Heat dissipation structure with heat pipes for heat conduction
By using the design of heat dissipation base and thermal conductivity components in the optical transmission module, and using the evaporation and condensation cycle mechanism of the heat pipe, the problem of the inability to effectively dissipate the thermal energy of the optical transmission module is solved, and the rapid conduction of thermal energy is achieved, and the performance and reliability of the optical transmission module are improved.
Patent Information
- Application Number
- CN202111253921.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-10-27
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2041-10-27
AI Technical Summary
The thermal energy generated by the optical transmission module during operation cannot be effectively dispersed, resulting in performance degradation and reliability problems.
A heat dissipation structure including a heat dissipation base and a heat conduction assembly is adopted. The heat conduction assembly consists of an elastic fixture and a heat pipe. The heat pipe is in close contact with the light transmission module and the heat dissipation base through the elastic fixture, and uses the evaporation and condensation cycle mechanism of the heat pipe to quickly conduct thermal energy.
Effectively discharging the thermal energy of the astigmatism transmission module, ensuring its performance and reliability during operation, and preventing damage due to overheating.
Smart Images

Figure CN116027496B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a heat dissipation structure, and particularly to a heat dissipation structure that conducts heat through a heat pipe to further dissipate heat energy. Background Art
[0002] The main function of an optical transmission module (Transceiver) is to convert an optical signal into an electrical signal or convert an electrical signal into an optical signal, and it is a key component in the field of optical communication. Among them, a laser diode (Laser Diode) or a light emitting diode (Light Emitting Diode) is encapsulated in the optical transmission module to transmit an optical signal, and a photodiode (Pphotodiode) is encapsulated to receive the optical signal and convert the optical signal into an electrical signal.
[0003] During the operation of the above-mentioned laser diode, light emitting diode and photodiode, a large amount of heat energy will be generated. If this heat energy cannot be effectively dissipated, it will seriously affect the performance and reliability of the optical transmission module, and even cause the optical transmission module to be damaged due to overheating. Summary of the Invention
[0004] In view of the problems existing in the foregoing prior art, the purpose of the present invention is to provide a heat dissipation structure that conducts heat through a heat pipe, which can be used to assist electronic components such as optical transmission modules... to dissipate heat energy.
[0005] In order to achieve the above-mentioned invention purpose, the technical means adopted by the present invention is to make a heat dissipation structure that conducts heat through a heat pipe include:
[0006] A heat dissipation base, a through hole is formed through between its opposite ends;
[0007] At least one heat conduction component, which is installed in the through hole of the heat dissipation base, and each heat conduction component includes an elastic fixture and a heat pipe;
[0008] The elastic fixture has a body, two elastic pressing pieces and a through hole. One end edge of each elastic pressing piece is connected to the body. One elastic pressing piece protrudes forward from the front side of the body, and the other elastic pressing piece protrudes backward from the rear side of the body. Moreover, each elastic pressing piece has an outer side facing away from the body, and the through hole is formed through the body;
[0009] The heat pipe is in the shape of a long thin plate, and the heat pipe has two heat conduction sections and a connecting section. One heat conduction section protrudes forward from the front side of the body of the elastic fixture and is laminated on the outer side of the corresponding elastic pressing piece, and the other heat conduction section protrudes backward from the rear side of the body of the elastic fixture and is laminated on the outer side of the corresponding elastic pressing piece. The connecting section is formed between the two heat conduction sections and is passed through the through hole of the elastic fixture.
[0010] In the heat dissipation structure with heat conduction by heat pipes, the elastic fixture of each heat conduction component can further have an elastic clip, one edge of which is connected to the body and protrudes forward from the front side of the body.
[0011] In the heat dissipation structure with heat conduction by heat pipes, the elastic fixture of each heat conduction component can further have two fixing parts, which are arranged at opposite ends of the body and fixedly connected to the heat dissipation base.
[0012] In the heat dissipation structure with heat conduction by heat pipes, each fixing part of the elastic fixture of each heat conduction component can be in the shape of a hook bent towards the rear side of the body and hooked on the heat dissipation base.
[0013] In the heat dissipation structure with heat conduction by heat pipes, a plurality of heat dissipation fins can be formed on the outer wall surface of the heat dissipation base.
[0014] Through the above design, when an optical transmission module is inserted into the through hole of the heat dissipation base, the two elastic pressing pieces of the elastic fixture will respectively push against the two heat conduction sections of the heat pipe to be in contact with the optical transmission module and the heat dissipation base respectively. Thus, the heat energy generated when the optical transmission module is operating can be quickly and efficiently conducted to the heat dissipation base through the heat pipe for dissipation, so that the temperature rise of the optical transmission module can be effectively avoided, ensuring the performance and reliability of the optical transmission module during operation. Brief Description of the Drawings
[0015] Figure 1 It is a three-dimensional external view of the heat dissipation structure of the present invention in the use state.
[0016] Figure 2 It is a three-dimensional exploded view of the heat dissipation structure of the present invention in the use state.
[0017] Figure 3 It is a three-dimensional external view of the heat conduction component of the heat dissipation structure of the present invention.
[0018] Figure 4 It is a three-dimensional exploded view of the heat conduction component of the heat dissipation structure of the present invention.
[0019] Figure 5 It is a partial side-sectional view of the heat dissipation structure of the present invention in the use state.
[0020] Brief Description of the Reference Numerals in the Drawings
[0021] 10: Heat dissipation base
[0022] 11: Through hole
[0023] 12: Heat dissipation fin
[0024] 20: Heat conduction component
[0025] 21: Elastic fixture
[0026] 211: Body
[0027] 212: Fixing part
[0028] 213: Elastic clip
[0029] 214: Elastic pressing piece
[0030] 215: Perforation
[0031] 22: Heat pipe
[0032] 221: Heat conduction section
[0033] 222: Connection section
[0034] 30: Optical transmission module. Specific embodiments
[0035] The following is a further elaboration of the technical means adopted by the present invention to achieve the intended invention purpose in conjunction with the accompanying drawings and the preferred embodiments of the present invention.
[0036] See Figure 1 and Figure 2 As shown, it is a heat dissipation structure with heat conduction by a heat pipe according to the present invention. The heat dissipation structure can accommodate an optical transmission module (Transceiver) 30 therein to dissipate the heat generated when the optical transmission module 30 operates. The heat dissipation structure includes a heat dissipation base 10 and at least one heat conduction component 20.
[0037] As Figure 1 and Figure 2 As shown, a through hole 11 is formed through between the opposite ends of the heat dissipation base 10. The heat dissipation base 10 has an outer wall surface and an inner wall surface surrounding the through hole 11. A plurality of heat dissipation fins 12 are formed on the outer wall surface of the heat dissipation base 10 to help dissipate heat energy. Also, for better use effects, the heat dissipation base 10 can be made of a material with good heat conduction performance such as aluminum alloy or copper.
[0038] Further see Figures 2 to 4 As shown, the at least one heat conduction component 20 is installed in the through hole 11 of the heat dissipation base 10. Each heat conduction component 20 includes an elastic fixture 21 and a heat pipe 22.
[0039] The elastic fixture 21 is fixed on the inner wall surface of the heat dissipation base 10 and has a body 211, two fixing parts 212, an elastic clip 213, two elastic pressing pieces 214 and a perforation 215.
[0040] The body 211 is spaced from the inner wall surface of the heat dissipation base 10. The opposite two side surfaces of the body 211 are respectively defined as a front side surface and a rear side surface. When the elastic clamp 21 is fixed on the inner wall surface of the heat dissipation base 10, the rear side surface of the body 211 faces the inner wall surface of the heat dissipation base 10. The two fixing portions 212 are provided at the opposite ends of the body 211 and are fixedly connected to the heat dissipation base 10. In a specific embodiment of the present invention, each fixing portion 212 is in the shape of a hook bent towards the rear side surface of the body 211, so as to be fixedly connected to the heat dissipation base 10 in a hook-and-buckle manner. One end edge of the elastic clip 213 is connected to the body 211 and protrudes forward from the front side surface of the body 211.
[0041] The two elastic pressing pieces 214 are provided between the elastic clip 213 and one of the fixing portions 212. One end edge of each elastic pressing piece 214 is connected to the body 211. One elastic pressing piece 214 protrudes forward from the front side surface of the body 211, and the other elastic pressing piece 214 protrudes backward from the rear side surface of the body 211. Moreover, each elastic pressing piece 214 has an outer side surface facing away from the body 11. The perforation 215 is formed through the body 211.
[0042] The heat pipe 22 is in the shape of a long thin plate and is disposed through the perforation 215 of the elastic clamp 21. The heat pipe 22 has two heat conduction sections 221 and a connecting section 222. One of the heat conduction sections 221 protrudes forward from the front side surface of the body 211 of the elastic clamp 21 and is superposed on the outer side surface of the corresponding elastic pressing piece 214. The other heat conduction section 221 protrudes backward from the rear side surface of the body 211 of the elastic clamp 21 and is superposed on the outer side surface of the corresponding elastic pressing piece 214. The connecting section 222 is formed between the two heat conduction sections 221 and is disposed through the perforation 215 of the elastic clamp 21.
[0043] In a specific embodiment of the present invention, the perforation 215 is located between the two elastic pressing pieces 214. The connecting section 222 extends obliquely between the two heat conduction sections 221, so that the heat pipe 22 is bent at the connecting section 222 to be in a stepped shape, and the two heat conduction sections 221 are located in different planes and can be respectively superposed on the two elastic pressing pieces 214 of the elastic clamp 21.
[0044] In a specific embodiment of the present invention, the at least one heat conduction component 20 includes two heat conduction components 20. The two heat conduction components 20 are respectively installed on the opposite sides of the inner wall surface of the base 10, but not limited thereto. The at least one heat conduction component 20 can also only include one heat conduction component 20 or include more than two heat conduction components 20, depending on the heat dissipation requirements.
[0045] The above heat pipe 22 is a sealed and hollow metal tube body. Its closed chamber contains a cooling fluid and is also provided with a capillary structure. The liquid-phase cooling fluid absorbs heat at the evaporation section of the heat pipe 22 and vaporizes into a vapor-phase cooling fluid, which then flows to the condensation section of the heat pipe 22. After the vapor-phase cooling fluid is cooled and releases heat at the condensation section and condenses into a liquid-phase cooling fluid, it then returns to the evaporation section through the capillary structure. Through the cyclic change of the cooling fluid in the closed chamber between the liquid and vapor phases, the heat pipe 22 achieves the purpose of heat conduction. The specific structure and heat conduction mechanism of the heat pipe 22 are both prior arts and will not be further elaborated here.
[0046] See Figure 1 , Figure 3 and Figure 5 As shown, when the aforementioned optical transmission module 30 is inserted into the through-hole 11 of the heat dissipation base 10, the elastic clips 212 of the elastic clamp 21 will abut against the optical transmission module 30, thereby clamping and fixing the optical transmission module 30 in the through-hole 11. In addition, the two elastic pressing pieces 214 of the elastic clamp 21 will respectively push against the two heat conduction sections 221 of the heat pipe 22 to make them respectively abut against the inner wall surfaces of the optical transmission module 30 and the through-hole 11 of the heat dissipation base 10.
[0047] Thus, the heat energy generated when the optical transmission module 30 is operating can be quickly and efficiently conducted to the heat dissipation base 10 via the heat pipe 22 for further dissipation. Therefore, it can effectively prevent the temperature of the optical transmission module 30 from rising and ensure the performance and reliability of the optical transmission module 30 during operation.
[0048] The above description is only a preferred embodiment of the present invention and does not impose any formal restrictions on the present invention. Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art, without departing from the scope of the technical solution of the present invention, may make some changes or modifications to the above-disclosed technical content to form equivalent embodiments of equivalent changes. However, as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.
Claims
1. A heat dissipation structure with heat conduction by heat pipes, characterized in that, Comprising a heat dissipation base and at least one heat conducting component, wherein: A through hole is formed through between opposite ends of the heat dissipation base; The at least one heat conducting component is installed in the through hole of the heat dissipation base, and each heat conducting component includes an elastic clamp and a heat pipe; The elastic clamp is fixed on the inner wall surface of the heat dissipation base, and has a body, two elastic pressing pieces and a through hole. One end edge of each elastic pressing piece is connected to the body. One elastic pressing piece protrudes forward from a front side surface of the body, and the other elastic pressing piece protrudes backward from a rear side surface of the body. Moreover, each elastic pressing piece has an outer side surface facing away from the body, and the through hole is formed through the body; The heat pipe is in the shape of a long thin plate, and the heat pipe has two heat conducting sections and a connecting section. One heat conducting section protrudes forward from the front side surface of the body of the elastic clamp, and is superposed on the outer side surface of the corresponding elastic pressing piece. The other heat conducting section protrudes backward from the rear side surface of the body of the elastic clamp, and is superposed on the outer side surface of the corresponding elastic pressing piece. The connecting section is formed between the two heat conducting sections, and is inserted through the through hole of the elastic clamp.
2. The heat dissipation structure with heat conduction by heat pipes according to claim 1, wherein, The elastic clamp of each heat conducting component further has an elastic clip, and one end edge of the elastic clip is connected to the body and protrudes forward from the front side surface of the body.
3. The heat dissipation structure with heat conduction by heat pipes according to claim 1, characterized in that The elastic clamp of each heat conducting component further has two fixing portions, and the two fixing portions are arranged at opposite ends of the body and are fixedly connected to the heat dissipation base.
4. The heat dissipation structure with heat conduction by heat pipes according to claim 2, characterized in that, The elastic clamp of each heat conducting component further has two fixing portions, and the two fixing portions are arranged at opposite ends of the body and are fixedly connected to the heat dissipation base.
5. The heat dissipation structure with heat conduction by heat pipes according to claim 3 or 4, characterized in that, Each fixing portion of the elastic clamp of each heat conducting component is in the shape of a hook bent towards the rear side surface of the body and hooks onto the heat dissipation base.
6. The heat dissipation structure with heat conduction by heat pipes according to any one of claims 1 to 4, characterized in that, A plurality of heat dissipation fins are formed on the outer wall surface of the heat dissipation base.
Citation Information
Patent Citations
Optical module elastic structure radiator
CN112684549A
Heat dissipation structure conducting heat through heat pipe
CN216087403U
Heat radiation device
TWM315009U