each column of component placement area is connected to the power signal line 103.

[0071] For example, such as Figure 4 As shown, the third pad group 23 also includes an address pad Di and a ground pad Gnd. The address pad Di and the power supply pad Pwr, belonging to the same third pad group 23, are spaced apart in the second direction Y and spaced apart from the output pad Out in the first direction X. The second direction Y is perpendicular to the first direction X. The ground pad Gnd and the power supply pad Pwr are spaced apart in the first direction X and spaced apart from the output pad Out in the first direction X.

[0072] Exemplarily, each third pad group 23 can be coupled to a micro driver chip, and each second pad group 22 is coupled to an LED. In some embodiments, the address pad Di can receive an address signal to select the micro driver chip at the corresponding address. The power supply pad Pwr can provide a first operating voltage and communication data to the micro driver chip, which can be used to control the brightness of the corresponding light-emitting element. The output pad Out can output a relay signal and a drive signal at different time periods. Optionally, the relay signal is an address signal provided to the address pad Di in the next-level third pad group 23, and the drive signal is a drive current used to drive the light-emitting element coupled to the third pad group 23 where the output pad Out is located to emit light. The ground pad Gnd receives a common voltage signal.

[0073] Figure 2 and Figure 4 The third pad group 23 shown includes four third pads, therefore, the third pad group 23 can be coupled to a micro-driver chip with four pins. It should be noted that the number of pads in the third pad group 23 is not limited to four; it can also be fewer or more, such as eight. The number of pads in the third pad group 23 can be set according to the specific micro-driver chip.

[0074] In some embodiments, such as Figure 1 As shown, the metal trace 12 also includes an address signal line 108, which can be coupled to the address pad Di of the third pad group 23.

[0075] like Figure 2 As shown, the metal trace 12 also includes a cascade line 109. There are multiple third pad groups 23. The cascade line 109 is configured to connect the output pad Out of the nth level third pad group 23 and the address pad Di of the (n+1)th level third pad group 23 in the same column of component placement area, where n is a positive integer, so that the relay signal output by the output pad Out of the nth level third pad group 23 is provided to the address pad Di of the (n+1)th level third pad group 23 through the cascade line 109.

[0076] like Figure 1 As shown, the metal trace 12 also includes a feedback signal line (FB) 110, which is coupled to the output pad Out of the last third pad group 23 in the multi-level third pad group 23.

[0077] like Figure 1 and Figure 2 As shown, a second voltage line (GND) 111 is coupled to the ground pad Gnd of all the third pad groups 23 in a row of component arrangement areas.

[0078] exist Figure 2In order to better distinguish the various metal traces, power signal line 103, address signal line 108, cascade line 109, feedback signal line 110, first voltage line 112, and second voltage line 111 are represented using different fillers. It should be noted that power signal line 103, address signal line 108, cascade line 109, feedback signal line 110, first voltage line 112, and second voltage line 111 are formed simultaneously using the same process; therefore, in... Figure 3 In this design, the metal traces transmitting different signals use the same cross-sectional line.

[0079] For example, in a wiring board, in order to enable disconnected metal traces to meet electrical requirements, such as transmitting the same signal, a bridging section can be used to connect two metal traces.

[0080] For example, such as Figure 2 As shown, to facilitate metal trace routing, the wiring substrate may include multiple power signal lines 103. To ensure that each power signal line 103 transmits the same signal, adjacent power signal lines 103 can be connected via a bridging portion 123. It should be noted that, for ease of explanation, Figure 2 The diagram shows a bridging portion 123 coupled to the first pad group 21. It is understood that the bridging portion 123 is not part of the wiring substrate.

[0081] The bridging portion 123 includes a conductive portion. The conductive portion serves to conduct electricity. In some examples, the conductive portion is made of a conductive material, such as copper or aluminum. In other examples, the conductive portion may be a resistor or capacitor.

[0082] Figure 5 This is a schematic plan view of a light-emitting substrate. The light-emitting substrate 200 may include the wiring substrate 100 described above, and also includes electronic components coupled to the exposed surfaces of the metal traces 12 of the wiring substrate 100. Exemplarily, the electronic components may include light-emitting elements, micro-driver chips, and bridging portions.

[0083] In the wiring substrate, the bridging part is coupled to the first pad group 21, the light-emitting element is coupled to the second pad group 22, and the micro driver chip is coupled to the third pad group 23.

[0084] For example, the second reflective layer 14 is an insulating reflective material. On the one hand, this allows the second reflective layer 14 to provide electrical isolation, reducing the risk of short circuits or other malfunctions in the light-emitting substrate 200. On the other hand, it allows the second reflective layer 14 to reflect light (such as light emitted by an LED), thereby increasing the brightness of the light-emitting substrate 200 and reducing its power consumption.

[0085] In some examples, the material of the second reflective layer 14 includes white ink. For example, the material of the second reflective layer 14 may include at least one of photosensitive white ink and curable white ink.

[0086] Although the second reflective layer 14 can reflect light, experimental verification has shown that the reflection effect of the second reflective layer 14 cannot meet higher requirements.

[0087] In one embodiment, such as Figure 5 As shown, the light-emitting substrate 200 may further include a first reflective layer 30. Exemplarily, the first reflective layer 30 may include a reflective sheet attached to the surface of the second reflective layer 14 facing away from the substrate 10.

[0088] Compared to using only the second reflective layer 14 to reflect light, the reflective sheet attached to the upper surface of the second reflective layer 14 has a higher reflectivity, resulting in better picture quality and lower power consumption for the display device.

[0089] The fabrication process of a light-emitting substrate using a reflective sheet mainly includes: die bonding process; packaging process; cutting process; and reflective sheet attachment process.

[0090] In the die bonding process, electronic components, such as light-emitting elements, micro-driver chips, or bridging sections, are coupled to the pads of the wiring substrate using a die bonding method. In the packaging process, a package covering the electronic components is formed on the electronic components. For example, a hemispherical lens is formed by spraying highly thixotropic adhesive onto the light-emitting elements and micro-driver chips using a dispensing machine. The package protects the electronic components and can improve luminous efficiency. In the embodiments, the package covering the bridging section can be referred to as the first package, the package covering the light-emitting element as the second package, and the package covering the micro-driver chip as the third package.

[0091] Figure 5 In the first reflective layer 30, there are multiple first functional regions Q1, and at least a portion of the orthogonal projection of the bridging portion onto the substrate 10 is located in the first functional region Q1. The first reflective layer 30 also has multiple second functional regions Q2, and at least a portion of the orthogonal projection of the micro-driving chip onto the substrate 10 is located in the second functional region Q2.

[0092] To improve reflectivity, such as Figure 5 As shown, the reflector uses a straight-slit design in the first functional area Q1 and a cross-slit design in the second functional area Q2. The reflector has an opening at the position of the light-emitting element 121, as shown... Figure 5 As shown, the reflector sheet has a first through hole M1. The orthographic projection of the light-emitting element 121 on the substrate 10 is located within the orthographic projection of the first through hole M1 on the substrate 10, so that the light-emitting element 121 can be exposed through the first through hole M1.

[0093] Because the reflective sheet requires slots or openings, the reflective sheet attachment process must be performed after the encapsulation process. Since electronic components are present on the light-emitting substrate, the reflective sheet cannot be attached using rollers; instead, a bonding fixture must be used. Furthermore, the bonding fixture needs to have openings at positions corresponding to the electronic components to avoid obstructing their movement.

[0094] Figure 6A This is a schematic diagram of the cross-sectional structure of a reflective sheet in related technologies. Figure 6B This is a schematic diagram of a planar structure of a reflective sheet in related technologies. For example... Figure 6A As shown, the reflective sheet 50 may include a second reflective film 51, a third adhesive layer 52, and a second release film 53, which are sequentially stacked. Exemplarily, the reflective sheet 50 may also include a protective layer ( Figure 6A (A protective layer is not shown in the image). The protective layer is located on the side of the second reflective film 51 facing away from the third adhesive layer 52. Before attaching the reflective sheet, a first through hole M1 needs to be punched out at the corresponding light-emitting element position on the reflective sheet 50, such as... Figure 6B As shown, the diameter of the first through-hole M1 is approximately 5 mm. Exemplarily, a cross-shaped slot is formed at the location of the corresponding micro-driving chip on the reflector; a single-line slot is formed at the location of the corresponding bridging portion on the reflector. It should be noted that... Figure 6B The cross-shaped and straight seams are not shown.

[0095] Figure 7 This is a schematic diagram of a process for attaching a reflective sheet. Related technologies employ a full-surface hard-to-hard bonding method for attaching the reflective sheet. The lower suction fixture 91 vacuum-adsorbs the light-emitting substrate 200, whose surface is the surface of the second reflective layer 14. The upper suction fixture 92 vacuum-adsorbs the reflective sheet 40 / 50, removes the release film from the reflective sheet 40 / 50, and rotates the upper suction fixture 92 180 degrees so that the reflective sheet faces the light-emitting substrate 200 of the lower suction fixture 91. The upper suction fixture 92 has openings to avoid electronic components on the light-emitting substrate. After CCD alignment (optical alignment), the lower suction fixture 91 rises, achieving pressure bonding between the lower suction fixture 91 and the upper suction fixture 92, thus attaching the reflective sheet to the light-emitting substrate 200. Because the upper suction fixture 92 has openings to avoid electronic components, the pressure bonding between the lower and upper suction fixtures 91 and 92 does not cause damage to the electronic components.

[0096] Hard-to-hard bonding has certain drawbacks. During the bonding process, factors such as the flatness of the fixture platform and the uniformity of the reflective sheet thickness can affect the complete bonding between the reflective sheet and the surface of the second reflective layer 14 of the light-emitting substrate 200. Furthermore, without vacuum extraction equipment during the bonding process, some gas will be trapped between the reflective sheet and the surface of the second reflective layer 14 of the light-emitting substrate. Therefore, using a process like... Figure 6AWhen the reflective sheet 50 is shown, the trapped gas cannot escape because the periphery of the reflective sheet 50 is firmly bonded to the second reflective layer. As the process continues, the trapped gas polymerizes to form bubbles.

[0097] like Figure 6A As shown, the thickness of the third adhesive layer 52 is typically between 20μm and 100μm. A thicker third adhesive layer 52 results in stronger adhesion; however, a thicker third adhesive layer 52 also leads to more severe yellowing after bonding, affecting optical performance. A 20μm third adhesive layer 52 can be used, as this thickness provides an adhesion strength between 2000 (g / 25mm) and 2400 (g / 25mm), which is sufficient, and there is no peeling issue between the reflector and the light-emitting substrate edge after bonding. However, using... Figure 6A The reflective sheet with the stacked structure shown is bonded to the light-emitting substrate in a hard-on-hard bonding process. After the reflective sheet is bonded to the light-emitting substrate, there is gas between the reflective sheet and the light-emitting substrate. The gas trapped between the reflective sheet and the light-emitting substrate has no emission path. The gas aggregates to form bubbles, which not only affects the appearance but also the optical effect.

[0098] Figure 8 This is a schematic cross-sectional view of the reflector sheet in one embodiment of the present disclosure. Figure 9A This is a planar schematic diagram of the reflector in one embodiment of the present disclosure. Figure 9B This is a planar schematic diagram of the reflector in another embodiment of the present disclosure. Figure 9A and Figure 9B The surface of the first adhesive layer facing the first release film is shown. Figure 9A and Figure 9B The first release film is not shown. Embodiments of this disclosure provide a reflective sheet, such as... Figure 8 and Figure 9A , Figure 9B As shown, the reflective sheet includes a first reflective film 41, a first adhesive layer 42, and a first release film 43 stacked sequentially. A first venting groove 421 is provided on the surface of the first adhesive layer 42 near the first release film 43, and the first venting groove 421 communicates with the edge of the first adhesive layer 42.

[0099] Figure 10 For including Figure 2 The wiring substrate shown and Figure 6A A schematic diagram of the EE cross-section of the light-emitting substrate of the reflective sheet shown; Figure 11 For including Figure 2 The diagram shows a schematic cross-sectional view of the wiring substrate and the light-emitting substrate of the reflective sheet in one embodiment of this disclosure. It should be noted that before attaching the reflective sheet to the surface of the light-emitting substrate, the release film of the reflective sheet needs to be removed first. Then, the reflective sheet is attached to the surface of the second reflective layer 14 of the light-emitting substrate through the first adhesive layer 42. Therefore, Figure 10 and Figure 11 The release film has been removed from all the reflective sheets.

[0100] like Figure 6A and Figure 10 As shown, in related technologies, the third adhesive layer 52 of the reflective sheet is a plain adhesive layer. When passed through... Figure 7 When the reflective sheet is attached to the surface of the second reflective layer 14 of the light-emitting substrate in the attached process shown, the third adhesive layer 52 is in complete contact with the surface of the second reflective layer 14. Due to the influence of the flatness of the fixture platform and the uniformity of the reflective sheet thickness in some areas, gas will be trapped between the second reflective layer 14 and the third adhesive layer 52. Since the gas has no way to escape, it will accumulate and form bubbles.

[0101] When the reflective sheet of this embodiment is attached to the surface of the second reflective layer 14 of the light-emitting substrate, as follows: Figure 11 As shown, a first venting groove 421 exists between the first adhesive layer 42 and the second reflective layer 14, and the first venting groove 421 is connected to the edge of the first adhesive layer 42, so that the first venting groove 421 can form an venting channel. Therefore, the gas trapped during the bonding process can be discharged through the first venting groove 421, enabling full bonding between the reflective sheet and the light-emitting substrate, improving the bonding effect between the reflective sheet and the light-emitting substrate, preventing gas accumulation and bubble formation, and improving the optical effect.

[0102] In one implementation, such as Figure 9A and Figure 9B As shown, the width w of the first exhaust groove 421 can range from 0.05mm to 0.2mm (including the endpoint value). For example, the width of the first exhaust groove 421 can be any value from 0.05mm to 0.2mm, such as 0.05mm, 0.1mm, 0.15mm or 0.2mm.

[0103] If the width of the first venting groove 421 is less than 0.05 mm, it will hinder gas discharge and increase the manufacturing difficulty of the first venting groove 421; if the width of the first venting groove 421 is greater than 0.2 mm, it will reduce the reliability and shrinkage resistance of the reflective layer. Setting the width of the first venting groove 421 to 0.05 mm to 0.2 mm not only ensures that gas can be discharged, but also reduces the manufacturing difficulty of the first venting groove 421 and does not affect the reliability and shrinkage resistance of the reflective layer.

[0104] In one embodiment, the depth of the first venting groove 421 may be the same as the thickness of the first adhesive layer 42.

[0105] In one embodiment, the depth d1 of the first venting groove 421 can be less than the thickness d2 of the first adhesive layer 42. With this arrangement, although the first venting groove 421 is provided, the surface area of ​​the first adhesive layer 42 facing the light-emitting substrate is not reduced. During the bonding process between the reflective layer and the second reflective layer 14 of the light-emitting substrate, gas can not only be discharged from the first venting groove 421; but also, as the bonding pressure increases, the first adhesive layer 42 can compress the first venting groove 421, which helps the first adhesive layer 42 to fill the first venting groove 421, ensuring the bonding area between the first adhesive layer 42 and the second reflective layer 14, ensuring the firmness of the bonding between the reflective sheet and the second reflective layer 14, and preventing the edge of the reflective sheet from peeling off the surface of the second reflective layer 14.

[0106] In one embodiment, the depth d1 of the first venting groove 421 can be 25% to 75% of the thickness d2 of the first adhesive layer 42 (including the endpoint value).

[0107] In one embodiment, the thickness d2 of the first adhesive layer 42 can be 15μm to 30μm (inclusive). Exemplarily, the thickness d2 of the first adhesive layer 42 can be any value from 15μm to 30μm, for example, 15μm, 20μm, 25μm, or 30μm. When the thickness of the first adhesive layer 42 is too large, the yellowing of the first adhesive layer 42 after bonding becomes more severe, affecting the optical performance. Setting the thickness d2 of the first adhesive layer 42 to 15μm to 30μm not only ensures sufficient adhesiveness of the first adhesive layer 42 to prevent peeling between the reflector and the light-emitting substrate edge after bonding, but also prevents yellowing of the first adhesive layer 42 after bonding, thus improving the optical performance.

[0108] For example, the thickness d2 of the first adhesive layer 42 is 20μm, and the depth d1 of the first venting groove 421 can be 5μm~15μm.

[0109] In one embodiment, the depth d1 of the first exhaust groove 421 is 5μm~15μm.

[0110] During the bonding process between the reflective layer and the second reflective layer 14 of the light-emitting substrate, as the bonding pressure increases, the first adhesive layer 42 will compress the first venting groove 421, reducing the venting channel area of ​​the first venting groove 421. Setting d1 to 25%~75% of d2 or to 5μm~15μm not only ensures that gas can be discharged through the first venting groove 421 during the bonding process, but also allows the first adhesive layer 42 to deform and fill the first venting groove 421 after bonding, ensuring the bonding area between the first adhesive layer 42 and the second reflective layer 14, and ensuring the firmness of the bonding between the reflective sheet and the second reflective layer 14.

[0111] In one implementation, such as Figure 9A and Figure 9B As shown, there are multiple first exhaust channels 421, and these channels are interconnected. This arrangement allows gas to be discharged more quickly along the interconnected channels 421, preventing gas from accumulating and forming bubbles.

[0112] For example, such as Figure 9A and Figure 9B As shown, multiple first exhaust channels 421 are connected to form a grid. This structure can increase the distribution density of the first exhaust channels 421, which is more conducive to the entry and discharge of gas into the first exhaust channels 421.

[0113] In one embodiment, such as Figure 9A As shown, multiple first exhaust slots 421 can be connected to form a quadrilateral grid. In another embodiment, as... Figure 9B As shown, the multiple first exhaust grooves 421 can be connected to form a hexagonal grid. In other embodiments, the multiple first exhaust grooves 421 can be connected to form a grid of various shapes such as triangles or pentagons, and are not limited to quadrilateral or hexagonal grids.

[0114] In one embodiment, such as Figure 9A and Figure 9B As shown, the first exhaust groove 421 is a straight exhaust groove. In other embodiments, the first exhaust groove 421 can be a curved exhaust groove. When the first exhaust groove 421 is a curved exhaust groove, multiple first exhaust grooves 421 can be connected to form a circular or elliptical arc-shaped grid.

[0115] In one embodiment, such as Figure 9A and Figure 9B As shown, the length L of the first exhaust groove 421 ranges from 0.5mm to 2mm (inclusive). For example, the length L of the first exhaust groove 421 can be any value from 0.5mm to 2mm; for instance, the length L of the first exhaust groove 421 can be 0.5mm, 1mm, 1.5mm, or 2mm. If the length L of the first exhaust groove 421 is less than 0.5mm, it will increase the manufacturing difficulty of the first exhaust groove 421, reduce the area of ​​the grid formed by the connected first exhaust grooves 421, and decrease the adhesion between the reflective sheet and the second reflective layer 14. If the length L of the first exhaust groove 421 is greater than 2mm, it will make the area of ​​the grid formed by the connected first exhaust grooves 421 too large, causing gas to be trapped within the grid and unable to be discharged through the first exhaust groove 421. Setting the length L of the first exhaust groove 421 to 0.5mm~2mm not only reduces the manufacturing difficulty of the first exhaust groove 421, but also makes the grid area of ​​multiple first exhaust grooves 421 connected together suitable, so that the sealed gas can easily enter the first exhaust groove 421 and be discharged.

[0116] In one embodiment, such as Figure 8 As shown, the cross-section of the first exhaust groove 421 can be rectangular. It should be noted that the cross-sectional shape of the first exhaust groove 421 is not limited here. In other embodiments, the cross-section of the first exhaust groove 421 can be U-shaped, semi-circular, or other shapes, as long as it can serve the purpose of exhaust.

[0117] In one embodiment, the adhesive strength of the first adhesive layer 42 is 1500 (g / 25mm) to 2200 (g / 25mm) (including endpoint values). Such adhesive strength of the first adhesive layer 42 is sufficient to prevent peeling problems between the reliable rear reflector and the edge of the light-emitting substrate.

[0118] In one embodiment, the material of the first reflective film 41 may include at least one of titanium dioxide and polymethyl methacrylate (PMMA). The material of the first adhesive layer 42 may include an acrylic adhesive. The material of the first release film may include polyethylene terephthalate (PET).

[0119] Figure 8 The preparation process of the reflective sheet shown may include the following steps: coating a first adhesive layer 42 on the surface of a first reflective film 41; pre-curing the first adhesive layer 42; and before bonding the first reflective film 41 to the first release film 43, pressing the surface of the first adhesive layer 42 into a grid-like first venting groove 421 by a rolling process. For example, the roller surface is provided with grid-like protrusions, the cross-sectional structure of which is the same as the cross-sectional structure of the first venting groove 421. Thus, when the roller rolls over the surface of the first adhesive layer 42, a grid-like first venting groove 421 is formed on the surface of the first adhesive layer 42. Then, the first release film 43 is bonded to the surface of the first adhesive layer 42 with the grid-like first venting groove 421 by a roll-to-roll bonding process. After winding, the first adhesive layer 42 is cured, and then slit to produce the finished reflective sheet.

[0120] Figure 12 This is a cross-sectional schematic diagram of a reflective sheet according to another embodiment of the present disclosure. In one embodiment, such as Figure 12 As shown, the reflective sheet 40 also includes a transparent film 44 and a second adhesive layer 45 disposed between the first adhesive layer 42 and the first reflective film 41, with the second adhesive layer 45 close to the first reflective film 41.

[0121] In one embodiment, the tack of the first adhesive layer 42 can be 800 (g / 25mm) to 1200 (g / 25mm). The tack of the second adhesive layer 45 can be 1300 (g / 25mm) to 1500 (g / 25mm).

[0122] For example, the material of the second adhesive layer 45 may include an acrylic adhesive. The material of the transparent film 44 may include a transparent material, such as polyethylene terephthalate (PET).

[0123] Figure 13 for Figure 5 The light-emitting substrate shown is a cross-sectional schematic diagram along D1-D1 in one embodiment of this disclosure, wherein the first reflective layer 30 in the light-emitting substrate adopts the laminated structure of the reflective sheet 40 in the embodiment of this disclosure.

[0124] This disclosure also provides a light-emitting substrate, such as... Figure 13 As shown, the light-emitting substrate includes a wiring substrate, electronic components, and a first reflective layer 30.

[0125] The wiring substrate includes a substrate 10, multiple metal traces 12 disposed on one side of the substrate 10, and a second reflective layer 14 disposed on the side of the multiple metal traces 12 facing away from the substrate 10. The second reflective layer 14 has multiple openings 141 that expose a portion of the surface of the metal traces 12. The exposed area of ​​the metal traces 12 can form a pad. The pad is used for coupling with electronic components 120 via die bonding. The electronic components may include LEDs, micro-driver chips, or bridging components.

[0126] The wiring substrate may include a first pad group 21, which is coupled to the bridging portion 123. The wiring substrate may also include a second pad group 22, which is coupled to the light-emitting element 121. The wiring substrate may also include a third pad group 23, which is coupled to the micro driver chip.

[0127] Figure 13 The image shows a light-emitting element 121 and a second package 1210.

[0128] The first reflective layer 30 has a laminated structure as shown in the embodiments of the present disclosure for the reflective sheet 40. The first reflective film 41 of the reflective sheet 40 is attached to the surface of the second reflective layer 14 on the wiring substrate on which electronic components are disposed via a first adhesive layer 42, as shown in the embodiments of the present disclosure. Figure 13 As shown.

[0129] Figure 14 for Figure 5 The schematic diagram of the light-emitting substrate along cross-section D1-D1 in another embodiment of this disclosure shows that the first reflective layer 30 in the light-emitting substrate has, as shown in the diagram... Figure 6A The layered structure shown. For example... Figure 14 As shown, the light-emitting substrate includes a wiring substrate, electronic components, and a first reflective layer 30.

[0130] The wiring substrate includes a substrate 10, a plurality of metal traces 12 disposed on one side of the substrate 10, and a second reflective layer 14 disposed on the side of the plurality of metal traces 12 facing away from the substrate 10. The second reflective layer 14 is provided with a plurality of openings 141, the openings 141 exposing a portion of the surface of the metal traces 12. A second venting groove 142 is provided on the surface of the second reflective layer 14 facing away from the substrate 10, and the second venting groove 142 communicates with the edge of the second reflective layer 14.

[0131] The exposed area of ​​the metal trace 12 can form a solder pad. The solder pad is used for die bonding with the electronic component 120. The electronic component may include an LED, a micro driver chip, or a bridging component.

[0132] The wiring substrate may include a first pad group 21, which is coupled to the bridging portion 123. The wiring substrate may also include a second pad group 22, which is coupled to the light-emitting element 121. The wiring substrate may also include a third pad group 23, which is coupled to the micro driver chip.

[0133] The first reflective layer 30 has, for example, Figure 6A The layered structure is shown. After the second release film 53 is removed, the reflective sheet 50 is attached to the surface of the second reflective layer 14 of the wiring substrate on which electronic components are disposed, as shown. Figure 14 As shown. Therefore, in Figure 14 In the first reflective layer 30, there are a third adhesive layer 52 and a second reflective film 51 stacked together. The second reflective film 51 is attached to the surface of the second reflective layer 14 of the wiring substrate on which electronic components are disposed through the third adhesive layer 52.

[0134] In this embodiment, a second venting groove 142 is provided on the surface of the second reflective layer 14 facing away from the substrate 10. The second venting groove 142 is connected to the edge of the second reflective layer 14, so that the second venting groove 142 can form an venting channel. Therefore, the gas trapped during the bonding process can be discharged through the second venting groove 142, enabling full bonding between the reflective sheet and the light-emitting substrate, improving the bonding effect between the reflective sheet and the light-emitting substrate, preventing gas accumulation and bubble formation, and improving the optical effect.

[0135] In one embodiment, the width of the second exhaust groove 142 is 0.05mm to 0.2mm.

[0136] In one embodiment, the depth of the second exhaust groove 142 is 5μm to 15μm.

[0137] In one embodiment, there are multiple second exhaust channels 142, which are interconnected and form a grid. The length of each second exhaust channel 142 is 0.5mm to 2mm.

[0138] For example, the structure, size and connection shape of the second vent groove 142 provided on the surface of the second reflective layer 14 away from the substrate can be the same as the first vent groove 421.

[0139] In order to form a second venting groove 142 on the surface of the second reflective layer 14 away from the substrate 10, the material of the second reflective layer 14 can be photosensitive white ink, and the second venting groove 142 can be formed on the surface of the second reflective layer 14 away from the substrate 10 by exposure and development processes.

[0140] In related technologies, the light-emitting substrate adopts a structure having, for example, Figure 6A In the case of the reflective sheet 50 with the stacked structure shown, the entire surface of the third adhesive layer 52 facing the wiring substrate is an adhesive layer. Once the reflective sheet is attached to the second reflective layer 14, it is difficult to remove, reducing the repairability of the process and hindering the replacement of the reflective sheet. In the light-emitting substrate of this embodiment, by providing a first venting groove 421 on the surface of the first adhesive layer 42 facing the wiring substrate or a second venting groove 142 on the surface of the second reflective layer 14 facing away from the substrate 10, the bonding strength between the reflective sheet and the second reflective layer 14 can be appropriately reduced. This ensures the attachment effect while improving the repairability of the attachment process and facilitating the replacement of the reflective sheet.

[0141] After a reliable high-temperature test, the shrinkage rate of the reflective sheet in the light-emitting substrate of this embodiment is about 0.12%, which meets the existing process conditions of 0.18% shrinkage rate.

[0142] In related technologies, such as Figure 5 As shown, in the first functional area Q1, the following is adopted: Figure 5 The diagram shows a slotted structure. Due to the large size of the bridging section, the first encapsulation section protrudes significantly after encapsulation, typically about 1mm. This prevents the reflector from fully adhering at the first encapsulation section. During the reliability process, as the reflector shrinks, the reflector bulges at the first encapsulation section, affecting the optical performance.

[0143] Figure 15 This is a planar schematic diagram of a light-emitting substrate according to an embodiment of the present disclosure. Figure 16 for Figure 15 An enlarged diagram of the first functional area in the image. Figure 17A for Figure 16 Schematic diagram of section F1-F1 in the figure. Figure 17B for Figure 16 A schematic diagram of section F2-F2 in the diagram. Figure 16 The first functional area is Figure 2 The first functional area corresponding to the bridging part 123 shown.

[0144] In one embodiment, such as Figure 16As shown, the electronic component may include a bridging section 123, which is coupled to two metal traces. Figure 16 In the middle, the bridging part 123 is coupled to two power signal lines 103, which are two non-connected metal traces in the metal trace pattern.

[0145] like Figure 15 and Figure 16 As shown, the first reflective layer 30 has a first functional area Q1, and the bridging portion 123 is projected onto the substrate 10 within the projection range of the first functional area Q1 onto the substrate 10. The first reflective layer 30 has a plurality of first linear slits 61, each of which penetrates the first reflective layer 30 in a direction perpendicular to the substrate 10. The edge of the first functional area Q1 is formed by a plurality of mutually spaced first linear slits 61.

[0146] like Figure 15 and Figure 16 As shown, the first reflective layer 30 also has a plurality of third linear slits 63 located in the first functional area Q1, and the plurality of third linear slits 63 are arranged at intervals along at least a portion of the edge of the first functional area Q1.

[0147] During the reliability process, due to the bulging at the bridging portion 123, the reflector will generate contraction stress in the first functional area Q1. The first linear slit 61 provides a stress release path. By setting a third linear slit 63 in the first functional area Q1, the stress release path is increased. Thus, during the reliability process, when the reflector contracts in the first functional area Q1, the stress can be released simultaneously through the first linear slit 61 and the third linear slit 63, preventing the reflector from bulging in the first functional area Q1 and improving the optical effect.

[0148] In one implementation, such as Figure 16 As shown, the first reflective layer 30 also has a second linear slit 62 located within the first functional region Q1. The second linear slit 62 penetrates the first reflective layer 30 in a direction perpendicular to the substrate. The orthographic projection of the edge of the second linear slit 62 onto the substrate 10 at least partially overlaps with the orthographic projection of the bridging portion 123 onto the substrate 10. The second linear slit 62 divides the first functional region Q1 into a first sub-region and a second sub-region, and a third linear slit 63 is located within at least one of the first and second sub-regions.

[0149] Understandably, the bridging portion 123 has the highest protrusion. By setting the orthographic projection of the edge of the second linear slit 62 onto the substrate 10 to at least partially overlap with the orthographic projection of the bridging portion 123 onto the substrate 10, the second linear slit 62 can release the stress at the highest point of the bridging portion 123, preventing the reflector from bulging. Exemplarily, the third linear slit 63 is located within the first sub-region and the second sub-region. Thus, the third linear slit 63 located in the first sub-region can release the shrinkage stress in the first sub-region, and the third linear slit 63 located in the second sub-region can release the shrinkage stress in the second sub-region, preventing uneven stress release and further improving the reflector bulging problem, thereby improving optical performance.

[0150] In one implementation, such as Figure 16 As shown, the interval between two adjacent first linear slits 61 is g, and the length of the first linear slit 61 is f, where f can be greater than twice g. It is understood that within the first functional area Q1, the reflector located between two adjacent first linear slits 61 will experience shrinkage stress during reliability testing. If this stress cannot be fully released, the risk of the reflector bulging will increase. By setting f to be greater than twice g, the first linear slits 61 can more fully release the shrinkage stress of the reflector, preventing bulging of the reflector within the first functional area Q1.

[0151] In one implementation, such as Figure 16 As shown, the edge of the first functional area Q1 includes a first edge 71a, a second edge 71b, a third edge 71c, and a fourth edge 71d connected in sequence. The first edge 71a and the third edge 71c are arranged opposite each other and both extend along a first direction X. The second edge 71b and the fourth edge 71d are arranged opposite each other and both extend along a second direction Y. The first direction X is the extension direction of the bridging portion 123, and the second direction Y is perpendicular to the first direction X.

[0152] The first linear slot 61 includes a first sub-linear slot 611 and a second sub-linear slot 612. Multiple first sub-linear slots 611 are spaced apart along a first edge 71a and a third edge 71c. The second sub-linear slots 612 are positioned along a second edge 71b and a fourth edge 71d. A third linear slot 63 corresponds one-to-one with and is parallel to the first sub-linear slots 611. The size of the third linear slot 63 is the same as the size of the first sub-linear slots 611.

[0153] With this structure, the first sub-linear slit 611 and the third linear slit 63 can work together to release the shrinkage stress of the reflector, further reducing the risk of the reflector bulging and improving the optical effect.

[0154] In one implementation, such as Figure 16As shown, the second linear slit 62 can extend along the first direction X. In other examples, the second linear slit 62 can extend along the second direction Y. In still other examples, the second linear slit 62 can extend along a direction that intersects both the first direction X and the second direction Y.

[0155] In one embodiment, in the second direction Y, the orthogonal projection of the second linear slot 62 onto the substrate 10 lies within the range of the orthogonal projection of the bridging portion 123 onto the substrate 10, such as... Figure 16 As shown.

[0156] In one implementation, such as Figure 16 As shown, the orthographic projection of the bridging portion 123 on the substrate 10 can be rectangular. The dimension of the bridging portion 123 in the first direction X is W1, and the dimension of the bridging portion 123 in the second direction Y is L1. The gap between the window 141 of the second reflective layer 14 and the bridging portion 123 is a, the offset of the window 141 is b, the white glue dispensing position accuracy is c, and the glue overflow size is d.

[0157] like Figure 16 and Figure 17A , Figure 17B As shown, the light-emitting substrate may further include a first encapsulation portion 1230, which is located on the side of the bridging portion 123 away from the substrate 10. The orthographic projection of the bridging portion 123 on the substrate 10 is within the orthographic projection range of the first encapsulation portion 1230 on the substrate 10. The first reflective layer 30 is located on the side of the first encapsulation portion 1230 away from the substrate 10.

[0158] The dimensions of the first encapsulation part 1230 in the first direction X are W2 = W1 + 2*(a+b) + 2*c + 2*d, and the dimensions of the first encapsulation part 1230 in the second direction Y are L2 = L1 + 2*(a+b) + 2*c + 2*d.

[0159] For example, the distance d3 between the orthographic projection of the third linear slit 63 on the substrate 10 and the edge of the orthographic projection of the first package portion 1230 on the substrate 10 is greater than or equal to 0.5 mm, and the distance d4 between the third linear slit and the corresponding first sub-linear slit is 0.8 mm to 1.2 mm.

[0160] For example, the size of the second linear slit 62 in the first direction X can be larger than the size of the first encapsulation portion 1230 in the first direction X. The difference between the size of the second sub-linear slit 612 in the second direction Y and the size L2 of the first encapsulation portion 1230 in the second direction Y can be greater than 3 mm.

[0161] In some examples, the length of the third linear slit 63 can range from 1.5mm to 4.5mm, 2mm to 4mm, or 2.5mm to 3.5mm, etc. In some examples, the length of the third linear slit 63 can be 1.2mm, 2.8mm, 3.4mm, or 4.8mm, etc.

[0162] In some examples, the width of the third linear slit 63 can be in the range of 100μm~250μm, 120μm~220μm, or 150μm~200μm, etc. In some examples, the width of the third linear slit 63 can be 80μm, 120μm, 220μm, or 280μm, etc.

[0163] Understandably, the length and width of the multiple third linear slits 63 can be the same or different.

[0164] Understandably, setting the length and width of the third linear slit 63 to different values ​​can meet different usage requirements and improve the reliability of the light-emitting substrate.

[0165] It is understandable that the length of the linear slit is the dimension of the linear slit in its extension direction, and the width of the linear slit is the dimension of the linear slit perpendicular to its extension direction.

[0166] In one embodiment, the length of the second linear slit 62 may be greater than the dimension W2 of the first encapsulation portion 1230 in the first direction X.

[0167] In some examples, the width of the second linear slit 62 can range from 100μm to 250μm, 120μm to 220μm, or 150μm to 200μm, etc. In some examples, the width of the second linear slit 62 can be 80μm, 120μm, 220μm, or 280μm, etc. The width of the second linear slit 62 can be the same as or different from the width of the third linear slit 63.

[0168] By way of example, the material of the first encapsulation portion 1230 can be a light-transmitting material, such as transparent silicone. In other examples, the material of the first encapsulation portion 1230 can also be a reflective material, such as white silicone. The embodiments of this disclosure do not further limit the material of the first encapsulation portion 1230.

[0169] It should be noted that, in the above text, the dimensions of the bridging portion 123 are the dimensions of the orthographic projection of the bridging portion 123 onto the substrate 10; and the dimensions of the first packaging portion 1230 are the dimensions of the orthographic projection of the first packaging portion 1230 onto the substrate 10.

[0170] For example, at least a portion of the first package portion 1230 on the side away from the substrate 10 can reflect light. In some examples, the area of ​​the first package portion 1230 on the side away from the substrate 10 and exposed by the second linear slot 62 can reflect light to reduce the impact of the first package portion 1230 on the brightness of the substrate, thereby improving the utilization rate of light incident on the area where the first package portion 1230 is located on the substrate and improving the brightness uniformity of the substrate.

[0171] Figure 18 for Figure 15 A schematic diagram of the D1-D1 cross-section of the light-emitting substrate shown. Figure 19 for Figure 15 A schematic diagram of the D2-D2 cross section of the light-emitting substrate shown.

[0172] In one embodiment, such as Figure 15 and Figure 18 As shown, the electronic components may include a light-emitting element 121, such as an LED. The light-emitting substrate may also include a second encapsulation portion 1210, wherein the orthographic projection of the light-emitting element 121 on the substrate 10 is within the orthographic projection range of the second encapsulation portion 1210 on the substrate 10. The first reflective layer 30 has a first through-hole M1, and the orthographic projection of the second encapsulation portion 1210 on the substrate 10 is within the orthographic projection of the first through-hole M1 on the substrate 10, thereby allowing the second encapsulation portion 1210 to be exposed through the first through-hole M1.

[0173] For example, such as Figure 18 As shown, the second encapsulation portion 1210 covers the light-emitting element 121, which can protect the light-emitting element 21 and extend its service life. The material of the second encapsulation portion 1210 is a light-transmitting material, which reduces the light blocking effect of the second encapsulation portion 1210 and increases the light intensity that can pass through the second encapsulation portion 1210.

[0174] In some instances, the material of the second encapsulation portion 1210 includes transparent adhesive. In some embodiments, the second encapsulation portion 1210 may be mushroom-shaped or approximately mushroom-shaped.

[0175] In one embodiment, such as Figure 15 and Figure 19As shown, the electronic component may include a micro-driver chip 122. The light-emitting substrate may also include a third package portion 1220, the orthographic projection of the micro-driver chip 122 on the substrate 10 being within the orthographic projection range of the third package portion 1220 on the substrate 10. The first reflective layer 30 has a second functional region Q2, and the orthographic projection of the third package portion 1220 on the substrate 10 is within the orthographic projection range of the second functional region Q2 on the substrate 10. The first reflective layer 30 has a fourth linear slit 64. The fourth linear slit 64 is located within the second functional region Q2. The fourth linear slit 64 penetrates the first reflective layer 30 in a direction perpendicular to the substrate 10, and the orthographic projection of the fourth linear slit 64 on the substrate 10 at least partially overlaps with the orthographic projection of the micro-driver chip 122 on the substrate 10. The fourth linear slit 64 can release the contractile stress of the reflective sheet in the second functional region Q2, preventing the reflective sheet from bulging in the second functional region Q2.

[0176] The number of fourth linear slots 64 located in the same second functional area Q2 can be one or more. The number of fourth linear slots 64 in different second functional areas Q2 can be the same or different.

[0177] In some examples, such as Figure 15 As shown, at least two fourth linear slits 64 are located in the same second functional area Q2, and the at least two fourth linear slits 64 located in the same second functional area Q2 are distributed circumferentially within the second functional area Q2.

[0178] For example, at least two fourth linear slits 64 located within the same second functional area Q2 intersect at the same position, such as... Figure 15 As shown, at least two fourth linear slits 64 located within the same second functional area Q2 are intersecting slits, such as cross-shaped slits or X-shaped slits. Setting the fourth linear slits 64 within the second functional area Q2 as intersecting slits can better release the shrinkage stress in the central region of the second functional area Q2 and prevent the reflective sheet of the second functional area Q2 from bulging.

[0179] For example, the third package 1220 covers the micro driver chip, which can protect the micro driver chip and extend its life.

[0180] By way of example, the material of the third encapsulation portion 1220 can be a light-transmitting material, such as transparent silicone. In other examples, the material of the third encapsulation portion 1220 can also be a reflective material, such as white silicone. The embodiments of this disclosure do not further limit the material of the third encapsulation portion 1220.

[0181] Figure 20 This is a planar schematic diagram of the light-emitting substrate according to another embodiment of this disclosure. For example... Figure 20As shown, the fourth linear slots 64 located in the same second functional area Q2 can intersect to form a cross-shaped slot. Figure 15 In the illustrated embodiment, the first reflective layer 30 covers the third encapsulation portion 1220. In another embodiment, as shown... Figure 20 As shown, the first reflective layer 30 has a second through hole M5. The second through hole M2 penetrates the first reflective layer 30 in a direction perpendicular to the substrate 10, and the third package 1220 and the micro driver chip 122 can be exposed through the second through hole M2, thus avoiding the third package 1220 from causing shrinkage stress on the first reflective layer 30.

[0182] In one embodiment, such as Figure 13 , Figure 14 and Figure 18 As shown, the light-emitting substrate also includes a plurality of reflective portions 80, which are disposed at the edge of the window 141.

[0183] Understandably, the reflective portion 80 serves to reflect light. In some examples, the material of the reflective portion 80 includes white glue. Exemplarily, the reflective portion 80 can be formed by applying dots of white glue.

[0184] This disclosure also provides a display device, including the light-emitting substrate in any embodiment of this disclosure.

[0185] The light-emitting substrate in this embodiment can be used as a display panel in a display device, or it can be used as a light source in a display device. The display device can be any product or component with display function, such as electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable display device, etc.

[0186] The light-emitting substrate in this embodiment can also be used as a light source in lighting products.

[0187] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0188] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0189] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0190] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0191] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify this disclosure, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this disclosure. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0192] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure, and these should all be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A light-emitting substrate, characterized in that, include: A wiring substrate includes a substrate, a plurality of metal traces disposed on one side of the substrate, and a second reflective layer disposed on the side of the plurality of metal traces facing away from the substrate. The second reflective layer is provided with a plurality of openings, the openings exposing a portion of the surface of the metal traces. Electronic components are coupled to the exposed surface of the metal traces; The first reflective layer includes a reflective sheet, which comprises a first reflective film, a first adhesive layer, and a first release film stacked sequentially. A first venting groove is provided on the surface of the first adhesive layer near the first release film. The first venting groove communicates with the edge of the first adhesive layer. The depth of the first venting groove is less than the thickness of the first adhesive layer. The reflective sheet is attached to the surface of the second reflective layer of the wiring substrate on which the electronic components are disposed through the first adhesive layer. There are multiple first venting grooves, and the multiple first venting grooves are interconnected.

2. The light-emitting substrate according to claim 1, characterized in that, The width of the first exhaust groove is 0.05mm~0.2mm.

3. The light-emitting substrate according to claim 1, characterized in that, The depth of the first venting groove is 25% to 75% of the thickness of the first adhesive layer.

4. The light-emitting substrate according to claim 1, characterized in that, Multiple first exhaust channels are connected to form a grid.

5. The light-emitting substrate according to claim 4, characterized in that, The length of the first exhaust groove is 0.5mm to 2mm.

6. The light-emitting substrate according to claim 1, characterized in that, The thickness of the first adhesive layer is 15μm to 30μm; and / or the viscosity of the first adhesive layer is 1500 (g / 25mm) to 2200 (g / 25mm).

7. The light-emitting substrate according to claim 1, characterized in that, It also includes a transparent film and a second adhesive layer disposed between the first adhesive layer and the first reflective film, the second adhesive layer being close to the first reflective film.

8. A light-emitting substrate, characterized in that, include: A wiring substrate includes a substrate, a plurality of metal traces disposed on one side of the substrate, and a second reflective layer disposed on the side of the plurality of metal traces facing away from the substrate. The second reflective layer has a plurality of openings that expose a portion of the surface of the metal traces. A second venting groove is disposed on the surface of the second reflective layer facing away from the substrate, and the second venting groove communicates with the edge of the second reflective layer. The depth of the second venting groove is less than the thickness of the second reflective layer. Electronic components are coupled to the exposed surface of the metal traces; The first reflective layer includes a third adhesive layer and a second reflective film stacked together, wherein the second reflective film is attached to the surface of the second reflective layer of the wiring substrate on which the electronic components are disposed through the third adhesive layer.

9. The light-emitting substrate according to claim 8, characterized in that, The width of the second exhaust groove is 0.05mm to 0.2mm; and / or the depth of the second exhaust groove is 5μm to 15μm.

10. The light-emitting substrate according to claim 8, characterized in that, There are multiple second exhaust channels, which are interconnected and form a grid. The length of each second exhaust channel is 0.5mm to 2mm.

11. The light-emitting substrate according to any one of claims 8-10, characterized in that, The electronic component includes a bridging section, which is coupled to the two metal traces; The first reflective layer includes a first functional area, and the orthographic projection of the bridging portion on the substrate is located within the range of the orthographic projection of the first functional area on the substrate; the first reflective layer has a plurality of first linear slits, each of the first linear slits penetrating the first reflective layer in a direction perpendicular to the substrate, and the edge of the first functional area is formed by a plurality of mutually spaced first linear slits. The first reflective layer also has a plurality of third linear slits located within the first functional area, and the plurality of third linear slits are arranged at intervals along at least a portion of the edge of the first functional area.

12. The light-emitting substrate according to claim 11, characterized in that, The length of the first linear slit is greater than twice the interval between two adjacent first linear slits.

13. The light-emitting substrate according to claim 11, characterized in that, The first reflective layer is further provided with a second linear slit located within the first functional area. The second linear slit penetrates the first reflective layer in a direction perpendicular to the substrate. The orthographic projection of the edge of the second linear slit on the substrate at least partially overlaps with the orthographic projection of the bridging portion on the substrate. The second linear slit divides the first functional area into a first sub-region and a second sub-region. The third linear slit is located in at least one of the first sub-region and the second sub-region.

14. The light-emitting substrate according to claim 11, characterized in that, The edge of the first functional area includes a first edge, a second edge, a third edge and a fourth edge connected in sequence. The first edge and the third edge are arranged opposite to each other and both extend along a first direction. The second edge and the fourth edge are arranged opposite to each other and both extend along a second direction. The first direction is the extension direction of the bridging part, and the second direction is perpendicular to the first direction. The first linear slot includes a first sub-linear slot and a second sub-linear slot. A plurality of first sub-linear slots are spaced apart from each other along the first edge and the third edge. The second sub-linear slots are arranged along the second edge and the fourth edge. The third linear slot corresponds one-to-one with the first sub-linear slots and is parallel to each other. The size of the third linear slot is the same as the size of the first sub-linear slot.

15. The light-emitting substrate according to claim 14, characterized in that, The light-emitting substrate further includes a first encapsulation portion located on the side of the bridging portion away from the substrate, the orthographic projection of the bridging portion on the substrate being within the orthographic projection range of the first encapsulation portion on the substrate; the first reflective layer located on the side of the first encapsulation portion away from the substrate, the distance between the orthographic projection of the third linear slot on the substrate and the edge of the orthographic projection of the first encapsulation portion on the substrate being greater than or equal to 0.5 mm, and the distance between the third linear slot and the corresponding first sub-linear slot being 0.8 mm to 1.2 mm.

16. A display device, characterized in that, The light-emitting substrate includes any one of claims 8-15.

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