Metal film forming device and film forming method thereof
By introducing a film pulling mechanism into the film forming device, the slack caused by thermal expansion of the solid electrolyte film is eliminated, the problem of concave and convexity on the surface of the metal coating is solved, and the film forming quality and film thickness stability are improved.
CN115976611BActive Publication Date: 2025-06-06TOYOTA JIDOSHA KK
Patent Information
- Application Number
- CN202211256867.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-10-15
- Filing Date
- 2022-10-14
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2042-10-14
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Figure CN115976611B_ABST
Abstract
The present invention relates to a film forming device for a metal coating and a film forming method thereof, which suppress the generation of unevenness on the surface of a metal coating (F) and seek to improve the film forming quality. The film forming device (1) comprises: an anode (11); a solid electrolyte membrane (13) arranged between the anode and a substrate (B); a power supply unit (14) which uses the substrate as a cathode and applies a voltage between the anode and the substrate; and a liquid storage body (15) which holds the anode and the solid electrolyte membrane in a separated state and stores an electrolyte (L) containing metal ions between the anode and the solid electrolyte membrane. The solid electrolyte membrane includes: a central portion (13a) which is a portion in contact with the substrate and the electrolyte; and an outer edge portion (13b) which is located outside the central portion. The film forming device comprises a film pulling mechanism (18) which applies a tensile force to the central portion from the central portion toward the outer edge portion when the heated electrolyte is stored in the liquid storage body, thereby stretching the central portion of the solid electrolyte membrane.
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Citation Information
Patent Citations
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