A method for manufacturing quantum dot light conversion film

By spin-coating quantum dot polymer on the concave template and using temporary substrate transfer technology, combining high-resolution concave templates and viscous materials, the problem of poor quantum dot patterning effect in the prior art is solved, and a high-thickness and high-resolution quantum dot light conversion film is achieved, which is suitable for full-color display.

CN116017999BActive Publication Date: 2025-09-02GUANGDONG INST OF SEMICON IND TECH
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202211697899.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-28
Publication Date
2025-09-02
Estimated Expiration
2042-12-28

AI Technical Summary

Technical Problem

In the prior art, the quantum dot patterning effect is poor, the photolithography method damages the optical performance, the transfer film thickness is insufficient, and the inkjet printing method has low resolution, so it is impossible to achieve high-thickness and high-resolution quantum dot photoconversion films.

Method used

The quantum dot polymer composite is spin-coated with a concave template, and the excess material is transferred through a temporary substrate to form patterned quantum dots and transferred to the target substrate. High resolution concave templates are prepared using photolithography and deep silicon etching technology, combined with the use of viscous materials to achieve high thickness and high resolution.

Benefits of technology

It improves the depth and uniformity of quantum dot patterning, maintains the optical performance of quantum dot materials, and realizes high-thickness and high-resolution quantum dot light conversion films, suitable for full-color displays.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN116017999B_ABST
    Figure CN116017999B_ABST
Patent Text Reader

Abstract

The present application provides a method for producing a quantum dot light-conversion film, relating to the field of semiconductor technology. First, a concave plate is provided, wherein a plurality of patterned grooves are provided on the concave plate. A quantum dot polymer composite material is then spin-coated along the surface of the concave plate to form a quantum dot polymer film layer. Subsequently, a temporary substrate is provided, and the quantum dot polymer film layer is transferred to a temporary substrate. Excess quantum dot polymer composite material in the quantum dot polymer film layer is removed from the temporary substrate, and a plurality of patterned quantum dots are formed on the temporary substrate. Finally, the patterned quantum dots are transferred to a target substrate. The method for producing a quantum dot light-conversion film provided by the present application has the advantage of producing patterned quantum dots with better results.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a method for manufacturing a quantum dot light conversion film. Background Art

[0002] Display technology, as an important component of information technology and the terminal human-machine interface of the information chain, is one of the cornerstones of my country's electronic information industry. Currently, a variety of new display technologies are competing for development, such as liquid crystal display (LCD), organic light-emitting diode (OLED) display and micron light-emitting diode (mini / micro-LED). Among them, LCD technology has matured after years of development and is the mainstream of small and medium-sized display products. However, it still has technical problems such as poor color richness, dull colors, limited viewing angles, and slow response speeds. Although OLED display has advantages in response speed, contrast, viewing angles, flexibility and transparent display, the technology still has high costs and "burn-in" caused by differences in pixel lifespan. Mini / micro-LED display is a new display technology that miniaturizes and arrays LED devices. It has the characteristics of high brightness, high color saturation, ultra-high resolution, high power efficiency and good stability, but it still faces severe challenges in mass transfer and drive circuit design.

[0003] Quantum dots, as light-conversion materials with excellent properties such as high color purity, easily tunable emission wavelength, high quantum yield, and solution processability, can help overcome the barriers to these various display technologies. For example, quantum dots can be applied to active light-emitting devices such as blue OLEDs or mini / micro-LEDs to achieve full-color displays. However, two aspects remain to be considered: first, the stability, toxicity, synthesis scale, and cost of the quantum dot materials themselves; second, the development of suitable micro-nanofabrication technologies for patterned integration to produce high-resolution patterned quantum dot films.

[0004] Currently, the methods for quantum dot patterning mainly include photolithography, transfer printing and inkjet printing. Among them, photolithography causes significant damage to the optical properties of perovskite quantum dot materials, the film thickness obtained by transfer printing is too thin, and traditional inkjet printing cannot achieve high resolution.

[0005] In summary, the existing technology has the problem of poor effect of quantum dot patterning. Summary of the Invention

[0006] The purpose of the present application is to provide a method for manufacturing a quantum dot light conversion film to solve the problem of poor quantum dot patterning effect in the prior art.

[0007] In order to achieve the above objectives, the technical solutions adopted in the embodiments of the present application are as follows:

[0008] The present invention provides a method for manufacturing a quantum dot light conversion film, the method comprising:

[0009] Providing a concave plate, wherein the concave plate is provided with a plurality of patterned grooves;

[0010] Spin coating the quantum dot polymer composite material along the surface of the concave template to form a quantum dot polymer thin film layer;

[0011] Providing a temporary substrate and transferring the quantum dot polymer film layer to the temporary substrate;

[0012] removing excess quantum dot polymer composite material in the quantum dot polymer film layer on the temporary substrate, and forming a plurality of patterned quantum dots on the temporary substrate;

[0013] The patterned quantum dots are transferred to a target substrate.

[0014] Optionally, the step of providing a concave template includes:

[0015] providing a silicon substrate;

[0016] forming a photoresist mask along the surface of the silicon substrate;

[0017] The silicon substrate is etched based on the photoresist mask to form a recessed template.

[0018] Optionally, after the step of forming the concave template, the method further comprises:

[0019] The surface of the concave plate is subjected to OST treatment.

[0020] Optionally, the step of transferring the quantum dot polymer film layer to the temporary substrate comprises:

[0021] Spin coating an adhesive material on the surface of the temporary substrate;

[0022] The adhesive material is brought into contact with the quantum dot polymer film layer, and the quantum dot polymer film layer is transferred to the temporary substrate.

[0023] Optionally, the step of providing a temporary substrate includes:

[0024] Provide a glass substrate or a transparent flexible tape.

[0025] Optionally, the step of removing excess quantum dot polymer composite material in the quantum dot polymer film layer on the temporary substrate comprises:

[0026] The plasma etching technology is used to remove the redundant quantum dot polymer composite material in the quantum dot polymer film layer on the temporary substrate.

[0027] Optionally, the step of transferring the patterned quantum dots to a target substrate comprises:

[0028] providing a target substrate;

[0029] spin coating an adhesive material along the surface of the target substrate;

[0030] The adhesive material is used to contact the patterned quantum dots, and the patterned quantum dots are transferred to the temporary substrate.

[0031] Optionally, after the step of providing a temporary substrate, the method further comprises:

[0032] Spin coating a first adhesive material along the surface of the temporary substrate;

[0033] The step of spin coating an adhesive material along the surface of the target substrate comprises:

[0034] A second viscous material is spin-coated along the surface of the target substrate, wherein the viscosity of the second viscous material is greater than the viscosity of the first viscous material.

[0035] Optionally, the step of providing a target substrate includes:

[0036] Provide a glass substrate or a transparent flexible tape.

[0037] Optionally, after the step of transferring the patterned quantum dots to a target substrate, the method further comprises:

[0038] Spin coating a quantum dot polymer composite material of another color along the surface of the concave template, and transferring the quantum dot polymer composite material of the other color to a temporary substrate;

[0039] removing excess quantum dot polymer composite material in the quantum dot polymer thin film layer of another color on the temporary substrate, and forming a plurality of patterned quantum dots of another color on the temporary substrate;

[0040] The plurality of patterned quantum dots of another color is transferred to the target substrate.

[0041] Compared with the prior art, this application has the following beneficial effects:

[0042] The embodiment of the present application provides a method for producing a quantum dot light conversion film. First, a concave template is provided, wherein a plurality of patterned grooves are provided on the concave template. Then, a quantum dot polymer composite material is spin-coated along the surface of the concave template to form a quantum dot polymer film layer. Then, a temporary substrate is provided, and the quantum dot polymer film layer is transferred to a temporary substrate. Excess quantum dot polymer composite material in the quantum dot polymer film layer is removed on the temporary substrate, and a plurality of patterned quantum dots are formed on the temporary substrate. Finally, the patterned quantum dots are transferred to a target substrate. Since the present application produces the quantum dot polymer composite material on the concave template, the depth and uniformity of the patterned quantum dots can be improved, and the reusability of the concave template is high. In addition, the use of a temporary substrate and a target substrate to produce patterned quantum dots has no adverse effect on the optical properties of the quantum dot material itself, and has good applicability, thereby achieving a high-thickness and high-resolution quantum dot light conversion film.

[0043] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0045] Figure 1 This is an exemplary flow chart of the method for manufacturing the quantum dot light conversion film provided in an embodiment of the present application.

[0046] Figure 2 Provided in the embodiments of this application Figure 1 Flowchart of the sub-steps of S102.

[0047] Figure 3 Schematic diagram of the structure of the silicon substrate and mask provided in the embodiment of the present application.

[0048] Figure 4 This is a schematic diagram of the structure after etching provided in an embodiment of the present application.

[0049] Figure 5 A schematic structural diagram of the concave template after removing the photoresist provided in an embodiment of the present application.

[0050] Figure 6 A structural diagram corresponding to S104 is provided for the embodiment of the present application. DETAILED DESCRIPTION

[0051] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0053] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance.

[0054] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0055] In the description of this application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0056] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, or electrical connections; direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0057] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0058] As described in the background, current methods for quantum dot patterning primarily include photolithography, transfer printing, and inkjet printing. The photolithography process, which typically involves exposure, development, etching, and rinsing with polar solvents, significantly damages the optical properties of the quantum dot material, making this method less suitable. The film thickness obtained by the transfer printing method is too thin to effectively absorb blue light, making it unsuitable for preparing quantum dot films for light conversion. Traditional inkjet printing cannot achieve high resolution and may result in coffee ring effects and uneven film morphology. Consequently, the existing techniques suffer from poor quantum dot patterning results.

[0059] In view of this, in order to solve the above problems, the embodiment of the present application provides a method for manufacturing a quantum dot light conversion film. The following is an exemplary description of the method for manufacturing a quantum dot light conversion film provided by the present application:

[0060] As an optional implementation, see Figure 1 , the method comprising:

[0061] S102, providing a concave template, wherein a plurality of patterned grooves are provided on the concave template.

[0062] S104, spin coating the quantum dot polymer composite material along the surface of the concave template to form a quantum dot polymer thin film layer.

[0063] S106, providing a temporary substrate, and transferring the quantum dot polymer film layer to the temporary substrate.

[0064] S108, removing excess quantum dot polymer composite material in the quantum dot polymer film layer on the temporary substrate, and forming a plurality of patterned quantum dots on the temporary substrate.

[0065] S110, transferring the patterned quantum dots to a target substrate.

[0066] The patterning technology provided in this application has no adverse effects on the optical properties of the quantum dot material itself, has good applicability, and can achieve high-thickness and high-resolution quantum dot light conversion films.

[0067] As an implementation, see Figure 2 , S102 includes:

[0068] S1021, provide a silicon substrate.

[0069] S1022: forming a photoresist mask along the surface of the silicon substrate.

[0070] S1023, etching the silicon substrate based on the photoresist mask to form a recessed template.

[0071] Among them, photolithography technology and deep silicon etching technology are used to prepare silicon intaglio templates. The advantages are that the template can achieve high resolution, high groove depth, high verticality and uniformity, and the silicon template has higher stability in reuse than the elastic template.

[0072] In practice, see Figure 3 First, photoresist is coated on the surface of the silicon substrate. Then, a mask is used in combination with photolithography technology to etch the photoresist using ultraviolet light to form a patterned photoresist structure. Next, the silicon wafer is etched using deep silicon etching technology. Due to the effect of the photoresist, during the etching process, only the areas without photoresist will be etched, while the areas with photoresist will not be affected. The structure after etching is as follows: Figure 4 By this processing method, patterned grooves can be formed on the silicon substrate, and the depth of the grooves can be set to be relatively deep.

[0073] It should be noted that the patterning described in this application can be a pattern arranged in an array. Moreover, after the etching is completed, that is, after the patterned grooves are made on the silicon substrate, the photoresist mask can be removed to obtain a concave template. The structure of the concave template is as follows: Figure 5 shown.

[0074] Optionally, after step S102, the method further includes:

[0075] S103, performing OST treatment on the surface of the concave plate.

[0076] Among them, on the basis of the concave template, OTS is selected for surface treatment. Its advantage is that the surface modified by the OTS self-assembled monolayer has a lower surface energy, which is conducive to the subsequent peeling of the quantum dot polymer film.

[0077] When the quantum dot polymer composite material is spin-coated, since a plurality of patterned grooves are provided on the concave template, the quantum dot polymer composite material will fill the grooves and form a thin film on the surface of the concave template. Figure 6 Furthermore, the light conversion layer uses a composite material of quantum dots and polymers, which has the advantage of enhancing the stability of quantum dots and being able to be spin-coated to obtain a thin film with a thickness of micrometers, which is conducive to the effective absorption and conversion of blue light.

[0078] In addition, the quantum dot polymer composite material provided in the present application can be a material with a certain viscosity, and thus can be better spin-coated on the surface of the concave template.

[0079] As an implementation method, S106 includes:

[0080] S1061, spin-coating an adhesive material on the surface of the temporary substrate.

[0081] S1062, using an adhesive material to contact the quantum dot polymer film layer, and transferring the quantum dot polymer film layer to a temporary substrate.

[0082] Among them, a layer of sticky material that has no effect on light transmittance is spin-coated on the surface of the temporary transfer substrate. Its advantage is that it can enhance the interaction force between the interface layer and the quantum dot film, making it easier to pick up the quantum dot film.

[0083] After the quantum dot polymer composite material forms a film, a temporary substrate with a certain thickness of viscous material spin-coated on it is placed in contact with the quantum dot polymer composite material. The quantum dot polymer film layer is then separated from the concave template by surface OST treatment to transfer the quantum dot polymer film layer to the temporary substrate. Due to the OST treatment on the concave template surface, the quantum dot polymer film layer and the concave template can be separated more easily, achieving the effect of transferring using the temporary substrate.

[0084] It should be noted that, in order not to affect the luminescence performance of the quantum dots, the temporary substrate may be a transparent substrate such as a glass substrate or a transparent flexible tape.

[0085] Afterwards, the excess quantum dot polymer composite material in the quantum dot polymer film layer is removed on the temporary substrate, and a plurality of patterned quantum dots are formed on the temporary substrate; as an implementation method, the present application uses plasma etching technology to remove the excess quantum dot polymer composite material in the quantum dot polymer film layer on the temporary substrate.

[0086] It can be understood that when etching is performed using plasma etching technology, due to the effect of the concave template, the position of the quantum dots will become relatively thick. After etching, when the quantum dot polymer composite material at the remaining positions is completely etched, the material at the quantum dot position will remain and multiple patterned quantum dots will be formed on the temporary substrate.

[0087] Finally, the plurality of patterned quantum dots are transferred to a target substrate. As an implementation method, S110 includes:

[0088] S1101, providing a target substrate.

[0089] S1102 , spin-coating an adhesive material along the surface of the target substrate.

[0090] S1103, using an adhesive material to contact the patterned quantum dots and transfer the patterned quantum dots to a temporary substrate.

[0091] The target substrate can be a glass substrate or a transparent flexible tape, which does not affect the optical properties of the quantum dot material itself. The patterned quantum dot polymer film layer can be transferred to the target substrate by placing a glass substrate or a transparent flexible tape spin-coated with a certain thickness of adhesive material in contact with the quantum dot polymer film layer and then separating them. The adhesive layer material, glass substrate, and transparent flexible tape do not affect light transmission.

[0092] Furthermore, in order to ensure smooth transfer, a first viscous material is spin-coated along the surface of the temporary substrate; a second viscous material is spin-coated along the surface of the target substrate, and the viscosity of the second viscous material is greater than that of the first viscous material.

[0093] On the basis of the above implementation, in order to realize full-color display, the method further includes:

[0094] Spin coating a quantum dot-polymer composite material of another color along the surface of the concave template, and transferring the quantum dot-polymer composite material of the other color to a temporary substrate;

[0095] removing excess quantum dot polymer composite material in the quantum dot polymer film layer of another color on the temporary substrate, and forming a plurality of patterned quantum dots of another color on the temporary substrate;

[0096] A plurality of patterned quantum dots of another color is transferred to a target substrate.

[0097] For example, the patterned quantum dots of another color may be red patterned quantum dots, and the red patterned quantum dots may be integrated onto the same target substrate, thereby combining with blue light OLED or mini / micro-LED to achieve full-color display.

[0098] In summary, the embodiments of the present application provide a method for producing a quantum dot light conversion film. First, a concave template is provided, wherein a plurality of patterned grooves are provided on the concave template. Then, a quantum dot polymer composite material is spin-coated along the surface of the concave template to form a quantum dot polymer film layer. Then, a temporary substrate is provided, and the quantum dot polymer film layer is transferred to a temporary substrate. Excess quantum dot polymer composite material in the quantum dot polymer film layer is removed on the temporary substrate, and a plurality of patterned quantum dots are formed on the temporary substrate. Finally, the patterned quantum dots are transferred to a target substrate. Since the present application produces the quantum dot polymer composite material on the concave template, the depth and uniformity of the patterned quantum dots can be improved, and the reusability of the concave template is high. In addition, the use of a temporary substrate and a target substrate to produce patterned quantum dots has no adverse effects on the optical properties of the quantum dot material itself, and has good applicability, thereby achieving a high-thickness and high-resolution quantum dot light conversion film.

[0099] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

[0100] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present application is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A method for producing a quantum dot light conversion film, characterized in that: The method comprises: Providing a concave plate, wherein the concave plate is provided with a plurality of patterned grooves; Spin coating the quantum dot polymer composite material along the surface of the concave template to form a quantum dot polymer thin film layer; Providing a temporary substrate, spin-coating a first adhesive material along the surface of the temporary substrate, and transferring the quantum dot polymer film layer to the temporary substrate; removing excess quantum dot polymer composite material in the quantum dot polymer film layer on the temporary substrate, and forming a plurality of patterned quantum dots on the temporary substrate; transferring the patterned quantum dots to a target substrate; The step of transferring the patterned quantum dots to a target substrate comprises: providing a target substrate; Spin-coating a second viscous material along the surface of the target substrate, wherein the viscosity of the second viscous material is greater than the viscosity of the first viscous material; The adhesive material is used to contact the patterned quantum dots, and the patterned quantum dots are transferred to the temporary substrate.

2. The method for producing a quantum dot light conversion film according to claim 1, wherein: The steps of providing a concave template include: providing a silicon substrate; forming a photoresist mask along the surface of the silicon substrate; The silicon substrate is etched based on the photoresist mask to form a recessed template.

3. The method for producing a quantum dot light conversion film according to claim 2, wherein: After the step of forming the concave plate, the method further comprises: The surface of the concave plate is subjected to OST treatment.

4. The method for producing a quantum dot light conversion film according to claim 1, wherein: The step of transferring the quantum dot polymer thin film layer to the temporary substrate comprises: Spin coating an adhesive material on the surface of the temporary substrate; The adhesive material is brought into contact with the quantum dot polymer film layer, and the quantum dot polymer film layer is transferred to the temporary substrate.

5. The method for producing a quantum dot light conversion film according to claim 1, wherein: The steps of providing a temporary substrate include: Provide a glass substrate or a transparent flexible tape.

6. The method for producing a quantum dot light conversion film according to claim 1, wherein: The step of removing excess quantum dot polymer composite material in the quantum dot polymer film layer on the temporary substrate comprises: The plasma etching technology is used to remove the redundant quantum dot polymer composite material in the quantum dot polymer film layer on the temporary substrate.

7. The method for producing a quantum dot light conversion film according to claim 1, wherein: The step of providing a target substrate includes: Provide a glass substrate or a transparent flexible tape.

8. The method for producing a quantum dot light conversion film according to claim 1, wherein: After the step of transferring the patterned quantum dots to a target substrate, the method further comprises: Spin coating a quantum dot polymer composite material of another color along the surface of the concave template, and transferring the quantum dot polymer composite material of the other color to a temporary substrate; removing excess quantum dot polymer composite material in the quantum dot polymer thin film layer of another color on the temporary substrate, and forming a plurality of patterned quantum dots of another color on the temporary substrate; The plurality of patterned quantum dots of another color is transferred to the target substrate.

Citation Information

Patent Citations

  • Mold and preparation method and transfer printing method thereof

    CN113066948A