A circuit board mounted component connection strength detection device and detection method

Abstract

The application relates to a circuit board component mounting strength detection device and detection method, which comprises a base, a mounting plate parallel to the base, a bidirectional driving assembly arranged on the mounting plate and connected with two clamping pieces arranged on the mounting plate, the bidirectional driving assembly can drive the two clamping pieces to move close to each other, a pressing mechanism arranged on the base, the pressing mechanism comprising a power assembly and an adjusting assembly, the power assembly is provided with an abutting roller, the power assembly can drive the abutting roller to make a circular motion, the adjusting assembly changes the radius of the circular motion of the abutting roller when the bidirectional driving assembly is in action, a follow-up mechanism arranged on the mounting plate, the follow-up mechanism is connected with the clamping pieces, the follow-up mechanism comprises a follow-up assembly and a driving assembly, the driving assembly is provided with a receiving piece, when the circuit board is bent, the driving assembly can drive the two clamping pieces to further move close to each other through the follow-up assembly, the circuit board is bent, and the conductivity of the circuit board is detected.

Description

Technical Field

[0001] This invention relates to the field of circuit board testing, specifically to a device and method for testing the connection strength of mounted components on a circuit board. Background Technology

[0002] Circuit board mounting is a process in reflow soldering. Reflow soldering is mainly used for soldering various surface mount components. The solder used in this soldering technology is solder paste, which is dried, preheated, melted, wetted, and cooled to solder the components onto the printed circuit board.

[0003] After components are soldered onto a circuit board, the board needs to be assembled. During assembly, the circuit board is subjected to compression and strain due to assembly process issues. Since component solder joints are highly sensitive to strain failure, the strain characteristics of the circuit board under the worst conditions are crucial. Excessive strain can lead to various failure modes depending on the solder alloy, package type, surface treatment, or laminate material. These failures include solder ball cracking, circuit damage, laminate-related adhesive or cohesive failures, and package substrate cracking.

[0004] Therefore, after components are mounted on the circuit board, the connection strength of the components needs to be tested. However, since circuit boards of different lengths have different strain resistance, shorter circuit boards have stronger strain resistance and longer circuit boards have stronger strain resistance, in order to make the test results more consistent with the installation conditions, the testing equipment needs to be adjusted accordingly during the test, which affects the testing speed. Summary of the Invention

[0005] The purpose of this invention is to provide a device and method for testing the connection strength of mounted components on a circuit board, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A circuit board mounting component connection strength testing device includes:

[0008] A base, on which a mounting plate parallel to the base is provided, and on which a testing device is provided;

[0009] A bidirectional drive assembly is disposed on the mounting plate and connected to two clamping members disposed on the mounting plate. The bidirectional drive assembly can drive the two clamping members to move closer to each other to clamp the circuit board.

[0010] A pressure-applying mechanism is provided on the base. The pressure-applying mechanism includes a power component and an adjustment component that is linked to the bidirectional drive component. An abutment roller is installed on the power component, and the power component can drive the abutment roller to make a circular motion to act on the circuit board and bend the circuit board. The adjustment component changes the radius of the circular motion of the abutment roller when the bidirectional drive component is activated.

[0011] A follower mechanism is disposed on the mounting plate. The follower mechanism includes a follower component and a drive component. The follower component is connected to the clamping member and includes a follower component and a drive component. The drive component is equipped with a support member that can support the circuit board. When the circuit board is bent, the drive component can drive the two clamping members to move closer to each other through the follower component.

[0012] As a further embodiment of the present invention: two sets of guide grooves are symmetrically arranged on the mounting plate, each set of guide grooves includes two parallel sliding grooves, and a slider is slidably installed on each of the four sliding grooves.

[0013] The bidirectional drive assembly includes a bidirectional lead screw rotatably mounted on the mounting plate. Two threaded sleeves are symmetrically arranged on the bidirectional lead screw and threadedly connected thereto. Two crossbars are symmetrically connected to the threaded sleeves. A hinge rod is rotatably mounted on the crossbar. The end of the hinge rod away from the crossbar is connected to the first slider.

[0014] As a further embodiment of the present invention: a vertical plate is also fixedly installed on the base;

[0015] The power assembly includes a drive device fixedly mounted on the upright plate. The output shaft of the drive device passes through the upright plate and is connected to a rotating rod. At least two sets of fixed plates are equidistantly arranged on the rotating rod. A telescopic plate is sleeved on the fixed plate. The end of the telescopic plate away from the rotating rod is rotatably connected to the abutment roller.

[0016] As a further embodiment of the present invention: the adjustment component includes a fitting groove arranged along the length direction of the rotating rod, a telescopic member is slidably installed in the fitting groove, a plurality of parallel pull rods are rotatably installed on the telescopic member, and the end of the pull rod away from the telescopic member is rotatably connected to the telescopic plate;

[0017] The telescopic component is fixedly connected to a connecting shaft that is slidably sleeved on a rotating rod at one end near the upright plate. An annular groove is provided on the connecting shaft, and a collar is rotatably installed in the annular groove.

[0018] The adjustment assembly also includes a traction kit connecting the collar to one of the threaded sleeves.

[0019] As a further embodiment of the present invention: the traction kit includes a second sliding groove formed on the upright plate, a fourth slider is slidably installed in the second sliding groove, a connecting rod is rotatably installed on the fourth slider, and the end of the connecting rod away from the fourth slider is rotatably connected to the collar.

[0020] A connecting plate is also fixedly installed on the fourth slider. A support rod is rotatably installed on the end of the connecting plate away from the fourth slider. The support rod is rotatably connected to a follower rod that passes through the vertical plate and is connected to the threaded sleeve.

[0021] As a further embodiment of the present invention: the follower component includes a third slider that is slidably disposed in the first slide groove, a guide is fixedly installed at the bottom of the third slider, a second slider is slidably installed in the guide, and a roller is connected between the two second sliders on the same side, the roller can slide in the horizontal groove formed on the receiving member;

[0022] The follower assembly also includes an elastic structure disposed on the third slider, the elastic structure being connected to a side plate fixed on the first slider.

[0023] As a further embodiment of the present invention: the elastic structure includes a column fixedly installed on the third slider, one end of the column away from the third slider passes through the side plate and is connected to the clamping member, and a spring is also sleeved on the column, one end of the spring is connected to the end of the column, and the other end is connected to the side plate.

[0024] As a further embodiment of the present invention: the driving assembly includes a pulley rotatably mounted on the side of the second slider away from the roller and a driving plate fixedly mounted on the first slider. The driving plate has an inclined groove, and the pulley can roll in the inclined groove.

[0025] A method for testing the connection strength of mounted components on a circuit board using the aforementioned testing device includes the following steps:

[0026] Step 1: Align the length direction of the circuit board to be tested with the length direction of the receiving component, place the circuit board to be tested on the receiving component, and then manually drive the bidirectional drive component to move the two clamping components closer to each other to clamp the circuit board to be tested. Finally, connect the circuit board to be tested to the testing equipment through wires.

[0027] Step 2: During the operation of the bidirectional drive component, the radius of the abutment roller during its circular motion can be changed by adjusting the component. After the clamping component completes the clamping of the circuit board to be tested, the radius of the abutment roller during its circular motion remains unchanged.

[0028] Step 3: Control the power unit to drive the contact roller in a circular motion. When the contact roller rotates to the bottom, it contacts the circuit board to be tested. As the contact roller continues to rotate, the circuit board to be tested bends. When the contact roller reaches the bottom position, control the power unit to stop and let it stand for 10-15 minutes. Then control the power unit to continue to operate so that the contact roller returns to its original position.

[0029] Step 4: When the circuit board to be tested bends, the receiving part moves downward, and under the action of the follower mechanism, the two clamping parts are driven to move closer to each other to maintain their clamping of the circuit board to be tested when it bends.

[0030] Step 5: The testing equipment tests the conductivity of the circuit board before and after bending to check whether the soldering at the pins of the mounted components on the circuit board still has a stable connection after bending. Finally, the connection strength of the mounted components on the circuit board is tested.

[0031] Compared with the prior art, the beneficial effects of the present invention are:

[0032] By using a bidirectional drive component and a pressure mechanism with linkage, when the length of the clamped circuit board is short, the radius of the circular motion of the abutment roller is small, so that the abutment roller acts on the circuit board and causes the circuit board to bend and deform less. Conversely, when the length of the abutment roller is long, the abutment roller acts on the circuit board and causes the circuit board to bend and deform more. This makes the test process more consistent with the actual installation scenario of the circuit board. Moreover, the movement stroke of the clamping component and the radius of the circular motion of the abutment roller are realized through mechanical interlocking, avoiding relatively complex software adjustment.

[0033] The bidirectional drive component ensures the stability of the circuit board clamping. On the other hand, after the circuit board is placed on the receiving component, when the two clamping components move closer to each other, the circuit board can be driven to move towards the center of the mounting plate, so that the two clamping components have a certain positioning effect on the circuit board. During the detection process, the abutment roller will act on the center of the circuit board so that the circuit board is symmetrical on both sides when it bends.

[0034] By using a follow-up mechanism, the clamping component can maintain its grip on the circuit board even when the board bends and its ends collapse, thus preventing the board from separating from the clamping component due to the bending of the board causing its sides to shorten. Attached Figure Description

[0035] Figure 1 A schematic diagram of one embodiment of a device for testing the connection strength of mounted components on a circuit board.

[0036] Figure 2A schematic diagram of the structure of a circuit board mounting component connection strength testing device from another angle in one embodiment.

[0037] Figure 3 A schematic diagram of the structure after removing the base in one embodiment of the device for testing the connection strength of mounted components on a circuit board.

[0038] Figure 4 for Figure 3 A magnified schematic diagram of the structure at point A in the middle.

[0039] Figure 5 An exploded view of the drive component in one embodiment of a device for testing the connection strength of mounted components on a circuit board.

[0040] Figure 6 A schematic diagram of the bidirectional drive assembly in one embodiment of a device for testing the connection strength of mounted components on a circuit board.

[0041] Figure 7 A schematic diagram of the pressure application mechanism in one embodiment of a device for testing the connection strength of mounted components on a circuit board.

[0042] Figure 8 A schematic diagram of the pressure application mechanism from another angle in one embodiment of a device for testing the connection strength of components mounted on a circuit board.

[0043] Figure 9 A partial exploded view of the adjustment component in one embodiment of a device for testing the connection strength of mounted components on a circuit board.

[0044] In the diagram: 1. Base; 2. Mounting plate; 3. No. 1 slide groove; 4. No. 1 slider; 5. Side plate; 6. Hinge rod; 7. Crossbar; 8. Threaded sleeve; 9. Double-acting screw; 10. Protrusion; 11. Receiving component; 12. Horizontal groove; 13. Roller; 14. No. 2 slider; 15. Guide component; 16. Pulley; 17. No. 3 slider; 18. Drive plate; 19. Column; 20. Spring; 21. Clamping component; 22. Follower rod; 23. Support rod; 24. Connecting plate; 25. No. 2 slide groove; 26. No. 4 slider; 27. Connecting rod; 28. Collar; 29. ​​Connecting shaft; 30. Pull rod; 31. Fixing plate; 32. Telescopic plate; 33. Abutment roller; 34. Drive device; 35. Rotating rod; 36. Fitting groove; 37. Vertical plate; 38. Telescopic component; 39. Testing equipment. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] Furthermore, elements in this invention are referred to as being "fixed to" or "set on" another element, which may be directly on the other element or may also include an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or may also include an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0047] Please see Figures 1-9 In this embodiment of the invention, a circuit board mounting component connection strength detection device includes: a base 1, a bidirectional drive assembly, a pressure application mechanism, and a follow-up mechanism.

[0048] The base 1 is provided with a mounting plate 2 parallel to it, and the base 1 is provided with a detection device 39;

[0049] The bidirectional drive assembly is disposed on the mounting plate 2 and connected to two clamping members 21 disposed on the mounting plate 2. The bidirectional drive assembly can drive the two clamping members 21 to move closer to each other to clamp the circuit board.

[0050] The mounting plate 2 is symmetrically provided with two sets of guide grooves. Each set of guide grooves includes two parallel sliding grooves 3. A slider 4 is slidably installed on each of the four sliding grooves 3.

[0051] The bidirectional drive assembly includes a bidirectional lead screw 9 rotatably mounted on the mounting plate 2. Two threaded sleeves 8 are symmetrically arranged on the bidirectional lead screw 9 and threadedly connected thereto. Two crossbars 7 are symmetrically connected to the threaded sleeves 8. A hinge rod 6 is rotatably mounted on the crossbar 7. The end of the hinge rod 6 away from the crossbar 7 is connected to the first slider 4.

[0052] The threaded sleeve 8 is fixed with a protrusion 10, which slides in conjunction with a guide groove provided on the mounting plate 2.

[0053] In use, the circuit board to be tested is placed on the receiving part 11. At the same time, the two threaded sleeves 8 set on the two-way lead screw 9 are manually rotated to move the two threaded sleeves 8 closer to each other or further away from each other. Specifically, when the two threaded sleeves 8 move closer to each other, the crossbars 7 on the two threaded sleeves 8 pull the first slider 4 through the hinge rod 6 to move the first slider 4 along the length direction of the first slide groove 3, so that the two clamping parts 21 placed on the mounting plate 2 move closer to each other and, after abutting against the circuit board, complete the clamping of the circuit board.

[0054] With the above settings, on the one hand, since the bidirectional lead screw 9 and the threaded sleeve 8 are connected by threads, and the threaded connection has self-locking properties, the position of the threaded sleeve 8 on the bidirectional lead screw 9 will not change when the clamping member 21 abuts against the circuit board and the external force is removed. At this time, the positions of the four first sliders 4 will also be fixed, driving the two clamping members 21 to be fixed in position, thereby ensuring the stability of the circuit board clamping. On the other hand, after the circuit board is placed on the receiving member 11, the position of the circuit board is not accurate enough, that is, there is a difference between the center position of the circuit board and the center position of the mounting plate 2. When the two clamping members 21 move closer to each other, they can drive the circuit board to move towards the center position of the mounting plate 2. That is, the two clamping members 21 have a certain positioning effect on the circuit board, so that during the detection process, the abutment roller 33 will act on the center position of the circuit board, so that the circuit board is symmetrical on both sides when it bends.

[0055] Please see Figure 1 , Figure 2 , Figure 7 , Figure 8 , Figure 9 The pressure applying mechanism is disposed on the base 1. The pressure applying mechanism includes a power component and an adjusting component that is linked to the bidirectional drive component. The power component is equipped with an abutting roller 33, and the power component can drive the abutting roller 33 to perform circumferential motion to act on the circuit board and bend the circuit board. The adjusting component changes the radius of the circumferential motion of the abutting roller 33 when the bidirectional drive component is activated.

[0056] A vertical plate 37 is also fixedly installed on the base 1. The power assembly includes a drive device 34 fixedly installed on the vertical plate 37. The output shaft of the drive device 34 passes through the vertical plate 37 and is connected to a rotating rod 35. At least two sets of fixing plates 31 are equidistantly arranged on the rotating rod 35. A telescopic plate 32 is sleeved on the fixing plate 31. The end of the telescopic plate 32 away from the rotating rod 35 is rotatably connected to the abutting roller 33.

[0057] The adjustment assembly includes a fitting groove 36 arranged along the length of the rotating rod 35, a telescopic member 38 is slidably installed in the fitting groove 36, and a plurality of parallel pull rods 30 are rotatably installed on the telescopic member 38, with the end of the pull rod 30 away from the telescopic member 38 rotatably connected to the telescopic plate 32.

[0058] The telescopic member 38 is fixedly connected to a connecting shaft 29 that is slidably sleeved on the rotating rod 35 at one end near the upright plate 37. The connecting shaft 29 has an annular groove, and a collar 28 is rotatably installed in the annular groove.

[0059] The adjustment assembly also includes a traction kit connecting the collar 28 and one of the threaded sleeves 8. The traction kit includes a second slide groove 25 formed on the vertical plate 37. A fourth slider 26 is slidably installed in the second slide groove 25. A connecting rod 27 is rotatably installed on the fourth slider 26. The end of the connecting rod 27 away from the fourth slider 26 is rotatably connected to the collar 28.

[0060] A connecting plate 24 is also fixedly installed on the fourth slider 26. A support rod 23 is rotatably installed on one end of the connecting plate 24 away from the fourth slider 26. The support rod 23 is rotatably connected to the follower rod 22 that passes through the vertical plate 37 and is connected to the threaded sleeve 8.

[0061] When the circuit board is clamped between the two clamping members 21, the control drive device 34 operates. The output shaft of the drive device 34 drives the rotating rod 35 connected to it to rotate, and causes the abutment roller 33, which is connected to the rotating rod 35 through the fixed plate 31 and the telescopic plate 32, to make a circular motion. When the abutment roller 33 is in the lower position during rotation, it will abut against the circuit board. As the abutment roller 33 continues to make a circular motion, it will act on the surface of the circuit board, causing the circuit board to bend. By bending the circuit board, the connection strength between the pins of the surface mount components and the circuit board can be detected. Specifically, when the connection strength between the pins of the surface mount components and the circuit board is weak, the solder joints at the pins of the components may break during the bending process of the circuit board, resulting in the entire circuit board being in an open circuit state. This can be detected by the detection device 39.

[0062] Because the same pressure applied to a longer circuit board and a shorter circuit board results in different deformations, to make the testing more consistent with the actual installation scenario of the circuit board, when the two threaded sleeves 8 move closer to each other and the two clamping pieces 21 move closer to each other, it indicates that the circuit board is shorter. At this time, one of the threaded sleeves 8 will drive the follower rod 22 to move. The follower rod 22 drives the connecting plate 24 downward through the inclined support rod 23, which in turn drives the fourth slider 26 downward. As the fourth slider 26 moves downward... When in motion, the connecting rod 27 drives the collar 28 to move toward the upright plate 37, and the connecting shaft 29 drives the telescopic component 38 to move toward the upright plate 37. The telescopic component 38 drives the telescopic plate 32 toward the fixed plate 31 through multiple pull rods 30, thereby reducing the radius of the circular motion of the abutment roller 33. This makes the bending deformation of the circuit board smaller when the abutment roller 33 acts on the circuit board with a shorter length. Also, since the collar 28 is rotatably connected to the connecting shaft 29, the radius of the circular motion of the abutment roller 33 will not change when the rotating rod 35 rotates.

[0063] Through the above settings, when the length of the clamped circuit board is short, the radius of the circular motion of the abutment roller 33 is small, so that the abutment roller 33 acts on the circuit board and causes the circuit board to bend and deform less. Conversely, when the length of the clamped circuit board is long, the abutment roller 33 acts on the circuit board and causes the circuit board to bend and deform more. This makes the circuit board more consistent with the actual installation scenario during the inspection process. The movement stroke of the clamping member 21 and the radius of the circular motion of the abutment roller 33 are realized through mechanical interlocking, avoiding relatively complex software adjustment. At the same time, it also avoids the phenomenon of shorter circuit boards breaking during inspection.

[0064] Please see Figure 3 , Figure 4 , Figure 5 The follower mechanism is disposed on the mounting plate 2. The follower component is connected to the clamping member 21 and includes a follower component and a drive component. The drive component is equipped with a support member 11 that can support the circuit board. When the circuit board is bent, the drive component can drive the two clamping members 21 to move closer to each other through the follower component.

[0065] The follower component includes a third slider 17 that is slidably disposed in the first slide groove 3. A guide 15 is fixedly installed at the bottom of the third slider 17. A second slider 14 is slidably installed in the guide 15. A roller 13 is connected between the two second sliders 14 on the same side. The roller 13 can slide in the horizontal groove 12 formed on the receiving member 11.

[0066] The follower assembly also includes an elastic structure disposed on the third slider 17. The elastic structure is connected to the side plate 5 fixed on the first slider 4. The elastic structure includes a column 19 fixedly installed on the third slider 17. One end of the column 19 away from the third slider 17 passes through the side plate 5 and is connected to the clamping member 21. A spring 20 is also sleeved on the column 19. One end of the spring 20 is connected to the end of the column 19, and the other end is connected to the side plate 5.

[0067] The drive assembly includes a pulley 16 rotatably mounted on the side of the second slider 14 away from the roller 13 and a drive plate 18 fixedly mounted on the first slider 4. The drive plate 18 has an inclined groove, and the pulley 16 can roll in the inclined groove.

[0068] When the circuit board is placed on the receiving member 11, the side of the circuit board with the components is facing down. At this time, since the receiving member 11 has abutment rods on both sides, the abutment rods abut against the end of the circuit board surface. This can keep the circuit board in a horizontal state when placed on the receiving member 11, and avoid the circuit board being tilted when placed on the receiving member 11, which would cause the clamping member 21 to be misaligned with the side wall of the circuit board and make the circuit board unable to be effectively clamped. On the other hand, the abutment rods abut against the end of the circuit board surface, so that when the clamping member 21 acts on the circuit board and moves the circuit board to the center position of the mounting plate 2, the components will not interfere with the receiving member 11 or the abutment rods.

[0069] In the initial state, since one end of the column 19 is connected to the third slider 17 and the other end passes through the side plate 5 and is connected to the clamping member 21, the first slider 4 and the third slider 17 are in a state of distance under the action of the spring 20. At this time, when the threaded sleeve 8 drives the first slider 4 to move through the cross bar 7 and the hinge bar 6, the third slider 17 will follow the first slider 4 to move. At the same time, the roller 13 will slide in the horizontal groove 12. After the clamping member 21 clamps the circuit board, the first slider 4 is in a locked state. Then, when the abutment roller 33 acts on the circuit board to make the circuit board bend, the receiving member 11 will be pressed downward and drive the second slider 14 to move downward through the roller 13. When the second slider 14 moves downward, the pulley 16 will roll in the inclined groove and drive the third slider 17 to move towards the first slider 4, compressing the spring 20 and driving the clamping member 21 to move relative to the first slider 4 so that it follows the end of the circuit board when the circuit board bends.

[0070] With the above settings, when the first slider 4 moves, it drives the clamping member 21 to move and simultaneously drives the third slider 17 to move synchronously. When the circuit board bends, the receiving member 11 moves downward and drives the third slider 17 toward the first slider 4 through the roller 13, the second slider 14, the guide member 15, the pulley 16 and the drive plate 18, so as to drive the clamping member 21 to move further toward the circuit board. When the circuit board bends and the two ends of the circuit board collapse, the clamping member 21 can always maintain the clamping of the circuit board, and avoid the circuit board from separating from the clamping member 21 due to the shortening of the two sides of the circuit board caused by bending.

[0071] As an embodiment of the present invention, a method for detecting the connection strength of mounted components on a circuit board using the aforementioned detection device is also proposed, comprising the following steps:

[0072] Step 1: Align the length direction of the circuit board to be tested with the length direction of the receiving component 11, place the circuit board to be tested on the receiving component 11, and then manually drive the bidirectional drive component to move the two clamping components 21 closer to each other to clamp the circuit board to be tested. Finally, connect the circuit board to be tested to the testing equipment 39 through wires.

[0073] Step 2: During the operation of the bidirectional drive component, the sheet metal of the abutment roller 33 can be changed by adjusting the component, and after the clamping member 21 completes the clamping of the circuit board to be tested, the radius of the abutment roller 33 in the circular motion remains unchanged.

[0074] Step 3: Control the drive component to move the contact roller 33 in a circular motion. When the contact roller 33 rotates downwards, it contacts the circuit board to be tested. As the contact roller 33 continues to rotate, the circuit board to be tested bends. When the contact roller 33 reaches its lowest position, control the drive component to stop and let it stand still for 10-15 minutes. Then control the drive component to continue to move to reset the contact roller 33.

[0075] Step 4: When the circuit board to be tested bends, the receiving part 11 moves downward, and under the action of the follower mechanism, the two clamping parts 21 are driven to move closer to each other to maintain the clamping of the circuit board to be tested when it bends.

[0076] Step 5: The testing equipment 39 tests the conductivity of the circuit board before and after bending to check whether the soldering at the pins of the mounted components on the circuit board still has a stable connection after bending. Finally, the connection strength of the mounted components on the circuit board is tested.

[0077] In summary, during use, the circuit board to be tested is placed on the receiving part 11, and the two threaded sleeves 8 set on the two-way lead screw 9 are manually rotated to move the two threaded sleeves 8 closer to each other or further apart. Specifically, when the two threaded sleeves 8 move closer to each other, the crossbars 7 on the two threaded sleeves 8 pull the first slider 4 through the hinge rod 6, so that the first slider 4 moves along the length direction of the first slide groove 3, so that the two clamping parts 21 placed on the mounting plate 2 move closer to each other and, after abutting against the circuit board, complete the clamping of the circuit board.

[0078] When the circuit board is clamped between the two clamping members 21, the control drive device 34 operates. The output shaft of the drive device 34 drives the rotating rod 35 connected to it to rotate, and causes the abutment roller 33, which is connected to the rotating rod 35 through the fixed plate 31 and the telescopic plate 32, to make a circular motion. When the abutment roller 33 is in the lower position during rotation, it will abut against the circuit board. As the abutment roller 33 continues to make a circular motion, it will act on the surface of the circuit board, causing the circuit board to bend. By bending the circuit board, the connection strength between the pins of the surface mount components and the circuit board can be detected. Specifically, when the connection strength between the pins of the surface mount components and the circuit board is weak, the solder joints at the pins of the components may break during the bending process of the circuit board, resulting in the entire circuit board being in an open circuit state. This can be detected by the detection device 39.

[0079] Because the same pressure applied to a longer circuit board and a shorter circuit board results in different deformations, to make the testing more consistent with the actual installation scenario of the circuit board, when the two threaded sleeves 8 move closer to each other and the two clamping pieces 21 move closer to each other, it indicates that the circuit board is shorter. At this time, one of the threaded sleeves 8 will drive the follower rod 22 to move. The follower rod 22 drives the connecting plate 24 downward through the inclined support rod 23, which in turn drives the fourth slider 26 downward. As the fourth slider 26 moves downward... When in motion, the connecting rod 27 drives the collar 28 to move toward the upright plate 37, and the connecting shaft 29 drives the telescopic component 38 to move toward the upright plate 37. The telescopic component 38 drives the telescopic plate 32 toward the fixed plate 31 through multiple pull rods 30, thereby reducing the radius of the circular motion of the abutment roller 33. This makes the bending deformation of the circuit board smaller when the abutment roller 33 acts on the circuit board with a shorter length. Also, since the collar 28 is rotatably connected to the connecting shaft 29, the radius of the circular motion of the abutment roller 33 will not change when the rotating rod 35 rotates.

[0080] When the circuit board is placed on the receiving member 11, the side of the circuit board with the components is facing down. At this time, since the receiving member 11 has abutment rods on both sides, the abutment rods abut against the end of the circuit board surface. This can keep the circuit board in a horizontal state when placed on the receiving member 11, and avoid the circuit board being tilted when placed on the receiving member 11, which would cause the clamping member 21 to be misaligned with the side wall of the circuit board and make the circuit board unable to be effectively clamped. On the other hand, the abutment rods abut against the end of the circuit board surface, so that when the clamping member 21 acts on the circuit board and moves the circuit board to the center position of the mounting plate 2, the components will not interfere with the receiving member 11 or the abutment rods.

[0081] In the initial state, since one end of the column 19 is connected to the third slider 17 and the other end passes through the side plate 5 and is connected to the clamping member 21, the first slider 4 and the third slider 17 are in a state of distance under the action of the spring 20. At this time, when the threaded sleeve 8 drives the first slider 4 to move through the cross bar 7 and the hinge bar 6, the third slider 17 will follow the first slider 4 to move. At the same time, the roller 13 will slide in the horizontal groove 12. After the clamping member 21 clamps the circuit board, the first slider 4 is in a locked state. Then, when the abutment roller 33 acts on the circuit board to make the circuit board bend, the receiving member 11 will be pressed downward and drive the second slider 14 to move downward through the roller 13. When the second slider 14 moves downward, the pulley 16 will roll in the inclined groove and drive the third slider 17 to move towards the first slider 4, compressing the spring 20 and driving the clamping member 21 to move relative to the first slider 4 so that it follows the end of the circuit board when the circuit board bends.

[0082] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0083] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A device for detecting the connection strength of mounted components on a circuit board, characterized in that, include: A base (1) is provided with a mounting plate (2) parallel to it, and a testing device (39) is provided on the base (1). A bidirectional drive assembly is disposed on the mounting plate (2) and connected to two clamping members (21) disposed on the mounting plate (2). The bidirectional drive assembly can drive the two clamping members (21) to move closer to each other to clamp the circuit board. A pressure-applying mechanism is provided on the base (1). The pressure-applying mechanism includes a power component and an adjustment component that is linked with the bidirectional drive component. An abutment roller (33) is installed on the power component, and the power component can drive the abutment roller (33) to make a circular motion to act on the circuit board and bend the circuit board. When the bidirectional drive component is activated, the adjustment component changes the radius of the circular motion of the abutment roller (33). The follower mechanism is disposed on the mounting plate (2). The follower mechanism includes a follower component and a drive component. The follower component is connected to the clamping member (21). The drive component is equipped with a support member (11) that can support the circuit board. When the circuit board is bent, the drive component can drive the two clamping members (21) to move closer to each other through the follower component.

2. The circuit board mounting component connection strength testing device according to claim 1, characterized in that, The mounting plate (2) is symmetrically provided with two sets of guide grooves. Each set of guide grooves includes two parallel sliding grooves (3). A slider (4) is slidably installed on each of the four sliding grooves (3). The bidirectional drive assembly includes a bidirectional lead screw (9) rotatably mounted on the mounting plate (2). Two threaded sleeves (8) are symmetrically arranged on the bidirectional lead screw (9) and threadedly connected thereto. Two crossbars (7) are symmetrically connected on the threaded sleeves (8). A hinge rod (6) is rotatably mounted on the crossbar (7). The end of the hinge rod (6) away from the crossbar (7) is connected to the first slider (4).

3. The circuit board mounting component connection strength testing device according to claim 2, characterized in that, A vertical plate (37) is also fixedly installed on the base (1); The power assembly includes a drive device (34) fixedly mounted on the upright plate (37). The output shaft of the drive device (34) passes through the upright plate (37) and is connected to a rotating rod (35). At least two sets of fixing plates (31) are equidistantly arranged on the rotating rod (35). A telescopic plate (32) is sleeved on the fixing plate (31). The end of the telescopic plate (32) away from the rotating rod (35) is rotatably connected to the abutting roller (33).

4. The circuit board mounting component connection strength testing device according to claim 3, characterized in that, The adjustment assembly includes a fitting groove (36) arranged along the length direction of the rotating rod (35), a telescopic member (38) is slidably installed in the fitting groove (36), and a plurality of parallel pull rods (30) are rotatably installed on the telescopic member (38), with one end of the pull rod (30) away from the telescopic member (38) rotatably connected to the telescopic plate (32). The telescopic component (38) is fixedly connected to a connecting shaft (29) that is slidably sleeved on the rotating rod (35) at one end near the upright plate (37). An annular groove is provided on the connecting shaft (29), and a collar (28) is rotatably installed in the annular groove. The adjustment assembly also includes a traction kit connecting the collar (28) to one of the threaded sleeves (8).

5. The circuit board mounting component connection strength testing device according to claim 4, characterized in that, The traction kit includes a second slide groove (25) opened on the upright plate (37), a fourth slider (26) is slidably installed in the second slide groove (25), a connecting rod (27) is rotatably installed on the fourth slider (26), and the end of the connecting rod (27) away from the fourth slider (26) is rotatably connected to the collar (28). A connecting plate (24) is also fixedly installed on the fourth slider (26). A support rod (23) is rotatably installed on one end of the connecting plate (24) away from the fourth slider (26). The support rod (23) is rotatably connected to the follower rod (22) that passes through the vertical plate (37) and is connected to the threaded sleeve (8).

6. The circuit board mounting component connection strength testing device according to claim 2, characterized in that, The follower assembly includes a third slider (17) that is slidably disposed in the first slide groove (3). A guide (15) is fixedly installed at the bottom of the third slider (17). A second slider (14) is slidably installed in the guide (15). A roller (13) is connected between the two second sliders (14) on the same side. The roller (13) can slide in the horizontal groove (12) formed on the receiving member (11). The follower assembly also includes an elastic structure disposed on the third slider (17), the elastic structure being connected to a side plate (5) fixed on the first slider (4).

7. The circuit board mounting component connection strength testing device according to claim 6, characterized in that, The elastic structure includes a column (19) fixedly installed on the third slider (17). One end of the column (19) away from the third slider (17) passes through the side plate (5) and is connected to the clamping member (21). A spring (20) is also sleeved on the column (19). One end of the spring (20) is connected to the end of the column (19), and the other end is connected to the side plate (5).

8. The circuit board mounting component connection strength testing device according to claim 6, characterized in that, The drive assembly includes a pulley (16) rotatably mounted on the side of the second slider (14) away from the roller (13) and a drive plate (18) fixedly mounted on the first slider (4). The drive plate (18) has an inclined groove, and the pulley (16) can roll in the inclined groove.

9. A method for testing the connection strength of mounted components on a circuit board using the testing device as described in claim 1, characterized in that, Includes the following steps: Step 1: Make the length direction of the circuit board to be tested in the same direction as the length direction of the receiving part (11), and place the circuit board to be tested on the receiving part (11). Then manually drive the bidirectional drive component to move so that the two clamping parts (21) move closer to each other to clamp the circuit board to be tested. Finally, connect the circuit board to be tested to the testing equipment (39) through the wire. Step 2: During the operation of the bidirectional drive component, the radius of the abutment roller (33) during its circular motion can be changed by adjusting the component. After the clamping member (21) completes the clamping of the circuit board to be tested, the radius of the abutment roller (33) during its circular motion remains unchanged. Step 3: Control the power component to drive the contact roller (33) to make a circular motion. When the contact roller (33) rotates to the bottom, it contacts the circuit board to be tested. During the continuous rotation of the contact roller (33), the circuit board to be tested is bent. When the contact roller (33) moves to the bottom position, control the power component to stop and let it stand for 10-15 minutes. Then control the power component to continue to operate so that the contact roller (33) returns to its original position. Step 4: When the circuit board to be tested bends, the receiving part (11) moves downwards, and under the action of the follower mechanism, the two clamping parts (21) are driven to move closer to each other to maintain the clamping of the circuit board to be tested when it bends. Step 5: The testing equipment (39) tests the conductivity of the circuit board before and after bending to check whether the soldering at the pins of the mounted components on the circuit board still has a stable connection after bending, and finally completes the test of the connection strength of the mounted components on the circuit board.

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