Automatic detection method and system for embedded chip

Abstract

The present application provides an automatic detection method and system for an embedded chip. The automatic detection method is applied to a main control detection module in the automatic detection system for the embedded chip. The main control detection module is connected to a control module, which is in turn connected to an embedded chip. The embedded chip is installed with an operating status test program. The method includes: the main control detection module receives a system operating status detection instruction sent by the control module, and controls the embedded chip to execute the operating status test program based on the system operating status detection instruction; receives an operation result corresponding to the operating status test program sent by the embedded chip; and determines whether the embedded chip has failed based on the operation result. The present application ensures the reliability of the embedded chip by pre-installing the operating status test program in the embedded chip and then determining whether the embedded chip has failed based on whether the embedded chip can normally execute the operating status test program.

Description

Technical Field

[0001] The present application relates to the technical field of detection equipment, and in particular to an automatic detection method and system for embedded chips. Background Art

[0002] With the development of technology, more and more electronic products are controlled by embedded chips.

[0003] Currently, in various electronic products using embedded chips, the normal operation of the chip's internal memory is directly related to whether the electronic product can function properly. In order to improve the yield rate of embedded chips, it is very necessary to test the reliability of embedded chips.

[0004] However, the traditional method for testing embedded chips is to immediately read the software data from the chip's internal memory after burning the embedded chip's software data. The read data is then compared one-by-one with the burned data to determine whether the software data has been successfully burned. After confirming that the burning is successful, an external tool is used to test the software data's running status on the embedded chip to determine whether the embedded chip has malfunctioned. However, testing with external tools requires reading the software data's running status on the embedded chip. After the software data burning test is completed, the embedded chip's read protection function is triggered. Once activated, the software data in the chip's internal memory cannot be read again, making data comparison impossible. Therefore, the reliability of the embedded chip cannot be guaranteed. Summary of the Invention

[0005] The present application provides an automatic detection method and system for an embedded chip. The present application pre-installs an operating status test program in the embedded chip, and then determines whether the embedded chip has failed based on whether the embedded chip can run normally. This ensures the reliability of the embedded chip.

[0006] In a first aspect of the present application, a method for automatically detecting an embedded chip is provided, which is applied to a main control detection module in an automatic detection system for the embedded chip, wherein the automatic detection system further includes a control module, the main control detection module is connected to the control module, and the main control detection module is connected to the embedded chip, wherein the embedded chip is installed with a running status test program, and the method includes:

[0007] receiving a system operation status detection instruction sent by the control module, and controlling the embedded chip to run the operation status test program based on the system operation status detection instruction;

[0008] receiving an operation result corresponding to the operation status test program sent by the embedded chip;

[0009] Whether the embedded chip fails is determined based on the operation result.

[0010] By adopting the above technical solution, by pre-installing the operation status test program in the embedded chip, the control module sends a system operation status detection instruction to the main control detection module, so that the main control detection module controls the embedded chip to run the operation status test program. After the embedded chip runs the operation status test program, it generates an operation result. The main control detection module determines whether the embedded chip has a fault based on the operation result, thereby facilitating the detection of whether the embedded chip has a fault, so that the reliability of the embedded chip is guaranteed.

[0011] Optionally, controlling the embedded chip to run the operating status test program based on the system operating status detection instruction includes:

[0012] controlling the embedded chip to run the operating status test program based on the system operating status detection instruction, so that the embedded chip obtains first feature information generated after running the operating status test program, and compares the first feature information with second feature information written before running the operating status test program;

[0013] The determining whether the embedded chip fails based on the operation result includes:

[0014] If the operation result indicates that the first characteristic information is consistent with the second characteristic information, it is determined that the embedded chip has not failed;

[0015] If the operation result indicates that the first characteristic information is inconsistent with the second characteristic information, it is determined that the embedded chip fails.

[0016] By adopting the above technical solution, when the embedded chip runs the operating status test program, it will obtain the first characteristic information after the operation and compare the first characteristic information with the second characteristic information written before the operation. If the first characteristic information and the second characteristic information are consistent, it is determined that the embedded chip is not faulty; if the first characteristic information and the second characteristic information are inconsistent, it is determined that the embedded chip is faulty. By comparing the first characteristic information and the second characteristic information for consistency, the main control detection module can determine whether the embedded chip is faulty, thereby further ensuring the reliability of the embedded chip.

[0017] Optionally, if the operation result sent by the embedded chip is not received within a preset first time period, it is determined that the embedded chip fails.

[0018] By adopting the above technical solution, if the main control detection module does not receive the operation result sent by the embedded chip within the preset first time period, it is determined that the embedded chip has failed, which has a convenient and quick effect.

[0019] Optionally, the automatic detection system further includes a display module connected to the main control detection module. After determining whether the embedded chip fails based on the operation result, the system further includes:

[0020] A fault result of the embedded chip is obtained, and the fault result is sent to the display module so that the display module displays the fault result.

[0021] By adopting the above technical solution and setting up a display module, when the main control detection module determines whether the embedded chip has failed based on the operation results, a fault result will be generated. The main control detection module will obtain the fault result of the embedded chip and send the fault result to the display module, so that the display module displays the fault result, making it easier for staff to take corresponding measures based on the fault result more intuitively, thereby ensuring the reliability of the embedded chip.

[0022] Optionally, the first characteristic information includes date information after running the running status test program and CRC32 verification information after running the running status test program, and the second characteristic information includes date information written before running the running status test program and CRC32 verification information written before running the running status test program.

[0023] By adopting the above technical solution, by setting the date information and CRC32 check information in the first characteristic information, and the date information and CRC32 check information in the second characteristic information, the first characteristic information and the second characteristic information can be made unique, thereby facilitating improving the accuracy of detection.

[0024] In a second aspect of the present application, an automatic detection system for an embedded chip is provided, the automatic detection system comprising a control module and a main control detection module, wherein the control module is connected to the main control detection module, the control module is used to send a system operation status detection instruction, and control the embedded chip to run the operation status test program based on the system operation status detection instruction; the main control detection module is connected to the control module, and the main control detection module is connected to the embedded chip,

[0025] The main control detection module is used to receive the system operation status detection instruction sent by the control module, and control the embedded chip to run the operation status test program based on the system operation status detection instruction;

[0026] The main control detection module is further used to receive the operation result corresponding to the operation status test program sent by the embedded chip;

[0027] The main control detection module is further used to determine whether the embedded chip fails based on the operation result.

[0028] Optionally, the main control detection module is further configured to receive an operation result corresponding to the operation status test program sent by the embedded chip, specifically to:

[0029] controlling the embedded chip to run the operating status test program based on the system operating status detection instruction, so that the embedded chip obtains first feature information generated after running the operating status test program, and compares the first feature information with second feature information written before running the operating status test program;

[0030] The main control detection module is further used to determine whether the embedded chip has a fault based on the operation result, specifically to:

[0031] If the operation result indicates that the first characteristic information is consistent with the second characteristic information, it is determined that the embedded chip has not failed;

[0032] If the operation result indicates that the first characteristic information is inconsistent with the second characteristic information, it is determined that the embedded chip fails.

[0033] Optionally, the automatic detection system further includes a display module, which is connected to the main control detection module and is used to display the fault result sent by the main control detection module.

[0034] Optionally, the main control detection module is connected to the embedded chip via a UART interface.

[0035] By adopting the above technical solution, the UART interface provides an accurate clock. If there is a problem with the clock of the embedded chip being tested, the UART interface communication will fail, and the main control detection module will be able to detect that there is a fault in the embedded chip.

[0036] In a third aspect of the present application, a computer-readable storage medium is provided, wherein the computer storage medium stores instructions, and when the instructions are executed, the method described in any one of the above methods is executed.

[0037] In summary, this application includes at least one of the following beneficial technical effects:

[0038] 1. This application pre-installs an operating status test program in the embedded chip. The control module sends a system operating status detection instruction to the main control detection module, which controls the embedded chip to run the operating status test program. After the embedded chip runs the operating status test program, it generates an operating result. The main control detection module determines whether the embedded chip has a fault based on the operating result, thereby facilitating the detection of whether the embedded chip has a fault and ensuring the reliability of the embedded chip.

[0039] 2. This declaration can make the first characteristic information and the second characteristic information unique by setting the date information and CRC32 check information in the first characteristic information, as well as the date information and CRC32 check information in the second characteristic information, thereby facilitating improved detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a flow chart of an automatic detection method for an embedded chip according to an embodiment of the present application.

[0041] Figure 2 It is a structural diagram of an automatic detection system for an embedded chip according to an embodiment of the present application.

[0042] Explanation of the accompanying drawings: 11. Main control detection module; 12. Control module; 13. Display module; 14. Embedded chip. DETAILED DESCRIPTION

[0043] In order to enable people skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0044] In the description of the embodiments of this application, words such as "exemplary," "for example," or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary," "for example," or "for example" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary," "for example," or "for example" is intended to present the relevant concepts in a concrete manner.

[0045] In the description of the embodiments of the present application, unless otherwise specified, the term "multiple" means two or more. For example, multiple systems refers to two or more systems, and multiple screen terminals refers to two or more screen terminals. In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0046] Before introducing the embodiments of the present application, some terms involved in the embodiments of the present application are first defined and explained.

[0047] CRC32: Cyclic Redundancy Check (CRC) generates a 32-bit checksum. Because CRC32 calculates every bit of the source data block, even a change in just one bit in the data block will result in a different CRC32 value.

[0048] This application provides an automatic detection method for embedded chips, referring to Figure 1 The main control detection module 11 is applied to the automatic detection system of the embedded chip. The automatic detection system also includes a control module 12. The main control detection module 11 is connected to the control module 12. The main control detection module 11 is connected to the embedded chip 14. The embedded chip 14 is installed with a running status test program. The automatic detection method includes steps S110 to S130. The above steps are as follows:

[0049] S110 , receiving a system operation status detection instruction sent by the control module 12 , and controlling the embedded chip 14 to execute an operation status test program based on the system operation status detection instruction.

[0050] Specifically, the control module 12 sends a system operation status detection instruction to the main control detection module 11. After receiving the system operation status detection instruction, the main control detection module 11 starts to control the operation status test program in the embedded chip 14 to run. The operation status test program is pre-burned into the embedded chip 14 and can run normally on a normal embedded chip 14. The embedded chip 14 obtains the first feature information generated after the main body runs the operation status test program, and then compares the first feature information with the second feature information, where the second feature information is written before the operation status test program is run.

[0051] S120 , receiving the running result corresponding to the running status test program sent by the embedded chip 14 .

[0052] Specifically, after the operating status test program in the embedded chip 14 starts running, after a period of time, the operating status test program will be completed, and the corresponding operating result will be generated at this time, that is, whether it can operate normally or abnormally. The operating results are all generated by the embedded chip 14 itself, and the operating detection process does not require staff participation, saving manpower and time, and facilitating improved detection efficiency. Among them, normal operation means that the embedded chip 14 can run the entire program completely without any errors. For example, if part of the operating status test program is operating normally and part is operating abnormally, the operating result generated by the embedded chip 14 is abnormal operation.

[0053] When the first characteristic information and the second characteristic information are consistent, the embedded chip 14 will generate a corresponding operation result, wherein the operation result can be "PASS" or "Normal", and the specific type is set according to the specific situation and will not be repeated here. When the first characteristic information and the second characteristic information are inconsistent, the embedded chip 14 will generate a corresponding operation result, wherein the operation result can be "FAIL" or "Abnormal", and the specific type is set according to the specific situation and will not be repeated here.

[0054] S130 : Determine whether the embedded chip 14 fails based on the operation result.

[0055] Specifically, the main control detection module 11 obtains the operation result sent by the embedded chip 14 and determines whether the embedded chip 14 has a fault based on the operation result. If the operation result indicates that the first characteristic information and the second characteristic information are consistent, the main control detection module 11 determines that the embedded chip 14 has not failed, that is, the embedded chip 14 can be used normally. If the operation result indicates that the first characteristic information and the second characteristic information are inconsistent, the main control detection module 11 determines that the embedded chip 14 has a fault, which makes it easier for the staff to take appropriate measures, thereby improving the detection efficiency of the embedded chip 14 and ensuring the reliability of the embedded chip 14.

[0056] In a possible implementation, if the operation result sent by the embedded chip 14 is not received within a preset first time period, it is determined that the embedded chip 14 has failed.

[0057] Specifically, if the main control detection module 11 does not receive the operating results sent by the embedded chip 14 within a preset first time period, the main control detection module 11 determines that the embedded chip 14 has failed. The preset first time period can be 5 seconds or 10 seconds, and the specific duration is set according to the specific situation and will not be detailed here. For example, if the main control detection module 11 does not receive the operating results sent by the embedded chip 14 within 5 seconds, the main control detection module 11 automatically determines that the embedded chip 14 has failed.

[0058] In one possible embodiment, the automatic detection system further includes a display module 13, which is connected to the main control detection module 11. After the main control detection module 11 determines whether the embedded chip 14 has a fault based on the operation result, it will generate a fault result and send the fault result to the display module 13; the display module 13 displays the fault result of the embedded chip 14 after receiving it. Among them, the fault result includes two types: no fault and fault. When the fault result of the embedded chip 14 is no fault, the display word of the display module 13 can be "PASS" or "normal". The specific type is set according to the specific situation and will not be repeated here. When the fault result of the embedded chip 14 is a fault, the display word of the display module 13 can be "FAIL" or "abnormal". The specific type is set according to the specific situation and will not be repeated here.

[0059] In one possible implementation, the first characteristic information includes date information after running the running status test program and CRC32 verification information after running the running status test program, and the second characteristic information includes date information written before running the running status test program and CRC32 verification information written before running the running status test program.

[0060] Specifically, before the embedded chip 14 runs the operating status test program, the operating status test program will contain the second characteristic information. After running the operating status test program, the embedded chip 14 will generate the first characteristic information. For example, the date information of the first characteristic information is "2022.10.21", and the CRC32 check information is "c294f5b1", and the date information of the second characteristic information is "2022.10.21", and the CRC32 check information is "fc26498f". If the CRC32 check information of the first characteristic information is inconsistent with the CRC32 check information of the second characteristic information, the main control detection module 11 will determine that the embedded chip 14 has failed. Among them, if the date information and CRC32 check information of the first characteristic information are inconsistent with any of the date information and CRC32 check information of the second characteristic information, the main control detection module 11 will determine that the embedded chip 14 has failed.

[0061] This application also provides an automatic detection system for embedded chips, referring to Figure 2 The automatic detection system includes a control module 12, a display module 13 and a main control detection module 11, wherein the control module 12 is connected to the main control detection module 11, and the control module 12 is used to send a system operation status detection instruction and control the embedded chip 14 to run the operation status test program based on the system operation status detection instruction;

[0062] The main control detection module 11 is connected to the control module 12, and the main control detection module 11 is connected to the embedded chip 14. The main control detection module 11 is used to receive the system operation status detection instruction sent by the control module 12, and control the embedded chip 14 to run the operation status test program based on the system operation status detection instruction; the main control detection module 11 is also used to receive the operation results corresponding to the operation status test program sent by the embedded chip 14; the main control detection module 11 is also used to determine whether the embedded chip 14 has a fault based on the operation results.

[0063] In a possible implementation, the main control detection module 11 controls the embedded chip 14 to run the running status test program based on the system running status detection instruction, including:

[0064] The main control detection module 11 controls the embedded chip 14 to run the running status test program based on the system running status detection instruction, so that the embedded chip 14 obtains the first feature information generated after running the running status test program, and the embedded chip 14 compares the first feature information with the second feature information written before running the running status test program;

[0065] The main control detection module 11 determines whether the embedded chip 14 has a fault based on the operation result, including:

[0066] If the operation result indicates that the first characteristic information is consistent with the second characteristic information, the main control detection module 11 determines that the embedded chip 14 is not faulty;

[0067] If the operation result indicates that the first characteristic information is inconsistent with the second characteristic information, the main control detection module 11 determines that the embedded chip 14 has a fault.

[0068] In a possible implementation, if the main control detection module 11 does not receive the operation result sent by the embedded chip 14 within a preset first time period, the main control detection module 11 determines that the embedded chip 14 has failed.

[0069] In a possible implementation, the automatic detection system further includes a display module 13 , which is connected to the main control detection module 11 . The display module 13 is configured to display the fault result sent by the main control detection module 11 .

[0070] In a possible implementation, the main control detection module 11 obtains the fault result of the embedded chip 14 and sends the fault result to the display module 13 so that the display module 13 displays the fault result.

[0071] In a possible implementation, the main control detection module 11 is connected to the embedded chip 14 via a UART interface.

[0072] It should be noted that the above embodiments provide systems that implement their functions using only the division of the above functional modules as an example. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the system and method embodiments provided in the above embodiments are based on the same concept. The specific implementation process is detailed in the method embodiment and will not be repeated here.

[0073] The present application also provides a computer-readable storage medium, which stores instructions. When the instructions are executed, the above-mentioned automatic detection method for an embedded chip is executed.

[0074] It should be noted that for the aforementioned method embodiments, for simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that this application is not limited by the order of the actions described, because according to this application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required for this application.

[0075] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0076] In the several embodiments provided in this application, it should be understood that the disclosed system can be implemented in other ways. For example, the system embodiments described above are merely schematic, and the division of units, for example, is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interface, and the indirect coupling or communication connection of the system or unit can be electrical or other forms.

[0077] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0078] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0079] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of this application, or the portion that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a memory and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the various embodiments of the method of this application. The aforementioned memory includes various media that can store program code, such as USB flash drives, mobile hard drives, magnetic disks, or optical disks.

[0080] The above is only an exemplary embodiment of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification and the truth of practice, those skilled in the art will easily think of other embodiments of the present disclosure. This application is intended to cover any variation, use or adaptive change of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the art that are not recorded in the present disclosure. The description and examples are to be regarded as exemplary only, and the scope and spirit of the present disclosure are defined by the claims.

Claims

1. A method for automatically detecting an embedded chip, characterized in that: A main control detection module (11) is used in an automatic detection system for an embedded chip, the automatic detection system further comprising a control module (12), the main control detection module (11) being connected to the control module (12), the main control detection module (11) being connected to the embedded chip (14), the embedded chip (14) being installed with a running status test program, and the method comprising: receiving a system operation status detection instruction sent by the control module (12), and controlling the embedded chip (14) to run the operation status test program based on the system operation status detection instruction; receiving an operation result corresponding to the operation status test program sent by the embedded chip (14); determining whether the embedded chip (14) fails based on the operation result; The controlling the embedded chip (14) to run the operating status test program based on the system operating status detection instruction includes: Controlling the embedded chip (14) to run the operating status test program based on the system operating status detection instruction, so that the embedded chip (14) obtains first characteristic information generated after running the operating status test program, and so that the embedded chip (14) compares the first characteristic information with second characteristic information written before running the operating status test program; The determining whether the embedded chip (14) fails based on the operation result includes: If the operation result indicates that the first characteristic information is consistent with the second characteristic information, it is determined that the embedded chip (14) has not failed; If the operation result indicates that the first characteristic information is inconsistent with the second characteristic information, it is determined that the embedded chip (14) has failed; The first characteristic information includes the date information after running the running status test program and the CRC32 check information after running the running status test program, and the second characteristic information includes the date information written before running the running status test program and the CRC32 check information written before running the running status test program.

2. The automatic detection method of embedded chip according to claim 1, characterized in that: The method further comprises: If the operation result sent by the embedded chip (14) is not received within a preset first time period, it is determined that the embedded chip (14) has failed.

3. The automatic detection method of embedded chip according to claim 1, characterized in that: The automatic detection system further comprises a display module (13), wherein the display module (13) is connected to the main control detection module (11), and after determining whether the embedded chip (14) has failed based on the operation result, the system further comprises: A fault result of the embedded chip (14) is obtained, and the fault result is sent to the display module (13), so that the display module (13) displays the fault result.

4. An automatic detection system for embedded chips, characterized in that: The automatic detection system comprises a control module (12) and a main control detection module (11), wherein the control module (12) is connected to the main control detection module (11), the control module (12) is used to send a system operation status detection instruction, and control the embedded chip (14) to run the operation status test program based on the system operation status detection instruction; the main control detection module (11) is connected to the control module (12), and the main control detection module (11) is connected to the embedded chip (14). The main control detection module (11) is used to receive the system operation status detection instruction sent by the control module (12), and control the embedded chip (14) to run the operation status test program based on the system operation status detection instruction; The main control detection module (11) is also used to receive the operation result corresponding to the operation status test program sent by the embedded chip (14); The main control detection module (11) is further used to determine whether the embedded chip (14) has a fault based on the operation result; The main control detection module (11) is also used to receive the operation result corresponding to the operation status test program sent by the embedded chip (14), specifically used to: Controlling the embedded chip (14) to run the operating status test program based on the system operating status detection instruction, so that the embedded chip (14) obtains first characteristic information generated after running the operating status test program, and so that the embedded chip (14) compares the first characteristic information with second characteristic information written before running the operating status test program; The main control detection module (11) is further used to determine whether the embedded chip (14) has a fault based on the operation result, specifically for: If the operation result indicates that the first characteristic information is consistent with the second characteristic information, it is determined that the embedded chip (14) has not failed; If the operation result indicates that the first characteristic information is inconsistent with the second characteristic information, it is determined that the embedded chip (14) has failed; The first characteristic information includes the date information after running the running status test program and the CRC32 check information after running the running status test program, and the second characteristic information includes the date information written before running the running status test program and the CRC32 check information written before running the running status test program.

5. The automatic detection system for embedded chips according to claim 4, characterized in that: The automatic detection system further comprises a display module (13), wherein the display module (13) is connected to the main control detection module (11), and the display module (13) is used to display the fault result sent by the main control detection module (11).

6. The automatic detection system for embedded chips according to claim 4, characterized in that: The main control detection module (11) is connected to the embedded chip (14) via a UART interface.

7. A computer-readable storage medium storing instructions, wherein when the instructions are executed, the method according to any one of claims 1 to 3 is executed.

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