Electronic device

Abstract

The application relates to an electronic device, comprising a back frame, a first heat source, a second heat source, a guide and a fan. The first heat source is arranged on a first side of the back frame; the second heat source is arranged on a second side of the back frame; the guide is arranged on the second side of the back frame; and the fan is arranged corresponding to the guide. At least a part of an air flow path is formed between the first heat source and the second heat source.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device that can improve heat dissipation. Background Technology

[0002] In recent years, electronic devices, such as display devices, may need to increase the brightness of their backlights to achieve high contrast display effects. However, this also increases the power consumption of the backlight module's light source and / or circuit board, resulting in a rise in the temperature of the backlight device. However, existing heat dissipation mechanisms for display devices cannot effectively solve this problem.

[0003] Therefore, an electronic device is needed to improve the above problems. Summary of the Invention

[0004] This invention provides an electronic device, characterized in that it includes a back frame, a first heat source, a second heat source, a guide member, and a fan. The first heat source is disposed on a first side of the back frame. The second heat source includes a circuit board, which is disposed on a second side of the back frame. The guide member is disposed on the second side of the back frame. The fan is disposed corresponding to the guide member. At least a portion of an airflow path is formed between the first heat source and the second heat source.

[0005] Other novel features of the invention will become clearer from the following detailed description and in conjunction with the accompanying drawings. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of an electronic device according to an embodiment of the present invention.

[0007] Figure 2 show Figure 1 A partial cross-sectional view of an embodiment of the electronic device at section line A-A'.

[0008] Figure 3 show Figure 1 A partial cross-sectional view of another embodiment of the electronic device at section line A-A'.

[0009] Figure 4 show Figure 1 A partial cross-sectional view of another embodiment of the electronic device at section line A-A'.

[0010] Figure 5A show Figure 1 A partial cross-sectional view of another embodiment of the electronic device at section line A-A'.

[0011] Figure 5B show Figure 5A Corresponding to the Implementation Examples Figure 1 A partial side view at section line B-B'.

[0012] Figure 6 show Figure 1 A partial cross-sectional view of another embodiment of the electronic device at section line A-A'.

[0013] Figure 7 This is a schematic diagram of an electronic device according to another embodiment of the present invention.

[0014] Figure 8 show Figure 7 A cross-sectional schematic diagram of an embodiment of an electronic device along line A-A'.

[0015] Figure 9 show Figure 7 A cross-sectional schematic diagram of another embodiment of the electronic device along section A-A'.

[0016] Figure 10 show Figure 7 A cross-sectional schematic diagram of another embodiment of the electronic device along section A-A'.

[0017] Figure 11 show Figure 7 A cross-sectional schematic diagram of another embodiment of the electronic device along section A-A'.

[0018] Figure 12 This is a schematic diagram of an electronic device according to another embodiment of the present invention.

[0019] Figure 13 show Figure 12 A cross-sectional schematic diagram of an embodiment of an electronic device along the C-C' section.

[0020] Figure 14 This is a schematic diagram of an electronic device according to another embodiment of the present invention.

[0021] Figure 15 show Figure 14 A cross-sectional schematic diagram of another embodiment of the electronic device along the C-C' section.

[0022] 1. Electronic devices

[0023] 2. Back frame

[0024] 2a The first side of the back frame

[0025] 2b The second side of the back frame

[0026] 2c End of back frame

[0027] 3. Primary heat source

[0028] 31 Light source

[0029] 32 Circuit board

[0030] 4 Second heat source

[0031] 40 circuit boards

[0032] 4a The first side of the circuit board

[0033] 41 Electronic Components

[0034] 5. Guide components

[0035] 5a First side of the guide

[0036] 5b The second side of the guide

[0037] 5c guide edge

[0038] 501 Guide Component Flow Channel

[0039] 52 Second opening

[0040] 53 Third opening

[0041] 54. Fourth opening

[0042] 6 fans

[0043] 7 Support components

[0044] 8 Second Guide

[0045] 81. Flow channel of the second guide

[0046] 82 Grooves

[0047] 9 heat pipes

[0048] 10. Plate cover

[0049] 101 First Opening

[0050] 11 Diffuser Plate

[0051] 12 Frame

[0052] 13. Dimming equipment

[0053] 14 fans

[0054] 15 Fan support bracket

[0055] h1 Thickness of the guide element

[0056] h2 Thickness of the second guide

[0057] 21 First perforation

[0058] 22 Second perforation

[0059] 23 Fourth perforation

[0060] 24 Fifth perforation

[0061] 33 Third perforation

[0062] 34 intervals

[0063] 35 Second Interval

[0064] 36 Third Interval

[0065] R part of the airflow path

[0066] 2f End of back frame

[0067] 2D back frame end Detailed Implementation

[0068] When read in conjunction with the accompanying drawings, the following embodiments clearly illustrate the above and other technical contents, features, and / or effects of the present invention. Through the description of specific embodiments, one will further understand the technical means and effects employed by the present invention to achieve the above-mentioned objectives. Furthermore, since the content disclosed in this invention should be easily understood and implemented by those skilled in the art, all equivalent substitutions or modifications that do not depart from the concept of the present invention should be included in the claims.

[0069] It should be noted that, unless otherwise specified, "a" component is not limited to a single component, but may also refer to one or more of the components.

[0070] Furthermore, ordinal numbers such as "first" or "second" in the specification and claims are merely descriptive of the claimed components and do not represent or indicate any order of the claimed components, nor are they an order between the claimed components and another claimed component or between steps of the manufacturing method. The use of these ordinal numbers is solely for the purpose of distinguishing one claimed component with a specific name from another claimed component with the same name.

[0071] Furthermore, the word "adjacent" in the specification and claims is used to describe mutual proximity and does not necessarily mean mutual contact.

[0072] Furthermore, descriptions such as "when..." or "...when" in this invention refer to "at present, before, or after," and are not limited to simultaneous occurrences; this is stated in advance. Descriptions such as "set on..." in this invention indicate the corresponding positional relationship between two components, and do not limit whether the two components are in contact, unless specifically limited; this is stated in advance. Moreover, when this invention describes multiple functions, the use of the word "or" between functions indicates that the functions can exist independently, but does not preclude the simultaneous existence of multiple functions.

[0073] Furthermore, the terms "connection" or "coupled" in the specification and claims refer not only to a direct connection to another component, but also to an indirect or electrical connection to another component. Additionally, an electrical connection includes direct connection, indirect connection, or communication between two components via radio signals.

[0074] Furthermore, in the specification and claims, the terms "about," "approximately," "substantially," and "generally" typically indicate a range where the difference between a value and a given value is within 10%, 5%, 3%, 2%, 1%, or 0.5% of the given value. The quantities given here are approximate quantities; that is, even without specific mention of "about," "approximately," "substantially," or "generally," their meanings are implied. Additionally, the terms "range from the first value to the second value" and "range between the first value and the second value" indicate that the range includes the first value, the second value, and other values ​​in between.

[0075] Furthermore, the technical features of the different embodiments disclosed in this invention can be combined to form another embodiment.

[0076] Furthermore, the electronic device disclosed in this invention may include a display device, a backlight device, an antenna device, a sensing device, a splicing device, a touch display, a curved display, or a free-shape display, but is not limited thereto. The electronic device may include, for example, liquid crystal, light-emitting diode, fluorescence, phosphorescence, other suitable display media, or combinations thereof, but is not limited thereto. The display device may be a non-self-emissive display device or a self-emissive display device. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device, and the sensing device may be a sensing device for capacitance, light, heat, or ultrasound, but is not limited thereto. Electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes (LEDs) or photodiodes. The light-emitting diode (LED) may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any of the aforementioned arrangements and combinations, but is not limited thereto. Furthermore, the electronic device may be a bendable or flexible electronic device. It should be noted that the electronic device may be any of the aforementioned arrangements and combinations, but is not limited thereto. Furthermore, the shape of the electronic device may be rectangular, circular, polygonal, with curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, control system, light source system, and shelving system to support the display device, antenna device, or splicing device. For ease of explanation, the following description will use the form of an electronic device as a display device (which may include a backlight device), but the invention is not limited thereto.

[0077] Please also refer to Figure 1 and Figure 2 . Figure 1 This is a schematic diagram (top view) of an electronic device 1 according to an embodiment of the present invention, and Figure 2 show Figure 1 This is a partial cross-sectional view of an embodiment of the electronic device 1 along line A-A'. Furthermore, for ease of explanation, the cross-sectional view is taken with the light-emitting surface of the electronic device 1 facing downwards (e.g., towards...). Figure 2 Presented in the opposite direction of the Z-axis.

[0078] like Figure 1 and Figure 2 As shown, the electronic device 1 includes a back frame 2, at least one first heat source 3, at least one second heat source 4, at least one guide 5, and at least one fan 6. The back frame 2 has a first side 2a and a second side 2b. The first heat source 3 is disposed on the first side 2a of the back frame 2. The second heat source 4 may include a circuit board 40 and electronic components (not shown) disposed on the circuit board 40. The circuit board 40, the guide 5, and the fan 6 are disposed on the second side 2b of the back frame 2. The guide 5 may have a first side 5a and a second side 5b opposite to each other. The first side 5a of the guide 5 may be disposed adjacent to the second side 2b of the back frame 2, and the fan 6 may be disposed adjacent to the second side 5b of the guide 5, but is not limited thereto. In one embodiment, the fan 6 may be directly abutted against the second side 5b of the guide 5. In one embodiment, the first side 5a of the guide 5 may be directly abutted against the second side 2b of the back frame 2. Furthermore, the fan 6 may be configured corresponding to the guide 5, for example, in a normal direction (e.g., the Z direction) of the second side 5b of the guide 5, the fan 6 and the guide 5 may at least partially overlap, or the two may be considered as a stacked configuration.

[0079] When the fan 6 operates (e.g., rotates), at least a portion of an airflow path can be formed between the first heat source 3 and the second heat source 4 (e.g., Figure 2 (The symbol R is used to indicate this). For example, when fan 6 operates, it generates airflow, and some of the air can flow through fan 6 and guide 5 to the second heat source 4 (e.g., circuit board 40), causing airflow around the second heat source 4. Therefore, a partial airflow path (e.g., R) can be formed between the second heat source 4 and the first heat source 3, but this is not limited to this. The airflow can accelerate the heat dissipation of either the first heat source 3 or the second heat source 4. It should be noted that when fan 6 operates, other airflow paths may be generated besides the aforementioned airflow paths. Therefore, this invention does not limit the existence of only a single airflow path, nor does it limit all airflow to following the aforementioned airflow path. Furthermore, the airflow paths (e.g., R) and directions (e.g., arrow directions) indicated in the figures are for illustrative purposes only and are not limitations of this invention.

[0080] Next, the details of each component will be explained.

[0081] In one embodiment, the material of the back frame 2 may include materials with high thermal conductivity, such as copper, aluminum, aluminum alloys, sheet metal, other suitable materials, or combinations thereof, but is not limited thereto. In another embodiment, the material of the back frame 2 may also include plastic, wood, ceramic, glass, other suitable materials, or combinations thereof, but is not limited thereto. In one embodiment, heat conduction is possible between the first heat source 3, the back frame 2, and the guide member 5, but is not limited thereto.

[0082] In one embodiment, the first heat source 3 can be any object that generates heat. In one embodiment, the first heat source 3 may include at least one light source 31 and a circuit board 32, wherein the light source 31 can be disposed on the circuit board 32. In this case, the first heat source 3 may be, for example, one or more light bars, and the type of light source 31 may be a light-emitting diode or a cold cathode fluorescent lamp (CCFL), but is not limited thereto. In another embodiment, the first heat source 3 may also be other devices that generate heat during operation, such as a display panel, memory, processor, motherboard, chip, circuit, antenna, or motor, etc., and is not limited thereto. For ease of explanation, this document uses the example of a light bar as the first heat source 3 for illustration. Furthermore, in one embodiment, the first heat source 3 may be fixed to the first side 2a of the back frame 2, but is not limited thereto. In one embodiment, the first heat source 3 may be directly attached to the first side 2a of the back frame 2, but in another embodiment, there may be a gap between the first heat source 3 and the back frame 2 (see reference). Figure 9 (Examples are provided, but are not limited to.) In another embodiment, the electronic device 1 further includes a diffuser plate 11 disposed adjacent to a first side 2a of the back frame 2, wherein a space may exist between the first heat source 3 and the diffuser plate 11. In one embodiment, the diffuser plate 11 may be disposed between the back frame 2 and the frame 12, but is not limited thereto. Furthermore, a dimming device 13 may be disposed on the diffuser plate 11, for example, the dimming device 13 may be disposed outside the diffuser plate 11 (e.g., on the side away from the first heat source 3). In one embodiment, the dimming device 13 may be, for example, a display panel, but is not limited thereto. In one embodiment, the back frame 2, the first heat source 3, and the diffuser plate 11 may be, for example, part of the backlight device of the display device, wherein the backlight device may be a direct-lit backlight device, but is not limited thereto.

[0083] In one embodiment, the circuit board 40 can be electrically connected to the circuit carrier board 32 of the first heat source 3, and a controller (not shown) can be provided on the circuit board 40 to control the brightness of the light source 31, but is not limited thereto. Furthermore, in one embodiment, multiple support members 7 can be provided between the circuit board 40 and the back frame 2. The support members 7 can be used to support the circuit board 40, forming a gap between the circuit board 40 and the back frame 2. In another embodiment, the support members 7 may not be provided between the circuit board 40 and the back frame 2, in which case the circuit board 40 can be directly attached to the second side 2b of the back frame 2 (not shown). In one embodiment, when the circuit board 40 is attached to the back frame 2, the second heat source 4 may include at least a portion of the circuit board 40 and the back frame 2 (e.g., the part in contact with the circuit board 40), but is not limited thereto.

[0084] In one embodiment, the guide 5 may be a heat sink, but is not limited thereto. When the guide 5 is a heat sink, it can assist the first heat source 3 and the back frame 2 in heat dissipation, for example, by conducting heat, but is not limited thereto. In one embodiment, the guide 5 may be a finned heat sink and may include at least one flow channel 501 (e.g., Figure 1 (As shown). In one embodiment, the flow channel 501 may extend to at least one edge 5c of the guide member 5, and the edge 5c of the guide member 5 includes at least one air vent. Therefore, when the fan 6 operates to generate airflow, at least a portion of the air in the guide member 5 may flow out from the air vent of the edge 5c via the flow channel 501. Furthermore, in one embodiment, when the guide member 5 includes multiple flow channels 501, these flow channels 501 may be configured to be horizontally arranged, radially arranged, or arranged in any shape, and are not limited thereto. In addition, the shape of the flow channels 501 is not limited, and the shape of each flow channel 501 may also be different. In one embodiment, the guide member 5 may use various commercially available products, and is not limited thereto. Furthermore, in one embodiment, the material of the guide member 5 may include materials with high thermal conductivity, such as metals or alloys such as copper, aluminum, and aluminum alloys, and is not limited thereto.

[0085] Fan 6 can be used for air intake, for example, it can be used to draw outside air into guide 5. In other embodiments, the invention may also include other fans for air extraction (see reference). Figures 12 to 15 Example (Example).

[0086] Furthermore, in one embodiment, the circuit board 40 may be positioned as an edge 5c adjacent to the guide member 5, and the air vent of the edge 5c may face the circuit board 40. Therefore, when the fan 6 operates, at least some of the air in the guide member 5 can flow out from the air vent of the edge 5c and flow towards the circuit board 40, at which time there is airflow around the circuit board 40, and its heat dissipation effect can be improved. In addition, when a support member 7 is provided between the circuit board 40 and the back frame 2, some air can also flow into the gap space between the circuit board 40 and the back frame 2, thereby improving the heat dissipation effect of the circuit board 40 and the back frame 2, but this is not a limitation.

[0087] Additionally, a cover 10 may be disposed above the circuit board 40. The cover 10 may shield at least a portion of the circuit board 40, thereby protecting the circuit board 40. In one embodiment, there may be a gap between the circuit board 40 and the cover 10, meaning the cover 10 may not contact the circuit board 40. In one embodiment, the cover 10 may be disposed above the circuit board 40 in various feasible ways, such as being locked to the back frame 2 or other mechanisms, and is not limited thereto. In one embodiment, a space may be defined at the overlap between the cover 10 and the back frame 2, and this space may have at least one first opening 101, so that some air can pass through the first opening 101, but is not limited thereto. In other embodiments, the present invention may not include the cover 10.

[0088] Therefore, when the fan 6 is running, the airflow can accelerate the heat dissipation of the electronic device 1, and is not limited to this.

[0089] This invention can also be implemented in different forms.

[0090] Figure 3 show Figure 1 A partial cross-sectional view of another embodiment of the electronic device 1 at section line A-A', and please also refer to... Figure 1 and Figure 2 .because Figure 3 Some features of the embodiments are applicable Figure 2 The embodiments will not be described in detail here; the following mainly focuses on the differences.

[0091] Compared to Figure 2 Example, Figure 3 In this embodiment, the guide member 5 extends a relatively long length in all tangential directions (e.g., direction Y) of the second side 2b of the back frame 2, and at least a portion of the circuit board 40 can be disposed on the guide member 5, and the two can be disposed correspondingly, for example, the two at least partially overlap in a normal direction (e.g., direction Z) of the circuit board 40. In other words, at least a portion of the circuit board 40 and the fan 6 can be disposed simultaneously on the second end 5b of the guide member 5.

[0092] like Figure 3 As shown, in one embodiment, a support member 7 may be provided between the circuit board 40 and the back frame 2, thus forming a gap space between at least a portion of the circuit board 40 and at least a portion of the back frame 2, but this is not a limitation. In one embodiment, a support member 7 may also be provided between the circuit board 40 and the guide member 5, thus forming a gap space between at least a portion of the circuit board 40 and at least a portion of the guide member 5, but this is not a limitation. In one embodiment, the gap space between the circuit board 40 and the back frame 2 and the gap space between the circuit board 40 and the guide member 5 may be connected, but this is not a limitation. By allowing air to flow in the gap space, the heat dissipation effect of the electronic device 1 can be improved.

[0093] In another embodiment, the support member 7 may not be provided between the circuit board 40 and the guide member 5. In this case, the circuit board 40 can directly abut against the second side 5b of the guide member 5, thus the guide member 5 can conduct heat to the circuit board 40. Therefore, the guide member 5 can assist the first heat source 3 and the circuit board 40 in heat dissipation to achieve a double-sided heat dissipation effect. In addition, in one embodiment, the second side 5b of the guide member 5 may have a groove for accommodating components on the circuit board 40 (see reference). Figure 5A and 5B Examples are provided, and improvements may be made, but this is not the only one.

[0094] Figure 4 show Figure 1A partial cross-sectional view of another embodiment of the electronic device 1 at section line A-A', and please also refer to... Figures 1 to 3 .because Figure 4 Some features of the embodiments are applicable Figure 2 The embodiments will not be described in detail here; the following mainly focuses on the differences.

[0095] Compared to Figure 2 Example, Figure 4 The electronic device 1 of the embodiment further includes a second guide 8 disposed on the second side 2b of the back frame 2. In one embodiment, the second guide 8 may be disposed adjacent to the guide 5, for example, adjacent to the edge 5c of the guide 5, but is not limited thereto. Furthermore, the circuit board 40 may be disposed correspondingly on the second guide 8. For example, in the normal direction (e.g., the Z direction), the circuit board 40 and the second guide 8 may at least partially overlap, but is not limited thereto. In one embodiment, a support 7 may be disposed between the circuit board 40 and the second guide 8 or between the circuit board 40 and the back frame 2, thus forming a gap space between at least a portion of the circuit board 40 and at least a portion of the second guide 8, and between at least a portion of the circuit board 40 and at least a portion of the back frame 2. In one embodiment, the gap space between the circuit board 40 and the second guide 8 may be connected to the gap space between the circuit board 40 and the back frame 2, but is not limited thereto. Furthermore, in another embodiment, the support 7 may not be disposed between the circuit board 40 and the second guide 8, in which case the circuit board 40 may directly abut against the second side 8b of the second guide 8, but is not limited thereto.

[0096] In one embodiment, the second guide 8 may be a heat sink, but is not limited thereto. In one embodiment, the second guide 8 may be a finned heat sink, and therefore may also include one or more flow channels (not shown in the figure). Furthermore, like the guide 5, when the second guide 8 includes multiple flow channels, these flow channels may be arranged horizontally, radially, or in any shape, and are not limited thereto, and the shape of each flow channel is also unrestricted. In addition, the arrangement of the flow channels 501 of the guide 5 may be the same as or different from the arrangement of the flow channels of the second guide 8, and the present invention is not limited thereto. In one embodiment, the material of the second guide 8 may include materials with high thermal conductivity, such as aluminum alloy, sheet metal, copper, aluminum, etc., and is not limited thereto.

[0097] Furthermore, in one embodiment, the thickness h1 of the guide 5 in the normal direction (e.g., the Z direction) and the thickness h2 of the second guide 8 in the normal direction (e.g., the Z direction) may be the same or different. For example, the thickness h1 of the guide 5 may be greater than, equal to or less than the thickness h2 of the second guide 8.

[0098] Therefore, the fan 6, guide 5, and second guide 8 can assist the first heat source 3 in heat dissipation (e.g., but not limited to heat conduction). Furthermore, when the fan 6 rotates, some air can flow in the channels of the guide 5 and the second guide 8, accelerating the heat dissipation of the electronic device 1. In addition, the arrangement of the guide 5 and the second guide 8 also achieves heat dissipation around them.

[0099] Figure 5A show Figure 1 A partial cross-sectional view of another embodiment of the electronic device 1 at section line A-A'. Figure 5B This embodiment corresponds to Figure 1 Partial side view at section line B-B', and please also refer to... Figures 1 to 4 .because Figure 5A and 5B Some features of the embodiments are applicable Figure 4 The embodiments will not be described in detail here; the following mainly focuses on the differences.

[0100] Compared to Figure 4 Example, Figure 5A and Figure 5B In this embodiment, the second guide 8 and guide 5 can be disposed adjacent to each other, and the second guide 8 can have at least one groove 82. At least one electronic component 41 can be disposed on the first side 4a of the circuit board 40, and no support member 7 needs to be disposed between the circuit board 40 and the second guide 8. Therefore, the circuit board 40 can directly abut against the second guide 8. The groove 82 can correspond to the electronic component 41, so when the first side 4a of the circuit board 40 abuts against the second side 8b of the second guide 8, the groove 82 can accommodate the electronic component 41. In one embodiment, the electronic component 41 can abut against the groove 82, thus the second guide 8 assists the electronic component 41 in heat dissipation (e.g., but not limited to heat conduction). In one embodiment, the electronic component 41 can be, for example, a control chip for the light source 31, but is not limited to this.

[0101] For example Figure 5B As shown, the groove 82 can be disposed between the multiple channels 81 of the second guide 8, so when the electronic component 41 is accommodated in the groove 82, the air flowing in the channels 81 can also increase the heat dissipation efficiency of the electronic component 41. In addition, since the electronic component 41 can be accommodated in the groove 82, the thickness of the electronic device 1 in the normal direction (e.g., the Z direction) can be reduced.

[0102] Therefore, the heat dissipation effect of electronic device 1 can be improved, or the thickness of electronic device 1 in the normal direction (e.g., the Z direction) can be reduced.

[0103] Figure 6 show Figure 1A partial cross-sectional view of another embodiment of the electronic device 1 at section line A-A', and please also refer to... Figures 1 to 5B .because Figure 6 Some features of the embodiments are applicable Figure 4 The embodiments will not be described in detail here; the following mainly focuses on the differences.

[0104] Compared to Figure 4 Example, Figure 6 The electronic device 1 of the embodiment further includes at least one heat pipe 9 disposed on the second side 2b of the back frame 2. In one embodiment, the heat pipe 9 may be disposed on the guide member 5, or disposed in the flow channel 501 of the guide member 5, but may also be disposed in other parts of the guide member 5, and is not limited thereto. In one embodiment, the second guide member 8 and the guide member 5 may be disposed adjacent to each other, and the heat pipe 9 may also be disposed on the second guide member 8, or disposed in the flow channel of the second guide member 8, but may also be disposed in other parts of the second guide member 8, and is not limited thereto. For example, in one embodiment, the heat pipe 9 may be disposed on both the guide member 5 and the second guide member 8; in another embodiment, the heat pipe 9 may be disposed between the guide member 5 and the second guide member 8 (not shown in the figure), for example, one end of the heat pipe 9 may be connected to the edge 5c of the guide member 5, and the other end of the heat pipe 9 may be connected to an edge of the second guide member 8; in another embodiment, the guide member 5 and the second guide member 8 may each be provided with a heat pipe 9, but the present invention is not limited thereto. In one embodiment, the heat pipe 9 may be filled with a condensate, such as, but not limited to, pure water, which may be used to assist the heat dissipation of the guide 5 or the second guide 8, but is not limited thereto.

[0105] With the heat pipe 9 installed, the heat dissipation effect of electronic device 1 can be further improved.

[0106] Furthermore, the guide element 5 of the present invention may also have other embodiments.

[0107] Figure 7 This is a schematic diagram of electronic device 1 according to another embodiment of the present invention. Figure 8 show Figure 7 A schematic cross-sectional view of an embodiment of the electronic device 1 along line A-A'. Because... Figure 7 and Figure 8 Some details and configuration methods of the embodiments are applicable Figure 1 and Figure 2 The following description focuses on the differences between the embodiments.

[0108] like Figure 7 and Figure 8As shown, the guide 5 in this embodiment can be a fan support frame. In the normal direction (e.g., the Z direction), the guide 5 can be disposed between the back frame 2 and the fan 6. In one embodiment, the guide 5 can be a hollow structure, but is not limited thereto. In one embodiment, the second side 5b of the guide 5 can have an opening (hereinafter referred to as the second opening 52), and the fan 6 can be disposed corresponding to the second opening 52. For example, in the normal direction (e.g., the Z direction), the second opening 52 and the fan 6 at least partially overlap. In addition, the guide 5 can have another opening (hereinafter referred to as the third opening 53) on at least one edge, wherein the third opening 53 can be configured to face the circuit board 40. Therefore, the third opening 53 can form an air vent. In one embodiment, the material of the fan support frame can be suitable for... Figure 2 The material of the heat sink in the embodiments will not be described in detail. Additionally, as... Figure 8 As shown, the guide 5 may have a bottom cover 5d disposed between the back frame 2 and the second side 5b, and the bottom cover 5d may be in direct contact with the back frame 2. However, in some embodiments, the guide 5 may not require the bottom cover 5d, while in other embodiments, the bottom cover 5d and the back frame 2 may contain other media layers.

[0109] In this embodiment, when the fan 6 rotates, the guide 5 can form part of the airflow path, wherein at least a portion of the air can flow into the guide 5 from the second opening 52, and at least a portion of the air can flow towards the circuit board 40 from the third opening 53, so that there is airflow around the circuit board 40, and the air flows out from the first opening 101. Therefore, the heat dissipation effect of the electronic device 1 can be improved.

[0110] Figure 9 show Figure 7 A cross-sectional view of another embodiment of the electronic device 1 along line A-A', and please also refer to... Figures 1 to 8 .because Figure 9 Some details and configuration methods of the embodiments are applicable Figure 8 The following description focuses on the differences between the embodiments.

[0111] exist Figure 9In one embodiment, the back frame 2 may have a first perforation 21, and the fan 6 may be positioned adjacent to the first perforation 21. In one embodiment, the fan 6 may be positioned corresponding to the first perforation 21, for example, in the normal direction (e.g., the Z direction), the first perforation 21 and the fan 6 at least partially overlap. Furthermore, the guide 5 may have an opening (hereinafter referred to as the fourth opening 54) corresponding to the first perforation 21. Additionally, the back frame 2 and the first heat source 3 may have a space between them. In one embodiment, to form the space, the first heat source 3 may be fixed to the end 2c of the back frame 2 or fixed to other components, or a support member may be provided between the first heat source 3 and the back frame 2, and the embodiment is not limited thereto. Therefore, when the fan 6 operates, at least a portion of the air may flow into the space between the back frame 2 and the first heat source 3 through the fourth opening 54 and the first perforation 21, and flow within the space between the back frame 2 and the first heat source 3.

[0112] Furthermore, in one embodiment, the back frame 2 may also have at least one second perforation 22. The location of the second perforation 22 of the back frame 2 may be adjacent to the end 2c of the back frame 2, for example, it may be located near the circuit board 40, but is not limited thereto. In this case, at least part of the air between the back frame 2 and the first heat source 3 can flow out through the second perforation 22, but is not limited thereto. In addition, there may also be airflow between the circuit board 40 and the first heat source 3 in this embodiment, so a part of an airflow path (e.g., R) may also be formed between the second heat source 4 and the first heat source 3. In addition, in another embodiment, a perforation may also be provided on the end 2c of the back frame 2, but is not limited thereto.

[0113] Therefore, airflow is possible between the back frame 2 and the first heat source 3, which can further improve the heat dissipation effect of the electronic device 1.

[0114] Figure 10 show Figure 7 A cross-sectional view of another embodiment of the electronic device 1 along line A-A', and please also refer to... Figures 1 to 9 .because Figure 10 Some details and configuration methods of the embodiments are applicable Figure 9 The following description focuses on the differences between the embodiments.

[0115] exist Figure 10In this embodiment, not only does the back frame 2 have a first perforation 21, but the first heat source 3 may also have at least one perforation (hereinafter referred to as the third perforation 33). Therefore, when the fan 6 operates, at least a portion of the air can flow into the space between the back frame 2 and the first heat source 3 through the fourth opening 54 and the first perforation 21 of the back frame 2, and flow in this space. Furthermore, at least a portion of the air in this space can further flow into a space between the first heat source 3 and the diffuser plate 11 through the third perforation 33 of the first heat source 3, thus there is airflow between the diffuser plate 11 and the first heat source 3. Therefore, the first heat source 3 can have airflow on both sides in the normal direction (e.g., the Z direction). In addition, airflow can also occur between the circuit board 40 and the back frame 2 or between the back frame 2 and the first heat source 3 in this embodiment, thus forming part of an airflow path (e.g., R) between the second heat source 4 and the first heat source 3.

[0116] In one embodiment, a perforation (not shown) may also be provided on the end 2c of the back frame 2, so that air in the space between the first heat source 3 and the diffuser plate 11 can also flow out through the perforation, but it is not limited to this.

[0117] Therefore, air can flow around the first heat source 3, which can improve the heat dissipation effect of the electronic device 1.

[0118] Figure 11 show Figure 7 A cross-sectional view of another embodiment of the electronic device 1 along line A-A', and please also refer to... Figures 1 to 10 .because Figure 11 Some details and configuration methods of the embodiments are applicable Figure 10 The following description focuses on the differences between the embodiments.

[0119] exist Figure 11 In the embodiment, the first heat source 3 and the end 2c of the back frame 2 may not be in contact at least partially, that is, in all tangential directions (e.g., the Y direction), there may be at least a gap 34 between the first heat source 3 and the end 2c of the back frame 2.

[0120] Therefore, when the fan 6 is operating, at least some air can also pass through the gap 34 and flow in the space between the first heat source 3 and the diffuser plate 11. Thus, air can flow around the first heat source 3, which can improve the heat dissipation effect of the electronic device 1.

[0121] Furthermore, the electronic device 1 of the present invention may also have different heat dissipation mechanisms.

[0122] Figure 12 This is a schematic diagram of electronic device 1 according to another embodiment of the present invention. Figure 13 show Figure 12A schematic cross-sectional view of an embodiment of the electronic device 1 along line C-C'. Because... Figure 12 and Figure 13 Some details and configuration methods of the embodiments are applicable Figure 1 and Figure 2 The following description focuses on the differences between the embodiments.

[0123] exist Figure 12 and Figure 13 In this embodiment, at least one perforation (hereinafter referred to as the fourth perforation 23) may be present near a first end 2f on the back frame 2, and at least one perforation (hereinafter referred to as the fifth perforation 24) may be present near a second end 2d on the back frame 2, wherein the first end 2f and the second end 2d are opposite to each other. Furthermore, a fan 14 may be disposed adjacent to the fifth perforation 24, or the fan 14 may be disposed correspondingly above the fifth perforation 24, for example, in the normal direction (e.g., the Z direction), the fan 14 and the fifth perforation 24 may at least partially overlap. In this embodiment, the fan 14 may be configured to exhaust air from the fifth perforation 24, but is not limited thereto. Furthermore, another fan support frame 15 may be disposed between the fan 14 and the back frame 2, but is not limited thereto. It should be noted that... Figure 13 The positions of the central fan 14 and each perforation are merely examples and not limitations.

[0124] In addition, in one embodiment, the first heat source 3 may have two opposing intervals (hereinafter referred to as the second interval 35 and the third interval 36), wherein the second interval 35 may be configured to be adjacent to the fourth perforation 23, and the third interval 36 may be configured to be adjacent to the fifth perforation 24, but is not limited thereto.

[0125] In one embodiment, when the fan 14 is operating, at least a portion of the air between the circuit board 40 and the back frame 2 or elsewhere can flow into the space between the first heat source 3 and the diffuser plate 11 through the fourth perforation 23 and the second gap 35, but is not limited thereto. In addition, at least a portion of the air between the first heat source 3 and the diffuser plate 11 can also flow to the fan 14 through the third gap 36 and the fifth perforation 24, and be discharged outside the electronic device 1 by the fan 14.

[0126] Therefore, the heat dissipation effect of electronic device 1 can be improved.

[0127] also, Figure 12 and Figure 13 The embodiments may also be combined with the foregoing embodiments.

[0128] Figure 14 This is a schematic diagram of electronic device 1 according to another embodiment of the present invention, and please also refer to... Figures 1 to 13 .because Figure 14 Some details and configuration methods of the embodiments can be applied to the foregoing embodiments (e.g.) Figure 8 and Figure 13The following description focuses on the differences from the example description.

[0129] like Figure 14 As shown, electronic device 1 may simultaneously include a fan 6 for air intake and a fan 14 for air extraction. In this embodiment, electronic device 1 may be... Figure 8 Examples and Figure 13 Integration of the examples.

[0130] Please also refer to Figure 8 , Figure 13 and Figure 14 When fans 6 and 14 are operating, fan 6 can draw air into guide 5, according to... Figure 14 and Figure 13 The structure shown allows air drawn in by fan 6 to be divided into at least two paths. After air is blown into the space between cover 10 and back frame 2 via the third opening 53 of guide 5, a portion of the air flows between the first heat source 3 and diffuser plate 11 through the fourth perforation 23 of back frame 2 and the second gap 35 of the first heat source 3. Furthermore, at least a portion of the air between the first heat source 3 and diffuser plate 11 can flow towards fan 14 via the fifth perforation 24 of back frame 2 and the third gap 36 of the first heat source 3. Therefore, if this can be achieved... Figure 13 The heat dissipation mechanism shown.

[0131] Furthermore, since the space between the cover 10 and the back frame 2 can have a first opening 101, another portion of the air, after flowing towards the circuit board 40 to assist in heat dissipation, is dissipated through the first opening 101, such as... Figure 8 As shown.

[0132] Although this embodiment is to Figure 13 The heat dissipation mechanism of the embodiment and Figure 8 The heat dissipation mechanism is integrated in this embodiment, but in other embodiments... Figure 13 The heat dissipation mechanism of the embodiment can also be compared with... Figures 2 to 6 Examples are combined, but not limited to.

[0133] Figure 15 show Figure 14 A cross-sectional view of another embodiment of the electronic device 1 along line C-C', and please also refer to... Figures 1 to 13 .because Figure 14 and Figure 15 Some details and configuration methods of the embodiments can be applied to the foregoing embodiments (e.g.) Figure 10 The following description focuses on the differences from the example description.

[0134] Please also refer to Figure 10 , Figure 14 and Figure 15Similar to the aforementioned embodiments, when fans 6 and 14 operate, fan 6 draws in air, which is then divided into multiple airflow paths. Air is blown into the space between the cover and the back frame through the third opening 53 of the guide 5. A portion of this air flows through the fourth perforation 23 into the space between the first heat source 3 and the back frame 2, while another portion flows through the fourth perforation 23 and the second gap 35 into the space between the first heat source 3 and the diffuser plate 11. Furthermore, as... Figure 15 As shown, a portion of the air between the first heat source 3 and the diffuser plate 11 or between the first heat source 3 and the back frame 2 can also flow to the fan 14 through the third gap 36 and the fifth perforation 24 and be discharged from the electronic device 1.

[0135] in addition, Figure 10 An alternative airflow path is shown. Since the space between the cover 10 and the back frame 2 has a first opening 101, the air blown into the space between the cover and the back frame through the third opening 53 of the guide 5, in addition to a portion flowing to the first heat source 3 through the fourth perforation 23, also flows to the circuit board 40 to assist in heat dissipation before being discharged through the first opening 101. Furthermore, when the fan 6 draws some air into the guide 5, some air can also flow into the space between the back frame 2 and the first heat source 3 through the fourth opening 54 and the first perforation 21, and even flow into the space between the first heat source 3 and the diffuser plate 11 through the third perforation 33.

[0136] This invention can at least be used as evidence of whether the object falls within the scope of protection by comparing the presence or absence of components and / or the configuration of components in electronic device 1, but is not limited thereto. Furthermore, an airflow sensor or similar sensor can be used to sense the presence or absence of airflow. Alternatively, a temperature sensor can also be used to determine the presence or absence of airflow, for example, by measuring the temperature at a specific location before and after fan operation.

[0137] In one embodiment, the electronic device 1 obtained in the foregoing embodiments can be used as a touch device. Furthermore, if the electronic device 1 obtained in the foregoing embodiments of the present invention is in the form of a display device or a touch display device, it can be applied to any product known in the art that requires a display screen, such as monitors, mobile phones, laptops, cameras, camcorders, music players, mobile navigation devices, televisions, vehicle dashboards, center consoles, electronic rearview mirrors, head-up displays, etc., which require displaying images.

[0138] Therefore, the present invention provides an improved electronic device that can improve the heat dissipation efficiency of electronic device 1, thereby solving the problem of poor heat dissipation in the prior art.

[0139] Features of the various embodiments of the present invention may be arbitrarily combined and used as long as they do not violate the spirit of the invention or conflict with it.

[0140] The above embodiments are merely examples for the purpose of illustration. The scope of the claims made in this invention should be determined by the claims of the patent application, and not limited to the above embodiments.

[0141] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electronic device, characterized in that, Include: A back frame; Multiple primary heat sources are located on a first side of the back frame and arranged in an extended manner; A second heat source is located on a second side of the back frame; A guide element is disposed on the second side of the back frame; and One fan, corresponding to the bootloader settings; Wherein, at least a portion of an airflow path is formed between the first heat source and the second heat source; The electronic device also includes a cover disposed on the second heat source; There is a gap between the cover and the second heat source, and the gap is part of the airflow path; The electronic device also includes a diffuser plate, and there is a gap between the first heat source and the diffuser plate. When the fan is running, there is airflow between the diffuser plate and the first heat source. The electronic device in question is a backlight device.

2. The electronic device of claim 1, wherein the first heat source comprises at least one light source.

3. The electronic device of claim 1, wherein the guide is a finned heat sink or a fan support, wherein the fan support has at least one opening and the opening faces the second heat source.

4. The electronic device of claim 1, wherein at least a portion of the second heat source is disposed on the guide.

5. The electronic device of claim 1, further comprising a second guide and a heat pipe, the second guide being disposed adjacent to the guide and the heat pipe being disposed on the second guide.

6. The electronic device of claim 1, further comprising a second guide disposed adjacent to the first guide, wherein the second guide includes a groove.

7. The electronic device of claim 1, wherein the back frame has at least one perforation, and the fan is adjacent to the perforation.

8. The electronic device of claim 7, wherein the fan is configured to ventilate the perforation.

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