A hybrid integrated circuit interconnect structure and method of hybrid integrated circuit interconnection

Abstract

The application belongs to the technical field of hybrid integrated circuit electronic surface mounting, and particularly relates to a hybrid integrated circuit interconnection structure and a hybrid integrated circuit interconnection method. The hybrid integrated circuit interconnection structure comprises a structure body, a boss arranged above the structure body and forming a stepped structure with the structure body, and through holes penetrating through the structure body and the boss. The sidewall of the stepped structure is a rounded structure. The hybrid integrated circuit interconnection structure and the hybrid integrated circuit interconnection method can solve the problems in the prior art, improve the efficiency of structure preparation, reduce the material rejection rate of structure mounting, realize automatic mounting of the structure, and meet the demand of automatic production of hybrid integrated circuit products.

Description

Technical Field

[0001] This invention relates to the field of hybrid integrated circuit electronic surface assembly technology, and more specifically to a hybrid integrated circuit interconnect structure and a hybrid integrated circuit interconnect method. Background Technology

[0002] With the advent of the digital economy era, the integrated circuit industry has become a crucial component of the next generation of information technology within strategic emerging industries, driving rapid global GDP growth. Integrated circuits are miniature structures that perform specific circuit or system functions using specific fabrication processes. In the trend towards thinner and lighter consumer electronics, to meet market demands, consumer electronics products place higher requirements on device power management systems. Integrating multiple functions into a single power management chip can effectively reduce the number of external components, improve processing efficiency, and enhance system reliability. Hybrid integrated circuit products are also the preferred packaging choice for high-end applications in aerospace, electronics, and weaponry. Hybrid integrated circuit products are rapidly developing towards higher integration, higher efficiency, and lower power consumption. To achieve miniaturization of the internal structure and high efficiency with low power consumption, the internal components of hybrid integrated circuit products need to be thinner and lighter, with superior electrical performance and more reliable product quality.

[0003] Currently, common lead electrical interconnection methods used in hybrid integrated circuit assembly include structural component soldering and wire bonding. The quality of the electrical interconnection at the leads directly determines the electrical performance of the hybrid integrated circuit product, which often needs to withstand high voltage, high power, and high current. Structural component soldering has become a commonly used soldering method, not only because of its high process reliability, but also because it can reduce the impedance at the connection, improve the current carrying capacity, and significantly improve the electrical performance of the product.

[0004] Currently, with the industrialization of intelligent manufacturing processes and digital workshops, hybrid integrated circuit products not only need to possess excellent product characteristics but also need to be feasible for intelligent manufacturing to ensure that product supply can meet market demand. Therefore, the feasibility of automated production is a crucial factor in the design and manufacturing process of hybrid integrated circuit products. A large number of hybrid integrated circuit products require the mounting of structural components, and structural component mounting has become an indispensable automated assembly step in the assembly process. Currently, problems such as low efficiency in structural component preparation and high rejection rates during structural component mounting have made automated structural component mounting a major capacity bottleneck in the soldering process, failing to meet the requirements of automated production of hybrid integrated circuit products. Summary of the Invention

[0005] The purpose of this invention is to provide a hybrid integrated circuit interconnect structure and a hybrid integrated circuit interconnect method. This hybrid integrated circuit interconnect structure and method can overcome the shortcomings of the prior art, improve the material preparation efficiency of the structure, reduce the material rejection rate of the structure, realize the automatic placement of the structure, and meet the needs of automated production of hybrid integrated circuit products.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] In a first aspect of the invention, a hybrid integrated circuit interconnect structure is disclosed.

[0008] The structural component includes:

[0009] Structural main body;

[0010] A boss is provided above the main body of the structural component and forms a stepped structure with the main body of the structural component;

[0011] The main body of the structural component and the boss are provided with through holes that pass through each other;

[0012] The sidewall at the step formed by the main body of the structural component and the boss has a rounded corner structure.

[0013] Furthermore, the main body of the structural component includes a first structural component main body and a second structural component main body connected in sequence;

[0014] The boss includes a first boss portion and a second boss portion connected in sequence.

[0015] The first boss portion is disposed above the main body portion of the first structural member;

[0016] The second boss portion is disposed above the main body portion of the second structural member;

[0017] The first structural component body, the second structural component body, the first boss, and the second boss are integrally formed.

[0018] Furthermore, the second structural member body and the second boss are two coaxial and stacked semicircular rings, and the two semicircular rings form a semicircular ring structure.

[0019] The inner and outer diameters of the main body of the second structural member and the second boss are the same.

[0020] Furthermore, the stepped structure is formed by the first boss portion and the first structural member body portion stacked from top to bottom;

[0021] The rounded corner structure is the sidewall of the stepped structure;

[0022] The connection between the sidewall of the stepped structure and the semi-circular structure is an inwardly recessed rounded corner.

[0023] Furthermore, the bottom of the main body of the structural component is a plane;

[0024] The thickness of the main body of the structural component is 0.1 mm;

[0025] The thickness of the boss is 0.2 mm.

[0026] Furthermore, both the main body of the structural component and the boss include a first structural layer and a second structural layer that wraps around the outside of the first structural layer.

[0027] Furthermore, the first structural layer is made of pure copper;

[0028] The pure copper used is oxygen-free copper with a copper content of 99.7% to 99.95%.

[0029] Furthermore, the second structural layer is made of pure gold;

[0030] The second structural layer is deposited on the surface of the second structural layer using an electroplating process;

[0031] The thickness of the second structural layer is no greater than 0.1 μm.

[0032] Furthermore, the structural component is manufactured using an etching process.

[0033] In a second aspect of the invention, a hybrid integrated circuit interconnection method is disclosed.

[0034] The hybrid integrated circuit interconnection method includes:

[0035] (1) Structural component preparation

[0036] A mounting fixture is used to separate the structural components on a sheet structure containing multiple structural components, and each structural component is adsorbed onto the mounting fixture.

[0037] (2) Mounting of structural components on circuit boards

[0038] Apply a certain amount of solder paste to the outer periphery of each pin hole on the circuit board. Use a mounting fixture to move each component to the corresponding pin hole. Solder the components to the corresponding pin holes using the solder paste applied to the outer periphery of the pin holes. After the components are mounted, remove the mounting fixture.

[0039] (3) Electrical interconnection between the circuit board and the metal package

[0040] The circuit board with the mounting structure is placed on top of the metal package housing with pins, so that the structure fits onto the corresponding pins through the perforations on the structure; solder paste is applied to the surface of the structure, and the structure and pins are soldered with the solder paste, so that the circuit board is electrically interconnected with the metal package housing through the structure and pins, thereby realizing the electrical interconnection between the circuit board and the metal package housing.

[0041] Compared with the prior art, the advantages of the present invention are:

[0042] (1) This invention solves the problem of poor electrical connection performance and reliability of metal packaged products in hybrid integrated circuit products that cannot meet military assessment by using a novel ring-shaped irregular device through automated mounting. It not only improves the production efficiency of intelligent manufacturing of products in this field, but also improves the electrical characteristics of such products and the reliability of such connection structures.

[0043] (2) Based on experience gained from over 400 hybrid integrated circuit products, this invention adopts suitable structural components according to the internal structural characteristics of hybrid integrated circuit products. Oxygen-free copper is etched into structural components, and gold is plated on the structural components to prevent copper layer oxidation and improve device reliability. A compatible automated mounting fixture is also designed. This structural component is well soldered to solder, housing leads, and pads, and is suitable for the field of electronic surface mount technology. It effectively solves the problems of low reliability, poor electrical performance, and low production efficiency of the electrical interconnection between the substrate and housing leads of hybrid integrated circuit products.

[0044] (3) The structural components described in this invention have uniform stress distribution, long-term reliability, and have passed the relevant standards of the National Military Standard GJB548B and GJB2438. They can be applied not only to civilian products, but also to high-end fields such as aerospace, aviation and weaponry, and have high market returns.

[0045] (4) The structural components described in this invention are made of pure copper electroplated with gold, which has a high thermal conductivity and excellent electrical properties such as high voltage and high current resistance. This improves the electrical performance of hybrid integrated circuit products and can adapt to the trend of high power and miniaturization of hybrid integrated circuits, thus meeting market demands.

[0046] (5) The structural components described in this invention are processed by etching, which has the characteristics of high precision and meets the requirements of high precision and high density product assembly.

[0047] (6) To enable the application of the structural components described in this invention in the field of intelligent manufacturing, this invention employs a mounting fixture to separate the individual structural components from a sheet structure containing multiple structural components. The mounting fixture then places each structural component at its corresponding pin hole on the circuit board, achieving electrical interconnection between the circuit board and the metal package. This process reduces manual operation during assembly, avoids device damage, meets current trends in intelligent and digital manufacturing, and allows for large-scale automated applications, possessing the characteristics of independent and controllable industrialization. By designing the structure of the structural components and combining it with the use of mounting fixtures, automated separation and automated mounting of the structural components are achieved, solving the problem of mass production application of devices in the intelligent manufacturing process. Attached Figure Description

[0048] Figure 1 This is a three-dimensional structural diagram of the structural component in this invention;

[0049] Figure 2 This is a top view of the structural component in this invention;

[0050] Figure 3 This is a simulation result diagram of the stress of the structural component in this invention;

[0051] Figure 4 This is a schematic diagram of the assembly structure of the structural components, circuit board, and metal packaging shell in this invention;

[0052] Figure 5 This is a structural diagram of the lower mold in the mounting fixture;

[0053] Figure 6 This is a top view of the upper mold in the mounting fixture;

[0054] Figure 7 This is a side view of the upper mold in the mounting fixture.

[0055] in:

[0056] 1. Main body of structural component; 2. Boss; 3. Through hole; 4. Inwardly recessed rounded corner; 5. Semi-circular ring structure; 6. Rounded corner structure; 7. Structural component; 8. Pin; 9. Circuit board; 10. Lower mold; 11. Metal encapsulation shell; 110. Upper plate of lower mold; 120. Limiting part; 130. Pin; 140. Bevel angle one; 20. Upper mold; 201. Upper plate of upper mold; 202. Lower plate of upper mold; 210. Protrusion; 220. Limiting groove; 230. Through hole; 240. Bevel angle two. Detailed Implementation

[0057] The present invention will be further described below with reference to the accompanying drawings:

[0058] In current hybrid integrated circuit products, electrical interconnect micro-assembly technology remains a key focus. As the integration density of these products increases, achieving high-performance electrical interconnects within limited space and improving the electrical performance of pin interconnects in metal-packaged hybrid integrated circuits remains a persistent technical challenge and bottleneck. This is especially true in aerospace, missile-borne, and other fields with high reliability requirements, necessitating not only high-performance electrical interconnects but also high reliability to meet military performance requirements.

[0059] To address these issues and avoid reliability risks associated with overly complex structures, it is necessary to design a structural component that not only achieves high-performance and high-reliability electrical interconnection, but also ensures a sufficiently simple structure for easy mass assembly and eliminates reliability risks such as stress concentration points.

[0060] like Figure 1 and Figure 2 The diagram illustrates a hybrid integrated circuit interconnect structure, which includes:

[0061] Structural component body 1;

[0062] The boss 2 is located above the main body 1 of the structural component and forms a stepped structure with the main body 1 of the structural component.

[0063] The stepped structure formed by the height difference between the main body of the structural component and the boss is to ensure that the equipment nozzle can accurately pick up the structural component and complete the automatic mounting during the intelligent manufacturing process. This ensures that the structural component is mass-producible in the subsequent production and assembly process, and is the most important link in realizing the automated assembly of the structural component.

[0064] The structural component body 1 and the boss 2 are provided with through holes 3. The structural component body 1 and the boss 2 are integrally formed, and a through hole, namely the through hole 3, is provided at the same end of both.

[0065] The sidewall at the step formed by the main body 1 of the structural component and the boss 2 is a rounded corner structure 6.

[0066] In this invention, the perforation is a structural feature specifically designed for pin assembly, tailored to the characteristics of metal-packaged products. It fits snugly within the pins, ensuring the component's positioning during soldering and enabling soldering of each pin requiring electrical interconnection. This design offers high compatibility and flexibility. The perforation is a circular hole structure, customizable to accommodate various metal housing pin sizes, meeting diverse metal housing requirements. The boss ensures accurate pick-up and automatic placement of the component during intelligent manufacturing, guaranteeing mass production feasibility and serving as a crucial element for automated assembly. To address the high-density assembly characteristics of current hybrid integrated circuits, the rounded corner design allows for real-time adjustments based on the internal component positions (resistors, capacitors, etc.). The rounded corners resolve localized stress issues and avoid assembly interference problems caused by sharp corners. This combination of three structures enables the component to achieve high-efficiency electrical connections with maximum usable area, meeting military standards and meeting high-reliability requirements in aerospace, missile, and other fields.

[0067] Furthermore, the main body 1 of the structural component includes a first main body portion and a second main body portion connected in sequence;

[0068] The boss 2 includes a first boss portion and a second boss portion connected in sequence.

[0069] The first boss portion is disposed above the main body portion of the first structural member;

[0070] The second boss portion is disposed above the main body portion of the second structural member;

[0071] The first structural component body, the second structural component body, the first boss, and the second boss are integrally formed.

[0072] Furthermore, the second structural component body and the second boss are two coaxial and stacked semi-circular rings, and the two semi-circular rings form a semi-circular ring structure 5.

[0073] The inner and outer diameters of the main body of the second structural member and the second boss are the same.

[0074] Furthermore, the stepped structure is formed by the first boss portion and the first structural member body portion stacked from top to bottom;

[0075] The rounded corner structure 6 is the sidewall of the stepped structure;

[0076] The connection between the sidewall of the stepped structure and the semi-circular annular structure is an inwardly recessed rounded corner 4. By setting the inwardly recessed rounded corner, the contact area can be increased, making the head of the structural component, i.e. Figure 1 The left half of the structure is designed to be as large as possible to improve electrical performance.

[0077] Furthermore, the bottom of the main body 1 of the structural component is flat. The reason for designing the bottom of the main body of the structural component as a flat surface is mainly to maximize the electrical interconnection area between the casing pins and the hybrid integrated circuit substrate by using the structural component as a carrier, thereby achieving high-efficiency electrical interconnection. The flat structure also significantly improves assembly reliability, ensuring that the structural component can achieve highly reliable inter-plane connections through soldering processes. This maximizes the electrical connection area and facilitates assembly.

[0078] Furthermore, the thickness of the main body 1 of the structural component is 0.1 mm; the thickness of the boss 2 is 0.2 mm. This design achieves the requirements of lightweighting and reliability while reducing costs.

[0079] Furthermore, both the main body 1 and the boss 2 include a first structural layer and a second structural layer that wraps around the outside of the first structural layer.

[0080] Specifically, the first structural layer is made of pure copper; the pure copper is oxygen-free copper with a copper content of 99.7% to 99.95%. Because copper metal not only has excellent electrical conductivity and heat dissipation performance, but also has a low cost, this invention significantly improves the cost-effectiveness of the structural components while ensuring improved electrical performance. Furthermore, the higher the copper content, the higher the electrical conductivity and the better the heat dissipation performance. This invention uses oxygen-free copper with a copper content as high as 99.7% to 99.95%.

[0081] The second structural layer is made of pure gold; the second structural layer is plated onto the surface of the second structural layer using an electroplating process. Although copper has excellent electrical conductivity and heat dissipation performance, it is prone to oxidation, which greatly affects the welding process. Therefore, this invention uses pure gold on the surface of pure copper. Pure gold not only prevents copper oxidation but also has good weldability, ensuring high reliability of the welded structural components. To avoid the gold brittleness effect common in the aerospace field, this invention requires reasonable control of the pure gold plating layer to below 0.1 μm through the electroplating process to ensure the long-term reliability of the welded IMC layer.

[0082] The thickness of the second structural layer is no greater than 0.1 μm. To avoid the gold brittleness effect commonly seen in the aerospace field, this invention requires the pure gold plating layer to be reasonably controlled to below 0.1 μm through electroplating process to ensure the long-term reliability of the welded IMC layer.

[0083] Furthermore, this structural component is manufactured using an etching process. To avoid the gold brittleness effect commonly seen in the aerospace field, this invention requires precise control of the pure gold plating layer to below 0.1µm through electroplating, achieving high-precision plating control and ensuring the long-term reliability of the welded IMC layer.

[0084] Figure 3 The figure shows the stress simulation results of the structural component in this invention. As can be seen from the figure, the structural component is subjected to uniform stress, there are no local stress concentration points, and the long-term reliability is high. It will not cause problems such as local stress failure that lead to product connection failure, thereby ensuring the reliability of the electrical interconnection between the circuit board and the metal package shell.

[0085] The present invention also includes a hybrid integrated circuit interconnection method, the method comprising:

[0086] (1) Structural component preparation

[0087] A mounting fixture is used to separate the structural components on a sheet structure containing multiple structural parts, and each structural component is then adsorbed onto the mounting fixture. The structural components are the aforementioned hybrid integrated circuit interconnect structural components. The mounting fixture with the adsorbed structural components is placed in intelligent manufacturing equipment for mounting. During the interconnection process of the hybrid integrated circuit, the structural components are prepared first to prepare for automated mounting, meeting the requirements of the intelligent manufacturing equipment to pick up the structural components and enabling large-scale application of the structural components.

[0088] (2) Mounting of structural components on circuit boards

[0089] A certain amount of solder paste is applied to the outer periphery of each pin hole on the circuit board 9. The solder paste is used to mount the structural components, ensuring that the structural components can be fitted onto the pins, preventing excessive displacement of the structural components during the soldering process, and ensuring a good electrical connection between the structural components and the corresponding pins. Each structural component 7 is moved to the corresponding pin hole in a set direction using a mounting fixture. The solder paste applied to the outer periphery of the pin hole allows each structural component to be soldered to the corresponding pin hole. After the structural component 7 is mounted, the mounting fixture is removed. The mounting fixture uses bosses to hold the structural components in place, ensuring the stability of the mounting fixture in holding the structural components. Since the bottom of the main body of the structural component is flat, the solder paste applied in step (1) can completely hold the structural component, serving a positioning function.

[0090] (3) Electrical interconnection between the circuit board and the metal package

[0091] The circuit board 9 with the structural component 7 mounted on it is placed above the metal package housing 11 with pins 8, so that the structural component 7 is fitted onto the corresponding pins 8 through the through holes 3 on the structural component 7; solder paste is applied to the surface of the structural component 7, and the structural component 7 and pins 8 are soldered together with the solder paste, so that the circuit board 9 is electrically connected to the metal package housing 11 through the structural component 7 and pins 8, thereby achieving the following: Figure 4 The circuit board 9 shown is electrically interconnected with the metal package housing 11.

[0092] The mounting fixtures used in the aforementioned hybrid integrated circuit interconnection method, such as... Figures 5-7 As shown. This mounting fixture includes a lower mold with a horizontally arranged upper plate on its upper surface. Multiple pins perpendicular to the upper plate are arranged in a series on the upper plate. An upper mold has an upper surface composed of multiple protrusions arranged in a series. A cross-shaped locating groove is formed between four adjacent protrusions to limit the position of the structural component. A through hole penetrating the thickness of the upper mold is opened at a predetermined position at the bottom of the locating groove. The positions of the through holes are adapted to the vertical positions of the pins. This mounting fixture, using upper and lower molds in conjunction with pins and locating grooves, can simultaneously confine multiple structural components within the locating groove, facilitating subsequent placement operations and effectively improving production efficiency. It can also be applied to the automatic placement of structural components in various automatic placement machines.

[0093] Upper mold 20 and lower mold 10 are used to limit the position of the structural component and to facilitate its application in the next process. Both the lower mold 10 and the upper mold 20 are rectangular plate structures with the same outer contour. Both have beveled angles cut vertically at their corners, namely bevel angle one 14° and bevel angle two 24°. The use of beveled angles ensures that the molds will not be misaligned during use.

[0094] The upper surface of the lower mold 10 has a horizontally arranged upper plate 110. Multiple pins 130, perpendicular to the upper plate 110, are arranged in a series on the upper plate 110. These pins 130 are typically metal pins with a cylindrical structure. A limiting part 120, fixed to the upper plate 110, is formed at the bottom of each pin 130. Generally, the limiting part 120 is used to match the bottom structure of the upper mold 20. The fit between the protruding limiting part 120 and the groove at the bottom of the upper mold 20 ensures the structural stability of the upper mold 20 and lower mold 10 after fitting. The groove structure at the bottom of the upper mold 20 is not illustrated here; its usage can be understood by those skilled in the art through textual description. Furthermore, to facilitate the production and processing of the lower mold 10 and the assembly of the pins 130, the multiple pins 130 are arranged in a rectangular array.

[0095] The upper end face of the upper mold 20 is composed of a plurality of protrusions 210 arranged in a sequential array. A cross-shaped limiting groove 220 is formed between four adjacent protrusions 210 to limit the position of the structural component. A through hole 230 penetrating the thickness of the upper mold 20 is provided at a preset position at the bottom of the limiting groove 220. The positions of the plurality of through holes 230 are adapted to the vertical position of the pin 130.

[0096] The protrusion 210 formed by the upper mold 20 is to construct a cross-shaped limiting groove 220. Each limiting groove 220 independently limits a structural component, and all the limiting grooves 220 are connected sequentially. It is important to note that in practice, the lower plate surface 202 of the upper mold is adapted to the upper plate surface 110 of the lower mold; both are planar structures. In use, the pins 130 of the lower mold 10 are first passed through the through hole 230. At this time, the upper plate surface 110 of the lower mold and the lower plate surface 202 of the upper mold are tightly fitted together, with the top of the pins 130 higher than the upper end face of the protrusion 210. Then, the structural components are sequentially fitted onto the pins 130. The location of the through hole 230 and the size and structure of the limiting groove 220 are adapted to the aforementioned structure. The structural components (with holes adapted to the diameter of pins 130) are gradually lowered into the limiting grooves 220 by shaking the upper mold 20 and the lower mold 10 under the influence of gravity. Since the limiting grooves 220 are blocked on all four sides by protrusions 210, the structural components are stably confined within them. After all the structural components have fallen into the limiting grooves 220, the lower mold 10 moves vertically downwards relative to the upper mold 20 to disengage the pins 130 from the upper mold 20, thus allowing the structural components to be independently positioned within the limiting grooves 220. It should be noted that the upper mold 20 is adapted to the pick-and-place machine in the next process. By clamping and moving the upper mold 20 to the next process, the pick-and-place machine can perform further operations on each structural component.

[0097] During the assembly of hybrid integrated circuit products, in order to achieve electrical interconnection between the circuit board and the pins on the metal package shell by soldering structural components, the structural components need to be fitted into the pins 130 in the mounting fixture through through-holes 3. During placement, the lower mold 10 is first engaged with the equally spaced pins 130 in the lower mold 10 through equally spaced through-holes 230 on its upper surface. At this time, the structural component 7 is fitted onto the equally spaced pins 130. After the boss 2 on the structural component 7 is fully inserted into the equally spaced limiting grooves 220 on the upper surface of the lower mold 10 and parallel to the plane of the limiting grooves 220 in the lower mold 10, the previously engaged upper mold 20 is disengaged from the lower mold 10, and each structural component 7 is respectively located in the equally spaced limiting grooves 220 on the upper surface of the lower mold 10. At this point, the lower mold 10 is placed in automated / intelligent manufacturing equipment (generally an automatic placement machine or automatic mounting machine). The equipment automatically picks up the protrusions 2 on the surface of the structural component 7, completing the picking operation of the structural component 7 from the equally spaced limiting grooves 220 on the upper surface of the lower mold 10. The structural component 7 is then placed onto the pins of the metal package shell through the perforation, completing the placement application of the structural component 7 in the hybrid integrated circuit product. To ensure that the device orientation is correct, the bevel angle 140 in the lower mold 10 is matched with the bevel angle 240 in the upper mold 20 to avoid orientation abnormalities.

[0098] The above-described embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A hybrid integrated circuit interconnect structure, characterized in that, This structural component includes: Structural main body; A boss is provided above the main body of the structural component and forms a stepped structure with the main body of the structural component; The main body of the structural component and the boss are provided with through holes that pass through each other; The sidewall at the step formed by the main body of the structural component and the boss has a rounded corner structure.

2. The structural component according to claim 1, characterized in that, The main body of the structural component includes a first structural component main body and a second structural component main body connected in sequence. The boss includes a first boss portion and a second boss portion connected in sequence. The first boss portion is disposed above the main body portion of the first structural member; The second boss portion is disposed above the main body portion of the second structural member; The first structural component body, the second structural component body, the first boss, and the second boss are integrally formed.

3. The structural component according to claim 2, characterized in that, The second structural component body and the second boss are two coaxial and stacked semi-circular rings, and the two semi-circular rings form a semi-circular ring structure. The inner and outer diameters of the main body of the second structural member and the second boss are the same.

4. The structural component according to claim 3, characterized in that, The stepped structure is formed by the first boss portion and the first structural member body portion stacked from top to bottom; The rounded corner structure is the sidewall of the stepped structure; The connection between the sidewall of the stepped structure and the semi-circular structure is an inwardly recessed rounded corner.

5. The structural component according to claim 1, characterized in that, The bottom of the main body of the structural component is flat; The thickness of the main body of the structural component is 0.1 mm; The thickness of the boss is 0.2 mm.

6. The structural component according to claim 1, characterized in that, Both the main body of the structural component and the boss include a first structural layer and a second structural layer that wraps around the outside of the first structural layer.

7. The structural component according to claim 6, characterized in that, The first structural layer is made of pure copper; The pure copper used is oxygen-free copper with a copper content of 99.7% to 99.95%.

8. The structural component according to claim 6, characterized in that, The second structural layer is made of pure gold; The second structural layer is deposited on the surface of the second structural layer using an electroplating process; The thickness of the second structural layer is no greater than 0.1 μm.

9. The structural component according to claim 1, characterized in that, This structural component is manufactured using an etching process.

10. A hybrid integrated circuit interconnection method, characterized in that, The method includes: (1) Structural component preparation A mounting fixture is used to separate the structural components on a sheet structure containing multiple structural components, and each structural component is adsorbed onto the mounting fixture; the structural components are as described in any one of claims 1 to 9; (2) Mounting of structural components on circuit boards Apply a certain amount of solder paste to the outer periphery of each pin hole on the circuit board. Use a mounting fixture to move each component to the corresponding pin hole. Solder the components to the corresponding pin holes using the solder paste applied to the outer periphery of the pin holes. After the components are mounted, remove the mounting fixture. (3) Electrical interconnection between the circuit board and the metal package The circuit board with the mounting structure is placed on top of the metal package housing with pins, so that the structure fits onto the corresponding pins through the perforations on the structure; solder paste is applied to the surface of the structure, and the structure and pins are soldered with the solder paste, so that the circuit board is electrically interconnected with the metal package housing through the structure and pins.

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