Laser system

Abstract

The application discloses a laser system, and belongs to the technical field of photoelectricity. The laser system comprises a laser, a circuit board and a soldering sheet. The laser comprises a bottom plate, a frame on the bottom plate, a light-emitting chip on the bottom plate and surrounded by the frame, and a conductive structure embedded in the frame and communicating between the inside and outside of the surrounding area of the frame. One end of the conductive structure in the surrounding area of the frame is electrically connected with the light-emitting chip. The circuit board has a soldering pad connected with a power supply, the laser is located on the circuit board, and the bottom plate is close to the circuit board. One end of the conductive structure outside the surrounding area of the frame is electrically connected with the soldering pad through the soldering sheet. The application solves the problem that the electrical connection between the laser and the circuit board is relatively complex. The application is used for light emission.

Description

[0001] The embodiment of the present application claims priority to the Chinese patent application No. 202211732527.4, filed on December 30, 2022, and entitled "Laser system", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of optoelectronic technology, and in particular to a laser system. BACKGROUND

[0003] With the development of optoelectronic technology, lasers are widely used, and the requirements for lasers in various aspects are also increasingly high.

[0004] In the related art, a laser is electrically connected with a circuit board, and the circuit board is used to supply power to the laser. The laser includes a bottom plate, a packaging shell fixed to the bottom plate, and a light-emitting chip located in the packaging shell. The bottom plate is provided with a circuit connected with the circuit board, and the packaging shell is embedded with a conductive structure. The light-emitting chip is connected with the circuit on the bottom plate through the conductive structure in the packaging shell, and then the circuit board, the circuit and the conductive structure can transmit current to the light-emitting chip to make the light-emitting chip emit light.

[0005] However, the process of setting the circuit on the circuit board in the related art is relatively complex, so the process of electrically connecting the laser with the circuit board is relatively complex. SUMMARY

[0006] The present application provides a laser system, which can solve the problem of complex process of electrically connecting the laser with the circuit board. The laser system comprises a laser, a circuit board and a soldering pad.

[0007] The laser comprises a bottom plate, a frame located on the bottom plate, a light-emitting chip located on the bottom plate and surrounded by the frame, and a conductive structure embedded in the frame and communicating between the inside and outside of the surrounding area of the frame; one end of the conductive structure located in the surrounding area of the frame is electrically connected with the light-emitting chip.

[0008] The circuit board has a pad connected with a power supply, the laser is located on the circuit board, and the bottom plate is close to the circuit board; one end of the conductive structure located outside the surrounding area of the frame is electrically connected with the pad through the soldering pad.

[0009] The technical scheme provided by the present application has at least the following beneficial effects:

[0010] In the laser system provided in the application, the frame is arranged on the bottom plate, and the conductive structure is embedded in the frame to communicate the inside and outside of the surrounding area of the frame; one end of the conductive structure located in the surrounding area of the frame is electrically connected with the light-emitting chip, and the other end located outside the surrounding area of the frame is electrically connected with the pad in the circuit board through the soldering sheet, so that the current can be transmitted to the light-emitting chip through the circuit board and the soldering sheet. In this way, when the laser and the circuit board are fixed, only the soldering sheet needs to be arranged between the other end of the conductive structure located outside the surrounding area of the frame and the pad of the circuit board, and the electrical connection mode of the laser and the circuit board can be simplified. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0012] Figure 1 is a structural schematic diagram of a laser system provided in the related art;

[0013] Figure 2 is a structural schematic diagram of a laser system provided in the embodiments of the application;

[0014] Figure 3 is a structural schematic diagram of another laser system provided in the embodiments of the application;

[0015] Figure 4 is a structural schematic diagram of a laser provided in the embodiments of the application;

[0016] Figure 5 is a structural schematic diagram of another laser provided in the embodiments of the application;

[0017] Figure 6 is a structural schematic diagram of a frame provided in the embodiments of the application;

[0018] Figure 7 is a structural schematic diagram of another laser system provided in the embodiments of the application;

[0019] Figure 8 is a structural schematic diagram of another laser system provided in the embodiments of the application;

[0020] Figure 9 is a structural schematic diagram of another laser provided in the embodiments of the application;

[0021] Figure 10 is a structural schematic diagram of another laser provided in the embodiments of the application;

[0022] Figure 11 This is a schematic diagram of another laser provided in another embodiment of this application;

[0023] Figure 12 This is a schematic diagram of the structure of a laser system provided in another embodiment of this application;

[0024] Figure 13 This is a schematic diagram of a conductive structure provided in an embodiment of this application;

[0025] Figure 14 This is a schematic diagram of the structure of a base plate provided in an embodiment of this application;

[0026] Figure 15 This is a schematic diagram of another laser system provided in another embodiment of this application;

[0027] Figure 16 This is a schematic diagram of another laser system provided in another embodiment of this application;

[0028] Figure 17 This is a schematic diagram of the structure of a laser provided in another embodiment of this application. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0030] With the development of optoelectronic technology, lasers are being used more and more widely, and the requirements for the ease of laser fabrication and connection with other devices are also increasing. Lasers need to be connected to circuit boards to transmit current to the laser, exciting the light-emitting chip within the laser to emit laser light. Figure 1 This is a structural schematic diagram of a laser system provided by related technologies. For example... Figure 1 As shown, the laser system includes a laser 00 and a circuit board 01, with the laser 00 located on the circuit board 01. The laser 00 includes: a base plate 001, an encapsulation shell 002 fixed to the base plate 001, and a light-emitting chip 003 located within the encapsulation shell 002. The base plate is made of metal, and a circuit layer (not shown) connected to the circuit board 01 is provided between the base plate 001 and the encapsulation shell 002. Insulating layers (not shown) are also laid between the circuit layer and the base plate 001, and between the circuit layer and the encapsulation shell 002. A conductive structure (not shown) is embedded in the encapsulation shell 002, with its two ends connected to the light-emitting chip 003 and the circuit layer on the base plate 001, respectively. Current can then be transmitted to the light-emitting chip 003 through the circuit board 01 and the conductive structure, causing the light-emitting chip 003 to emit light.

[0031] The laser 00 needs to be provided with an insulating layer and a circuit layer on the bottom plate 001, and the setting process is relatively complex, the preparation process of the laser 00 is relatively complex, and the process of realizing the electrical connection between the laser 00 and the circuit board 01 is relatively complex. And the conductive structure in the laser 00 needs to be accurately connected with the corresponding position in the circuit layer first, and then the circuit layer is accurately connected with the circuit board 01, which further improves the implementation complexity of the electrical connection between the laser 00 and the circuit board 01. The insulating layer may be damaged or have poor laying quality at some places, which may cause the conductive structure to be in conduction with the bottom plate 001, or the short circuit between different conductive structures, and then the electrical connection effect between the laser 00 and the circuit board 01 is poor. Since the circuit layer is located inside the laser 00, if the electrical connection between the laser 00 and the circuit board 01 fails, the maintenance difficulty is high and the cost is high.

[0032] The following embodiments of the application provide a laser system, the preparation process of the laser in the laser system is relatively simple, the implementation complexity of the electrical connection between the laser and the circuit board is low, and the electrical connection effect between the laser and the circuit board is good.

[0033] Figure 2 FIG. 1 is a structural schematic diagram of a laser system provided by an embodiment of the application, Figure 3 FIG. 2 is a structural schematic diagram of another laser system provided by an embodiment of the application, Figure 3 may be Figure 2 the top view of the laser system shown in FIG. 1, Figure 2 may be Figure 3 the schematic diagram of the cross section a-a' of the laser system shown in FIG. 1. As Figure 2 and Figure 3 shown, the laser system includes a laser 10, a circuit board 20 and a soldering sheet 30, the laser 10 is located on the circuit board 20, and the laser 10 and the circuit board 20 can be electrically connected through the soldering sheet 30. The circuit board 20 is a printed circuit board (PCB).

[0034] The circuit board 20 has a plate-shaped structure, the plate-shaped structure has two opposite and relatively large plate surfaces, and a plurality of small side surfaces connecting the two plate surfaces, and the two plate surfaces can be parallel. The plate surface close to the laser 10 in the circuit board 20 has a solder pad H connected with a power supply, the solder pad H can be used as a positive electrode or a negative electrode, and is used for supplying power to the laser 10. Optionally, the solder pad H on the circuit board 20 can be located outside the coverage area of the laser 10. The coverage area can refer to the orthographic projection area of the laser 10 on the circuit board 20.

[0035] The laser 10 comprises a bottom plate 101, a frame 102 located on the bottom plate 101, a light emitting chip 103 located on the bottom plate 101 and surrounded by the frame 102, and a conductive structure 104 embedded in the frame 102 and connecting the inside and outside of the surrounding area of the frame 102.

[0036] The bottom plate 101 is substantially in a plate structure, and the frame 102 and the light emitting chip 103 are located on one plate surface of the bottom plate 101. The frame 102 is in a frame structure, and the frame structure has two opposite annular end surfaces at two ends in an axial direction (such as the z direction), and has an inner wall and an outer wall connecting the two end surfaces. One end surface of the frame 102 in the axial direction is fixed to the plate surface of the bottom plate 101, and the frame 102 and the bottom plate 101 enclose a groove, which is a containing space for containing the light emitting chip 103 and other components. The bottom plate 101 in the laser 10 is close to the circuit board 20, and the laser 10 is fixed to the circuit board 20 by the bottom plate 101.

[0037] One end of the conductive structure 104 is located in the surrounding area of the frame 102, and the other end is located outside the surrounding area of the frame 102, so as to connect the inside and outside of the surrounding area of the frame 102. For the convenience of description, the one end of the conductive structure 104 located in the surrounding area of the frame 102 is referred to as the first end, and the other end located outside the surrounding area of the frame 102 is referred to as the second end. The first end of the conductive structure 104 is electrically connected to the light emitting chip 103, such as the first end of the conductive structure 104 being electrically connected to the light emitting chip 103 through a wire X. The second end of the conductive structure 104 is electrically connected to the pad H through the soldering sheet 30, that is, one end of the soldering sheet 30 is connected to the second end of the conductive structure 104, and the other end of the soldering sheet 30 is connected to the pad H. In this way, the light emitting chip 103 and the pad H can be electrically connected through the conductive structure 104 and the soldering sheet 30, and then the current can be transmitted to the light emitting chip 103 to excite the light emitting chip 103 to emit laser.

[0038] In the laser system of the embodiment of the present application, the frame 102 in the laser 10 is located on the bottom plate 101, and the light emitting chip 103 is located on the bottom plate 101 and surrounded by the frame 102, which is equivalent to omitting the bottom of the packaging shell in the related art, so that the thickness of the laser 10 can be smaller, which is beneficial to the miniaturization of the laser 10. The light emitting chip 103 in the laser 10 can be directly connected to the circuit board 20 through the conductive structure 104 and the soldering sheet 30, and the bottom plate 101 does not need to be provided with an insulating layer and a circuit layer, so that the laser 10 is easy to prepare. When the laser 10 is electrically connected to the circuit board 20, the soldering sheet 30 only needs to be fixed between the conductive structure 104 of the laser 10 and the pad H in the circuit board 20, and the connection mode is simple. If the electrical connection between the laser 10 and the circuit board 20 has a problem, the soldering sheet 30 can be re-fixed for maintenance, which has low maintenance difficulty and low cost.

[0039] In summary, in the laser system provided by the embodiments of the present application, the frame is arranged on the bottom plate, and the conductive structure is embedded in the frame to communicate the inside and outside of the surrounding area of the frame. One end of the conductive structure located in the surrounding area of the frame is electrically connected with the light-emitting chip, and the other end located outside the surrounding area of the frame is electrically connected with the pad in the circuit board through the soldering sheet. Then, the current can be transmitted to the light-emitting chip through the circuit board and the soldering sheet. In this way, when the laser and the circuit board are fixed, only the soldering sheet needs to be arranged between the other end of the conductive structure located outside the surrounding area of the frame and the pad of the circuit board, and thus the electrical connection mode of the laser and the circuit board can be simplified.

[0040] In the embodiments of the present application, the number of the light-emitting chips 103 in the laser 10 can be one or multiple, Figure 2 and Figure 3 For example, the laser 10 includes 6 light-emitting chips 103 arranged in two rows and three columns, and the row direction is the x direction and the column direction is the y direction. The number and arrangement mode of the light-emitting chips 103 can be designed arbitrarily, which is not limited in the embodiments of the present application. The number of the conductive structures 104 is multiple, and different conductive structures 104 are spaced apart from each other. The number of the soldering sheets 30 is the same as that of the conductive structures 104, each conductive structure 104 corresponds to one soldering sheet 30, and each conductive structure 104 is electrically connected with one pad H on the circuit board 20 through the corresponding soldering sheet 30. The number of the pads H in the circuit board 20 is also the same as that of the conductive structures 104.

[0041] The number of the conductive structures 104 is related to the number and connection mode of the light-emitting chips 103. Each light-emitting chip 103 is electrically connected with two conductive structures 104, and the two conductive structures 104 are connected with the positive electrode and the negative electrode of the power supply through the soldering sheet 30 and the pad H respectively. For example, if the light-emitting chips 103 in each row are connected in series, and the two ends need to be connected with two conductive structures 104 respectively, then the number of the conductive structures 104 can be 2 times the number of the rows of the light-emitting chips 103, and each conductive structure 104 can be located on the two sides of the light-emitting chips 103 in the row direction. For example, Figure 3 As shown in the laser system, the laser 10 includes 4 conductive structures 104, the laser system includes 4 soldering sheets 30, the circuit board 20 has 4 pads H corresponding to the 4 conductive structures 104 respectively, and the 4 conductive structures 104 and the 4 pads H are connected through the 4 soldering sheets 30 respectively.

[0042] In the embodiments of the present application, one conductive structure 104 in the laser 10 and the corresponding soldering sheet 30 and pad H are mainly introduced, and the other conductive structures 104, soldering sheets 30 and pads H can be referred to the introduction, and the embodiments of the present application do not make too much repetition.

[0043] The frame 102 of the laser 10 can be surrounded by a plurality of side walls, for example, the frame 102 in the embodiment of the present application is rectangular and surrounded by four side walls. Each of the conductive structures 104 is embedded in one side wall of the frame 102, and in the embodiment of the present application, the plurality of conductive structures 104 of the laser 10 are embedded in two opposite side walls of the frame 102. The laser 10 in the embodiment of the present application can have various optional structures, and two optional structures of the laser 10 are introduced below.

[0044] In the first optional structure, Figure 4 is a structural schematic diagram of a laser provided in the embodiment of the present application, Figure 5 is a structural schematic diagram of another laser provided in the embodiment of the present application, Figure 5 may be Figure 4 the left view of the laser shown in the figure. Figure 4 and Figure 5 shown in the figure is Figure 2 and Figure 3 the laser 10 in the laser system shown in the figure. Figure 6 is a structural schematic diagram of a frame provided in the embodiment of the present application, and the frame can be Figure 4 and Figure 5 the frame 102 of the laser 10 shown in the figure. Please refer to Figure 2 to Figure 6 , the outer wall of the frame 102 is flat, the second end of the conductive structure 104 is located on the outer wall of the frame 102, and the end surface M2 of the second end of the conductive structure 104 can be flush with the outer wall of the frame 102. Alternatively, the second end of the conductive structure 104 can also protrude relative to the outer wall of the frame 102, which is not shown in the present application.

[0045] In the second optional structure, Figure 7 is a structural schematic diagram of another laser system provided in the embodiment of the present application, Figure 8 is a structural schematic diagram of still another laser system provided in the embodiment of the present application, Figure 8 may be Figure 7 the top view of the laser system shown in the figure, Figure 7 may be Figure 8 the schematic diagram of the cross section a-a' of the laser system shown in the figure. Figure 9 is a structural schematic diagram of still another laser provided in the embodiment of the present application, Figure 10 is a structural schematic diagram of yet another laser provided in the embodiment of the present application, Figure 10 may be Figure 9 the left view of the laser shown in the figure. Figure 9 and Figure 10 shown in the figure is Figure 7 and Figure 8 the laser 10 in the laser system shown in the figure. Figure 11is a structural schematic diagram of another frame body provided by an embodiment of the present application. The frame body can be Figure 9 and Figure 10 the frame body 102 of the laser 10 shown in

[0046] Please refer to Figure 7 to Figure 11 , the outer wall of the frame body 102 has a first boss T1 near one end of the bottom plate 101, and the part of the conductive structure 104 near the outside of the enclosed area of the frame body 102 is embedded in the first boss T1, and the second end of the conductive structure 104 is located on the first boss T1. For example, the first boss T1 is prismatic, the surface of the first boss T1 near the bottom plate 101 is called the bottom surface of the first boss T1, the surface opposite to the bottom surface is called the top surface of the first boss T1, and the other surfaces are called the side surfaces of the first boss T1. The second end of the conductive structure 104 can be located on the side surface of the first boss T1, such as the side surface of the first boss T1 away from the enclosed area of the frame body 102. Alternatively, Figure 12 is a structural schematic diagram of a laser system provided by another embodiment of the present application. As shown in Figure 12 , the second end of the conductive structure 104 can also be located on the top surface of the first boss T1.

[0047] The embodiments of the present application only take the example that the end surface M2 of the second end of the conductive structure 104 is flush with the surface in the first boss T1. As shown in Figure 7 , the end surface M2 of the second end of the conductive structure 104 is flush with the side surface of the first boss T1 away from the enclosed area of the frame body 102; as shown in Figure 12 , the end surface M2 of the second end of the conductive structure 104 is flush with the top surface of the first boss T1. Alternatively, the end surface M2 of the second end of the conductive structure 104 can also protrude relative to the surface in the first boss T1.

[0048] Please continue to refer to Figure 7 to Figure 12 , each conductive structure 104 in the laser 10 can correspond to a first boss T1 in the frame body 102, and the area of each first boss T1 can be slightly larger than the area of the end surface M2 of the second end of the corresponding conductive structure 104. The outer wall of the side wall in which the plurality of conductive structures 104 are embedded in the frame body 102 can have a plurality of mutually spaced first bosses T1 corresponding to the plurality of conductive structures 104; the part of each conductive structure 104 near the outside of the enclosed area of the frame body 102 is embedded in the corresponding first boss T1, and the second end of each conductive structure 104 is located on the corresponding first boss T1.

[0049] Optionally, the outer wall of the side wall in which the conductive structure 104 is embedded in the frame 102 can also have only one first protrusion T1 in the form of a strip, the length of the first protrusion T1 can be equal to the length of the side wall, and the first protrusion T1 can cover the entire area of the side wall near one end of the base plate 101. When a plurality of conductive structures 104 are embedded in the side wall, the portions of the plurality of conductive structures 104 that are outside the enclosed area of the frame 102 are embedded in the same first protrusion T1, the second ends of the plurality of conductive structures 104 are located on the first protrusion T1, and the second ends of the respective conductive structures 104 are spaced apart from each other.

[0050] In the second structure of the laser 10, the second end of the conductive structure 104 is far away from the base plate 101, so that the risk of solder overflow on the base plate 101 when welding the second end of the conductive structure 104 and the soldering pad 30 can be reduced, and the risk of mis-conduction between the conductive structure 104 and the base plate 101 can be reduced. Since the solder pad H on the circuit board 101 is located outside the coverage area of the laser 10, the distance between the solder pad H and the base plate 101 can also be far away, which can reduce the risk of solder overflow on the base plate 101 when welding the soldering pad 30 and the solder pad H, and reduce the risk of mis-conduction.

[0051] Please continue to refer to Figure 2 to Figure 12 , the inner wall of the frame 102 can have a second protrusion T2, for example, the inner wall of each side wall in which the conductive structure 104 is located can have a second protrusion T2. The second protrusion T2 can be located at one end of the inner wall of the frame 102 that is close to the base plate 101. The portion of the conductive structure 104 that is inside the enclosed area of the frame 102 is embedded in the second protrusion T2. The first end of the conductive structure 104 is located on the surface of the second protrusion T2 that is away from the base plate 101, so that it is convenient to arrange the wire X on the first end. For example, the end surface M1 of the first end of the conductive structure 104 can be flush with the surface of the second protrusion T2 that is away from the base plate 101, or it can also protrude relative to the surface of the second protrusion T2 that is away from the base plate 101.

[0052] As shown in Figure 2 to Figure 12 , the second protrusion T2 on each side wall in which the conductive structure 104 is embedded in the frame 102 can be in the form of a strip, the length of the second protrusion T2 can be equal to the length of the side wall, and the second protrusion T2 covers the entire area in the side wall near one end of the base plate 101. Figure 2 to Figure 6 The side wall in which the conductive structure 104 is embedded in the laser 10 of Figure 7 to Figure 12 The side wall in which the conductive structure 104 is embedded in the laser 10 can be substantially in the form of a T shape. Optionally, the side wall in which a plurality of conductive structures 104 are embedded can also have a plurality of second protrusions T2 that are spaced apart from each other, each conductive structure 104 is embedded in a corresponding second protrusion T2, and the first end of each conductive structure 104 is located on the corresponding second protrusion T2.

[0053] Figure 13 is a structural schematic diagram of a conductive structure provided by an embodiment of the present application. As shown in Figure 13 , the conductive structure 104 can include a first end 1041, a second end 1042, and an intermediate portion 1043 between the first end 1041 and the second end 1042. An end surface M1 of the first end 1041 is exposed to an enclosed area of the frame 102, for electrical connection with the light emitting chip 103. An end surface M2 of the second end 1043 is exposed outside the enclosed area of the frame 102, for electrical connection with the soldering pad 30. The sizes of the first end 1041 and the second end 1042 can be slightly larger than the size of the intermediate portion 1043, to facilitate connection with the light emitting chip 103 and the soldering pad 30.

[0054] In an embodiment of the present application, the material of the frame 102 can be an insulating material, such as ceramic. The material of the conductive structure 104 can include metal, such as tungsten. The frame 102 can be prepared by ceramic printing process, and the metal material (such as tungsten) can be pre-placed in the process of printing ceramic, so as to obtain an integrated frame 102 and conductive structure 104 after printing the ceramic structure. The thickness and number of layers of the metal material in the printing process can be designed according to the size of the current required to pass through the conductive structure 104. Alternatively, the independent conductive structure 104 can be prepared first, and then the ceramic printing is performed outside the conductive structure 104 to prepare the frame 102, so as to embed the conductive structure 104 in the frame 102 in the process of preparing the frame 102.

[0055] After the frame 102 and the conductive structure 104 are prepared, the frame 102 and the bottom plate 101 can be soldered and packaged. For example, the soldering material can be arranged between the end surface of the frame 102 and the bottom plate 101, and then the soldering material is melted to fix the frame 102 and the bottom plate 101. Alternatively, the soldering material can be a metal soldering material such as tin-silver-copper.

[0056] Figure 14 is a structural schematic diagram of a bottom plate provided by an embodiment of the present application. As shown in Figure 14 , the bottom plate 101 can have a first area D1 and a second area D2 surrounding the first area D1. The first area D1 is used for mounting the light emitting chip 103 and other components, and the second area D2 is used for fixing the frame 102. The first area D1 can be protruded relative to the second area D2, so that the strength of the first area D1 can be higher, which is beneficial to ensure that the flatness of the first area D1 is higher and the mounting effect of the light emitting chip 103 is better. Alternatively, the material of the bottom plate 101 in the laser 10 can include metal, such as copper, and the material of the bottom plate 101 can be oxygen-free copper.

[0057] The conductive structure 104 can be reserved a certain safety distance from the upper and lower ends of the frame 102 to avoid misdirecting the conductive structure 104 with the bottom plate 101 below and affecting the fixation of the frame 102 and other components above. For example, the side of the frame 102 away from the bottom plate 101 needs to be fixed with a component having a similar thermal expansion coefficient to that of the frame 102, while the thermal expansion coefficient of the conductive structure 104 is quite different from that of the frame 102, so that the conductive structure 104 is far away from the component fixed above the frame 102, which can avoid affecting the fixation effect of the component due to the conductive structure 104, thereby ensuring the preparation reliability of the laser 10.

[0058] For example, the minimum distance between the conductive structure 104 and the bottom plate 101 is greater than or equal to 0.5 mm, and / or the minimum distance between the conductive structure 104 and the surface of the frame 102 away from the bottom plate 101 is greater than or equal to 0.5 mm. The minimum distance between the conductive structure 104 and another component refers to the minimum value of the distance between each position in the conductive structure 104 and the component, and the distance between each position in the conductive structure 104 and the metal bottom plate 101 is greater than or equal to 0.5 mm, and the distance between each position and the surface of the frame 102 away from the metal bottom plate 101 is also greater than or equal to 0.5 mm. For example, Figure 2 and Figure 7 In the above, the minimum distance between the conductive structure 104 and the bottom plate 101 is the distance d1 in the direction perpendicular to the bottom plate 101 (such as the z direction), and d1 can also be referred to as the distance between the conductive structure 104 and the end surface of the frame 102 close to the bottom plate 101; the minimum distance between the conductive structure 104 and the surface of the frame 102 away from the bottom plate 101 is the distance d2 in the z direction, and d1 and d2 are both greater than or equal to 0.5 mm.

[0059] In the embodiment of the present application, the soldering piece 30 in the laser system can be a bent structure. The soldering piece 30 can have one bending part or multiple bending parts. The shape of the soldering piece 30 can also be designed accordingly based on the different conductive structures 104.

[0060] In an optional manner, for example, Figure 2 , Figure 3 , Figure 7 , Figure 8 and Figure 12As shown, the soldering piece 30 can have a bending part, and the soldering piece 30 can be substantially L-shaped, and the soldering piece 30 includes a first connecting part L1 and a second connecting part L2 which are connected to each other and are both plate-shaped. The plate surface of the first connecting part L1 can be perpendicular to the plate surface of the second connecting part L2, for example, the plate surface of the first connecting part L1 is parallel to the plate surface of the bottom plate 101, and the plate surface of the second connecting part L2 is perpendicular to the plate surface of the bottom plate 101. Alternatively, the included angle between the plate surface of the first connecting part L1 and the plate surface of the second connecting part L2 can also be an acute angle or an obtuse angle, which is not limited in the embodiments of the present application.

[0061] The first connecting part L1 is connected to the conductive structure 104, and the second connecting part L2 is connected to the soldering pad H. One end of the first connecting part L1 away from the second connecting part L2 is fixed to the second end of the conductive structure 104, and one end of the second connecting part L2 away from the first connecting part L1 is fixed to the soldering pad H. As shown in Figure 2 、 Figure 3 、 Figure 7 and Figure 8 As shown, the end surface of the first connecting part L1 away from the second connecting part L2 is connected and fixed to the end surface M2 of the second end of the conductive structure 104; as shown in Figure 12 , one end of the second connecting part L1 away from the second connecting part L2 and close to the surface of the bottom plate 101 is connected and fixed to the end surface M2 of the second end of the conductive structure 104.

[0062] As shown, the first connecting part L1 and the second end of the conductive structure 104 can be provided with conductive solder to realize fixation and electrical connection through the conductive solder; the second connecting part L2 and the soldering pad H can also be provided with conductive solder to realize fixation and electrical connection. When the solder is provided between the conductive structure 104 and the first connecting part L1, the solder can be provided from the side of the first connecting part L1 away from the bottom plate 101, so that the first connecting part L1 can block the solder to a certain extent, so as to avoid the solder overflowing to the bottom plate 101 and causing mis-conduction between the conductive structure 104 and the bottom plate 101.

[0063] In another optional manner, Figure 15 is a structure schematic diagram of another laser system provided by another embodiment of the present application. As shown in Figure 15 , on the basis of the laser shown in Figure 12 , the soldering piece 30 in the laser system can have two bending parts, and the soldering piece 30 can be substantially U-shaped.

[0064] In still another optional manner, Figure 16 is a structure schematic diagram of still another laser system provided by another embodiment of the present application. As shown in Figure 16 , the soldering piece 30 in the laser system can also be arc-shaped.

[0065] In the drawings of the embodiments of the present application, the area of the surface of the soldering sheet 30 fixed with the soldering pad H is equal to the area of the soldering pad H. Alternatively, the area of the surface of the soldering sheet 30 fixed with the soldering pad H can be greater than or less than the area of the soldering pad H, which is not limited in the embodiments of the present application.

[0066] Please continue to refer to Figure 2 to Figure 16 The laser 10 can further include a heat sink 105 and a reflecting prism 106. Each light emitting chip 103 corresponds to one heat sink 105 and one reflecting prism 107. The heat sink 105 is located on the bottom plate 101, and the light emitting chip 103 is located on the surface of the heat sink 105 away from the bottom plate 101. The heat sink 105 is used to assist the light emitting chip 103 in heat dissipation. The material of the heat sink 105 can include ceramic. The reflecting prism 106 is located on the light emitting side of the corresponding light emitting chip 103. The laser emitted by the light emitting chip 103 can be shot to the corresponding reflecting prism 106. The reflecting prism 106 can reflect the received laser in a direction away from the bottom plate 101, so that the laser is shot out of the accommodating space surrounded by the bottom plate 101 and the frame 102.

[0067] Figure 17 is a structural schematic diagram of a laser provided by another embodiment of the present application. As Figure 17 indicated, based on the laser 10 shown in Figure 2 , the laser 10 can further include a light-transmitting sealing component 107. The light-transmitting sealing component 107 can be in a plate shape. The light-transmitting sealing component 107 is located on the side of the frame 102 away from the bottom plate 101, and is used to seal the accommodating space surrounded by the frame 102 and the bottom plate 101, so as to avoid damage of external water, oxygen and other pollutants to the light emitting chip 103. The edge region of the surface of the light-transmitting sealing component 107 close to the bottom plate 101 is fixed with the surface of the frame 102 away from the bottom plate 101. For example, the edge region of the light-transmitting sealing component 107 can be pre-provided with solder. The light-transmitting sealing component 107 can be placed on the side of the frame 102 away from the bottom plate 101, and the solder is in contact with the surface of the frame 102 away from the bottom plate 101. Then, the frame 102 and the light-transmitting sealing component 107 are placed in a high-temperature furnace, so that the solder is melted and the frame 102 and the light-transmitting sealing component 107 are welded.

[0068] Please continue to refer to Figure 17 , the laser 10 can further include a collimating lens group 108 located on the side of the light-transmitting sealing component 107 away from the bottom plate 101. The collimating lens group 108 can include a plurality of collimating lenses corresponding to the light emitting chips 103 one by one. The laser emitted by each light emitting chip 103 can be shot to the corresponding collimating lens after being reflected by the corresponding reflecting prism 106. The collimating lens can collimate the received laser and then shoot it out, so that the laser is close to parallel light.

[0069] In summary, in the laser system provided by the embodiments of the present application, the frame is arranged on the bottom plate, and the conductive structure is embedded in the frame to communicate the inside and outside of the surrounding area of the frame. One end of the conductive structure in the surrounding area of the frame is electrically connected with the light-emitting chip, and the other end of the conductive structure outside the surrounding area of the frame is electrically connected with the pad on the circuit board through the soldering sheet, so that the current can be transmitted to the light-emitting chip through the circuit board and the soldering sheet. In this way, when the laser and the circuit board are fixed, only the soldering sheet needs to be arranged between the other end of the conductive structure outside the surrounding area of the frame and the pad of the circuit board, and the electrical connection mode of the laser and the circuit board can be simplified.

[0070] The laser system in the embodiments of the present application can be applied to laser projection as a light source in a projection device. In addition to the laser system, the projection light source can also include other optical components, such as a light homogenizing component, a shaping component, and a converging lens, etc. The light homogenizing component is used to homogenize the laser emitted by the laser system, the shaping component can shape the laser spot into a shape required by the projection picture, and the converging lens can converge the laser into subsequent components. For example, the light homogenizing component can be a light guide pipe.

[0071] The embodiments of the present application also provide a projection device, which can include the light source assembly described above, and can also include a light valve and a lens. The laser emitted by the light source assembly can be incident on the light valve, and then be modulated by the light valve and incident on the lens, and then the lens can project the received laser to form a projection picture. Since the quality of the laser emitted by the projection light source is good, the display effect of the projection picture formed based on the laser can also be good, and the display effect of the projection device can be improved.

[0072] In the present application, the terms "at least one of A and B" and "A and / or B" are merely used to describe the association relationship of the associated objects, and indicate that there can be three relationships, i.e., A exists alone, A and B exist simultaneously, and B exists alone. The term "at least one of A, B and C" indicates that there can be seven relationships, i.e., A exists alone, B exists alone, C exists alone, A and B exist simultaneously, A and C exist simultaneously, C and B exist simultaneously, and A, B and C exist simultaneously. In the embodiments of the present application, the terms "first" and "second" are used for description purposes only, and cannot be understood as indicating or implying relative importance. The term "at least one" refers to one or more, and the term "multiple" refers to two or more, unless otherwise explicitly limited.

[0073] Throughout the specification and claims, the following terms have the meanings indicated: "comprising" and "including" and conjugations of these terms are used to mean "including but not limited to"; "consisting essentially of" means including the components specified but also including an amount of inert substances as can be required or helpful in order to carry out the function of the compositions or methods; "consisting of" means including the components specified and nothing more. "Approximately" means within an acceptable error range for the quantity measured taking into account physical measurements experiment error, human errors, measurement precision, etc. Certain terminology can also be used in the specification and claims in order to refer to a particular component under discussion. Such terminology includes the words "comprising," "consisting of," "consisting essentially of," and the like. It is to be understood that the use of such terminology is intended to cover the component referred to plus any additional components that can not necessarily be specifically described herein.

[0074] The above description is intended to be illustrative and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the application should, therefore, be determined not with reference to the above description, but instead with reference to the appended claims, along with their full scope of equivalents.

Claims

1. A laser system, characterized by, The laser system comprises a laser, a circuit board and a soldering piece; The laser comprises a bottom plate, a frame on the bottom plate, a light emitting chip on the bottom plate and surrounded by the frame, and a conductive structure embedded in the frame and communicating inside and outside of the surrounded area of the frame; one end of the conductive structure inside the surrounded area of the frame is electrically connected with the light emitting chip; The circuit board has a soldering pad connected with a power supply, the laser is located on the circuit board, and the bottom plate is close to the circuit board; one end of the conductive structure outside the surrounded area of the frame is electrically connected with the soldering pad through the soldering piece; The frame has two opposite annular end faces at two ends thereof, and has an inner wall and an outer wall connecting the two end faces; The outer wall of the frame is flat, and one end of the conductive structure outside the surrounded area of the frame is located on the outer wall; Alternatively, one end of the outer wall of the frame close to the bottom plate has a first boss, part of the conductive structure is embedded in the first boss, and one end of the conductive structure outside the surrounded area of the frame is located on the first boss; one end of the conductive structure outside the surrounded area of the frame is flush with the surface of the first boss away from the surrounded area of the frame, or flush with the surface of the first boss away from the bottom plate.

2. The laser system of claim 1, wherein, The soldering piece is L-shaped, and the soldering piece comprises a first connecting part and a second connecting part which are connected with each other and are both plate-shaped; One end of the first connecting part away from the second connecting part is fixed with the conductive structure, and one end of the second connecting part away from the first connecting part is fixed with the soldering pad.

3. The laser system of claim 2, wherein, The soldering piece is arc-shaped or U-shaped.

4. The laser system of any of claims 1 to 3, wherein, The laser comprises a plurality of conductive structures, the outer wall has a plurality of first bosses corresponding to the plurality of conductive structures, and one end of each conductive structure outside the surrounded area of the frame is located on the corresponding first boss.

5. The laser system of any of claims 1 to 3, wherein, The inner wall of the frame has a second boss, and part of the conductive structure is embedded in the second boss; One end of the conductive structure inside the surrounded area of the frame is located on the surface of the second boss away from the bottom plate.

6. The laser system of any of claims 1 to 3, wherein, The minimum distance between the conductive structure and the bottom plate is greater than or equal to 0.5 mm, and / or the minimum distance between the conductive structure and the surface of the frame away from the bottom plate is greater than or equal to 0.5 mm.

7. The laser system of any of claims 1 to 3, wherein, The laser satisfies at least one of the following conditions: The material of the bottom plate comprises metal; The material of the frame comprises ceramic; And the material of the conductive structure comprises tungsten.

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