3D composite heat pipe radiator design method, device, equipment and storage medium

Abstract

The application provides a 3D composite heat pipe radiator design method, device, equipment and storage medium, the method comprises the following steps: obtaining the design target of the surface temperature of the IGBT module; according to the total loss, the total air volume of the 3D composite heat pipe radiator is obtained; according to the total air volume and the layout range of the IGBT module, the initial cross-sectional size, fan type and fan number of the 3D composite heat pipe radiator are obtained; the whole machine thermal model is constructed, the whole machine thermal model is simulated and calculated, the surface temperature of the IGBT module and the fan working point are obtained; it is judged whether the 3D composite heat pipe radiator meets the design requirements; if it does not meet the design requirements, the adjusted cross-sectional size, fan type and fan number of the 3D composite heat pipe radiator are obtained again. The application provides a faster and more efficient 3D composite heat pipe radiator design process, which significantly saves development time, reduces development cost, improves development efficiency and development quality.

Description

Technical Field

[0001] This invention relates to the field of phase change cooling technology, and more specifically, to a design method, apparatus, equipment, and storage medium for a 3D composite heat pipe radiator. Background Technology

[0002] IGBT (Insulated Gate Bipolar Transistor) is a composite, fully controllable, voltage-driven power semiconductor device composed of BJT (Bipolar Junction Transistor) and MOS (Metal-Oxide-Semiconductor Field-Effect Transistor). IGBTs offer advantages such as high power density and low on-state voltage, and are widely used in various electrical systems.

[0003] Currently, the steady-state heat transfer problem of high power density IGBTs is generally addressed using 2D heat pipe radiators. However, the cooling and filtering effect of 2D heat pipe radiators is limited and cannot meet the cooling requirements of high power density IGBTs. In addition, the current design method for radiators involves repeated prototyping and testing based on existing designs, resulting in long development cycles, low development efficiency, and high development costs. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a design method, apparatus, device, and storage medium for a 3D composite heat pipe radiator.

[0005] In a first aspect, the present invention provides a 3D composite heat pipe radiator design method, comprising:

[0006] Based on the actual situation of the IGBT module, obtain the design target for the surface temperature of the IGBT module;

[0007] Obtain the total loss of the IGBT module, and based on the total loss, obtain the total airflow of the 3D composite heat pipe radiator;

[0008] Based on the total airflow and the layout range of the IGBT module, the initial cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator are obtained.

[0009] A complete system thermal model is constructed, including an IGBT module model and a 3D composite heat pipe radiator model. CFD flow field and temperature field simulation calculations are performed on the complete system thermal model to obtain the surface temperature of the IGBT module and the fan operating point.

[0010] Based on the surface temperature of the IGBT module, the operating point of the fan, and the design target for the surface temperature of the IGBT module, determine whether the 3D composite heat pipe radiator meets the design requirements.

[0011] If the design requirements are not met, the cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator will be adjusted based on the total air volume and the layout range of the IGBT module.

[0012] Optionally, obtaining the design target for the surface temperature of the IGBT module based on the actual situation of the IGBT module includes:

[0013] The design target for the surface temperature of the IGBT module is obtained according to a first formula, wherein the first formula includes:

[0014] ;

[0015] in, This indicates the design target for the surface temperature of the IGBT module. This indicates the maximum junction temperature of the IGBT module. This indicates the loss of the IGBT module. This indicates the junction-to-case thermal resistance of the IGBT module.

[0016] Optionally, obtaining the total airflow of the 3D composite heat pipe radiator includes:

[0017] The total airflow of the 3D composite heat pipe radiator is obtained according to a second formula, wherein the second formula includes:

[0018] ;

[0019] in, This represents the total loss of the IGBT module. This indicates the specific heat capacity of air at constant pressure. This indicates the density of the cooling air. This indicates the volumetric flow rate of the cooling air. The average air temperature difference between the radiator inlet and outlet is represented by the total air volume, and the volumetric flow rate of the cooling air is the total air volume.

[0020] Optionally, the process of constructing the 3D composite heat pipe radiator model includes:

[0021] The substrate of the 3D composite heat pipe radiator is equivalent to a horizontal planar heat pipe thermal resistance, the branch planar heat pipes of the 3D composite heat pipe radiator are equivalent to vertical planar heat pipe thermal resistance, and the heat exchange fins of the 3D composite heat pipe radiator are equivalent to heat exchange fin thermal resistance. Among them, multiple vertical planar heat pipe thermal resistances are connected in parallel, and the horizontal planar heat pipe thermal resistance, the multiple parallel vertical planar heat pipe thermal resistances, and the heat exchange fin thermal resistance are connected in series to form the 3D composite heat pipe radiator model.

[0022] The construction of a system thermal model includes an IGBT module model and a 3D composite heat pipe radiator model. CFD simulation calculations of the flow field and temperature field are performed on the system thermal model to obtain the surface temperature of the IGBT module and the fan operating point, including:

[0023] The thermal resistance of the 3D composite heat pipe radiator model is obtained according to the third formula, which includes:

[0024] ;

[0025] in, This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the thermal resistance of the horizontal planar heat pipe. This indicates the thermal resistance of the vertical planar heat pipe. This indicates the number of thermal resistances of the vertical planar heat pipes. This indicates the thermal resistance of the heat exchange fins;

[0026] The substrate temperature of the 3D composite heat pipe radiator is obtained according to the fourth formula, wherein the substrate temperature of the 3D composite heat pipe radiator is the surface temperature of the IGBT module, and the fourth formula includes:

[0027] ;

[0028] in, This indicates the substrate temperature of the 3D composite heat pipe radiator. Indicates the ambient temperature. This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the heat transfer capacity of the 3D composite heat pipe radiator;

[0029] The CFD flow field and temperature field of the IGBT module and the 3D composite heat pipe radiator model are simulated and calculated to obtain the fan operating point.

[0030] Optionally, the thermal conductivity coefficients of each part of the horizontal planar heat pipe are respectively αK x =30000-50000 w / m K , α K y = 180 w / m K The thermal conductivity coefficients of each part of the vertical planar heat pipe are respectivelyβK x =180 w / m K , βK y =30000-50000 w / m K The thermal conductivity of the heat exchange fins is γK= 180 w / m K .

[0031] Optionally, determining whether the 3D composite heat pipe radiator meets the design requirements based on the surface temperature of the IGBT module, the fan operating point, and the design target for the surface temperature of the IGBT module includes:

[0032] The substrate temperature of the 3D composite heat pipe radiator is compared with the design target surface temperature of the IGBT module to determine whether the substrate temperature of the 3D composite heat pipe radiator meets the requirements.

[0033] Based on the layout range of the IGBT module, determine whether the fan operating point of the 3D composite heat pipe radiator meets the requirements.

[0034] Optionally, after determining whether the 3D composite heat pipe radiator meets the design requirements based on the surface temperature of the IGBT module, the fan operating point, and the design target for the surface temperature of the IGBT module, the method further includes:

[0035] If the design requirements are met, the 3D composite heat pipe radiator will be further tested to verify its actual performance.

[0036] Secondly, the present invention provides a 3D composite heat pipe radiator design device, the device comprising:

[0037] The design target acquisition module obtains the design target for the surface temperature of the IGBT module.

[0038] The total airflow acquisition module acquires the total loss of the IGBT module and, based on the total loss, acquires the total airflow of the 3D composite heat pipe radiator.

[0039] The first design module obtains the initial cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator based on the total air volume and the layout range of the IGBT module.

[0040] The simulation calculation module constructs models of the IGBT module and the 3D composite heat pipe radiator, performs CFD flow field and temperature field simulation calculations on the IGBT module and the 3D composite heat pipe radiator models, and obtains the surface temperature of the IGBT module and the operating point of the fan.

[0041] The judgment module determines whether the 3D composite heat pipe radiator meets the design requirements based on the surface temperature of the IGBT module, the fan operating point, and the design target of the surface temperature of the IGBT module.

[0042] If the design requirements are not met, the second design module will re-obtain the adjusted cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator based on the total air volume and the layout range of the IGBT module.

[0043] Thirdly, the present invention provides a computer-readable storage medium storing a computer program for executing the 3D composite heat pipe radiator design method described above.

[0044] Fourthly, the present invention provides a computer device, including a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the 3D composite heat pipe radiator design method described above.

[0045] This invention provides a 3D composite heat pipe radiator design method, apparatus, equipment, and storage medium. It obtains the design target surface temperature of the IGBT module based on its actual conditions, and determines the total airflow required by the 3D composite heat pipe radiator based on the total IGBT losses. Furthermore, it preliminarily determines the cross-sectional dimensions, fan type, and number of fans based on the total airflow, resulting in a preliminary design of the 3D composite heat pipe radiator. A complete system thermal model, including the IGBT module and the 3D composite heat pipe radiator, is constructed. Through CFD flow field and temperature field simulation calculations, simulation results of the IGBT module surface temperature and fan operating points are obtained. The results are then assessed to determine if the requirements are met. If not, the 3D composite heat pipe radiator design is revised until a satisfactory 3D composite heat pipe radiator is obtained. This invention comprehensively utilizes theoretical calculations and CFD simulation technology, providing a faster and more efficient design process for 3D composite heat pipe radiators for IGBT modules. It can obtain 3D composite heat pipe radiators that meet the requirements, significantly saving development time, reducing development costs, and improving development efficiency and quality. Attached Figure Description

[0046] Figure 1This is an application environment diagram of the 3D composite heat pipe radiator design method in the embodiments of the present invention;

[0047] Figure 2 This is a flowchart illustrating the 3D composite heat pipe radiator design method in an embodiment of the present invention.

[0048] Figure 3 This is a schematic diagram of the overall thermal model in an embodiment of the present invention;

[0049] Figure 4 This is a schematic diagram of the structure of the 3D composite heat pipe radiator in an embodiment of the present invention;

[0050] Figure 5 This is a schematic diagram of the equivalent thermal resistance model of the 3D composite heat pipe radiator in an embodiment of the present invention;

[0051] Figure 6 This is a structural block diagram of the 3D composite heat pipe radiator design device in an embodiment of the present invention;

[0052] Figure 7 This is an internal structural diagram of a computer device in an embodiment of the present invention. Detailed Implementation

[0053] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Although some embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the accompanying drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0054] It should be understood that the various steps described in the method embodiments of the present invention may be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present invention is not limited in this respect.

[0055] The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "optional embodiments". Definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc., mentioned in this invention are used only to distinguish different devices, modules, or units, and are not intended to limit the order of functions performed by these devices, modules, or units or their interdependencies.

[0056] It should be noted that the terms "a" and "a plurality of" used in this invention are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0057] The names of the messages or information exchanged between the multiple devices in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of these messages or information.

[0058] Figure 1 This is an application environment diagram of a 3D composite heat pipe radiator design method in one embodiment. (Refer to...) Figure 1 This 3D composite heat pipe radiator design method is applied to a 3D composite heat pipe radiator design system. The system includes a terminal 110 and a server 120. The terminal 110 and server 120 are connected via a network. The terminal 110 can be a desktop terminal or a mobile terminal; a mobile terminal can be at least one of a mobile phone, tablet, or laptop. The server 120 can be a standalone server or a server cluster consisting of multiple servers.

[0059] like Figure 2 As shown, this embodiment of the invention provides a 3D composite heat pipe radiator design method, including:

[0060] Step 210: Based on the actual situation of the IGBT module, obtain the design target for the surface temperature of the IGBT module;

[0061] Step 220: Obtain the total loss of the IGBT module, and obtain the total airflow of the 3D composite heat pipe radiator based on the total loss.

[0062] Step 230: Based on the total air volume and the layout range of the IGBT module, obtain the initial cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator;

[0063] Step 240: Construct a whole-system thermal model including an IGBT module model and a 3D composite heat pipe radiator model; perform CFD flow field and temperature field simulation calculations on the whole-system thermal model to obtain the surface temperature of the IGBT module and the operating point of the fan.

[0064] Step 250: Based on the surface temperature of the IGBT module, the fan operating point, and the design target of the IGBT module surface temperature, determine whether the 3D composite heat pipe radiator meets the design requirements.

[0065] Step 260: If the design requirements are not met, then based on the total air volume and the layout range of the IGBT module, obtain the adjusted cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator.

[0066] Figure 2 This is a flowchart illustrating a 3D composite heat pipe radiator design method in one embodiment. It should be understood that, although... Figure 2 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise explicitly stated herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 2 At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0067] In step 210, the design target for the surface temperature of the IGBT module is obtained according to the first formula, which includes:

[0068] ;

[0069] in, This indicates the design target for the surface temperature of the IGBT module. This indicates the maximum junction temperature of the IGBT module. This indicates the loss of the IGBT module. This indicates the junction-to-case thermal resistance of the IGBT module.

[0070] That is, the design target for the surface temperature of the IGBT module is obtained through theoretical calculation.

[0071] In step 220, based on the total losses of the IGBT module, the total airflow required by the 3D composite heat pipe radiator is calculated theoretically using the second formula, which includes:

[0072] ;

[0073] in, This represents the total loss of the IGBT module. This indicates the specific heat capacity of air at constant pressure. This indicates the density of the cooling air. This indicates the volumetric flow rate of the cooling air. The average air temperature difference between the radiator inlet and outlet is represented by the total air volume, and the volumetric flow rate of the cooling air is the total air volume.

[0074] In step 230, the initial cross-sectional dimensions, initial fan type, and initial number of fans of the 3D composite heat pipe radiator are obtained based on the total air volume and the layout range of the IGBT module.

[0075] That is, based on the total air volume calculated in step 220, the initial design of the 3D composite heat pipe radiator, as well as the fan type and number of fans, are obtained, and the preliminary design of the 3D composite heat pipe radiator is determined.

[0076] In step 240, a whole-system thermal model is constructed, including an IGBT module model and a 3D composite heat pipe radiator model. CFD flow field and temperature field simulation calculations are performed on the whole-system thermal model to obtain the surface temperature of the IGBT module and the operating point of the fan.

[0077] CFD (Computational Fluid Dynamics) refers to computational fluid dynamics.

[0078] In one embodiment, such as Figure 3 As shown, the constructed overall thermal model includes an IGBT module model, a 3D composite heat pipe radiator model, a cooling fan model, and a chassis model.

[0079] The process of constructing the 3D composite heat pipe radiator model includes:

[0080] The substrate of the 3D composite heat pipe radiator is equivalent to the thermal resistance of a horizontal planar heat pipe, the branch planar heat pipes of the 3D composite heat pipe radiator are equivalent to the thermal resistance of a vertical planar heat pipe, and the heat exchange fins of the 3D composite heat pipe radiator are equivalent to the thermal resistance of heat exchange fins. Among them, multiple vertical planar heat pipe thermal resistances are connected in parallel, and the horizontal planar heat pipe thermal resistances, the multiple parallel vertical planar heat pipe thermal resistances, and the heat exchange fin thermal resistances are connected in series to form the 3D composite heat pipe radiator model.

[0081] By using the equivalent modeling method, the phase change steady-state heat transfer model of the complex 3D composite heat pipe radiator is equivalently decomposed into anisotropic solid models, thereby enabling rapid modeling and improving the efficiency of simulation calculations. Furthermore, the modeling method provided in this embodiment of the invention can accurately simulate the situation of the 3D composite heat pipe radiator, thus obtaining more accurate simulation results.

[0082] like Figure 4 As shown, the 3D composite heat pipe radiator consists of a substrate, vertical planar heat pipes located on the substrate, and heat dissipation fins welded to the vertical planar heat pipes. Figure 4 In the diagram, A represents the substrate, B represents the vertical planar heat pipe, and C represents the heat dissipation fins. The substrate of the 3D composite heat pipe radiator is a horizontal planar heat pipe.

[0083] Based on the structure of the 3D composite heat pipe radiator, an equivalent model is performed to obtain the 3D composite heat pipe radiator model, such as... Figure 5 As shown. Figure 5 Chinese R b R1, R2, R3…R represents the thermal resistance of a horizontal planar heat pipe (equivalent to the substrate of a 3D composite heat pipe radiator). n R represents the thermal resistance of a vertical planar heat pipe, where n is the number of vertical planar heat pipes. h Thermal resistance of heat sink fins

[0084] Furthermore, step 240 includes:

[0085] The thermal resistance of the 3D composite heat pipe radiator is obtained according to a third formula, which includes:

[0086] ;

[0087] in, This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the thermal resistance of the horizontal planar heat pipe. This indicates the thermal resistance of the vertical planar heat pipe. This indicates the number of thermal resistances of the vertical planar heat pipes. This indicates the thermal resistance of the heat exchange fins;

[0088] The substrate temperature of the 3D composite heat pipe radiator is obtained according to the fourth formula, wherein the substrate temperature of the 3D composite heat pipe radiator is the surface temperature of the IGBT module, and the fourth formula includes:

[0089] ;

[0090] in, This indicates the substrate temperature of the 3D composite heat pipe radiator. Indicates the ambient temperature. This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the heat transfer capacity of the 3D composite heat pipe radiator;

[0091] The CFD flow field and temperature field of the whole machine model are simulated and calculated to obtain the operating point of the fan.

[0092] Based on the material and structure of the 3D composite heat pipe radiator, the thermal conductivity of each component can be further adjusted.

[0093] In one embodiment, the thermal conductivity coefficients of each part of the horizontal planar heat pipe thermal resistance are respectively αK x =30000-50000 w / m K , αK y = 180 w / m K The thermal conductivity coefficients of each part of the vertical planar heat pipe are respectively βK x =180 w / m K , βK y =30000-50000 w / m K The thermal conductivity of the heat exchange fins is γK= 180 w / m K .

[0094] In step 250, the substrate temperature of the 3D composite heat pipe radiator is compared with the design target of the surface temperature of the IGBT module to determine whether the substrate temperature of the 3D composite heat pipe radiator meets the requirements.

[0095] Based on the layout range of the IGBT module, determine whether the fan operating point of the 3D composite heat pipe radiator meets the requirements.

[0096] When the substrate temperature and fan operating point of the 3D composite heat pipe radiator meet the requirements, the 3D composite heat pipe radiator is considered to meet the design requirements.

[0097] That is, the substrate temperature of the 3D composite heat pipe radiator obtained in step 240 is... With IGBT module surface temperature If a comparison is made, Less than or equal to Then it meets the requirements, if Greater than This does not meet the requirements;

[0098] In addition, based on the layout range of the IGBT module, it is determined whether the fan operating point of the 3D composite heat pipe radiator meets the requirements.

[0099] In step 260, if the design requirements are not met, the updated cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator are obtained again based on the total air volume and the layout range of the IGBT module.

[0100] In other words, if the initial design of the 3D composite heat pipe radiator cannot meet the design requirements, the 3D composite heat pipe radiator design is redone. The initial cross-sectional dimensions, fan type, and number of fans are adjusted to obtain the adjusted cross-sectional dimensions, fan type, and number of fans. Based on the adjusted cross-sectional dimensions, fan type, and number of fans, a model is rebuilt for simulation calculation and judgment until a 3D composite heat pipe radiator design that meets the requirements is obtained.

[0101] Accordingly, if the design requirements are met, the 3D composite heat pipe radiator will be further tested to verify its actual performance.

[0102] Specifically, if the design of the 3D composite heat pipe radiator meets the design requirements through simulation calculations, further testing can be conducted through physical prototyping to test the actual performance of the 3D composite heat pipe radiator, thereby obtaining more accurate test results.

[0103] If the physical prototype test fails to meet the design requirements, the 3D composite heat pipe radiator can be redesigned until a 3D composite heat pipe radiator that meets the design requirements is obtained.

[0104] In order to perform the steps in the above embodiments and various optional embodiments, such as Figure 6 As shown, another embodiment of the present invention provides a 3D composite heat pipe radiator design device, the device comprising:

[0105] Design target acquisition module 610 acquires the design target for the surface temperature of the IGBT module;

[0106] The total air volume acquisition module 620 acquires the total loss of the IGBT module and, based on the total loss, acquires the total air volume of the 3D composite heat pipe radiator.

[0107] The process of constructing the 3D composite heat pipe radiator model includes:

[0108] The substrate of the 3D composite heat pipe radiator is equivalent to a horizontal planar heat pipe thermal resistance, the branch planar heat pipes of the 3D composite heat pipe radiator are equivalent to vertical planar heat pipe thermal resistance, and the heat exchange fins of the 3D composite heat pipe radiator are equivalent to heat exchange fin thermal resistance. Among them, multiple vertical planar heat pipe thermal resistances are connected in parallel, and the horizontal planar heat pipe thermal resistance, the multiple parallel vertical planar heat pipe thermal resistances, and the heat exchange fin thermal resistance are connected in series to form the 3D composite heat pipe radiator model.

[0109] The construction of the overall system thermal model includes an IGBT module model and a 3D composite heat pipe radiator model. CFD simulation calculations of the flow field and temperature field are performed on the overall system thermal model to obtain the surface temperature of the IGBT module and the fan operating point, including:

[0110] The thermal resistance of the 3D composite heat pipe radiator model is obtained according to the third formula, which includes:

[0111] ;

[0112] in, This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the thermal resistance of the horizontal planar heat pipe. This indicates the thermal resistance of the vertical planar heat pipe. This indicates the number of thermal resistances of the vertical planar heat pipes. This indicates the thermal resistance of the heat exchange fins;

[0113] The substrate temperature of the 3D composite heat pipe radiator is obtained according to the fourth formula, wherein the substrate temperature of the 3D composite heat pipe radiator is the surface temperature of the IGBT module, and the fourth formula includes:

[0114] ;

[0115] in, This indicates the substrate temperature of the 3D composite heat pipe radiator. Indicates the ambient temperature. This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the heat transfer capacity of the 3D composite heat pipe radiator;

[0116] The CFD flow field and temperature field of the IGBT module and the 3D composite heat pipe radiator model are simulated and calculated to obtain the fan operating point.

[0117] The first design module 630 obtains the initial cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator based on the total air volume and the layout range of the IGBT module.

[0118] The simulation calculation module 640 constructs models of the IGBT module and the 3D composite heat pipe radiator, performs CFD flow field and temperature field simulation calculations on the IGBT module and the 3D composite heat pipe radiator models, and obtains the surface temperature of the IGBT module and the operating point of the fan.

[0119] The judgment module 650 determines whether the 3D composite heat pipe radiator meets the design requirements based on the surface temperature of the IGBT module, the fan operating point, and the design target of the surface temperature of the IGBT module.

[0120] If the design requirements are not met, the second design module 660 will re-obtain the updated cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator based on the total air volume and the layout range of the IGBT module.

[0121] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to perform the following steps:

[0122] Based on the actual situation of the IGBT module, obtain the design target for the surface temperature of the IGBT module;

[0123] Obtain the total loss of the IGBT module, and based on the total loss, obtain the total airflow of the 3D composite heat pipe radiator;

[0124] Based on the total airflow and the layout range of the IGBT module, the initial cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator are obtained.

[0125] Models of the IGBT module and the 3D composite heat pipe radiator are constructed, and CFD flow field and temperature field simulation calculations are performed on the IGBT module and the 3D composite heat pipe radiator model to obtain the surface temperature of the IGBT module and the operating point of the fan.

[0126] Based on the surface temperature of the IGBT module, the fan operating point, and the design target for the surface temperature of the IGBT module, determine whether the 3D composite heat pipe radiator meets the design requirements.

[0127] If the design requirements are not met, the updated cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator will be obtained based on the total air volume and the layout range of the IGBT module.

[0128] In one embodiment, the processor also implements the steps of the above-described 3D composite heat pipe radiator design method when executing a computer program.

[0129] Figure 7 An internal structural diagram of a computer device in one embodiment is shown. Specifically, this computer device may be... Figure 1 Terminal 110 (or server 120) in the system. For example... Figure 7 As shown, the computer device includes a processor, memory, network interface, input device, and display screen connected via a system bus. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores an operating system and may also store computer programs. When executed by the processor, these programs enable the processor to implement a 3D composite heat pipe radiator design method. The internal memory may also store computer programs, which, when executed by the processor, enable the processor to execute the 3D composite heat pipe radiator design method. The display screen can be an LCD screen or an e-ink screen. The input device can be a touch layer covering the display screen, buttons, a trackball, or a touchpad mounted on the computer device's casing, or an external keyboard, touchpad, or mouse.

[0130] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0131] Based on the actual situation of the IGBT module, obtain the design target for the surface temperature of the IGBT module;

[0132] Obtain the total loss of the IGBT module, and based on the total loss, obtain the total airflow of the 3D composite heat pipe radiator;

[0133] Based on the total airflow and the layout range of the IGBT module, the initial cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator are obtained.

[0134] Models of the IGBT module and the 3D composite heat pipe radiator are constructed, and CFD flow field and temperature field simulation calculations are performed on the IGBT module and the 3D composite heat pipe radiator model to obtain the surface temperature of the IGBT module and the operating point of the fan.

[0135] Based on the surface temperature of the IGBT module, the fan operating point, and the design target for the surface temperature of the IGBT module, determine whether the 3D composite heat pipe radiator meets the design requirements.

[0136] If the design requirements are not met, the cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator will be adjusted based on the total air volume and the layout range of the IGBT module.

[0137] In one embodiment, when the computer program is executed by the processor, it also implements the steps of the above-described 3D composite heat pipe radiator design method.

[0138] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0139] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A design method for a 3D composite heat pipe radiator, characterized in that, include: Based on the actual situation of the IGBT module, obtain the design target for the surface temperature of the IGBT module; Obtain the total loss of the IGBT module, and based on the total loss, obtain the total airflow of the 3D composite heat pipe radiator; Based on the total airflow and the layout range of the IGBT module, the initial cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator are obtained. A complete system thermal model is constructed, including an IGBT module model and a 3D composite heat pipe radiator model. CFD flow field and temperature field simulation calculations are performed on the complete system thermal model to obtain the surface temperature of the IGBT module and the fan operating point. Based on the surface temperature of the IGBT module, the fan operating point, and the design target for the surface temperature of the IGBT module, determine whether the 3D composite heat pipe radiator meets the design requirements. If the design requirements are not met, the cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator shall be adjusted based on the total air volume and the layout range of the IGBT module. The process of constructing the 3D composite heat pipe radiator model includes: The substrate of the 3D composite heat pipe radiator is equivalent to a horizontal planar heat pipe thermal resistance, the branch planar heat pipes of the 3D composite heat pipe radiator are equivalent to vertical planar heat pipe thermal resistance, and the heat exchange fins of the 3D composite heat pipe radiator are equivalent to heat exchange fin thermal resistance. Among them, multiple vertical planar heat pipe thermal resistances are connected in parallel, and the horizontal planar heat pipe thermal resistance, the multiple parallel vertical planar heat pipe thermal resistances, and the heat exchange fin thermal resistance are connected in series to form the 3D composite heat pipe radiator model. The construction of the overall system thermal model includes an IGBT module model and a 3D composite heat pipe radiator model. CFD simulation calculations of the flow field and temperature field are performed on the overall system thermal model to obtain the surface temperature of the IGBT module and the fan operating point, including: The thermal resistance of the 3D composite heat pipe radiator model is obtained according to the third formula, which includes: ； in, This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the thermal resistance of the horizontal planar heat pipe. This indicates the thermal resistance of the vertical planar heat pipe. This indicates the number of thermal resistances of the vertical planar heat pipes. This indicates the thermal resistance of the heat exchange fins; The substrate temperature of the 3D composite heat pipe radiator is obtained according to the fourth formula, wherein the substrate temperature of the 3D composite heat pipe radiator is the surface temperature of the IGBT module, and the fourth formula includes: ； in, This indicates the substrate temperature of the 3D composite heat pipe radiator. Indicates the ambient temperature. This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the heat transfer capacity of the 3D composite heat pipe radiator; The CFD flow field and temperature field of the IGBT module and the 3D composite heat pipe radiator model are simulated and calculated to obtain the fan operating point.

2. The 3D composite heat pipe radiator design method according to claim 1, characterized in that, The step of obtaining the design target for the surface temperature of the IGBT module based on the actual situation of the IGBT module includes: The design target for the surface temperature of the IGBT module is obtained according to a first formula, wherein the first formula includes: ； in, This indicates the design target for the surface temperature of the IGBT module. This indicates the maximum junction temperature of the IGBT module. This indicates the loss of the IGBT module. This indicates the junction-to-case thermal resistance of the IGBT module.

3. The 3D composite heat pipe radiator design method according to claim 1, characterized in that, The process of obtaining the total airflow of the 3D composite heat pipe radiator includes: The total airflow of the 3D composite heat pipe radiator is obtained according to a second formula, wherein the second formula includes: ； in, This represents the total loss of the IGBT module. This indicates the specific heat capacity of air at constant pressure. This indicates the density of the cooling air. This indicates the volumetric flow rate of the cooling air. The average air temperature difference between the radiator inlet and outlet is represented by the total air volume, and the volumetric flow rate of the cooling air is the total air volume.

4. The 3D composite heat pipe radiator design method according to claim 1, characterized in that, The thermal conductivity coefficients of the horizontal planar heat pipe are respectively αK x =30000-50000 w / m K , αK y = 180 w / m K The thermal conductivity coefficients of each part of the vertical planar heat pipe are respectively βK x =180 w / m K , βK y =30000-50000 w / m K The thermal conductivity of the heat exchange fins is γK= 180 w / m K .

5. The 3D composite heat pipe radiator design method according to claim 1, characterized in that, The step of determining whether the 3D composite heat pipe radiator meets the design requirements based on the surface temperature of the IGBT module, the fan operating point, and the design target for the surface temperature of the IGBT module includes: The substrate temperature of the 3D composite heat pipe radiator is compared with the design target surface temperature of the IGBT module to determine whether the substrate temperature of the 3D composite heat pipe radiator meets the requirements. Based on the layout range of the IGBT module, determine whether the fan operating point of the 3D composite heat pipe radiator meets the requirements.

6. The 3D composite heat pipe radiator design method according to claim 1, characterized in that, After determining whether the 3D composite heat pipe radiator meets the design requirements based on the surface temperature of the IGBT module, the fan operating point, and the design target for the surface temperature of the IGBT module, the process further includes: If the design requirements are met, the 3D composite heat pipe radiator will be further tested to verify its actual performance.

7. A 3D composite heat pipe radiator design device, characterized in that, The device includes: The design target acquisition module obtains the design target for the surface temperature of the IGBT module. The total airflow acquisition module acquires the total loss of the IGBT module and, based on the total loss, acquires the total airflow of the 3D composite heat pipe radiator. The first design module obtains the initial cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator based on the total air volume and the layout range of the IGBT module. The simulation calculation module constructs models of the IGBT module and the 3D composite heat pipe radiator, performs CFD flow field and temperature field simulation calculations on the IGBT module and the 3D composite heat pipe radiator models, and obtains the surface temperature of the IGBT module and the fan operating point. The process of constructing the 3D composite heat pipe radiator model includes: The substrate of the 3D composite heat pipe radiator is equivalent to a horizontal planar heat pipe thermal resistance, the branch planar heat pipes of the 3D composite heat pipe radiator are equivalent to vertical planar heat pipe thermal resistance, and the heat exchange fins of the 3D composite heat pipe radiator are equivalent to heat exchange fin thermal resistance. Among them, multiple vertical planar heat pipe thermal resistances are connected in parallel, and the horizontal planar heat pipe thermal resistance, the multiple parallel vertical planar heat pipe thermal resistances, and the heat exchange fin thermal resistance are connected in series to form the 3D composite heat pipe radiator model. The construction of the overall system thermal model includes an IGBT module model and a 3D composite heat pipe radiator model. CFD simulation calculations of the flow field and temperature field are performed on the overall system thermal model to obtain the surface temperature of the IGBT module and the fan operating point, including: The thermal resistance of the 3D composite heat pipe radiator model is obtained according to the third formula, which includes: ； in, This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the thermal resistance of the horizontal planar heat pipe. This indicates the thermal resistance of the vertical planar heat pipe. This indicates the number of thermal resistances of the vertical planar heat pipes. This indicates the thermal resistance of the heat exchange fins; The substrate temperature of the 3D composite heat pipe radiator is obtained according to the fourth formula, wherein the substrate temperature of the 3D composite heat pipe radiator is the surface temperature of the IGBT module, and the fourth formula includes: ； in, This indicates the substrate temperature of the 3D composite heat pipe radiator. Indicates the ambient temperature. This represents the thermal resistance of the 3D composite heat pipe radiator model. This indicates the heat transfer capacity of the 3D composite heat pipe radiator; The CFD flow field and temperature field of the IGBT module and the 3D composite heat pipe radiator model are simulated and calculated to obtain the fan operating point. The judgment module determines whether the 3D composite heat pipe radiator meets the design requirements based on the surface temperature of the IGBT module, the fan operating point, and the design target of the surface temperature of the IGBT module. If the design requirements are not met, the second design module will re-obtain the adjusted cross-sectional dimensions, fan type, and number of fans of the 3D composite heat pipe radiator based on the total air volume and the layout range of the IGBT module.

8. A computer-readable storage medium, characterized in that, The storage medium stores a computer program for executing the 3D composite heat pipe radiator design method according to any one of claims 1-6.

9. A computer device, characterized in that, The device includes a processor, a memory, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the 3D composite heat pipe radiator design method according to any one of claims 1-6.

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