Temperature-controlled oscillation device

Abstract

The application discloses a temperature-controlled oscillation device, which comprises a supporting base, a fixing glue, an integrated circuit, at least one conducting medium, a temperature sensor, a quartz crystal package and a heater. The fixing glue is arranged on the supporting base, and the integrated circuit is arranged on the fixing glue. The conducting medium and the temperature sensor are arranged on the integrated circuit. The quartz crystal package is arranged on the conducting medium. The quartz crystal package comprises a first quartz substrate, a second quartz substrate and a third quartz substrate. The heater is arranged on the quartz crystal package or the integrated circuit, and no base is arranged between the integrated circuit and the quartz crystal package.

Description

Technical Field

[0001] This invention relates to an oscillation device, and more particularly to a temperature-controlled oscillation device. Background Technology

[0002] With the trend of system integration, clock components are now found in various electronic systems. Integrating clock components with sensing components into electronic systems is one of the mainstream semiconductor packaging technologies to date. Since using quartz crystal piezoelectric elements as oscillators is currently the best choice in terms of accuracy and stability, most current practices use quartz crystals as clock components. According to the International Electrotechnical Commission (IEC), quartz crystal piezoelectric element oscillators are classified into four categories: simple packaged crystal oscillators (SPXO), voltage controlled crystal oscillators (VCXO), temperature compensated crystal oscillators (TCXO), and oven controlled crystal oscillators (OCXO). With the booming development of the electronics industry, electronic products are trending towards multifunctionality, high performance, and compactness. Existing packaging technologies are no longer sufficient to meet the high-density and miniaturization requirements of semiconductor wafers.

[0003] Generally, with the miniaturization of semiconductor piezoelectric devices, existing technologies primarily involve encapsulating a quartz crystal and an integrated circuit separately in ceramic packages before performing subsequent electrical connections. However, considering the problem of the quartz crystal tilting downwards and contacting the lower substrate, existing package structures often have a cavity on the surface of the lower substrate to house the quartz crystal. Within the cavity, the quartz crystal is adhered to the ceramic substrate using adhesive. However, the performance of the quartz crystal deteriorates due to adhesive aging. Furthermore, ceramic package structures consist of multiple stacked ceramic layers, which are difficult to align precisely. If the ceramic layers are not accurately aligned, the performance of the quartz crystal will deteriorate, and the entire ceramic package cannot be miniaturized. Achieving precise alignment of these ceramic layers necessitates increased manufacturing costs.

[0004] Therefore, the present invention addresses the aforementioned problems by proposing a temperature-controlled oscillation device to solve the existing issues. Summary of the Invention

[0005] The main objective of this invention is to provide a temperature-controlled oscillation device that avoids the degradation of quartz crystal performance due to adhesive aging, and achieves miniaturization and cost savings in manufacturing.

[0006] In one embodiment of the present invention, a temperature-controlled oscillation device includes a support base, a fixing adhesive, an integrated circuit, at least one conductive medium, a temperature sensor, a quartz crystal package, and a heater. The fixing adhesive is disposed on the support base, the integrated circuit is disposed on the fixing adhesive, and the conductive medium and temperature sensor are disposed on the integrated circuit. The quartz crystal package is disposed on the conductive medium and includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The first quartz substrate is disposed on the conductive medium, and the second quartz substrate has a peripheral region and a resonant region, wherein the peripheral region surrounds and connects to the resonant region, and the thickness of the resonant region is less than the thickness of the peripheral region. The third quartz substrate is disposed in the peripheral region of the second quartz substrate. The heater is disposed on the quartz crystal package or the integrated circuit, wherein no base is provided between the integrated circuit and the quartz crystal package.

[0007] In one embodiment of the present invention, the conductive medium includes thermally conductive adhesive, a first conductive pad is provided on the integrated circuit, the conductive medium and the first conductive pad are provided in different areas of the integrated circuit, a second conductive pad is provided on the third quartz substrate, and the second conductive pad and the first conductive pad are electrically connected to each other through conductive lines.

[0008] In one embodiment of the present invention, the conductive medium includes a conductive pad.

[0009] In one embodiment of the present invention, the temperature-controlled oscillation device further includes a connecting end disposed at the bottom of the support base.

[0010] In one embodiment of the present invention, the temperature-controlled oscillation device further includes a cover disposed on a support base, wherein the cover shields and protects the fixing adhesive, conductive medium, integrated circuit, quartz crystal package, temperature sensor and heater.

[0011] In one embodiment of the present invention, the quartz crystal package further includes a fourth quartz substrate disposed between the first quartz substrate and the conductive medium.

[0012] In one embodiment of the present invention, the heater is disposed on a third quartz substrate.

[0013] In one embodiment of the invention, the heater is embedded in a quartz crystal package.

[0014] In one embodiment of the invention, the temperature-controlled oscillation device further includes a passive element integrated with a quartz crystal package.

[0015] In one embodiment of the present invention, the heater is embedded between the first quartz substrate and the conductive medium, or between the conductive medium and the integrated circuit.

[0016] In one embodiment of the present invention, the temperature-controlled oscillation device further includes an encapsulating colloid covering the support base, fixing adhesive, integrated circuit, conductive medium, quartz crystal encapsulation, temperature sensor and heater.

[0017] In one embodiment of the present invention, the support base is a quartz base.

[0018] In one embodiment of the present invention, the support base is a conductor frame.

[0019] In one embodiment of the present invention, the temperature-controlled oscillation device further includes an encapsulating colloid disposed on a support base, the encapsulating colloid covering the fixing adhesive, integrated circuit, conductive medium, quartz crystal encapsulation, temperature sensor and heater.

[0020] Based on the above, the temperature-controlled oscillation device stacks quartz crystals onto an integrated circuit, wherein the quartz crystal package includes three stacked quartz substrates. Therefore, the temperature-controlled oscillation device can avoid the performance degradation of the quartz crystal due to adhesive aging, and achieve miniaturization and cost savings. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the temperature-controlled oscillation device according to the first embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of the structure of the temperature-controlled oscillation device according to the second embodiment of the present invention.

[0023] Figure 3 This is a schematic diagram of the temperature-controlled oscillation device according to the third embodiment of the present invention.

[0024] Figure 4 This is a schematic diagram of the structure of the temperature-controlled oscillation device according to the fourth embodiment of the present invention.

[0025] Figures 5 to 9 The diagram shows the structure of a quartz crystal package, an integrated circuit, at least one conductive medium, and a heater according to different embodiments of the present invention.

[0026] Figure 10 This is a schematic diagram of the structure of the temperature-controlled oscillation device according to the fifth embodiment of the present invention.

[0027] Figure 11 This is a schematic diagram of the structure of the temperature-controlled oscillation device according to the sixth embodiment of the present invention.

[0028] Figure 12 This is a schematic diagram of the temperature-controlled oscillation device according to the seventh embodiment of the present invention.

[0029] Figure 13 This is a schematic diagram of the structure of the temperature-controlled oscillation device according to the eighth embodiment of the present invention.

[0030] Figure 14 This is a schematic diagram of the temperature-controlled oscillation device according to the ninth embodiment of the present invention.

[0031] Figure 15 This is a schematic diagram of the structure of the temperature-controlled oscillation device according to the tenth embodiment of the present invention.

[0032] Figure 16 This is a schematic diagram of the temperature-controlled oscillation device according to the eleventh embodiment of the present invention.

[0033] Figure 17 This is a schematic diagram of the temperature-controlled oscillation device according to the twelfth embodiment of the present invention.

[0034] Explanation of reference numerals in the attached figures: 1-Temperature-controlled oscillation device; 10-Support base; 11-Fixing adhesive; 12-Integrated circuit; 13-Conductive medium; 14-Temperature sensor; 15-Quartz crystal package; 150-First quartz substrate; 151-Second quartz substrate; 1510-Peripheral region; 1511-Resonant region; 152-Third quartz substrate; 153-Fourth quartz substrate; 16-Heater; 17-First conductive pad; 18-Second conductive pad; 19-Third conductive pad; 20-Connecting end; 21-Passive component; 22-Cover; 23-Encapsulating adhesive. Detailed Implementation

[0035] Embodiments of the present invention will be further explained below with reference to the accompanying drawings. Wherever possible, the same reference numerals in the drawings and description represent the same or similar components. In the drawings, shapes and thicknesses may be exaggerated for simplicity and convenience. It is understood that elements not specifically shown in the drawings or described in the description are forms known to those skilled in the art. Those skilled in the art can make various changes and modifications based on the content of this invention.

[0036] Unless otherwise specified, certain conditional clauses or words, such as "can," "could," "might," or "may," are generally intended to express features, elements, or steps that are present in the embodiments of this invention, but may also be interpreted as features, elements, or steps that may not be required. In other embodiments, these features, elements, or steps may be unnecessary.

[0037] In the following description of "one embodiment" or "an embodiment," the term refers to a specific element, structure, or feature associated with at least one embodiment. Therefore, the multiple descriptions of "one embodiment" or "an embodiment" appearing in various places below do not refer to the same embodiment. Furthermore, specific components, structures, and features in one or more embodiments may be combined in a suitable manner.

[0038] Certain terms are used in the specification and claims to refer to specific elements. However, those skilled in the art will understand that the same element may be referred to by different names. The specification and claims do not distinguish elements by differences in name, but by differences in function. The term "comprising" in the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to". Furthermore, "coupled" here includes any direct and indirect means of connection. Therefore, if the text describes a first element coupled to a second element, it means that the first element can be directly connected to the second element via electrical connection or signal connection methods such as wireless transmission or optical transmission, or indirectly electrically or signalally connected to the second element via other elements or connection means.

[0039] The disclosure is specifically described with reference to the following examples, which are merely illustrative. Various modifications and refinements can be made by those skilled in the art without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended claims. Throughout the specification and claims, unless explicitly stated otherwise, the words “a” and “described” include statements containing “a or at least one” of the stated elements or components. Furthermore, as used in this disclosure, the singular article also includes statements of multiple elements or components unless clearly excluded from the specific context. Moreover, when applied in this description and throughout the claims below, unless explicitly stated otherwise, “in which” may include both “in which” and “on which”. The terms used throughout the specification and claims, unless otherwise specified, generally have their ordinary meaning in the context of this art, the content of this disclosure, and the specific content. Certain terms used to describe this disclosure will be discussed below or elsewhere in this specification to provide additional guidance to practitioners in describing this disclosure. Examples throughout this specification, including examples of any terms discussed herein, are merely illustrative and do not, of course, limit the scope or meaning of this disclosure or any illustrative terms. Similarly, this disclosure is not limited to the various embodiments set forth in this specification.

[0040] The following describes a temperature-controlled oscillation device that utilizes semiconductor manufacturing processes to create wafer-level quartz crystal packages. These wafer-level quartz crystal packages are then stacked onto integrated circuits to prevent the quartz crystals from degrading due to colloid aging, thereby achieving miniaturization and cost savings.

[0041] Figure 1 This is a schematic diagram of the temperature-controlled oscillation device according to the first embodiment of the present invention. Please refer to [link / reference]. Figure 1The first embodiment of the present invention is described below. The temperature-controlled oscillation device 1 includes a support base 10, a fixing adhesive 11, an integrated circuit 12, at least one conductive medium 13, a temperature sensor 14, a quartz crystal package 15, and a heater 16. For clarity and convenience, the first embodiment uses a conductive medium 13 as an example. The conductive medium 13 can be implemented with thermally conductive adhesive, but the present invention is not limited thereto. Furthermore, the support base 10 can be implemented with a quartz base, but the present invention is not limited thereto. The fixing adhesive 11 is disposed on the support base 10, and the integrated circuit 12 is disposed on the fixing adhesive 11. The conductive medium 13 and the temperature sensor 14 are disposed on the integrated circuit 12, and the quartz crystal package 15 is disposed on the conductive medium 13. The quartz crystal package 15 includes a first quartz substrate 150, a second quartz substrate 151, and a third quartz substrate 152. A first quartz substrate 150 is disposed on the conductive medium 13. A second quartz substrate 151 has a peripheral region 1510 and a resonant region 1511, wherein the peripheral region 1510 surrounds and connects to the resonant region 1511, and the thickness of the resonant region 1511 is less than the thickness of the peripheral region 1510. A third quartz substrate 152 is disposed on the peripheral region 1510 of the second quartz substrate 151. A heater 16 is disposed on the quartz crystal package 15 or the integrated circuit 12, wherein no base, such as a ceramic base, is provided between the integrated circuit 12 and the quartz crystal package 15, allowing the integrated circuit 12 to easily control the temperature of the quartz crystal package 15. The quartz crystal package 15, fabricated using semiconductor processes, can avoid the performance degradation of the quartz crystal caused by colloid aging, thereby achieving miniaturization and cost savings.

[0042] In some embodiments of the present invention, the integrated circuit 12 is provided with a first conductive pad 17, and the conductive medium 13, temperature sensor 14 and the first conductive pad 17 are provided in different areas of the integrated circuit 12. The third quartz substrate 152 is provided with a second conductive pad 18, and the second conductive pad 18 and the first conductive pad 17 are electrically connected to each other through conductive lines. The support base 10 may be provided with a third conductive pad 19, and the third conductive pad 19 and the first conductive pad 17 are electrically connected to each other through conductive lines. In addition, the temperature-controlled oscillation device 1 may also include a bonding end 20, a passive element 21 and a cover 22. The bonding end 20 is provided at the bottom of the support base 10, the passive element 21 is integrated with the quartz crystal package 15, and the cover 22 is provided on the support base 10. The cover 22 shields and protects the fixing adhesive 11, the conductive medium 13, the integrated circuit 12, the quartz crystal package 15, the temperature sensor 14, the heater 16, the first conductive pad 17, the second conductive pad 18, the third conductive pad 19 and the passive element 21.

[0043] Figure 2 This is a schematic diagram of the temperature-controlled oscillation device according to a second embodiment of the present invention. Please refer to [link / reference]. Figure 2The second embodiment of the present invention is described below. The difference between the second embodiment and the first embodiment lies in the conductive medium 13. In the second embodiment, the conductive medium 13 is implemented using conductive pads. Therefore, the quartz crystal package 15 is electrically connected to the integrated circuit 12 through the conductive medium 13. Compared to the first embodiment, the second embodiment lacks a second conductive pad disposed on the quartz crystal package 15.

[0044] Figure 3 This is a schematic diagram of the temperature-controlled oscillation device according to the third embodiment of the present invention. Please refer to [link / reference]. Figure 3 The third embodiment of the present invention is described below. The difference between the third embodiment and the first embodiment lies in the quartz crystal package 15. In the third embodiment, the quartz crystal package 15 may further include a fourth quartz substrate 153, which is disposed between the first quartz substrate 150 and the conductive medium 13.

[0045] Figure 4 This is a schematic diagram of the temperature-controlled oscillation device according to the fourth embodiment of the present invention. Please refer to [link / reference]. Figure 4 The fourth embodiment of the present invention is described below. The difference between the fourth embodiment and the second embodiment lies in the quartz crystal package 15. In the fourth embodiment, the quartz crystal package 15 may further include a fourth quartz substrate 153, which is disposed between the first quartz substrate 150 and the conductive medium 13.

[0046] Figures 5 to 9 These are schematic diagrams illustrating the structures of a quartz crystal package, integrated circuit, at least one conductive medium, and heater according to different embodiments of the present invention. Figures 1 to 4 As shown, in the aforementioned embodiment, the heater 16 is formed on the third quartz substrate 152, but the present invention is not limited thereto. Please refer to... Figures 5 to 9 The heater 16 can be embedded in the quartz crystal package 15. For example... Figure 5 As shown, the heater 16 is embedded between the second quartz substrate 151 and the third quartz substrate 152. Figure 6 As shown, the heater 16 is embedded between the second quartz substrate 151 and the first quartz substrate 150. Figure 7 As shown, the heater 16 is embedded between the first quartz substrate 150 and the conductive medium 13. Figure 8 As shown, heater 16 is embedded between integrated circuit 12 and conductive medium 13. Figure 9 As shown, heater 16 is embedded between the fourth quartz substrate 153 and the third quartz substrate 152.

[0047] Figure 10 This is a schematic diagram of the temperature-controlled oscillation device according to the fifth embodiment of the present invention. Please refer to [link / reference]. Figure 10The fifth embodiment of the present invention is described below. The difference between the fifth embodiment and the first embodiment lies in the cover. The cover system of the first embodiment is replaced by the encapsulating colloid 23 of the fifth embodiment. In the fifth embodiment, the encapsulating colloid 23 covers the support base 10, the fixing adhesive 11, the integrated circuit 12, the conductive medium 13, the quartz crystal package 15, the temperature sensor 14, the heater 16, the first conductive pad 17, the second conductive pad 18, the third conductive pad 19, and the passive element 21.

[0048] Figure 11 This is a schematic diagram of the temperature-controlled oscillation device according to the sixth embodiment of the present invention. Please refer to [link / reference]. Figure 11 The sixth embodiment of the present invention is described below. The difference between the sixth embodiment and the second embodiment lies in the cover. The cover system of the second embodiment is replaced by the encapsulating colloid 23 of the fifth embodiment. In the sixth embodiment, the encapsulating colloid 23 covers the support base 10, the fixing adhesive 11, the integrated circuit 12, the conductive medium 13, the quartz crystal package 15, the temperature sensor 14, the heater 16, the first conductive pad 17, the second conductive pad 18, the third conductive pad 19, and the passive element 21.

[0049] Figure 12 This is a schematic diagram of the temperature-controlled oscillation device according to the seventh embodiment of the present invention. Please refer to [link / reference]. Figure 12 The seventh embodiment of the present invention is described below. The difference between the seventh embodiment and the third embodiment lies in the cover. The cover system of the third embodiment is replaced by the encapsulating colloid 23 of the seventh embodiment. In the seventh embodiment, the encapsulating colloid 23 covers the support base 10, the fixing adhesive 11, the integrated circuit 12, the conductive medium 13, the quartz crystal package 15, the temperature sensor 14, the heater 16, the first conductive pad 17, the second conductive pad 18, the third conductive pad 19, and the passive element 21.

[0050] Figure 13 This is a schematic diagram of the temperature-controlled oscillation device according to the eighth embodiment of the present invention. Please refer to [link / reference]. Figure 13 The eighth embodiment of the present invention is described below. The difference between the eighth embodiment and the fourth embodiment lies in the cover. The cover system of the fourth embodiment is replaced by the encapsulating colloid 23 of the eighth embodiment. In the eighth embodiment, the encapsulating colloid 23 covers the support base 10, the fixing adhesive 11, the integrated circuit 12, the conductive medium 13, the quartz crystal package 15, the temperature sensor 14, the heater 16, the first conductive pad 17, the third conductive pad 19, and the passive element 21.

[0051] Figure 14 This is a schematic diagram of the temperature-controlled oscillation device according to the ninth embodiment of the present invention. Please refer to [link / reference]. Figure 14The following describes the ninth embodiment of the present invention. The difference between the ninth embodiment and the first embodiment lies in the cover and the support base 10. The cover of the first embodiment is replaced by the encapsulating adhesive 23 of the ninth embodiment. In the ninth embodiment, the support base 10 is implemented using a lead frame. Compared to the first embodiment, the ninth embodiment lacks a third conductive pad and a bonding end. In the ninth embodiment, the encapsulating adhesive 23 is disposed on the support base 10, and the encapsulating adhesive 23 covers the fixing adhesive 11, the integrated circuit 12, the conductive medium 13, the quartz crystal package 15, the temperature sensor 14, the heater 16, the first conductive pad 17, the third conductive pad 19, and the passive element 21.

[0052] Figure 15 This is a schematic diagram of the temperature-controlled oscillation device according to the tenth embodiment of the present invention. Please refer to [link / reference]. Figure 15 The tenth embodiment of the present invention is described below. The tenth embodiment differs from the second embodiment in that the cover and the support base 10 are different. The cover of the second embodiment is replaced by the encapsulating colloid 23 of the tenth embodiment. In the tenth embodiment, the support base 10 is implemented using a lead frame. Compared to the second embodiment, the tenth embodiment lacks a third conductive pad and a bonding end. In the tenth embodiment, the encapsulating colloid 23 is disposed on the support base 10, and the encapsulating colloid 23 covers the fixing adhesive 11, the integrated circuit 12, the conductive medium 13, the quartz crystal package 15, the temperature sensor 14, the heater 16, the first conductive pad 17, and the passive element 21.

[0053] Figure 16 This is a schematic diagram of the temperature-controlled oscillation device according to the eleventh embodiment of the present invention. Please refer to [link / reference]. Figure 16 The eleventh embodiment of the present invention is described below. The eleventh embodiment differs from the third embodiment in the cover and the support base 10. The cover of the third embodiment is replaced by the encapsulating colloid 23 of the eleventh embodiment. In the eleventh embodiment, the support base 10 is implemented using a lead frame. Compared to the third embodiment, the eleventh embodiment lacks a third conductive pad and a bonding end. In the eleventh embodiment, the encapsulating colloid 23 is disposed on the support base 10, and the encapsulating colloid 23 covers the fixing adhesive 11, the integrated circuit 12, the conductive medium 13, the quartz crystal package 15, the temperature sensor 14, the heater 16, the first conductive pad 17, the second conductive pad 18, and the passive element 21.

[0054] Figure 17 This is a schematic diagram of the temperature-controlled oscillation device according to the twelfth embodiment of the present invention. Please refer to [link / reference]. Figure 17The twelfth embodiment of the present invention is described below. The twelfth embodiment differs from the fourth embodiment in the cover and the support base 10. The cover of the fourth embodiment is replaced by the encapsulating adhesive 23 of the twelfth embodiment. In the twelfth embodiment, the support base 10 is implemented using a leadframe. Compared to the fourth embodiment, the twelfth embodiment lacks a third conductive pad and a bonding end. In the twelfth embodiment, the encapsulating adhesive 23 is disposed on the support base 10, and the encapsulating adhesive 23 covers the fixing adhesive 11, the integrated circuit 12, the conductive medium 13, the quartz crystal package 15, the temperature sensor 14, the heater 16, the first conductive pad 17, and the passive element 21. In the ninth, tenth, eleventh, and twelfth embodiments, leadframe packages can be used, such as Quad Flat No-Leader (QFN), Advanced Quad Flat No-Leader (aQFN), Quad Flat Package (QFP), Low Profile and Thin Quad Flat Package (LQFP / TQFP), Plastic Lead Chip Carrier (PLCC), Small Outline (SO), or Plastic Dual In-line Package (PDIP).

[0055] According to the above embodiments, the temperature-controlled oscillation device stacks quartz crystals and packages them on an integrated circuit, wherein the quartz crystal package includes three stacked quartz substrates. Therefore, the temperature-controlled oscillation device can avoid the degradation of quartz crystal performance due to adhesive aging, and achieve the goals of miniaturization and cost savings.

[0056] The above description is illustrative only and not restrictive of the present invention. Those skilled in the art will understand that many modifications, variations or equivalents can be made without departing from the spirit and scope defined by the claims, and all such modifications, variations or equivalents will fall within the protection scope of the present invention.

Claims

1. A temperature-controlled oscillation device, characterized in that, include: A supporting base; A fixing adhesive is applied to the support base; An integrated circuit is disposed on the adhesive. At least one conductive medium and a temperature sensor are disposed on the integrated circuit; A quartz crystal package is disposed on the at least one conductive medium, wherein the quartz crystal package includes: A first quartz substrate is disposed on the at least one conductive medium; A second quartz substrate has a peripheral region and a resonant region, wherein the peripheral region surrounds and connects the resonant region, and the thickness of the resonant region is less than the thickness of the peripheral region; A third quartz substrate is disposed in the peripheral region of the second quartz substrate; and A fourth quartz substrate, the fourth quartz substrate being disposed between the first quartz substrate and the at least one conductive medium; and A heater is directly disposed between any two of the first quartz substrate, the second quartz substrate, the third quartz substrate, and the fourth quartz substrate, wherein no base is provided between the integrated circuit and the quartz crystal package.

2. The temperature-controlled oscillation device as described in claim 1, characterized in that: The at least one conductive medium includes thermally conductive adhesive, the integrated circuit is provided with a first conductive pad, the at least one conductive medium and the first conductive pad are provided in different areas of the integrated circuit, the third quartz substrate is provided with a second conductive pad, and the second conductive pad and the first conductive pad are electrically connected to each other through conductive lines.

3. The temperature-controlled oscillation device as described in claim 1, characterized in that: The at least one conductive medium includes a conductive pad.

4. The temperature-controlled oscillation device as described in claim 1, characterized in that: It also includes a connecting end, which is located at the bottom of the support base.

5. The temperature-controlled oscillation device as described in claim 1, characterized in that: It also includes a cover disposed on the support base, wherein the cover shields and protects the fixing adhesive, the at least one conductive medium, the integrated circuit, the quartz crystal package, the temperature sensor and the heater.

6. The temperature-controlled oscillation device as described in claim 1, characterized in that: It also includes passive components integrated with the quartz crystal package.

7. The temperature-controlled oscillation device as described in claim 1, characterized in that: It also includes an encapsulating colloid covering the support base, the fixing adhesive, the integrated circuit, the at least one conductive medium, the quartz crystal encapsulation, the temperature sensor, and the heater.

8. The temperature-controlled oscillation device as described in claim 1, characterized in that: The support base is a quartz base.

9. The temperature-controlled oscillation device as described in claim 1, characterized in that: The support base is a conductor frame.

10. The temperature-controlled oscillation device as described in claim 9, characterized in that: It also includes an encapsulating colloid disposed on the support base, the encapsulating colloid covering the fixing adhesive, the integrated circuit, the at least one conductive medium, the quartz crystal encapsulation, the temperature sensor and the heater.

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