High-power electronic case with three-protection function

By designing a high-power electronic chassis with a 'U'-shaped air intake duct and an upper and lower exhaust fan structure, the problem of balancing sealing and heat dissipation was solved, achieving efficient sealing and heat dissipation, protecting functional modules, and improving structural strength and assembly/disassembly efficiency.

CN115933828BActive Publication Date: 2026-01-23CHONGQING HUILING ELECTRONIC NEW TECH CO LTD
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
CN202211648054.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-21
Publication Date
2026-01-23
Estimated Expiration
2042-12-21

AI Technical Summary

Technical Problem

Existing high-power electronic enclosures struggle to balance sealing and heat dissipation performance, leading to damage to functional modules from salt spray, moisture, and dust. Furthermore, poor heat dissipation poses a high risk of damage from high temperatures.

Method used

Design a high-power electronic chassis with tri-proof features. It adopts a U-shaped air intake duct and an upper and lower exhaust fan structure. Combined with heat conduction plate and sealing design, it ensures airtightness and efficient heat dissipation. Input and output modules are connected by blind plugging. Thermal conductive silicone and aluminum-copper plates are used for heat transfer. Exhaust fans are set in the air duct for active air extraction.

Benefits of technology

It achieves high-efficiency sealing and heat dissipation performance, avoids damage from environmental pollutants, reduces the risk of high-temperature failure of functional modules, and improves structural strength and assembly/disassembly efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN115933828B_ABST
    Figure CN115933828B_ABST
Patent Text Reader

Abstract

This invention discloses a high-power electronic chassis with tri-proof (waterproof, dustproof, and shockproof) functions. The upper and lower edges of each heat-conducting plate extend directly into the upper and lower air ducts, resulting in a short heat transfer path and a large heat transfer contact surface between the heat-conducting plate and the functional modules. This allows for efficient heat transfer from the functional modules to the air intake duct, preventing damage and failure of the functional modules due to high temperatures. Furthermore, the air intake duct has a U-shaped structure and actively draws air through an exhaust fan, which can efficiently remove heat from the heat-conducting plates and the inner casing. At the same time, the inner casing is completely sealed, and all functional modules are installed in the functional module mounting chamber, completely avoiding damage caused by environmental pollutants such as salt spray, water, and dust. The input / output modules are installed in the input / output module mounting chamber and are connected to the functional modules via blind plugging, which not only facilitates assembly but also ensures the airtightness of the inner casing.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of electronic device component technology, and specifically to a high-power electronic chassis with tri-proof (waterproof, dustproof, and shockproof) functions. Background Technology

[0002] High-power electronic enclosures are used to protect the internal electronic functional modules. In addition to meeting excellent electromagnetic compatibility requirements, they also need to be adaptable to some field application scenarios.

[0003] While existing high-power electronic enclosures boast high structural strength and minimal impact deformation, structural design flaws prevent a proper balance between sealing and heat dissipation. This results in high-power electronic enclosures with good heat dissipation exhibiting suboptimal sealing, making them susceptible to damage from environmental factors such as salt spray, water (vapor), and dust. Conversely, high-power electronic enclosures with good sealing but poor heat dissipation mean that the heat generated by functional modules cannot be dissipated quickly, increasing the risk of high-temperature damage and failure.

[0004] Solving these problems is now a top priority. Summary of the Invention

[0005] To address the technical problem that existing high-power electronic chassis cannot simultaneously achieve both sealing and heat dissipation performance, this invention provides a high-power electronic chassis with tri-proof (waterproof, dustproof, and shockproof) functions.

[0006] The technical solution is as follows:

[0007] A high-power electronic chassis with tri-proof function is characterized by comprising an outer box with a rectangular structure formed by a front panel, a rear panel, a top panel, a bottom panel, a left panel, and a right panel. An inner box is provided in the outer box, which is composed of a left side panel, a right side panel, a top panel, and a bottom panel arranged in a rectangle. The left side panel, right side panel, top panel, and bottom panel are located inside the left side panel, right side panel, top panel, and bottom panel, respectively, and all have gaps, thus forming an air intake duct with a "U" shaped structure. The front and rear edges of the left side panel, right side panel, top panel, and bottom panel extend sealed to the front and rear panels, respectively. The upper and lower edges of the left side panel and right side panel extend sealed to the top and bottom panels, respectively, thereby dividing the air intake duct into an upper air duct, a lower air duct, a left air duct, and a right air duct.

[0008] The inner casing is divided into a front and rear functional module installation chamber and a rear chamber by vertically arranged vertical partitions. The rear chamber is further divided into an upper exhaust air chamber, an input / output module installation chamber, and a lower exhaust air chamber arranged from top to bottom by two horizontally arranged horizontal partitions. The vertical partition at the input / output module installation chamber is provided with several blind inserts. The front panel is provided with several air inlets that are respectively connected to the upper air duct, lower air duct, left air duct, and right air duct. The upper air duct and lower air duct are respectively connected to the upper exhaust air chamber and lower exhaust air chamber through several first ventilation openings. The upper and lower ends of the left air duct and right air duct are respectively connected to the upper exhaust air chamber and lower exhaust air chamber through several second ventilation openings. The rear panel at the upper exhaust air chamber and lower exhaust air chamber is provided with several exhaust vents, and an exhaust fan is installed on the outside of each exhaust vent.

[0009] Several heat-conducting plates are arranged vertically side by side in the inner box, and the upper and lower edges of each heat-conducting plate extend into the upper air duct and the lower air duct, respectively.

[0010] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0011] The high-power electronic chassis with tri-proof features employing the above technical solutions has its upper and lower edges of each heat-conducting plate extending directly into the upper and lower air ducts. This not only shortens the heat transfer path but also maximizes the heat transfer contact area with the functional modules, efficiently dissipating heat from the functional modules into the air intake duct and preventing module damage or failure due to high temperatures. Furthermore, the air intake duct has a U-shaped structure and actively draws air from the upper and lower exhaust chambers using two rows of exhaust fans, effectively removing heat from the heat-conducting plates and the inner casing, resulting in extremely high heat dissipation efficiency. Simultaneously, the inner casing is completely sealed, with all functional modules installed in the functional module mounting chamber, completely preventing damage caused by environmental contaminants such as salt spray, water, and dust. Input / output modules are installed in the input / output module mounting chamber and connected to the functional modules via blind-plugging, facilitating assembly and ensuring the airtightness of the inner casing. Moreover, the high-power electronic chassis has high overall structural strength, is not easily deformed, and has a low manufacturing cost. Attached Figure Description

[0012] Figure 1 A front view of a high-power electronic chassis;

[0013] Figure 2 Left view of a high-power electronic chassis;

[0014] Figure 3 Rear view of a high-power electronic chassis after the exhaust fan has been removed;

[0015] Figure 4 A top view of a high-power electronic chassis;

[0016] Figure 5 Schematic diagram after removing the front panel; Figure 1 Schematic diagram after removing the front panel;

[0017] Figure 6 Schematic diagram of the sectional view at A - A in; Figure 5 Schematic diagram of the sectional view at A - A in;

[0018] Figure 7 Schematic diagram after removing the left panel; Figure 2 Schematic diagram after removing the left panel;

[0019] Figure 8 Schematic diagram after removing the top panel; Figure 4 Schematic diagram after removing the top panel; Specific implementation manners

[0020] The present invention will be further described below in conjunction with embodiments and the accompanying drawings.

[0021] As Figures 1-8 shown, a high - power electronic chassis with three - proof functions mainly includes an outer box body 1 and an inner box body 2 arranged in the outer box body 1. Among them, the outer box body 1 is a cuboid structure surrounded by a front panel 1a, a rear panel 1b, a top panel 1c, a bottom panel 1d, a left panel 1e and a right panel 1f, and the inner box body 2 is composed of a left side plate 2a, a right side plate 2b, a top plate 2c and a bottom plate 2d arranged in a rectangular layout.

[0022] Please refer to Figure 5 , the left side plate 2a, the right side plate 2b, the top plate 2c and the bottom plate 2d are respectively located inside the left panel 1e, the right panel 1f, the top panel 1c and the bottom panel 1d, and all have gaps, thus jointly forming an air inlet air duct 3 in a "return" - shaped structure.

[0023] Please refer to Figure 6 , the front edges and rear edges of the left side plate 2a, the right side plate 2b, the top plate 2c and the bottom plate 2d are respectively sealed and extended to the front panel 1a and the rear panel 1b. Please refer to Figure 5 , the upper edges and lower edges of the left side plate 2a and the right side plate 2b are respectively sealed and extended to the top panel 1c and the bottom panel 1d, thereby dividing the air inlet air duct 3 into an upper air duct 3a, a lower air duct 3b, a left air duct 3c and a right air duct 3d.

[0024] Please refer to Figure 3 , Figure 6 and Figure 7 , in the inner box body 2, it is divided into a function module installation chamber and a rear side chamber arranged front - to - back by a vertically arranged vertical partition 2e, and the rear side chamber is divided into an upper exhaust chamber 2g, an input / output module installation chamber 2h and a lower exhaust chamber 2i arranged from top to bottom by two horizontally arranged horizontal partitions 2f.

[0025] The vertical partition 2e located at the input / output module mounting cavity 2h is provided with several blind plugs 4. Therefore, the inner box 2 is completely sealed, and all functional modules are installed in the functional module mounting cavity. This can completely avoid damage caused by environmental pollutants such as salt spray, water and dust. The input / output modules are installed in the input / output module mounting cavity 2h and are connected to the functional modules through blind plugs 4. This not only facilitates assembly but also ensures the sealing of the inner box 2.

[0026] Please see Figure 1 as well as Figures 5-8 The front panel 1a has several air inlets 1a1 that are connected to the upper air duct 3a, lower air duct 3b, left air duct 3c and right air duct 3d respectively. In this embodiment, the air inlets 1a1 are arranged in a ring on the front panel 1a to make the upper air duct 3a, lower air duct 3b, left air duct 3c and right air duct 3d more evenly receive air, thereby improving the heat dissipation efficiency.

[0027] The upper air duct 3a and the lower air duct 3b are connected to the upper exhaust cavity 2g and the lower exhaust cavity 2i respectively through a number of first ventilation openings 3e. In this embodiment, a number of first ventilation openings 3e are evenly distributed at the rear of the top plate 2c and the bottom plate 2d, which can effectively improve the air guiding efficiency.

[0028] The upper and lower ends of the left air duct 3c and the right air duct 3d are connected to the upper exhaust air chamber 2g and the lower exhaust air chamber 2i respectively through several second ventilation openings 3f. Several exhaust vents 1b1 are opened on the rear panel 1b located at the upper exhaust air chamber 2g and the lower exhaust air chamber 2i, and an exhaust fan 5 is installed on the outside of each exhaust vent 1b1. The air inlet duct 3 has a "U" shaped structure, and by actively drawing air from the upper exhaust air chamber 2g and the lower exhaust air chamber 2i through the upper and lower rows of exhaust fans 5, it can remove the heat transmitted from the heat conduction plates 6 and the inner box 2 with extremely high heat dissipation efficiency.

[0029] Please see Figures 5-7 Several heat-conducting plates 6 are arranged vertically side by side in the inner casing 2. The upper and lower edges of each heat-conducting plate 6 extend into the upper air duct 3a and the lower air duct 3b, respectively. Not only is the heat transfer path short, but the heat transfer contact surface between the heat-conducting plate 6 and the functional module is also large, thereby efficiently transferring the heat of the functional module to the air inlet duct 3 and avoiding the problem of functional module damage and failure due to high temperature.

[0030] Please see Figure 8Each heat-conducting plate 6 includes thermally conductive silicone 6a and aluminum plates 6b and copper plates 6c respectively attached to both sides of the silicone 6a. The upper and lower edges of each aluminum plate 6b extend into the upper air duct 3a and lower air duct 3b, respectively. Each copper plate 6c is used to install functional modules and conduct heat dissipation for the functional modules. The thermally conductive silicone 6a ensures complete ground contact with the aluminum plates 6b and copper plates 6c. By setting the thermally conductive silicone 6a, the heat conduction efficiency between the copper plates 6c and aluminum plates 6b can be significantly improved, better protecting the functional modules. Furthermore, the gaps between the aluminum plates 6b and the top plate 2c and bottom plate 2d are sealed by welding or sealant to ensure the airtightness of the inner casing 2 and prevent environmental pollutants such as salt spray, water, and dust from entering.

[0031] Similarly, please see Figure 4 A sealing strip 8 is detachably installed around the front edge of the inner box 2, which is in an interference fit with the front panel 1a and the inner box 2 to ensure the airtightness of the inner box 2 and prevent environmental pollutants such as salt spray, water and dust from entering.

[0032] Please see Figure 5 Several quick-change locking devices 7 for unlocking or locking functional modules are installed on the side surfaces of the top plate 2c and the bottom plate 2d away from the upper air duct 3a and the lower air duct 3b, respectively. Each quick-change locking device 7 is close to the corresponding heat-conducting plate 6, which can quickly install and remove the functional module onto the heat-conducting plate 6, thereby improving the efficiency of functional module replacement.

[0033] Please see Figure 8 The top plate 2c and the bottom plate 2d are respectively located on one side of the upper air duct 3a and the lower air duct 3b. Several upper heat dissipation teeth 2j are arranged around each heat conduction plate 6. Each upper heat dissipation tooth 2j extends in the front-back direction, thereby further increasing the exchange area between the inner box 2 and the cold air and improving the heat dissipation efficiency of the inner box 2.

[0034] Similarly, please see Figure 7 The left side plate 2a and the right side plate 2b are respectively located on one side surface of the left air duct 3c and the right air duct 3d, and are provided with several side heat dissipation teeth 2k that extend in the front-back direction, thereby further increasing the exchange area between the inner box 2 and the cold air and improving the heat dissipation efficiency of the inner box 2.

[0035] Please see Figure 6 The top plate 2c and the bottom plate 2d are respectively formed with several functional module installation guide grooves 2l on the side surface away from the upper air duct 3a and the lower air duct 3b. By setting the guide grooves 2l, the functional modules can be slidably guided during installation and removal, which not only improves the installation and removal efficiency, but also avoids bumps and protects the functional modules to a certain extent.

[0036] Please see Figure 2The front panel 1a is installed and removed using quick-release bolts 9. Combined with modular functional modules, this greatly improves the efficiency of installation and removal, enabling quick replacement and repair of functional modules.

[0037] It should be noted that both the outer casing 1 and the inner casing 2 are made of materials with good electromagnetic compatibility in order to improve the compatibility with functional modules.

[0038] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention. Those skilled in the art, under the guidance of the present invention, can make various similar representations without departing from the spirit and claims of the present invention, and such modifications all fall within the protection scope of the present invention.

Claims

1. A high-power electronic chassis with tri-proof features, comprising an outer casing with a cuboid structure formed by a front panel, a rear panel, a top panel, a bottom panel, a left panel, and a right panel, characterized in that: An inner box body is arranged in the outer box body. The inner box body is composed of a left side plate, a right side plate, a top plate and a bottom plate arranged in a rectangular layout. The left side plate, the right side plate, the top plate and the bottom plate are respectively located inside the left panel, the right panel, the top panel and the bottom panel, and gaps are left, so as to jointly form an air inlet air duct with a "return" shape structure. The front edges and rear edges of the left side plate, the right side plate, the top plate and the bottom plate respectively extend to the front panel and the rear panel in a sealed manner. The upper edges and lower edges of the left side plate and the right side plate respectively extend to the top panel and the bottom panel in a sealed manner, so as to divide the air inlet air duct into an upper air duct, a lower air duct, a left air duct and a right air duct; The inner box body is divided into a function module installation chamber and a rear side chamber arranged front and rear by a vertically arranged vertical partition plate. The rear side chamber is divided into an upper exhaust air chamber, an input / output module installation chamber and a lower exhaust air chamber arranged from top to bottom by two horizontally arranged transverse partition plates. A plurality of blind plugs are arranged on the vertical partition plate at the input / output module installation chamber. A plurality of air inlets respectively communicating with the upper air duct, the lower air duct, the left air duct and the right air duct are formed on the front panel. The air inlets are annularly distributed on the front panel. A plurality of first ventilation openings are uniformly distributed at the rear parts of the top plate and the bottom plate. The upper air duct and the lower air duct respectively communicate with the upper exhaust air chamber and the lower exhaust air chamber through a plurality of first ventilation openings. The upper and lower ends of the left air duct and the right air duct respectively communicate with the upper exhaust air chamber and the lower exhaust air chamber through a plurality of second ventilation openings. A plurality of exhaust openings are formed on the rear panel at the upper exhaust air chamber and the lower exhaust air chamber. Exhaust fans are installed on the outer sides of each exhaust opening; A plurality of heat conducting plates are arranged side by side vertically in the inner box body. The upper edges and lower edges of each heat conducting plate respectively extend into the upper air duct and the lower air duct; Each heat conducting plate includes heat conducting silica gel, an aluminum plate and a copper plate respectively attached to both sides of the heat conducting silica gel. The upper edges and lower edges of each aluminum plate respectively extend into the upper air duct and the lower air duct. Each copper plate is used for installing a function module and conducting heat dissipation to the function module. The gaps between the aluminum plates and the top plate and the bottom plate are sealed by welding or sealant; Quick change locking devices for unlocking or locking function modules are installed on the one-side surfaces of the top plate and the bottom plate respectively far away from the upper air duct and the lower air duct. Each quick change locking device is adjacent to the corresponding heat conducting plate. The front panel is installed and disassembled by quick-install bolts.

2. The high-power electronic chassis with tri-proof function according to claim 1, characterized in that: On the one-side surfaces of the top plate and the bottom plate respectively located in the upper air duct and the lower air duct, a plurality of upper heat dissipation teeth arranged around each heat conducting plate are provided. Each upper heat dissipation tooth extends along the front and rear directions.

3. The high-power electronic chassis with tri-proof function according to claim 1 or 2, characterized in that: On the one-side surfaces of the left side plate and the right side plate respectively located in the left air duct and the right air duct, a plurality of side heat dissipation teeth all extending along the front and rear directions are provided.

4. The high-power electronic chassis with tri-proof function according to claim 1, characterized in that: A sealing rubber strip in interference fit with the front panel and the inner box body is detachably installed at the front edge of the inner box body.

5. The high-power electronic chassis with tri-proof function according to claim 1, characterized in that: Function module installation guiding sliding grooves are formed on the one-side surfaces of the top plate and the bottom plate respectively far away from the upper air duct and the lower air duct.

Citation Information

Patent Citations

  • Box surface cooling system

    CN206251541U

  • Closed air-cooling heat dissipation structure

    CN216600608U

  • Three-proofing high-power-consumption electronic case

    CN218886529U