A finishing device and chemical mechanical polishing system

Abstract

The application discloses a kind of trimming device and chemical mechanical polishing system, the trimming device includes swing arm, pedestal and trimming component, the pedestal is arranged at the end of the swing arm, the trimming component is rotatably connected below pedestal by guide shaft;The trimming component includes mounting seat and trimming disc, the trimming disc is arranged below mounting seat;The mounting seat includes fixing part and adapter, the fixing part is annular structure, the adapter is arranged at the center position of fixing part;The upper portion of the adapter is connected with the guide shaft, and its lower portion is connected to the fixing part by adapter piece;The adapter piece is the thin plate structure that is convex upward, and gap is arranged between it and the trimming disc.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of chemical mechanical polishing, and in particular, relates to a dressing device and a chemical mechanical polishing system. BACKGROUND

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digitalization and intelligentization. Chips are the carriers of integrated circuits, and chip manufacturing involves integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting and packaging, and testing processes. Among them, chemical mechanical polishing is one of the five core processes in the wafer manufacturing process.

[0003] Chemical mechanical polishing (CMP) is a global planarization ultra-precision surface processing technology. Chemical mechanical polishing usually attracts the wafer to the bottom surface of the carrier head, the side of the wafer with the deposited layer abuts the upper surface of the polishing pad, and the carrier head rotates with the polishing pad under the actuation of the drive assembly and gives the wafer a downward load; the polishing liquid is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the wafer completes the chemical mechanical polishing of the wafer under the joint action of chemical and mechanical.

[0004] During the polishing process, in order to ensure that the polishing pad has good surface characteristics, the polishing pad surface groove can accommodate more polishing liquid, and the polishing material to be polished can be efficiently and stably removed, a dressing device needs to be used to dress the surface of the polishing pad. The bottom of the dressing device is configured with a dressing disk, and the bottom surface of the dressing disk is inlaid with diamond particles; the dressing device gives the dressing disk a downward pressure and a rotary torque, and the dressing disk moves relative to the surface of the polishing pad to dress the surface of the polishing pad.

[0005] In order to improve the adaptability of the dressing disk, the existing dressing device is configured with a guide shaft, the lower part of the guide shaft is hinged through a concave ball member and a convex ball member to adjust the position and attitude of the dressing disk by tilting the guide shaft. However, the existing dressing device still has the following disadvantages: the heat generated by the mutual friction of the concave ball member and the convex ball member will be conducted to the dressing disk, which will affect the dressing effect of the polishing pad to some extent; the concave ball member and the convex ball member are usually made of metal materials, and the mutual friction between them will generate metal ions, and if the chamber in the dressing device leaks, there is a risk of metal ion contamination; when the surface of the polishing pad is large, the concave ball member and the convex ball member will separate, that is, the surface topography of the polishing pad cannot be accurately reflected through the guide shaft; at the same time, the concave ball member and the convex ball member are switched by separation and adhesion, and the two will collide and vibrate, which is not conducive to ensuring the reliable operation of the dressing device. SUMMARY

[0006] The embodiment of the present application provides a trimming device and a chemical mechanical polishing system, and aims at at least solving one of the technical problems in the prior art.

[0007] The first aspect of the embodiment of the present application provides a trimming device, which comprises a swing arm, a base and a trimming assembly, the base is arranged at the end of the swing arm, and the trimming assembly is rotationally connected to the lower part of the base through a guide shaft; the trimming assembly comprises a mounting seat and a trimming disc, and the trimming disc is arranged below the mounting seat; the mounting seat comprises a fixing part and an adapter part, the fixing part is in a ring structure, and the adapter part is arranged at the center position of the fixing part; the upper part of the adapter part is connected with the guide shaft, and the lower part of the adapter part is connected with the fixing part through a connecting part; the connecting part is in a thin plate structure which is upwardly convex, and a gap is arranged between the connecting part and the trimming disc.

[0008] In some embodiments, the fixing part, the adapter part and the connecting part are integrally formed to form a semi-closed structure with an open upper end.

[0009] In some embodiments, the connecting part is arranged upwardly and obliquely from the inner side wall of the fixing part and extends to the outside of the adapter part.

[0010] In some embodiments, the included angle between the connecting part and a horizontal plane is 2-10°.

[0011] In some embodiments, the adapter part is a rotating member which is integrated with the connecting part through a circular arc transition.

[0012] In some embodiments, the adapter part comprises an adapter body which is arranged above the connecting part, and the upper part of the adapter body is provided with a convex part which abuts against the lower end surface of the guide shaft.

[0013] In some embodiments, the outer diameter of the adapter body is less than or equal to the outer diameter of the convex part.

[0014] In some embodiments, the trimming device further comprises a flexible film which is in a ring structure; one end of the flexible film is connected to the mounting seat, and the other end of the flexible film is connected to a rotating part in the base; the flexible film, the rotating part and the mounting seat form a sealed chamber.

[0015] In some embodiments, the flexible film is provided with a wrinkle part, and the longitudinal cross section of the wrinkle part is in an S shape; the number of the wrinkle part is at least one, and the wrinkle parts are arranged in a vertical direction in a stacked manner.

[0016] The second aspect of the embodiment of the present application provides a chemical mechanical polishing system, which comprises a polishing disc, a carrier head, a liquid supply device and the dressing device described above, the carrier head loads a wafer to be polished and abuts the polishing pad above the polishing disc, the liquid supply device supplies polishing liquid towards the polishing pad and the wafer, and the dressing device is used to dress the surface of the polishing pad.

[0017] The beneficial effects of the present application include:

[0018] a. The mounting seat configured with an integrated structure can solve the problem of stability decline caused by the frictional heat and mutual impact of the concave ball member and the convex ball member in the prior art, and ensure the stability of the dressing operation;

[0019] b. The integrated mounting seat is made of plastic material, so as to prevent liquid from entering the interior of the dressing device, avoid the rust of the metal member in the interior of the dressing device, and prolong the service life of the dressing device;

[0020] c. The flexible film in the interior of the dressing assembly is configured with a wrinkle part, and the longitudinal section of the wrinkle part is S-shaped, so as to enhance the rebounding capacity of the flexible film, solve the problem of concentrated rebounding force of the flexible film, and improve the service life of the flexible film. BRIEF DESCRIPTION OF DRAWINGS

[0021] The advantages of the present application will become more apparent and more readily appreciated when considered in connection with the following detailed description, taken in conjunction with the accompanying drawings, which are merely illustrative and not restrictive, wherein:

[0022] Figure 1 is a schematic diagram of a chemical mechanical polishing system provided by an embodiment of the present application;

[0023] Figure 2 is a schematic diagram of a dressing device provided by an embodiment of the present application;

[0024] Figure 3 is a schematic diagram of a dressing assembly provided by an embodiment of the present application;

[0025] Figure 4 is a schematic diagram of a mounting seat provided by an embodiment of the present application;

[0026] Figure 5 is a schematic diagram of a mounting seat provided by another embodiment of the present application;

[0027] Figure 6 is a schematic diagram of a flexible film provided by an embodiment of the present application. DETAILED DESCRIPTION

[0028] The technical solutions of the present application will be described in detail below with reference to specific embodiments and drawings. The embodiments described herein are specific embodiments of the present application, which are used to illustrate the concept of the present application; these descriptions are all explanatory and exemplary, and should not be understood as limiting the embodiments of the present application and the protection scope of the present application. In addition to the embodiments described herein, those skilled in the art can also employ other technical solutions that are obvious based on the content disclosed in the claims and the specification of the present application, which include technical solutions that make any obvious substitutions and modifications to the embodiments described herein.

[0029] The drawings of the present specification are schematic drawings that assist in illustrating the concept of the present application, and schematically represent the shape of each part and the relationship between them. It should be understood that, in order to clearly show the structure of each component of the embodiments of the present application, the drawings are not drawn according to the same scale, and the same reference signs are used to represent the same parts in the drawings.

[0030] In the present application, "Chemical Mechanical Polishing (CMP)" is also referred to as "Chemical Mechanical Planarization (CMP)", and "Wafer (W)" is also referred to as "Substrate", which have the same meaning and actual effect.

[0031] The embodiments disclosed in the present application generally relate to a chemical mechanical polishing (CMP) system used in the semiconductor device manufacturing industry.

[0032] During chemical mechanical polishing, a polishing liquid composed of sub-micron or nano abrasive particles and a chemical solution flows between the wafer and the polishing pad, and the polishing liquid is uniformly distributed under the action of the transmission and rotation centrifugal force of the polishing pad, to form a thin liquid film between the wafer and the polishing pad. The chemical components in the liquid react chemically with the wafer, converting insoluble substances into easily soluble substances, which are then removed from the wafer surface by the micro-mechanical friction of the abrasive particles, dissolved into the flowing liquid and carried away. In the alternating process of chemical film formation and mechanical film removal, the surface material is removed to achieve surface planarization treatment, thereby achieving the purpose of global planarization.

[0033] Figure 1is a schematic diagram of a chemical mechanical polishing system 1000 provided by an embodiment of the present application, the chemical mechanical polishing system 1000 comprising a trimming device 100, a polishing disc 200, a polishing pad, a carrier head 300 and a liquid supply device 400. The polishing pad is arranged on the upper surface of the polishing disc 200, and the polishing pad rotates together with the polishing disc 200; the carrier head 300 is horizontally movable and is arranged above the polishing pad, and the bottom of the carrier head 300 attracts a wafer to be polished; the trimming device 100 swings around a fixed point, and a trimming assembly 130 (shown in the figure) arranged on the trimming device 100 rotates by itself and applies a downward load to trim the surface of the polishing pad; and the liquid supply device 400 is arranged above the polishing pad to spread polishing liquid on the surface of the polishing pad. Figure 2 and Figure 3 is a schematic diagram of a chemical mechanical polishing system 1000 provided by an embodiment of the present application, the chemical mechanical polishing system 1000 comprising a trimming device 100, a polishing disc 200, a polishing pad, a carrier head 300 and a liquid supply device 400. The polishing pad is arranged on the upper surface of the polishing disc 200, and the polishing pad rotates together with the polishing disc 200; the carrier head 300 is horizontally movable and is arranged above the polishing pad, and the bottom of the carrier head 300 attracts a wafer to be polished; the trimming device 100 swings around a fixed point, and a trimming assembly 130 (shown in the figure) arranged on the trimming device 100 rotates by itself and applies a downward load to trim the surface of the polishing pad; and the liquid supply device 400 is arranged above the polishing pad to spread polishing liquid on the surface of the polishing pad.

[0034] During polishing, the carrier head 300 abuts the surface of the polishing pad with the wafer to be polished, and the carrier head 300 rotates and reciprocates along the radial direction of the polishing disc 200, so that the surface of the wafer in contact with the polishing pad is gradually polished; at the same time, the polishing disc 200 rotates, and the liquid supply device 400 sprays polishing liquid on the surface of the polishing pad. Under the chemical action of the polishing liquid, the wafer is rubbed with the polishing pad through the relative movement of the carrier head 300 and the polishing disc 200 to implement material removal.

[0035] The trimming device 100 is used to trim and activate the surface of the polishing pad. The trimming device 100 can remove impurity particles remaining on the surface of the polishing pad, such as abrasive particles in the polishing liquid and waste materials falling from the surface of the wafer, to trim and activate the surface of the polishing pad.

[0036] Figure 2 is a schematic diagram of the trimming device 100 provided by an embodiment of the present application, the trimming device 100 comprising a swing arm 110, a base 120 and a trimming assembly 130. The swing arm 110 is rotationally connected to the outer side of the polishing disc 200, the base 120 is arranged at the end of the swing arm 110, and the trimming assembly 130 is arranged at the lower part of the base 120. The interior of the base 120 is provided with a driving mechanism rotating around an axis to drive the trimming assembly 130 to rotate around the axis. The bottom of the trimming assembly 130 is provided with a trimming disc 20 (shown in the figure) inlaid with diamond particles to trim and activate the surface of the polishing pad. Figure 3 is a schematic diagram of the trimming device 100 provided by an embodiment of the present application, the trimming device 100 comprising a swing arm 110, a base 120 and a trimming assembly 130. The swing arm 110 is rotationally connected to the outer side of the polishing disc 200, the base 120 is arranged at the end of the swing arm 110, and the trimming assembly 130 is arranged at the lower part of the base 120. The interior of the base 120 is provided with a driving mechanism rotating around an axis to drive the trimming assembly 130 to rotate around the axis. The bottom of the trimming assembly 130 is provided with a trimming disc 20 (shown in the figure) inlaid with diamond particles to trim and activate the surface of the polishing pad.

[0037] Figure 3 is a schematic diagram of the trimming assembly 130 provided by an embodiment of the present application, the trimming assembly 130 being rotationally connected to the lower part of the base 120 through a guide shaft 30. The trimming assembly 130 comprises a mounting seat 10 and a trimming disc 20, and the trimming disc 20 is arranged below the mounting seat 10.

[0038] Specifically, the inner part of the base 120 is configured with a rotating part 40 capable of rotating around an axis, the inner part of the rotating part 40 is configured with a through hole, and the guide shaft 30 is coaxially arranged in the through hole of the rotating part 40. The rotating part 40 extends towards the lower side and is connected with the mounting seat 10 of the trimming assembly 130, so that the trimming assembly 130 can rotate around the axis.

[0039] Figure 4 is a schematic view of the mounting seat 10 provided by an embodiment of the present application, and the mounting seat 10 comprises a fixing part 11 and an adapter part 12. The fixing part 11 is annular structure, and the adapter part 12 is arranged at the center position of the fixing part 11.

[0040] Further, the upper part of the adapter part 12 is connected with the guide shaft 30, and the lower part of the adapter part 12 is connected with the fixing part 11 through a connecting part 13.

[0041] Figure 4 In the mounting seat 10, the fixing part 11, the adapter part 12 and the connecting part 13 are integrally formed to form a semi-closed structure with an open upper end. In this way, it can be avoided that liquid enters the inner part of the trimming assembly 130 through the lower side of the mounting seat 10 during the trimming operation, and the metal parts in the inner part of the trimming assembly 130 can be prevented from rusting.

[0042] Since the trimming disc 20 is detachably fixed to the lower part of the mounting seat 10, a sealing ring is arranged between the two to ensure the sealing between the trimming disc 20 and the mounting seat 10. However, there is a problem of sealing failure between the two. If the mounting seat 10 is made of metal material, liquid may enter the gap between the mounting seat 10 and the trimming disc 20 and cause rusting problem.

[0043] To solve the above technical problems, the mounting seat 10 can be made of plastic material, such as polytetrafluoroethylene, polyformaldehyde resin, etc., to prevent rusting caused by sealing failure between the trimming disc 20 and the mounting seat 10 and prolong the service life of the metal parts in the inner part of the trimming assembly 10.

[0044] Figure 4 In the mounting seat 10, the connecting part 13 is a thin plate structure protruding upward, the bottom of the connecting part 13 is connected with the inner side wall of the fixing part 11, and the upper part of the connecting part 13 is connected with the adapter part 12. Figure 3 A gap is arranged between the trimming disc 20 and the mounting seat 10 to enhance the flexibility of the mounting seat 10 and ensure that the trimming assembly 130 has good self-adaptability.

[0045] Further, the connecting part 13 is inclined upward from the inner side wall of the fixing part 11, the connecting part 13 extends towards the position where the adapter part 12 is located, and extends to the outside of the adapter part 12.

[0046] As one aspect of this embodiment, the angle between the connector 13 and the horizontal plane is 2-10°. Preferably, the angle between the connector 13 and the horizontal plane is 5-8° to enhance the bending deformation capability of the adapter 12 and the connector 13 inside the mounting base 10.

[0047] In one embodiment of the present invention, the connector 13 has a thin-walled structure with a thickness of 1-4 mm. Preferably, the thickness of the connector 13 is 2-3 mm. Figure 4 In the illustrated embodiment, the connector 13 has a uniform thickness in the radial direction, and the thickness of the connector 13 is 2 mm. As... Figure 4 In one variation of the embodiment, the thickness of the connector 13 can be gradually varied. Specifically, the thickness of the connector 13 can be set to gradually decrease from the outside to the inside to ensure that the connector 13 has good flexibility; for example, the thickness of the connector 13 can be gradually reduced from the outside to the inside to 50% of the original thickness to ensure that the mounting base 10 has good flexibility.

[0048] Figure 4 In the embodiment shown, the adapter 12 is a rotating component. The adapter 12 and the connector 13 are integrated by a right-angle transition, so that the adapter 12 can adaptively change its position and orientation through the inclined connector 13, thereby adjusting the position and orientation of the dressing disk 20 to adapt to the undulating polishing pad surface.

[0049] Figure 5 In the connector 12, the adapter 12 includes an adapter body 12a, which is disposed above the connector 13. A protrusion 12b is disposed on the upper part of the adapter body 12a. The protrusion 12b abuts against the lower end face of the guide shaft 30.

[0050] Figure 5 In the middle, a support plate 12c is also provided on the upper part of the adapter body 12a, and a protrusion 12b is provided on the top of the support plate 12c. The support plate 12c is mainly used to connect the limiting member 50 ( Figure 3 (As shown). Specifically, one end of the limiting member 50 is engaged with the outside of the support plate 12c, and the other end is disposed on the fixing member 11 of the mounting base 10 to prevent excessive changes in the position and orientation of the adapter 12 from affecting the normal operation of the trimming assembly 130.

[0051] Figure 3 middle, Figure 5 The protrusion 12b and support plate 12c shown are located at the lower end of the guide shaft 30. The mounting base 10 is in close contact with the guide shaft 30 through the protrusion 12b, so that the position of the trimming plate 20 can be indirectly reflected by the tilt change of the guide shaft 30.

[0052] Figure 5is a schematic view of the mounting seat 10 provided by another embodiment of the present application, in which the outer side wall of the adapter 12 is inwardly recessed to ensure the bending deformation ability of the adapter 12 and improve the adaptability of the mounting seat 10. Figure 5 In the embodiment, the outer diameter of the adapter body 12a is smaller than the outer diameter of the protruding part 12b to enhance the bending deformation ability of the mounting seat 10 and ensure the pose adjustment ability of the polishing pad 20 arranged at the lower part of the trimming assembly 130.

[0053] In addition, Figure 1 In the embodiment, the mounting seat 10 is of an integrated structure, so that the center of gravity of the mounting seat 10 is properly lowered and the mounting seat 10 responsible for adaptive adjustment is closer to the polishing pad 20. In this way, the vibration of the trimming assembly 130 is weakened, the jumping during the trimming process is reduced or avoided, the fluctuation of the trimming pressure is controlled, and the stability of the trimming operation is ensured.

[0054] Figure 1 In the embodiment shown, the trimming device 100 further comprises a flexible film 60, which is of a ring structure and is arranged at the upper part of the mounting seat 10. Specifically, one end of the flexible film 60 is connected to the mounting seat 10, and the other end of the flexible film 60 is connected to the rotating part 40 in the base 120.

[0055] Figure 1 In the embodiment, the lower end of the rotating part 40 is provided with a connecting piece 70, which is concentrically arranged at the outer circumferential side of the rotating part 40. One end of the flexible film 60 is fixed to the lower end of the connecting piece 70 through a snap ring 80, and the other end of the flexible film 60 is arranged in a clamping groove of the mounting seat 10 and is fixed by being pressed against a connecting flange 90 arranged at the upper side of the mounting seat 10.

[0056] Figure 1 In the embodiment shown, the flexible film 60, the rotating part 40, the connecting piece 70 and the mounting seat 10 form a sealed chamber. Air flow can be delivered to the sealed chamber through a vent hole arranged along the length direction of the guide shaft 30 to adjust the trimming load applied by the trimming assembly 130.

[0057] Figure 6 is a schematic view of the flexible film 60 provided by an embodiment of the present application, and the flexible film 60 is provided with a pleat part 60a. Further, the longitudinal section of the pleat part 60a is S-shaped to ensure the resilience of the flexible film 60, so that the resilience of the flexible film 60 is basically consistent with the load applied to the polishing pad by the trimming assembly 130, to expand the range of load application by the trimming assembly 130 and improve the applicability of the trimming device 100.

[0058] Figure 6 In the embodiment, the pleat part 60a is arranged in a substantially S-shaped trajectory, i.e., first extends inwardly horizontally and then extends outwardly horizontally to form a flexible film 60 with multiple bending layers and good resilience.

[0059] Specifically, the resilience of the flexible film 60 is approximately linearly related to the stroke curve of the trimming assembly 130 when the trimming assembly 130 is pressed down, so that the trimming load applied by the trimming assembly 130 can be close to zero, thereby expanding the range of the trimming load.

[0060] In the present application, the number of the wrinkle portions 60a arranged on the flexible film 60 is at least one, and the wrinkle portions 60a are arranged in a vertical direction in a stacked manner, so as to ensure that the flexible film 60 has good resilience, solve the problem of concentrated resilience, and improve the service life of the flexible film 60.

[0061] Further, the flexible film 60 can be made of rubber materials, such as fluorine rubber, silicon rubber, etc., so as to ensure that the flexible film 60 has certain flexibility and resilience.

[0062] In addition, the present application also provides a chemical mechanical polishing system 1000, a schematic view of which is shown in Figure 1 The chemical mechanical polishing system 1000 comprises a polishing disc 200, a carrier head 300, a liquid supply device 400, and the trimming device 100 described above. The carrier head 300 loads a wafer to be polished and abuts the polishing pad above the polishing disc 200. The liquid supply device 400 supplies polishing liquid towards the polishing pad and the wafer. The trimming device 100 is used to trim the surface of the polishing pad.

[0063] The trimming device 100 is provided with an integrated mounting seat 10, which can solve the problems of heat generated by friction between the concave ball and the convex ball in the prior art, and the problem of stability decline caused by mutual impact, thereby ensuring the stability of the trimming operation.

[0064] At the same time, the integrated mounting seat 10 is made of plastic material, so as to prevent liquid from entering the inside of the trimming device 100, avoid rust of the metal parts inside the trimming device 100, and prolong the service life of the trimming device 100.

[0065] In addition, the flexible film 60 with the wrinkle portions 60a is arranged inside the trimming assembly 100. The longitudinal section of the wrinkle portion 60a is S-shaped, so as to enhance the resilience of the flexible film 60, solve the problem of concentrated resilience of the flexible film 60, and improve the service life of the flexible film 60.

[0066] In the description of the specification, reference to "one embodiment", "some embodiments", "an exemplary embodiment", "an example", "a specific example", or "some examples" means that a particular feature, structure, material, or characteristic being described is included in at least one embodiment or example of the application. The appearances of the phrases "in one embodiment", "in some embodiments", "in an exemplary embodiment", "an example", "a specific example", or "some examples" in various places in the specification are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0067] Although embodiments of the application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made hereto without departing from the principles and the scope of the application, which is defined by the claims and their equivalents.

Claims

1. A dressing device, characterized in that, The polishing device comprises a swing arm, a base and a trimming assembly, the base is arranged at the end of the swing arm, the trimming assembly is rotationally connected to the lower part of the base through a guide shaft; the trimming assembly comprises a mounting seat and a trimming disc, the trimming disc is arranged below the mounting seat; the mounting seat comprises a fixing member and an adapter, the fixing member is annular structure, the adapter is arranged at the center of the fixing member; the upper part of the adapter is connected with the guide shaft, the lower part of the adapter is connected with the fixing member through a connecting member; the connecting member is a thin plate structure which is upwardly convex, a gap is arranged between the connecting member and the trimming disc; the fixing member, the adapter and the connecting member are integrally formed to form a semi-closed structure with an open upper end; the included angle between the connecting member and the horizontal plane is 2-10°; further comprising a flexible film which is annular structure; one end of the flexible film is connected with the mounting seat, the other end of the flexible film is connected with a rotating part in the base; the flexible film, the rotating part and the mounting seat form a sealed chamber.

2. The dressing apparatus of claim 1, wherein, The connecting member is arranged upwardly and obliquely from the inner side wall of the fixing member and extends to the outside of the adapter.

3. The dressing apparatus of claim 1, wherein, The adapter is a rotating member which is integrated with the connecting member through a circular arc transition.

4. The dressing apparatus of claim 1 wherein, The adapter comprises an adapter main body, the adapter main body is arranged above the connecting member, the upper part of the adapter main body is provided with a convex part, the convex part abuts against the lower end surface of the guide shaft.

5. The dressing apparatus of claim 4, wherein the dressing apparatus is configured to be worn on the user's hand. The outer diameter of the adapter main body is less than or equal to the outer diameter of the convex part.

6. The dressing apparatus of claim 1 wherein, The flexible film is provided with a wrinkle part, the longitudinal section of the wrinkle part is S-shaped; the number of the wrinkle part is at least one, and the wrinkle parts are arranged in vertical direction in layers.

7. A chemical mechanical polishing system characterized by comprising: The polishing device comprises a polishing disc, a carrier head, a liquid supply device and the trimming device according to any one of claims 1 to 6, the carrier head loads a wafer to be polished and abuts the wafer against a polishing pad above the polishing disc, the liquid supply device supplies polishing liquid towards the polishing pad and the wafer, and the trimming device is used for trimming the surface of the polishing pad.

Images