A heat dissipation control method, device and electrical equipment

Abstract

The application relates to the technical field of intelligent control, in particular to a heat dissipation control method and device and electrical equipment, which detects the current mainboard temperature, working current and working voltage of the electrical equipment, judges whether the mainboard of the electrical equipment and the position points in the preset range around the mainboard are well heat-dissipated, and controls the working state of the heat dissipation equipment and / or the working state of the electrical equipment according to the judgment result, so that the fine control of the mainboard heat dissipation condition is realized according to the current working parameters of the electrical equipment, the heat dissipation of the electrical equipment is optimized, the temperature in the electrical equipment is more controllable, and the problem that the heat dissipation effect is poor due to the incapability of realizing the accurate control of the mainboard heat dissipation of the controller in the prior art is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent control, and particularly relates to a heat dissipation control method and device and electrical equipment. BACKGROUND

[0002] The variable frequency controller has the functions of adjusting the power of the motor and realizing the variable speed operation of the motor to save power, and is widely used in electrical equipment such as air conditioners and fans. At present, the general strong current topology architecture of the variable frequency controller includes rectification and inversion circuits. Since the variable frequency controller is usually in a high-voltage and high-current working state, the heat dissipation of the controller mainboard is relatively large. Since the components also have requirements for their own working temperature, exceeding the temperature will cause component damage or life reduction, and therefore the control component temperature rise is one of the important tasks of variable frequency design.

[0003] For the controller mainboard, the existing conventional heat dissipation methods mainly include natural heat dissipation, air cooling heat dissipation, refrigerant heat dissipation, water cooling heat dissipation and oil cooling heat dissipation methods. For these heat dissipation methods, although certain modifications are made in the application to achieve better heat dissipation effect. However, the existing conventional heat dissipation methods are usually passive heat dissipation, and active heat dissipation is not achieved, which cannot realize the precise control of the heat dissipation of the variable frequency controller, resulting in the problem of poor heat dissipation effect. SUMMARY

[0004] Therefore, the purpose of the present application is to provide a heat dissipation control method and device for electrical equipment and electrical equipment to solve the problem of poor heat dissipation effect due to the inability to achieve precise control of the heat dissipation of the controller mainboard in the prior art.

[0005] According to a first aspect of the embodiment of the present application, a heat dissipation control method is provided, comprising:

[0006] detecting the current mainboard temperature, working current and working voltage of the electrical equipment;

[0007] determining the current running power of the electrical equipment according to the working current and working voltage;

[0008] judging whether the mainboard of the electrical equipment and the position points within the preset range around the mainboard are well heat-dissipated according to the mainboard temperature and the running power;

[0009] controlling the working state of the heat dissipation equipment and / or the working state of the electrical equipment according to the judgment result.

[0010] Preferably, the step of judging whether the mainboard of the electrical equipment and the position points within the preset range around the mainboard are well heat-dissipated according to the mainboard temperature and the running power comprises:

[0011] obtaining the current environmental temperature;

[0012] determining whether the mainboard of the electrical equipment is well cooled according to the ambient temperature, the mainboard temperature and the running power;

[0013] when it is determined that the mainboard of the electrical equipment is well cooled, determining a presumed temperature of a position point within a preset range around the mainboard according to the ambient temperature and the running power;

[0014] determining whether the position point within the preset range around the mainboard is well cooled according to the presumed temperature.

[0015] Preferably, the determining whether the mainboard of the electrical equipment is well cooled according to the ambient temperature, the mainboard temperature and the running power comprises:

[0016] determining a temperature condition to which the current ambient temperature belongs and a power condition to which the running power belongs;

[0017] determining a limit temperature of the mainboard when the electrical equipment can still normally operate under the current temperature condition and the power condition;

[0018] determining whether the mainboard temperature is less than or equal to the limit temperature, and if yes, determining that the mainboard of the electrical equipment is well cooled, otherwise, determining that the mainboard of the electrical equipment is poorly cooled.

[0019] Preferably, the temperature condition comprises low temperature, normal temperature and high temperature, the power condition comprises low power, rated power and high power, and the method further comprises:

[0020] pre-storing limit temperatures of the mainboard when the electrical equipment can still normally operate under different temperature conditions and power conditions;

[0021] The determining a limit temperature of the mainboard when the electrical equipment can still normally operate under the current temperature condition and the power condition specifically comprises:

[0022] querying the pre-stored limit temperatures under different temperature conditions and power conditions to determine the limit temperature of the mainboard when the electrical equipment can still normally operate under the current temperature condition and the power condition.

[0023] Preferably, the method further comprises:

[0024] pre-storing presumed temperatures of each position point within a preset range around the mainboard when the electrical equipment can still normally operate under different temperature conditions and power conditions;

[0025] The determining a presumed temperature of a position point within a preset range around the mainboard according to the ambient temperature and the running power specifically comprises:

[0026] for each position point, querying the pre-stored presumed temperatures of the position point under different temperature conditions and power conditions to determine the presumed temperature of the position point.

[0027] Preferably, judging whether the heat dissipation of a point within a preset range around the mainboard is good based on the estimated temperature includes:

[0028] For each location point, if the estimated temperature is less than or equal to a threshold, it is determined that the heat dissipation at the location point is good; otherwise, it is determined that the heat dissipation at the location point is poor.

[0029] Preferably, controlling the working state of the heat dissipation device and / or the working state of the electrical device according to the judgment result includes:

[0030] When it is determined that all positions within a preset range around the motherboard are in good heat dissipation condition, controlling the working state of the heat dissipation device according to the difference between the limit temperature and the motherboard temperature; and / or,

[0031] When it is determined that the heat dissipation of any position point within the preset range around the mainboard is poor, it is determined whether the estimated temperature of the position point exceeds the threshold preset range. If so, the electrical equipment is controlled to shut down and a fault prompt message is output; otherwise, the output capacity of the electrical equipment is reduced and a fault prompt message is output.

[0032] Preferably, the method further comprises:

[0033] When it is determined that the heat dissipation of the mainboard of the electrical equipment is poor, it is determined whether the mainboard temperature exceeds the preset limit temperature range. If so, the electrical equipment is controlled to shut down and a fault prompt message is output; otherwise, the output capacity of the electrical equipment is reduced and a fault prompt message is output.

[0034] Preferably, controlling the working state of the heat dissipation device according to the difference between the limit temperature and the mainboard temperature includes:

[0035] If the difference is greater than a preset value, the heat dissipation device is turned off;

[0036] If the difference is less than or equal to the preset value, the heat dissipation device is turned on.

[0037] According to a second aspect of an embodiment of the present invention, there is provided a heat dissipation control device, comprising:

[0038] Detection module, used to detect the current motherboard temperature, operating current and operating voltage of the electrical equipment;

[0039] A determination module, configured to determine the current operating power of the electrical equipment based on the operating current and the operating voltage;

[0040] A judgment module, configured to judge whether the heat dissipation of the mainboard of the electrical device and points within a preset range around the mainboard is good according to the mainboard temperature and operating power;

[0041] The control module is used to control the working state of the heat dissipation device and / or the working state of the electrical device according to the judgment result.

[0042] According to a third aspect of an embodiment of the present invention, there is provided an electric device, including:

[0043] The heat dissipation control device described above.

[0044] Preferably, the electrical equipment includes at least one of the following items:

[0045] Air conditioning units, fresh air units, air coolers, inverter refrigerators.

[0046] The technical solutions provided by the embodiments of the present invention may have the following beneficial effects:

[0047] By detecting the current motherboard temperature, operating current and operating voltage of the electrical equipment, it is determined whether the mainboard of the electrical equipment and the position points within a preset range around the mainboard are well cooled, and based on the judgment result, the working state of the heat dissipation device and / or the working state of the electrical equipment are controlled, thereby achieving fine control of the mainboard heat dissipation condition according to the current working parameters of the electrical equipment, optimizing the heat dissipation of the electrical equipment, making the temperature inside the electrical equipment more controllable, and solving the problem of poor heat dissipation effect caused by the inability to achieve precise control of the heat dissipation of the controller mainboard in the existing technology.

[0048] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0050] Figure 1 is a flowchart illustrating a heat dissipation control method according to an exemplary embodiment;

[0051] Figure 2 is a flow chart showing a heat dissipation control method according to another exemplary embodiment;

[0052] Figure 3 The figure is a schematic block diagram of a heat dissipation control device according to an exemplary embodiment. DETAILED DESCRIPTION

[0053] The exemplary embodiments will be described in detail below with reference to the drawings. The following description is presented in connection with the accompanying drawings, in which the same numbers indicate the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments are not meant to be an all-inclusive description of all implementations consistent with the disclosure. Rather, they are merely examples that can be representative of some implementations consistent with the disclosure as detailed in the appended claims.

[0054] Figure 1 is a flow chart of a heat dissipation control method according to an exemplary embodiment, as shown in Figure 1 The heat dissipation control method comprises:

[0055] Step S11, detecting the current mainboard temperature, working current and working voltage of the electrical equipment;

[0056] Step S12, determining the current running power of the electrical equipment according to the working current and working voltage;

[0057] Step S13, judging whether the mainboard and the position points within the preset range around the mainboard of the electrical equipment are well heat-dissipated according to the mainboard temperature and running power;

[0058] Step S14, controlling the working state of the heat dissipation equipment and / or the working state of the electrical equipment according to the judgment result.

[0059] It should be noted that the technical solution provided in the embodiment is suitable for heat dissipation of the mainboard of the electrical equipment, and is especially suitable for heat dissipation of the mainboard with a variable frequency controller. In specific practice, the heat dissipation control method provided in the embodiment needs to be loaded in the controller of the electrical equipment or in the electronic equipment connected with the electrical equipment.

[0060] The electrical equipment includes but is not limited to air conditioning units, fresh air units, air coolers, variable frequency refrigerators, etc. In specific practice, the electrical equipment is preferably an air conditioning unit.

[0061] It can be understood that the technical solution provided in the embodiment judges whether the mainboard and the position points within the preset range around the mainboard of the electrical equipment are well heat-dissipated by detecting the current mainboard temperature, working current and working voltage of the electrical equipment, and controls the working state of the heat dissipation equipment and / or the working state of the electrical equipment according to the judgment result, so as to realize fine control of the mainboard heat dissipation condition according to the current working parameters of the electrical equipment, optimize the heat dissipation of the electrical equipment, make the temperature in the electrical equipment more controllable, and solve the problem of poor heat dissipation effect in the prior art due to the inability to realize precise control of the mainboard heat dissipation of the controller.

[0062] In the specific practice, the "current mainboard temperature of the electrical equipment" mentioned in step S11 can be detected and acquired by setting a temperature detection circuit on the controller mainboard. The specific circuit structure of the temperature detection circuit has various implementation manners, for example, through a temperature sensor, an RC low-frequency filter circuit, a temperature signal receiving port, a signal processing chip containing an analog-digital conversion circuit and a storage unit connected in sequence. It can be understood that the real-time temperature at a certain position on the controller mainboard is detected by the temperature sensor, the temperature signal is transmitted to the signal processing chip through the RC low-frequency filter circuit and the temperature receiving port, and the digital temperature signal is converted by the analog-digital conversion circuit in the signal processing chip and stored in the storage unit.

[0063] Similarly, the "current working current and working voltage of the electrical equipment" mentioned in step S11 can be detected and acquired by setting a voltage detection circuit (for example, detected by a voltage dividing resistor) or a current detection circuit (for example, detected by a current sensor or a sampling resistor) on the controller mainboard.

[0064] The "determining the current running power of the electrical equipment according to the working current and working voltage" in step S12 is specifically:

[0065] The running power is calculated according to the formula: running power = working voltage x working current.

[0066] The "position point in the preset range around the mainboard" mentioned in step S13 is a position point with a higher temperature rise inside the mainboard and the electrical equipment box under the same environmental temperature and running power. In the specific practice, multiple different position points can be selected according to the actual situation.

[0067] The "judging whether the mainboard and the position point in the preset range around the mainboard of the electrical equipment are well cooled according to the mainboard temperature and the running power" in step S13 includes:

[0068] 1. Acquiring the current environmental temperature.

[0069] Taking the air conditioning unit as an example, the current environmental temperature can be acquired by setting a temperature sensor in the outdoor unit.

[0070] 2. Judging whether the mainboard of the electrical equipment is well cooled according to the environmental temperature, the mainboard temperature and the running power, including:

[0071] Judging the temperature condition to which the current environmental temperature belongs, and the power condition to which the running power belongs;

[0072] Determining the limit temperature of the mainboard when the electrical equipment can still normally run under the current temperature condition and power condition;

[0073] If the mainboard temperature is less than or equal to the limit temperature, it is determined that the mainboard of the power equipment is well cooled; otherwise, it is determined that the mainboard of the power equipment is poorly cooled.

[0074] In specific implementation, the temperature conditions that can be set include low temperature (setting a temperature range below 0℃ as low temperature), normal temperature (setting a temperature range of 0℃-30℃ as normal temperature), and high temperature (setting a temperature range above 30℃ as high temperature), and the power conditions that can be set include low power (setting a power range less than 50% as low power), rated power (setting a power range of 50%-80% as rated power), and high power (setting a power range of 80%-100% as high power).

[0075] In specific implementation, the limit temperature of the mainboard when the power equipment can still operate normally under different temperature conditions and power conditions can be pre-stored, as shown in Table 1 below:

[0076]

[0077] Table 1

[0078] In Table 1, A1 represents the limit temperature of the mainboard when the power equipment can still operate normally under the condition that the current environment temperature is low temperature and the power equipment is operated at low power; that is, under the condition of low temperature and low power, the power equipment can operate normally when the real-time detected mainboard temperature is less than or equal to A1; A2 represents the limit temperature of the mainboard when the power equipment can still operate normally under the condition that the current environment temperature is normal temperature and the power equipment is operated at low power; that is, under the condition of normal temperature and low power, the power equipment can operate normally when the real-time detected mainboard temperature is less than or equal to A2. Similarly, the specific meanings of the limit temperatures A3, B1-B3, C1-C3 in Table 1 can be obtained, which are not described herein again.

[0079] It can be understood that by querying the limit temperatures pre-stored in Table 1 under different temperature conditions and power conditions, the limit temperature of the mainboard when the power equipment can still operate normally under the current temperature condition and power condition can be determined.

[0080] In specific implementation, the limit temperature of the mainboard when the power equipment can still operate normally under different temperature conditions and power conditions can be pre-stored, as shown in Table 1 below:

[0081]

[0082] Table 2

[0083]

[0084] Table III

[0085] Table II is a storage example of the estimated temperature of the position point A in the preset range around the mainboard. In Table II, D1 represents the estimated temperature of the position point A when the current environmental temperature is low-temperature condition and the electric device is in low-power operation; D2 represents the estimated temperature of the position point A when the current environmental temperature is normal-temperature condition and the electric device is in low-power operation. In this way, the specific meanings of the estimated temperatures D3, E1-E3, F1-F3 of the position point A in Table II can be obtained, which will not be described herein.

[0086] Table III is a storage example of the estimated temperature of the position point B in the preset range around the mainboard. In Table III, D4 represents the estimated temperature of the position point B when the current environmental temperature is low-temperature condition and the electric device is in low-power operation; D5 represents the estimated temperature of the position point B when the current environmental temperature is normal-temperature condition and the electric device is in low-power operation. In this way, the specific meanings of the estimated temperatures D6, E4-E6, F4-F6 of the position point B in Table III can be obtained, which will not be described herein.

[0087] It should be noted that the temperature values in Table II and Table III are called estimated temperatures because the position points (such as the position point A and the position point B) in the preset range around the mainboard are not provided with additional temperature sensors for temperature detection. The temperature data in Table II and Table III is recorded by experiments at the development initial stage, and the temperature data of the position points under different temperature conditions and power conditions is stored in the database for calling when the temperature data of the corresponding position point is needed. For example, for the position point A, if the current environmental temperature is low-temperature condition and the current operation power is low-power operation, it is inferred that the current temperature of the position point A is D1.

[0088] 3. When it is determined that the mainboard of the electric device is well cooled, the estimated temperature of the position point in the preset range around the mainboard is determined according to the environmental temperature and the operation power, specifically as follows:

[0089] For each position point, the pre-stored estimated temperature of the position point under different temperature conditions and power conditions is inquired to determine the estimated temperature of the position point.

[0090] For example, for the position point A, if the current environmental temperature is 15℃, according to the pre-defined temperature condition division, the current environmental temperature is low-temperature condition; if the current operation power of the electric device is 20%, according to the pre-defined power condition division, the current operation power is low-power condition; by inquiring Table II, it is known that the estimated temperature under the low-temperature and low-power operation condition is D1, and then it is determined that the estimated temperature of the current position point A is D1.

[0091] For example, for the position point B, if the current ambient temperature is 15°C, according to the pre-temperature condition division, the current ambient temperature is a low temperature condition; if the current running power of the electric equipment is 20%, according to the pre-power condition division, the current running power is a low power condition; by querying Table 2, it can be known that the estimated temperature under the low temperature and low power running condition is D4, and thus it is determined that the estimated temperature of the current position point B is D4.

[0092] 4. According to the estimated temperature, it is judged whether the position points in the preset range around the mainboard are well cooled, specifically:

[0093] For each position point, if the estimated temperature is less than or equal to a threshold value (the threshold value is set according to the user's needs, or is set according to historical experience values, or is set according to experimental data), it is determined that the position point is well cooled, otherwise, it is determined that the position point is poorly cooled.

[0094] For example, for the position point A, if the threshold value under the low temperature and low power running condition is 0°C, and the current estimated temperature is 3°C, the estimated temperature at this time is greater than the threshold value, and thus it is determined that the position point A is poorly cooled at this time.

[0095] For example, for the position point B, if the threshold value under the normal temperature and low power running condition is 30°C, and the current estimated temperature is 23°C, the estimated temperature at this time is less than the threshold value, and thus it is determined that the position point B is well cooled at this time.

[0096] The "cooling device" mentioned in step S14 includes but is not limited to: a cooling fan, a refrigerant, water, and the like. These cooling devices can be cooling devices that are self-provided by the electric equipment when it is shipped, or can be cooling devices that are not self-provided by the electric equipment when it is shipped but are externally added to the electric equipment.

[0097] According to the judgment result, the working state of the cooling device and / or the working state of the electric equipment are controlled, including:

[0098] When it is determined that all the position points in the preset range around the mainboard are well cooled, the working state of the cooling device is controlled according to the difference between the limit temperature and the mainboard temperature (for example, if the difference is greater than a preset value, the cooling device is turned off; if the difference is less than or equal to the preset value, the cooling device is turned on; for example, when the temperature of the surrounding position points is high, the opening of the cooling device such as the cooling fan, the refrigerant flow, or the water flow is increased to accelerate heat dissipation and improve the cooling effect, so as to reduce the temperature of the mainboard controller components, and when the temperature of the components is reduced, the opening of the cooling device is reduced); the preset value is set according to historical experience values or experimental data, for example, is set to 40°C.

[0099] And / or,

[0100] If it is determined that the mainboard is poorly cooled, it is determined whether the mainboard temperature exceeds the limit temperature preset range (the preset range is set according to user needs or historical experience values, for example, the preset range can be set as 20% of the limit temperature), if yes, the electric device is controlled to shut down and failure prompt information is output; otherwise, the output capability of the electric device is reduced and failure prompt information is output.

[0101] If it is determined that the mainboard is poorly cooled, it is determined whether the mainboard temperature exceeds the limit temperature preset range (the preset range is set according to user needs or historical experience values, for example, the preset range can be set as 20% of the limit temperature), if yes, the electric device is controlled to shut down and failure prompt information is output; otherwise, the output capability of the electric device is reduced and failure prompt information is output.

[0102] It should be noted that the "reducing the output capability of the electric device" mentioned in the embodiment mainly refers to reducing the running power of the electric device. It can be understood that the higher the running power is, the greater the working current and working voltage of the electric device are, and the higher the temperature of the mainboard is. Reducing the output capability of the electric device can to some extent alleviate the problem of poor cooling of the electric device.

[0103] It can be understood that the technical solution provided by the embodiment can output failure prompt information when the mainboard of the electric device is poorly cooled, and can also output failure prompt information when any position point in the preset range around the mainboard is poorly cooled. Compared with the prior art, the user can be reminded to solve the cooling failure in time, the passive cooling is changed into active cooling, and the user experience is improved. Figure 2 is a flowchart of a cooling control method according to another example embodiment, as shown in Figure 2 The cooling control method includes the following steps.

[0104] In step S21, the current mainboard temperature, working current and working voltage of the electric device are detected.

[0105] In step S22, it is determined whether the mainboard of the electric device is well cooled.

[0106] In step S23, if it is determined that the mainboard of the electric device is well cooled, the estimated temperature of the position point in the preset range around the mainboard is determined, and the process jumps to step S25.

[0107] In step S24, if it is determined that the mainboard of the electric device is poorly cooled, the process jumps to step S28.

[0108] In step S25, it is determined whether the position point in the preset range around the mainboard is well cooled according to the estimated temperature.

[0109] Step S26, when determining that all position points in the preset range around the mainboard are well cooled, controlling the working state of the cooling device according to the difference between the limit temperature and the mainboard temperature;

[0110] Step S27, when determining that any position point in the preset range around the mainboard is poorly cooled, jumping to step S28;

[0111] Step S28, determining whether the mainboard temperature exceeds the preset range of the limit temperature, if yes, controlling the power equipment to shut down and outputting a fault prompt information; otherwise, reducing the output capacity of the power equipment and outputting a fault prompt information; or, determining whether the estimated temperature of the position point exceeds the preset range of the threshold, if yes, controlling the power equipment to shut down and outputting a fault prompt information; otherwise, reducing the output capacity of the power equipment and outputting a fault prompt information.

[0112] It should be noted that the technical scheme provided in the embodiment is suitable for cooling the mainboard of the power equipment, and is especially suitable for cooling the mainboard with a variable frequency controller. In specific practice, the cooling control method provided in the embodiment needs to be loaded in the controller of the power equipment for running, or loaded in the electronic equipment connected with the power equipment for running.

[0113] The power equipment includes but is not limited to an air conditioning unit, a fresh air unit, a cooling fan, a variable frequency refrigerator, etc. In specific practice, the power equipment is preferably an air conditioning unit.

[0114] It can be understood that the technical scheme provided in the embodiment determines whether the mainboard of the power equipment and the position points in the preset range around the mainboard are well cooled by detecting the current mainboard temperature, working current and working voltage of the power equipment, and controls the working state of the cooling device and / or the working state of the power equipment according to the determination result, so as to realize fine control of the mainboard cooling condition according to the current working parameters of the power equipment, optimize the cooling of the power equipment, make the temperature in the power equipment more controllable, and solve the problem of poor cooling effect in the prior art due to the inability to realize precise control of the mainboard cooling of the controller.

[0115] Further, the technical scheme provided in the embodiment can output a fault prompt information when the mainboard is poorly cooled, and can also output a fault prompt information when any position point in the preset range around the mainboard is poorly cooled, which can remind the user to solve the cooling fault in time, changes passive cooling to active cooling, and improves the user experience compared with the prior art.

[0116] Figure 3 is a schematic block diagram of a cooling control device according to an example embodiment, as shown in Figure 3 the cooling control device 100 includes:

[0117] Detection module 101, used to detect the current motherboard temperature, operating current and operating voltage of the electrical equipment;

[0118] A determination module 102 is configured to determine the current operating power of the electrical equipment based on the operating current and the operating voltage;

[0119] The judgment module 103 is used to judge whether the heat dissipation of the mainboard of the electrical device and the points within a preset range around the mainboard are good according to the mainboard temperature and operating power;

[0120] The control module 104 is configured to control the working state of the heat dissipation device and / or the working state of the electrical device according to the determination result.

[0121] It should be noted that this embodiment provides a technical solution suitable for dissipating heat from a mainboard of an electrical device, and is particularly suitable for dissipating heat from a mainboard with a frequency conversion controller. In practice, the heat dissipation control device provided in this embodiment is disposed in the electrical device.

[0122] The electrical equipment includes but is not limited to: air conditioning units, fresh air units, air coolers, variable frequency refrigerators, etc. In specific practice, the electrical equipment is preferably an air conditioning unit.

[0123] The implementation method and beneficial effects of each module in this embodiment can be found in the introduction of the corresponding steps in the above embodiment, and will not be repeated in this embodiment.

[0124] It can be understood that the technical solution provided in this embodiment determines whether the mainboard of the electrical equipment and the position points within a preset range around the mainboard are well cooled by detecting the current mainboard temperature, operating current and operating voltage of the electrical equipment, and controls the working state of the heat dissipation device and / or the working state of the electrical equipment based on the judgment result, thereby achieving fine control of the heat dissipation condition of the mainboard according to the current working parameters of the electrical equipment, optimizing the heat dissipation of the electrical equipment, making the temperature inside the electrical equipment more controllable, and solving the problem of poor heat dissipation effect caused by the inability to achieve precise control of the heat dissipation of the controller mainboard in the prior art.

[0125] According to an exemplary embodiment, an electrical device includes: the heat dissipation control device described above.

[0126] Preferably, the electrical equipment includes at least one of the following items:

[0127] Air conditioning units, fresh air units, air coolers, inverter refrigerators.

[0128] It can be understood that the technical scheme provided by the embodiment includes the heat dissipation control device, the heat dissipation control device detects the current mainboard temperature, working current and working voltage of the electric equipment, judges whether the mainboard and the position point in the preset range around the mainboard of the electric equipment are well heat-dissipated, and controls the working state of the heat dissipation device and / or the working state of the electric equipment according to the judgment result, so as to realize fine control of the mainboard heat dissipation condition according to the current working parameters of the electric equipment, optimize the heat dissipation of the electric equipment, make the temperature in the electric equipment more controllable, and solve the problem of poor heat dissipation effect caused by the incapability of realizing precise control of the controller mainboard heat dissipation in the prior art.

[0129] It can be understood that the same or similar parts in the above embodiments can be mutually referred to, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0130] It should be noted that in the description of the present application, the terms "first", "second" and the like are only for the purpose of description and should not be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, the meaning of "a plurality of" is at least two.

[0131] Any process or method descriptions in flow charts or described elsewhere herein can be understood as representing code modules, segments, or portions of code which include one or more executable instructions for performing specific logic functions or steps in the process, and that the various systems described herein can include one or more circuits that can implement these code modules, segments, or portions of code. The various circuits can comprise one or more processing cores from one or more microprocessors, one or more ASICs, one or more FPGAs, and / or other hardware equivalents.

[0132] It should be understood that parts of the present application can be realized by hardware, software, firmware or a combination thereof. In the above embodiments, a plurality of steps or methods can be realized by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if realized by hardware, and as in another embodiment, it can be realized by any one or a combination of the following technologies known in the art: discrete logic circuit with logic gate circuit for implementing logic functions on data signals, application specific integrated circuit with suitable combination logic gate circuit, programmable gate array (PGA), field programmable gate array (FPGA) and the like.

[0133] Those skilled in the art of the present technology can understand that all or part of the steps carried out by the above-mentioned embodiment method can be completed by a program instructing the relevant hardware, and the program can be stored in a computer readable storage medium. When the program is executed, it includes one of the steps of the method embodiment or a combination thereof.

[0134] In addition, each functional unit in each embodiment of the present application can be integrated in one processing module, or each unit can be physically present separately, or two or more units can be integrated in one module. The integrated module can be realized in the form of hardware, or in the form of a software functional module. When the integrated module is realized in the form of a software functional module and sold or used as an independent product, it can also be stored in a computer readable storage medium.

[0135] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc.

[0136] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0137] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A heat dissipation control method, characterized in that: include: Detect the current motherboard temperature, operating current and operating voltage of the electrical equipment; Determining the current operating power of the electrical equipment based on the operating current and the operating voltage; Determining whether the mainboard of the electrical device and locations within a preset range around the mainboard are properly heat-dissipated based on the mainboard temperature and operating power includes: obtaining a current ambient temperature; determining whether the mainboard of the electrical device is properly heat-dissipated based on the ambient temperature, mainboard temperature, and operating power; when determining that the mainboard of the electrical device is properly heat-dissipated, determining, based on the ambient temperature and operating power, estimated temperatures of locations within a preset range around the mainboard; and determining, based on the estimated temperatures, whether the locations within the preset range around the mainboard are properly heat-dissipated; Controlling the working state of the heat dissipation device and / or the working state of the electrical device according to the judgment result; Also includes: Pre-store the estimated temperature of each point within a preset range around the motherboard when the electrical equipment can still operate normally under different temperature and power conditions; the temperature conditions include: low temperature, normal temperature and high temperature; the power conditions include: low power, rated power and high power; The method of determining the estimated temperature of a point within a preset range around the motherboard based on the ambient temperature and the operating power is as follows: For each location point, the pre-stored estimated temperature of the location point under different temperature conditions and power conditions is queried and determined as the estimated temperature of the location point.

2. The method according to claim 1, characterized in that The determining whether the mainboard of the electrical device has good heat dissipation according to the ambient temperature, mainboard temperature, and operating power includes: Determine whether the current ambient temperature belongs to the temperature condition, and whether the operating power belongs to the power condition; Determine the maximum temperature of the motherboard under the current temperature and power conditions, while the electrical equipment can still operate normally; It is determined whether the mainboard temperature is less than or equal to the limit temperature. If so, it is determined that the mainboard heat dissipation of the electrical device is good; otherwise, it is determined that the mainboard heat dissipation of the electrical device is poor.

3. The method according to claim 2, characterized in that The method further comprises: Pre-store the motherboard's maximum temperature under different temperature and power conditions, while the electrical equipment can still operate normally; The determination of the limit temperature of the mainboard when the electrical equipment can still operate normally under the current temperature and power conditions is specifically: Query the pre-stored limit temperatures under different temperature conditions and power conditions to determine the limit temperature of the mainboard when the electrical equipment can still operate normally under the current temperature conditions and power conditions.

4. The method according to claim 3, characterized in that The determining, based on the estimated temperature, whether a point within a preset range around the motherboard has good heat dissipation includes: For each location point, if the estimated temperature is less than or equal to a threshold, it is determined that the heat dissipation at the location point is good; otherwise, it is determined that the heat dissipation at the location point is poor.

5. The method according to claim 4, characterized in that The controlling of the working state of the heat dissipation device and / or the working state of the electrical device according to the judgment result includes: When it is determined that all positions within a preset range around the motherboard are in good heat dissipation condition, controlling the working state of the heat dissipation device according to the difference between the limit temperature and the motherboard temperature; and / or, When it is determined that the heat dissipation of any position point within the preset range around the mainboard is poor, it is determined whether the estimated temperature of the position point exceeds the threshold preset range. If so, the electrical equipment is controlled to shut down and a fault prompt message is output; otherwise, the output capacity of the electrical equipment is reduced and a fault prompt message is output.

6. The method according to claim 2 or 5, characterized in that Also includes: When it is determined that the heat dissipation of the mainboard of the electric device is poor, determining whether the mainboard temperature exceeds the preset limit temperature range, and if so, controlling the electric device to shut down and outputting a fault prompt message; Otherwise, the output capacity of the electrical equipment is reduced and a fault prompt message is output.

7. The method according to claim 5, characterized in that The controlling the working state of the heat dissipation device according to the difference between the limit temperature and the mainboard temperature includes: If the difference is greater than a preset value, the heat dissipation device is turned off; If the difference is less than or equal to the preset value, the heat dissipation device is turned on.

8. A heat dissipation control device, characterized in that: include: Detection module, used to detect the current motherboard temperature, operating current and operating voltage of the electrical equipment; A determination module, configured to determine the current operating power of the electrical equipment based on the operating current and the operating voltage; A judgment module is used to judge whether the mainboard of the electrical device and the locations within a preset range around the mainboard are well cooled based on the mainboard temperature and operating power; specifically, it is used to obtain the current ambient temperature; and judge whether the mainboard of the electrical device is well cooled based on the ambient temperature, mainboard temperature, and operating power; When it is determined that the heat dissipation of the mainboard of the electrical device is good, determining the estimated temperature of a point within a preset range around the mainboard based on the ambient temperature and the operating power; Based on the estimated temperature, determining whether heat dissipation is good at points within a preset range around the motherboard; a control module for controlling the operating state of the heat dissipation device and / or the operating state of the electrical device according to the determination result; and for pre-storing the estimated temperature of each location point within a preset range around the mainboard when the electrical device can still operate normally under different temperature conditions and power conditions; The temperature conditions include: low temperature, normal temperature and high temperature, and the power conditions include: low power, rated power and high power; the estimated temperature of the position points within a preset range around the mainboard is determined based on the ambient temperature and operating power, specifically: for each position point, the pre-stored estimated temperature of the position point under different temperature conditions and power conditions is queried, and the estimated temperature of the position point is determined.

9. An electrical device, characterized in that: include: The heat dissipation control device according to claim 8.

10. The electrical equipment according to claim 9, characterized in that: Include at least one of the following, including: Air conditioning units, fresh air units, air coolers, inverter refrigerators.

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