Support device, inspection system, and control method of support device

Abstract

This invention provides a support device, an inspection system, and a control method for the support device, which can flexibly control the temperature of a support portion used to support a substrate W to be inspected. The support device includes: a support portion that supports the inspection object and has an internal channel for a first temperature-regulating medium to flow from an inlet to an outlet; a mixing portion that discharges a third temperature-regulating medium, which is a mixture of the first temperature-regulating medium flowing from the outlet and a second temperature-regulating medium supplied from the outside, at a set ratio; a medium transfer portion that delivers the third temperature-regulating medium as the first temperature-regulating medium to the inlet; and a heating portion that heats either the first or third temperature-regulating medium.

Description

Technical Field

[0001] This invention relates to a support device, an inspection system, and a control method for the support device. Background Technology

[0002] For example, Patent Document 1 discloses an inspection system having multiple inspection chambers, each accommodating an inspection unit for performing electrical inspections of an object on a workbench. Patent Document 1 also discloses an inspection system including a refrigerant supply unit for supplying refrigerant to the workbench, and multiple refrigerant pipes extending from the refrigerant supply unit to the corresponding inspection chambers.

[0003] <Prior art documents>

[0004] <Patent Documents>

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-029627 Summary of the Invention

[0006] <Problem to be solved by this invention>

[0007] The present invention provides an inspection system that can flexibly control the temperature of the support portion used to support the substrate being inspected.

[0008] <Methods for solving problems>

[0009] According to one aspect of the present invention, a support device is provided, comprising: a support portion that supports an inspection object and has internally a flow channel for a first temperature-regulating medium to flow from an inlet to an outlet; a mixing portion that discharges a third temperature-regulating medium, which is a mixture of the first temperature-regulating medium flowing out of the outlet and a second temperature-regulating medium supplied from the outside, at a set ratio; a medium transfer portion that delivers the third temperature-regulating medium as the first temperature-regulating medium to the inlet; and a heating portion that heats either the first temperature-regulating medium or the third temperature-regulating medium.

[0010] <The Effects of the Invention>

[0011] The present invention provides an inspection system that can flexibly control the temperature of the support portion used to support the substrate being inspected. Attached Figure Description

[0012] Figure 1 This is a top cross-sectional view showing the general configuration of the inspection system of this embodiment.

[0013] Figure 2 This is a front longitudinal sectional view showing the general configuration of the inspection system of this embodiment.

[0014] Figure 3This is a front longitudinal sectional view showing the configuration of the inspection area of ​​the inspection system of this embodiment.

[0015] Figure 4 This is a partial enlarged view showing the details of the tester of the inspection system according to this embodiment.

[0016] Figure 5 This is a cross-sectional view showing the details of the upper part of the chuck of the inspection system of this embodiment.

[0017] Figure 6 This is a diagram that schematically illustrates the support device of the inspection system according to the first embodiment.

[0018] Figure 7 This is a diagram illustrating the flow of the temperature-regulating medium in the inspection system of the first embodiment.

[0019] Figure 8 This is a diagram illustrating the flow of the temperature-regulating medium in the inspection system of the first embodiment.

[0020] Figure 9 This is a diagram that schematically illustrates the support device of the inspection system according to the second embodiment.

[0021] Figure 10 This is a diagram that schematically illustrates the inspection system of the third embodiment. Detailed Implementation

[0022] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the accompanying drawings. It should be noted that in this specification and the accompanying drawings, substantially identical configurations are omitted by assigning the same reference numerals to them, thus avoiding repeated descriptions.

[0023] <Overall Structure of the Inspection System>

[0024] Figure 1 This is a top cross-sectional view showing the general configuration of the inspection system 100 of this embodiment. Figure 2 This is a front longitudinal sectional view showing the general configuration of the inspection system 100 of this embodiment.

[0025] An inspection system 100, which is an apparatus for inspecting electrical characteristics based on a set temperature set for each substrate W, which is an example of a substrate, includes a housing 110. The interior of the housing 110 is divided into a loading / unloading area 111, a transport area 112, and an inspection area 113.

[0026] The loading / unloading area 111 is used to load the substrate W before inspection into the inspection system 100 and to unload the substrate W after inspection from the inspection system 100. It is also used to load the probe card 180 (described later) into and out of the inspection system 100. The loading / unloading area 111 includes an opening 120 for receiving a housing C containing multiple substrates W and a loader 121 for receiving the probe card 180. Furthermore, the loading / unloading area 111 includes a control unit 122 for controlling each component of the inspection system 100.

[0027] The transport area 112 is used to transport substrates W and the like between the loading / unloading area 111 and the inspection area 113. A transport device 130, capable of moving freely while holding substrates W, is provided in the transport area 112. This transport device 130 transports substrates W between the housing C within the opening 120 of the loading / unloading area 111 and the alignment portion 150 of the inspection area 113 (described later). Additionally, the transport device 130 transports probe cards 180 requiring maintenance from the probe cards 180 fixed in the spring frame 170 (described later) within the inspection area 113 to the loader 121 in the loading / unloading area 111. Furthermore, the transport device 130 transports new or maintained probe cards 180 from the loader 121 to the spring frame 170 within the inspection area 113.

[0028] Inspection area 113 is the area where the electrical characteristics of electronic devices formed on the substrate W are inspected. Multiple testers 140, serving as inspection units, are provided in inspection area 113. Specifically, as... Figure 2 As shown, the inspection area 113 is divided into three regions in the vertical direction. In each of the divided regions 113a, there is a [missing information - likely a device or structure]. Figure 2 The tester array consists of four testers 140 arranged horizontally. Additionally, each segmented region 113a includes an alignment unit 150 and a camera 160. It should be noted that the number and configuration of the testers 140, alignment unit 150, and camera 160 can be arbitrarily selected. The testers 140 transmit and receive electrical signals for checking electrical characteristics with and from the substrate W.

[0029] The alignment unit 150 includes a chuck upper end member 151 and an aligner 153. Details of the chuck upper end member 151 and the aligner 153 will be described later. The alignment unit 150 holds a substrate W, which serves as a substrate. Furthermore, the alignment unit 150 aligns the held substrate W with a probe card 180 disposed below the tester 140. The alignment unit 150 is configured to be movable within the area below the tester 140 for alignment purposes.

[0030] The camera 160 captures images of the positional relationship between the probe card 180 disposed below the tester 140 and the substrate W placed on the alignment section 150. The camera 160 moves horizontally and is positioned in front of each tester 140 within the segmented area 113a in which the camera 160 is located.

[0031] In the inspection system 100 of this embodiment, while the transport device 130 is transporting the substrate W to one of the multiple testers 140 of the segmented region 113a, the other testers 140 of the segmented region 113a can perform inspections on the electrical characteristics of electronic devices formed on other substrates W.

[0032] Next, use Figure 3 as well as Figure 4 The tester 140, the alignment part 150, and their associated configurations will be described in detail. Figure 3 This is a front longitudinal sectional view showing the configuration of the inspection area 113 of the inspection system 100 of this embodiment. Figure 4 This is a partial enlarged view showing the details of the tester 140 of the inspection system 100 of this embodiment.

[0033] like Figure 3 as well as Figure 4 As shown, the tester 140 has a tester motherboard 141 horizontally disposed at the bottom of the tester 140. Multiple test circuit boards (not shown) are mounted vertically on the tester motherboard 141. Furthermore, multiple electrodes are provided on the bottom surface of the tester motherboard 141.

[0034] Furthermore, a spring frame 170 and a probe card 180 are respectively provided below the tester 140 from top to bottom.

[0035] Around the tester 140, a plurality of support walls 10b extend vertically downward from the upper wall 110a of each segmented region 113a. Furthermore, spring frames 170 are mounted on the lower part of the opposing support walls 110b. Each tester 140 is supported by these opposing support walls 10b and the spring frames 170 mounted between them.

[0036] The spring frame 170 supports the probe card 180 and electrically connects the probe card 180 to the tester 140. The spring frame 170 is positioned between the tester 140 and the probe card 180. The spring frame 170 has spring pins that electrically connect the tester 140 and the probe card 180. Specifically, the spring frame 170 has a spring pin holder 172 for holding a plurality of spring pins, and a frame body portion 173 having mounting holes 173a for mounting spring pins by inserting them into the spring pin holder 172.

[0037] On the lower surface of the spring frame 170, the probe card 180 is vacuum-adsorbed in a state of alignment with the specified position.

[0038] Additionally, a bellows 174 extending vertically downwards is mounted on the lower surface of the spring frame 170, surrounding the mounting position of the probe card 180. This bellows 174 forms a sealed space including the probe card 180 and the substrate W. Within this sealed space, the substrate W on the upper chuck member 151 (described later) is in contact with the probe 182 of the probe card 180 (described later).

[0039] Additionally, a vacuum attraction force (not shown) acts on the spring frame 170 and the probe card 180. Under this vacuum attraction force, the lower ends of each spring pin of the spring frame 170 contact the corresponding electrode pads on the upper surface of the card body 81 of the probe card 180 (described later). Furthermore, under the same vacuum attraction force, the upper ends of each spring pin of the spring frame 170 contact the corresponding electrodes on the lower surface of the tester motherboard 141.

[0040] The probe card 180 has a circular card body 181, a plurality of electrode pads (not shown) on the upper surface of the card body 181, and a plurality of needle-shaped terminals, namely probes 182, extending downward from the lower surface of the card body 181. The plurality of electrodes on the upper surface of the card body 181 are electrically connected to the corresponding probes 182. In addition, during inspection, the probes 182 contact the electrode pads and solder bumps of the electronic devices formed on the substrate W. Therefore, during electrical characteristic inspection, the transmission and reception of electrical signals for inspection between the tester motherboard 141 and the electronic devices on the substrate W are performed through the spring pins, the electrodes on the upper surface of the card body 181, and the probes 182.

[0041] The alignment section 150 includes a chuck upper end member 151 and an aligner 153. The chuck upper end member 151 is detachably mounted on the aligner 153. The substrate W is mounted on the chuck upper end member 151. Furthermore, the chuck upper end member 151 holds the mounted substrate W. A temperature adjustment mechanism 152 is provided in the chuck upper end member 151. This temperature adjustment mechanism 152 adjusts the temperature of the chuck upper end member 151 during electrical characteristic testing. By adjusting the temperature using the temperature adjustment mechanism 152, the temperature of the substrate W mounted on the chuck upper end member 151 during electrical characteristic testing can be adjusted to, for example, -30°C to +130°C.

[0042] Additionally, the aligner 153 supports the upper part 151 of the chuck, so that the upper part 151 of the chuck is in... Figure 3 as well as Figure 4 It can move up and down, front and back, and left and right.

[0043] Alignment is performed through the alignment section 150, with the substrate W on the upper part 151 of the chuck in contact with the probe 182 of the probe card 180. After alignment, a sealed space including the probe card 180 and the substrate W is formed, and this sealed space is evacuated using a vacuum mechanism (not shown). At this time, by moving the alignment device 153 downwards, the upper part 151 of the chuck separates from the alignment device 153 and is attracted to the spring frame 170 side.

[0044] <Chuck upper part>

[0045] Next, the upper chuck component 151 of the inspection system 100 of this embodiment will be described. Figure 5 This is a cross-sectional view showing the detailed contents of the upper chuck component 151 of the inspection system 100 of this embodiment. It should be noted that... Figure 5 This is a diagram showing the substrate W placed on the upper part 151 of the chuck.

[0046] The chuck upper part 151 of the inspection system 100 in this embodiment includes a top plate 155 and a cooling jacket 156.

[0047] The top plate 155 is a component for holding the substrate W. The top plate 155 is provided with a mechanism for adsorbing the substrate W, such as an electrostatic chuck.

[0048] Cooling jacket 156 is a component used to adjust the temperature of substrate W. A medium flow channel 158 for the circulation of temperature-regulating medium HM is formed inside cooling jacket 156. The medium flow channel 158 is, for example, spiral-shaped when viewed from above. It should be noted that the shape of the medium flow channel 158 is not limited to a spiral shape; for example, it can be zig-shaped. The hot medium introduced into the medium flow channel 158 is connected to the refrigerant supply unit 2 (described later) via an inlet / outlet pipe 158a located on the outside of cooling jacket 156. It should be noted that a heater can be separately provided as a component for temperature regulation. The temperature-regulating medium HM is a medium used to regulate the temperature of substrate W. The temperature-regulating medium HM is, for example, water, a refrigerant, etc. The temperature-regulating medium HM can be used to cool substrate W or to heat substrate W.

[0049] <<First Implementation Method>>

[0050] <Inspection System S1>

[0051] An example of the inspection system of the first embodiment, namely inspection system S1, will be described. For the inspection system S1 of the first embodiment, the key points of the inspection system S1 of the first embodiment will be extracted from the configuration of the inspection system 100 described above. Figure 6 This is a diagram that provides a general description of an example of the inspection system of the first embodiment, namely inspection system S1.

[0052] The inspection system S1 performs electrical inspections on the substrate W while the temperature is adjusted. The inspection system S1 includes an inspection device 1 and a refrigerant supply unit 2. For the inspection system S1, the number of components being inspected, i.e., the number of support parts 10, is in a one-to-one relationship with the number of refrigerant supply units 2.

[0053] Inspection device 1 is used to perform electrical inspections on substrate W. Refrigerant supply unit 2 is used to supply temperature-adjusted medium to inspection device 1.

[0054] [Inspection Device 1]

[0055] The inspection apparatus 1 includes a support device 3, an inspection unit 70, and a control unit 80. The support device 3 is used to place and support the substrate W, which is the object of inspection. The inspection unit 70 is used to perform electrical inspections on the substrate W supported by the support device 3.

[0056] The temperature-regulating medium is supplied from the refrigerant supply unit 2 to the inspection device 1 and is also recovered. The refrigerant supply unit 2 connects pipe Pa1 to connector F1, thereby connecting to pipe P1. The refrigerant supply unit 2 supplies the temperature-regulating medium to the inspection device 1 via pipe Pa1. Pipe P1 is connected to pipe P2 via stop valve SV1. Additionally, the refrigerant supply unit 2 connects pipe Pa2 to connector F2, thereby connecting to pipe P12. The refrigerant supply unit 2 recovers the temperature-regulating medium from the inspection device 1 via pipe Pa2. Pipe P12 is connected to pipe P11 via stop valve SV2. It should be noted that stop valves SV1 and SV2 are controlled by the control unit 80.

[0057] Each element is explained.

[0058] (Support device 3)

[0059] The support device 3 adjusts the temperature of the substrate W to the desired temperature while holding the substrate W in place. The support device 3 includes a support part 10, a mixing part 20, a dielectric transfer part 30, and a heating part 40.

[0060] (Support part 10)

[0061] The support portion 10 is used to mount and hold the substrate W, which is the object to be inspected. The support portion 10 is, for example, the upper part 151 of the chuck in the inspection system 100. The support portion 10 has a flow channel 11 (medium flow channel) inside it. The support portion 10 has an inlet 12a for the inflow of temperature-regulating medium and an outlet 12b for the outflow of temperature-regulating medium. In the flow channel 11, the temperature-regulating medium flows in from the inlet 12a and out from the outlet 12b.

[0062] The temperature-regulating medium flows through the interior of the support portion 10 and exchanges heat with the substrate W, thereby controlling the temperature of the substrate W to the desired temperature.

[0063] Additionally, the support portion 10 includes a temperature measuring element 15. The temperature measuring element 15 is used to measure the temperature of the support portion 10. The result measured by the temperature measuring element 15 is input to the control unit 80. The control unit 80 controls the temperature so that the temperature measured by the temperature measuring element 15 becomes the desired temperature.

[0064] (Mixing Section 20)

[0065] The mixing unit 20 discharges the temperature-regulating medium, which has been mixed with the temperature-regulating medium supplied from the outside of the self-inspection device 1, specifically from the refrigerant supply unit 2, and the temperature-regulating medium flowing out from the outlet 12b of the support unit 10, to the medium transfer unit 30.

[0066] The mixing section 20 includes a three-way valve 21, branch pipes B1, B2, and B3. Branch pipes B1, B2, and B3 each branch in three directions.

[0067] The three-way valve 21 has an inlet 21a for the temperature-regulating medium supplied from the refrigerant supply unit 2 to flow into, a first outlet 21b for the temperature-regulating medium to flow out to the path of being recovered by the refrigerant supply unit 2, and a second outlet 21c for the temperature-regulating medium to flow out to the path of flowing toward the support unit 10.

[0068] The inlet 21a of the three-way valve 21 is connected to the piping P2 through which the temperature-regulating medium supplied from the refrigerant supply unit 2 flows. The first outlet 21b of the three-way valve 21 is connected to the piping P10, which connects to the branch pipe B3. The second outlet 21c of the three-way valve 21 is connected to the piping P3, which connects to the branch pipe B1. It should be noted that a check valve 22 is provided in the piping P3, so that the temperature-regulating medium flows from the three-way valve 21 to the branch pipe B1 and does not flow back from the branch pipe B1 to the three-way valve 21.

[0069] As described above, branch pipe B1 is connected to pipe P3, pipe P4 which is the path through which the temperature-regulating medium flows to the support 10, and pipe P8 which is connected to branch pipe B2. It should be noted that a check valve 23 is provided in pipe P8, so that the temperature-regulating medium flows from branch pipe B2 to branch pipe B1 and does not flow back from branch pipe B1 to branch pipe B2.

[0070] Branch pipe B2 is connected to pipe P7 through which the temperature-regulating medium flows from support section 10, and is also connected to pipe P8 and pipe P9, which is connected to branch pipe B3, as described above. Branch pipe B3 is connected to pipe P9, pipe P10, and pipe P11, which directs the temperature-regulating medium to refrigerant supply section 2, as described above.

[0071] The three-way valve 21 can control the ratio of the amount of temperature-regulating medium flowing from the gravity inlet 21a to the first outlet 21b to the amount flowing from the gravity inlet 21a to the second outlet 21c by adjusting its opening. The three-way valve 21 is connected to the control unit 80. The control unit 80 controls the opening of the three-way valve 21 to a desired opening. The control unit 80 can control the ratio of the amount of temperature-regulating medium flowing from the gravity inlet 21a to the first outlet 21b to the amount flowing from the gravity inlet 21a to the second outlet 21c to a desired ratio by controlling the opening of the three-way valve 21.

[0072] (Media transfer unit 30)

[0073] The medium transfer unit 30 directs the temperature-regulating medium flowing in from pipe P5 to pipe P6. The medium transfer unit 30 is, for example, a pump. The medium transfer unit 30 also directs the temperature-regulating medium flowing out from mixing unit 20 to the inlet 12a of support unit 10. The type of pump used in the medium transfer unit 30 is not particularly limited; for example, an axial flow pump.

[0074] The medium transfer unit 30 is connected to the control unit 80. The control unit 80 controls the flow rate of the temperature-regulating medium flowing through the medium transfer unit 30. When the medium transfer unit 30 is a rotary pump, the control unit 80 controls the pump's rotational speed. It should be noted that a separate valve can also be installed to control the flow rate.

[0075] (Heating section 40)

[0076] The heating unit 40 is used to heat the temperature-regulating medium. The heating unit 40 is, for example, a hot wire heater. The heating unit 40 is connected to the control unit 80. The control unit 80 controls the heating amount of the heating unit 40. For example, when the heating unit 40 is a hot wire heater, the power supplied to the hot wire heater is controlled, thereby controlling the heat generated by the hot wire heater.

[0077] (Inspection Department 70)

[0078] The inspection unit 70 is used to perform electrical inspections on the substrate W. The inspection unit 70 may be, for example, the tester 140 and probe card 180 in the inspection system 100. The inspection unit 70 includes, for example, inspection probes. The inspection unit 70 performs electrical inspections on the substrate W by bringing the probes into contact with the substrate W.

[0079] (Control Department 80)

[0080] The control unit 80 is used to control the inspection device 1. The control unit 80 is composed of a computer including an arithmetic unit and a storage unit. The control unit 80 is used to control various parts of the inspection device 1. The arithmetic unit includes, for example, a CPU (Central Processing Unit). The storage unit includes, for example, RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or combinations thereof.

[0081] The storage unit stores a program containing a set of steps (commands) necessary for performing the inspection process. This program may include, for example, a set of steps configured to control the operation of the three-way valve 21 of the mixing unit 20, the media transfer unit 30, and the heating unit 40 in a manner that adjusts the temperature of the substrate W, and more specifically, the temperature of the temperature measuring element 15, to a desired temperature. The program is stored on a storage medium such as a hard disk, optical disk, magneto-optical disk, or memory card, and is installed into a computer from the storage medium.

[0082] For example, the control unit 80 controls the opening degree of the three-way valve 21 so that the temperature of the temperature measuring element 15 of the support 10 is the desired temperature. By controlling the opening degree of the three-way valve 21, the control unit 80 controls the mixing ratio of the temperature-regulating medium discharged from the support 10 and the temperature-regulating medium supplied from the refrigerant supply unit 2. As described above, the control method of this embodiment is executed by the control unit 80.

[0083] [Refrigerant Supply Department 2]

[0084] The refrigerant supply unit 2 supplies the temperature-regulating medium at a specified temperature to the inspection device 1. The refrigerant supply unit 2 is, for example, a chiller. The temperature of the temperature-regulating medium supplied by the refrigerant supply unit 2 is lower than the temperature-regulating medium flowing through the support unit 10.

[0085] The refrigerant supply unit 2 supplies the temperature-regulating medium to the inspection device 1 by connecting the piping Pa1 to the connector F1. Additionally, the refrigerant supply unit 2 recovers the temperature-regulating medium from the inspection device 1 by connecting the piping Pa2 to the connector F2.

[0086] <Check the flow of the temperature-regulating medium in system S1>

[0087] The flow of the temperature-regulating medium in the inspection system S1 will be explained. Figure 7 as well as Figure 8 This is a diagram illustrating the flow of the temperature-regulating medium in the inspection system S1 of the first embodiment.

[0088] The inspection system S1 has two modes: heating mode and cooling mode. Each mode will be explained below.

[0089] (Heating Mode)

[0090] The heating mode is used when, for example, there is no heat generation from the substrate W, and cooling is not required. Figure 7 The diagram illustrates the flow of the temperature-regulating medium in the heating mode. In the heating mode, the temperature-regulating medium (hereinafter referred to as the first temperature-regulating medium L1) flowing through the support section 10 is circulated via the medium transfer section 30. Furthermore, in the heating mode, all the temperature-regulating medium supplied from the refrigerant supply section 2 (hereinafter referred to as the second temperature-regulating medium L2) is returned to the refrigerant supply section 2.

[0091] Specifically, in the three-way valve 21 of the mixing section 20, the second temperature regulating medium L2 is prevented from flowing towards the support section 10. Furthermore, in the three-way valve 21 of the mixing section 20, all of the second temperature regulating medium L2 is returned to the refrigerant supply section 2. That is, in the three-way valve 21, the ratio of the second temperature regulating medium L2 flowing to the branch pipe B1 is set to zero.

[0092] The heating unit 40 is used to heat the first temperature-regulating medium L1 discharged from the mixing unit 20. The heated first temperature-regulating medium L1 is sent to the support unit 10 through the medium transfer unit 30.

[0093] (Cooling Mode)

[0094] The cooling mode is used in situations where, for example, the substrate W generates heat during inspection and needs to be cooled. Figure 8 The diagram shows the flow of the temperature-regulating medium in the cooling mode. In the cooling mode, in the mixing section 20, a third temperature-regulating medium L3, which is a mixture of a portion of the first temperature-regulating medium L1 (first temperature-regulating medium L1a) flowing out from the support section 10 and a portion of the second temperature-regulating medium L2 (second temperature-regulating medium L2a) supplied from the refrigerant supply section 2, is discharged to the medium transfer section 30.

[0095] The heating unit 40 is used to heat the third temperature-regulating medium L3 discharged from the mixing unit 20. The heated third temperature-regulating medium L3 is sent to the support unit 10 as the first temperature-regulating medium L1 through the medium transfer unit 30.

[0096] Specifically, in the three-way valve 21 of the mixing section 20, the second temperature-regulating medium L2a, which is part of the second temperature-regulating medium L2, flows towards the support section 10. On the other hand, the remaining second temperature-regulating medium L2b that fails to flow towards the support section 10 flows towards the branch pipe B3. Furthermore, in the branch pipe B2, the first temperature-regulating medium L1a, which is part of the first temperature-regulating medium L1, flows towards the branch pipe B1. On the other hand, the first temperature-regulating medium L1b that fails to flow from the branch pipe B2 to the branch pipe B1 flows towards the branch pipe B3. It should be noted that the amount of the first temperature-regulating medium L1b is equal to the amount of the second temperature-regulating medium L2a.

[0097] In branch pipe B1, the first temperature-regulating medium L1a and the second temperature-regulating medium L2a are mixed. Furthermore, the third temperature-regulating medium L3, resulting from the mixture of the first and second temperature-regulating media L1a and L2a, flows towards the medium transfer section 30. In the inspection device 1, the third temperature-regulating medium L3 is heated by the heating section 40 and then conveyed from the medium transfer section 30 to the support section 10.

[0098] On the other hand, in branch pipe B3, the first temperature regulating medium L1b and the second temperature regulating medium L2b are mixed. Furthermore, the temperature regulating medium L2r resulting from the mixture of the first temperature regulating medium L1b and the second temperature regulating medium L2b is recovered by the refrigerant supply unit 2.

[0099] In addition, when the temperature of the support portion 10 is higher than the desired temperature (target temperature), the control unit 80 controls the ratio by increasing the proportion of the second temperature regulating medium L2a.

[0100] It should be noted that although the above description is divided into heating mode and cooling mode, the heating mode can be set to a condition where, in the cooling mode, the third temperature-regulating medium L3, in which the ratio of the second temperature-regulating medium L2 flowing through the branch pipe B1 in the three-way valve 21 of the mixing section 20 is set to zero, is discharged from the mixing section 20. In this case, the third temperature-regulating medium L3, in which the ratio of the second temperature-regulating medium L2 flowing through the three-way valve 21 of the mixing section 20 to the branch pipe B1 is set to zero, is equivalent to the first temperature-regulating medium L1.

[0101] <Functions and Effects>

[0102] According to the inspection system S1 of the first embodiment, the temperature of the support portion used to support the substrate to be inspected can be flexibly controlled.

[0103] According to the inspection system S1, in order to control the temperature of the substrate W, when controlling the temperature of the support portion 10 used to support the substrate W to be inspected by controlling the heating unit 40 and the three-way valve 21, the temperature of the temperature-regulating medium flowing through the support portion 10 can be controlled. In the refrigerant supply unit 2, which is a chiller, it is desirable to have a constant flow rate in order to keep the temperature of the temperature-regulating medium constant. According to the inspection system S1, the flow rate of the temperature-regulating medium supplied from the refrigerant supply unit 2 is constant regardless of the target temperature of the support portion 10, so the temperature of the temperature-regulating medium supplied from the refrigerant supply unit 2 can be stabilized. In addition, according to the inspection system S1, since the temperature-regulating medium is heated by the heating unit 40, which is a heater, the temperature of the temperature-regulating medium can be controlled with a faster response speed.

[0104] Furthermore, according to the inspection system S1, in order to control the temperature of the substrate W, when the temperature of the support portion 10 used to support the substrate W to be inspected is controlled by the control medium transfer unit 30, the flow rate of the temperature-regulating medium flowing through the support portion 10 can be controlled. According to the inspection system S1, by controlling the flow rate of the temperature-regulating medium, the amount of heat transferred to the support portion 10 by the self-regulating medium per unit time can be controlled. Therefore, according to the inspection system S1, the rate at which the temperature of the support portion 10 changes per unit time can be controlled.

[0105] For example, generally, the temperature control of the support stage used to support the substrate W to be inspected involves setting the temperature of the supplied temperature-regulating medium to a constant and controlling the flow rate of the temperature-regulating medium. If the temperature of the temperature-regulating medium is changed by a chiller, the response speed may slow down. Furthermore, if the flow rate changes in the chiller, the temperature of the temperature-regulating medium may become unstable. The inspection system S1 according to this embodiment can stably control the temperature and can perform control that takes into account the response speed.

[0106] <<Second Implementation Method>>

[0107] <Inspection System S2>

[0108] In the inspection system S1 of the first embodiment, the heating part 40 and the support part 10 are provided separately, but the heating part can be provided inside the support part. The inspection system S2 of the second embodiment can replace the inspection device 1 and include an inspection device 1A having a support device 3A.

[0109] The support device 3A replaces the support portion 10 of the support device 3 in the first embodiment and includes a support portion 10A. In addition, the support device 3A replaces the heating portion 40 of the support device 3 in the first embodiment and includes a heating portion 40A disposed inside the support portion 10A.

[0110] An example of the inspection system of the second embodiment, inspection system S2, will be described. Figure 9 This is a diagram that provides a schematic description of an inspection system S2, an example of the inspection system according to the second embodiment.

[0111] (Support part 10A)

[0112] The support portion 10A is used to mount and hold the substrate W, which is the object to be inspected. The support portion 10A has a flow channel 11 inside it. The support portion 10A has an inlet 12a for the inflow of temperature-regulating medium and an outlet 12b for the outflow of temperature-regulating medium. In the flow channel 11, the temperature-regulating medium flows in from the inlet 12a and out from the outlet 12b.

[0113] Additionally, the support portion 10A has a heating portion 40A inside. The heating portion 40A is used to heat the first temperature-regulating medium L1. The heating portion 40A heats the support portion 10A and the temperature-regulating medium. The heating portion 40A is, for example, a hot wire heater. The heating portion 40A is connected to the control portion 80. The control portion 80 controls the heating amount of the heating portion 40A. The temperature-regulating medium flows through the interior of the support portion 10A, is heated by the heating portion 40A, and the substrate W exchanges heat with the temperature-regulating medium, thereby controlling the temperature of the substrate W to the desired temperature.

[0114] <Functions and Effects>

[0115] According to the inspection system S2 of the second embodiment, in addition to the function and effect of the inspection system S1 of the first embodiment, the system size can be set to be smaller by integrating the heating part and the support part.

[0116] It should be noted that in the inspection system S2 of the second embodiment, although the heating part is not provided on the outside of the support part 10, a heating part for heating the temperature regulating medium can be provided separately from the heating part 40A inside the support part 10 on the outside of the support part 10.

[0117] <<Third Implementation Method>>

[0118] <Inspection System S3>

[0119] In the inspection system S1 of the first embodiment, the support device 3 and the refrigerant supply unit 2 are in a one-to-one relationship, but it can be configured to have multiple support devices 3 relative to one refrigerant supply unit 2. The inspection system S3 of the third embodiment replaces the inspection device 1 and includes an inspection device 1B having multiple support devices 3. That is, the inspection system S3 includes multiple support devices 3. The inspection system S3 is a so-called multi-component testing system. Figure 10 This is a diagram that schematically illustrates the inspection system S3 of the third embodiment.

[0120] The inspection device 1B of the inspection system S3 in the third embodiment has multiple support devices 3 relative to a refrigerant supply unit 2. The temperature regulating medium supplied from the refrigerant supply unit 2 is supplied to each of the multiple support devices 3 through branch piping. In addition, the temperature regulating medium discharged from each of the multiple support devices 3 is recovered by the refrigerant supply unit 2 through the confluence of the branch piping.

[0121] It should be noted that in the inspection system S3, the support device 3A included in the inspection system S2 of the second embodiment can be used instead of the support device 3.

[0122] <Functions and Effects>

[0123] According to the inspection system S3 of the third embodiment, in addition to the functions and effects of the inspection system S1 of the first embodiment, the temperature can be individually controlled in each of the plurality of support devices 3. That is, according to the inspection system S3, inspection can be performed under different temperature conditions in each of the plurality of inspection devices.

[0124] For example, in a multi-component testing system like inspection system 100, if a temperature-regulating medium is supplied from one refrigerant supply unit to multiple inspection devices, then only inspections under the same temperature conditions can be performed on all of the multiple inspection devices. According to the inspection system S3 of this embodiment, since each of the multiple support devices 3 includes a mixing unit 20, a medium transfer unit 30, and a heating unit 40, temperature control can be performed individually on each of the multiple testers. Therefore, according to inspection system S3, inspections can be performed under different temperature conditions on each of the multiple testers.

[0125] Furthermore, according to the inspection system S3, the total flow rate of the temperature-regulating medium supplied from the refrigerant supply unit 2 to each inspection device 1B is constant regardless of the target temperature of the support portion 10 in each support device 3, thus enabling the temperature of the temperature-regulating medium supplied from the refrigerant supply unit 2 to be stable.

[0126] The support device, inspection system, and control method of the support device disclosed herein are illustrative and not limiting in all respects. The above embodiments can be modified and improved in various ways without departing from the appended claims and their spirit. The items described in the above embodiments can be otherwise configured, and can be combined, without contradiction.

Claims

1. A support device comprising: a support portion that supports an inspection object and has a flow path for a first temperature-adjusting medium to flow from an inlet to an outlet inside; a mixing portion that discharges a third temperature-adjusting medium obtained by mixing the first temperature-adjusting medium that has flowed out of the outlet and a second temperature-adjusting medium supplied from outside at a set ratio; a medium transfer portion that sends the third temperature-adjusting medium to the inlet as the first temperature-adjusting medium; and a heating portion that heats the first temperature-adjusting medium or the third temperature-adjusting medium, wherein the medium transfer portion includes a pump, wherein the mixing portion includes a three-way valve, and wherein the three-way valve distributes the temperature-adjusting medium supplied from outside to a path for discharge to the outside and a path for sending to the medium transfer portion.

2. The support device according to claim 1, further comprising a control portion that controls the ratio in accordance with a temperature of the support portion.

3. The support device according to claim 2, wherein a temperature of the second temperature-adjusting medium is lower than a temperature of the first temperature-adjusting medium, and wherein the control portion controls the ratio in such a manner that the proportion of the second temperature-adjusting medium becomes larger when the temperature of the support portion is higher than a target temperature.

4. The support device according to claim 3, wherein the control portion controls the proportion of the second temperature-adjusting medium to be zero.

5. The support device according to any one of claims 2 to 4, wherein the control portion controls a heat generation amount of the heating portion and a flow rate of the medium transfer portion.

6. The support device according to any one of claims 2 to 4, wherein the control portion controls an opening degree of the three-way valve.

7. The support device according to any one of claims 1 to 4, wherein the support portion includes the heating portion inside.

8. An inspection system comprising: a refrigerant supply portion; and a plurality of support devices according to any one of claims 1 to 7, wherein the refrigerant supply portion supplies the second temperature-adjusting medium to each of the plurality of support devices.

9. A control method of a support device that includes: a support portion that supports an inspection object and has a flow path for a first temperature-adjusting medium to flow from an inlet to an outlet inside; a heating portion that heats the first temperature-adjusting medium; a mixing portion that discharges a third temperature-adjusting medium obtained by mixing the first temperature-adjusting medium that has flowed out of the outlet and a second temperature-adjusting medium supplied from outside at a set ratio; and a medium transfer portion that sends the third temperature-adjusting medium to the inlet as the first temperature-adjusting medium, wherein the medium transfer portion includes a pump, wherein the mixing portion includes a three-way valve, and wherein the three-way valve distributes the temperature-adjusting medium supplied from outside to a path for discharge to the outside and a path for sending to the medium transfer portion, and wherein an opening degree of the three-way valve is controlled in accordance with a temperature of the support portion to control the ratio. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

Images