Pixel sounding unit and manufacturing method thereof, digital sounding chip

Abstract

The application discloses a pixel sound unit, a manufacturing method thereof and a digital sound chip, and is applied to the technical field of the digital sound chip, so as to solve the problem of low working frequency of a loudspeaker diaphragm. The pixel sound unit comprises a vibrating plate, an electrode plate and an air back cavity. The vibrating plate is divided into a plurality of sub-vibration regions. Each sub-vibration region is respectively etched with a sub-diaphragm. The vibrating plate, the electrode plate and the air back cavity are sequentially arranged. The plurality of sub-vibration regions share one electrode plate and the air back cavity. The digital sound chip comprises the pixel sound unit. The manufacturing method of the pixel sound unit adopts the pixel sound unit.

Description

Technical Field

[0001] This invention relates to the field of digital sound chip technology, and in particular to a pixel sound unit and its manufacturing method, and a digital sound chip. Background Technology

[0002] A loudspeaker is a transducer that converts electrical signals into sound signals. Loudspeakers are fundamental to the manufacture of audio equipment and active acoustic noise reduction devices; therefore, their performance has a crucial impact on the production of acoustic devices. MEMS loudspeakers (Micro Electro Mechanical Systems) offer advantages over traditional voice coil loudspeakers, including better consistency, lower power consumption, smaller size, and lower price.

[0003] Currently, commonly used MEMS loudspeakers simulate sound by moving a diaphragm to push air. Typically, the diaphragm inside a MEMS loudspeaker is a single piece of membrane structure. With this structure, sound can be produced by moving a single piece of diaphragm. However, this type of diaphragm has a low resonant frequency and poor working efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a pixel-based sound-generating unit and its manufacturing method, as well as a digital sound-generating chip, to improve the resonant frequency and working efficiency of the diaphragm.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A pixel-based sound-emitting unit, comprising:

[0007] The vibrating plate is divided into multiple sub-vibration regions, and each sub-vibration region is etched with a sub-diaphragm.

[0008] Electrode plates;

[0009] The air rear chamber, the vibration plate, the electrode plate, and the air rear chamber are arranged in sequence, and multiple sub-vibration regions share one electrode plate and one air rear chamber.

[0010] Compared with the prior art, the pixel sound-generating unit provided by the present invention has a vibrating plate divided into multiple sub-vibration regions, each of which is etched with a sub-diaphragm. By dividing the existing single diaphragm into multiple sub-diaphragms, the resonant frequency of the sub-diaphragms can be increased, thereby increasing the operating frequency of the sub-diaphragms, increasing the upper limit of the sub-diaphragm's sound emission frequency and increasing the sound pressure level, reducing distortion and increasing sensitivity, and thus improving the sound emission effect of the pixel sound-generating unit. At the same time, multiple sub-vibration regions share an electrode plate and an air cavity, which can optimize the structure of the pixel sound-generating unit, making the structure of the pixel sound-generating unit simpler and easier to install and process.

[0011] Optionally, in the aforementioned pixel-based sound-generating unit, the vibrating plate consists of at least two sub-vibration regions of equal area, and multiple sub-vibration regions are arranged in an array, with each sub-vibration region having a sub-diaphragm of the same size. This configuration optimizes the number of sub-vibration regions and improves the resonant frequency and operating frequency of the sub-diaphragms.

[0012] Optionally, the pixel sound-generating unit also includes a substrate, an electrode plate and a vibrating plate stacked in sequence, the substrate having an opening, and the structure between the side of the sub-diaphragm of the vibrating plate facing the electrode plate and the bottom of the opening forming an air back cavity.

[0013] The substrate contains support pillars for supporting the electrode plate. This design improves the mounting stability of the electrode plate by supporting it with the support pillars, thereby enhancing the overall stability of the pixel-based sound-generating unit.

[0014] Optionally, in the aforementioned pixel sound-emitting unit, each sub-vibration region is provided with at least two sub-segmentation slots arranged in a surrounding pattern. In adjacent sub-segmentation slots, the ends of one slot and the other slot are sequentially arranged along a ray extending outward from the center point of the sub-vibration region, overlapping in the surrounding pattern direction. A sub-diaphragm cantilever structure is formed between the overlapping sub-segmentation slots. The sub-segmentation slots divide the sub-vibration region into a sub-diaphragm located within the enclosing area of ​​the sub-segmentation slot and a sub-fixed portion located outside the enclosing area of ​​the sub-segmentation slot. The sub-diaphragm and the sub-fixed portion are elastically connected by the sub-diaphragm cantilever structure, and the sub-diaphragm, sub-fixed portion, and sub-diaphragm cantilever structure are an integrated structure. This arrangement increases the length of the sub-diaphragm cantilever structure between adjacent sub-segmentation slots when two adjacent sub-segmentation slots overlap, resulting in a larger vibration range for the sub-diaphragm and ensuring that the sub-diaphragm can elastically vibrate in a direction perpendicular to its outer surface.

[0015] Optionally, in the above-mentioned pixel sound-generating unit, the vibrating plate has multiple first dividing grooves, multiple second dividing grooves, and multiple connecting dividing grooves;

[0016] Each sub-vibration region has four first dividing grooves arranged in a ring, and the four first dividing grooves form a sub-diaphragm;

[0017] Multiple second dividing grooves form a ring structure, with the first dividing groove located inside the ring structure and the second dividing groove located outside both the first dividing groove in front and the first dividing groove behind it.

[0018] The first segmentation slots of two adjacent sub-vibration regions are connected by two parallel connecting segmentation slots. This arrangement optimizes the shape of the sub-segmentation slots, enabling the formation of a sub-diaphragm cantilever structure that meets design requirements.

[0019] Optionally, the pixel-based sound-generating unit also includes a spacer, which forms a gap between the electrode plate and the vibrating plate. This arrangement ensures that a planar capacitor can be formed between the electrode plate and the vibrating plate, allowing the sub-diaphragm to vibrate under the influence of the electric field formed by the electrode plate and the vibrating plate.

[0020] Optionally, in the aforementioned pixel-based sound-generating unit, the spacer is made of an insulating material. This arrangement further ensures that a parallel capacitance can be formed between the vibrating plate and the electrode plate.

[0021] The present invention also provides a digital sound chip, comprising pixel sound units as provided in any of the above claims, wherein the number of pixel sound units is multiple and they are arranged in an array or in a linear distribution.

[0022] Compared with the prior art, the beneficial effects of the digital sound chip provided by the present invention are the same as those of the pixel sound unit provided by the above-mentioned technical solutions, and will not be repeated here.

[0023] The present invention also provides a method for manufacturing a pixel sound-emitting unit, using a pixel sound-emitting unit as provided in any of the above claims, wherein the number of pixel sound-emitting units is multiple, and the manufacturing method includes:

[0024] Multiple sub-vibration regions are divided on the vibrating plate of the pixel sound-generating unit.

[0025] Sub-diaphragms are formed by etching on each sub-vibration region.

[0026] Compared with the prior art, the beneficial effects of the manufacturing method of the pixel sound unit provided by the present invention are the same as those of the pixel sound unit provided by the above-mentioned technical solutions, and will not be repeated here.

[0027] Optionally, in the above-described method for manufacturing the pixel-based sound unit, etching a sub-diaphragm on each sub-vibration region includes:

[0028] Sub-segmentation grooves are etched on each sub-vibration region to form a sub-diaphragm located within the enclosure area of ​​the sub-segmentation groove, a sub-fixed part located outside the enclosure area of ​​the sub-segmentation groove, and a sub-diaphragm cantilever structure connecting the sub-diaphragm and the sub-fixed part on each sub-vibration region.

[0029] Before the step of etching sub-segmentation grooves on each sub-vibration region, the method further includes:

[0030] Establish a stiffness model for the sub-diaphragm, and design the number and size of the sub-diaphragm cantilever structure based on the stiffness model.

[0031] Based on the number and size of the sub-diaphragm cantilever structures, the size of the sub-segmentation slots is designed. This configuration, by designing the number and size of the sub-diaphragm cantilever structures, ensures that the stiffness of the sub-diaphragms is the same as the stiffness of the diaphragm when a single diaphragm is formed on the vibrating plate. Attached Figure Description

[0032] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0033] Figure 1 This is a schematic diagram of the pixel sound-emitting unit in an embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of the vibrating plate in an embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of a digital sound-generating chip in an embodiment of the present invention.

[0036] Figure label:

[0037] 1-Base, 2-Electrode plate, 21-Through hole, 3-Spacer, 4-Vibration plate, 41-Sub-fixing part, 42-Sub-diaphragm cantilever structure, 43-Sub-diaphragm, 44-Sub-segmentation groove, 5-Support column, 6-Air rear cavity. Detailed Implementation

[0038] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0039] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0041] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0043] Please see Figure 1 and Figure 2 The pixel sound generation unit provided in this embodiment of the invention includes a vibrating plate 4, an electrode plate 2, and an air cavity 6. The vibrating plate 4 is divided into multiple sub-vibration regions, and each sub-vibration region is etched with a sub-diaphragm 43. The vibrating plate 4, the electrode plate 2, and the air cavity 6 are arranged in sequence, and multiple sub-vibration regions share one electrode plate 2 and one air cavity 6.

[0044] Compared with the prior art, the pixel sound-generating unit provided by the present invention has a vibrating plate 4 divided into multiple sub-vibration regions, each of which is etched with a sub-diaphragm 43. By dividing the existing single diaphragm into multiple sub-diaphragms 43, the resonant frequency of the sub-diaphragms 43 can be increased, thereby increasing the operating frequency of the sub-diaphragms 43, increasing the upper limit of the sound emission frequency of the sub-diaphragms 43 and increasing the sound pressure level of the sound emission, reducing distortion and increasing sensitivity, and thus improving the sound emission effect of the pixel sound-generating unit. At the same time, multiple sub-vibration regions share an electrode plate 2 and an air cavity 6, which can optimize the structure of the pixel sound-generating unit, making the structure of the pixel sound-generating unit simpler and easier to install and process.

[0045] The vibrating plate 4 consists of at least two sub-vibrating regions of equal area, arranged in an array, with each sub-vibrating region having a sub-diaphragm 43 of identical size. For example, the vibrating plate 4 may consist of four sub-vibrating regions of equal area, arranged in a two-row, two-column array. This structure optimizes the number of sub-vibrating regions, enabling sound generation through the vibration of multiple sub-diaphragms 43, thereby increasing the resonant frequency and operating frequency of the sub-diaphragms 43.

[0046] like Figure 1 and Figure 2As shown, the pixel sound-generating unit also includes a base 1, an electrode plate 2, and a vibrating plate 4 stacked sequentially. The base 1 has an opening, and the structure between the side of the sub-diaphragm 43 of the vibrating plate 4 facing the electrode plate 2 and the bottom of the opening forms an air cavity 6. A support column 5 is provided inside the base 1 to support the electrode plate 2. With this structure, the structure between the side of the sub-diaphragm 43 of the vibrating plate 4 facing the electrode plate 2 and the bottom of the opening forms an air cavity 6, allowing the sub-diaphragm 43 to move and push air to achieve simulated sound generation. The electrode plate 2 has an array of through holes 21 corresponding to the position of the air cavity 6, so that the air cavity 6 is connected to the air between the electrode plate 2 and the vibrating plate 4. At the same time, the support column 5 can improve the installation stability of the electrode plate 2, thereby improving the overall stability of the pixel sound-generating unit.

[0047] like Figure 1 and Figure 2 As shown, each sub-vibration region is provided with at least two sub-segmenting grooves 44 arranged in a surrounding manner. In adjacent sub-segmenting grooves 44, the ends of one groove and the other are sequentially arranged along a ray extending outward from the center point of the sub-vibration region, forming an overlap in the surrounding arrangement direction. A sub-diaphragm cantilever structure 42 is formed between the overlapping sub-segmenting grooves 44. The sub-segmenting grooves 44 divide the sub-vibration region into sub-diaphragms 43 located within the surrounding area of ​​the sub-segmenting groove 44 and sub-fixing parts 41 located outside the surrounding area of ​​the sub-segmenting groove 44. The sub-diaphragms 43 and sub-fixing parts 41 are elastically connected by the sub-diaphragm cantilever structure 42, and the sub-diaphragms 43, sub-fixing parts 41, and sub-diaphragm cantilever structure 42 are an integrated structure. The stiffness of the sub-diaphragms 43 is the same as the set stiffness of the diaphragm when a single diaphragm is formed on the vibrating plate 4, and the sum of the masses of the multiple sub-diaphragms 43 is less than the set mass of the diaphragm when a single diaphragm is formed on the vibrating plate 4. For example, the substrate 1 is a silicon substrate, the vibrating plate 4 is made of silicon material, and the pixel sound generation unit is preferably a MEMS speaker. MEMS speakers (Micro ElectroMechanical System) have advantages over traditional voice coil speakers, such as good consistency, low power consumption, small size, and low price.

[0048] It should be understood that at least two sub-segmentation grooves 44 divide the vibrating plate 4 into a sub-diaphragm 43 located within the enclosure area of ​​the sub-segmentation grooves 44, a sub-fixed part 41 located outside the enclosure area of ​​the sub-segmentation grooves 44, and a sub-diaphragm cantilever structure 42 connecting the sub-diaphragm 43 and the sub-fixed part 41. That is, the sub-segmentation grooves 44 are open on both sides in a direction perpendicular to the outer surface of the vibrating plate 4, so as to divide the vibrating plate 4 into a sub-diaphragm 43 that is separate from the sub-fixed part 41. The sub-segmentation grooves 44 divide the vibrating plate 4 into three parts: the sub-diaphragm 43, the sub-diaphragm cantilever structure 42, and the sub-fixed part 41. The sub-diaphragm 43 is connected to the sub-fixed part 41 through the sub-diaphragm cantilever structure 42. The arrangement of at least two sub-segmentation grooves 44 means that at least two sub-segmentation grooves 44 are arranged around the diaphragm and surround the sub-diaphragm 43.

[0049] With this structure, the vibrating plate 4 has multiple sub-vibration regions. By etching sub-segmentation grooves 44 on each sub-vibration region, the existing monolithic diaphragm can be divided into multiple sub-diaphragms 43. At this time, according to the sub-diaphragm resonant frequency model mentioned above, it can be concluded that when the stiffness of the sub-diaphragm 43 is the same as the set stiffness of the diaphragm when the monolithic diaphragm is formed on the vibrating plate 4, and the mass of the sub-diaphragm 43 is less than the set mass of the diaphragm when the monolithic diaphragm is formed on the vibrating plate 4, the resonant frequency of the sub-diaphragm 43 can be increased, thereby increasing the operating frequency of the sub-diaphragm 43, increasing the upper limit of the sound emission frequency of the sub-diaphragm 43, increasing the sound pressure level of the sound emission, reducing distortion, and increasing sensitivity. At the same time, sub-diaphragms 43 with high resonant frequencies are provided on multiple sub-vibration regions, and sound can be superimposed through multiple sub-diaphragms 43 to further improve the sound emission effect of the pixel sound unit. In addition, the diaphragm, fixing part and diaphragm cantilever structure are integrated, which makes the pixel sound unit structure simple and easy to install. By processing the dividing groove on the vibrating plate 4 to form the diaphragm cantilever structure and diaphragm, the production and processing of the diaphragm cantilever structure and diaphragm are more convenient, which in turn makes the production and processing of the pixel sound unit more convenient. When two adjacent dividing grooves overlap, the length of the diaphragm cantilever structure located between the two adjacent dividing grooves can be increased, so that the vibration range of the diaphragm is larger, ensuring that the diaphragm can vibrate elastically in a direction perpendicular to its outer surface.

[0050] like Figure 1 , Figure 2 and Figure 3As shown, the vibrating plate 4 has multiple first dividing grooves, multiple second dividing grooves, and multiple connecting dividing grooves. Each sub-vibration region has four first dividing grooves arranged in a ring, forming a sub-diaphragm 43. Multiple second dividing grooves form a ring structure, with the first dividing grooves located inside the ring structure and the second dividing grooves located outside both their adjacent first dividing grooves. The first dividing grooves of two adjacent sub-vibration regions are connected by two parallel connecting dividing grooves. This structure improves the integrity of the sub-diaphragms 43, resulting in better sound production of the pixel sound unit.

[0051] like Figure 1 As shown, the pixel sound-emitting unit also includes a spacer 3, with a gap formed between the electrode plate 2 and the vibrating plate 4 via the spacer 3. This arrangement ensures that a planar capacitor can be formed between the electrode plate 2 and the vibrating plate 4, allowing the sub-diaphragm 43 to vibrate under the electric field formed by the electrode plate 2 and the vibrating plate 4. For example, the gap between the electrode plate 2 and the vibrating plate 4 via the spacer 3 allows a planar capacitor to be formed between them, thereby enabling the sub-diaphragm 43 to vibrate under the electric field formed by the electrode plate 2 and the vibrating plate 4; the through hole 21 can be a circular hole, an elongated hole, or a square hole.

[0052] In use, the electrode plate 2 and the vibrating plate 4 are energized to generate an electric field. Under the action of the electric field, the sub-diaphragm 43 can vibrate relative to the sub-fixed part 41 to realize sound transmission, so that the pixel sound unit can work normally. In this embodiment, the pixel sound unit is a capacitor speaker composed of the electrode plate 2 and the vibrating plate 4. Compared with the dynamic coil speaker in the prior art, the pixel sound unit in this embodiment has a simple structure, high sound quality and good sound effect. The sub-diaphragm 43 has a high resonant frequency, which improves the acoustic performance of the pixel sound unit. The gap between the electrode plate 2 and the vibrating plate 4 can form air damping between the electrode plate 2 and the vibrating plate 4, ensuring that the electrode plate 2 and the vibrating plate 4 can form a planar capacitor to control the movement of the sub-diaphragm 43.

[0053] Of course, the pixel sound unit may also be without electrode plate 2, and the vibration of vibrating plate 4 can be achieved by piezoelectric drive.

[0054] In some embodiments, the spacer 3 is made of an insulating material. For example, the spacer 3 can be silicon dioxide. The spacer 3 can support the vibrating plate 4, ensuring that a gap is formed between the electrode plate 2 and the vibrating plate 4, while preventing electrical conductivity between the electrode plate 2 and the vibrating plate 4, so that a parallel capacitor can be formed between the vibrating plate 4 and the electrode plate 2.

[0055] like Figure 3As shown, this embodiment of the invention also provides a digital sound chip, including pixel sound units as provided in the above embodiments. The number of pixel sound units is multiple, and they are arranged in an array or a linear distribution. Each pixel sound unit can independently control audio and volume. By matching multiple pixel sound units with each other, digital control of sound can be achieved. In this embodiment, the distribution structure of the multiple pixel sound units is not limited to an array or linear distribution; other distribution structures can also be used.

[0056] Compared with the prior art, the digital sound chip provided in this embodiment of the invention can achieve consistent sound energy pulse output by using multiple array-distributed or linearly distributed pixel sound units, thereby improving the sound pressure level of the digital sound chip and significantly optimizing the acoustic distortion and other performance characteristics of the digital sound chip.

[0057] The present invention also provides a method for manufacturing a pixel sound-emitting unit, using a pixel sound-emitting unit as provided in any of the above claims, wherein the number of pixel sound-emitting units is multiple, and the manufacturing method includes:

[0058] Multiple sub-vibration regions are divided on the vibrating plate 4 of the pixel sound-generating unit.

[0059] Sub-diaphragms 43 are formed by etching on each sub-vibration region.

[0060] Compared with the prior art, in the manufacturing method of the pixel sound unit provided by the present invention, the vibrating plate 4 has multiple sub-vibration regions. By etching sub-segmentation grooves 44 on each sub-vibration region, the existing monolithic diaphragm can be divided into multiple sub-diaphragms 43. At this time, according to the above-mentioned sub-diaphragm resonant frequency model, it can be concluded that when the stiffness of the sub-diaphragm 43 is the same as the set stiffness of the diaphragm when the monolithic diaphragm is formed on the vibrating plate 4, and the mass of the sub-diaphragm 43 is less than the set mass of the diaphragm when the monolithic diaphragm is formed on the vibrating plate 4, the resonant frequency of the sub-diaphragm 43 can be increased, thereby increasing the operating frequency of the sub-diaphragm 43, increasing the upper limit of the sound emission frequency of the sub-diaphragm 43 and increasing the sound pressure level of the sound emission, reducing distortion and increasing sensitivity. At the same time, sub-diaphragms 43 with high resonant frequencies are provided on multiple sub-vibration regions, and sound can be superimposed through multiple sub-diaphragms 43 to further improve the sound emission effect of the pixel sound unit.

[0061] Specifically, the manufacturing method includes dividing the vibrating plate 4 into multiple sub-vibration regions; establishing a sub-diaphragm resonant frequency model; designing the dimensions of the sub-diaphragm 43 based on the sub-diaphragm resonant frequency model to ensure that the stiffness of the sub-diaphragm 43 is the same as the set stiffness of the diaphragm when a whole diaphragm is formed on the vibrating plate 4; and evenly distributing the set diaphragm mass of the multiple sub-diaphragms 43 when a whole diaphragm is formed on the vibrating plate 4; and etching the sub-diaphragm 43 in each sub-vibration region according to the designed dimensions of the sub-diaphragm 43.

[0062] The sub-diaphragm resonant frequency model is as follows:

[0063]

[0064] Where f0 is the resonant frequency of the sub-diaphragm 43, k is the stiffness of the sub-diaphragm 43, and m is the mass of the sub-diaphragm 43.

[0065] For example, the diaphragm stiffness set when a single diaphragm is formed on the vibrating plate 4 refers to the stiffness value of the entire diaphragm when the diaphragm on the vibrating plate 4 is a single piece of diaphragm. This set diaphragm stiffness is a known specific value that can be directly derived from the diaphragm's size, material, and the dimensions of the diaphragm cantilever structure. The diaphragm mass set when a single diaphragm is formed on the vibrating plate 4 refers to the mass value of the entire diaphragm when the diaphragm on the vibrating plate 4 is a single piece of diaphragm. This set mass is a known specific value that can be directly derived from the diaphragm's volume and material density.

[0066] In some embodiments, etching to form a sub-diaphragm 43 on each sub-vibration region includes:

[0067] Sub-segmentation grooves 44 are etched on each sub-vibration region to form a sub-diaphragm 43 located within the enclosure area of ​​the sub-segmentation groove 44, a sub-fixing part 41 located outside the enclosure area of ​​the sub-segmentation groove 44, and a sub-diaphragm cantilever structure 42 connecting the sub-diaphragm 43 and the sub-fixing part 41 on each sub-vibration region.

[0068] Before the step of etching sub-segmentation grooves 44 on each sub-vibration region, the method further includes:

[0069] Establish a stiffness model for the sub-diaphragm 43, and design the number and size of the sub-diaphragm cantilever structure 42 based on the stiffness model of the sub-diaphragm 43.

[0070] Based on the number and size of the sub-diaphragm cantilever structures 42, the size of the sub-segmentation grooves 44 is designed. In this way, by designing the number and size of the sub-diaphragm cantilever structures 42, the stiffness of the sub-diaphragm 43 is ensured to be the same as the diaphragm stiffness when a whole diaphragm is formed on the vibrating plate 4.

[0071] Specifically, the stiffness model of the sub-diaphragm 43 is as follows:

[0072]

[0073] Where k is the stiffness of the sub-diaphragm 43, N is the number of sub-diaphragms 43, E is the Young's modulus of the sub-diaphragm 43, and b w The width of the sub-diaphragm cantilever structure 42 is in meters. t b is the thickness of the sub-diaphragm 43l The length of the sub-diaphragm cantilever structure 42 is given. Using this method, as can be seen from the stiffness model of the sub-diaphragm 43 described above, when the number of sub-diaphragms 43 increases, the stiffness of the sub-diaphragm 43 can be ensured to be the same as the diaphragm stiffness set when a whole diaphragm is formed on the vibrating plate 4 by changing the length and width of the sub-diaphragm cantilever structure 42. Furthermore, using this stiffness model of the sub-diaphragm 43, the number and size of the sub-diaphragm cantilever structure 42 can be accurately calculated to ensure that the stiffness of the sub-diaphragm 43 is the same as the diaphragm stiffness set when a whole diaphragm is formed on the vibrating plate 4.

[0074] Example 1: Four sub-vibration regions are divided on the vibrating plate 4; sub-segmentation grooves 44 are etched on each sub-vibration region to form a sub-diaphragm 43 within the enclosure area of ​​the sub-segmentation groove 44, a sub-fixing part 41 outside the enclosure area of ​​the sub-segmentation groove 44, and a sub-diaphragm cantilever structure 42 connecting the sub-diaphragm 43 and the sub-fixing part 41. The stiffness of the sub-diaphragm 43 is ensured to be the same as the stiffness of the diaphragm when a whole diaphragm is formed on the vibrating plate 4, and the mass of the sub-diaphragm 43 is less than the mass of the diaphragm when a whole diaphragm is formed on the vibrating plate 4. The stiffness of the diaphragm when a whole diaphragm is formed on the vibrating plate 4 and the stiffness of the sub-diaphragm 43 can both be obtained from the sub-diaphragm stiffness model, which is as follows:

[0075]

[0076] Where k is the stiffness of the sub-diaphragm 43, N is the number of sub-diaphragms 43, E is the Young's modulus of the sub-diaphragm 43, and b w The width of the sub-diaphragm cantilever structure 42 is in meters. t b is the thickness of the sub-diaphragm 43 l The length of the sub-diaphragm cantilever structure is 42.

[0077] From the above sub-diaphragm stiffness model, it can be seen that when a whole diaphragm is formed on the vibrating plate 4, the number of diaphragms is set to 1. The diaphragm stiffness when a whole diaphragm is formed on the vibrating plate 4 can be directly calculated based on the known length and width of the diaphragm cantilever structure, and the calculated diaphragm stiffness is used as the set diaphragm stiffness when a whole diaphragm is formed on the vibrating plate 4. When a vibrating plate 4 is divided into four sub-diaphragms 43, N=4, and the Young's modulus E and the thickness m of the sub-diaphragm 43 are... t When the Young's modulus and thickness of the diaphragm are equal to those of a monolithic diaphragm formed on the vibrating plate 4, the length b of the sub-diaphragm cantilever structure 42 can be changed. l and width b w To change the stiffness of the sub-diaphragm 43, when When the ratio is 1 / 4, it can be ensured that when four sub-diaphragms 43 are divided on a vibrating plate 4, the stiffness of the sub-diaphragms 43 is the same as the stiffness of the diaphragm when a whole diaphragm is formed on the vibrating plate 4. Therefore, the stiffness of the sub-diaphragms 43 can be ensured to be the same as the stiffness of the diaphragm when a whole diaphragm is formed on the vibrating plate 4 by changing the length and width of the sub-diaphragm cantilever structure 42.

[0078] Secondly, when a single diaphragm is formed on the vibrating plate 4, the mass of the diaphragm is greater than the mass of the sub-diaphragm 43, which can be derived from the diaphragm mass model. The diaphragm mass model is as follows:

[0079] M = ρSt

[0080] Where S is the area of ​​the diaphragm, ρ is the density of the diaphragm, and t is the thickness of the diaphragm. The thickness of the diaphragm is equal to the thickness of the diaphragm cantilever structure.

[0081] As can be seen from the above diaphragm mass model, when a whole diaphragm is formed on the vibrating plate 4, the mass of the diaphragm can be directly calculated based on the known diaphragm density, thickness, and area, and the calculated diaphragm mass is used as the diaphragm mass when a whole diaphragm is formed on the vibrating plate 4. When a vibrating plate 4 is divided into four sub-diaphragms 43, the area of ​​the sub-diaphragms 43 is necessarily smaller than the diaphragm area when a whole diaphragm is formed on the vibrating plate 4. When the density and thickness of the sub-diaphragms 43 are equal to the density and thickness of the diaphragm when a whole diaphragm is formed on the vibrating plate 4, it can be concluded that the mass of the sub-diaphragms 43 is smaller than the diaphragm mass when a whole diaphragm is formed on the vibrating plate 4.

[0082] In some embodiments, sub-segmentation grooves 44 are etched on each sub-vibration region to form a sub-diaphragm 43 located within the enclosure area of ​​the sub-segmentation groove 44, a sub-fixing portion 41 located outside the enclosure area of ​​the sub-segmentation groove 44, and a sub-diaphragm cantilever structure 42 connecting the sub-diaphragm 43 and the sub-fixing portion 41 on each sub-vibration region. Before the step of etching sub-segmentation grooves 44 on each sub-vibration region, a stiffness model of the sub-diaphragm 43 is established, and the number and size of the sub-diaphragm cantilever structures 42 are designed according to the stiffness model of the sub-diaphragm 43. The size of the segmentation groove is designed according to the number and size of the designed sub-diaphragm cantilever structures 42. For example, the sub-segmentation groove 44 is a groove structure that runs through both sides in a direction perpendicular to the surface of the vibrating plate 4. By using this method, the stiffness of the sub-diaphragm 43 can be ensured to be the same as the diaphragm stiffness when a whole diaphragm is formed on the vibrating plate 4 by designing the number and size of the sub-diaphragm cantilever structure 42. Since the sub-diaphragm cantilever structure 42 is formed by the sub-segmentation groove 44 dividing the vibrating plate 4, the position of the sub-segmentation groove 44 can be designed according to the number and size of the sub-diaphragm cantilever structure 42, thereby ensuring that the stiffness of the sub-diaphragm 43 is the same as the diaphragm stiffness when a whole diaphragm is formed on the vibrating plate 4. Furthermore, by etching the sub-segmentation groove 44 to form the sub-diaphragm 43, the sub-fixing part 41, and the sub-diaphragm cantilever structure 42, the production and processing of the sub-diaphragm cantilever structure 42 and the sub-diaphragm 43 can be made more convenient. The sub-diaphragm 43 is connected to the sub-fixing part 41 through the sub-diaphragm cantilever structure 42, so that the sub-diaphragm 43 can reciprocate under the elastic action of the sub-diaphragm cantilever structure 42 to produce sound.

[0083] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0084] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A pixel-based sound-emitting unit, characterized in that, include: A vibrating plate is divided into multiple sub-vibration regions. Each sub-vibration region is etched with a sub-diaphragm. Each sub-vibration region has at least two sub-segmenting grooves arranged in a surrounding pattern. In two adjacent sub-segmenting grooves, the ends of one groove and the other groove are arranged sequentially along a ray direction extending outward from the center point of the sub-vibration region to form an overlap in the surrounding pattern direction. A sub-diaphragm cantilever structure is formed between the overlapping sub-segmenting grooves. The sub-segmenting grooves divide the sub-vibration region into a sub-diaphragm located within the surrounding area of ​​the sub-segmenting groove and a sub-fixed part located outside the surrounding area of ​​the sub-segmenting groove. The sub-diaphragm and the sub-fixed part are elastically connected by the sub-diaphragm cantilever structure, and the sub-diaphragm, the sub-fixed part, and the sub-diaphragm cantilever structure are an integrated structure. Electrode plates; The air rear cavity, the vibration plate, the electrode plate and the air rear cavity are arranged in sequence, and multiple sub-vibration regions share one electrode plate and one air rear cavity.

2. The pixel-based sound-emitting unit according to claim 1, characterized in that, The vibrating plate consists of at least two sub-vibrating regions of equal area, and the sub-vibrating regions are arranged in an array, with the sub-diaphragm on each sub-vibrating region having the same size.

3. The pixel-based sound-emitting unit according to claim 1, characterized in that, It also includes a substrate, wherein the substrate, electrode plate and vibrating plate are stacked in sequence, the substrate has an opening, and the structure between the side of the sub-diaphragm of the vibrating plate facing the electrode plate and the bottom of the opening forms the air back cavity; The substrate contains support columns for supporting the electrode plates.

4. The pixel-based sound-emitting unit according to claim 1, characterized in that, The vibrating plate has multiple first dividing grooves, multiple second dividing grooves, and multiple connecting dividing grooves. Each of the sub-vibration regions has four first dividing grooves arranged in a ring, and the four first dividing grooves form the sub-diaphragm; Multiple second dividing grooves form a ring structure, with the first dividing groove located inside the ring structure and the second dividing groove located outside both the first dividing groove in front and the first dividing groove behind it. The first dividing grooves of two adjacent sub-vibration regions are connected by two parallel connecting dividing grooves.

5. The pixel-based sound-emitting unit according to claim 1, characterized in that, It also includes a spacer, through which a gap is formed between the electrode plate and the vibrating plate.

6. The pixel-based sound-emitting unit according to claim 5, characterized in that, The spacer is made of insulating material.

7. A digital sound-generating chip, characterized in that, It includes the pixel sound-emitting unit as described in any one of claims 1 to 6, wherein the number of the pixel sound-emitting units is multiple, and they are arranged in an array or in a linear distribution.

8. A method for manufacturing a pixel-based sound-emitting unit, characterized in that, The manufacturing method, employing the pixel-based sound-emitting unit as described in any one of claims 1 to 6, comprises: Multiple sub-vibration regions are divided on the vibrating plate of the pixel sound-emitting unit. Sub-diaphragms are formed by etching on each of the sub-vibration regions.

9. The method for manufacturing a pixel-based sound-emitting unit according to claim 8, characterized in that, The method of etching to form a sub-diaphragm on each of the sub-vibration regions includes: Sub-segmentation grooves are etched on each of the sub-vibration regions to form a sub-diaphragm located within the enclosure area of ​​the sub-segmentation groove, a sub-fixing part located outside the enclosure area of ​​the sub-segmentation groove, and a sub-diaphragm cantilever structure connecting the sub-diaphragm and the sub-fixing part on each of the sub-vibration regions. Before the step of etching sub-segmentation grooves on each of the sub-vibration regions, the method further includes: Establish a stiffness model for the sub-diaphragm, and design the number and size of the sub-diaphragm cantilever structure based on the stiffness model of the sub-diaphragm; The dimensions of the sub-segmentation slots are designed based on the number and size of the sub-diaphragm cantilever structures.

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