Cleaning method and cleaning apparatus

Abstract

The application provides a cleaning method and a cleaning device, wherein the cleaning method is applied to the cleaning device, the cleaning device comprises a thin-film resistance pressure sensor, a voltage division circuit connected with the thin-film resistance pressure sensor, and a processing unit connected with the voltage division circuit, and the method comprises the following steps: the thin-film resistance pressure sensor receives the impact of a dirty particle at a current position and outputs a resistance signal with a corresponding resistance value according to the size of the impact intensity; the voltage division circuit converts the resistance signal output by the thin-film resistance pressure sensor at the current position into a voltage signal; and the processing unit determines the dirt condition of the current position based on the voltage signal. In this way, when cleaning, on the one hand, the thin-film resistance pressure sensor is simple to install, and on the other hand, the thin-film resistance pressure sensor is not sensitive to the vibration of the body of the cleaning device, and the voltage signal can more accurately reflect the size of the impact force of the dirty particle, thereby improving the accuracy of dirt detection.

Description

Technical Field

[0001] This application relates to the field of smart device technology, and in particular to a cleaning method and cleaning device. Background Technology

[0002] With the development of technology, cleaning equipment is being used more and more widely in daily life. Existing cleaning equipment generally has a piezoelectric sensor connected to a signal processing circuit installed in the air duct. When dirt enters the cleaning equipment and strikes the piezoelectric sensor, it generates a corresponding voltage pulse signal. When the voltage pulse signal reaches a certain amplitude, it outputs a pulse indication signal to the processor. The processor judges the level of dirt based on the information from the pulse indication signal.

[0003] However, the signal processing circuits of existing cleaning equipment have complex functional structures, high costs, and are difficult to develop. They also have high requirements for structural vibration reduction design. If the vibration reduction effect is not ideal, it will affect the accuracy of dirt detection. In addition, piezoelectric sensors have a short service life and their shape and size are limited, making it impossible to optimize them according to the air duct and layout of the cleaning equipment. Summary of the Invention

[0004] This application provides a cleaning method and cleaning equipment that can achieve simple and accurate detection of dirt conditions.

[0005] In a first aspect, embodiments of this application provide a cleaning method applied to a cleaning device. The cleaning device includes a thin-film resistive pressure sensor, a voltage divider circuit connected to the thin-film resistive pressure sensor, and a processing unit connected to the voltage divider circuit. The method includes:

[0006] The thin-film resistive pressure sensor receives the impact of dirt particles at the current location and outputs a resistance signal with a corresponding resistance value according to the magnitude of the impact intensity.

[0007] The voltage divider circuit converts the resistance signal output by the thin-film resistive pressure sensor at the current position into a voltage signal;

[0008] The processing unit determines the level of dirt at the current location based on the voltage signal.

[0009] Secondly, embodiments of this application provide a cleaning device, which includes a thin-film resistive pressure sensor, a voltage divider circuit connected to the thin-film resistive pressure sensor, and a processing unit connected to the voltage divider circuit.

[0010] A thin-film resistive pressure sensor is used to receive the impact of dirt particles at the current location and output a resistance signal with a corresponding resistance value according to the magnitude of the impact intensity.

[0011] A voltage divider circuit is used to convert the resistance signal output by the thin-film resistive pressure sensor at the current position into a voltage signal.

[0012] The processing unit is used to determine the level of dirt at the current location based on the voltage signal.

[0013] In summary, this application provides a cleaning method and a cleaning device. The cleaning method is applied to the cleaning device, which includes a thin-film resistive pressure sensor, a voltage divider circuit connected to the thin-film resistive pressure sensor, and a processing unit connected to the voltage divider circuit. The method includes: the thin-film resistive pressure sensor receiving the impact of dirt particles at the current position and outputting a resistance signal with a corresponding resistance value according to the magnitude of the impact intensity; the voltage divider circuit converting the resistance signal output by the thin-film resistive pressure sensor at the current position into a voltage signal; and the processing unit determining the dirt level at the current position based on the voltage signal. Through the technical solution of this application, when the thin-film resistive pressure sensor is installed on the cleaning device, it can be directly pasted into the air duct of the cleaning device, and its size, shape, and layout can be adaptively adjusted according to the shape, size, and layout of the air duct of the cleaning device. Furthermore, the thin-film resistive pressure sensor is insensitive to vibrations of the cleaning equipment body. Therefore, on the one hand, no additional vibration damping structure is needed when installing the thin-film resistive pressure sensor, making installation easier. On the other hand, the change in the resistance value of the thin-film resistive pressure sensor is not affected by the vibration of the cleaning equipment body, and the voltage signal can more accurately reflect the magnitude of the impact force of dirt particles. The dirt status analyzed by the processing unit based on this voltage signal is more accurate. At the same time, the thin-film resistive pressure sensor does not generate low-frequency noise due to the vibration of the cleaning equipment body. Therefore, when processing the voltage signal, the signal filtering of low-frequency noise can be eliminated, making the signal processing process simpler and more efficient. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of an existing cleaning device;

[0016] Figure 2 This is a schematic diagram of the structure of an existing signal processing circuit.

[0017] Figure 3 This is a schematic diagram of the structure of a piezoelectric sensor;

[0018] Figure 4 This is a schematic diagram of the system structure of a cleaning device provided in an embodiment of this application;

[0019] Figure 5 This is a schematic diagram of the structure of a thin-film resistive pressure sensor provided in an embodiment of this application;

[0020] Figure 6 A schematic diagram of a signal processing circuit provided in an embodiment of this application;

[0021] Figure 7 A specific circuit structure diagram of a signal processing circuit provided in an embodiment of this application;

[0022] Figure 8 A schematic flowchart illustrating a cleaning method provided in an embodiment of this application;

[0023] Figure 9 This is a schematic diagram of the structure of a matrix-type thin-film resistive pressure sensor provided in an embodiment of this application;

[0024] Figure 10 This is a schematic diagram of another matrix-type thin-film resistive pressure sensor provided in an embodiment of this application;

[0025] Figure 11 This is a schematic diagram illustrating the response relationship when sensors of different sensitivities are triggered, as provided in an embodiment of this application. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices.

[0028] The cleaning method provided in this application can be applied to any area that needs cleaning.

[0029] The existing cleaning solutions are described below.

[0030] Figure 1 This is a schematic diagram of the structure of an existing cleaning device.

[0031] like Figure 1 As shown, a piezoelectric sensor is installed inside the air duct of the existing cleaning equipment. This piezoelectric sensor is connected to a signal processing circuit, which in turn is connected to a processor. When dirt is sucked into the cleaning equipment by the fan and hits the sensor, the signal processing circuit generates a corresponding dirt indication signal. The processor analyzes this dirt indication signal to determine the dirt status at the current location.

[0032] However, piezoelectric sensors are sensitive to vibrations from the cleaning equipment itself, which can generate noise. When a piezoelectric sensor responds to the impact of dirt particles, the resulting response signal carries low-frequency noise components. Therefore, additional circuit modules are needed in the subsequent signal processing circuit design to filter out the noise components in the response signal.

[0033] Figure 2 This is a schematic diagram of the structure of an existing signal processing circuit.

[0034] like Figure 2 As shown, the output of the piezoelectric sensor is connected to the input of an acoustic vibration filter or an RFI (Radio Frequency Interference) filter. The output of the filter is connected to the input of a signal amplifier. The output of the signal amplifier is connected to the input of an attenuator and the input of a reference level generation circuit, respectively. The outputs of the attenuator and the reference level generation circuit are connected to the input of a comparator, respectively. The output of the comparator is connected to a pulse broadening circuit.

[0035] The signal processing circuit first needs to filter out low-frequency noise caused by body vibration and other external high-frequency radio frequency noise. The noise-filtered signal is then amplified by a signal amplifier. Part of the amplified signal is attenuated by voltage division and then input to a comparator, while the other part is processed by a reference level generation circuit to generate a reference level. When dirt hits the piezoelectric sensor, if the generated pulse signal amplitude is large enough, even after voltage division and attenuation, it will still be larger than the reference level. In this case, the comparator generates a corresponding dirt indication pulse signal. The pulse broadening circuit broadens the dirt indication pulse signal and outputs it to the processor. Based on the broadened pulse indication signal, the processor determines the dirt status at the current location.

[0036] On the other hand, in order to reduce the impact of cleaning equipment vibration on the accuracy of dirt detection to a certain extent, additional vibration damping devices are needed when installing piezoelectric sensors. Typically, sufficient space needs to be left around the piezoelectric sensor to accommodate components such as the housing, vibration-damping silicone, and drive board for fixing the sensor.

[0037] Figure 3 This is a schematic diagram of the structure of a piezoelectric sensor.

[0038] like Figure 3 As shown, a piezoelectric sensor includes a shield, a PCB (Printed Circuit Board), a plastic housing, a piezoelectric element, a rubber ring, and fixing screws.

[0039] It is evident that piezoelectric sensors have high requirements for structural vibration reduction design, and their overall structural design and assembly process are quite complex. Cleaning or detecting dirt is both difficult and costly.

[0040] In addition, piezoelectric sensors typically use brass metal discs as a base, which limits their shape and size. They cannot be optimized and adjusted according to the shape and layout of the air duct of different cleaning equipment. Furthermore, piezoelectric thin film sensors are expensive and have a short lifespan.

[0041] To address the aforementioned technical problems, this application provides a cleaning method and a cleaning device. The cleaning method is applied to the cleaning device, which includes a thin-film resistive pressure sensor, a voltage divider circuit connected to the thin-film resistive pressure sensor, and a processing unit connected to the voltage divider circuit. The method includes: the thin-film resistive pressure sensor receiving impacts from dirt particles at a current location and outputting a resistance signal with a corresponding resistance value based on the impact intensity; the voltage divider circuit converting the resistance signal output by the thin-film resistive pressure sensor at the current location into a voltage signal; and the processing unit determining the level of dirt at the current location based on the voltage signal. Through this technical solution, when the thin-film resistive pressure sensor is installed on the cleaning device, it can be directly attached to the air duct of the cleaning device, and its size, shape, and layout can be adaptively adjusted according to the shape, size, and layout of the air duct of the cleaning device. Furthermore, the thin-film resistive pressure sensor is insensitive to vibrations of the cleaning equipment body. Therefore, on the one hand, no additional vibration damping structure is needed when installing the thin-film resistive pressure sensor, making installation easier. On the other hand, the change in the resistance value of the thin-film resistive pressure sensor is not affected by the vibration of the cleaning equipment body, and the voltage signal can more accurately reflect the magnitude of the impact force of dirt particles. The dirt status analyzed by the processing unit based on this voltage signal is more accurate. At the same time, the thin-film resistive pressure sensor does not generate low-frequency noise due to the vibration of the cleaning equipment body. Therefore, when processing the voltage signal, the signal filtering of low-frequency noise can be eliminated, making the signal processing process simpler and more efficient.

[0042] The technical solutions of the embodiments of this application will be described in detail below through some examples. The following embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0043] Figure 4 This is a schematic diagram of the system structure of a cleaning device provided in an embodiment of this application.

[0044] like Figure 4 As shown, a cleaning device includes a thin-film resistive pressure sensor, a voltage divider circuit connected to the thin-film resistive pressure sensor, and a processing unit connected to the voltage divider circuit.

[0045] A thin-film resistive pressure sensor is used to receive the impact of dirt particles at the current location and output a resistance signal with a corresponding resistance value according to the magnitude of the impact intensity.

[0046] A voltage divider circuit is used to convert the resistance signal output by the thin-film resistive pressure sensor at the current position into a voltage signal.

[0047] The processing unit is used to determine the level of dirt at the current location based on the voltage signal.

[0048] It should be noted that when dirt particles enter the air duct of the cleaning equipment and impact the thin-film resistive pressure sensor (hereinafter referred to as the sensor), the sensor converts the physical quantity (pressure) into a change in resistance. The resistance value changes proportionally with the impact force, thus reflecting the pressure value experienced by the sensor. The resistance is highest when the pressure is 0; the higher the pressure, the lower the resistance. Through a voltage divider circuit, the change in resistance is converted into a change in voltage. Therefore, information about the impact force can be obtained based on the voltage change, and further, information about the dirt particles can be derived.

[0049] In this application, the dirty particles involved in the embodiments can be any particulate matter that can be sucked into the air duct of the cleaning equipment, such as dust particles or small debris.

[0050] Figure 5 This is a schematic diagram of the structure of a thin-film resistive pressure sensor provided in an embodiment of this application.

[0051] like Figure 5 As shown, the thin-film resistive pressure sensor comprises two substrates composed of a flexible polymer (polyethylene terephthalate, PET). One substrate is printed with conductive pressure-sensitive ink, and the other substrate is printed with a set of interdigitated silver electrodes. The two substrates are placed opposite each other, separated by an adhesive ring gasket. When pressure is applied to the substrate surface, the silver electrodes contact the conductive ink, generating contact resistance. The greater the applied force, the lower the resistance of the pressure-sensitive ink, and the larger the contact area between the electrodes and the conductive ink. This is equivalent to multiple contact resistors connected in parallel, resulting in a lower resistance presented by the thin-film resistive pressure sensor.

[0052] When a voltage divider circuit is connected after the thin-film resistive pressure sensor, the pressure signal can be converted into a voltage signal, thereby enabling the detection of impacts from dirty particles.

[0053] When installing thin-film resistance pressure sensors, the adhesive-backed sensors can be directly pasted into the air duct of the cleaning equipment. Their layout can be adjusted according to the shape of the air duct. At the same time, thin-film resistance pressure sensors are easy to customize in different shapes and sizes to meet the needs of air ducts of different sizes.

[0054] Thin-film resistive pressure sensors change their resistance by altering the relative positions of two substrates (and thus the distance between them) due to collisions or compression. Therefore, the overall vibration of the thin-film resistive pressure sensor itself does not affect the resistance change, making it insensitive to vibrations of the cleaning equipment. This eliminates the need for additional vibration damping structures, simplifying the equipment's design. Furthermore, the voltage signal more accurately reflects the impact force of dirt particles, allowing the processing unit to analyze the dirt level more precisely.

[0055] In some embodiments, the above-described thin-film resistive pressure sensor is a single thin-film resistive pressure sensor.

[0056] In this possible implementation, the processing unit includes a signal processing circuit and a processor, wherein the input terminal of the signal processing circuit is connected to the output terminal of the voltage divider circuit, and the output terminal of the signal processing circuit is connected to the processor.

[0057] Signal processing circuit, used to convert voltage signal into first pulse signal;

[0058] The processor is used to determine the level of dirt at the current location based on the width of the first pulse signal.

[0059] The embodiments of this application do not impose specific limitations on the circuit modules included in the signal processing circuit.

[0060] Figure 6 This is a schematic diagram of a signal processing circuit provided in an embodiment of this application.

[0061] like Figure 6 As shown, the signal processing circuit includes a filter circuit, a half-wave peak detection circuit, and a comparison circuit.

[0062] A filter circuit is used to filter high-frequency noise in voltage signals.

[0063] When the cleaning equipment is working, the Bluetooth and WIFI (wireless network communication technology) connections on the equipment will generate radio frequency signal interference. In this embodiment of the application, a filtering circuit is used to filter out the radio frequency interference generated by other devices to improve the accuracy of dirt detection.

[0064] The half-wave peak detection circuit is used to convert the output signal of the filter circuit into a second pulse signal;

[0065] The comparator circuit generates a first pulse signal and outputs the first pulse signal to the processor when the voltage value of the second pulse signal is detected to be greater than the reference voltage.

[0066] In one possible implementation, the specific circuit structure of the signal processing circuit is as follows: Figure 7 As shown.

[0067] In this possible implementation, a voltage divider circuit is formed by a power supply, a sensor, and a voltage divider resistor, and the output of the voltage divider circuit is connected to a filter circuit.

[0068] One end of the sensor (varistor R1) is connected to the power supply, and the other end is connected to one end of the voltage divider resistor R2. The other end of the voltage divider resistor R2 is grounded.

[0069] When dirt particles hit the sensor, the greater the impact force, the smaller the sensor's resistance, and the greater the voltage across the voltage divider resistor R2.

[0070] A filter circuit is formed by resistor R3 and capacitor C1, and the output of the filter circuit is connected to a half-wave peak detection circuit.

[0071] One end of resistor R3 is connected to the output of the voltage divider circuit, and the other end is connected to one end of capacitor C1, while the other end of capacitor C1 is grounded.

[0072] For high-frequency signals, the capacitive reactance of a capacitor is relatively small, forming a path. Therefore, capacitor C1 can absorb radio frequency high-frequency noise in the voltage signal to achieve a filtering effect.

[0073] A half-wave peak detection circuit is formed by diode D1, resistor R4 and capacitor C2, and the output of the half-wave peak detection circuit is connected to the input of the comparator.

[0074] In this configuration, one end of diode D1 is connected to capacitor C1, and the other end is connected to one end of resistor R4 and capacitor C2, respectively. The other ends of resistor R4 and capacitor C2 are grounded.

[0075] When dirt particles collide with the sensor, the impact force varies depending on the size of the dirt particles, which in turn corresponds to different trigger resistance values. At this time, the half-wave peak detection circuit will generate a positive pulse of different amplitudes.

[0076] The specific working process is as follows: when a dirt particle hits the sensor, the signal is at its rising edge, the voltage at the left end of the diode is greater than the voltage at the right end, the diode conducts, and C2 is quickly charged through R3 and D1 to reach the pulse peak. When the dirt particle is carried away from the sensor by the suction force generated by the fan, the pulse signal begins to decay. At this time, diode D1 is cut off, and C2 slowly discharges through R4. Depending on the trigger resistance value, the pulse peak size is different. The half-wave peak detection circuit will generate a positive pulse of different amplitudes, and correspondingly, the discharge duration of C2 and the pulse decay duration will be different.

[0077] A comparator circuit is formed by using a comparator, such as Figure 7 As shown, one input of the comparator is connected to the output of the half-wave peak detection circuit, and the other input of the comparator is connected to the reference voltage V.ref .

[0078] When the comparator detects that the voltage of the output signal of the half-wave peak detection circuit is greater than the reference voltage V ref When the signal is high, a high level is output, forming the first pulse signal.

[0079] It should be noted that the reference voltage V ref The reference voltage can be optimized and adjusted according to the needs of dirt detection. For example, when the cleaning equipment only detects larger dirt particles, the reference voltage can be increased because larger dirt particles correspond to larger signal peaks. When the cleaning equipment needs to detect smaller dirt particles, the reference voltage can be decreased to improve the sensitivity of dirt detection.

[0080] The signal processing circuit works as follows: When a dirt particle hits the sensor, the signal is at its rising edge. The voltage at the left end of the diode is greater than the voltage at the right end, so the diode conducts. C8 is rapidly charged through R14 and D6 to reach the pulse peak. When the dirt particle is carried away from the sensor by the suction force generated by the fan, the pulse signal begins to decay. Diode D6 is cut off, and C8 slowly discharges through R15. At this time, the time it takes for the signal to decay to the reference voltage Vref varies depending on the pulse amplitude. Therefore, the pulse width shaped by the comparator also varies. The processor can identify the presence or absence of dirt by checking the comparator's output pulse, and identify the size of the impacting particle by checking the width of the comparator's output pulse.

[0081] It should be noted that the processor can also determine the location of concentrated dirt based on the presence and width of the first pulse signal, and then adjust the cleaning strategy of the cleaning equipment. For example, when the cleaning equipment moves from position C to position D, if it detects that the pulse width at position D is greater than the pulse width at position C, it can increase the suction power of the cleaning equipment.

[0082] In some embodiments, the signal processing circuit includes: a filtering circuit, a half-wave peak detection circuit, a comparison circuit, and a pulse broadening circuit;

[0083] A filter circuit is used to filter high-frequency noise in voltage signals.

[0084] The half-wave peak detection circuit is used to convert the output signal of the filter circuit into a second pulse signal;

[0085] A comparator circuit is used to generate a first pulse signal when it detects that the voltage value of the second pulse signal is greater than the reference voltage;

[0086] The pulse widening circuit is used to increase the width of the first pulse signal and output the widened first pulse signal to the processor.

[0087] If the dirt particles are particularly small, the impact force when they collide with the thin-film resistive pressure sensor is very small. The resistance of the thin-film resistive pressure sensor only changes slightly, and the voltage divided by the voltage divider resistor in the voltage divider circuit is too small. This results in an excessively narrow first pulse signal output after the signal processing circuit, which the processor cannot detect the impact of the dirt particles. In this embodiment, a pulse broadening circuit is connected after the comparator to broaden the width of the first pulse signal. This allows the processor to detect even very small dirt particles when the cleaning equipment is working, further improving the sensitivity of dirt detection in the cleaning equipment.

[0088] As described above, with the technical solution of this application, when a thin-film resistive pressure sensor is used, since the thin-film resistive pressure sensor is not sensitive to the vibration of the cleaning equipment itself, it will not generate low-frequency noise due to the vibration of the cleaning equipment itself. Therefore, during signal processing, the circuit for filtering low-frequency noise is eliminated, simplifying the structure of the signal processing circuit and facilitating circuit design. In addition, compared with existing signal processing circuits, the embodiments of this application also eliminate the need for signal amplifiers and attenuators. Signal processing can be achieved through a filter circuit, a half-wave peak detection circuit, and a comparator.

[0089] It should be noted that, in this embodiment, the processor can also count the number of times the thin-film resistive pressure sensor is triggered within a preset time period. By comparing the number of times the thin-film resistive pressure sensor is triggered at different locations and at different times within the preset time period, the processor determines the location of concentrated dirt and which time period has more dirt. For example, if the processor detects that the thin-film resistive pressure sensor is triggered more times within the preset time period when the cleaning device is cleaning location A than it is triggered more times within the preset time period when the cleaning device is cleaning location B, then location A is determined to be a location with concentrated dirt compared to location B. The processor can also further adjust the cleaning strategy based on the analysis of the location with concentrated dirt. For example, when the processor determines that location A is a location with concentrated dirt compared to location B, the processor can increase the suction power of the cleaning device when the cleaning device is cleaning location A.

[0090] In some embodiments, the above-mentioned thin-film resistive pressure sensor is a matrix thin-film resistive pressure sensor, and each thin-film resistive pressure sensor in the matrix thin-film resistive pressure sensor has the same sensitivity.

[0091] In this possible implementation, the processing unit includes a processor.

[0092] The processor is configured to: determine the reference voltage corresponding to the current position of each triggered thin-film resistive pressure sensor in the matrix thin-film resistive pressure sensor; determine the corresponding calibration voltage of each triggered thin-film resistive pressure sensor based on the voltage value corresponding to the current position and the reference voltage; and further determine the degree of contamination at the current position based on the calibration voltage of each triggered thin-film resistive pressure sensor.

[0093] In some embodiments, the processor is specifically configured to, for each of the triggered thin-film resistive pressure sensors in the matrix thin-film resistive pressure sensor, acquire the voltage value corresponding to the thin-film resistive pressure sensor at the current position when there are no dirt particles, and determine the voltage value as the reference voltage corresponding to the thin-film resistive pressure sensor at the current position.

[0094] In some embodiments, the processor is specifically configured to determine the difference between the voltage value corresponding to the thin-film resistive pressure sensor and the reference voltage corresponding to the thin-film resistive pressure sensor as the calibration voltage corresponding to the thin-film resistive pressure sensor.

[0095] In some embodiments, the matrix-type thin-film resistive pressure sensor includes M regions, where M is a positive integer greater than or equal to 2. The processor is further configured to determine a cleaning strategy based on the number of times the thin-film resistive pressure sensor in each of the M regions is triggered and / or the calibration voltage corresponding to the thin-film resistive pressure sensor triggered in each region.

[0096] In some embodiments, the above-mentioned thin-film resistive pressure sensor is a matrix thin-film resistive pressure sensor, and each thin-film resistive pressure sensor in the matrix thin-film resistive pressure sensor has the same sensitivity.

[0097] In this possible implementation, the processing unit includes a processor.

[0098] The processor determines the number of triggered thin-film resistive pressure sensors based on the voltage signal corresponding to each thin-film resistive pressure sensor in the matrix-type thin-film resistive pressure sensor, and determines the level of dirt at the current location based on the number of triggered thin-film resistive pressure sensors.

[0099] In some embodiments, when the thin-film resistive pressure sensor is a matrix thin-film resistive pressure sensor, and the matrix thin-film resistive pressure sensor includes thin-film resistive pressure sensors with N different sensitivities, the thin-film resistive pressure sensors with N different sensitivities are used to detect N different sizes of dirt particles, where N is a positive integer greater than or equal to 2.

[0100] In this possible implementation, the processing unit includes a processor.

[0101] The processor is used to determine, based on the voltage signal, the voltage value, conversion coefficient, and the number of times the thin-film resistive pressure sensor with each of the N sensitivities is triggered within a preset time period; based on the conversion coefficient and voltage value of the thin-film resistive pressure sensor with each of the N sensitivities, it determines the voltage component of the N types of dirt particles at the current location under each sensitivity; based on the voltage component of the N types of dirt particles under each sensitivity and the number of times they are triggered within the preset time period, it determines the voltage value of each of the N types of dirt particles at the current location; and then, based on the voltage value of each dirt particle, it determines the dirt status at the current location.

[0102] In some embodiments, the processor is specifically configured to, for the i-th type of dirt particle among N types of dirt particles, multiply the voltage component of the i-th type of dirt particle under the j-th sensitivity among the N types of sensitivity by the number of times the thin-film resistive pressure sensor of the j-th sensitivity is triggered within a preset time, and determine the voltage value corresponding to the i-th type of dirt particle under the j-th sensitivity. For the i-th type of dirt particle among N types of dirt particles, the processor adds the voltage values ​​corresponding to the i-th type of dirt particle under the N types of sensitivity to obtain a first value, and determines the first value as the voltage value corresponding to the i-th type of dirt particle, where i is a positive integer from 1 to N, and j is a positive integer from 1 to N.

[0103] In some embodiments, N equals 2, and the matrix-type thin-film resistive pressure sensor includes a high-sensitivity thin-film resistive pressure sensor for detecting large and small dirt particles, and a low-sensitivity thin-film resistive pressure sensor for detecting large dirt particles.

[0104] In this possible implementation, the processor is used to determine the impact force corresponding to large dirt particles based on the voltage value and conversion coefficient corresponding to the low-sensitivity thin-film resistive pressure sensor, and to determine the voltage value corresponding to the low-sensitivity thin-film resistive pressure sensor as the voltage component corresponding to the large dirt particles under the low-sensitivity thin-film resistive pressure sensor; and to determine the voltage component corresponding to small dirt particles under the high-sensitivity thin-film resistive pressure sensor, and the voltage component corresponding to large dirt particles under the high-sensitivity thin-film resistive pressure sensor, based on the impact force corresponding to the large dirt particles, the voltage value corresponding to the high-sensitivity thin-film resistive pressure sensor, and the conversion coefficient.

[0105] In some embodiments, the processor is specifically configured to determine the ratio of the voltage value corresponding to the low-sensitivity thin-film resistive pressure sensor to the conversion coefficient corresponding to the low-sensitivity thin-film resistive pressure sensor as the impact force corresponding to large dirt particles.

[0106] In some embodiments, the processor is specifically configured to multiply the conversion coefficient corresponding to the high-sensitivity thin-film resistive pressure sensor by the impact force corresponding to the large dirt particle to obtain a first product, and determine the first product as the voltage component corresponding to the large dirt particle under the high-sensitivity thin-film resistive pressure sensor; and determine the difference between the voltage value corresponding to the high-sensitivity thin-film resistive pressure sensor and the first product as the voltage component corresponding to the small dirt particle under the high-sensitivity thin-film resistive pressure sensor.

[0107] In summary, this application provides a cleaning device including a thin-film resistive pressure sensor, a voltage divider circuit connected to the thin-film resistive pressure sensor, and a processing unit connected to the voltage divider circuit. The thin-film resistive pressure sensor receives impacts from dirt particles at the current location and outputs a resistance signal with a corresponding resistance value based on the impact intensity. The voltage divider circuit converts the resistance signal output by the thin-film resistive pressure sensor at the current location into a voltage signal. The processing unit determines the level of dirt at the current location based on the voltage signal. With this technical solution, when the thin-film resistive pressure sensor is installed on the cleaning device, it can be directly attached to the air duct of the cleaning device, and its size, shape, and layout can be adaptively adjusted according to the shape, size, and layout of the air duct. Furthermore, the thin-film resistive pressure sensor is insensitive to vibrations of the cleaning equipment body. Therefore, on the one hand, no additional vibration damping structure is needed when installing the thin-film resistive pressure sensor, making installation easier. On the other hand, the change in the resistance value of the thin-film resistive pressure sensor is not affected by the vibration of the cleaning equipment body, and the voltage signal can more accurately reflect the magnitude of the impact force of dirt particles. The dirt status analyzed by the processing unit based on this voltage signal is more accurate. At the same time, the thin-film resistive pressure sensor does not generate low-frequency noise due to the vibration of the cleaning equipment body. Therefore, when processing the voltage signal, the signal filtering of low-frequency noise can be eliminated, making the signal processing process simpler and more efficient.

[0108] Figure 8 This is a schematic flowchart illustrating a cleaning method provided in an embodiment of this application.

[0109] like Figure 8 As shown, the cleaning method is applied to a cleaning device, which includes a thin-film resistive pressure sensor, a voltage divider circuit connected to the thin-film resistive pressure sensor, and a processing unit connected to the voltage divider circuit. The method includes the following steps S101 to S103:

[0110] S101: The thin-film resistive pressure sensor receives the impact of dirt particles at the current location and outputs a resistance signal with a corresponding resistance value according to the magnitude of the impact intensity.

[0111] S102: The voltage divider circuit converts the resistance signal output by the thin-film resistive pressure sensor at the current position into a voltage signal;

[0112] S103: The processing unit determines the level of dirt at the current location based on the voltage signal.

[0113] In some embodiments, the above-described thin-film resistive pressure sensor is a single thin-film resistive pressure sensor.

[0114] In this possible implementation, the processing unit includes a signal processing circuit and a processor, wherein the output of the voltage divider circuit is connected to the input of the signal processing circuit, and the output of the signal processing circuit is connected to the processor.

[0115] The signal processing circuit converts the voltage signal across the voltage divider resistor in the voltage divider circuit into a first pulse signal and outputs the first pulse signal to the processor; the processor determines the level of dirt at the current location based on the width of the first pulse signal.

[0116] In some embodiments, the thin-film resistive pressure sensor is a matrix thin-film resistive pressure sensor. This matrix thin-film resistive pressure sensor includes G sensing points (each sensing point corresponds to one sensor), all of which are used to sense the impact of dirt particles and generate resistance signals of different resistance values ​​according to the magnitude of the impact force. Each sensing point on the matrix thin-film resistive pressure sensor has the same sensitivity, and G is a positive integer greater than or equal to 2.

[0117] Figure 9 This is a schematic diagram of the structure of a matrix-type thin-film resistive pressure sensor provided in an embodiment of this application.

[0118] like Figure 9 As shown, multiple thin-film resistive pressure sensors are arranged in a matrix, and each thin-film resistive pressure sensor has its own row and column information.

[0119] It should be noted that this application does not impose specific limitations on the number of sensors included in the matrix thin-film resistive pressure sensor, nor on the arrangement of the sensors. The number and arrangement can be optimized and adjusted according to the size of the dirt particles that the cleaning equipment needs to detect. For example, when the cleaning equipment detects small dirt particles, the surface area of ​​each sensor can be reduced, or the sensors can be arranged more closely; when the cleaning equipment detects larger dirt particles, the surface area of ​​each sensor can be appropriately increased, or the distance between the sensors can be appropriately adjusted to be greater.

[0120] In this possible implementation, the processing unit includes a processor.

[0121] The above S103 mainly determines the dirt status at the current location based on the following steps S103-A1 to S103-A3.

[0122] S103-A1: The processor determines the reference voltage corresponding to the current position of each of the triggered thin-film resistive pressure sensors in the matrix thin-film resistive pressure sensor.

[0123] Considering the impact of wind pressure on the accuracy of dirt detection, in this embodiment, the collected voltage signal needs to be calibrated to improve the accuracy of dirt detection.

[0124] When calibrating the voltage, a reference voltage is first obtained. This reference voltage is used to indicate the voltage across the voltage divider resistor in the voltage divider circuit when there is only wind pressure at the current location.

[0125] This application does not impose specific limitations on the method of obtaining the reference voltage.

[0126] Method 1: In an environment free of dirt particles, start the cleaning equipment. At this time, obtain the voltage across the voltage divider resistor and use this voltage as the reference voltage.

[0127] Method 2 involves simultaneously impacting the sensor with both no-pressure and pressure-pressure environments using the same dirty particle, acquiring the voltage across the voltage divider resistor under both environments, and determining the difference between the voltages under the two environments as the reference voltage.

[0128] S103-A2: For each of the triggered thin-film resistive pressure sensors, the processor determines the calibration voltage corresponding to the thin-film resistive pressure sensor based on the voltage value corresponding to the current position of the thin-film resistive pressure sensor and the reference voltage corresponding to the thin-film resistive pressure sensor.

[0129] The embodiments of this application do not limit the specific method for determining the calibration voltage.

[0130] In one possible implementation, the difference between the voltage value corresponding to each sensor and the reference voltage corresponding to that sensor is determined as the calibration voltage corresponding to that sensor.

[0131] In another possible implementation, the voltage value corresponding to each sensor is subtracted from the reference voltage corresponding to that sensor to obtain a first difference value. The product of the first difference value and a preset value is determined as the calibration voltage corresponding to that sensor.

[0132] S103-A3: The processor determines the current level of dirt based on the calibration voltage corresponding to each of the triggered thin-film resistive pressure sensors.

[0133] It should be noted that, in the embodiments of this application, each sensor can be designed to be small enough that each sensor can only detect one dirt particle. In this way, during cleaning, the number of dirt particles during the same period can be obtained by counting the number of times the sensor is triggered within the same period, and then the location of the dirt concentration can be determined. Alternatively, the location of the dirt concentration can be determined by combining the magnitude of the calibration voltage value corresponding to each sensor in the matrix sensor within the same period.

[0134] In some embodiments, the matrix thin-film resistive pressure sensor can be divided into M regions, where M is a positive integer greater than or equal to 2. By counting the number of times the thin-film resistive pressure sensor in each of the M regions is triggered at the same time and location and / or the calibration voltage corresponding to the sensor triggered in each of the M regions, the dirt level of each of the M regions can be determined, and the cleaning strategy of the cleaning equipment can be determined based on the dirt level of each of the M regions.

[0135] The following example uses a matrix-type thin-film resistive pressure sensor divided into two regions, combined with... Figure 9 The structure of the matrix-type thin-film resistive pressure sensor shown herein provides a detailed explanation of the technical solution of this application.

[0136] Will Figure 9 The matrix-type thin-film resistive pressure sensor shown is divided into two regions, for example, […]. Figure 9 The matrix-type thin-film resistive pressure sensor shown is divided into two regions, left and right. The cleaning strategy is determined by counting the number of times the thin-film resistive pressure sensor in each region is triggered and / or the magnitude of the calibration voltage value corresponding to the triggered sensor.

[0137] In some embodiments, the processor determines a cleaning strategy based on the number of times the sensors in each of the two regions are triggered.

[0138] For example, at the same time and location, if the processor detects that the number of times the sensor in the left area of ​​the matrix thin-film resistive pressure sensor is triggered is greater than the number of times the sensor in the right area is triggered, then it determines that the left area is the area with concentrated dirt compared to the right area, and controls the cleaning equipment to prioritize cleaning the left area, and increases the suction level when the cleaning equipment is cleaning the left area.

[0139] In some embodiments, the processor determines a cleaning strategy based on the calibration voltage value corresponding to the sensor triggered in each of the two regions.

[0140] For example, at the same time and location, if the processor detects that the sum of the calibration voltage values ​​corresponding to the sensors triggered in the left area of ​​the matrix thin-film resistive pressure sensor is less than the sum of the calibration voltage values ​​corresponding to the sensors triggered in the right area, then it determines that the right area is a dirt-concentrated area relative to the left area, and controls the cleaning equipment to clean the right area first, and increases the suction level when the cleaning equipment is cleaning the right area.

[0141] For example, at the same time and location, if the processor detects that the average value of the calibration voltage corresponding to the sensor triggered in the left area of ​​the matrix thin-film resistive pressure sensor is less than the average value of the calibration voltage corresponding to the sensor triggered in the right area, then it determines that the right area is a dirt-concentrated area relative to the left area, and controls the cleaning equipment to clean the right area first, and increases the suction level when the cleaning equipment is cleaning the right area.

[0142] In some embodiments, the processor determines a cleaning strategy based on the number of times the thin-film resistive pressure sensor in each of the two regions is triggered and the calibration voltage value corresponding to the triggered sensor.

[0143] For example, a matrix-type thin-film resistive pressure sensor includes 100 sensors, with 50 sensors in each of the left and right regions. If the sensors in the left region are triggered 40 times and the sensors in the right region are triggered 43 times, the number of triggers for the sensors in the two regions is similar. However, the sum of the calibration voltages corresponding to the sensors triggered in the right region is greater than the sum of the calibration voltages corresponding to the sensors triggered in the left region. In this case, the cleaning device is controlled to clean the right region first, and the suction level is increased when the cleaning device is cleaning the right region.

[0144] In some embodiments, the thin-film resistive pressure sensor is a matrix thin-film resistive pressure sensor, and the matrix thin-film resistive pressure sensor includes N thin-film resistive pressure sensors with different sensitivities, which are used to detect N different sizes of dirt particles, where N is a positive integer greater than or equal to 2.

[0145] It should be noted that the specific size of different sizes of dirt particles is a range. For example, particles larger than 3 mm are defined as large dirt particles, and particles with a size of 3 mm or less are defined as small dirt particles.

[0146] Figure 10 This is a schematic diagram of another matrix-type thin-film resistive pressure sensor provided in an embodiment of this application.

[0147] like Figure 10As shown, the matrix-type thin-film resistive pressure sensor includes two types of sensors with different sensitivities, and the two types of sensors are evenly arranged in a matrix, with each thin-film resistive pressure sensor having its own row and column information.

[0148] It should be noted that this application does not impose specific limitations on the number of sensors, the types of sensitivity, or the arrangement of sensors included in the matrix-type thin-film resistive pressure sensor. The number of sensors, the types of sensitivity, and the arrangement of sensors can be optimized and adjusted according to the size of the dirt particles that the cleaning equipment needs to detect. For example, when the cleaning equipment detects small dirt particles, the sensor sensitivity can be designed to be higher, the surface area of ​​each sensor can be reduced, or the sensors can be arranged more closely; when the cleaning equipment detects larger dirt particles, the sensor sensitivity can be designed to be lower, the surface area of ​​each sensor can be appropriately increased, or the distance between the sensors can be appropriately adjusted to be greater. When more refined and precise classification of dirt particles is required, sensors with more types of sensitivity can be designed into the matrix-type thin-film resistive pressure sensor.

[0149] In one possible implementation, the above-mentioned S103 mainly determines the dirt status at the current location based on the following steps S103-B1 to S103-B4.

[0150] S103-B1: The processor determines the voltage value, conversion coefficient, and number of times the thin-film resistive pressure sensor with each of the N sensitivity levels is triggered within a preset time period, based on the voltage signal.

[0151] It should be noted that, in this embodiment, the thin-film resistive pressure sensor converts the pressure signal into a corresponding resistance signal, and then, through a voltage divider circuit connected to the thin-film resistive pressure sensor, converts the resistance signal back into a voltage signal. The conversion coefficient in this embodiment can be understood as a conversion relationship between the pressure experienced by the thin-film resistive pressure sensor and the corresponding voltage signal; this conversion relationship can be linear or non-linear.

[0152] It should be noted that for the same sensitivity sensor on a matrix thin-film resistive pressure sensor, the triggered voltage values ​​are different at the same time. Therefore, the processor needs to determine the voltage value corresponding to each type of sensor based on the voltage signal. The embodiments of this application do not limit the specific method of determining the voltage value corresponding to each type of sensor.

[0153] Method 1: For each type of sensor sensitivity, determine the voltage value of any one of the triggered sensors corresponding to that type of sensitivity as the voltage value corresponding to that type of sensor sensitivity.

[0154] Method 2: For each type of sensor sensitivity, determine the average voltage of the triggered sensor corresponding to that sensitivity, and set the average voltage as the voltage value corresponding to that type of sensor sensitivity.

[0155] For example, if a matrix-type thin-film resistive pressure sensor contains three high-sensitivity sensors (sensor 1, sensor 2, and sensor 3), and during a cleaning process, within a preset time period, sensor 1 is triggered 5 times, sensor 2 is triggered 3 times, and sensor 3 is triggered 10 times, with the voltage value corresponding to each trigger of sensor 1 being V1, sensor 2 being V2, and sensor 3 being V3, then the voltage value corresponding to the high-sensitivity sensor is...

[0156] S103-B2: The processor determines the voltage component of the N types of dirt particles at the current location under each sensitivity level based on the conversion coefficient and voltage value corresponding to the thin-film resistive pressure sensor for each of the N sensitivity levels.

[0157] The following describes the technical solution for determining the voltage component of N types of dirt particles at each sensitivity level, taking N=2 as an example.

[0158] When N=2, the matrix-type thin-film resistive pressure sensor includes a high-sensitivity sensor and a low-sensitivity sensor. The high-sensitivity sensor can detect the collision between large and small dirt particles, while the low-sensitivity sensor can only detect the collision between large dirt particles.

[0159] First, the processor acquires the voltage values ​​corresponding to the sensors triggered within a preset time period, as well as the sensitivity of each sensor, and determines the voltage values ​​corresponding to the high-sensitivity sensors and the low-sensitivity sensors, respectively. The determination of the voltage values ​​corresponding to the high-sensitivity and low-sensitivity sensors is described in the above embodiments and will not be repeated here.

[0160] Next, based on the voltage value and conversion coefficient corresponding to the low-sensitivity thin-film resistive pressure sensor, the impact force (or collision force) corresponding to the large dirt particles is determined, and the voltage value corresponding to the low-sensitivity thin-film resistive pressure sensor is determined as the voltage component corresponding to the large dirt particles under the low-sensitivity thin-film resistive pressure sensor.

[0161] The embodiments of this application do not limit the specific method of "determining the impact force corresponding to large dirt particles based on the voltage value and conversion coefficient corresponding to the low-sensitivity thin-film resistive pressure sensor".

[0162] In some embodiments, the ratio of the voltage value to the conversion coefficient corresponding to the low-sensitivity thin-film resistive pressure sensor is determined as the impact force corresponding to large dirt particles.

[0163] In some embodiments, the voltage value corresponding to the low-sensitivity thin-film resistive pressure sensor is subtracted from a preset value to obtain a second difference. The ratio of this second difference to the conversion coefficient is determined as the impact force corresponding to large dirt particles.

[0164] It should be noted that in the two implementation methods mentioned above, there is a linear conversion relationship between the pressure borne by the thin-film resistive pressure sensor and the corresponding voltage signal. For example, when the conversion coefficient of the thin-film resistive pressure sensor is P, when it is subjected to an impact force of Q Newtons, its corresponding voltage signal is P×QV; or, its corresponding voltage signal is P×Q+bV.

[0165] Then, based on the impact force corresponding to large dirt particles, the voltage value corresponding to the high-sensitivity thin-film resistive pressure sensor, and the conversion coefficient, the voltage component corresponding to small dirt particles under the high-sensitivity thin-film resistive pressure sensor, and the voltage component corresponding to large dirt particles under the high-sensitivity thin-film resistive pressure sensor are determined.

[0166] The embodiments of this application do not limit the specific method for determining the voltage components corresponding to large and small dirt particles under a highly sensitive thin-film resistive pressure sensor.

[0167] In some embodiments, the processing unit multiplies the conversion coefficient corresponding to the high-sensitivity thin-film resistive pressure sensor with the impact force corresponding to the large dirt particles to obtain a first product, and determines the first product as the voltage component corresponding to the large dirt particles under the high-sensitivity thin-film resistive pressure sensor.

[0168] The processing unit determines the voltage component corresponding to the small dirt particles under the high-sensitivity thin-film resistive pressure sensor as the difference between the voltage value corresponding to the high-sensitivity thin-film resistive pressure sensor and the first product.

[0169] In some embodiments, the processing unit multiplies the conversion coefficient corresponding to the high-sensitivity thin-film resistive pressure sensor with the impact force corresponding to the large dirt particles to obtain a first product, and subtracts the first product from a preset value to obtain a third difference, and determines the third difference as the voltage component corresponding to the large dirt particles under the high-sensitivity thin-film resistive pressure sensor.

[0170] The processing unit determines the difference between the voltage value corresponding to the high-sensitivity thin-film resistive pressure sensor and the third difference value as the voltage component corresponding to the small dirt particles under the high-sensitivity thin-film resistive pressure sensor.

[0171] It should be noted that high-sensitivity sensors can detect the impact force of both large and small dirt particles. Therefore, the voltage value triggered by a high-sensitivity sensor is related to both the impact force of large and small dirt particles. In other words, the voltage value triggered by a high-sensitivity sensor includes the voltage components corresponding to both small and large dirt particles.

[0172] The following example uses K1 as the conversion coefficient of a high-sensitivity sensor and K2 as the conversion coefficient of a low-sensitivity sensor. Figure 11 The technical solution of this application is described.

[0173] like Figure 11 As shown, let the impact force of the smaller dirt particle be f1, and the impact force of the larger dirt particle be f2. The conversion coefficient of the high-sensitivity sensor is K1, and its output response is F1 = K1*f1 + K1*f2; the conversion coefficient of the low-sensitivity sensor is K2, and its output response is F2 = K2*f2. At the same time, the high-sensitivity thin-film resistor can simultaneously pick up the impact of both larger and smaller particles, and its output response cannot distinguish the size of the particles. The processor collects F1 and F2 from the high-sensitivity and low-sensitivity sensors respectively, and calculates the impact force of the larger dirt particle. The voltage component corresponding to small dirt particles under the high-sensitivity sensor was extracted through calculation. And the voltage component K1*f2=F1-K1*f1 corresponding to large dirt particles under a highly sensitive sensor.

[0174] S103-B3: The processor determines the voltage value corresponding to each of the N types of dirt particles at the current position based on the voltage components of each type of dirt particle at each sensitivity and the number of times it is triggered within a preset time.

[0175] The embodiments of this application do not limit the specific method of "determining the voltage value corresponding to each of the N types of dirt particles at the current position based on the voltage components of N types of dirt particles at each sensitivity and the number of times the thin-film resistive pressure sensor at each sensitivity is triggered".

[0176] In some embodiments, for the i-th type of dirt particle among N types of dirt particles, the product of the voltage component of the i-th type of dirt particle at the j-th sensitivity among N types of sensitivity and the number of times the thin-film resistance pressure sensor at the j-th sensitivity is triggered is determined as the voltage value corresponding to the i-th type of dirt particle at the j-th sensitivity, where i is a positive integer from 1 to N and j is a positive integer from 1 to N.

[0177] For the i-th type of dirt particle among N types of dirt particles, the voltage values ​​corresponding to the i-th type of dirt particle under N sensitivities are added together to obtain a first value, and the first value is determined as the voltage value corresponding to the i-th type of dirt particle.

[0178] In some embodiments, for the i-th type of dirt particle among N types of dirt particles, the product of the voltage component of the i-th type of dirt particle at the j-th sensitivity among N types of sensitivity and the weight corresponding to the j-th sensitivity is determined as the voltage value corresponding to the i-th type of dirt particle at the j-th sensitivity, where i is a positive integer from 1 to N and j is a positive integer from 1 to N.

[0179] For the i-th type of dirt particle among N types of dirt particles, the voltage values ​​corresponding to the i-th type of dirt particle under N sensitivities are added together to obtain a first value, and the first value is determined as the voltage value corresponding to the i-th type of dirt particle.

[0180] In one possible implementation, the weights corresponding to each type of sensor sensitivity are determined in the following way.

[0181] For each of the N types of sensors, the number of sensors with that type of sensitivity in the matrix thin-film resistive pressure sensor is compared with the total number of sensors in the matrix thin-film resistive pressure sensor to obtain the first coefficient corresponding to that sensitivity.

[0182] The weight corresponding to the thin-film resistive pressure sensor with the j-th sensitivity among N types of sensors is determined by multiplying the number of times the thin-film resistive pressure sensor with the j-th sensitivity is triggered within a preset time period with the first coefficient corresponding to the thin-film resistive pressure sensor with the j-th sensitivity.

[0183] S103-B4: The processor determines the level of dirt at the current location based on the voltage value corresponding to each type of dirt particle.

[0184] The technical solution of this application can solve the problem that a single-sensitivity sensor cannot simultaneously detect the amount of dirt particles of various sizes, thus improving the accuracy of dirt statistics.

[0185] It should be noted that the processor can classify and record the degree of dirtiness at different locations based on the voltage value of each type of dirt particle corresponding to different positions of the cleaning device. For example, if the processor detects that the voltage value corresponding to a large dirt particle at cleaning position E is greater than the voltage value corresponding to a large dirt particle at cleaning position F, then when the cleaning device needs to clean the large dirt particle, it will control the cleaning device to prioritize cleaning position E. Furthermore, in this embodiment, the more types of sensitivity included in the matrix thin-film resistive pressure sensor, the more classifications of dirt particles there are. By increasing the types of sensitivity, the detection of dirt particle size can be refined, improving the accuracy of dirt statistics.

[0186] In summary, this application provides a cleaning method applied to the aforementioned cleaning equipment. The method includes: a thin-film resistive pressure sensor receiving impacts from dirt particles at a current location and outputting a resistance signal with a corresponding resistance value based on the impact intensity; a voltage divider circuit converting the resistance signal output by the thin-film resistive pressure sensor at the current location into a voltage signal; and a processing unit determining the level of dirt at the current location based on the voltage signal. Through the technical solution of this application, when the thin-film resistive pressure sensor is installed on the cleaning equipment, it can be directly attached to the air duct of the cleaning equipment, and its size, shape, and layout can be adaptively adjusted according to the shape, size, and layout of the air duct of the cleaning equipment. Furthermore, the thin-film resistive pressure sensor is insensitive to vibrations of the cleaning equipment body. Therefore, on the one hand, no additional vibration damping structure is needed when installing the thin-film resistive pressure sensor, making installation easier. On the other hand, the change in the resistance value of the thin-film resistive pressure sensor is not affected by the vibration of the cleaning equipment body, and the voltage signal can more accurately reflect the magnitude of the impact force of dirt particles. The dirt status analyzed by the processing unit based on this voltage signal is more accurate. At the same time, the thin-film resistive pressure sensor does not generate low-frequency noise due to the vibration of the cleaning equipment body. Therefore, when processing the voltage signal, the signal filtering of low-frequency noise can be eliminated, making the signal processing process simpler and more efficient.

[0187] The preferred embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this application, various simple modifications can be made to the technical solutions of this application, and these simple modifications all fall within the protection scope of this application. For example, the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this application will not describe the various possible combinations separately. Furthermore, various different embodiments of this application can also be arbitrarily combined, as long as they do not violate the spirit of this application, they should also be considered as the content disclosed in this application.

[0188] It should also be understood that, in the various method embodiments of this application, the order of the above-mentioned processes does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0189] It should be understood that the device embodiments and method embodiments can correspond to each other, and similar descriptions can be referred to the method embodiments. To avoid repetition, further details will not be provided here. Specifically, Figure 3 The apparatus shown can perform the above-described signal direction finding method embodiments, and the aforementioned and other operations and / or functions of the radome, antenna, and processor in the apparatus are respectively embodiments of the signal direction finding method corresponding to the computing device, which will not be described in detail here for the sake of brevity.

[0190] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A cleaning method, characterized in that, The method is applied to cleaning equipment, the cleaning equipment including a thin-film resistive pressure sensor, a voltage divider circuit connected to the thin-film resistive pressure sensor, and a processing unit connected to the voltage divider circuit, the method comprising: The thin-film resistive pressure sensor receives the impact of dirt particles at the current location and outputs a resistance signal with a corresponding resistance value according to the magnitude of the impact intensity. The voltage divider circuit converts the resistance signal output by the thin-film resistive pressure sensor at the current position into a voltage signal; The processing unit determines the level of dirt at the current location based on the voltage signal.

2. The method according to claim 1, characterized in that, When the thin-film resistive pressure sensor is a single thin-film resistive pressure sensor, the processing unit includes a signal processing circuit and a processor. The processing unit determines the level of dirt at the current location based on the voltage signal, including: The signal processing circuit converts the voltage signal into a first pulse signal; The processor determines the level of dirt at the current location based on the width of the first pulse signal.

3. The method according to claim 2, characterized in that, The signal processing circuit includes a filtering circuit, a half-wave peak detection circuit, and a comparison circuit. The signal processing circuit converts the voltage signal into a first pulse signal, including: The filtering circuit filters out high-frequency noise in the voltage signal; The half-wave peak detection circuit converts the output signal of the filter circuit into a second pulse signal; The comparison circuit generates the first pulse signal when it detects that the voltage value of the second pulse signal is greater than the reference voltage.

4. The method according to claim 1, characterized in that, When the thin-film resistive pressure sensor is a matrix thin-film resistive pressure sensor, and each thin-film resistive pressure sensor in the matrix thin-film resistive pressure sensor has the same sensitivity, the processing unit includes a processor. The processing unit determines the level of dirt at the current location based on the voltage signal, including: The processor determines the reference voltage corresponding to the current position of each of the triggered thin-film resistive pressure sensors in the matrix thin-film resistive pressure sensor. For each of the triggered thin-film resistive pressure sensors, the processor determines the calibration voltage corresponding to the thin-film resistive pressure sensor based on the voltage value corresponding to the thin-film resistive pressure sensor at its current position and the reference voltage corresponding to the thin-film resistive pressure sensor. The processor determines the level of dirt at the current location based on the calibration voltage corresponding to each of the triggered thin-film resistive pressure sensors.

5. The method according to claim 4, characterized in that, The processor determines the reference voltage corresponding to the thin-film resistive pressure sensor at the current position, including: The processor acquires the voltage value of each of the triggered thin-film resistive pressure sensors in the matrix thin-film resistive pressure sensor when there are no dirt particles at the current position, and determines the voltage value as the reference voltage of the thin-film resistive pressure sensor at the current position.

6. The method according to claim 4, characterized in that, The processor determines the calibration voltage corresponding to the thin-film resistive pressure sensor based on the voltage signal corresponding to the thin-film resistive pressure sensor and the reference voltage corresponding to the thin-film resistive pressure sensor, including: The processor determines the difference between the voltage value corresponding to the thin-film resistive pressure sensor and the reference voltage corresponding to the thin-film resistive pressure sensor as the calibration voltage corresponding to the thin-film resistive pressure sensor.

7. The method according to claim 4, characterized in that, The matrix-type thin-film resistive pressure sensor includes M regions, where M is a positive integer greater than or equal to 2. The method further includes: The processor determines the cleaning strategy based on the number of times the thin-film resistive pressure sensor in each of the M regions is triggered and / or the calibration voltage corresponding to the thin-film resistive pressure sensor triggered in each region.

8. The method according to claim 1, characterized in that, When the thin-film resistive pressure sensor is a matrix thin-film resistive pressure sensor, and each thin-film resistive pressure sensor in the matrix thin-film resistive pressure sensor has the same sensitivity, the processing unit includes a processor. The processing unit determines the level of dirt at the current location based on the voltage signal, including: The processor determines the number of triggered thin-film resistive pressure sensors based on the voltage signal corresponding to each thin-film resistive pressure sensor in the matrix thin-film resistive pressure sensor, and determines the dirt status at the current location based on the number of triggered thin-film resistive pressure sensors.

9. The method according to claim 1, characterized in that, When the thin-film resistive pressure sensor is a matrix-type thin-film resistive pressure sensor, and the matrix-type thin-film resistive pressure sensor includes N types of thin-film resistive pressure sensors with different sensitivities, the N types of thin-film resistive pressure sensors are used to detect N different sizes of dirt particles, where N is a positive integer greater than or equal to 2. The processing unit includes a processor, and the processing unit determines the dirt status at the current location based on the voltage signal, including: Based on the voltage signal, the processor determines the voltage value, conversion coefficient, and number of times the thin-film resistive pressure sensor is triggered within a preset time period for each of the N sensitivity types. The processor determines the voltage component of the N types of dirt particles at the current location at each sensitivity level based on the conversion coefficient and voltage value corresponding to the thin-film resistive pressure sensor for each of the N types of sensitivity. The processor determines the voltage value corresponding to each of the N types of dirt particles at the current position based on the voltage components of the N types of dirt particles at each sensitivity and the number of times they are triggered within a preset time. The processor determines the level of dirt at the current location based on the voltage value corresponding to each type of dirt particle.

10. The method according to claim 9, characterized in that, The processor determines the voltage value corresponding to each of the N types of dirt particles at the current location based on the voltage components of each type of dirt particle at each sensitivity level, and the number of times it is triggered within a preset time period, including: For the i-th type of dirt particle among the N types of dirt particles, the processor determines the voltage value corresponding to the i-th type of dirt particle at the j-th sensitivity among the N types of sensitivity by multiplying the voltage component of the i-th type of dirt particle at the j-th sensitivity with the number of times the thin-film resistance pressure sensor at the j-th sensitivity is triggered within a preset time. Here, i is a positive integer from 1 to N, and j is a positive integer from 1 to N. For the i-th type of dirt particle among the N types of dirt particles, the processor adds up the voltage values ​​corresponding to the i-th type of dirt particle under N different sensitivities to obtain a first value, and determines the first value as the voltage value corresponding to the i-th type of dirt particle.

11. The method according to claim 9, characterized in that, When N equals 2, the matrix-type thin-film resistive pressure sensor includes a high-sensitivity thin-film resistive pressure sensor for detecting large and small dirt particles, and a low-sensitivity thin-film resistive pressure sensor for detecting large dirt particles; the processor determines the voltage components of the N types of dirt particles at the current location at each sensitivity level based on the conversion coefficient and voltage value of the thin-film resistive pressure sensor for each of the N sensitivities, including: The processor determines the impact force of large dirt particles based on the voltage value and conversion coefficient corresponding to the low-sensitivity thin-film resistive pressure sensor, and determines the voltage value corresponding to the low-sensitivity thin-film resistive pressure sensor as the voltage component of large dirt particles under the low-sensitivity thin-film resistive pressure sensor. The processor determines the voltage component corresponding to small dirt particles under the high-sensitivity thin-film resistive pressure sensor, and the voltage component corresponding to large dirt particles under the high-sensitivity thin-film resistive pressure sensor, based on the impact force corresponding to the large dirt particles, the voltage value corresponding to the high-sensitivity thin-film resistive pressure sensor, and the conversion coefficient.

12. The method according to claim 11, characterized in that, The processor determines the impact force corresponding to large dirt particles based on the voltage value and conversion coefficient corresponding to the low-sensitivity thin-film resistive pressure sensor, including: The processor determines the ratio of the voltage value corresponding to the low-sensitivity thin-film resistive pressure sensor to the conversion coefficient corresponding to the low-sensitivity thin-film resistive pressure sensor as the impact force corresponding to large dirt particles.

13. The method according to claim 11, characterized in that, The processor determines the voltage components corresponding to small dirt particles and large dirt particles under the high-sensitivity thin-film resistive pressure sensor based on the impact force of the large dirt particles, the voltage value of the high-sensitivity thin-film resistive pressure sensor, and the conversion coefficient. This includes: The processor multiplies the conversion coefficient corresponding to the high-sensitivity thin-film resistive pressure sensor with the impact force corresponding to the large dirt particle to obtain a first product, and determines the first product as the voltage component corresponding to the large dirt particle under the high-sensitivity thin-film resistive pressure sensor. The processor determines the difference between the voltage value corresponding to the high-sensitivity thin-film resistive pressure sensor and the first product as the voltage component corresponding to the small dirt particles under the high-sensitivity thin-film resistive pressure sensor.

14. A cleaning device, characterized in that, The cleaning equipment includes a thin-film resistive pressure sensor, a voltage divider circuit connected to the thin-film resistive pressure sensor, and a processing unit connected to the voltage divider circuit. The thin-film resistive pressure sensor is used to receive the impact of dirt particles at the current location and output a resistance signal with a corresponding resistance value according to the magnitude of the impact intensity. The voltage divider circuit is used to convert the resistance signal output by the thin-film resistive pressure sensor at the current position into a voltage signal. The processing unit is used to determine the level of dirt at the current location based on the voltage signal.

15. The device according to claim 14, characterized in that, When the thin-film resistive pressure sensor is a single thin-film resistive pressure sensor, the processing unit includes a signal processing circuit and a processor. The signal processing circuit is used to convert the voltage signal into a first pulse signal; The processor is configured to determine the level of dirt at the current location based on the width of the first pulse signal.

16. The device according to claim 15, characterized in that, The signal processing circuit includes a filtering circuit, a half-wave peak detection circuit, and a comparison circuit. The filtering circuit is used to filter high-frequency noise in the voltage signal; The half-wave peak detection circuit is used to convert the output signal of the filter circuit into a second pulse signal; The comparison circuit is used to generate the first pulse signal when it detects that the voltage value of the second pulse signal is greater than the reference voltage.

17. The device according to claim 14, characterized in that, When the thin-film resistive pressure sensor is a matrix-type thin-film resistive pressure sensor, and each thin-film resistive pressure sensor in the matrix-type thin-film resistive pressure sensor has the same sensitivity, the processing unit includes a processor. The processor is configured to determine the reference voltage corresponding to the current position of each of the triggered thin-film resistive pressure sensors in the matrix thin-film resistive pressure sensor. For each of the triggered thin-film resistive pressure sensors, a calibration voltage is determined based on the voltage value of the thin-film resistive pressure sensor at its current position and the reference voltage of the thin-film resistive pressure sensor. Then, based on the calibration voltage of each of the triggered thin-film resistive pressure sensors, the level of dirt at the current position is determined.

18. The device according to claim 17, characterized in that, The processor is specifically configured to acquire, for each of the triggered thin-film resistive pressure sensors in the matrix thin-film resistive pressure sensor, the voltage value corresponding to the thin-film resistive pressure sensor at the current position when there are no dirty particles, and determine the voltage value as the reference voltage corresponding to the thin-film resistive pressure sensor at the current position.

19. The device according to claim 17, characterized in that, The processor is specifically configured to determine the difference between the voltage value corresponding to the thin-film resistive pressure sensor and the reference voltage corresponding to the thin-film resistive pressure sensor as the calibration voltage corresponding to the thin-film resistive pressure sensor.

20. The device according to claim 17, characterized in that, The matrix-type thin-film resistive pressure sensor comprises M regions, where M is a positive integer greater than or equal to 2. The processor is also configured to determine a cleaning strategy based on the number of times the thin-film resistive pressure sensor in each of the M regions is triggered and / or the calibration voltage corresponding to the thin-film resistive pressure sensor triggered in each region.

21. The device according to claim 14, characterized in that, When the thin-film resistive pressure sensor is a matrix-type thin-film resistive pressure sensor, and each thin-film resistive pressure sensor in the matrix-type thin-film resistive pressure sensor has the same sensitivity, the processing unit includes a processor. The processor is used to determine the number of triggered thin-film resistive pressure sensors based on the voltage signal corresponding to each thin-film resistive pressure sensor in the matrix thin-film resistive pressure sensor, and to determine the dirt status at the current location based on the number of triggered thin-film resistive pressure sensors.

22. The device according to claim 14, characterized in that, When the thin-film resistive pressure sensor is a matrix-type thin-film resistive pressure sensor, and the matrix-type thin-film resistive pressure sensor includes N types of thin-film resistive pressure sensors with different sensitivities, the N types of thin-film resistive pressure sensors are used to detect N types of dirt particles of different sizes, where N is a positive integer greater than or equal to 2, and the processing unit includes a processor. The processor is used to determine, based on the voltage signal, the voltage value, conversion coefficient, and number of times the thin-film resistive pressure sensor with each of the N sensitivities is triggered within a preset time period. Based on the conversion coefficient and voltage value of the thin-film resistive pressure sensor for each of the N sensitivities, determine the voltage component of the N types of dirt particles at the current location under each sensitivity. Based on the voltage components of the N types of dirt particles at each sensitivity level, and the number of times they are triggered within a preset time period, the voltage value corresponding to each of the N types of dirt particles at the current location is determined; then, based on the voltage value corresponding to each type of dirt particle, the dirt status at the current location is determined.

23. The device according to claim 22, characterized in that, The processor is specifically configured to, for the i-th type of dirt particle among the N types of dirt particles, multiply the voltage component of the i-th type of dirt particle under the j-th sensitivity among the N types of sensitivity by the number of times the thin-film resistive pressure sensor of the j-th sensitivity is triggered within a preset time, and determine the voltage value corresponding to the i-th type of dirt particle under the j-th sensitivity. Furthermore, for the i-th type of dirt particle among the N types of dirt particles, the processor adds the voltage values ​​corresponding to the i-th type of dirt particle under the N types of sensitivity to obtain a first value, and determines the first value as the voltage value corresponding to the i-th type of dirt particle, where i is a positive integer from 1 to N, and j is a positive integer from 1 to N.

24. The device according to claim 22, characterized in that, When N equals 2, the matrix-type thin-film resistive pressure sensor includes a high-sensitivity thin-film resistive pressure sensor for detecting large and small dirt particles, and a low-sensitivity thin-film resistive pressure sensor for detecting large dirt particles. The processor is configured to determine the impact force corresponding to large dirt particles based on the voltage value and conversion coefficient corresponding to a low-sensitivity thin-film resistive pressure sensor, and to determine the voltage value corresponding to the low-sensitivity thin-film resistive pressure sensor as the voltage component corresponding to the large dirt particles under the low-sensitivity thin-film resistive pressure sensor; and further, based on the impact force corresponding to the large dirt particles, the voltage value corresponding to the high-sensitivity thin-film resistive pressure sensor, and the conversion coefficient, to determine the voltage component corresponding to small dirt particles under the high-sensitivity thin-film resistive pressure sensor, and the voltage component corresponding to large dirt particles under the high-sensitivity thin-film resistive pressure sensor.

25. The device according to claim 24, characterized in that, The processor is specifically used to determine the ratio of the voltage value corresponding to the low-sensitivity thin-film resistive pressure sensor to the conversion coefficient corresponding to the low-sensitivity thin-film resistive pressure sensor as the impact force corresponding to large dirt particles.

26. The device according to claim 24, characterized in that, The processor is specifically configured to multiply the conversion coefficient corresponding to the high-sensitivity thin-film resistive pressure sensor by the impact force corresponding to the large dirt particle to obtain a first product, and determine the first product as the voltage component corresponding to the large dirt particle under the high-sensitivity thin-film resistive pressure sensor; and further determine the difference between the voltage value corresponding to the high-sensitivity thin-film resistive pressure sensor and the first product as the voltage component corresponding to the small dirt particle under the high-sensitivity thin-film resistive pressure sensor.

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