Airborne stealth phased array antenna

Abstract

The application provides an airborne stealth phased array antenna, and relates to the technical field of antennas.The airborne stealth phased array antenna comprises an antenna circuit board, an antenna radiation unit, a beam forming chip, a mounting column, a structural member and a connecting member.The antenna radiation unit is attached to the front surface of the antenna circuit board.The beam forming chip is attached to the back surface of the antenna circuit board.The mounting column is embedded in the back surface of the antenna circuit board.The structural member is arranged on the side of the antenna circuit board away from the antenna radiation unit.The connecting member is mounted on the structural member and detachably connected with the mounting column.Compared with the prior art, the application avoids opening a groove or forming a protrusion on the front surface of the antenna circuit board, reduces the influence of RCS on stealth, and avoids the reliability problem caused by filling adhesive on the front surface in the conventional technology.Meanwhile, the connecting member is connected in a detachable manner, so that the connecting member can be directly removed during maintenance, thereby separating the structural member and the antenna circuit board, facilitating disassembly and assembly, and improving the maintainability.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and more specifically, to an airborne stealth phased array antenna. Background Technology

[0002] In recent local wars, stealth aircraft, appearing and disappearing without a trace, have moved freely on the battlefield, suffering almost no attacks from the enemy, achieving remarkable results. The key lies in the stealth effect of the aircraft itself. Airborne antennas must not only ensure the transmission and reception of electromagnetic signals within their own operating frequency band, but also ensure a low RCS (Radar Cross Section) impact on electromagnetic signals within the entire stealth operating frequency band. Reducing the impact of RCS on stealth is related to the structural design, installation, and material selection of airborne products.

[0003] Most existing phased array antennas are planar phased array antennas. These are typically installed by creating openings in the antenna array surface and fixing it to a structural component with screws. However, for antennas with special requirements, such as airborne stealth phased array antennas, the design requires that the array surface, except for the radiating elements, must not have any protrusions or grooves (to reduce the impact of RCS on stealth) to achieve the aircraft's stealth effect. Existing solutions to this problem mostly employ the following methods: Figure 1 As shown, after installation with countersunk screws, the groove is filled and smoothed with conductive adhesive. However, since the materials of the flat panel antenna PCB, screws and filler are different, they may fall off or crack after long-term use, which reduces its reliability and makes it difficult to maintain. The filler needs to be removed before disassembly and refilled after installation. Summary of the Invention

[0004] The objectives of this invention include, for example, providing an airborne stealth phased array antenna that can meet the requirements for reducing RCS while improving maintainability and reliability.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, the present invention provides an airborne stealth phased array antenna, comprising:

[0007] Antenna circuit board;

[0008] The antenna radiating element is attached to the front side of the antenna circuit board;

[0009] A beamforming chip is attached to the back of the antenna circuit board;

[0010] Mounting posts are embedded on the back of the antenna circuit board;

[0011] A structural component is disposed on the side of the antenna circuit board away from the antenna radiating element;

[0012] And a connector, which is installed on the structural member and detachably connected to the mounting post, so that the structural member and the antenna circuit board are fixed together.

[0013] In an optional embodiment, a soldering groove is provided on the back of the antenna circuit board, one end of the mounting post is fitted into the soldering groove, and the other end protrudes from the back of the antenna circuit board, and a connection hole is provided on the end face of the mounting post, and the connector is fitted into the connection hole.

[0014] In an optional embodiment, the welding groove is filled with soldering material and a solder layer is formed, which covers one end of the mounting post so that the mounting post is welded and fixed in the welding groove.

[0015] In an optional embodiment, a solder resist ring is also provided on the back side of the antenna circuit board. The solder resist ring is arranged around the solder groove to block the soldering material.

[0016] In an optional embodiment, a stop protrusion is further provided at one end of the mounting post that extends into the welding groove, and the width of the stop protrusion is greater than the width of the mounting post.

[0017] In an optional embodiment, the stop protrusion is rectangular, the mounting post is cylindrical, and the shape of the stop protrusion is adapted to the shape of the welding groove.

[0018] In an optional embodiment, the antenna circuit board includes a dielectric layer and a wiring layer embedded in the dielectric layer, the wiring layer being in electrical contact with the beamforming chip.

[0019] In an optional embodiment, a protective metal layer is provided at the periphery and bottom wall of the welding tank to separate the dielectric layer from the welding tank.

[0020] In an optional embodiment, an interface thermal conductive layer is further attached to the surface of the beamforming chip, and the interface thermal conductive layer is in contact with the surface of the structure to conduct the chip generated by the beamforming chip to the structure.

[0021] In an optional embodiment, the structural component includes an integrally formed structural plate and heat dissipation fins, one side of the structural plate is in contact with the interface thermal conductive layer, the heat dissipation fins are disposed on the other side of the structural plate, and the connector is mounted on the structural plate.

[0022] The beneficial effects of the embodiments of the present invention include, for example:

[0023] The airborne stealth phased array antenna provided in this invention comprises an antenna radiating element mounted on the front of an antenna circuit board and a beamforming chip mounted on the back of the circuit board, forming a phased array antenna. A mounting post is then embedded on the back of the circuit board, and a connector is used to detachably connect the structural components and the mounting post, thus fixing the structural components and the antenna circuit board as a single unit, completing the antenna assembly. Compared to existing technologies, this invention avoids creating grooves or protrusions on the front of the antenna circuit board by setting mounting posts on the back and using connectors to fix the structural components to the antenna circuit board, reducing the impact of RCS on stealth and solving the requirements of airborne phased array antenna installation on aircraft stealth RCS. It also avoids the reliability problems caused by front-side glue filling in conventional technologies. Furthermore, the detachable connection using connectors allows for direct removal of the connectors during maintenance, separating the structural components and the antenna circuit board, facilitating disassembly and assembly and improving maintainability. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a phased array antenna in the prior art.

[0026] Figure 2 This is a schematic diagram of the overall structure of an airborne stealth phased array antenna provided in an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the antenna circuit board in another embodiment of the present invention;

[0028] Figure 4 for Figure 2 A schematic diagram of the back structure of the antenna circuit board;

[0029] Figure 5 for Figure 2 A partial structural diagram of the central antenna circuit board;

[0030] Figure 6 This is an exploded structural diagram of an airborne stealth phased array antenna provided in an embodiment of the present invention;

[0031] Figure 7 for Figure 2 A schematic diagram of the structure of the centrally mounted column.

[0032] Icons: 100 - Airborne stealth phased array antenna; 110 - Antenna circuit board; 111 - Solder groove; 113 - Solder layer; 115 - Solder resist ring wall; 117 - Dielectric layer; 119 - Wiring layer; 130 - Antenna radiating element; 150 - Beamforming chip; 151 - Interface thermal conductive layer; 170 - Mounting post; 171 - Connection hole; 173 - Stop plate; 175 - Protective metal layer; 180 - Structural component; 181 - Structural plate; 183 - Heat sink fins; 190 - Connector. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0037] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0038] As disclosed in the background section, most existing phased array antennas are planar phased array antennas. The installation of planar phased array antennas typically involves opening holes in the antenna array surface and fixing the array surface to the structural components with screws, as shown below. Figure 1As shown. For antennas with special requirements, such as airborne stealth phased array antennas, the design requires that the array surface, apart from the radiating elements, must not have any other protrusions or grooves (to reduce the impact of RCS on stealth) to achieve the aircraft's stealth effect. Most existing technical solutions to this problem adopt the following methods. Figure 1 As shown, after installation with screws, the groove is filled and smoothed with conductive glue. However, since the materials of the flat panel antenna PCB, screws and filler are different, they may fall off or crack after long-term use, which reduces its reliability. At the same time, it is difficult to maintain. The filler needs to be removed before disassembly and refilled after installation.

[0039] Furthermore, existing technologies also include reducing the number of screws and omitting screws in the radiating element area. While this approach is feasible for small arrays, for large arrays, the reliability of the array cannot be guaranteed to meet usage requirements if screws are not used in the radiating element area. Alternatively, protruding parts can be ground smooth or countersunk screws can be used. However, grinding is time-consuming and labor-intensive, and cannot achieve complete flatness. Moreover, this method has a complex structure. Countersunk screws are usually standard parts with considerable thickness. When the antenna board is thin, it is impossible to pre-embed the screw head inside the PCB board. Therefore, this method is limited in its use and cannot meet universal installation requirements.

[0040] In other words, existing phased array antennas all need to be installed from the antenna radiating surface of the circuit board. Although the design can meet the airborne design requirements, it is an indirect way to meet the requirements and does not directly solve the problem. Therefore, the effect of reducing RCS is not ideal.

[0041] To address the aforementioned problems, this invention provides a novel airborne stealth phased array antenna 100. It should be noted that, without conflict, features in the embodiments of this invention can be combined with each other. Specific Implementation

[0043] See Figure 2 and Figure 3 This embodiment provides an airborne stealth phased array antenna 100, which avoids creating grooves or protrusions on the front of the antenna circuit board 110, reducing the impact of RCS on stealth and solving the requirements of airborne phased array antenna installation on aircraft stealth RCS, resulting in high reliability. Furthermore, it can be directly removed for maintenance, making disassembly and assembly convenient and improving maintainability. In addition, it meets the general usage requirements for the installation structure of the airborne stealth phased array antenna 100.

[0044] The airborne stealth phased array antenna 100 provided in this embodiment includes an antenna circuit board 110, an antenna radiating element 130, a beamforming chip 150 (Beamformer chip), a mounting post 170, a structural component 180, and a connector 190. The antenna radiating element 130 is attached to the front side of the antenna circuit board 110, the beamforming chip 150 is attached to the back side of the antenna circuit board 110, the mounting post 170 is embedded in the back side of the antenna circuit board 110, the structural component 180 is disposed on the side of the antenna circuit board 110 away from the antenna radiating element 130, and the connector 190 is installed on the structural component 180 and detachably connected to the mounting post 170 so that the structural component 180 and the antenna circuit board 110 are fixed together.

[0045] In this embodiment, a phased array antenna is constructed by attaching the antenna radiating element 130 to the front of the antenna circuit board 110 and the beamforming chip 150 to the back of the antenna circuit board 110. Then, the mounting post 170 is embedded in the back of the antenna circuit board 110, and the structural component 180 and the mounting post 170 are detachably connected using the connector 190, thereby fixing the structural component 180 and the antenna circuit board 110 as a single unit, completing the antenna assembly. This embodiment avoids creating grooves or protrusions on the front of the antenna circuit board 110 by setting the mounting post 170 on the back of the antenna circuit board 110 and using the connector 190 to fix the structural component 180 and the antenna circuit board 110, thus reducing the impact of RCS on stealth and solving the requirements of airborne phased array antenna installation on aircraft stealth RCS. It also avoids the reliability problems caused by front-side adhesive filling in conventional technologies. Meanwhile, the connector 190 is used for detachable connection, which allows the connector 190 to be directly removed during maintenance, thereby separating the structural component 180 and the antenna circuit board 110. This facilitates disassembly and assembly and improves its maintainability.

[0046] In this embodiment, the antenna radiating element 130 is mounted on the front side of the antenna circuit board 110. The entire front side of the antenna circuit board 110 has no groove structure, so that the front side of the antenna circuit board 110 has no groove or protrusion structure, which helps to reduce the RCS of the antenna. The structure and working principle of the antenna radiating element 130 and the beamforming chip 150 are consistent with the relevant structures on conventional phased array antennas, and will not be described in detail here.

[0047] In this embodiment, a soldering groove 111 is provided on the back side of the antenna circuit board 110. One end of the mounting post 170 is fitted into the soldering groove 111, and the other end protrudes from the back side of the antenna circuit board 110. A connection hole 171 is provided on the end face of the mounting post 170, and the connector 190 is fitted into the connection hole 171. Figure 6(As shown in the diagram). Specifically, the welding groove 111 does not penetrate the antenna circuit board 110, thereby avoiding leaving a groove on the front side of the antenna circuit board 110. Preferably, the depth of the welding groove 111 should be set to ensure the stable fixation of the mounting post 170, and the end of the mounting post 170 is fixed in the welding groove 111. By designing the welding groove 111 on the back side of the antenna circuit board 110 for welding installation, the impact of protrusions or grooves on the surface of the antenna radiating element 130 on aircraft stealth can be directly avoided, solving the requirements of installation and stealth.

[0048] It is worth noting that in this embodiment, the connector 190 includes screws, and the connecting hole 171 is a screw hole structure. The screw is assembled in the screw hole to achieve the connection and fixation between the structural component 180 and the mounting post 170. Specifically, the structural component 180 has a through hole, and the mounting post 170 passes through the through hole and is flush with the back of the structural component 180. The screw is pressed onto the back of the structural component 180 to achieve the installation limit of the structural component 180. In this embodiment, the fixation between the structural component 180 and the antenna circuit board 110 is achieved by screws. After the screws are tightened or loosened, no other treatment is required on the screw head or array surface, which optimizes the maintenance characteristics of the product.

[0049] In this embodiment, the soldering groove 111 is filled with soldering material, forming a solder layer 113. The solder layer 113 covers one end of the mounting post 170, thereby fixing the mounting post 170 in the soldering groove 111. Specifically, the mounting post 170 is fixed in the soldering groove 111 by soldering residual material. The mounting post 170 can be made of materials such as copper-plated stainless steel or brass, resulting in a better bonding effect with the antenna circuit board 110 during soldering. By filling the soldering groove 111 with soldering material and forming a solder layer 113, the soldering and fixing of the mounting post 170 can be better achieved, improving the fixing effect between the mounting post 170 and the antenna circuit board 110.

[0050] It should be noted that when assembling the mounting post 170, the mounting post 170 can be first inserted into the welding groove 111, and then soldering material can be injected for welding, thereby achieving fixation. In other preferred embodiments of the present invention, such as... Figure 4 As shown, during the fabrication of the antenna circuit board 110, the pre-designed mounting posts 170 can be directly pressed onto the inner layer of the PCB board during the PCB board processing and pressing process, thus eliminating the soldering step. Specifically, for example, a first layer of PCB material can be formed first, then the mounting posts 170 can be placed, and then a second layer of PCB material can be pressed onto it. The second layer of PCB material can directly make way for the mounting posts 170, thereby realizing the structure in which the mounting posts 170 are directly pressed into the antenna circuit board 110.

[0051] In this embodiment, a stop protrusion 173 is also provided at one end of the mounting post 170 that extends into the welding groove 111. The width of the stop protrusion 173 is greater than the width of the mounting post 170. Specifically, the stop protrusion 173 and the mounting post 170 are an integral structure. The stop protrusion 173 serves as the welding base of the mounting post 170, forming a stepped structure with the mounting post 170. The stop protrusion is completely covered in the solder layer 113, thereby significantly increasing the welding area and further improving the welding and fixing effect of the mounting post 170. In addition, the stop protrusion 173 can also increase the bearing area, making the solder material distribution in the bottom bearing area of ​​the mounting post 170 more uniform, ensuring the verticality of the mounting post 170, and facilitating the alignment and connection of the connector 190.

[0052] In this embodiment, the stop protrusion 173 is rectangular, and the mounting post 170 is cylindrical. The shape of the stop protrusion 173 is adapted to the shape of the welding groove 111. Specifically, the welding groove 111 can also be rectangular, and the shape of the stop protrusion 173 can be adapted to the shape of the welding groove 111. Preferably, the diagonal width of the stop protrusion 173 is greater than the side width of the welding groove 111, thereby preventing the stop protrusion 173 from rotating within the welding groove 111 and ensuring that the mounting post 170 has a certain orientation when placed in the welding groove 111. Of course, the shapes of the stop protrusion 173 and the welding groove 111 here are merely illustrative. In other preferred embodiments of the present invention, the shapes of the stop protrusion 173 and the welding groove 111 can also be pentagonal or hexagonal, etc., and are not specifically limited here.

[0053] It should be noted that the stop cam 173 here adopts an irregular shape design to ensure the positional accuracy and flatness of the mounting post 170.

[0054] In some embodiments, such as Figure 5 As shown, a solder resist ring 115 is also raised on the back of the antenna circuit board 110. The solder resist ring 115 surrounds the soldering groove 111 and is used to block soldering material. Specifically, the solder resist ring 115 can be made of metal and integrally formed on the back of the antenna circuit board 110. By setting the solder resist ring 115, it is possible to prevent solder from spreading from the soldering groove 111 to the surrounding areas during the soldering process, thus avoiding damage to the antenna circuit board 110 or the beamforming chip 150.

[0055] See Figure 6 and Figure 7In this embodiment, the antenna circuit board 110 includes a dielectric layer 117 and a wiring layer 119 embedded in the dielectric layer 117. The wiring layer 119 is in electrical contact with the beamforming chip 150. Specifically, the wiring layer 119 can be a PCB copper layer, and its wiring principle is the same as that of a conventional PCB board, which will not be described in detail here. The PCB copper layer can be multi-layered, and each beamforming chip 150 is provided with a copper pillar at a corresponding position. The copper pillars can connect the multi-layer PCB copper layers together, thereby realizing electrical series connection.

[0056] In this embodiment, a protective metal layer 175 is provided on the periphery and bottom wall of the welding groove 111 to separate the dielectric layer 117 from the welding groove 111. Specifically, the protective metal layer 175 can also be a copper layer. When fabricating the antenna circuit board 110, the welding groove 111 has a copper layer structure on all four sides and the bottom surface. That is, the internal space of the welding groove 111 is separated from the dielectric layer 117 by a copper layer, so that the inner surface of the welding groove 111 is a copper layer. The copper layer has good wettability, which allows the welding material to be better fixed in the welding groove 111, improving the welding effect of the mounting post 170. By setting the protective metal layer 175, on the one hand, the bonding force between the solder layer 113 and the surface of the welding groove 111 can be enhanced, so that the mounting post 170 can be fixed. On the other hand, the high temperature generated during welding can be prevented from directly affecting the dielectric layer 117, ensuring the structural stability of the welding groove 111.

[0057] It should be noted that in this embodiment, the copper layer at the side wall of the welding groove 111 is horizontally pressed together with the PCB copper layer, that is, the PCB copper layer and the PCB dielectric layer 117 are cross-pressed and welded by soldering material, which makes the reliability of the mounting post 170 higher.

[0058] In this embodiment, an interface thermal conductive layer 151 is also attached to the surface of the beamforming chip 150. The interface thermal conductive layer 151 is in contact with the surface of the structural component 180 to conduct the heat generated by the beamforming chip 150 to the structural component 180. Specifically, under the compression of the screws, the structural component 180 can be held against the surface of the interface thermal conductive layer 151, and the heat generated by the beamforming chip 150 can be transferred to the structural component 180 through the interface thermal conductive layer 151 to achieve heat dissipation.

[0059] In this embodiment, the structural component 180 includes an integrally formed structural plate 181 and heat dissipation fins 183. One side of the structural plate 181 is in contact with the interface thermal conductive layer 151, and the heat dissipation fins 183 are disposed on the other side of the structural plate 181. The connector 190 is mounted on the structural plate 181. Specifically, the structural component 180 can be made of a metal or non-metal material with good thermal conductivity, such as aluminum or copper. By providing heat dissipation fins 183, the heat dissipation area can be further increased, thereby improving the heat dissipation effect of the structural component 180.

[0060] In summary, this embodiment provides an airborne stealth phased array antenna 100. By attaching the antenna radiating element 130 to the front of the antenna circuit board 110 and the beamforming chip 150 to the back of the antenna circuit board 110, a phased array antenna is formed. Then, the mounting post 170 is embedded in the back of the antenna circuit board 110, and the structural component 180 and the mounting post 170 are detachably connected using a connector 190, thereby fixing the structural component 180 and the antenna circuit board 110 as a single unit, completing the antenna assembly. Compared to existing technologies, this embodiment, by providing the mounting post 170 on the back of the antenna circuit board 110 and using the connector 190 to fix the structural component 180 and the antenna circuit board 110, avoids creating grooves or protrusions on the front of the antenna circuit board 110, reducing the impact of RCS on stealth, solving the requirements of airborne phased array antenna installation on aircraft stealth RCS, and avoiding the reliability problems caused by front-side glue filling in conventional technologies. Meanwhile, the connector 190 is used for detachable connection, allowing for direct removal of the connector 190 during maintenance, thereby separating the structural component 180 and the antenna circuit board 110. This facilitates disassembly and assembly, improving maintainability. Furthermore, the rear-mounted design is applicable to any type of antenna circuit board 110, offering better versatility.

[0061] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An airborne stealth phased array antenna, characterized in that, include: Antenna circuit board; The antenna radiating element is attached to the front side of the antenna circuit board; A beamforming chip is attached to the back of the antenna circuit board; Mounting posts are embedded on the back of the antenna circuit board; A structural component is disposed on the side of the antenna circuit board away from the antenna radiating element; And a connector, which is installed on the structural member and detachably connected to the mounting post, so that the structural member and the antenna circuit board are fixed together as one unit; The antenna circuit board has a soldering groove on its back side. One end of the mounting post is fitted into the soldering groove, and the other end protrudes from the back side of the antenna circuit board. The end face of the mounting post has a connection hole, and the connector is fitted into the connection hole.

2. The airborne stealth phased array antenna according to claim 1, characterized in that, The welding groove is filled with soldering material and a solder layer is formed. The solder layer covers one end of the mounting post so that the mounting post is welded and fixed in the welding groove.

3. The airborne stealth phased array antenna according to claim 2, characterized in that, The back of the antenna circuit board is also provided with a raised solder resist ring wall, which surrounds the solder groove to block the soldering material.

4. The airborne stealth phased array antenna according to claim 1 or 2, characterized in that, The end of the mounting post that extends into the welding groove is also provided with a stop protrusion, the width of which is greater than the width of the mounting post.

5. The airborne stealth phased array antenna according to claim 4, characterized in that, The stop protrusion is rectangular, the mounting post is cylindrical, and the shape of the stop protrusion is adapted to the shape of the welding groove.

6. The airborne stealth phased array antenna according to claim 1 or 2, characterized in that, The antenna circuit board includes a dielectric layer and a wiring layer embedded in the dielectric layer, and the wiring layer is in electrical contact with the beamforming chip.

7. The airborne stealth phased array antenna according to claim 6, characterized in that, The periphery and bottom wall of the welding tank are provided with a protective metal layer to separate the medium layer from the welding tank.

8. The airborne stealth phased array antenna according to claim 1, characterized in that, The surface of the beamforming chip is also attached with an interface thermal conductive layer, which is in contact with the surface of the structure to conduct the chip generated by the beamforming chip to the structure.

9. The airborne stealth phased array antenna according to claim 8, characterized in that, The structural component includes an integrally formed structural plate and heat dissipation fins. One side of the structural plate is in contact with the interface thermal conductive layer, the heat dissipation fins are disposed on the other side of the structural plate, and the connector is mounted on the structural plate.

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