A multi-stage lifting structure and crystal bonding equipment

Abstract

The multi-stage lifting structure and crystal bonding equipment provided by the present invention, when performing the process of separating the chip from the bottom film, drive the end lifting component and the first lifting component through the first lifting avoidance opening along the first direction through the lifting unit, after the end lifting component and the first lifting component synchronously move a first distance along the first direction, the first lifting component is blocked by the first limiting portion, so that the first spring unit enters a compressed state, at this time the lifting unit continues to drive the end lifting component through the first lifting avoidance opening along the first direction, while the first lifting component is blocked, so that the end lifting component rises relative to the first lifting component, thereby completing the separation of the chip from the bottom film; for the chip, its separation from the bottom film includes at least two stages, when the first lifting component and the end lifting component rise at the same time, because the contact area between the multi-stage lifting structure and the bottom film is large at this time, the distance from the edge of the chip to the lifting structure is small, so that the chip is not easy to break.

Description

Technical Field

[0001] The invention relates to the technical field of crystal bonding, and in particular to a multi-stage lifting structure and crystal bonding equipment. Background Art

[0002] Die bonding refers to a process of bonding a wafer to a designated area of ​​a support through colloid to form a thermal or electrical path, providing conditions for subsequent wire bonding. Before the wafer is bonded to the support, it is bonded to a base film. During the die bonding process, a nozzle structure and a lifting structure are usually provided. The lifting structure lifts the corresponding wafer to initially separate the wafer from the base film. At the same time, the nozzle structure can suck the wafer and completely separate it from the base film.

[0003] In the prior art, the lifting structure is usually provided with a lifting block and a cylinder, and the telescopic end of the cylinder is connected to the lifting block, so that the cylinder can drive the lifting block to lift up the local bottom film from bottom to top, and correspondingly lift up the wafer on the bottom film to achieve the initial separation of the wafer and the bottom film; the lifting structure is usually suitable for thicker wafers. For thinner wafers, the wafers are usually brittle. If the above-mentioned lifting structure is directly used to lift the wafer, when the bottom film is lifted, the distance between the edge of the wafer and the lifting structure is large, and when the wafer itself is brittle, it is easy to cause the wafer to break; if the area of ​​the lifting structure is directly expanded, it will lead to incomplete separation of the wafer and the bottom film.

[0004] Therefore, it is necessary to develop a new lifting structure to solve the problem that thinner wafers are easily broken during separation from the base film. Summary of the invention

[0005] The object of the present invention is to provide a multi-stage lifting structure and a crystal bonding device to solve the problem that a thinner crystal chip is easily broken during the process of being separated from a base film.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A multi-stage lifting structure, comprising a shell and a lifting unit, wherein a first lifting avoidance opening is arranged on the shell along a first direction, a first lifting cavity connected to the first lifting avoidance opening is formed in the shell, and a first limiting portion is convexly arranged on the cavity wall of the first lifting cavity;

[0008] A terminal jacking assembly is installed at the lifting end of the lifting unit, and the terminal jacking assembly extends into the first jacking cavity along the first direction and can be driven by the lifting unit to pass through the first jacking avoidance opening;

[0009] The outer sleeve of the terminal lifting assembly is provided with a first lifting assembly, and a first spring unit is arranged between the first lifting assembly and the terminal lifting assembly; along the first direction, one end of the first spring unit abuts against the terminal lifting assembly, and the other end of the first spring unit abuts against the first lifting assembly;

[0010] When the terminal lifting assembly moves a first distance along the first direction, the first lifting assembly abuts against the first limiting portion, and the first spring unit is in a compressed state.

[0011] Optionally, the first lifting component is provided with a second lifting avoidance opening along the first direction, a second lifting cavity communicating with the second lifting avoidance opening is formed in the first lifting component, and a second limiting portion is further provided on the first lifting component;

[0012] A second lifting component is also sleeved outside the terminal lifting component, the second lifting component is located in the second lifting cavity, and the second lifting component can slide in the second lifting cavity along the first direction;

[0013] A second spring unit is provided between the second lifting assembly and the terminal lifting assembly; along the first direction, one end of the second spring unit abuts against the terminal lifting assembly, and the other end of the second spring unit abuts against the second lifting assembly;

[0014] When the second lifting assembly moves a second distance along the first direction, the second lifting assembly abuts against the second limiting portion, and the second spring unit is in a compressed state.

[0015] Optionally, the first limiting portion is convexly disposed on the cavity wall of the first lifting cavity;

[0016] The first lifting assembly includes a first lifting block, the second lifting avoidance opening is opened on the first lifting block, and the second lifting cavity is formed in the first lifting block; the first lifting block is provided with a first clamping ring unit on its outer sleeve;

[0017] Wherein, when the terminal lifting assembly moves a first distance along the first direction, the first clamping ring unit abuts against the first limiting portion.

[0018] Optionally, the second limiting portion is a second clamping ring unit, and the second clamping ring unit is arranged on a side of the first clamping ring unit away from the second jacking avoidance opening;

[0019] When the second lifting assembly moves a second distance along the first direction, the second lifting assembly abuts against the second clamping ring unit, and the second spring unit is in a compressed state.

[0020] Optionally, the second lifting assembly includes a second lifting block, and the second lifting block is provided with a third lifting avoidance opening at a position corresponding to the terminal lifting assembly;

[0021] The second lifting block is fixedly connected with a connecting rod, the connecting rod extends in a direction away from the third lifting avoidance opening, and a limit rod is installed on the connecting rod;

[0022] When the second lifting assembly moves a second distance along the first direction, the limiting rod abuts against the second clamping ring unit.

[0023] Optionally, a guide groove is provided on the cavity wall of the second lifting cavity at a position corresponding to the second lifting block, a guide sleeve is installed in the guide groove, and the second lifting block is slidably connected to the guide sleeve.

[0024] Optionally, the first lifting block includes a first outer wall surface and a second outer wall surface, the first clamping ring unit and the second clamping ring unit are sleeved on the first outer wall surface, and the second outer wall surface is arranged opposite to the first limiting portion;

[0025] Wherein, the second outer wall surface protrudes from the first outer wall surface.

[0026] Optionally, the outlines of the first jacking escape opening, the second jacking escape opening, and the third jacking escape opening are all rectangular.

[0027] A crystal bonding device comprises a feeding structure and a multi-stage lifting structure as described above.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The multi-stage lifting structure and crystal bonding equipment provided by the present invention, when performing the process of separating the chip and the bottom film, drive the end lifting component and the first lifting component through the first lifting avoidance opening along the first direction through the lifting unit, after the end lifting component and the first lifting component synchronously move a first distance along the first direction, the first lifting component is blocked by the first limiting portion, so that the first spring unit enters a compressed state, at this time the lifting unit continues to drive the end lifting component through the first lifting avoidance opening along the first direction, while the first lifting component is blocked, so that the end lifting component rises relative to the first lifting component, thereby completing the separation of the chip and the bottom film; in the above process, first the first lifting component and the end lifting component rise at the same time, at this time the total contact area of ​​the two with the bottom film is the first area, then the end lifting component rises alone, at this time the contact area of ​​the end lifting component with the bottom film is obviously smaller than the first area, so that the chip can be separated from the bottom film in sections. For the chip, its separation from the base film includes at least two stages. When the first lifting component and the end lifting component rise at the same time, due to the larger area of ​​the first component, most of the chip is supported by the lifting structure, that is, the distance from the edge of the chip to the lifting structure is small, ensuring that the chip will not break; then, the end lifting component rises alone, so that the base film outside the end lifting component can be separated from the chip, completing the lifting of the chip. On the premise of ensuring that the separation process of the chip and the base film is completed, the chip is effectively protected and is not easy to break. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0031] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0032] Figure 1 A schematic diagram of the overall structure of a multi-stage jacking structure provided by an embodiment of the present invention;

[0033] Figure 2 for Figure 1 A schematic diagram of the local enlarged structure at point A;

[0034] Figure 3 A schematic diagram of a first cross-sectional structure of a multi-section lifting structure provided by an embodiment of the present invention;

[0035] Figure 4 for Figure 3 A schematic diagram of the local enlarged structure at B;

[0036] Figure 5 A schematic diagram of a second cross-sectional structure of a multi-section lifting structure provided by an embodiment of the present invention;

[0037] Figure 6 A third cross-sectional structural schematic diagram of a multi-section lifting structure provided by an embodiment of the present invention;

[0038] Figure 7 A fourth cross-sectional structural schematic diagram of a multi-section lifting structure provided by an embodiment of the present invention;

[0039] Figure 8 for Figure 7 Schematic diagram of the local enlarged structure at point C.

[0040] Illustrations: 10. housing; 11. first jacking avoidance opening; 12. first jacking cavity; 13. first limiter;

[0041] 20. first lifting assembly; 21. second lifting avoidance; 22. second lifting cavity; 23. second limiting portion; 24. first lifting block; 241. first outer wall surface; 242. second outer wall surface; 25. first clamping ring unit; 26. guide groove; 27. guide sleeve;

[0042] 30. Second jacking assembly; 31. Third jacking avoidance; 33. Second jacking block; 34. Connecting rod; 35. Limit rod;

[0043] 40. End lifting assembly; 41. First spring base; 42. Second spring base; 43. Third lifting block;

[0044] 50. lifting unit; 51. motor; 52. cam; 53. driven wheel;

[0045] 61. A first spring unit; 62. A second spring unit. DETAILED DESCRIPTION

[0046] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0048] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0049] Please refer to Figures 1 to 8 picture, Figure 1 The overall structural diagram of the multi-stage lifting structure provided by the embodiment of the present invention is as follows: Figure 2 for Figure 1 A local enlarged structural diagram at point A. Figure 3 A schematic diagram of a first cross-sectional structure of a multi-stage lifting structure provided by an embodiment of the present invention, Figure 4 for Figure 3 The local enlarged structural diagram at B, Figure 5 A second cross-sectional structural schematic diagram of a multi-stage jacking structure provided by an embodiment of the present invention, Figure 6 A third cross-sectional structural schematic diagram of a multi-section lifting structure provided by an embodiment of the present invention, Figure 7 A fourth cross-sectional structural schematic diagram of a multi-stage jacking structure provided by an embodiment of the present invention, Figure 8 for Figure 7 Schematic diagram of the local enlarged structure at point C.

[0050] Embodiment 1

[0051] The multi-stage lifting structure provided in this embodiment is applied to the crystal bonding equipment, and can lift up the bottom film to separate the chip on the bottom film from the bottom film. The multi-stage lifting structure is optimized so that when separating the thinner chip from the bottom film, the chip will not be broken due to the excessive distance between the edge of the chip and the lifting structure, and the chip will not be incompletely separated due to the excessive distance between the edge of the chip and the lifting structure.

[0052] like Figures 1 to 4As shown, the multi-stage lifting structure of the present embodiment includes an outer shell 10 and a lifting unit 50, a first lifting avoidance opening 11 is arranged on the outer shell 10 along a first direction, a first lifting cavity 12 connected to the first lifting avoidance opening 11 is formed in the outer shell 10, and a first limiting portion 13 is convexly provided on the cavity wall of the first lifting cavity 12; a terminal lifting assembly 40 is installed at the lifting end of the lifting unit 50, the terminal lifting assembly 40 extends into the first lifting cavity 12 along the first direction, and can be driven by the lifting unit 50 to pass through the first lifting avoidance opening 11; the lifting unit 50 includes a motor 51, a rotating shaft of the motor 51 is connected to a cam 52, and during the rotation of the cam 52, it will drive the corresponding driven wheel 53 to rise and fall, and the driven wheel 53 is connected to the terminal lifting assembly 40, so that the terminal lifting assembly 40 can rise along the first direction, and the terminal lifting assembly 40 can pass through the first lifting avoidance opening 11 to lift the bottom film.

[0053] The first lifting component 20 is disposed on the outer sleeve of the terminal lifting component 40, and a first spring unit 61 is disposed between the first lifting component 20 and the terminal lifting component 40, and the terminal lifting component 40 is correspondingly provided with a first spring base 41 to carry the first spring unit 61; along the first direction, one end of the first spring unit 61 abuts against the terminal lifting component 40, and the other end of the first spring unit 61 abuts against the first lifting component 20; wherein, after the terminal lifting component 40 moves a first distance along the first direction, the first lifting component 20 abuts against the first limiting portion 13, and the first spring unit 61 is in a compressed state. It should be understood that before the first lifting component 20 abuts against the first limiting portion 13, the first lifting component 20 moves synchronously with the terminal lifting component 40 until the first lifting component 20 abuts against the first limiting portion 13, so that the first lifting component 20 cannot continue to move upward, at which time the terminal lifting component 40 overcomes the elastic force of the first spring unit 61 and continues to rise, and the terminal lifting component 40 rises relative to the first lifting component 20.

[0054] Specifically, when the wafer and the bottom film are separated, the end lifting assembly 40 and the first lifting assembly 20 are driven by the lifting unit 50 to pass through the first lifting avoidance opening 11 along the first direction. After the end lifting assembly 40 and the first lifting assembly 20 are synchronously moved along the first direction by a first distance, Figure 5The first lifting component 20 is blocked by the first limiting portion 13, so that the first spring unit 61 enters a compressed state. At this time, the lifting unit 50 continues to drive the terminal lifting component 40 to pass through the first lifting avoidance opening 11 along the first direction, and the first lifting component 20 is blocked, so that the terminal lifting component 40 rises relative to the first lifting component 20, thereby completing the separation of the chip and the bottom film; in the above process, the first lifting component 20 and the terminal lifting component 40 rise at the same time, at this time the total contact area of ​​the two with the bottom film is the first area, then, the terminal lifting component 40 rises alone, at this time the contact area of ​​the terminal lifting component 40 with the bottom film is obviously smaller than the first area, so that the chip can be separated from the bottom film in sections. For the chip, its separation from the base film includes at least two stages. When the first lifting component 20 and the end lifting component 40 rise at the same time, since the first area is larger, most of the chip is supported by the lifting structure, that is, the distance from the edge of the chip to the lifting structure is small, ensuring that the chip will not break; then, the end lifting component 40 rises alone, so that the base film outside the end lifting component 40 can be separated from the chip, completing the lifting of the chip. On the premise of ensuring that the separation process of the chip and the base film is completed, the chip is effectively protected and is not easy to break.

[0055] Furthermore, the first lifting component 20 is provided with a second lifting avoidance opening 21 along the first direction, a second lifting cavity 22 connected to the second lifting avoidance opening 21 is formed in the first lifting component 20, and a second limiting portion 23 is also provided on the first lifting component 20; a second lifting component 30 is also sleeved on the end lifting component 40, the second lifting component 30 is located in the second lifting cavity 22, and the second lifting component 30 can slide in the second lifting cavity 22 along the first direction; the second lifting component 30 and the end A second spring unit 62 is arranged between the end lifting components 40, and the end lifting component 40 is correspondingly provided with a second spring base 42 to carry the second spring unit 62; along the first direction, one end of the second spring unit 62 abuts against the end lifting component 40, and the other end of the second spring unit 62 abuts against the second lifting component 30; wherein, when the second lifting component 30 moves a second distance along the first direction, the second lifting component 30 abuts against the second limiting portion 23, and the second spring unit 62 is in a compressed state.

[0056] For example, during the process of the end lifting assembly 40 moving a first distance along the first direction, since the first lifting assembly 20 does not abut against the first limit portion 13, and the second lifting assembly 30 does not abut against the second limit portion 23, at this time, Figure 5 As shown, the first lifting assembly 20 and the second lifting assembly 30 rise synchronously with the end lifting assembly 40. Then, the end lifting assembly 40 continues to rise. Since the second lifting assembly 30 does not abut against the second limit portion 23, at this time, Figure 6As shown, the second lifting assembly 30 and the terminal lifting assembly 40 rise synchronously; until the second lifting assembly 30 and the terminal lifting assembly 40 move a second distance in total along the first direction, as shown in FIG. Figure 7 As shown, the second lifting assembly 30 abuts against the second limiting portion 23, and the terminal lifting assembly 40 continues to rise by overcoming the elastic force of the second spring unit 62, while the second lifting assembly 30 is stationary, so that the terminal lifting assembly 40 rises relative to the second lifting assembly 30, that is, the terminal lifting assembly 40 passes through the second lifting avoidance opening 21; finally, as shown in FIG. Figure 8 As shown, the third lifting block 43 of the end lifting assembly 40 is higher than the second lifting block 33, and the second lifting block 33 is higher than the first lifting block 24, forming a "triangle" structure as a whole, which is conducive to the separation of the wafer and the base film, and ensures that the wafer will not break.

[0057] In this embodiment, if Figures 4 to 6 As shown, the first limiting portion 13 is protruded on the cavity wall of the first jacking cavity 12; that is, the first limiting portion 13 is equivalent to a stepped groove formed on the cavity wall; the first jacking assembly 20 includes a first jacking block 24, the second jacking avoidance opening 21 is opened on the first jacking block 24, and the second jacking cavity 22 is formed in the first jacking block 24; the first jacking block 24 is outer-mounted with a first clamping ring unit 25; wherein, when the end jacking assembly 40 moves a first distance along the first direction, the first clamping ring unit 25 abuts against the first limiting portion 13.

[0058] Further, the second limit portion 23 is a second snap ring unit, and the second snap ring unit is arranged on the side of the first snap ring unit 25 away from the second jacking avoidance opening 21; wherein, when the second jacking assembly 30 moves the second distance along the first direction, the second jacking assembly 30 abuts against the second snap ring unit, and the second spring unit 62 is in a compressed state. It can be understood that the first snap ring unit 25 and the second snap ring unit are both installed outside the first jacking block 24, so the two are based on the first jacking block 24, and the accuracy between the two is guaranteed, so that the accuracy of the second jacking block 33 protruding from the second jacking avoidance opening 21 is guaranteed, and the position accuracy between the second jacking block 33 and the first jacking block 24 is ensured.

[0059] Furthermore, if Figure 7As shown, the second lifting assembly 30 includes a second lifting block 33, and a third lifting avoidance opening 31 is opened at the position of the second lifting block 33 corresponding to the end lifting assembly 40; the second lifting block 33 is fixedly connected to a connecting rod 34, and the connecting rod 34 extends in a direction away from the third lifting avoidance opening 31, and a limiting rod 35 is installed on the connecting rod 34; wherein, when the second lifting assembly 30 moves a second distance along the first direction, the limiting rod 35 abuts against the second clamping ring unit. Through the above arrangement, the space between the cavity wall of the first lifting cavity 12 and the first lifting block 24 can be effectively utilized, making the structure more compact, and at the same time, the second limiting ring can be slidably connected to the first lifting cavity 12, thereby improving the stability of the second lifting assembly 30 when it is lifted or lowered.

[0060] Furthermore, if Figures 5 to 7 As shown, a guide groove 26 is provided on the cavity wall of the second lifting cavity 22 at a position corresponding to the second lifting block 33, a guide sleeve 27 is installed in the guide groove 26, and the second lifting block 33 is slidably connected with the guide sleeve 27. The arrangement of the guide groove 26 and the guide sleeve 27 makes the sliding of the second lifting block 33 relative to the first lifting block 24 smoother and more stable.

[0061] Furthermore, if Figure 5 As shown, the first lifting block 24 includes a first outer wall surface 241 and a second outer wall surface 242 , the first clamping ring unit 25 and the second clamping ring unit are sleeved on the first outer wall surface 241 , and the second outer wall surface 242 is arranged opposite to the first limiting portion 13 ; wherein the second outer wall surface 242 protrudes from the first outer wall surface 241 . It can be understood that, for the first lifting block 24, it includes a second outer wall surface 242 located at the upper end and a first outer wall surface 241 located at the lower end, wherein the first outer wall surface 241 is connected to the cavity wall of the first lifting cavity 12 through the first clamping ring unit 25 and the second clamping ring unit, and the second outer wall surface 242 is spaced apart from the first limit portion 13. In addition, the second outer wall surface 242 protrudes from the first outer wall surface 241 and a guide groove 26 is provided on the inner side of the second outer wall surface 242. That is, for the first lifting block 24, the shape of its wall surface is "Z"-shaped as a whole, with uniform thickness and high overall stability. At the same time, its upper end (second outer wall surface 242) is convex and the lower end (first outer wall surface 241) is recessed, which makes full use of the space inside the lifting structure and makes the overall structure more compact.

[0062] In this embodiment, if Figure 2 As shown, the outlines of the first jacking escape opening 11, the second jacking escape opening 21 and the third jacking escape opening 31 are all rectangular.

[0063] In summary, the multi-stage lifting structure provided in this embodiment can effectively avoid the situation where the wafer is broken when being separated from the base film, and at the same time has the advantages of compact structure and high stability.

[0064] Embodiment 2

[0065] The crystal bonding equipment provided in this embodiment includes a feeding structure and the multi-stage lifting structure in Embodiment 1. The feeding structure refers to a structure capable of conveying a bottom film to the multi-stage lifting structure. When the bottom film passes through the multi-stage lifting structure, the multi-stage lifting structure can lift the bottom film to facilitate separation of the wafer on the bottom film from the bottom film. Embodiment 1 describes the specific structure and technical effects of the multi-stage lifting structure. The crystal bonding equipment in this embodiment refers to this structure and also has its technical effects.

[0066] In summary, the die bonding equipment provided in this embodiment can effectively prevent the wafer from breaking when being separated from the base film, and at the same time has the advantages of compact structure and high stability.

[0067] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-stage lifting structure, It is characterized in that The invention comprises a shell (10) and a lifting unit (50), wherein a first lifting avoidance opening (11) is arranged on the shell (10) along a first direction, a first lifting cavity (12) connected to the first lifting avoidance opening (11) is formed in the shell (10), and a first limiting portion (13) is convexly arranged on the cavity wall of the first lifting cavity (12); A terminal lifting component (40) is installed at the lifting end of the lifting unit (50); the terminal lifting component (40) extends into the first lifting cavity (12) along the first direction and can be driven by the lifting unit (50) to pass through the first lifting avoidance opening (11); The terminal lifting component (40) is provided with a first lifting component (20) on its outer sleeve, and a first spring unit (61) is provided between the first lifting component (20) and the terminal lifting component (40); along the first direction, one end of the first spring unit (61) abuts against the terminal lifting component (40), and the other end of the first spring unit (61) abuts against the first lifting component (20); Wherein, when the terminal lifting component (40) moves a first distance along the first direction, the first lifting component (20) abuts against the first limiting portion (13), and the first spring unit (61) is in a compressed state; The first lifting component (20) is provided with a second lifting avoidance opening (21) along the first direction, a second lifting cavity (22) communicating with the second lifting avoidance opening (21) is formed in the first lifting component (20), and a second limiting portion (23) is also provided on the first lifting component (20); The terminal lifting component (40) is also sleeved with a second lifting component (30), the second lifting component (30) is located in the second lifting cavity (22), and the second lifting component (30) can slide in the second lifting cavity (22) along the first direction; A second spring unit (62) is provided between the second lifting component (30) and the terminal lifting component (40); along the first direction, one end of the second spring unit (62) abuts against the terminal lifting component (40), and the other end of the second spring unit (62) abuts against the second lifting component (30); When the second lifting assembly (30) moves a second distance along the first direction, the second lifting assembly (30) abuts against the second limiting portion (23), and the second spring unit (62) is in a compressed state.

2. A multi-stage lifting structure according to claim 1, It is characterized in that The first limiting portion (13) is protrudingly arranged on the cavity wall of the first lifting cavity (12); The first lifting assembly (20) comprises a first lifting block (24), the second lifting avoidance opening (21) is opened on the first lifting block (24), and the second lifting cavity (22) is formed in the first lifting block (24); the first lifting block (24) is provided with a first clamping ring unit (25) on its outer sleeve; Wherein, when the terminal lifting assembly (40) moves a first distance along the first direction, the first clamping ring unit (25) abuts against the first limiting portion (13).

3. A multi-stage lifting structure according to claim 2, It is characterized in that The second limiting portion (23) is a second clamping ring unit, and the second clamping ring unit is arranged on a side of the first clamping ring unit (25) away from the second lifting avoidance opening (21); When the second lifting assembly (30) moves a second distance along the first direction, the second lifting assembly (30) abuts against the second clamping ring unit, and the second spring unit (62) is in a compressed state.

4. A multi-stage lifting structure according to claim 3, It is characterized in that The second lifting component (30) comprises a second lifting block (33), and the second lifting block (33) is provided with a third lifting avoidance opening (31) at a position corresponding to the terminal lifting component (40); The second lifting block (33) is fixedly connected to a connecting rod (34), the connecting rod (34) extends in a direction away from the third lifting avoidance opening (31), and a limiting rod (35) is installed on the connecting rod (34); Wherein, when the second lifting assembly (30) moves a second distance along the first direction, the limiting rod (35) abuts against the second clamping ring unit.

5. A multi-stage lifting structure according to claim 4, It is characterized in that A guide groove (26) is provided on the cavity wall of the second lifting cavity (22) at a position corresponding to the second lifting block (33), a guide sleeve (27) is installed in the guide groove (26), and the second lifting block (33) is slidably connected to the guide sleeve (27).

6. A multi-stage lifting structure according to claim 5, It is characterized in that The first lifting block (24) comprises a first outer wall surface (241) and a second outer wall surface (242); the first clamping ring unit (25) and the second clamping ring unit are sleeved on the first outer wall surface (241); and the second outer wall surface (242) is arranged opposite to the first limiting portion (13); Wherein, the second outer wall surface (242) protrudes from the first outer wall surface (241).

7. A multi-stage lifting structure according to claim 4, It is characterized in that The first jacking escape opening (11), the second jacking escape opening (21) and the third jacking escape opening (31) all have rectangular outlines.

8. A die bonding device, It is characterized in that It comprises a feeding structure and a multi-stage lifting structure as claimed in any one of claims 1 to 7.

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