Substrate transport device and substrate transport method

Abstract

This invention provides a substrate transport apparatus and a substrate transport method. In the substrate transport method, a first transport body and a second transport body are used to transport the substrate. The first transport body and the second transport body are respectively lifted from the bottom of the substrate transport area by magnetic force, and support the substrate and move laterally. The substrate transport method includes the following steps: a transport step, in which the first transport body transports the substrate to a predetermined first reference position for the substrate in a module; a receiving step, in which the second transport body receives the substrate at the first reference position for the substrate; and a detection step, in which the second transport body is moved to a predetermined first reference position for the transport body to transport the substrate to a detection unit, and the top-view position deviation between the position of the substrate and a predetermined second reference position for the substrate in the detection unit is detected.

Description

Technical Field

[0001] This invention relates to a substrate conveying device and a substrate conveying method. Background Technology

[0002] In the semiconductor device manufacturing process, semiconductor wafers (hereinafter referred to as wafers) serving as substrates are transported and processed within an apparatus. Regarding the transport of these wafers, Patent Document 1 discloses a transport mechanism that levitates from the bottom of the apparatus using magnetic force. Furthermore, Patent Document 2 discloses a method where the storage state of wheels used to move a wafer stage mounted on the exposure apparatus on the ground is controlled via a remote control device (teach pendant).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-86987

[0006] Patent Document 2: Japanese Patent Application Publication No. 2018-146983 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] This disclosure provides a technique for easily grasping and utilizing the positional relationship between the transporter of the substrate and the module when viewed from above.

[0009] Solution for solving the problem

[0010] The substrate transport method disclosed herein uses a first transport body and a second transport body to transport a substrate. The first transport body and the second transport body are respectively lifted from the bottom of the substrate transport area by magnetic force, and support the substrate and move laterally. The substrate transport method includes the following steps:

[0011] The transfer process involves using the first transfer body to move the substrate to a predetermined first reference position for the substrate within the module.

[0012] The receiving process involves receiving the substrate at a first reference position for the substrate via the second conveyor; and

[0013] In the detection process, the second conveyor is moved to a predetermined first reference position for the conveyor to transport the substrate to the detection unit, and the positional deviation between the position of the substrate and the predetermined second reference position for the substrate in the detection unit is detected.

[0014] The effects of the invention

[0015] According to this disclosure, the positional relationship between the transporter of the substrate and the module when viewed from above can be easily grasped and utilized. Attached Figure Description

[0016] Figure 1 This is a top view of a substrate processing apparatus that uses a substrate conveying device as an embodiment of the present disclosure.

[0017] Figure 2 This is a longitudinal sectional side view of the substrate processing apparatus.

[0018] Figure 3 This is a perspective view of the bottom of the conveyor and housing of the substrate processing apparatus.

[0019] Figure 4 These are top views showing the conveyor, the substrate, and the mounting stage for placing the substrate.

[0020] Figure 5 This is a flowchart illustrating the various steps involved in teaching the conveyor body to the processing module 5.

[0021] Figure 6 This is an explanatory diagram illustrating the acquisition of position data for the first reference position of the loading interlock module 3A of the conveyor body 42, which serves as the second conveyor body, in step S1.

[0022] Figure 7 This is an explanatory diagram showing how, in step S2, the wafer W is transported to the first reference position of the substrate of the processing module 5 via the transport body 41, which serves as the first transport body.

[0023] Figure 8 This is an illustration of how the wafer W is moved out of the processing module 5 by the conveyor 42 in step S3.

[0024] Figure 9 This is an explanatory diagram illustrating step S4, which involves moving the wafer W to a first reference position via the conveyor 42, detecting the deviation between the wafer W and the second reference position on the substrate, and providing a teaching demonstration.

[0025] Figure 10 This is a top view of the substrate processing apparatus used to illustrate the teaching of the conveyor body.

[0026] Figure 11 It is a top view of the conveyor used to illustrate the position correction of the conveyor through teaching.

[0027] Figure 12 This is a top view used to illustrate a variation of the teaching. Detailed Implementation

[0028] exist Figure 1The diagram shows a substrate processing apparatus 1, which includes a substrate transport apparatus as one embodiment of the present disclosure. The substrate processing apparatus 1 is disposed in an atmospheric atmosphere and includes a loading module 2, an alignment module 20, loading interlock modules 3A and 3B, a vacuum transport module 4, and six processing modules 5. In each processing module 5, a wafer W, which is a circular substrate, is processed under a vacuum atmosphere.

[0029] Loading module 2, referred to as EFEM (Equipment Front End Module), is used to load and unload wafer W from a transport container C called FOUP (Front Open Unified Pod), which holds the wafer W. The wafer W removed from transport container C is then placed into substrate processing apparatus 1. Loading module 2 is horizontally elongated and its interior is set to an atmospheric atmosphere and normal pressure. Hereinafter, the length direction of loading module 2 will be defined as the X direction, and the direction orthogonal to the X direction will be defined as the Y direction. Both the X and Y directions are horizontal. Furthermore, one side and the other side of the X direction will be referred to as the +X side and -X side, respectively, and one side and the other side of the Y direction will be referred to as the +Y side and -Y side, respectively.

[0030] On the -Y side of the loading module 2, three container mounting sections 21 for holding each transport container C are arranged along the X direction. Furthermore, a transport mechanism 22 is provided within the loading module 2. The transport mechanism 22 is not a magnetically levitated structure like the transport bodies 41 and 42 described later. This transport mechanism 22 is, for example, composed of a multi-joint arm that can move freely in the X direction and has an end effector 23 supporting the back side of the wafer W. The wafer W is transported between the transport containers C on the container mounting sections 21, the loading interlock modules 3A and 3B, and the alignment module 20 via the transport mechanism 22.

[0031] An alignment module 20 is connected to the -X side of the loading module 2. The alignment module 20 optically detects the orientation and center position of the wafer W. When the transport mechanism 22 receives the wafer W from the alignment module 20, the operation of the transport mechanism 22 is controlled by the control unit 10 (described later) so that the center position of the wafer W is located at a predetermined position on the end effector 23 when the wafer W is in a predetermined orientation.

[0032] Loading interlocking modules 3A and 3B are provided on the +Y side of loading module 2, and loading interlocking modules 3A and 3B are separated from each other in the X direction. Also refer to the longitudinal sectional side view. Figure 2The loading interlock module 3A, which constitutes the detection unit, will be described. The loading interlock module 3A includes a housing 30. A gas supply mechanism and an exhaust mechanism are provided in the housing 30 so as to supply and exhaust N2 (nitrogen) gas into and out of the housing 30, and the housing 30 can switch between an atmospheric pressure atmosphere and a vacuum atmosphere containing N2 gas.

[0033] A mounting stage 31, which appears circular when viewed from above, is provided within the housing 30. The wafer W is horizontally placed on the upper surface of the mounting stage 31. Three lifting pins 32 are provided on the mounting stage 31, which can protrude and retract freely relative to the upper surface of the mounting stage 31 by vertical movement. The wafer W can be transferred between the mounting stage 31, the aforementioned conveying mechanism 22, and the conveying bodies 41 and 42 (described later) provided in the vacuum conveying module 4 via these lifting pins 32.

[0034] A camera 33 is installed above the stage 31 and on the top of the housing 30. The camera 33 has a downward field of view and can acquire image data from above of the support 47 of the transport bodies 41 and 42 (described later) moving on the stage 31, and the wafer W supported by the support 47. This image data is sent to the control unit 10 and used for teaching the transport bodies 41 and 42, as detailed later. The loading interlock module 3B does not have the camera 33, except that it is constructed in the same way as the loading interlock module 3A. A gate valve G1 is provided between the housing 30 of each loading interlock module 3A and 3B and the loading module 2, thereby enabling the separation of the atmosphere inside the loading module 2 from the atmosphere inside the housing 30.

[0035] Vacuum transfer module 4 is connected to the +Y side of the load interlock modules 3A and 3B. Vacuum transfer module 4 includes a housing 40. The housing 40 houses the substrate transfer area, and a vacuum atmosphere is created inside the housing 40 by venting the interior using an venting mechanism (not shown). Transfer bodies 41 and 42 for transferring wafer W are provided inside the housing 40, which will be described in detail later. A gate valve G2 is provided between the housing 30 of each load interlock module 3A and 3B and the housing 40 of the vacuum transfer module 4, thereby separating the atmosphere inside the housing 30 from the atmosphere inside the housing 40.

[0036] The six processing modules 5 described above will be explained. Each processing module 5 includes a processing container 50, and a vacuum atmosphere is created inside the processing container 50 by an exhaust mechanism (not shown). Inside the processing container 50, a mounting stage 31 is provided, similar to the loading interlock modules 3A and 3B, and a lifting pin 32 for mounting the wafer W is provided. Furthermore, the mounting stage 31 in the processing module 5 includes a flow path for the flow of fluid, for example, after temperature adjustment by a cooling unit, and a heater as a temperature adjustment unit to adjust the temperature of the mounted wafer W to the desired temperature for processing.

[0037] Additionally, a gas supply unit (not shown), such as a gas spray head, is provided in the processing container 50 to supply processing gas into the processing container 50, which is set to a vacuum atmosphere. The wafer W, placed on the stage 31 and subjected to temperature adjustment, is exposed to this processing gas and thus undergoes processing corresponding to the processing gas. Such processing includes, for example, etching, film deposition, or annealing. Furthermore, a plasma forming mechanism may be provided to plasmaize the processing gas for processing.

[0038] In this example, three processing modules 5 are connected to the vacuum transfer module 4 on both the -X and +X sides. Furthermore, the three processing modules 5 on the -X side and the three processing modules 5 on the +X side are arranged in the Y direction. A gate valve G3 is provided between the processing container 50 of each processing module 5 and the housing 40 of the vacuum transfer module 4, thereby enabling the separation of the atmosphere inside the housing 40 from the atmosphere inside the processing container 50.

[0039] During operation of the substrate processing apparatus 1, except when necessary for transferring wafer W between modules and for the transport bodies 41 and 42 to access modules for teaching as described later, gate valves G1, G2, and G3 described above are closed to separate the atmosphere between modules. Therefore, pressure changes are performed within the housings 30 of the aforementioned loading interlock modules 3A and 3B while gate valves G1 and G2 are closed. Furthermore, processing in each processing module 5 is performed while gate valve G3 is closed, separating the processing container 50 from the vacuum transport module 4.

[0040] Furthermore, the loading interlock modules 3A and 3B, the vacuum conveying module 4, and the six processing modules 5, which are capable of creating a vacuum atmosphere internally through exhaust, are each configured to perform this exhaust independently. By exhausting each module in this way, it is possible to set the processing container 50 of the processing module 5 to a vacuum atmosphere while the housing 40 of the vacuum conveying module 4 is in an atmospheric atmosphere, which will be used in the applications described later.

[0041] Next, also refer to Figure 3 The vacuum transport module 4 will be described in further detail using a perspective view. The transport body 41, serving as the first transport body, and the transport body 42, serving as the second transport body, are disposed within the housing 40 forming the substrate transport area. They move laterally to transport the wafer W while being lifted from the bottom plate 49 (i.e., the bottom of the substrate transport area) within the housing 40 by magnetic force. This levitation movement prevents dust accumulation, thereby keeping the vacuum transport module 4 and the processing module 5 clean and suppressing processing abnormalities caused by foreign matter adhering to the wafer W. Figure 3As schematically shown, a plurality of coils 43 are embedded laterally in the base plate 49. Furthermore, the system is configured such that power is individually supplied to each coil 43 from the power supply unit 44, and the coil 43 generates a magnetic field around itself with an intensity corresponding to the supplied power. That is, each coil 43 functions as an electromagnet.

[0042] The movement of the conveyor bodies 41 and 42 is individually controlled using the aforementioned magnetic field. The conveyor bodies 41 and 42 are similarly configured, and representatively, for... Figure 3 The conveyor 41 shown will be described below. The conveyor 41 includes a moving body 46 that internally includes a magnet 45, for example, a permanent magnet. The magnet 45 repels the energized coil 43 through magnetic force, causing the conveyor 41 to float from the base plate 49. By switching the energized coil 43 and adjusting the supplied electrical force, the magnetic field on the base plate 49 can be controlled, thereby enabling the conveyor 41 to move in the X and Y directions, change its orientation, remain stationary, and change its levitation height from the base plate 49 while maintaining its levitation. Furthermore, the movement in the X and Y directions here includes both separate movement in the X and Y directions and simultaneous movement in the X and Y directions.

[0043] A support body 47 is provided on the side of the moving body 46 to horizontally support the wafer W from below. Through the movement of the moving body 46, the support body 47 can be positioned on each of the loading interlock modules 3A, 3B, and processing module 5's mounting stages 31. Therefore, the wafer W can be transferred between the mounting stage 31 and the support body 47 using the lifting pins 32 of the mounting stage 31. In this example, the support body 47 is configured in a forked shape to avoid interference with the lifting pins 32 during this transfer.

[0044] The transport path of wafer W in substrate processing apparatus 1 is described below. Wafer W, taken from transport container C and placed into loading module 2, is transported in the order of alignment module 20 → loading module 2 → loading interlock module 3A → vacuum transport module 4. Furthermore, after being processed by processing module 5, wafer W is transported in the order of vacuum transport module 4 → loading interlock module 3B → loading module 2 → transport container C. The transport between vacuum transport module 4 and processing module 5 can be described in more detail. The apparatus structure can be configured to transport wafers to only one of the six processing modules 5 for processing, or it can be configured to transport wafers to multiple processing modules 5 sequentially for processing. Any of the transport bodies 41 and 42 can be used for transport between vacuum transport module 4, processing module 5, and loading interlock modules 3A and 3B.

[0045] In order to perform such transfer and processing of wafer W, the transport bodies 41 and 42 are taught (operational teaching). This teaching will now be explained. As described above, the wafer W is transferred between the mounting stage 31 of each module accessed by the transport bodies 41 and 42 and the support body 47 of the transport bodies 41 and 42. More specifically, the wafer W is fed onto the mounting stage 31 by the transport bodies 41 and 42 via the lifting pin 32, and the wafer W is received from the mounting stage 31 by the transport bodies 41 and 42 via the lifting pin 32. In summary, the teaching of the transport bodies 41 and 42 refers to the operation of determining the position of the transport bodies 41 and 42 when performing the transfer of wafer W in this manner.

[0046] Also refer to Figure 4 To illustrate this in more detail, a top view is provided. In the figure, the center position of the wafer W is designated as center point O1. Furthermore, a predetermined position on the support 47 of the transport bodies 41 and 42 is designated as support center point O2. This support center point O2 is the point that coincides with the center point O1 of the wafer W when viewed from above, with the wafer W normally placed on the support 47. Moreover, the center of the upper surface of the stage 31 is designated as the placement center point O3.

[0047] By teaching, the positions of the transport bodies 41 and 42 during handover are determined so that the support center points O2 of each transport body 41 and 42 coincide with the placement center point O3 of the stage 31 when viewed from above. By determining the position in this way, the wafer W is placed on the stage 31 with its center point O1 coinciding with the placement center point O3 when viewed from above, and is received by the support body 47 with its center point O1 coinciding with the support center point O2. Therefore, when an XY coordinate system is set in the processing module 5 and the vacuum transport module 4, consisting of the X-axis and Y-axis along the X and Y directions respectively, teaching the transport bodies 41 and 42 is equivalent to determining the coordinate position of the support center points O2 of the transport bodies 41 and 42 in that XY coordinate system. Teach each module accessed by the transport bodies 41 and 42 to properly process the wafer W by placing it in such a way that the center point O1 of the wafer W coincides with the placement center point O3 of the placement stage 31 of all processing modules 5.

[0048] Furthermore, as described above, the conveyor bodies 41 and 42 are constructed identically to each other. However, there are unavoidable shape errors in the manufacturing process and differences in the characteristics of the magnet 45 between the conveyor bodies 41 and 42. Assuming that the same magnetic field is formed under the conveyor bodies 41 and 42, it is conceivable that even if the shape error is small, the difference in the characteristics of the magnet 45 will cause deviations in the position of their respective support center points O2. In other words, it is conceivable that because the conveyor bodies 41 and 42 have a magnetic levitation structure, individual differences may easily occur between the conveyor bodies 41 and 42. Therefore, the conveyor bodies 41 and 42 are taught separately.

[0049] In addition, for Figure 1 , Figure 3 The control unit 10 shown will be described below. This control unit 10 is configured as a computer and includes a program and a memory 11. The program is programmed into a set of steps to output control signals to each part of the substrate processing apparatus 1 to control the operation of each part, thereby performing the aforementioned wafer W transfer and processing, and the automatic teaching described later. The program is stored in the control unit 10, for example, on a storage medium such as a hard disk, optical disc, DVD, or memory card.

[0050] In memory 11, data (let's call it position data) specifying the location for the aforementioned handover is stored for each module accessed by each transport body 41, 42. That is, when the transport bodies 41, 42 hand over the wafer W to the module, the operation of the transport bodies 41, 42 is controlled (i.e., the magnetic field on the base plate 49 is controlled) to move the transport bodies 41, 42 to the position corresponding to the position data for that module. Therefore, the teaching regarding the transport bodies 41, 42 describes determining the position for handing over the wafer W to the module, and more specifically, acquiring position data where the support center point O2 and the placement center point O3 coincide in a top view, and storing it in memory 11. Since... Figure 3 As described above, the positions of the conveyors 41 and 42 are changed by the change of the magnetic field on the base plate 49, and therefore, for example, data such as which coil 43 to supply how much power is used as position data.

[0051] In this substrate processing apparatus 1, after an operator teaches one of the transport bodies 41 and 42, the teaching of the other transport body can be performed automatically. Because the teaching is performed automatically in this way, it can be performed while the substrate processing apparatus 1 is running, i.e., while maintaining a vacuum atmosphere within the housing 40 of the vacuum transport module 4 and the processing containers 50 of each processing module 5. The object of the automatic teaching can be either the transport body 41 or 42. Hereinafter, we will assume that the teaching of the transport body 42 is performed automatically, referring to... Figure 5 Flowcharts (showing steps S1 to S4 below) and Figures 6-10 The process is illustrated using a top view. For ease of explanation, the processing module located closest to the +Y side among the three processing modules 5 on the +X side is referred to as processing module 5A.

[0052] First, for example, the housing 40 of the vacuum transfer module 4 and the processing containers 50 of each processing module 5 are opened to the outside of the device to create an atmospheric atmosphere, and the substrate processing device 1 is set to a non-operating state. In this state, the operator manually teaches the transfer body 41. That is, regarding the transfer body 41, the described position data (second data) of each processing module 5 and each module of the loading interlock modules 3A and 3B are acquired and stored in the memory 11.

[0053] Furthermore, the operator pre-teachs the transport mechanism 22 of the loading module 2 using any method to ensure that the transport mechanism 22 appropriately delivers the wafer W to each accessed module and transport container C. Also, it is pre-set that provisional position data is stored in the memory 11 of the control unit 10 as the position data of the transport body 42 relative to each module. In other words, the transport body 42 is configured to move to a provisional position for wafer W delivery. Additionally, the position of the loading center point O3 of the loading stage 31 is pre-determined from the image data acquired by the camera 33 of the loading interlock module 3A.

[0054] Next, the housing 40 of the vacuum transfer module 4 and the processing containers 50 of each processing module 5 are vented to create a vacuum atmosphere, and the substrate processing apparatus 1 is operated. Then, at arbitrary time intervals, the transfer body 42 is moved to a provisional position for the transfer of wafer W to the loading interlock module 3A according to provisional position data stored for the loading interlock module 3A. As a result, the support 47 of the transfer body 42 is positioned on the mounting stage 31 of the loading interlock module 3A, and an image of the support 47 from above is captured by a camera 33.

[0055] The control unit 10 sequentially detects the support 47 in the image data, determines the support center point O2, and calculates the deviations of the support center point O2 from the placement center point O3 of the stage 31 in the X and Y directions. Furthermore, it updates the position data of the loading interlock module 3A in the memory 11 to correct these deviations in the X and Y directions (that is, changes from provisional position data to formal position data). Specifically, the position of the transport body 42 when handing over the loading interlock module 3A to the wafer W is corrected so that the support center point O2 coincides with the placement center point O3 when viewed from above, thus completing the teaching of the transport body 42 to the loading interlock module 3A. Figure 6 (Step S1). Furthermore, step S1 corresponds to the first determination process for determining the first reference position of the conveyor body, where the position where the support center point O2 coincides with the placement center point O3 is the first reference position of the conveyor body. Moreover, the position data updated through step S1 is the first data.

[0056] Next, the wafer is transferred from the transport container C to either the loading interlock modules 3A or 3B via the loading module 2. In this example, it is transferred to the loading interlock module 3A. As already described, the transport mechanism 22 has been taught, so the wafer W is transferred with its center point O1 coinciding with the placement center point O3 of the loading interlock module 3A. The transport body 41 receives the wafer W transferred in this manner and transports it to the processing module 5A. Since the transport body 41 has been taught, it is moved to a position where, in top view, the support center point O2 coincides with the placement center point O3 of the processing module 5A (the second reference position for the transport body).

[0057] The lifting pin 32 of the stage 31 of the processing module 5A rises, and the wafer W is supported on the lifting pin 32 instead of being supported on the transport body 41 (step S2). As described above, since the transport body 41 has been taught and the transport body 41 receives the wafer W whose center point O1 coincides with the placement center point O3 through the loading interlock module 3A, the center point O1 of the wafer W supported on the lifting pin 32 coincides with the placement center point O3 of the stage 31 when viewed from above. Figure 7 At this point, the position of wafer W is the first reference position used for the substrate.

[0058] The conveyor 41 retracts from the processing module 5A. Then, according to the provisional position data stored in the processing module 5A, the conveyor 42 moves to a provisional position for the transfer of wafer W to the processing module 5A, with the support 47 of the conveyor 42 positioned below the wafer W. Furthermore, the lifting pin 32 descends, and the wafer W is supported by the support 47 instead of the lifting pin 32. Figure 8 Step S3).

[0059] Afterwards, the transport body 42 supporting the wafer W moves to the position where the loading interlock module 3A is handed over. Specifically, since the teaching of the loading interlock module 3A was completed in step S1, the transport body 42 is positioned where the support center point O2 coincides with the placement center point O3 of the stage 31 when viewed from above (the first reference position for the transport body). Figure 9 Furthermore, the camera 33 captures images of the wafer W supported by the support 47 from above.

[0060] The control unit 10 calculates the center point O1 of the wafer W in the image data, for example, calculating the deviation of the center point O1 from the placement center point O3 of the stage 31 in the X and Y directions. When the position of the wafer W where the center point O1 coincides with the placement center point O3 in a top view is set as the second reference position for the substrate, assuming that the transport body 42 has completed teaching to the processing module 5A, the wafer W coincides with this second reference position. Therefore, the calculation of the deviation of the center point O1 of the wafer W from the placement center point O3 using the image data is a calculation of the deviation between the wafer W at the predetermined second reference position and the wafer W at the actual position.

[0061] The deviation calculated based on the image data (denoted as the deviation of wafer W) corresponds to the deviation of the support center point O2 of the transporter 42 relative to the center point O1 of wafer W when viewed from above during step S3. As described above, in the processing module 5A, the center point O1 of wafer W coincides with the placement center point O3, therefore the deviation of wafer W corresponds to the deviation of the support center point O2 of the transporter 42 relative to the placement center point O3 when viewed from above. When the deviation of the placement center point O3 from the support center point O2 is set as the deviation of the junction position, the control unit 10 calculates the deviation of the junction position.

[0062] Regarding the calculation of the deviation at this handover position, in Figure 11 Specific examples are shown below for illustration. Figure 11 This is a top view showing the conveyor 42 used in step S3 to receive wafer W from processing module 5A and in step S4 to acquire image data via loading interlock module 3A. (See attached image data.) Figure 11 As shown, the deviation of wafer W obtained from the image data (the deviation of the center point O1 of wafer W relative to the placement center point O3 of the loading interlock module 3A) is L1 in the -X direction and L2 in the -Y direction.

[0063] Based on the positional relationship between the loading interlock module 3A and the processing module 5A relative to the vacuum transfer module 4, the orientation of the transfer body 42 differs by 90° when receiving the wafer W and when photographing the wafer W. Based on this difference in orientation of the transfer body 42 and the deviation of the wafer W obtained from the aforementioned image data, when receiving the wafer W from the processing module 5A, the support center point O2 of the transfer body 42 deviates by L2 in the -X direction and L1 in the +Y direction relative to the placement center point O3 (= the center point O1 of the wafer W). Values ​​of L2 in the -X direction and L1 in the +Y direction are calculated as the deviation at the handover position.

[0064] The position data for processing module 5A is updated to eliminate the aforementioned deviation at the handover position. In other words, the teaching of processing module 5A is completed by changing the provisional position data based on the deviation of wafer W to the formal position data (step S4). Specifically, for example, in... Figure 10 If the deviation of the handover position is L2 in the -X direction and L1 in the +Y direction as shown, the position data is updated so that the support center point O2 of the conveyor 42 at the time of handover is deviated by L2 in the +X direction and L1 in the -Y direction, thereby coinciding with the placement center point O3 of the processing module 5A.

[0065] Subsequently, steps S2 to S4 are also performed on other processing modules 5 (excluding 5A) and loading interlock module 3B accessed by the transporter 42 to teach the modules sequentially. Furthermore, depending on the module being taught, the orientation of the transporter 42 during wafer W reception in step S3 and during imaging in step S4 sometimes differs from... Figure 11 The case differs from that of processing module 5A described in the text. In this case, the teaching is performed by calculating the deviation of the handover position in step S4 based on the different relationships of the orientation.

[0066] When steps S2 to S4 are performed and position data is updated for all modules accessed by the transport body 42, the teaching of the transport body 42 is completed. After this teaching is completed, when the transport body 42 transfers wafer W between modules, the center point O1 of the wafer W in top view coincides with the placement center point O3 of each module. Figure 10 The diagram shows the state of wafer W being handed over to the processing module 5A in this manner.

[0067] Furthermore, steps S2 and S3 described above correspond to the conveying process and the receiving process, respectively. Each process up to the calculation of the deviation at the junction position in step S4 corresponds to the inspection process, and the subsequent update of the position data corresponds to the correction process. Additionally, the deviation of the wafer W and the deviation of the junction position obtained in step S4 represent data indicating the top-view positional relationship between the first reference position of the substrate and the second conveyor body during the receiving process.

[0068] As previously described, teaching is required for each of the conveyors 41 and 42 separately. However, the substrate processing apparatus 1 automatically performs the teaching for one of the conveyors 41 and 42, thus reducing the manpower and time required for manual teaching. Furthermore, the structure of the substrate processing apparatus 1 can be appropriately modified, and the number of modules connected to the vacuum conveying module can be appropriately increased or decreased. Although teaching is performed for each module accessed by the conveyors 41 and 42, the operator only needs to manually teach one of the conveyors 41 and 42, thus reducing the workload for the operator even if the number of modules is large.

[0069] Furthermore, although it is stated that the wafer W supported on the lifting pin 32 of the module in step S2 is not placed on the mounting stage 31, but is received by the transport body 42 in step S3, the lifting pin 32 can also be lowered to temporarily place the wafer W on the mounting stage 31. That is, in step S3, the wafer W processed in the processing module 5 can be received by placing it on the mounting stage 31. In other words, the processing of the wafer W can be performed during steps S1 to S4. In addition, regarding steps S1 to S4, it is not limited to using a wafer W as a substrate for manufacturing semiconductor devices; a substrate such as a wafer dummy, which has the same shape as the wafer W when viewed from above but is not intended for manufacturing semiconductor devices, can also be used.

[0070] Furthermore, the teaching of the processing module 5A has been described in the manner of performing steps S1 to S4 sequentially. However, the teaching of the transfer body 42 to the loading interlock module 3A in step S1 can be performed only during the period before the transfer body 42 receives the wafer W from the processing module 5A in step S3. Therefore, step S2 can be performed before step S1.

[0071] Furthermore, as described above, it is preferable to perform all steps S1 to S4 automatically. However, for example, the teaching of the loading interlock module 3A for the conveyor 42 in step S1 can be performed manually by an operator, just as it is for the teaching of the conveyor 41. Even if step S1 is performed manually, the number of modules that become the objects of manual teaching only increases by one, thus significantly reducing the burden on the operator.

[0072] The teaching performed when the substrate processing apparatus 1 starts operating is explained, but the same teaching is also performed during maintenance after the substrate processing apparatus 1 has been operating. Below, the process of each operation, including teaching, is explained by taking the case where the conveyor 42 is replaced during the operation of the apparatus as an example of such maintenance.

[0073] First, with gate valves G2 and G3 closed, the venting inside the housing 40 of the vacuum transfer module 4 is stopped, and the pressure inside the housing 40 is restored from the preset vacuum pressure (hereinafter referred to as the transfer vacuum pressure) used for transferring the wafer W to atmospheric pressure. The operator removes a portion of the partition wall constituting the housing 40 and accesses the housing 40 from the outside of the device to replace the transfer body 42. Afterwards, the housing 40 is vented and the transfer vacuum pressure is reset. As described above, due to individual differences between transfer bodies, it is necessary to teach the newly used transfer body 42; therefore, steps S1 to S4 are performed in the same manner as when starting operation of the device as described above.

[0074] The processing modules 5 do not stop operating or open to atmospheric conditions by replacing the transport body 42 and executing steps S1 to S4. They operate continuously from the time the transport vacuum pressure is released until it is restored. Specifically, the operation of the processing modules 5 means maintaining the temperature of the stage 31 within the processing container 50 at the same temperature as during wafer W processing, or maintaining a vacuum pressure within the processing container 50. By maintaining the processing environment of the wafer W within the processing container 50 through the operation of the processing modules 5, the wafer W can be quickly transferred to the processing modules 5 and processing can resume after the vacuum transport module 4 restores the transport vacuum pressure. Alternatively, if wafer W is being processed within the processing container 50 when the transport vacuum pressure is released, processing can continue, and the processed wafer W can be removed from the processing container 50 after the transport vacuum pressure is restored.

[0075] Since the teaching of the processing module 5 by the conveyor 42 can be performed without creating an atmospheric atmosphere inside the processing container 50, each processing module 5 can be operated without stopping during steps S1 to S4 as described above. Therefore, even if the device structure is designed such that the conveyors 41 and 42 are replaced frequently, the time during which processing cannot be performed in each processing module 5 can be prevented from becoming longer. In addition, the number of processing modules 5 provided in the substrate processing apparatus 1 can be appropriately increased or decreased. When the number of processing modules 5 is large, the ability to operate without stopping the operation of each processing module 5 is particularly effective in ensuring the productivity of the apparatus.

[0076] The following describes variations of steps S1 to S4, but the transport object used for teaching is the same as in the previous examples, designated as transport object 42, unless otherwise specified. Figure 6The following describes a variation of step S1 (teaching the loading interlock module 3A to the conveyor 42) as explained in the text. Step S1 is not limited to using the camera 33. As a specific example, a sensor wafer can be used. This sensor wafer is a device comprising a substrate body having the same shape as the wafer W when viewed from above, and a camera positioned within the substrate body to capture images from above. Furthermore, image data acquired by the camera is transmitted wirelessly or via a wired connection to the control unit 10.

[0077] The aforementioned sensor wafer is transferred from the transfer container C to the loading interlock module 3A via the transfer mechanism 22, and then placed on the mounting stage 31 of the loading interlock module 3A. Furthermore, the transfer mechanism 22 performing this transfer is set to be in the teaching stage, and a specified point (denoted as O4) in the image data acquired by the sensor wafer placed on the mounting stage 31 in this manner is located directly above the mounting center point O3 of the mounting stage 31.

[0078] After the sensor wafer is moved into the loading interlock module 3A as shown in this example, Figure 6 As described above, the conveyor 42 is moved to the handover position using provisional position data. Then, image data is acquired by taking a picture of the support 47 of the conveyor 42 using a sensor wafer. The control unit 10 detects the deviation between the support center point O2, determined based on the position of the support 47 in the image data, and the aforementioned point O4, and updates the position data to eliminate this deviation, thus completing step S1.

[0079] Furthermore, assuming the sensor wafer is transferred to the processing module 5 and taught in the same manner as when teaching the loading interlock module 3A, the sensor wafer may become malfunctioning due to the magnetic field affecting it as it passes through the vacuum transfer module 4. Additionally, in the substrate processing apparatus 1, as described above, teaching may be performed, for example, while the processing module 5 is running. However, since the sensor wafer is being transferred into the running processing module 5, it may be exposed to the gases within the processing module. This poses a risk of corrosion to the constituent components of the sensor wafer. Therefore, teaching the processing module 5 using the method described so far is effective.

[0080] Other embodiments of step S1 will be described. The operator enters the loading module 2, which is in an atmospheric state, and visually inspects the loading interlock module 3A through the opening of the gate valve G1. Teaching can be performed by confirming the position of the support 47 of the conveyor 42 within the loading interlock module 3A in this state. Furthermore, when the conveyor 42 enters the loading interlock module 3A, the vacuum conveying module 4 is connected to the loading interlock module 3A; therefore, both the vacuum conveying module 4 and the loading interlock module 3A are pre-set to an atmospheric state to enable the aforementioned visual inspection.

[0081] Furthermore, as another example, the teaching in step S1 can be performed by installing multiple distance sensors on the side wall of the housing 30 of the loading interlock module 3A. These distance sensors may include, for example, a sensor that detects the distance in the X direction to the support 47 of the conveyor 42 as it moves to the handover position based on provisional position data, and a sensor that detects the distance in the Y direction. The control unit 10 calculates the position of the support center point O2 based on the detection results of each distance sensor installed in this way, and calculates the deviations of the support center point O2 from the placement center point O3 in the X and Y directions when viewed from above, thus performing the teaching.

[0082] Furthermore, when a distance sensor is used instead of camera 33 in step S1, it can also be used instead of camera 33 in step S4. Specifically, for example, in step S4, each distance sensor is used to detect the distance relative to wafer W. The control unit 10 calculates the position of the center point O1 of wafer W based on the detection result, and calculates the aforementioned deviation of wafer W and the deviation of the junction position based on the center point O1 for teaching purposes. Moreover, by using the same detection equipment (camera 33, distance sensor) installed in the same module to perform steps S1 and S4, it is not necessary to prepare separate detection equipment for performing steps S1 and S4 separately, which is therefore preferable.

[0083] As a detection unit equipped with the aforementioned camera 33 and distance sensor for performing steps S1 and S4, any location accessible to the transport bodies 41 and 42 is acceptable. Therefore, the loading interlock module 3B can be configured as the detection unit. In the case of a substrate processing apparatus configured by connecting the alignment module 20 and the connection module to the vacuum transport module 4, these modules can be configured as detection units. In the case of a device structure with multiple vacuum transport modules 4, the aforementioned connection module is a module that connects the vacuum transport modules 4 to each other, and the connection module has a housing with an internal vacuum atmosphere and a mounting stage disposed within the housing. Unlike the vacuum transport module 4, no magnetic field is formed at the bottom of this housing. A fixed pin is provided on the mounting stage of the connection module, and the wafer W is transferred between two vacuum transport modules 4 by the lifting and lowering action of the transport bodies 41 and 42.

[0084] Furthermore, a portion of the vacuum transport module 4 can be designated as a detection unit by installing a camera 33 and a distance sensor in the vacuum transport module 4. In this case, a specific point in this area can be treated similarly to the loading center point O3 of the aforementioned loading interlock module 3A. That is, in step S1, the support center point O2 of the transport body 42 is taught to coincide with this specific point, and in step S4, the transport body 42 is moved to coincide with this specific point to detect the deviation of the wafer W. However, when the vacuum transport module 4 is designated as a detection unit in this way, it is preferable to configure the camera 33 in a way that shields the magnetic field to prevent malfunctions of the camera 33, etc., due to the influence of the magnetic field. Considering this, in terms of simplifying the device structure, it is preferable to install cameras 33, etc., as detection units in the aforementioned modules where no magnetic field is formed on the bottom, which simplifies the device structure.

[0085] In addition, Figure 8 In step S3, the untaught transporter 42 is brought into the module to receive the wafer W according to provisional position data. For example, in the vacuum transport module 4, a camera 52 is placed near each taught module as a detection device to acquire image data, and the position of the transporter 42 upon entry is adjusted based on this image data. That is, the path of the transporter 42 to the module is changed according to the image data. By adjusting the position in this way, a device structure can be designed to more reliably avoid interference with the gate valves G2 and G3 that constitute the module entrance. A distance sensor can be used as a detection device instead of the camera 52, and interference can be avoided similarly by detecting the position of the transporter 42 before entering the module. Furthermore, photoelectric sensors such as fiber optic sensors and area sensors can be used as detection devices.

[0086] Next, use Figure 12 For Figure 10 A variation of step S4 described herein will be explained. Furthermore, in Figure 12 In this diagram, the support center point of the end effector 23 of the conveying mechanism 22 is also represented as O2, similar to the support center points of the conveying bodies 42 and 43. In the initial step S4, the conveying body 42 conveys the wafer W from the processing module 5A to the loading interlock module 3A and places the wafer W on the mounting stage 31. At this time, the mounting center point O3 of the mounting stage 31 deviates from the center point O1 of the wafer W. Figure 12 (Upper part). The conveying mechanism 22 of the loading module 2 accepts the wafer W. Since the conveying mechanism 22 has been taught, when accepting the wafer W, the support center point O2 of the conveying mechanism 22 is located on the placement center point O3. Therefore, when viewed from above, the center point O1 of the wafer W is deviated from the support center point O2 of the conveying mechanism 22 by the same amount as the deviation between the placement center point O3 of the loading interlock module 3A and the center point O1 of the wafer W.

[0087] Furthermore, the wafer W is transported in such a manner that the support center point O2 of the transport mechanism 22 coincides with the placement center point O3 of the placement stage 31 of the alignment module 20. Figure 12 (Lower part), and place the wafer W on the mounting stage 31. Because the wafer W is transported in this way, the deviation of the center point O1 of the wafer W relative to the mounting center point O3 when viewed from above is different from that of the mounting center point O3. Figure 10 The deviation of the handover position as described in the text (the deviation between the support center point O2 of the conveyor 42 and the placement center point O3 of the processing module 5A) corresponds to this.

[0088] The structure of the alignment module 20 is described. During the rotation of the mounting stage 31, which has a diameter smaller than that of the wafer W, around the vertical axis, light is irradiated from one of the light-emitting portions located above and below the peripheral end of the wafer W to the light-receiving portion located above and below the other peripheral end. The light-receiving portion receives light passing through the side of the wafer W. The control unit 10 detects the position of the center point O1 of the wafer W based on the light-receiving state and calculates the deviation between the center point O1 and the mounting center point O3 of the alignment module 20. Therefore, the calculation and teaching of the deviation of the aforementioned intersection position can be performed.

[0089] Therefore, in this Figure 12 In the example, the alignment module 20 is a detection unit whose position differs from the first reference position (position within the loading interlock module 3A) of the transport body, which is predetermined in the manner in which the transport body 42 receives and transports the wafer W. The wafer W is then transferred to other components (in a manner that preserves the deviation between the transport body 42, which has moved to the first reference position for the transport body, and the wafer W) in a manner that preserves the deviation between them. Figure 12In the case of a conveyor mechanism 22 (as in the example), the position of the wafer W can be taught by detecting the position of the wafer W based on the conveying destination of the other component as the detection unit. However, if it is considered that the position of the wafer W may deviate when the conveyor 42 is handed over to other components, it is preferable to set the position in the detection unit as a first reference position for the conveyor, and to teach by detecting the position of the wafer W at this reference position.

[0090] In addition, through Figure 10 The description explains that in step S4 of the substrate processing apparatus 1, for example, the deviation of wafer W is calculated based on image data, the deviation of the junction position is calculated, and the deviation of the junction position is used for teaching. Alternatively, the apparatus structure can be configured without this teaching. For example, the control unit 10 is configured to have a display unit for displaying the deviation of wafer W and / or the deviation of the junction position. Furthermore, steps S1 to S4 are performed as maintenance of the substrate processing apparatus 1. However, in step S4, no teaching is performed (i.e., the position data of memory 11 is updated), but instead, the acquired deviation of wafer W and / or the deviation of the junction position is displayed on the display unit. If the operator sees this display and determines that the deviation is large, they can take any action, such as releasing the vacuum atmosphere formed in the vacuum transfer module 4 and the processing module 5 for inspection. Even in a structure like this where no teaching is performed, the deviation of wafer W and the deviation of the junction position can be easily obtained, thus reducing the burden on the operator when monitoring the apparatus status, which is therefore preferred.

[0091] Furthermore, the transport bodies 41 and 42 are described in a manner that involves handover relative to each module (receiving wafer W from a module and sending wafer W to a module). However, it is also possible to configure them so that only one of the transport bodies 41 and 42 sends wafer W to a module and only the other receives wafer W. How to use the transport bodies 41 and 42 to transport wafer W in the vacuum transport module 4 is arbitrary. Therefore, the positions of the transport bodies 41 and 42 determined in step S4 can be used as positions for receiving only relative to the module or for sending only. Even if they are used as positions for receiving only or sending only, since these positions are positions where both receiving and sending are possible relative to the module, the handover position, i.e., the receiving position and the sending position, will be determined in step S4.

[0092] In the vacuum transfer module 4, the transfer bodies are not limited to just transfer bodies 41 and 42; more transfer bodies can be provided. Even if there are three or more transfer bodies, after the operator manually teaches one transfer body, the other transfer bodies can be automatically taught. To elaborate, the module can be taught by performing steps S1, S3, and S4 on each of the other transfer bodies (i.e., the multiple second transfer bodies). Furthermore, regarding step S2 (transferring the wafer W to the first reference position for the substrate) performed by the first transfer body, any transfer body that has completed teaching the module at the time step S2 is performed can be used. That is, a transfer body that has been taught manually can be used, and if there is a transfer body among the other transfer bodies that has completed automatic teaching, that transfer body can be used. In other words, in this example, the transfer body that is a second transfer body sometimes also functions as a first transfer body.

[0093] Furthermore, the module that serves as the teaching object is not limited to the processing module 5, the loading interlock modules 3A and 3B, but may also be, for example, the connection module described above. Also, in the substrate processing apparatus 1, the conveyors 41 and 42 move within the housing 40 in a vacuum atmosphere, but it may also be a device structure that moves within the housing 40 in an atmospheric atmosphere. In the case where the housing 40 is in an atmospheric atmosphere, the atmosphere within the processing module 5, which is connected to the housing 40 and where the wafer W is transferred by the conveyors 41 and 42, may also be, for example, an atmospheric atmosphere. Additionally, the substrate conveyed in this technology is not limited to a circular substrate, but may also be a rectangular substrate.

[0094] It should be considered that the embodiments disclosed herein are illustrative in all respects and not restrictive. The above embodiments may be omitted, substituted, modified and / or combined in various ways without departing from the appended claims and their spirit.

[0095] Explanation of reference numerals in the attached figures

[0096] W: Wafer; 3A: Loading interlock module; 4: Vacuum transfer module; 40: Housing; 41, 42: Transfer body; 5: Processing module.

Claims

1. A substrate transport method, comprising using a first transport body and a second transport body to transport a substrate, wherein the first transport body and the second transport body are respectively levitated from the bottom of a substrate transport area by magnetic force, and support the substrate and move laterally, the substrate transport method comprising the following steps: The transfer process involves using the first transfer body to move the substrate to a predetermined first reference position for the substrate within the module. The receiving process involves receiving the substrate at a first reference position for the substrate via the second conveyor. as well as In the inspection process, the second conveyor is moved to a predetermined first reference position for the conveyor to transport the substrate to the inspection unit, and the top-view position deviation between the position of the substrate and the predetermined second reference position for the substrate in the inspection unit is detected. The substrate transport area is a region within a vacuum transport module capable of creating a vacuum atmosphere. The module is a processing module that is capable of creating a vacuum atmosphere internally for processing the substrate and is connected to the vacuum conveying module. The conveying process, the receiving process, and the detection process are performed under a vacuum atmosphere within the vacuum conveying module and the processing module. With the processing module set to a vacuum atmosphere, the substrate transport area is changed from an atmospheric atmosphere to a vacuum atmosphere. Next, in a vacuum atmosphere within the processing module and the substrate transport area, the transport process, the receiving process, the detection process, and the process of acquiring first data for positioning the second transport body at a first reference position for the transport body are performed.

2. The substrate conveying method according to claim 1, characterized in that, It also includes a correction process in which the position of the second conveyor relative to the module for the transfer of the substrate is corrected based on the positional deviation.

3. The substrate conveying method according to claim 2, characterized in that, There are multiple second conveying bodies, and the receiving process, the detection process, and the calibration process are performed on each of the second conveying bodies.

4. The substrate conveying method according to any one of claims 1 to 3, characterized in that, The first reference position for the conveyor is the position within the detection unit.

5. The substrate conveying method according to any one of claims 1 to 3, characterized in that, Before the receiving process, a process is performed to obtain first data for positioning the second conveyor at a first reference position for the conveyor.

6. The substrate conveying method according to claim 5, characterized in that, The process of acquiring the first data is the process of detecting the position of the second conveyor body by the detection unit and acquiring the first data based on the detection result of the position.

7. The substrate conveying method according to any one of claims 1 to 3, characterized in that, The receiving process includes the following steps: The position of the second conveyor body is detected using detection equipment; and Based on the detection results of the position of the second conveyor, the path of the second conveyor to the module is changed.

8. A substrate transport method, comprising using a first transport body and a second transport body to transport a substrate, wherein the first transport body and the second transport body are respectively lifted from the bottom of a substrate transport area by magnetic force, and support the substrate and move laterally, the substrate transport method comprising the following steps: The transfer process involves using the first transfer body to move the substrate to a predetermined first reference position for the substrate within the module. The receiving process involves receiving the substrate at a first reference position for the substrate via the second conveyor. as well as In the inspection process, the second conveyor is moved to a predetermined first reference position for the conveyor to transport the substrate to the inspection unit, and the top-view position deviation between the position of the substrate and the predetermined second reference position for the substrate in the inspection unit is detected. The substrate transport area is a region within a vacuum transport module capable of creating a vacuum atmosphere. The module is a processing module that is capable of creating a vacuum atmosphere internally for processing the substrate and is connected to the vacuum conveying module. The conveying process, the receiving process, and the detection process are performed under a vacuum atmosphere within the vacuum conveying module and the processing module. Prior to the conveying process, a process of acquiring second data is included. The second data is used to position the first conveyor at a second reference position for conveying the substrate to a first reference position for conveying the substrate to the substrate in an atmospheric state where the substrate conveying area and the processing module are in an atmospheric state.

9. A substrate conveying device, comprising: The first conveyor and the second conveyor are respectively lifted from the bottom of the substrate conveying area by magnetic force, and support the substrate and move laterally. The module transports the substrate to the substrate transport area via the first transport body and the second transport body. as well as The control unit outputs control signals to perform the following steps: a conveying step, in which the substrate is conveyed to a predetermined first reference position for the substrate in the module by means of the first conveying body; and a receiving step, in which the substrate at the first reference position for the substrate is received by means of the second conveying body. The detection step involves moving the second conveyor to a predetermined first reference position for the conveyor to transport the substrate to the detection unit, and detecting the top-view position deviation between the position of the substrate and the predetermined second reference position for the substrate in the detection unit. The substrate transport area is a region within a vacuum transport module capable of creating a vacuum atmosphere. The module is a processing module that is capable of creating a vacuum atmosphere internally for processing the substrate and is connected to the vacuum conveying module. The conveying step, the receiving step, and the detection step are performed under a vacuum atmosphere within the vacuum conveying module and the processing module. With the processing module set to a vacuum atmosphere, the substrate transport area is changed from an atmospheric atmosphere to a vacuum atmosphere. Next, the control unit outputs a control signal to perform the conveying step, the receiving step, the detection step, and, before performing the receiving step, to acquire first data for positioning the second conveyor at a first reference position for the conveyor, under a vacuum atmosphere within the processing module and the substrate conveying area.

10. A substrate conveying device, comprising: The first conveyor and the second conveyor are respectively lifted from the bottom of the substrate conveying area by magnetic force, and support the substrate and move laterally. The module transports the substrate to the substrate transport area via the first transport body and the second transport body. as well as The control unit outputs control signals to perform the following steps: a conveying step, in which the substrate is conveyed to a predetermined first reference position for the substrate in the module by means of the first conveying body; and a receiving step, in which the substrate at the first reference position for the substrate is received by means of the second conveying body. The detection step involves moving the second conveyor to a predetermined first reference position for the conveyor to transport the substrate to the detection unit, and detecting the top-view position deviation between the position of the substrate and the predetermined second reference position for the substrate in the detection unit. The substrate transport area is a region within a vacuum transport module capable of creating a vacuum atmosphere. The module is a processing module that is capable of creating a vacuum atmosphere internally for processing the substrate and is connected to the vacuum conveying module. The conveying step, the receiving step, and the detection step are performed under a vacuum atmosphere within the vacuum conveying module and the processing module. The control unit outputs a control signal to perform a step of acquiring second data before the transfer step is performed. The second data is used to position the first transfer body at a second reference position for transferring the substrate to a first reference position for the substrate in an atmospheric state where the substrate transfer area and the processing module are in an atmospheric state.

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