Handling method, handling device, dicing machine, readable storage medium, and electronic device

Abstract

This invention discloses a handling method, a handling device, a dicing machine, a readable storage medium, and an electronic device. The handling method is used with a dicing machine, which includes a handling mechanism, a guide rail, and a support platform. The support platform is located below the guide rail. The handling method includes: Step S1, controlling the handling mechanism to adsorb a workpiece on the guide rail and move it upward a preset distance, and monitoring the adsorption force of the handling mechanism on the workpiece in real time during the adsorption and upward movement, wherein the guide rail is in a supporting position for the workpiece; Step S2, controlling the guide rail to switch from the supporting position to an avoidance position; controlling the handling mechanism to move the workpiece downward and place it on the support platform. By optimizing the handling process, the occurrence of workpiece falling and causing damage can be reduced, and the safety of workpiece handling can be improved.

Description

Technical Field

[0001] This invention relates to the field of dicing machine technology, and in particular to a handling method, handling device, dicing machine, readable storage medium, and electronic device. Background Technology

[0002] A dicing machine is a device that uses blades or lasers to cut workpieces with high precision. Taking a wafer as an example, when processing a wafer, it is necessary to perform wafer handling operations. These operations include transferring the wafer from the loading table to the target position on the guide rail, and also moving the wafer from the target position on the guide rail to place it on the carrier table for processing.

[0003] In related technologies, dicing machines are equipped with a transport mechanism, a guide rail, and a carrier platform. The guide rail is located above the carrier platform and can be switched between a support position for supporting the wafer and a clearance position that does not obstruct the wafer's downward movement. In actual operation, when the transport mechanism transports the wafer on the guide rail, it first picks up the workpiece, then switches the guide rail to the clearance position, and then the transport mechanism lowers the wafer onto the carrier platform. During this process, the wafer is prone to falling, and in severe cases, it may be damaged due to falling. Summary of the Invention

[0004] The purpose of this invention is to provide a handling method, a handling mechanism, and a dicing machine. By optimizing the handling process, the occurrence of workpiece falling and causing damage can be reduced, and the safety of workpiece handling can be improved.

[0005] Another object of the present invention is to provide a readable storage medium and an electronic device capable of performing or implementing the aforementioned transport method.

[0006] To address the aforementioned technical problems, embodiments of the present invention provide a handling method for a dicing machine. The dicing machine includes a handling mechanism, a guide rail, and a support platform, wherein the support platform is located below the guide rail. The handling method includes:

[0007] Step S1: Control the conveying mechanism to adsorb the workpiece on the guide rail and move it upward a preset distance, and monitor the adsorption force of the conveying mechanism on the workpiece in real time during the adsorption of the workpiece and the upward movement, wherein the guide rail is in the bearing position supporting the workpiece;

[0008] Step S2: Control the guide rail to switch from the bearing position to the avoidance position; control the conveying mechanism to move the workpiece down and place it on the bearing platform.

[0009] The handling method described above further includes, after step S2:

[0010] Step S3: Control the support platform to adsorb the workpiece, and press the edge of the workpiece by the pressing mechanism on the support platform.

[0011] The handling method described above further includes, after step S3:

[0012] Step S4: Release the suction of the conveying mechanism to the workpiece, and control the conveying mechanism to move upward to the target height position.

[0013] In the handling method described above, the handling mechanism adsorbs the workpiece through an adsorption component, and the support platform adsorbs the workpiece through adsorption holes opened on its surface;

[0014] Step S4 specifically includes: detecting a first pressure in the pipe connected to the adsorption component and a second pressure in the pipe connected to the adsorption hole; when the first pressure is less than a first threshold and the second pressure is greater than a second threshold, controlling the conveying mechanism to move upward to the target height position.

[0015] In the transport method described above, in step S1, if it is detected that the adsorption force of the workpiece does not meet the preset requirement when adsorbing the workpiece, and / or, during the process of moving the workpiece upward, it is detected that the adsorption force of the workpiece does not meet the preset requirement, then the transport mechanism is controlled to stop moving.

[0016] The transport method described above further includes the following steps before step S1:

[0017] Step S0: Control the gripper of the conveying mechanism to move the workpiece from the initial position to the target position on the guide rail.

[0018] In the handling method described above, step S0 includes:

[0019] Step S01: Control the gripper of the conveying mechanism to be in a first state, grip the workpiece from the initial position and move it along a first direction, and place the workpiece at the transition position of the guide rail; wherein, in the first direction, the transition position exceeds the target position of the guide rail;

[0020] Step S02: Control the gripper to be in the second state, and control the conveying mechanism to move in the second direction opposite to the first direction. Push the workpiece back from the transition position to the target position through the determined surface of the gripper in the second state; wherein, when the workpiece is in the target position, the center of the workpiece is directly opposite to the center of the support platform.

[0021] This invention also provides a conveying device for a dicing machine, the dicing machine including a conveying mechanism, a guide rail, and a support platform, the support platform being located below the guide rail, the conveying device comprising:

[0022] The first control module is used to control the conveying mechanism to move upward a preset distance after adsorbing the workpiece on the guide rail; wherein the guide rail is in a bearing position supporting the workpiece;

[0023] The monitoring module is used to monitor the adsorption force of the conveying mechanism on the workpiece in real time when the conveying mechanism adsorbs the workpiece and during the process of moving the workpiece upward;

[0024] The second control module is used to control the guide rail to switch from the bearing position to the avoidance position, and to control the conveying mechanism to move the workpiece down and place it on the bearing platform.

[0025] This invention also provides a dicing machine, including a conveying mechanism, a guide rail, and a support platform, wherein the support platform is located below the guide rail, and the dicing machine further includes the conveying device described above.

[0026] This invention also provides a readable storage medium storing a program or instructions that, when executed by a processor, implement the steps of the transport method described in any of the preceding embodiments.

[0027] This invention also provides an electronic device, including a processor, a memory, and a program or instructions stored in the memory and executable on the processor, wherein the program or instructions, when executed by the processor, implement the steps of the transport method as described in any of the preceding embodiments.

[0028] Compared with existing handling methods, the solution provided by this invention involves using a handling mechanism to adsorb the workpiece on the guide rail. The mechanism is then moved upwards a preset distance to move the workpiece upwards as well. The adsorption force on the workpiece is monitored in real time during both the adsorption and upward movement. After the guide rail is switched to a clearance position, the handling mechanism is then controlled to move the workpiece downwards to the support platform. This avoids directly switching the guide rail state after adsorbing the workpiece, preventing the workpiece from suddenly losing support and falling and being damaged due to the guide rail being removed. The real-time monitoring of the adsorption force during both the adsorption and upward movement ensures that the workpiece is securely adsorbed before the guide rail is removed, reducing the probability of workpiece falling and being damaged, and effectively improving the safety and reliability of workpiece handling.

[0029] The handling device, dicing machine, readable storage medium, and electronic device provided by this invention correspond to the above-described handling method and have the same technical effects, so they will not be described in detail here. Attached Figure Description

[0030] Figure 1 This is a partial structural diagram of the dicing machine provided in the embodiments of the present invention;

[0031] Figure 2This is a schematic diagram illustrating the principle of the conveying method provided by the present invention, which moves the workpiece upward.

[0032] Figure 3 This is a schematic diagram illustrating the principle of transporting a workpiece from its initial position to the target position on the guide rail in the handling method provided by the present invention.

[0033] Figure 4 This is a schematic diagram of the gripper structure of the conveying mechanism in a specific embodiment;

[0034] Figure 5 This is a flowchart of one embodiment of the handling method provided by the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] The conveying mechanism 10, gripper 11, clamping plate 111, mounting base 112, determining surface 1121, and adsorption assembly 12 are included.

[0037] Guide rail 20, first guide rail 21, second guide rail 22;

[0038] Support platform 30, loading platform 40, workpiece box 41, workpiece 411, flat part 4111;

[0039] Target position A, initial position A1, transition position A2, first direction D1, second direction D2. Detailed Implementation

[0040] In existing dicing machines, when transporting workpieces from the guide rail to the support platform below it, the transport mechanism picks up the workpiece from the guide rail and then immediately moves the guide rail aside to allow the transport mechanism to place the workpiece directly onto the support platform. Research has shown that when the workpiece is picked up by the transport mechanism while supported by the guide rail, and then the guide rail is immediately moved away, the workpiece is highly susceptible to falling and damage due to the sudden loss of support and unstable suction force. To address this issue, this paper proposes an improved and optimized workpiece transport method to reduce the risk of workpiece falling and being damaged.

[0041] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] Please refer to Figure 1 , Figure 2 and Figure 5 , Figure 1 This is a partial structural diagram of the dicing machine provided in the embodiments of the present invention; Figure 2 This is a schematic diagram illustrating the principle of the conveying method provided by the present invention, which moves the workpiece upward. Figure 5 This is a flowchart of one embodiment of the handling method provided by the present invention.

[0043] This invention provides a material handling method applied to a dicing machine. A partial structure of the dicing machine can be found here. Figure 1 It is understood that the dicing machine includes a conveying mechanism 10, a guide rail 20, and a support platform 30; the support platform 30 is located below the guide rail 20 and is used to support the workpiece 411 to facilitate the processing of the workpiece 411; the guide rail 20 is used to assist in supporting the workpiece 411 during the conveying process; the conveying mechanism 10 can move under the control of a program or instruction to transfer the workpiece 411.

[0044] In this embodiment, the handling method includes:

[0045] Step S1: After the control conveying mechanism 10 adsorbs the workpiece 411 on the guide rail 20, it moves upward a preset distance h, and the adsorption force of the conveying mechanism 10 adsorbing the workpiece 411 is monitored in real time during the adsorption of the workpiece 411 and during the upward movement; wherein, the guide rail 20 is in the bearing position supporting the workpiece 411.

[0046] Step S2: Control the guide rail 20 to switch from the bearing position to the avoidance position, and control the conveying mechanism 10 to move the workpiece 411 down and place it on the bearing platform 30.

[0047] in, Figure 2 The solid line box indicates the state of workpiece 411 on guide rail 20, and the dashed line box indicates the position of workpiece 411 after it is moved up h by the conveying mechanism 10.

[0048] In a specific application, when the guide rail 20 is in the bearing position, it is used to support the workpiece 411. At this time, due to the presence of the guide rail 20, the workpiece 411 cannot move directly down to the bearing platform 30. After the guide rail 20 is switched to the clearance position, the guide rail 20 will not interfere with or obstruct the workpiece 411 in the space where the workpiece 411 moves down to the bearing platform 30, so that the workpiece 411 can be placed smoothly on the bearing platform 30.

[0049] In a specific application, in step S1, the workpiece 411 is positioned on the guide rail 20 directly opposite the support platform 30. In this way, in step S2, the conveying mechanism 10 can directly move the workpiece 411 down to the support platform 30, ensuring that the center of the workpiece 411 coincides with the center of the support platform 30, thus guaranteeing the accuracy and effect of processing the workpiece 411.

[0050] Combination Figure 3As shown, in practical applications, guide rail 20 includes a first guide rail 21 and a second guide rail 22, which are arranged in parallel. Specifically, in the bearing position, the distance between the first guide rail 21 and the second guide rail 22 is less than the outer diameter of the workpiece 411, as indicated by the solid lines in the figure, allowing the workpiece 411 to be supported by the upper surfaces of the first guide rail 21 and the second guide rail 22. In the avoidance position, the distance between the first guide rail 21 and the second guide rail 22 is greater than the outer diameter of the workpiece 411, as indicated by the dashed lines in the figure, ensuring that the workpiece 411 is not interfered with or obstructed during its descent to the support platform 30. Thus, guide rail 20 switches positions by changing the distance between the first guide rail 21 and the second guide rail 22.

[0051] The above-mentioned handling method first controls the handling mechanism 10 to adsorb the workpiece 411 on the guide rail 20, and then moves the workpiece 411 upward by a preset distance h. Then, the guide rail 20 is switched from the bearing position to the avoidance position, and the handling mechanism 10 is controlled to move the workpiece 411 downward and place it on the bearing platform 30. In this way, the state of the guide rail 20 is not switched directly after adsorbing the workpiece 411, and the situation of the workpiece 411 suddenly losing its support and falling and being damaged due to the removal of the guide rail 20 is avoided. This solution also monitors the adsorption force on the workpiece 411 in real time during the adsorption of the workpiece 411 and during the upward movement of the workpiece 411, which can ensure that the workpiece 411 is firmly adsorbed before the guide rail 20 is removed, reducing the probability of the workpiece 411 falling and being damaged, and effectively improving the safety and reliability of handling the workpiece 411.

[0052] In specific applications, in step S1, if the conveying mechanism 10 detects that the adsorption force of the workpiece 411 does not meet the preset requirements when adsorbing the workpiece 411, and / or, during the process of moving the workpiece 411 upward, the conveying mechanism 10 is controlled to stop operating. That is, during the process of controlling the conveying mechanism 10 to adsorb the workpiece 411, and / or during the process of controlling the conveying mechanism 10 to move the workpiece 411 upward, the adsorption force of the conveying mechanism 10 on the workpiece 411 is detected. If the adsorption force does not meet the preset requirements, it is considered that the conveying mechanism 10 cannot firmly adsorb the workpiece 411, or that the workpiece 411 has fallen, and the operation of the conveying mechanism 10 should be paused to avoid greater losses.

[0053] Furthermore, after the control conveying mechanism 10 stops operating, an alarm signal can be issued to notify the staff so that they can handle the situation promptly.

[0054] In one possible implementation, the conveying mechanism 10 includes an adsorption component 12, which may be equipped with at least one suction cup to adsorb the workpiece 411. Generally, the suction cup is connected to a vacuum pump through a pipeline, and the adsorption force of the workpiece 411 is generated by drawing a vacuum. The above-mentioned real-time monitoring of the adsorption force of the workpiece 411 can be achieved by monitoring the vacuum degree or pressure of the pipeline connected to the adsorption component 12.

[0055] The specific number of suction cups in the adsorption component 12 can be set according to actual needs such as the size of the workpiece 411.

[0056] In one possible implementation, the transport method further includes, after the aforementioned step S2:

[0057] Step S3: Control the support platform 30 to adsorb the workpiece 411, and press the edge of the workpiece 411 by the pressing mechanism on the support platform 30.

[0058] In specific applications, the surface of the workpiece 411 on the support table 30 has adsorption holes, which can adsorb the workpiece 411 through the adsorption holes and use the clamping mechanism to press the edge of the workpiece 411 to firmly fix the workpiece 411 on the support table 30, so as to avoid the workpiece 411 from shifting during the processing of the workpiece 411 and affecting the processing accuracy.

[0059] Similarly, the adsorption holes of the support platform 30 can also be connected to a vacuum pump through a pipeline to generate the adsorption force of the workpiece 411 by drawing a vacuum.

[0060] The clamping mechanism can be a spring plate or similar structure. To ensure the firmness of the workpiece 411, multiple clamping mechanisms can be set and arranged at intervals along the circumference of the support platform 30.

[0061] In one possible implementation, the transport method further includes, after the aforementioned step S3:

[0062] Step S4: Release the suction of the conveying mechanism 10 to the workpiece 411, and control the conveying mechanism 10 to move upward to the target height position.

[0063] In this way, after the control conveying mechanism 10 moves the workpiece 411 down and places it on the support table 30, the workpiece 411 is first fixed on the support table 30 by the suction hole and the clamping mechanism. Only then is the suction of the conveying mechanism 10 on the workpiece 411 released. This ensures that the relative position of the workpiece 411 and the support table 30 is stable before the conveying mechanism 10 is removed. This avoids the problem of the workpiece 411 being carried off course due to the suction force of the conveying mechanism 10 being released before the position of the workpiece 411 is fixed. This ensures the accuracy of the position of the workpiece 411 on the support table 30, thereby ensuring the subsequent processing effect of the workpiece 411.

[0064] In one possible implementation, during step S4, as the adsorption force of the conveying mechanism 10 on the workpiece 411 is released to separate the adsorption component 12 from the workpiece 411, a first pressure in the pipeline connected to the adsorption component 12 and a second pressure in the pipeline connected to the adsorption hole of the support platform 30 are detected. The conveying mechanism 10 is only controlled to move upward when the first pressure is less than a first threshold and the second pressure is greater than the second threshold. This ensures that the handover is performed with sufficient adsorption force on the workpiece 411, preventing the conveying mechanism 10 from operating when the adsorption force of the support platform 30 on the workpiece 411 is insufficient or too large. This effectively reduces the possibility of the workpiece 411 falling and being damaged during the handover process due to the movement of the conveying mechanism 10.

[0065] The specific values ​​of the first and second thresholds can be set according to actual needs, and are not limited here.

[0066] See again Figure 3 In one possible implementation, the transport method further includes, prior to the aforementioned step S1:

[0067] Step S0: Control the gripper 11 of the conveying mechanism 10 to move the workpiece 411 from the initial position A1 to the target position A of the guide rail 20.

[0068] When the workpiece 411 is at the target position A of the guide rail 20, its center is directly opposite the center of the support platform 30 below the guide rail 20. This makes it convenient for the workpiece 411 to be placed on the support platform 30 in subsequent steps S1 and S2, so that the centers of the two coincide and the workpiece 411 position is not corrected again.

[0069] The initial position A1 can be the loading table 40 of the dicing machine. Generally, a workpiece box 41 is placed on the loading table 40, and a workpiece 411 is placed inside the workpiece box 41.

[0070] In specific applications, step S0 includes:

[0071] Step S01: Control the gripper 11 of the conveying mechanism 10 to be in the first state, grip the workpiece 411 from the initial position A1 and move it along the first direction D1, and place the workpiece 411 in the transition position A2 of the guide rail 20; wherein, in the first direction D1, the transition position A2 exceeds the target position A of the guide rail 20.

[0072] Step S02: Control the gripper 11 to be in the second state, and control the conveying mechanism 10 to move along the second direction D2, which is opposite to the first direction D1. The workpiece 411 is pushed back from the transition position A2 to the target position A by the determining surface 1121 of the gripper 11 in the second state; wherein, when the workpiece 411 is in the target position A, the center of the workpiece 411 is directly opposite to the center of the support table 30.

[0073] by Figure 3 The orientation shown here, the first direction D1 refers to the direction from left to right; here, in the first direction D1, the transition position A2 exceeds the target position A of the guide rail 20, which means that when the conveying mechanism 10 drives the workpiece 411 to move along the first direction D1, it passes through the target position A and continues to move a certain distance to reach the transition position A2. In other words, the transition position A2 is far away from the initial position A1 relative to the target position A.

[0074] It is understandable that the guide rail 20 is in a bearing position during this process, so that the workpiece 411 can be placed on the guide rail 20 by the gripper 11.

[0075] In specific applications, during the process of the conveying mechanism 10 moving the workpiece 411 along the first direction D1, the workpiece 411 can slide along the upper surface of the guide rail 20. Under the dual action of gripping by the gripper 11 and supporting by the guide rail 20, the probability of losing the workpiece 411 can be reduced.

[0076] The method described above for transporting workpiece 411 from initial position A1 to target position A of guide rail 20 first controls the transport mechanism 10 to move workpiece 411 to transition position A2 beyond target position A, and then uses the determining surface 1121 of the gripper 11 of transport mechanism 20 to push workpiece 411 back to target position A. The gripper 11 has a determining surface 1121 in the second state, and the position of the determining surface 1121 can be accurately known. By contacting the edge of workpiece 411 with the determining surface 1121 and pushing workpiece 411 to move, the accuracy of the position movement of workpiece 411 can be ensured, thereby accurately moving workpiece 411 to target position A, so that the center of workpiece 411 at target position A is aligned with the center of support table 30. When workpiece 411 is subsequently transferred from below to support table 30, the accuracy of the position of workpiece 411 on support table 30 can be guaranteed, providing a basis for ensuring the machining accuracy of workpiece 411 in the future.

[0077] Please refer to the above. Figure 4 In specific applications, the gripper 11 includes two clamping plates 111 and a mounting base 112. The mounting base 112 connects the first ends of the two clamping plates 111 to... Figure 3 As shown, the mounting base 112 is connected to the right end of the clamping plate 111, so that the second end of the two clamping plates 111 opposite to the first end has an open structure, through which the workpiece 411 can be clamped.

[0078] Specifically, when the gripper 11 is in the aforementioned first state, the two clamping plates 111 are in a clamped state, which can clamp the workpiece 411. That is, the edge of the workpiece 411 is located between the two clamping plates 111, and the two clamping plates 111 are in contact with the upper and lower surfaces of the workpiece 411 respectively to hold the workpiece 411. When the gripper 11 is in the aforementioned second state, the two clamping plates 111 are in an open state. At this time, although the edge of the workpiece 411 can still be located between the two clamping plates 111, the clamping plates 111 will not contact the workpiece 411 because the clamping plates 111 are open, and the workpiece 411 cannot be clamped. In the second state, the gripper 11 can control the relative position between the gripper 11 and the workpiece 411 so that the edge of the workpiece 411 abuts against the mounting base 112. Even if the mounting base 112 contacts the peripheral wall of the workpiece 411, when the material handling mechanism 10 is controlled to move along the second direction D2, the mounting base 112 pushes the workpiece 411 to move along the guide rail 20.

[0079] Among them, the surface of the mounting base 112 of the gripper 11 facing the second end of the clamping plate 111 is the determining surface 1121 for pushing the workpiece 411.

[0080] Combination Figure 3 and Figure 4 Specifically, the peripheral wall of workpiece 411 has a flat portion 4111. When the gripper 11 grips workpiece 411, it grips the position of the flat portion 4111. Correspondingly, in the second state, the defining surface 1121 of the mounting base 112 of the gripper 11 abuts against the flat portion 4111. Figure 3 As shown, the defining surface 1121 of the mounting base 112 includes surface portions located on both sides of the clamping plate 111.

[0081] In specific applications, there is a calibration relationship between the determining surface 1121 of the gripper 11 and the target position A of the guide rail 20. In the aforementioned step S02, the distance between the determining surface 1121 and the target position A is obtained to determine whether the workpiece 411 has moved to the target position A.

[0082] Specifically, the relative positions of the guide rail 20 and the support table 30 of the dicing machine are determined, and the target position A on the guide rail 20 directly opposite the support table 30 is also determined. By controlling the drive unit (such as a motor screw drive structure) that drives the material handling mechanism 10 to move, the position of the material handling mechanism 10 can be accurately determined. Correspondingly, the determining surface 1121 of the gripper 11 of the material handling mechanism 10 can also be accurately determined. Thus, the distance between the determining surface 1121 of the gripper 11 and the target position A can be known. Combined with the size of the workpiece 411, the distance between the center of the workpiece 411 and the target position A can be determined, that is, the horizontal distance L between the center of the workpiece 411 and the center of the support table 30. Thus, the relative distance between the determining surface 1121 of the gripper 11 and the target position A when the workpiece 411 is pushed to the target position A can be calibrated. Then, the distance between the determining surface 1121 of the gripper 11 and the target position A can be used to determine whether the workpiece 411 has moved to the target position.

[0083] In each of the above implementation methods, the workpiece 411 can be a wafer or other workpiece to be processed.

[0084] In addition to the above-described handling method, this embodiment of the invention also provides a handling device for a dicing machine. The structure of the dicing machine is the same as described above. The handling device includes:

[0085] The first control module is used to control the conveying mechanism 10 to move upward a preset distance after adsorbing the workpiece 411 on the guide rail 20; wherein the guide rail 20 is in the bearing position supporting the workpiece 411.

[0086] The monitoring module is used to monitor the adsorption force of the workpiece 411 by the conveying mechanism 10 in real time when the conveying mechanism 10 adsorbs the workpiece 411 and during the process of moving the workpiece 411 upward.

[0087] The second control module is used to control the guide rail 20 to switch from the bearing position to the avoidance position, and to control the conveying mechanism 10 to move the workpiece 411 down and place it on the bearing platform 30.

[0088] In one possible implementation, the conveying device further includes a third control module for controlling the support platform 30 to adsorb the workpiece 411 and controlling the clamping mechanism on the support platform 30 to clamp the edge of the workpiece.

[0089] In one possible implementation, the aforementioned first control module is also used to release the suction force of the conveying mechanism 10 on the workpiece 411 and control the conveying mechanism 10 to move from the position where the workpiece 411 is placed on the support platform 30 to the target height position.

[0090] The working process of this conveying device corresponds to the aforementioned conveying method, and will not be described again here.

[0091] This invention also provides a dicing machine, which includes a conveying mechanism 10, a guide rail 20, and a support platform 30. It may also include a loading platform 40. The structure and operation of these components are as described above and will not be repeated here. The dicing machine also includes the aforementioned conveying device, which can safely and reliably convey the workpiece 411 from the guide rail 20 to the support platform 30 using the aforementioned material handling method. The specific process corresponds to the aforementioned material handling method and will not be described again here.

[0092] This invention also provides a readable storage medium storing a program or instructions that, when executed by a processor, can implement the steps of the aforementioned transfer method.

[0093] This invention also provides an electronic device, including a processor and a memory, wherein the memory stores a program or instructions that can run on the processor, and the program or instructions, when executed by the processor, can implement the steps of the aforementioned transport method.

[0094] The foregoing has provided a detailed description of the material handling method, material handling device, dicing machine, readable storage medium, and electronic device provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A handling method for a dicing machine, the dicing machine comprising a handling mechanism, a guide rail, and a support platform, the support platform being located below the guide rail, characterized in that, The transport method includes: Step S1: Control the conveying mechanism to adsorb the workpiece on the guide rail and move it upward a preset distance. During the adsorption of the workpiece and the upward movement, monitor the adsorption force of the conveying mechanism on the workpiece in real time. The guide rail is in the bearing position supporting the workpiece, and the workpiece is in the position on the guide rail directly opposite the bearing platform. Step S2: Control the guide rail to switch from the bearing position to the avoidance position; control the conveying mechanism to move the workpiece down and place it on the bearing platform; The procedure preceding step S1 also includes: Step S0: Control the gripper of the conveying mechanism to move the workpiece from the initial position to the target position on the guide rail; Step S0 includes: Step S01: Control the gripper of the conveying mechanism to be in a first state, grip the workpiece from the initial position and move it along a first direction, and place the workpiece at the transition position of the guide rail; wherein, in the first direction, the transition position exceeds the target position of the guide rail; Step S02: Control the gripper to be in the second state, and control the conveying mechanism to move in the second direction opposite to the first direction. Push the workpiece back from the transition position to the target position through the defined surface of the gripper in the second state; wherein, when the workpiece is in the target position, the center of the workpiece is directly opposite to the center of the support platform.

2. The handling method according to claim 1, characterized in that, Following step S2, the following is also included: Step S3: Control the support platform to adsorb the workpiece, and press the edge of the workpiece by the pressing mechanism on the support platform.

3. The handling method according to claim 2, characterized in that, The step S3 is followed by: Step S4: Release the suction of the conveying mechanism to the workpiece, and control the conveying mechanism to move upward to the target height position.

4. The handling method according to claim 3, characterized in that, The conveying mechanism adsorbs the workpiece through an adsorption component, and the support platform adsorbs the workpiece through adsorption holes on its surface. Step S4 specifically includes: detecting a first pressure in the pipe connected to the adsorption component and a second pressure in the pipe connected to the adsorption hole; when the first pressure is less than a first threshold and the second pressure is greater than a second threshold, controlling the conveying mechanism to move upward to the target height position.

5. The handling method according to any one of claims 1-4, characterized in that, In step S1, if the adsorption force of the workpiece is not detected to meet the preset requirement when adsorbing the workpiece, and / or if the adsorption force of the workpiece is not detected to meet the preset requirement when moving the workpiece upward, then the conveying mechanism is controlled to stop moving.

6. A conveying device for a dicing machine, the dicing machine comprising a conveying mechanism, a guide rail, and a support platform, the support platform being located below the guide rail, characterized in that, The conveying device conveys the workpiece using the conveying method described in claim 1, and the conveying device includes: The first control module is used to control the conveying mechanism to move upward a preset distance after adsorbing the workpiece on the guide rail; wherein the guide rail is in a bearing position supporting the workpiece; The monitoring module is used to monitor the adsorption force of the conveying mechanism on the workpiece in real time when the conveying mechanism adsorbs the workpiece and during the process of moving the workpiece upward; The second control module is used to control the guide rail to switch from the bearing position to the avoidance position, and to control the conveying mechanism to move the workpiece down and place it on the bearing platform.

7. A dicing machine, comprising a conveying mechanism, a guide rail, and a support platform, wherein the support platform is located below the guide rail, characterized in that, The dicing machine also includes the conveying device as described in claim 6.

8. A readable storage medium, characterized in that, The readable storage medium stores a program or instructions that, when executed by a processor, implement the steps of the transport method as described in any one of claims 1-5.

9. An electronic device, characterized in that, It includes a processor, a memory, and a program or instructions stored in the memory and executable on the processor, wherein the program or instructions, when executed by the processor, implement the steps of the transport method as described in any one of claims 1-5.

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