driving backplane

Abstract

A drive backplane includes a substrate, a light blocking pattern layer, a first insulating layer, a first conductive pattern layer, a second insulating layer, and a second conductive pattern layer. The substrate has a front side, wherein the front side includes a junction region. The light blocking pattern layer is disposed on the front side of the substrate. The first insulating layer is disposed on the light blocking pattern layer. The first conductive pattern layer is disposed on the first insulating layer. The second insulating layer is disposed on the first conductive pattern layer. The second conductive pattern layer is disposed on the second insulating layer. In a top view of the drive backplane, within the junction region, the first conductive pattern layer and the second conductive pattern layer have a common opening region, and the light blocking pattern layer completely blocks the common opening region.

Description

Technical Field

[0001] This invention relates to a drive backplate. Background Technology

[0002] A light-emitting diode (LED) display panel includes a driver backplane and multiple LED elements mounted on the driver backplane. Inheriting the characteristics of LEDs, LED display panels offer advantages such as energy saving, high efficiency, high brightness, and fast response time. Furthermore, compared to organic light-emitting diode (OLED) display panels, LED display panels also offer advantages such as easier color calibration, longer lifespan, and no image burn-in. Therefore, LED display panels are considered the next generation of display technology. However, light passes through multiple film layers on the front side of the driver backplane and is transmitted to the back side wiring on the back side of the driver backplane. The light is reflected by the back side wiring, making the back side wiring visible to the user and affecting the visual effect of the LED display panel. Summary of the Invention

[0003] This invention provides a drive backplate with excellent visual effects.

[0004] The driving backplate of the present invention includes a substrate, a light-shielding pattern layer, a first insulating layer, a first conductive pattern layer, a second insulating layer, and a second conductive pattern layer. The substrate has a front side, wherein the front side includes a bonding region. The light-shielding pattern layer is disposed on the front side of the substrate. The first insulating layer is disposed on the light-shielding pattern layer. The first conductive pattern layer is disposed on the first insulating layer. The second insulating layer is disposed on the first conductive pattern layer. The second conductive pattern layer is disposed on the second insulating layer. In a top view of the driving backplate, within the bonding region, the first conductive pattern layer and the second conductive pattern layer have a common opening region, and the light-shielding pattern layer completely blocks the common opening region. Attached Figure Description

[0005] Figure 1 This is a cross-sectional schematic diagram of the drive backplate 10 according to an embodiment of the present invention.

[0006] Figure 2 This is a top view of a drive backplate 10 according to an embodiment of the present invention.

[0007] Figure 3 This is a top view of the light-shielding pattern layer 120 of the drive backplate 10 according to an embodiment of the present invention.

[0008] Figure 4 This is a top view of the first conductive pattern layer 170 of the drive backplate 10 according to an embodiment of the present invention.

[0009] Figure 5 This is a top view of the second conductive pattern layer 190 of the drive backplate 10 according to an embodiment of the present invention.

[0010] Figure 6This is a top view of the third conductive pattern layer 210 of the drive backplate 10 according to an embodiment of the present invention.

[0011] Figure 7 This is a top view of the transparent conductive pattern layer 220 and the fourth insulating layer 230 of the drive backplate 10 according to an embodiment of the present invention.

[0012] Explanation of reference numerals in the attached figures:

[0013] 10: Drive backplane

[0014] 110: Substrate

[0015] 112: Front

[0016] 112a: Junction area

[0017] 112a-1: First boundary

[0018] 112a-2: Second Boundary

[0019] 112a-3: Third Boundary

[0020] 112a-4: Fourth Boundary

[0021] 114: Back

[0022] 120: Light-blocking pattern layer

[0023] 130: Buffer layer

[0024] 140: Gate insulation layer

[0025] 150: Interlayer dielectric layer

[0026] 160: First insulating layer

[0027] 170: First conductive pattern layer

[0028] 170a: First opening

[0029] 171, 191, 211: First conductive region

[0030] 172, 192, 212: Second conductive region

[0031] 180: Second insulating layer

[0032] 190: Second conductive pattern layer

[0033] 190a: Second opening

[0034] 200: Third insulation layer

[0035] 210: Third conductive pattern layer

[0036] 210a: Third opening

[0037] 211a, 212a: Sealing pads

[0038] 220: Transparent conductive patterned layer

[0039] 221, 222: Transparent conductive patterns

[0040] 230: Fourth Insulation Layer

[0041] 231, 232: Through holes

[0042] 240: Back panel wiring

[0043] A1, A2, A3, A4: Distance

[0044] O: Common opening area

[0045] W, Wx, Wy: Width

[0046] x: First direction

[0047] y: Second direction

[0048] I-I': section line Detailed Implementation

[0049] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0050] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or an intermediate element may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate element is present. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may involve the presence of other elements between the two elements.

[0051] As used herein, “about,” “approximately,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement under discussion and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” or “substantially” herein may be chosen based on the optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, and may not require a single standard deviation to apply to all properties.

[0052] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and this invention, and will not be interpreted as having idealized or overly formal meanings unless expressly defined herein.

[0053] Figure 1 This is a cross-sectional schematic diagram of the drive backplate 10 according to an embodiment of the present invention. Figure 2 This is a top view of a drive backplate 10 according to an embodiment of the present invention. Figure 3 This is a top view of the light-shielding pattern layer 120 of the drive backplate 10 according to an embodiment of the present invention. Figure 4 This is a top view of the first conductive pattern layer 170 of the drive backplate 10 according to an embodiment of the present invention. Figure 5 This is a top view of the second conductive pattern layer 190 of the drive backplate 10 according to an embodiment of the present invention. Figure 6 This is a top view of the third conductive pattern layer 210 of the drive backplate 10 according to an embodiment of the present invention. Figure 7 This is a top view of the transparent conductive pattern layer 220 and the fourth insulating layer 230 of the drive backplate 10 according to an embodiment of the present invention. Figure 1 correspond Figures 2 to 7 The section line I-I'.

[0054] Please refer to Figure 1 and Figure 2 The drive backplane 100 includes a substrate 110 having a front side 112 and a back side 114 opposite to the front side 112. The front side 112 of the substrate 110 includes a bonding region 112a. In this embodiment, the substrate 110 is light-transmitting. For example, in this embodiment, the substrate 110 may be made of glass, quartz, organic polymer, or other suitable materials.

[0055] Please refer to Figure 1 , Figure 2 and Figure 3 The drive backplate 100 also includes a light-shielding pattern layer 120 disposed on the front side 112 of the substrate 110. In this embodiment, the material of the light-shielding pattern layer 120 is, for example, metal, but the present invention is not limited thereto. In this embodiment, the light-shielding pattern layer 120 may be selectively floating, but the present invention is not limited thereto.

[0056] Please refer to Figure 1The driving backplane 100 further includes a first insulating layer 160 disposed on the light-shielding pattern layer 120. The first insulating layer 160 may be composed of a single film layer or multiple film layers stacked in phase. In this embodiment, the driving backplane 100 may also include a buffer layer 130 disposed on the light-shielding pattern layer 120, a semiconductor pattern layer (not shown) disposed on the buffer layer 130, a gate insulating layer 140 disposed on the semiconductor pattern layer, a first metal layer (not shown) disposed on the gate insulating layer 140, an interlayer dielectric layer 150 disposed on the first metal layer, and a second metal layer (not shown) disposed on the interlayer dielectric layer 150. The semiconductor pattern layer may include a channel of a thin-film transistor, the first metal layer may include the gate of the thin-film transistor, the second metal layer may include the source and drain of the thin-film transistor, and the first insulating layer 160 may be disposed on the interlayer dielectric layer 150 and cover the second metal layer, but the present invention is not limited thereto.

[0057] Please refer to Figure 1 , Figure 2 and Figure 3 The drive backplane 100 also includes a first conductive pattern layer 170 disposed on the first insulating layer 160. The first conductive pattern layer 170 can block light. In this embodiment, the material of the first conductive pattern layer 170 can be metal, and the first conductive pattern layer 170 can also be called a third metal layer, but the present invention is not limited thereto. Please refer to... Figure 1 and Figure 4 In this embodiment, the first conductive pattern layer 170 may include a first conductive region 171 and a second conductive region 172, wherein a first opening 170a exists between the first conductive region 171 and the second conductive region 172 of the first conductive pattern layer 170. In this embodiment, the first conductive region 171 and the second conductive region 172 extend substantially in the same direction (i.e., the second direction y) and are spaced apart from each other to define a strip-shaped first opening 170a. In this embodiment, the first conductive pattern layer 170 may include at least a portion of a pulse width modulation (PWM) circuit, wherein the PWM circuit controls the duration of current switching to determine grayscale brightness, but the present invention is not limited thereto.

[0058] Please refer to Figure 1 The drive backplane 100 also includes a second insulating layer 180 disposed on the first conductive pattern layer 170. The second insulating layer 180 may consist of a single film layer or multiple film layers stacked in phase.

[0059] Please refer to Figure 1 , Figure 2 and Figure 5The drive backplate 100 also includes a second conductive pattern layer 190 disposed on the second insulating layer 180. The second conductive pattern layer 190 can block light. In this embodiment, the material of the second conductive pattern layer 190 can be metal, and the second conductive pattern layer 190 can also be called a fourth metal layer, but the present invention is not limited thereto.

[0060] Please refer to Figure 1 and Figure 5 In this embodiment, the second conductive pattern layer 190 may include a first conductive region 191 and a second conductive region 192, wherein a second opening 190a exists between the first conductive region 191 and the second conductive region 192 of the second conductive pattern layer 190. In this embodiment, the first conductive region 191 may surround the second conductive region 192, and the first conductive region 191 and the second conductive region 192 are spaced apart from each other to define an annular second opening 190a. In this embodiment, the second conductive pattern layer 190 may include at least a portion of a pulse amplitude modulation (PAM) circuit, wherein the PAM circuit controls the magnitude of the current amplitude to determine the grayscale brightness.

[0061] Please refer to Figure 1 In this embodiment, the drive backplane 100 may further include a third insulating layer 200 disposed on the second conductive pattern layer 190. The third insulating layer 200 may consist of a single film layer or multiple film layers stacked in phase.

[0062] Please refer to Figure 1 , Figure 2 and Figure 6 In this embodiment, the driving backplate 100 may further include a third conductive pattern layer 210 disposed on the third insulating layer 200. The third conductive pattern layer 210 can block light. In this embodiment, the material of the third conductive pattern layer 210 may be metal, and the third conductive pattern layer 210 may also be called a fifth metal layer, but the present invention is not limited thereto.

[0063] Please refer to Figure 1 and Figure 6In this embodiment, the third conductive pattern layer 210 may include a first conductive region 211 and a second conductive region 212, wherein a third opening 210a exists between the first conductive region 211 and the second conductive region 212 of the third conductive pattern layer 210. In this embodiment, the first conductive region 211 of the third conductive pattern layer 210 surrounds the second conductive region 212 of the third conductive pattern layer 210, and the first conductive region 211 and the second conductive region 212 of the third conductive pattern layer 210 are spaced apart from each other to define the third opening 210a. The third conductive pattern layer 210 has a plurality of pads 211a and 212a. Each pad 212a may be an island-shaped second conductive region 212. Each pad 211a may be a portion of the first conductive region 211 protruding beside the second conductive region 212. For example, in this embodiment, pad 212a can be used to electrically connect to the anode of a light-emitting diode element (not shown), and another pad 211a can have a ground potential and be used to electrically connect to the cathode of the light-emitting diode element.

[0064] Please refer to Figure 1 , Figure 2 , Figure 6 and Figure 7 In this embodiment, the driving backplate 100 may further include a transparent conductive pattern layer 220 disposed on the third conductive pattern layer 210. Please refer to... Figure 1 , Figure 6 and Figure 7 In this embodiment, the transparent conductive pattern layer 220 can be directly disposed on and electrically connected to the third conductive pattern layer 210. More specifically, in this embodiment, the transparent conductive pattern layer 220 has a plurality of transparent conductive patterns 221 and 222, wherein the plurality of transparent conductive patterns 221 and 222 are respectively disposed on a plurality of pads 211a and 212a of the third conductive pattern layer 210 and are respectively electrically connected to the plurality of pads 211a and 212a of the third conductive pattern layer 210. For example, in this embodiment, the transparent conductive pattern layer 220 may include metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide, other suitable oxides, or a stacked layer of at least two of the above, but the present invention is not limited thereto.

[0065] Please refer to Figure 1 , Figure 2 , Figure 6 and Figure 7In this embodiment, the driving backplate 100 may further include a fourth insulating layer 230 disposed on the transparent conductive pattern layer 220, and having a plurality of through holes 231, 232, wherein the plurality of through holes 231, 232 of the fourth insulating layer 230 overlap with the plurality of transparent conductive patterns 221, 222 respectively. The plurality of transparent conductive patterns 221, 222 exposed by the plurality of through holes 231, 232 of the fourth insulating layer 230 and the plurality of pads 211a, 212a under the plurality of transparent conductive patterns 221, 222 are used to bond with light-emitting diode elements (not shown) to form a display device.

[0066] Please refer to Figure 1 In this embodiment, the drive backplate 10 further includes a backside trace 240 disposed on the backside 114 of the substrate 110. The backside trace 240 can be electrically connected to the first conductive pattern layer 170, the second conductive pattern layer 190, and / or the third conductive pattern layer 210 disposed on the frontside 112 of the substrate 110 via side traces disposed on the sidewall (not shown) of the substrate 110, conductive vias (not shown) penetrating the substrate 110, or other conductive elements. In this embodiment, the backside trace 240 is reflective. For example, in this embodiment, the material of the backside trace 240 can be metal, but the present invention is not limited thereto.

[0067] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 In the top view of the drive backplate 10, within the bonding area 112a, the first conductive pattern layer 170 and the second conductive pattern layer 190 have a common opening area O, which is the overlap of the first opening 170a of the first conductive pattern layer 170 and the second opening 190a of the second conductive pattern layer 190, while the light-shielding pattern layer 120 completely blocks the common opening area O.

[0068] In this embodiment, the common opening region O of the first conductive pattern layer 170 and the second conductive pattern layer 190 overlaps with a portion of the light-shielding pattern layer 120 and the back trace 240. That is, the light-shielding pattern layer 120 shields the portion of the back trace 240 not shielded by the first conductive pattern layer 170 and the second conductive pattern layer 190. Therefore, light beams (not shown) are less likely to be transmitted from the front side 112 to the back trace 240 and reflected by it. As a result, the user is less likely to see the back trace 240 from the front side 112, thereby improving the visual effect of the display device including the drive backplate 10.

[0069] Please refer to Figure 1 , Figure 3 , Figure 4 and Figure 5In this embodiment, the first opening 170a of the first conductive pattern layer 170 and the second opening 190a of the second conductive pattern layer 190 intersect each other to define a common opening region O of the first conductive pattern layer 170 and the second conductive pattern layer 190. More specifically, in this embodiment, the first opening 170a of the first conductive pattern layer 170 is strip-shaped and extends generally in the second direction y, while the second opening 190a of the second conductive pattern layer 190 is annular, with a segment of the annular second opening 190a extending in the first direction x. The strip-shaped first opening 170a of the first conductive pattern layer 170 and the annular second opening 190a of the second conductive pattern layer 190 intersect to define a common opening region O, but the invention is not limited thereto.

[0070] Please refer to Figure 1 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In this embodiment, in the top view of the drive backplate 10, within the bonding area 112a, the first conductive pattern layer 170, the second conductive pattern layer 190, and the third conductive pattern layer 210 share a common opening area O. The third opening 210a of the third conductive pattern layer 210 intersects with the first opening 170a of the first conductive pattern layer 170 and overlaps with the second opening 190a of the second conductive pattern layer 190, thereby defining the common opening area O of the first conductive pattern layer 170, the second conductive pattern layer 190, and the third conductive pattern layer 210.

[0071] Please refer to Figure 7In this embodiment, the bonding region 112a has a first boundary 112a-1, a second boundary 112a-2, a third boundary 112a-3, and a fourth boundary 112a-4. The first boundary 112a-1 is relative to the second boundary 112a-2, the third boundary 112a-3 connects the first boundary 112a-1 and the second boundary 112a-2, and the fourth boundary 112a-4 is relative to the third boundary 112a-3 and connects the first boundary 112a-1 and the second boundary 112a-2. A plurality of through holes 231 and 232 of the fourth insulating layer 230 are located within the bonding region 112a. The plurality of through holes 231 and 232 include a first through hole 232a and a second through hole 231a respectively close to the first boundary 112a-1 and the second boundary 112a-2. Arranged in a first direction x, each of the plurality of through holes 231, 232 has a width W in a second direction y that is substantially perpendicular to the first direction x. The first through hole 232a is at a distance A1 from the first boundary 112a-1 of the junction area 112a in the first direction x. The second through hole 231a is at a distance A2 from the second boundary 112a-2 of the junction area 112a in the first direction x. The first through hole 232a is at a distance A3 from the third boundary 112a-3 of the junction area 112a in the second direction y. The first through hole 232a is at a distance A4 from the fourth boundary 112a-4 of the junction area 112a in the second direction y. 0.25W≤A1≤0.75W, 0.25W≤A2≤0.75W, 0.35W≤A3≤0.85W, and 0.35W≤A4≤0.85W. For example, in this embodiment, the width W, distances A1, A2, A3, and A2 can be 85μm, 50μm, 50μm, 55μm, and 60μm, respectively, but the present invention is not limited thereto. Additionally, in this embodiment, the width Wx of the joining region 112a in the first direction x and the width Wy in the second direction y can be 400μm and 200μm, respectively; however, the present invention is not limited thereto.

Claims

1. A drive backplane, comprising: A substrate having a front side, wherein the front side includes a bonding area; A light-shielding pattern layer is disposed on the front side of the substrate; A first insulating layer is disposed on the light-shielding pattern layer; A first conductive pattern layer is disposed on the first insulating layer; A second insulating layer is disposed on the first conductive pattern layer; as well as A second conductive pattern layer is disposed on the second insulating layer; In the top view of the drive backplate, within the bonding area, the first conductive pattern layer and the second conductive pattern layer share a common opening area, which is completely covered by the light-shielding pattern layer. The substrate further has a back side opposite to the front side, and the driving back plate also includes: A back-side circuit is disposed on the back side of the substrate. The common opening area of ​​the first conductive pattern layer and the second conductive pattern layer overlaps with a portion of the light-shielding pattern layer and the back-side wiring.

2. The drive backplane as described in claim 1, wherein, The first conductive pattern layer includes: A first conductive region; as well as A second conductive region, wherein a first opening exists between the first conductive region of the first conductive pattern layer and the second conductive region of the first conductive pattern layer; The second conductive pattern layer includes: A first conductive region; as well as A second conductive region, wherein a second opening exists between the first conductive region of the second conductive pattern layer and the second conductive region of the second conductive pattern layer; The first opening of the first conductive pattern layer and the second opening of the second conductive pattern layer are interleaved to define the common opening area of ​​the first conductive pattern layer and the second conductive pattern layer.

3. The drive backplate of claim 2, wherein the first conductive region of the first conductive pattern layer and the second conductive region of the first conductive pattern layer extend in the same direction and are spaced apart from each other to define the strip-shaped first opening; the first conductive region of the second conductive pattern layer surrounds the second conductive region of the second conductive pattern layer, and the first conductive region of the second conductive pattern layer and the second conductive region of the second conductive pattern layer are spaced apart from each other to define the annular second opening.

4. The drive backplane as described in claim 2, further comprising: A third insulating layer is disposed on the second conductive pattern layer; as well as A third conductive pattern layer is disposed on the third insulating layer; In the top view of the drive backplate, the first conductive pattern layer, the second conductive pattern layer, and the third conductive pattern layer have the common opening area within the bonding area.

5. The drive backplane as described in claim 4, wherein, The third conductive pattern layer includes: A first conductive region; and A second conductive region, wherein a third opening exists between the first conductive region of the third conductive pattern layer and the second conductive region of the third conductive pattern layer; The third opening of the third conductive pattern layer intersects with the first opening of the first conductive pattern layer and overlaps with the second opening of the second conductive pattern layer to define the common opening area of ​​the first conductive pattern layer, the second conductive pattern layer and the third conductive pattern layer.

6. The drive backplane of claim 5, wherein the first conductive region of the third conductive pattern layer surrounds the second conductive region of the third conductive pattern layer, and the first conductive region of the third conductive pattern layer and the second conductive region of the third conductive pattern layer are spaced apart from each other to define the third opening.

7. The drive backplane as described in claim 1, further comprising: A third insulating layer is disposed on the second conductive pattern layer; A third conductive pattern layer is disposed on the third insulating layer and has multiple pads; A transparent conductive pattern layer is disposed on the third conductive pattern layer and has multiple transparent conductive patterns, wherein the transparent conductive patterns are respectively disposed on the pads of the third conductive pattern layer and are respectively electrically connected to the pads of the third conductive pattern layer. as well as A fourth insulating layer is disposed on the transparent conductive pattern layer and has a plurality of through holes, wherein the through holes of the fourth insulating layer overlap the transparent conductive patterns respectively; The joining area has a first boundary, a second boundary, a third boundary and a fourth boundary, the first boundary being relative to the second boundary, the third boundary being connected between the first boundary and the second boundary, and the fourth boundary being relative to the third boundary and connected between the first boundary and the second boundary. The vias of the fourth insulating layer are located within the junction area, and the vias include a first via and a second via respectively close to the first boundary and the second boundary; The through holes are arranged in a first direction, each of the through holes having a width W in a second direction substantially perpendicular to the first direction, the first through hole being a distance A1 from the first boundary of the joint area in the first direction, the second through hole being a distance A2 from the second boundary of the joint area in the first direction, the first through hole being a distance A3 from the third boundary of the joint area in the second direction, and the first through hole being a distance A4 from the fourth boundary of the joint area in the second direction, where 0.25W≤A1≤0.75W, 0.25W≤A2≤0.75W, 0.35W≤A3≤0.85W, and 0.35W≤A4≤0.85W.

8. The driving backplane of claim 1, wherein the first conductive pattern layer includes at least a portion of a pulse width modulation circuit.

9. The drive backplane of claim 1, wherein the second conductive pattern layer includes at least a portion of a pulse amplitude modulation circuit.

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