A swinging process for cutting sapphire ingots

Abstract

The present invention provides a swinging process for cutting sapphire ingots. Among them, through a swinging mechanism, the ingot at the swinging end reciprocates between the new wire end and the old wire end. The swinging posture of the ingot can ensure that the contact arc length with the diamond wire is reduced. The swinging angle α of the ingot towards the new wire end and the swinging angle β of the ingot towards the old wire end satisfy α > β. In this way, the diamond wire cuts the ingot; by increasing the swinging angle of the ingot when the new wire end exits, the contact arc length between the ingot and the diamond wire is reduced, the wear degree of the new wire end when it exits is decreased, the cutting force during the back-cutting of the old wire end is enhanced, the cutting forces of the diamond wire when the new wire end and the old wire end exit are equalized, the warpage and curvature of the cutting surface of the wafer are effectively reduced, the surface flatness of the wafer after cutting is improved, and thus the quality and yield of sapphire substrate cutting are enhanced.

Description

Technical Field

[0001] The present invention belongs to the technology of LED wafer manufacturing, and particularly relates to a swinging process for cutting sapphire wafers. Background Art

[0002] At present, a sapphire wafer is cut into sapphire wafers of corresponding specifications by a high-speed cutting machine. The transformation from a wafer to a wafer is mainly achieved by using a diamond wire on a high-speed cutting machine, in combination with processes such as feeding motion, workpiece swinging motion, and reciprocating motion of the diamond wire. During cutting, since the wafer is circular, the cutting area changes from small to large and then to small. By controlling the feeding speed to a certain extent, the size of the wire bow of the diamond wire during cutting is controlled. The diamond wire performs periodic reciprocating motion with a certain length. At this time, the wafer also swings left and right at a certain swinging angle. Through a series of process parameter combinations, the cutting force of the diamond wire is balanced to ensure that the cut wafer meets the required quality. Among them, the swinging motion of the workpiece plays a crucial role.

[0003] At present, the equipment for cutting sapphire is basically in the form of workpiece swinging. The mainstream cutting swinging process is to swing the same angle to the left and right, so that the arc length of the diamond wire in contact with the wafer remains basically the same during cutting. Due to the movement mode of the diamond wire between the new wire end and the old wire end, the cutting ability of the new wire end is stronger, while the old wire has been worn after cutting, and the cutting force is weaker, resulting in unbalanced cutting forces at the new wire end and the old wire end, and different abrasive grain morphologies at the two ends of the wire. In this case, when the new wire end exits, after the diamond wire is extruded into a slightly deformed arc state by the cutting surface of the wafer, the surface of the wafer facing the new wire always contacts the new abrasive grains transmitted from the new wire end first; when the old wire end exits, the surface of the wafer facing the old wire always contacts the old abrasive grains transmitted from the old wire end first, resulting in asymmetry in the abrasive grain morphology and cutting groove profile on both sides of the wafer. Even if symmetric swinging actions are taken to make the morphology of the middle cutting groove uniform, the feeding directions of the abrasive grains received by the cutting groove at the swinging end are always different. Therefore, there are always large differences in the cutting groove profiles at the swinging end. As the cutting depth increases, the differences in the cutting groove profiles on both sides continue to accumulate, resulting in a certain warping degree and bending degree on the cutting surface of the cut wafer, and a low flatness of the surface of the cut wafer, which limits the quality and yield of sapphire substrate cutting. Therefore, a new technical solution is needed to improve this situation. Summary of the Invention

[0004] In view of the above problems in the prior art, the present invention provides a swinging process for cutting sapphire wafers, which equalizes the cutting forces at the new wire end and the old wire end of the diamond wire, effectively reduces the warping degree and bending degree of the cutting surface of the wafer, improves the flatness of the surface of the cut wafer, and thereby improves the quality and yield of sapphire substrate cutting.

[0005] The present invention is implemented through the following technical solutions: A swinging process for cutting a sapphire ingot, comprising the following steps:

[0006] Fix the ingot at the swinging end of the swinging mechanism, with the diamond wire on one side of the ingot. Start the feeding mechanism to move the ingot on the swinging mechanism towards the diamond wire mesh position. Start the reciprocating mechanism to draw the diamond wire from the new wire end at a certain wire speed and enter the old wire end. Start the swinging mechanism to make the ingot at the swinging end swing reciprocally between the new wire end and the old wire end. The swinging posture of the ingot can ensure that the contact arc length with the diamond wire is reduced. Among them, the swinging angle α of the ingot towards the new wire end and the swinging angle β of the ingot towards the old wire end satisfy α > β. In this way, the diamond wire cuts the ingot;

[0007] After the diamond wire is drawn from the new wire end and enters the old wire end with a line segment of length X, start the reciprocating mechanism to drive the diamond wire to be drawn from the old wire end in the opposite direction and enter the old wire end with a line segment of length Y. The lengths X and Y satisfy X ≥ Y.

[0008] Further, α is 9° - 11°, and β is 7° - 9°.

[0009] Further, after the diamond wire is drawn from the new wire end and enters the old wire end with a line segment of length X, start the reciprocating mechanism to drive the diamond wire to be drawn from the old wire end in the opposite direction and return to the new wire end with a line segment of length Y. In this way, the diamond wire reciprocates between the new wire end and the old wire end. As the number of reciprocating movements n increases, the length X remains a constant value, and the length Y forms a decreasing sequence of [Y 1 、Y 2 ...Y n , where Y n = Y 1 - nZ, and X > Y 1 > Z.

[0010] Further, X is 1000 ± 10 meters, Y 1 is 990 ± 10 meters, and Z is 10 ± 2 meters.

[0011] Further, during the process that the feeding mechanism moves the ingot on the swinging mechanism towards the diamond wire mesh position, when the cutting depth of the diamond wire on the ingot is 0 - T 1 , the feeding speed of the feeding mechanism is V 1 ; when the cutting depth of the diamond wire on the ingot is T 1 - T 2 , the feeding speed of the feeding mechanism is V 2 ; when the cutting depth of the diamond wire on the ingot is T 2 - T 3 , the feeding speed of the feeding mechanism is V 3 ; where T 3is the diameter of the crystal bar, T 1 <T 2 <T 3 , V 2 <V 1 , V 2 <V 3 .

[0012] Furthermore, the T 1 , the T 2 , the T 3 satisfy: T 1 = T 3 / 6, T 2 = T 3 ·5 / 6, the V 1 , the V 2 , the V 3 satisfy: V 1 = V 3 = 500um / mim - 600um / mim, V 2 = 190um / min - 230um / min.

[0013] Furthermore, the swing speed of the crystal bar swinging reciprocally between the new wire end and the old wire end is 9° / s - 11° / s, and the wire speed of the diamond wire is 1800 ± 10m / min.

[0014] Furthermore, the swing center of the crystal bar swinging reciprocally between the new wire end and the old wire end is the axis of the crystal bar.

[0015] Furthermore, the type of the crystal bar is a sapphire crystal bar, and the size of the crystal bar is 4, 6, 8 inches.

[0016] Furthermore, the swing mechanism includes a swing end, an arc-shaped guide rail, a mounting frame, and a swing motor. The crystal bar is fixed to a resin block at one end of the swing end through AB-type epoxy resin. The other end of the swing end is a circular arc surface and is sleeved in the arc-shaped guide rail. The swing motor is fixedly arranged on the arc-shaped guide rail through the mounting frame. A synchronous pulley is connected to the output shaft of the swing motor. A synchronous belt is installed on the swing pulley and the two end heads of the synchronous belt are led out. The two end heads of the synchronous belt are respectively fixed on both sides of the swing end; the output shaft of the servo cylinder in the feeding mechanism is connected to the mounting frame.

[0017] The beneficial effects of the present invention are as follows: By increasing the rocking angle of the ingot when the new wire end exits, the contact arc length between the ingot and the diamond wire is reduced, the wear degree of the new wire end during exiting is decreased, the cutting force during the back-cutting of the old wire end is enhanced, the cutting forces at the new wire end and the old wire end during wire exiting are equalized, the warpage and curvature of the wafer cutting surface are effectively reduced, the surface flatness of the cut wafer is improved, thereby enhancing the quality and yield of sapphire substrate cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a working state diagram of an embodiment of the present invention;

[0019] Figure 2 is a schematic diagram of the swing of the new wire end in an embodiment of the present invention;

[0020] Figure 3 is a schematic diagram of the swing of the old wire end in an embodiment of the present invention;

[0021] Figure 4 is a partial cutting schematic diagram of an embodiment of the present invention.

[0022] In the figure: 10 - ingot, 10a - cutting surface, 10b - angular body, 10c - cutting groove, 11 - diamond wire, 21 - swing end, 22 - arc-shaped guide rail, 23 - swing motor, 24 - synchronous pulley, 24a - synchronous belt, 31 - servo cylinder. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] The present invention will be further described in detail below in conjunction with the accompanying drawings of the specification and embodiments.

[0024] Embodiment 1

[0025] This embodiment provides a swing process for cutting a sapphire ingot, including the following steps:

[0026] S1: Fix a 6-inch sapphire ingot 10 on a resin block at one end of the swing end 21 by adhering it with AB-type epoxy resin. Connect the two sides of the swing end 21 with the synchronous pulleys 24 on the swing motor 23 through a synchronous belt 24a to form a state as shown in Figure 1 . The diamond wire 11 is located below the ingot 10. Start the servo cylinder 31 in the feeding mechanism, so that the output shaft of the servo cylinder 31 drives the mounting frame, the arc-shaped guide rail 22 and the swing end 21 to move downward as a whole, causing the ingot 10 on the swing end 21 to move towards the diamond wire 11 below and come into contact. Start the reciprocating mechanism simultaneously to make the diamond wire 11 exit from the new wire end (such as Figure 1 the right end) at a wire speed of 1800 m / min and enter the old wire end (such as Figure 1The swing mechanism is started to make the crystal rod 10 at the swing end 21 swing back and forth between the new line end and the old line end. The swing center of the reciprocating swing is the axis of the crystal rod 10. The swing angle of the crystal rod 10 toward the new line end is 10°, forming a Figure 2 In the state shown, the swing angle of the crystal rod 10 toward the old wire end is 8°, forming Figure 3 In the state shown, each time the swing limit posture is reached, the acceleration is decelerated to a standstill at -99° / s2, and then the reverse acceleration is accelerated to a constant swing speed of 10° / s at 99° / s2, and the swing center is the center of the sapphire crystal rod 10, so that the diamond wire 11 cuts the crystal rod 10;

[0027] After the crystal rod 10 is cut by the diamond wire 11 in the center position and a certain cutting arc length is generated, the edge of the cutting surface 10a of the crystal rod 10 must form an angle 10b with the arc surface of the outer surface of the crystal rod 10, such as Figure 4 As shown, the diamond wire 11 is pressed by the cutting surface 10a and is in a slightly bent state. As the swinging action is performed, cutting grooves 10c left by the swinging action are generated on both sides of the cutting surface 10a. When the crystal rod 10 has any swinging angle, the tip of the horn 10b on the edge of the cutting surface 10a can fully resist the diamond wire 11, thereby reducing the contact arc length between the diamond wire 11 and the crystal rod 10. As the feeding action of the crystal rod 10 is performed, the tip of the horn 10b is worn by the diamond wire 11 to generate a new cutting surface 10a. Since the edge of the new cutting surface 10a has a new horn 10b, the crystal rod 10 needs to continue to swing to a larger swing angle, so that the new horn 10b can be pressed against the diamond wire 11. By analogy, the larger the swing angle of the crystal rod 10, the longer the contact time between the horn 10b and the diamond wire 11, the shorter the contact time between the cutting surface 10a and the diamond wire 11, and the lower the wear degree of the diamond wire 11. Therefore, when the crystal rod 10 is reciprocatingly swung, the angle of the crystal rod 10 swinging toward the new wire end on the right side each time (such as Figure 2 10°) are greater than the swing angle of the old line end towards the left (as shown in Figure 3 8°), the abrasive particles fed at the new wire end can immediately contact the more warped horn 10b and reduce the contact arc length. The degree of wear of the diamond wire 11 after it exits from the new wire end on the right and completes cutting is reduced, thereby reducing the wear difference between the new wire end and the old wire end, enhancing the cutting force when the old wire end is cut back, and balancing the cutting force of the diamond wire at the new wire end and the old wire end.

[0028] In this embodiment, the swing angle of the crystal rod 10 toward the right new line end is enlarged, because the right edge of the right horn 10b is the outer arc surface of the crystal rod 10 (such as Figure 4) has a large warping degree and a large included angle with the diamond wire 11. Therefore, when the new wire end exits, the abrasive grains fed by the new wire end cut the side with a large warping degree of the angular body 10b, further reducing the wear degree of the diamond wire at the new wire end and equalizing the cutting forces of the new wire end and the old wire end when they exit.

[0029] In other comparative examples, when the diamond wire 11 exits from the new wire end, the swing angle of the ingot 10 towards the new wire end on the right side each time is set to 8°, and the swing angle of the ingot 10 towards the old wire end on the left side each time is set to 10°. At this time, the swing angle of the ingot 10 towards the old wire end on the left side is amplified. Although this method can ensure the contact between the left angular body 10b and the diamond wire 11, the right edge of the left angular body 10b is the cutting surface 10a (as Figure 4 ) Its contour shape is relatively close to that of the diamond wire 11, its warping degree is small, and the included angle formed with the diamond wire 11 is small. Therefore, when the new wire end exits, the abrasive grains fed by the new wire end cut the side with a small warping degree of the angular body 10b, and the wear degree of the diamond wire at the new wire end cannot be sufficiently reduced.

[0030] Therefore, through the comparison with other comparative examples, it can be seen that the process technology of amplifying the swing angle of the new wire end in this embodiment has obvious advantages, can effectively ensure the equalization of the cutting force, effectively reduce the warping degree and bending degree of the cutting surface of the wafer, improve the surface flatness of the wafer after cutting, and thus improve the quality and yield of the sapphire substrate cutting.

[0031] S2: After the diamond wire 11 is led out from the new wire end and enters the old wire end with a line segment of 1000 m in length, the reciprocating mechanism is started to drive the diamond wire 11 to be led out from the old wire end and return to the new wire end with a line segment of 990 m in length in the opposite direction; then it enters the old wire end from the new wire end with a line segment of 1000 m in length and returns to the new wire end from the old wire end with a line segment of 980 m in length. In this way, the diamond wire 11 reciprocates between the new wire end and the old wire end. As the number of reciprocating movements increases, the length of the wire led out from the new wire end remains 1000 m, and the length of the wire led out from the old wire end decreases by 10 m each time. In this way, each operation of leading out the wire from the old wire end cannot be completely carried out, and each operation of leading out the wire from the new wire end has a brand-new wire led out, so as to ensure that the new wire end maintains the properties of a new wire, prevent the over-repeated use of the wire body, and ensure the smooth implementation of the reciprocating cutting operation.

[0032] S3: During the process that the feeding mechanism moves the ingot 10 on the swinging mechanism towards the wire mesh position of the diamond wire 11, as the cutting depth increases, when the cutting depth of the diamond wire 11 on the ingot 10 is 0 to 1 / 6 of the diameter, the feeding speed of the feeding mechanism is 550 um / min; when the cutting depth of the diamond wire 11 on the ingot 10 is 1 / 6 to 5 / 6 of the diameter, the feeding speed of the feeding mechanism is 210 um / min; when the cutting depth of the diamond wire 11 on the ingot 10 is 5 / 6 to 6 / 6 of the diameter, the feeding speed of the feeding mechanism is 550 um / min; thus, the feeding speed is increased at the relatively narrow parts at both ends of the ingot 10 to ensure efficiency, and the feeding speed is decreased at the relatively wide part in the middle of the ingot 10 to ensure smooth cutting.

[0033] Embodiment 2

[0034] The difference between this embodiment and Embodiment 1 is that a swinging process for cutting a small-sized sapphire ingot is provided, including the following steps:

[0035] S1: Fix a 4-inch sapphire ingot 10 on a resin block at one end of the swinging end 21 by adhering with AB-type epoxy resin. Connect the two sides of the swinging end 21 with the synchronous pulleys 24 on the swinging motor 23 through the synchronous belt 24a to form a state as shown in Figure 1 the figure. The diamond wire 11 is located below the ingot 10. Start the servo cylinder 31 in the feeding mechanism, so that the output shaft of the servo cylinder 31 drives the mounting frame, the arc-shaped guide rail 22 and the swinging end 21 to move downward as a whole, making the ingot 10 on the swinging end 21 move towards the wire mesh position of the diamond wire 11 below and come into contact. Simultaneously start the reciprocating mechanism to make the diamond wire 11 lead out from the new wire end (such as Figure 1 the right end) at a wire speed of 1790 m / min and enter the old wire end (such as Figure 1 the left end). Start the swinging mechanism to make the ingot 10 on the swinging end 21 reciprocate between the new wire end and the old wire end. The reciprocating swing center is the axis of the ingot 10. Among them, the swing angle of the ingot 10 towards the new wire end is 9°, and the swing angle of the ingot 10 towards the old wire end is 7°. Each time when reaching the swing limit posture, decelerate to a stop with an acceleration of -99° / s², and then accelerate to a constant swing speed of 9° / s with a reverse acceleration of 99° / s². The swing center is the center of the sapphire ingot 10. In this way, the diamond wire 11 cuts the ingot 10;

[0036] Since after the ingot 10 is cut by the diamond wire 11 in the centered posture and a certain cutting arc length is generated, the edge of the cutting surface 10a of the ingot 10 will inevitably form an angular body 10b with the arc surface of the outer surface of the ingot 10, as shown in Figure 4As shown in the figure, the diamond wire 11 is pressed by the cutting surface 10a and is in a slightly bent state. As the swinging action is performed, cutting grooves 10c left by the swinging action are generated on both sides of the cutting surface 10a. When the crystal rod 10 generates any swinging angle, the tip of the horn 10b on the edge of the cutting surface 10a can fully resist the diamond wire 11, thereby reducing the contact arc length between the diamond wire 11 and the crystal rod 10. As the feeding action of the crystal rod 10 is performed, the tip of the horn 10b is worn by the diamond wire 11 to generate a new cutting surface 10a. Since the edge of the new cutting surface 10a has a new horn 10b, the crystal rod 10 needs to continue to swing to a larger swinging angle, so that the new horn 10b can resist the diamond wire 11, and so on. It is known that the greater the swing angle of the crystal rod 10, the longer the contact time between the horn 10b and the diamond wire 11, the shorter the contact time between the cutting surface 10a and the diamond wire 11, and the lower the wear degree of the diamond wire 11. Therefore, when the crystal rod 10 swings back and forth, since the swing angle of the crystal rod 10 toward the new wire end on the right side each time is greater than the swing angle toward the old wire end on the left side, the abrasive particles fed from the new wire end can immediately contact the more warped horn 10b and reduce the contact arc length. The wear degree of the diamond wire 11 after it exits from the new wire end on the right side and completes the cutting is reduced, thereby reducing the wear difference between the new wire end and the old wire end, enhancing the cutting force when the old wire end is cut back, and balancing the cutting force of the diamond wire at the new wire end and the old wire end.

[0037] In this embodiment, the swing angle of the crystal rod 10 toward the right new line end is enlarged, because the right edge of the right horn 10b is the outer arc surface of the crystal rod 10 (such as Figure 4 ), which has a larger warping degree and forms a larger angle with the diamond wire 11. Therefore, when the new wire end comes out, the abrasive grains fed by the new wire end cut the side of the angled body 10b with a larger warping degree, further reducing the wear degree of the diamond wire at the new wire end, balancing the cutting force between the new wire end and the old wire end, effectively reducing the warping and curvature of the chip cutting surface, and improving the surface flatness of the chip after cutting, thereby improving the quality and yield of sapphire substrate cutting.

[0038] S2: After the diamond wire 11 is led out from the new wire end and enters the old wire end with a wire segment of 990m in length, the reciprocating mechanism is started to drive the diamond wire 11 to be led out from the old wire end in the opposite direction and return to the new wire end with a wire segment of 980m in length; then, the wire segment of 990m in length enters the old wire end from the new wire end, and returns to the new wire end from the old wire end with a wire segment of 970m in length. In this way, the diamond wire 11 reciprocates between the new wire end and the old wire end. As the number of reciprocating motions increases, the length of the wire coming out of the new wire end remains at 990m, and the length of the wire coming out of the old wire end decreases by 10m each time, so that each time the old wire end is brought out, the wire cannot be completely brought out, and each time the new wire end is brought out, a brand new wire is brought out, thereby ensuring that the new wire end maintains the properties of a new wire, and preventing excessive reuse of the wire body, thereby ensuring the smooth implementation of the reciprocating cutting operation.

[0039] S3: During the process that the feeding mechanism moves the ingot 10 on the swinging mechanism towards the wire mesh position of the diamond wire 11, as the cutting depth increases, when the cutting depth of the diamond wire 11 on the ingot 10 is 0 to 1 / 6 of the diameter, the feeding speed of the feeding mechanism is 600 um / min; when the cutting depth of the diamond wire 11 on the ingot 10 is 1 / 6 to 5 / 6 of the diameter, the feeding speed of the feeding mechanism is 230 um / min; when the cutting depth of the diamond wire 11 on the ingot 10 is 5 / 6 to 6 / 6 of the diameter, the feeding speed of the feeding mechanism is 600 um / min; thus, the feeding speed is increased at the relatively narrow parts at both ends of the ingot 10 to ensure efficiency, and the feeding speed is decreased at the relatively wide part in the middle of the ingot 10 to ensure smooth cutting.

[0040] Embodiment III

[0041] The difference between this embodiment and Embodiment I is that a swinging process for cutting a large-sized sapphire ingot is provided, including the following steps:

[0042] S1: The 8-inch sapphire ingot 10 is adhesively fixed to the resin block at one end of the swinging end 21 through AB-type epoxy resin. The two sides of the swinging end 21 are connected to the synchronous pulleys 24 on the swinging motor 23 through the synchronous belt 24a to form a state as shown in Figure 1 As shown, the diamond wire 11 is located below the ingot 10. Start the servo cylinder 31 in the feeding mechanism, so that the output shaft of the servo cylinder 31 drives the mounting frame, the arc-shaped guide rail 22 and the swinging end 21 to move downward as a whole, making the ingot 10 on the swinging end 21 move towards the wire mesh position of the diamond wire 11 below and come into contact. Simultaneously start the reciprocating mechanism to make the diamond wire 11 lead out from the new wire end (such as Figure 1 the right end) at a wire speed of 1810 m / min and enter the old wire end (such as Figure 1 the left end). Start the swinging mechanism to make the ingot 10 on the swinging end 21 reciprocally swing between the new wire end and the old wire end. The reciprocating swing center is the axis of the ingot 10. Among them, the swing angle of the ingot 10 towards the new wire end is 11°, and the swing angle of the ingot 10 towards the old wire end is 9°. Each time when reaching the swing limit attitude, it decelerates to a stop with an acceleration of -99° / s², and then accelerates to a constant swing speed of 11° / s with a reverse acceleration of 99° / s². The swing center is the center of the sapphire ingot 10. In this way, the diamond wire 11 cuts the ingot 10;

[0043] Since after the ingot 10 is cut by the diamond wire 11 in the centered attitude and a certain cutting arc length is generated, the edge of the cutting surface 10a of the ingot 10 will inevitably form an angular body 10b with the arc surface of the outer surface of the ingot 10, as shown in Figure 4As shown, the diamond wire 11 is pressed by the cutting surface 10a and is in a slightly bent state. As the swinging motion runs, cutting grooves 10c left by the swinging motion are generated on both sides of the cutting surface 10a. When the crystal bar 10 generates any swinging angle, the tip of the angled body 10b at the edge of the cutting surface 10a can fully resist the diamond wire 11, thereby reducing the contact arc length between the diamond wire 11 and the crystal bar 10. As the feeding motion of the crystal bar 10 runs, the tip of the angled body 10b is worn by the diamond wire 11 to generate a new cutting surface 10a. Since the edge of the new cutting surface 10a has a new angled body 10b, at this time, the crystal bar 10 needs to continue swinging to a larger swinging angle so that the new angled body 10b resists the diamond wire 11. By analogy, the larger the swinging angle of the crystal bar 10, the longer the contact time between the angled body 10b and the diamond wire 11, the shorter the contact time between the cutting surface 10a and the diamond wire 11, and the lower the wear degree of the diamond wire 11. Therefore, when the crystal bar 10 swings back and forth, since the angle of each swing of the crystal bar 10 towards the new wire end on the right side is greater than the angle of swing towards the old wire end on the left side, the abrasive grains fed by the new wire end can immediately contact the more warped angled body 10b and reduce the contact arc length. The wear degree of the diamond wire 11 after it exits from the new wire end on the right side and completes cutting is reduced, thereby reducing the wear difference between the new wire end and the old wire end when the wire exits, enhancing the cutting force during the back-cutting of the old wire end, and equalizing the cutting forces of the diamond wire at the new wire end and the old wire end when the wire exits.

[0044] In this embodiment, the swinging angle of the crystal bar 10 towards the new wire end on the right side is enlarged. Since the right edge of the angled body 10b on the right side is the outer arc surface of the crystal bar 10 (such as Figure 4 ), its warping degree is relatively large and the included angle formed with the diamond wire 11 is relatively large. Therefore, when the wire exits from the new wire end, the abrasive grains fed by the new wire end cut the more warped side of the angled body 10b, further reducing the wear degree of the diamond wire at the new wire end, equalizing the cutting forces of the new wire end and the old wire end when the wire exits, effectively reducing the warping degree and bending degree of the cutting surface of the wafer, improving the surface flatness of the wafer after cutting, and thus enhancing the quality and yield of sapphire substrate cutting.

[0045] S2: After the diamond wire 11 is led out from the new wire end and enters the old wire end with a wire segment of 1010 m in length, start the reciprocating mechanism to drive the diamond wire 11 to be led out from the old wire end in the opposite direction and return to the new wire end with a wire segment of 1000 m in length; then enter the old wire end from the new wire end with a wire segment of 1010 m in length, and return to the new wire end from the old wire end with a wire segment of 980 m in length. In this way, the diamond wire 11 reciprocates between the new wire end and the old wire end. As the number of reciprocating movements increases, the length of the wire led out from the new wire end remains 1010 m, and the length of the wire led out from the old wire end decreases by 10 m each time, so that the wire led out from the old wire end cannot be completely taken out during each operation of leading out the wire from the old wire end, and a brand-new new wire is led out during each operation of leading out the wire from the new wire end, thereby ensuring that the new wire end maintains the properties of the new wire, preventing the over-reutilization of the wire body, and ensuring the smooth implementation of the reciprocating cutting operation.

[0046] S3: During the process that the feeding mechanism moves the ingot 10 on the swinging mechanism towards the wire position of the diamond wire 11, as the cutting depth increases, when the cutting depth of the diamond wire 11 on the ingot 10 is 0 to 1 / 6 of the diameter, the feeding speed of the feeding mechanism is 500 um / min; when the cutting depth of the diamond wire 11 on the ingot 10 is 1 / 6 to 5 / 6 of the diameter, the feeding speed of the feeding mechanism is 190 um / min; when the cutting depth of the diamond wire 11 on the ingot 10 is 5 / 6 to 6 / 6 of the diameter, the feeding speed of the feeding mechanism is 500 um / min; thus, the feeding speed is increased at the relatively narrow parts at both ends of the ingot 10 to ensure efficiency, and the feeding speed is decreased at the relatively wide part in the middle of the ingot 10 to ensure smooth cutting.

[0047] The above are only the preferred embodiments of the present invention, and are not used to make formal restrictions on the present invention. It should be understood that under the feature scope defined by the claims, the embodiments can also be modified and changed in other equivalent forms, and these should all be covered within the protection scope of the present invention.

Claims

1. A swinging process for cutting sapphire ingots, characterized in that: It includes the following steps: Fix the ingot at the swinging end of the swinging mechanism, with the diamond wire on one side of the ingot. Start the feeding mechanism to move the ingot on the swinging mechanism towards the diamond wire mesh position. Start the reciprocating mechanism to draw the diamond wire from the new wire end at a certain wire speed and enter the old wire end. Start the swinging mechanism to make the ingot at the swinging end swing reciprocally between the new wire end and the old wire end, where the swinging angle α of the ingot towards the new wire end and the swinging angle β of the ingot towards the old wire end satisfy α > β, and in this way, the diamond wire cuts the ingot; After the diamond wire is drawn from the new wire end and enters the old wire end with a line segment of length X, start the reciprocating mechanism to drive the diamond wire to be drawn from the old wire end in the opposite direction and enter the old wire end with a line segment of length Y, and the lengths X and Y satisfy X ≥ Y; The α is 9° - 11°, and the β is 7° - 9°.

2. The swinging process for cutting sapphire ingots according to claim 1, characterized in that, After the diamond wire is led out from the new wire end and enters the old wire end with a line segment of length X, the reciprocating mechanism is started to drive the diamond wire to be led out from the old wire end and enter the old wire end with a line segment of length Y in the opposite direction. In this way, the diamond wire reciprocates between the new wire end and the old wire end. As the number of reciprocating movements n increases, the length X remains a constant value, and the length Y forms a decreasing sequence of [[Y 1 , Y 2 ... Y n , where Y n = Y 1 - nZ, and X > Y 1 > Z.

3. The swinging process for cutting sapphire ingots according to claim 2, characterized in that, The X is 1000 ± 10 meters, and the Y 1 is 990 ± 10 meters, and the Z is 10 ± 2 meters.

4. The swinging process for cutting sapphire ingots according to claim 1, characterized in that, During the process of the feeding mechanism moving the ingot on the swinging mechanism towards the wire mesh position, the cutting depth of the wire saw on the ingot is 0 to T 1 When it is, the feeding speed of the feeding mechanism is V 1 ; the cutting depth of the wire saw on the ingot is T 1 ~T 2 When it is, the feeding speed of the feeding mechanism is V 2 ; the cutting depth of the wire saw on the ingot is T 2 ~T 3 When it is, the feeding speed of the feeding mechanism is V 3 ; where T 3 is the diameter of the ingot, T 1 <T 2 <T 3 , V 2 <V 1 , V 2 <V 3 .

5. The swinging process for cutting sapphire ingots according to claim 4, characterized in that, The said T 1 、the said T 2 、the said T 3 satisfy: T 1 = T 3 / 6, T 2 = T 3 ·5 / 6, the said V 1 、the said V 2 、the said V 3 satisfy: V 1 = V 3 = 500um / mim ~ 600um / mim, V 2 = 190um / min ~ 230um / min.

6. The swinging process for cutting sapphire ingots according to claim 1, characterized in that, The swinging speed of the ingot swinging reciprocally between the new wire end and the old wire end is 9° / s - 11° / s, and the wire speed of the diamond wire is 1800 ± 10 m / min.

7. The swinging process for cutting sapphire ingots according to claim 1, characterized in that, The swinging center of the ingot swinging reciprocally between the new wire end and the old wire end is the axis of the ingot.

8. The swinging process for cutting sapphire ingots according to claim 1, characterized in that, The type of the ingot is a sapphire ingot, and the size of the ingot is 4, 6 or 8 inches.

9. The swinging process for cutting sapphire ingots according to claim 1, characterized in that, The swinging mechanism includes a swinging end, an arc-shaped guide rail, a mounting frame, and a swinging motor. The ingot is fixed to a resin block at one end of the swinging end through AB-type epoxy resin. The other end of the swinging end is a circular arc surface and is sleeved in the arc-shaped guide rail. The swinging motor is fixedly arranged on the arc-shaped guide rail through the mounting frame. The output shaft of the swinging motor is connected with a synchronous pulley. A synchronous belt is installed on the synchronous pulley and the two end heads of the synchronous belt are led out. The two end heads of the synchronous belt are respectively fixed on both sides of the swinging end; the output shaft of the servo cylinder in the feeding mechanism is connected with the mounting frame.

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