Electronic device

Abstract

The application discloses an electronic device, and belongs to the technical field of electronic devices.The electronic device comprises a frame body, an infrared device and a circuit board, wherein the infrared device and the circuit board are arranged in the frame body, the circuit board comprises a driving circuit, and the infrared device emits a light beam under the drive of the driving circuit; the infrared device comprises an infrared light source, a light guide column and a photosensitive sensor, the infrared light source and the photosensitive sensor are arranged on the same side of the circuit board, one end of the light guide column extends to the top of the frame body, and the other end of the light guide column is arranged opposite to the infrared light source and the photosensitive sensor; the light beam emitted by the infrared light source is emitted out of the frame body through the light guide column to form an emission light path; the emission light path is reflected by a target object outside the frame body, is shot into the frame body, and is irradiated on the photosensitive sensor through the light guide column to form a receiving light path.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] With the development of information technology, electronic devices are becoming increasingly powerful, bringing people a more and more convenient life. In recent years, infrared functionality has also become very popular among users. Currently, many electronic devices integrate infrared functionality. Electronic devices with infrared remote control functionality can be used as remote controls, and electronic devices with infrared proximity functionality can detect obstacles to avoid accidental touches.

[0003] In the existing technology, the above two functions are mainly achieved by two separate solutions: an infrared proximity module and an infrared remote control module.

[0004] However, the two discrete solutions consist of two independently configured circuits. These two independent circuits require two power supplies and two infrared light sources. Since infrared light sources are expensive and bulky, this can lead to higher costs and larger footprints for the electronic equipment. Furthermore, because the infrared light source of the infrared proximity module is normally on, the power supply connected to it remains powered, resulting in additional standby power consumption in the infrared remote control IR path, thus increasing the overall power consumption of the device. Summary of the Invention

[0005] The purpose of this application is to provide an electronic device that can solve the problems of high overall cost, large required stacking space, and high power consumption of existing electronic devices.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows:

[0007] The device includes a frame, an infrared device, and a circuit board. Both the infrared device and the circuit board are housed within the frame. The circuit board includes a driving circuit, and the infrared device emits a light beam under the drive of the driving circuit. The infrared device includes an infrared light source, a light guide column, and a photosensitive sensor. The infrared light source and the photosensitive sensor are located on the same side of the circuit board. One end of the light guide column extends to the top of the frame, and the other end of the light guide column is positioned opposite to the infrared light source and the photosensitive sensor. The light beam emitted by the infrared light source exits the frame through the light guide column to form an emission light path. The emission light path is reflected by a target object outside the frame and then enters the frame, illuminating the photosensitive sensor through the light guide column to form a receiving light path.

[0008] In this embodiment, the frame provides space for the infrared device and circuit board. The circuit board houses the driving circuit, which in turn drives the infrared device to achieve infrared remote control and proximity detection functions. An infrared light source emits a light beam, enabling both remote control and proximity detection. A photosensitive sensor detects the light reflected from the light source, thus achieving proximity detection. The infrared light source and photosensitive sensor are mounted on the circuit board, either on its side or on the ground, depending on the specific situation. One end of a light guide extends to the top of the frame, while the other end is positioned opposite the infrared light source and photosensitive sensor. In practical applications, the driving circuit drives the infrared light source to emit a light beam. The beam exits the frame through the light guide, forming an emitted light path, which enables infrared remote control. The emitted light is reflected by a target object outside the frame and then re-enters the frame, illuminating the photosensitive sensor through the light guide to form a received light path. The emitted and received light paths together enable proximity detection. In this embodiment of the application, by setting up an infrared light source and a light guide column, infrared remote control function and proximity detection function can be realized, which has the beneficial effects of reducing the overall cost of electronic devices, saving stacking space, and reducing power consumption. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the installation of the infrared device and the frame in an embodiment of this application;

[0010] Figure 2 This is a partial structural schematic diagram of the infrared device in the embodiments of this application;

[0011] Figure 3 This is a schematic diagram of the optical transmission path in an embodiment of this application;

[0012] Figure 4 This is a top view of the optical transmission path in an embodiment of this application;

[0013] Figure 5 This is a schematic diagram of the transmitting optical path and the receiving optical path in the embodiments of this application;

[0014] Figure 6 This is a top view of the transmitting and receiving optical paths in the embodiments of this application;

[0015] Figure 7 This is a schematic diagram of a circuit according to an embodiment of this application;

[0016] Figure 8 This is a schematic diagram of the second type of circuit in the embodiments of this application;

[0017] Figure 9This is a schematic diagram of the third type of circuit in the embodiments of this application;

[0018] Figure 10 This is a schematic diagram of the fourth type of circuit in the embodiments of this application.

[0019] Explanation of reference numerals in the attached figures:

[0020] 10. Frame; 11. First light-transmitting hole; 12. Second light-transmitting hole; 20. Infrared device; 21. Infrared light source; 22. Light guide column; 23. Photosensitive sensor; 24. Isolator; 25. Filter assembly; 221. First light guide section; 222. Second light guide section; 251. Filter; 252. Ink layer; 253. Lens; 30. Circuit board; 40. First power supply; 41. Second power supply; 43. Processing unit; 44. Photosensitive driving unit; 45. Resistor; 46. PMOS; 47. NMOS; 48. Switch. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] The subject matter and electronic devices provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0024] See Figures 1 to 10This application provides an electronic device, including: a frame 10, an infrared device 20, and a circuit board 30. The infrared device 20 and the circuit board 30 are both disposed within the frame 10. The circuit board 30 includes a driving circuit. The infrared device 20 emits a light beam under the drive of the driving circuit. The infrared device 20 includes an infrared light source 21, a light guide post 22, and a photosensitive sensor 23. The infrared light source 21 and the photosensitive sensor 23 are disposed on the same side of the circuit board 30. One end of the light guide post 22 extends to the top of the frame 10, and the other end of the light guide post 22 is disposed opposite to the infrared light source 21 and the photosensitive sensor 23. The light beam emitted by the infrared light source 21 exits the frame 10 through the light guide post 22 to form an emission light path. The emission light path is reflected by a target object outside the frame 10 and enters the frame 10, and then shines on the photosensitive sensor 23 through the light guide post 22 to form a receiving light path.

[0025] In this embodiment, the frame 10 provides space for the infrared device 20 and the circuit board 30. The circuit board 30 houses the driving circuit, which drives the infrared device 20 to achieve infrared remote control and proximity detection functions. The infrared light source 21 emits a light beam, enabling infrared remote control and proximity detection. The photosensitive sensor 23 detects the light reflected to it, thus achieving proximity detection. The infrared light source 21 and photosensitive sensor 23 are mounted on the circuit board 30, either on its side or bottom, depending on the specific situation. One end of the light guide post 22 extends to the top of the frame 10, while the other end is positioned opposite the infrared light source 21 and photosensitive sensor 23. In practical applications, the driving circuit drives the infrared light source 21 to emit a light beam, which exits the frame 10 through the light guide post 22 to form an emitted light path, enabling infrared remote control functionality. The emitted light is reflected by the target object outside the frame 10 and then enters the frame 10 again. It then shines onto the photosensitive sensor 23 through the light guide post 22 to form a receiving light path. The emitted and receiving light paths enable proximity detection. In this embodiment, the use of an infrared light source 21 and a light guide post 22 enables infrared remote control and proximity detection functions, reducing the overall cost of the electronic device, saving stacking space, and lowering power consumption.

[0026] Optionally, in this embodiment of the application, the portion of the frame 10 connected to the light guide post 22 is provided with an adjacent first light-transmitting hole 11 and a second light-transmitting hole 12. The first light-transmitting hole 11 and the infrared light source 21 are arranged opposite to each other, and the second light-transmitting hole 12 and the photosensitive sensor 23 are arranged opposite to each other.

[0027] In this embodiment, a first light-transmitting hole 11 is disposed on the frame 10, and the first light-transmitting hole 11 and the infrared light source 21 are disposed opposite to each other. The first light-transmitting hole 11 is configured to allow the emitted light path to exit from the frame 10, thereby realizing the infrared remote control function. A second light-transmitting hole 12 is disposed opposite to the photosensitive sensor 23. The second light-transmitting hole 12 is configured to allow the received light path to enter the frame 10 from outside the frame 10. That is, when the electronic device is close to a target object, the photosensitive sensor 23 can receive the received light path reflected by the target object, thereby realizing the proximity detection function. In this embodiment, the arrangement of the first light-transmitting hole 11 and the second light-transmitting hole 12 has the beneficial effect of realizing the emitted light path and the received light path.

[0028] It should be noted that the first light-transmitting hole 11 can be a through-hole structure opened on the frame 10, or the first light-transmitting hole 11 can also be a transparent area on the frame 10; the second light-transmitting hole 12 can be a through-hole structure opened on the frame 10, or the second light-transmitting hole 12 can also be a transparent area on the frame 10. This application embodiment does not specifically limit this.

[0029] Optionally, in this embodiment, the light guide post 22 includes a first light guide portion 221 and a second light guide portion 222. The first light guide portion 221 and the infrared light source 21 are disposed opposite to each other, and the second light guide portion 222 and the photosensitive sensor 23 are disposed opposite to each other. The first light guide portion 221 is disposed between the infrared light source 21 and the first light-transmitting hole 11, and the second light guide portion 222 is disposed between the photosensitive sensor 23 and the second light-transmitting hole 12.

[0030] In this embodiment, the first light guide post 22 and the infrared light source 21 are arranged opposite to each other to guide the emitted light. The second light guide post 22 and the photosensitive sensor 23 are arranged opposite to each other to guide the reflected light path. The first light guide part 221 is disposed between the infrared light source 21 and the first light-transmitting hole 11. The infrared light source passes through the first light guide part 221 and then through the first light-transmitting hole 11 to realize the emission light path. The second light guide part 222 is disposed between the photosensitive sensor 23 and the second light-transmitting hole 12. The light source passes through the second light-transmitting hole 12 and then through the second light guide post 22 to illuminate the photosensitive sensor 23 to realize the receiving light path. In this embodiment, the light guiding of the emission and receiving light paths is realized by a single light guide post 22. Since the above-mentioned arrangement of the first light guide part 221 and the second light guide part 222 only requires one light guide post 22 in the electronic device, the cost of the electronic device can be reduced and the overall stacking space of the electronic device can be reduced.

[0031] It should be noted that the first light guide 221 and the second light guide 222 can also be light guide plates, and the specific configuration can be made according to actual needs. This application embodiment does not make specific limitations in this regard.

[0032] Optionally, in this embodiment of the application, the infrared device 20 further includes a partition member, which is disposed between the first light guide portion 221 and the second light guide portion 222 along the direction of the emitted light path.

[0033] In this embodiment, a partition is disposed between the first light guide portion 221 and the second light guide portion 222 along the emission direction of the emitting light path. The partition separates the infrared light source 21 and the photosensitive sensor 23 on both sides, separates the first light guide portion 221 and the second light guide portion 222 on both sides, and separates the first light-transmitting hole 11 and the second light-transmitting hole 12 on both sides. The partition separates the emitting light path and the receiving light path on both sides. By separating the emitting and receiving light paths, the infrared proximity function and the infrared remote control function of the electronic device can be implemented separately, avoiding interference between the emitting and receiving light paths, thus preventing interference between the infrared proximity function and the infrared remote control function of the electronic device.

[0034] Optionally, in this embodiment of the application, the infrared device 20 further includes a light filter assembly 25, which includes a filter element 251 disposed on the side of the frame 10 away from the light guide post 22.

[0035] In this embodiment, the filter assembly 25 is provided to improve the transmittance of the infrared band and also to improve the appearance of the light guide post 22. The filter element 251 is disposed on the side of the frame 10 away from the light guide post 22. When the emitted light path exits the frame 10 through the light guide post 22, the emitted light path passes through the exit frame 10 of the filter element 251. When the received light path enters the frame 10 from the outside through the filter element 251, the filter element 251 reduces the low transmittance of the visible light band and improves the transmittance of the received light path, that is, the infrared light band.

[0036] It should be noted that in this embodiment, the infrared light source 21 can be in the 940nm band, or it can be an infrared light source 21 in other bands depending on the actual application. This embodiment does not limit it in any way.

[0037] Optionally, in this embodiment, the filter assembly 25 further includes an ink layer 252 and a lens 253. The ink layer 252 is disposed on the side of the filter element 251 away from the light guide post 22, and the lens 253 is disposed on the side of the ink layer 252 away from the filter element 251.

[0038] In this embodiment, the ink layer 252 is disposed on the side of the filter element 251 opposite to the light guide post 22, and the lens 253 is disposed on the side of the ink layer 252 opposite to the filter element 251. When the electronic device implements the proximity detection function, the infrared light source 21 emits light, and the infrared light passes through the first light guide part 221 and reaches the ink layer 252.

[0039] It should be noted that the 252-bit appearance ink layer is used to hide the components inside the frame 10. In practical applications, it is generally designed to have low transmittance in the visible light band and high transmittance in the infrared band in order to achieve the function of hiding the components.

[0040] It should also be noted that the lens 253 is designed to protect the components inside the housing 10, preventing external dust from entering the housing 10 without affecting the transmission and reception of the optical path.

[0041] Optionally, such as Figure 7 As shown in this embodiment, the driving circuit includes: a first power supply 40, a second power supply 41, a processing unit 43, a photosensitive driving unit 44, and an infrared light source 21. The first power supply 40 and the photosensitive driving unit 44 are electrically connected, and the second power supply 41 and the infrared light source 21 are electrically connected. When the electronic device is in a proximity detection state, the processing unit 43 controls the photosensitive driving unit 44 to configure the infrared light source 21 in a first state. When the electronic device is in an infrared remote control state, the infrared remote control function is triggered, and the processing unit 43 controls the photosensitive driving unit 44 to configure the infrared light source 21 in a second state.

[0042] In the first state, the infrared light source 21 achieves a first power and a first frequency for proximity detection, and in the second state, the infrared light source 21 achieves a second power and a second frequency for infrared remote control.

[0043] In this embodiment, when the electronic device implements the proximity detection function, the processing unit 43 can communicate with the photosensitive driving unit 44, which in turn drives the infrared light source 21 to a first state. In the first state, the emitted light from the infrared light source 21 can be transmitted outwards through the first light-transmitting hole 11. The photosensitive sensor 23 can determine the approach of an object by the intensity of the received light, thereby realizing the proximity detection function. It should be noted that the aforementioned first state refers to the first power and first frequency configured for the infrared light source 21 to achieve proximity detection. In the first state, the infrared light source 21 can realize the proximity detection function of the electronic device. When the electronic device implements the infrared remote control function, the infrared remote control function is triggered, and the processing unit 43 configures the infrared light source 21 to a second state. The processing unit 43 controls the photosensitive driving unit 44 to drive the infrared light source 21 to light up or turn off to realize the infrared remote control function of the electronic device. It should be noted that the aforementioned second state refers to the second power and second frequency configured for the infrared light source 21 to achieve infrared remote control. In the second state, the infrared light source 21 can realize the infrared remote control function of the electronic device.

[0044] It should be noted that the infrared remote control requires a higher transmission power than the detection power and needs to encode the switching frequency of the light. Therefore, the above circuit design requires that the photosensitive driving unit 44 has sufficient driving capability and that the PWM (Pulse Width Modulation) wave it generates is programmable.

[0045] It should also be noted that in the above-mentioned driving circuit, since the proximity detection function is a normally open function, when the power is on, the processing unit 43 communicates with the photosensitive driving unit 44 to configure the infrared light source 21 to the first state of the proximity detection function. Only when the infrared remote control function is triggered will the infrared light source 21 be configured to the second state corresponding to the infrared remote control function.

[0046] Optionally, such as Figure 8 As shown in this embodiment, the driving circuit further includes a first driving sub-circuit. One end of the first driving sub-circuit is electrically connected to the second power supply 41, and the other end of the first driving sub-circuit is electrically connected to the infrared light source 21. The first driving sub-circuit includes a resistor 45 and a PMOS 46. The NMOS source in the photosensitive driving unit 44 and the gate of the PMOS 46 are connected. The resistor 45 is connected between the photosensitive driving unit 44 and the PMOS 46, and the resistor 45 is connected to the gate of the PMOS 46. The photosensitive driving unit 44 is used to control the frequency of the infrared light source 21.

[0047] In this embodiment, if the driving capability of the photosensitive driving unit 44 is limited, that is, the maximum current that the photosensitive driving unit 44 can provide is limited and insufficient to meet the power requirements of the infrared remote control function, but PWM programmable is supported. The first driving sub-circuit generally uses a PMOS46 for driving, where the MOS transistor is a metal-oxide-semiconductor field-effect transistor, or metal-insulator-semiconductor. The LDR (modulated wave) signal is connected to the NMOS source inside the photosensitive driving unit 44 and externally connected to the gate of the PMOS46, and pulled up through the second power supply 41. The gate is pulled up through the resistor (45) to ensure that the PMOS46 is in the off state when powered on or idle, and to provide a discharge path when powered off, ensuring that the MOS transistor can be turned off quickly, while preventing electrostatic breakdown. It is generally set to 10kΩ. In this way, the ambient light sensor only controls the switching frequency of the infrared light source 21, and the driving current that can be provided is determined by the performance of the PMOS46. When the electronic device is in proximity detection mode, the processing unit 43 can send a high level through the first driving sub-circuit, and the infrared light source 21 will not work, thus realizing the proximity detection function of the electronic device. When the electronic device is in infrared remote control mode, the processing unit 43 can alternately send a low level through the first driving sub-circuit, and the infrared light source 21 will be turned on, enabling the electronic device to realize the infrared remote control function.

[0048] Optionally, in this embodiment, the driving circuit includes a second driving sub-circuit. One end of the second driving sub-circuit is electrically connected to the processing unit 43, and the other end is electrically connected to the infrared light source 21. The processing unit 43 and the photosensitive driving unit 44 are communicatively connected via their input / output ports, and the other end of the photosensitive driving unit 44 is electrically connected to the first power supply 40. One end of the processing unit 43 and the second driving sub-circuit are electrically connected to the processing unit 43, and the other end of the second driving sub-circuit is connected to one end of the infrared light source 21. The other end of the infrared light source 21 is electrically connected to the second power supply 41. The second driving sub-circuit includes a resistor 45 and an NMOS 47, and the gates of the processing unit 43 and the NMOS 47 are connected. The gates of resistor 45 and NMOS 47 are connected. When the electronic device is in a proximity detection state, the processing unit 43 controls the photosensitive driving unit 44 to configure the infrared light source 21 to a first state. The processing unit 43 configures PWM1 to a third state, and the photosensitive driving unit 44 acquires the timing of the third state through the input / output port and synchronizes the timing of the third state. When the electronic device is in an infrared remote control state, the infrared remote control function is triggered, and the processing unit 43 controls the second driving sub-circuit to configure the infrared light source 21 to a second state. The processing unit 43 configures PWM1 to a fourth state, and the photosensitive driving unit 44 acquires the timing of the fourth state and synchronizes the timing of the fourth state.

[0049] In this embodiment, the PWM (Modifiable Transmission) signal of the photosensitive driving unit 44 is not programmable, meaning that the photosensitive driving unit 44 cannot perform infrared remote control encoding. The photosensitive driving unit 44 communicates with the processing unit 43 through an IO (Input / Output) port to obtain the sampling time and timing received by the photosensitive sensor 23. The infrared light source 21 is switched on and off and encoded through the PWM port of the processing unit 43. In practical applications, since the proximity detection function is a normally open function, the processing unit 43 and the photosensitive driving unit 44 communicate for relevant configuration. The processing unit 43 configures PWM1 to a preset proximity detection function switching frequency, and the photosensitive driving unit 44 obtains the switching timing of PWM1 through the IO port, thereby controlling the sampling timing of the internal detection circuit of the photosensitive sensor 23 to ultimately realize the proximity detection function. When an infrared remote control button is pressed, the processing unit 43 disables the proximity detection function and simultaneously encodes PWM1 to realize the infrared remote control function. When the gate is pulled down through resistor 45, it ensures that the NMOS47 transistor is in the off state when powered on or idle. When the power is off, it provides a discharge path to ensure that the NMOS47 transistor can be turned off quickly and prevent electrostatic discharge. It is generally set to 10kΩ.

[0050] Optionally, in this embodiment, the driving circuit further includes a switching switch 48, which is disposed between the second driving sub-circuit and the infrared light source 21, and is electrically connected to both the second driving sub-circuit and the infrared light source 21. The switching switch 48 is also electrically connected to the photosensitive driving unit 44. The switching switch 48 is connected to the source of the NMOS 47. When the electronic device is in a proximity detection state, the processing unit 43 controls the switching switch 48 to connect the photosensitive driving unit 44 and the infrared light source 21 through an LDR, and the processing unit 43 controls the photosensitive driving unit 44 to configure the infrared light source 21 to the first state. When the electronic device is in an infrared remote control state, the infrared remote control function is triggered, and the processing unit 43 controls the switching switch 48 to connect the second driving sub-circuit and the infrared light source 21. The second driving sub-circuit is connected to the second driving sub-circuit through PWM1, and the processing unit 43 controls the second driving sub-circuit to configure the infrared light source 21 to the second state.

[0051] In this embodiment, the PWM signal of the photosensitive driving unit 44 is not programmable. The infrared light source 21 can be controlled by either LDR or PWM1 via a switch 48. The switch 48 is selected by the processing unit 43. Since the proximity detection function is normally open, the processing unit 43 and the photosensitive driving unit 44 communicate for configuration. The driving unit configures PWM1 to a preset proximity function switching frequency. The photosensitive driving unit 44 obtains the switching timing of PWM1 and the sampling timing of the internal detection circuit of the photosensitive sensor 23 through the I / O port, ultimately realizing the proximity detection function. When an infrared remote control button is pressed, the processing unit 43 disables the proximity detection function and simultaneously encodes PWM1 to realize the infrared remote control function.

[0052] It should be noted that, in the embodiments of this application, electronic devices include, but are not limited to, mobile phones, computers, tablets, and wearable devices.

[0053] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0054] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, comprising: The application relates to an infrared device and a circuit board, and belongs to the field of infrared devices. The infrared device comprises an infrared light source, a light guide column and a photosensitive sensor, the infrared light source and the photosensitive sensor are arranged on the same side of the circuit board, one end of the light guide column extends to the top of the frame, and the other end of the light guide column is arranged opposite to the infrared light source and the photosensitive sensor. The light beam emitted by the infrared light source is emitted out of the frame through the light guide column to form an emission light path; the emission light path is reflected by a target object outside the frame, is shot into the frame, and is irradiated on the photosensitive sensor through the light guide column to form a receiving light path. The frame and the part corresponding to the light guide column are provided with adjacent first and second light transmission holes, the first light transmission hole is arranged opposite to the infrared light source, and the second light transmission hole is arranged opposite to the photosensitive sensor. The light guide column comprises a first light guide part and a second light guide part, the first light guide part is arranged opposite to the infrared light source, and the second light guide part is arranged opposite to the photosensitive sensor. The first light guide part is arranged between the infrared light source and the first light transmission hole, and the second light guide part is arranged between the photosensitive sensor and the second light transmission hole. The infrared device further comprises a partitioning piece arranged between the first light guide part and the second light guide part along the direction of the emission light path.

2. The electronic device of claim 1, wherein, The infrared device further comprises a light filtering assembly, the light filtering assembly comprises a filtering piece arranged on the side of the frame away from the light guide column.

3. The electronic device of claim 1, wherein, The light filtering assembly further comprises an ink layer arranged on the side of the filtering piece away from the light guide column and a lens arranged on the side of the ink layer away from the filtering piece.

4. The electronic device of claim 3, wherein, The driving circuit comprises a first power supply, a second power supply, a processing unit, a photosensitive driving unit and an infrared light source, the first power supply and the photosensitive driving unit are electrically connected, and the second power supply and the infrared light source are electrically connected.

5. The electronic device of claim 1, wherein, When the electronic device is in a proximity detection state, the processing unit controls the photosensitive driving unit to configure the infrared light source into a first state. When the electronic device is in an infrared remote control state, an infrared remote control function is triggered, and the processing unit controls the photosensitive driving unit to configure the infrared light source into a second state. The first state is a first power and a first frequency of the infrared light source for realizing proximity detection, and the second state is a second power and a second frequency of the infrared light source for realizing infrared remote control. The driving circuit further comprises a first driving sub-circuit, one end of the first driving sub-circuit is electrically connected with the second power supply, and the other end of the first driving sub-circuit is electrically connected with the infrared light source.

6. The electronic device of claim 5, wherein, The first driving sub-circuit comprises a resistance and a PMOS, the source of an NMOS in the photosensitive driving unit is connected with the gate of the PMOS, the resistance is connected between the photosensitive driving unit and the PMOS, and the resistance is connected with the gate of the PMOS. ​ The photosensitive driving unit is configured to control a frequency of the infrared light source.

7. The electronic device of claim 5, wherein, The driving circuit comprises a second driving sub-circuit, one end of the second driving sub-circuit is electrically connected with the processing unit, and the other end of the second driving sub-circuit is electrically connected with the infrared light source. The processing unit and the input / output port of the photosensitive driving unit are in communication connection, and the other end of the photosensitive driving unit is electrically connected with the first power supply. One end of the second driving sub-circuit is electrically connected with the processing unit, the other end of the second driving sub-circuit is electrically connected with one end of the infrared light source, and the other end of the infrared light source is electrically connected with the second power supply. The second driving sub-circuit comprises a resistor and an NMOS, the processing unit is connected with the NMOS, and the resistor is connected with the gate of the NMOS. In the proximity detection state of the electronic device, the processing unit controls the photosensitive driving unit to configure the infrared light source into a first state. In the infrared remote control state of the electronic device, the infrared remote control function is triggered, the processing unit controls the second driving sub-circuit to configure the infrared light source into a second state. In the infrared remote control state of the electronic device, the infrared remote control function is triggered, the processing unit controls the second driving sub-circuit to configure the infrared light source into a second state. The driving circuit further comprises a switching switch, the switching switch is arranged between the second driving sub-circuit and the infrared light source, and is electrically connected with the second driving sub-circuit and the infrared light source respectively, and the switching switch is further electrically connected with the photosensitive driving unit.

8. The electronic device of claim 7, wherein, The switching switch is connected with the source of the NMOS. In the proximity detection state of the electronic device, the processing unit controls the switching switch to make the photosensitive driving unit and the infrared light source communicate through the LDR, and the processing unit controls the photosensitive driving unit to configure the infrared light source into the first state. In the infrared remote control state of the electronic device, the infrared remote control function is triggered, the processing unit controls the switching switch to make the second driving sub-circuit and the infrared light source communicate, the second driving sub-circuit communicates through the PWM1 and the second driving sub-circuit, and the processing unit controls the second driving sub-circuit to configure the infrared light source into the second state. ​

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