A polishing pad conditioner and method of use

Abstract

This invention relates to the field of semiconductor processing technology, specifically to a polishing pad dresser and its usage method. The polishing pad dresser provided by this invention includes a polishing pad with several protrusions on its surface, the protrusions being adapted to rub a wafer when the polishing pad rotates; a base located on the side of the polishing pad; a transmission assembly rotatably connected at one end to the base; a dressing assembly including a body and a dressing head, one end of the body being connected to the other end of the transmission assembly, and the other end being movably connected to the dressing head; a diamond dressing layer is provided at the end of the dressing head near the polishing pad; and a first air outlet is located on the side of the dressing head near the polishing pad. The first air outlet provided by this invention adds a method for adjusting the roughness of the polishing pad by blowing air, and by combining it with the diamond dressing layer, extends the service life of the diamond dressing layer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, specifically to a polishing pad conditioner and its usage method. Background Technology

[0002] Chemical mechanical polishing (CMP) is a technique used in integrated circuit manufacturing to achieve global planarization, combining chemical and mechanical processes. During CMP, the surface of a wafer is fixed and aligned with a polishing pad rotating at a certain speed. Polishing fluid is applied to the pad, and planarization is achieved through the relative movement between the wafer and the pad. However, because the polishing pad is a consumable component, over time, the polyurethane coating on its surface flattens, resulting in a smooth surface and significantly reducing polishing speed and quality.

[0003] In existing technologies, to extend the service life of polishing pads, polishing pad dressers are typically used to restore the polishing pads to an appropriate roughness. A polishing pad dresser includes a dressing disc and a power unit. One side of the dressing disc has a layer of diamond particles. The power unit controls the dressing disc to rotate relative to the polishing pad, causing the diamond particles on the dressing disc to restore the flattened polyurethane on the polishing pad to an upright state, thereby increasing the roughness of the polishing pad and ensuring polishing rate and quality. During the movement of the dressing disc, not only is the roughness of the polishing pad restored, but the polishing fluid on the pad is also evenly distributed, and the flatness of the polishing pad is maintained. However, because the diamond particles on the surface of the dressing disc are prone to wear and detachment at the end of their use, these detached diamond particles can scratch the surface of the wafer, reducing yield. Furthermore, diamond particles are very expensive, and frequent replacement would result in high production costs. To reduce production costs, it is necessary to extend the service life of the diamond particles on the dressing disc. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the shortcomings of the existing polishing pad dresser which mainly uses diamond particles, but the replacement cost of diamond particles is expensive, resulting in high production cost, so as to provide a polishing pad dresser and a method of use.

[0005] To address the above problems, the present invention provides an abrasive pad conditioner, comprising:

[0006] A polishing pad has a plurality of protrusions on its surface, the protrusions being adapted to rub a wafer when the polishing pad rotates;

[0007] The base is located on the side of the grinding pad;

[0008] A transmission component, one end of which is rotatably connected to the base;

[0009] A dressing assembly includes a body and a dressing head. One end of the body is connected to the other end of the transmission assembly, and the other end is movably connected to the dressing head. The dressing head has a diamond dressing layer at one end near the abrasive pad. Driven by the transmission assembly, the dressing head has a first dressing state in which it descends to rub against the abrasive pad and rotates and reciprocates along the center to the edge of the abrasive pad, and a second dressing state in which it rises to be spaced apart from the abrasive pad and reciprocates along the center to the edge of the abrasive pad.

[0010] The first air outlet is located on the side of the dressing head near the grinding pad; the body has a passage connected to the first pump body, the first air outlet is connected to the passage, and is adapted to be opened when the dressing head is in the second dressing state.

[0011] Optionally, there are multiple first air outlets, spaced apart on the trimming head, and each first air outlet is connected to the passage via a first branch path.

[0012] Optionally, a second air outlet is also included, disposed on the side of the main body and connected to the passage via a second branch; the second air outlet is adapted to discharge air toward the edge of the abrasive pad when it is near the edge of the abrasive pad.

[0013] Optionally, a third air outlet is also included, disposed on the side of the main body and spaced apart from the second air outlet, and connected to the passage via a third branch; the third air outlet is adapted to discharge air toward the grinding head when it is close to the grinding head.

[0014] Optionally, the angle between the air outlet direction of the second air outlet and the air outlet direction of the third air outlet and the air outlet direction of the first air outlet is 35° to 45°.

[0015] Optionally, the polishing pad is provided with a plurality of grooves at intervals to accommodate polishing fluid;

[0016] The transmission assembly is further provided with a fourth air outlet on the side facing the grinding pad. The fourth air outlet is connected to the second pump body or the first pump body, and the fourth air outlet is adapted to discharge air toward the groove.

[0017] A method of use, applicable to the above-mentioned abrasive pad dresser, includes the following steps:

[0018] S1: Output polishing fluid to the polishing pad;

[0019] S2: Grind and adjust the roughness of the grinding pad;

[0020] S3: Clean the abrasive pad;

[0021] Step S2 includes: the dressing head entering the first dressing state and adjusting the roughness of the polishing pad through the diamond dressing layer, and the dressing head entering the second dressing state and adjusting the roughness of the polishing pad through the first air outlet.

[0022] Optionally, it also includes a second air outlet, disposed on the side of the main body and connected to the passage via a second branch; and a third air outlet, disposed on the side of the main body and spaced apart from the second air outlet, and connected to the passage via a third branch.

[0023] In step S2, while adjusting the roughness of the grinding pad by releasing air through the first air outlet, the second air outlet and the third air outlet are opened to release air and clean up the residue.

[0024] Optionally, the transmission assembly is further provided with a fourth air outlet on the side facing the grinding pad, and the fourth air outlet is connected to the second pump body or the first pump body;

[0025] A pre-cleaning step is included before step S1: the transmission assembly rotates around the base, and the fourth vent outlet vents air above the abrasive pad to pre-clean the abrasive pad.

[0026] Optionally, the transmission assembly is further provided with a fourth air outlet on the side facing the grinding pad, and the fourth air outlet is connected to the second pump body or the first pump body;

[0027] Step S3 includes: spraying high-pressure water onto the abrasive pad and opening the fourth air outlet to assist in cleaning and accelerate the drying of the abrasive pad.

[0028] The present invention has the following advantages:

[0029] 1. The polishing pad dresser provided by the present invention includes a polishing pad, a base, a transmission assembly, a dressing assembly, and a first air outlet. The polishing pad has several protrusions on its surface, which are adapted to rub the wafer when the polishing pad rotates. The base is located on the side of the polishing pad. One end of the transmission assembly is rotatably connected to the base. The dressing assembly includes a body and a dressing head. One end of the body is connected to the other end of the transmission assembly, and the other end is movably connected to the dressing head. The dressing head has a diamond dressing layer at the end near the polishing pad. Driven by the transmission assembly, the dressing head has a first dressing state where it descends to rub against the polishing pad and rotates, and reciprocates along the center to the edge of the polishing pad; and a second dressing state where it rises to a distance from the polishing pad and reciprocates along the center to the edge of the polishing pad. The first air outlet is located on the side of the dressing head near the polishing pad. The body has a passage connected to a first pump body, and the first air outlet communicates with the passage and is adapted to open when the dressing head is in the second dressing state.

[0030] This device adds a first air outlet to the dressing head, thereby increasing the method by which the dressing head adjusts the roughness of the polishing pad by blowing air. During wafer polishing, the dressing head can rotate and reciprocate along the center to the edge of the polishing pad, thereby maintaining the roughness of the polishing pad through friction between the diamond dressing layer and the polishing pad; the dressing head can also rise above the polishing pad and reciprocate along the center to the edge of the polishing pad, while simultaneously opening the first air outlet to blow air to maintain the roughness of the polishing pad. When the dressing head adjusts the roughness by blowing air, there is no friction between the diamond dressing layer and the polishing pad, thereby reducing the frequency of use of the diamond dressing layer and extending its service life.

[0031] The diamond dressing layer has the beneficial effects of uniform polishing fluid, cleaning polishing residue, and maintaining roughness during adjustment. The first air outlet also has the beneficial effect of maintaining roughness during adjustment. By combining the diamond dressing layer and air blowing adjustment methods, both roughness adjustment and the effects of uniform polishing fluid and cleaning polishing residue are achieved. This reduces the friction frequency of the diamond dressing layer, extends its service life, and thus reduces the replacement frequency and cost of the diamond dressing layer.

[0032] 2. The polishing pad trimmer provided by the present invention further includes a second air outlet, which is disposed on the side of the main body and is connected to the passage through a second branch; the second air outlet is adapted to discharge air toward the edge of the polishing pad when it is close to the edge of the polishing pad.

[0033] By setting a second air outlet, when the dressing head adjusts the roughness through the first air outlet, it can expel air towards the edge of the grinding pad through the second air outlet to clean the grinding residue on the grinding pad, thus preventing excessive accumulation of grinding residue and the resulting splashing of residue during the rotation of the grinding platform.

[0034] 3. The grinding pad dressing device provided by the present invention further includes a third air outlet, which is disposed on the side of the main body and spaced apart from the second air outlet, and is connected to the passage through a third branch; the third air outlet is adapted to discharge air toward the grinding head when it is close to the grinding head.

[0035] By setting a third air outlet, when the dressing head adjusts the roughness through the first air outlet, air can be vented towards the grinding head through the third air outlet to blow the grinding residue adhering to the grinding head onto the grinding pad. In conjunction with the second air outlet, the grinding residue on the grinding head and the grinding pad can be cleaned.

[0036] 4. The polishing pad dressing device provided by the present invention has a plurality of grooves spaced apart on the polishing pad, which are suitable for containing polishing fluid;

[0037] The transmission assembly is also provided with a fourth air outlet on the side facing the grinding pad, which is connected to the second pump body or the first pump body. The fourth air outlet is adapted to discharge air toward the groove.

[0038] By providing a fourth air outlet on the side of the transmission assembly that vents air towards the groove, the cleaning of the abrasive pad is facilitated, and the drying of the abrasive pad is also accelerated.

[0039] 5. The method of use provided by the present invention includes the following steps: S1: outputting polishing fluid to the polishing pad; S2: polishing and adjusting the roughness of the polishing pad; S3: cleaning the polishing pad. Step S2 includes: the dressing head entering a first dressing state and adjusting the roughness of the polishing pad through a diamond dressing layer, and the dressing head entering a second dressing state and adjusting the roughness of the polishing pad by venting air through a first air outlet.

[0040] By adding a first air outlet, the roughness of the dressing head is adjusted. The roughness of the grinding pad is maintained by combining the friction of the diamond dressing layer with the air outlet of the first air outlet. This not only extends the service life of the diamond dressing layer, but also retains the effect of uniform grinding fluid and cleaning grinding residue. Moreover, the structure is simple and the improvement cost is low.

[0041] 6. The method of use provided by the present invention further includes a second air outlet, which is disposed on the side of the main body and connected to the passage through a second branch; a third air outlet, which is disposed on the side of the main body and spaced apart from the second air outlet, and connected to the passage through a third branch; in step S2, air is released through the first air outlet to adjust the roughness of the grinding pad while cleaning the residue, and the second and third air outlets are opened to release air.

[0042] Air is released from the side of the dressing head through the second and third air outlets to clean the grinding head and grinding pad of grinding residue, respectively. While adjusting the air output through the first air outlet, the cleanliness of the grinding pad is maintained to prevent the wafer from being scratched by grinding residue.

[0043] 7. The method of use provided by the present invention includes a fourth air outlet on the side of the transmission component facing the grinding pad, which is connected to the second pump body or the first pump body; a pre-cleaning step is also included before step S1: the transmission component rotates around the base, and the fourth air outlet releases air above the grinding pad to pre-clean the grinding pad.

[0044] The fourth vent is used to clean the residue or dust on the grinding pad before grinding begins, ensuring the grinding quality of the wafer and improving the yield.

[0045] 8. The method of use provided by the present invention includes a fourth air outlet on the side of the transmission component facing the grinding pad, which is connected to the second pump body or the first pump body; step S3 includes: spraying high-pressure water onto the grinding pad and opening the fourth air outlet to assist in cleaning and accelerate the drying of the grinding pad.

[0046] By adding a fourth air outlet, water resources can be saved or eliminated, and the grinding pad is dried while the cleaning work is completed. Attached Figure Description

[0047] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0048] Figure 1 A schematic diagram showing the connection between the base and the dressing assembly of the abrasive pad dressing device provided by the present invention is shown.

[0049] Figure 2 A schematic diagram of the abrasive pad of the abrasive pad dresser provided by the present invention is shown.

[0050] Figure 3 A bottom view of the dressing head of the abrasive pad dressing device provided by the present invention is shown.

[0051] Figure 4 A cross-sectional view of the dressing head of the abrasive pad dresser provided by the present invention is shown.

[0052] Explanation of reference numerals in the attached figures:

[0053] 1. Grinding pad; 11. Grinding platform; 12. Infusion tube; 2. Base; 3. Transmission assembly; 4. Dressing assembly; 41. Body; 42. Dressing head; 5. First air outlet; 6. Second air outlet; 7. Third air outlet; 8. Grinding head; 9. Fourth air outlet. Detailed Implementation

[0054] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0055] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0056] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0057] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0058] This embodiment provides an abrasive pad dressing tool, such as Figures 1 to 4 As shown, it includes a grinding pad 1, a base 2, a transmission assembly 3, a trimming assembly 4, and a first air outlet 5.

[0059] The polishing pad 1 is a circular pad with several protrusions on its surface. These protrusions are adapted to rub the wafer when the polishing pad 1 rotates. Specifically, the protrusions are made of polyurethane fiber, which is prior art and will not be further described here. The base 2 is located on the side of the polishing pad 1. One end of the transmission assembly 3 is rotatably connected to the base 2. Specifically, as shown... Figure 1From the perspective shown, the transmission assembly 3 contains a driving wheel and a driven wheel, which are connected by a belt. The base 2 contains a first power device connected to the driving wheel, and the driven wheel is connected to the trimming assembly 4 via a first transmission shaft. The first power device drives the trimming assembly 4 to rotate around the first transmission shaft. Simultaneously, the first transmission shaft is connected to a vacuum pump via a connecting pipe. Pressurization or depressurization by the vacuum pump allows the trimming assembly 4 to move up and down along the axial direction of the first transmission shaft. The first power device can be a first rotary motor. Alternatively, the base 2 contains a linear motor, which drives the transmission assembly 3 to move up and down along the axial direction of the base 2, thereby achieving the up and down movement of the trimming assembly 4. Finally, the base 2 also contains a second power device connected to the transmission assembly 3 via a second transmission shaft, allowing the transmission assembly 3 to rotate around the axial direction of the base 2. The second power device can be a second rotary motor.

[0060] The trimming assembly 4 includes a body 41 and a trimming head 42. One end of the body 41 is connected to the other end of the transmission assembly 3, and the other end is movably connected to the trimming head 42. The materials of the body 41 and the trimming head 42 are not further specified here. Figure 3 As shown, the dressing head 42 has a diamond dressing layer at one end near the polishing pad 1, the diamond dressing layer being composed of diamond particles. Driven by the transmission assembly 3, the dressing head 42 has a first dressing state where it descends to rub against the polishing pad 1 and rotates, reciprocating along the center to the edge of the polishing pad 1; and a second dressing state where it rises to a distance from the polishing pad 1 and reciprocates along the center to the edge of the polishing pad 1. The first air outlet 5 is located on the dressing head 42 near the polishing pad 1; a passage is provided inside the body 41, the passage connecting to the first pump body, and the first air outlet 5 communicating with the passage and adapted to open when the dressing head 42 is in the second dressing state. Specifically, the passage can be a shaft hole or a pipe. The shape of the first air outlet 5 is not further limited here; for example, it can be circular, rectangular, etc.

[0061] This device adds a first air outlet 5 to the dressing head 42, thereby increasing the method by which the dressing head 42 adjusts the roughness of the polishing pad 1 by blowing air. During the wafer polishing process, the dressing head 42 can rotate and reciprocate along the center to the edge of the polishing pad 1, thereby maintaining the roughness of the polishing pad 1 through friction between the diamond dressing layer and the polishing pad 1; the dressing head 42 can also rise above the polishing pad 1 and reciprocate along the center to the edge of the polishing pad 1, while opening the first air outlet 5 to blow air to maintain the roughness of the polishing pad 1. When the dressing head 42 adjusts the roughness by blowing air, there is no friction between the diamond dressing layer and the polishing pad 1, thereby reducing the frequency of use of the diamond dressing layer and extending its service life.

[0062] The diamond dressing layer has the beneficial effects of uniform polishing fluid, cleaning polishing residue, and maintaining roughness during adjustment. The first air outlet 5 also has the beneficial effect of maintaining roughness during adjustment. By combining the diamond dressing layer and air blowing adjustment methods, both roughness adjustment and the effects of uniform polishing fluid and cleaning polishing residue are achieved. This reduces the friction frequency of the diamond dressing layer, extends its service life, and thus reduces the replacement frequency and cost of the diamond dressing layer.

[0063] Optionally, the grinding pad dressing device provided in this embodiment further includes a grinding platform 11. The grinding platform 11 is connected to a third power device via a third drive shaft. The third power device is adapted to drive the grinding platform 11 to perform a second rotational motion. The grinding pad 1 is disposed on the grinding platform 11 and rotates with the grinding platform 11. It should be noted that the first rotational motion and the second rotational motion are relative motions, and the direction and speed of the first rotational motion and the second rotational motion are not specifically limited here. As one specific implementation, the first rotational motion is counterclockwise at a speed of 100 rpm / min, and the second rotational motion is counterclockwise at a speed of 30 rpm / min. As another specific implementation, the first rotational motion is counterclockwise at a speed of 110 rpm / min, and the second rotational motion is counterclockwise at a speed of 40 rpm / min.

[0064] Optionally, such as Figure 4 As shown, there are multiple first air outlets 5, spaced apart on the trimming head 42, and each first air outlet 5 is connected to the passage through a first branch. The first branch can be a shaft hole or a pipe.

[0065] Optionally, such as Figure 2As shown, it also includes a second air outlet 6, disposed on the side of the main body 41 and connected to the passage via a second branch; the second air outlet 6 is adapted to discharge air toward the edge of the grinding pad 1 when near the edge of the grinding pad 1. By providing the second air outlet 6, when the dressing head 42 adjusts the roughness through the first air outlet 5, it can discharge air toward the edge of the grinding pad 1 through the second air outlet 6 to clean the grinding residue on the grinding pad 1, preventing excessive accumulation of grinding residue and subsequent splashing of residue during the rotation of the grinding platform. Optionally, there can be multiple second air outlets 6; the number of second air outlets 6 is not specifically limited here.

[0066] Optionally, the polishing pad dresser provided in this embodiment further includes a polishing head 8, one end of which is adapted to fix the wafer near the polishing pad 1 and to press the wafer onto the polishing pad 1 to perform a third rotational motion. The third rotation is relative to the second rotational motion. Since the polishing head 8 is prior art, it will not be described further here.

[0067] Optionally, the polishing pad dresser provided in this embodiment further includes a third air outlet 7, disposed on the side of the main body 41 and spaced apart from the second air outlet 6, and connected to the passage via a third branch path; the third air outlet 7 is adapted to emit air toward the polishing head 8 when it is close to the polishing head 8. By providing the third air outlet 7, when the dressing head 42 adjusts the roughness through the first air outlet 5, it can emit air toward the polishing head 8 through the third air outlet 7, thereby blowing the polishing residue adhering to the polishing head 8 onto the polishing pad 1, which, in conjunction with the second air outlet 6, achieves the cleaning of polishing residue on the polishing head 8 and the polishing pad 1. Optionally, there can be multiple third air outlets 7, and the number of third air outlets 7 is not specifically limited here.

[0068] Optionally, the angle between the air outlet direction of the second air outlet 6 and the third air outlet 7 and the air outlet direction of the first air outlet 5 is 35° to 45°, so that the second air outlet 6 and the third air outlet 7 can be aligned with the edge of the polishing pad 1 and the polishing head 8, respectively. In one specific embodiment, the angle between the air outlet direction of the second air outlet 6 and the third air outlet 7 and the air outlet direction of the first air outlet 5 is 35°; in another specific embodiment, the angle between the air outlet direction of the second air outlet 6 and the third air outlet 7 and the air outlet direction of the first air outlet 5 is 45°.

[0069] Optionally, the polishing pad 1 is provided with a plurality of grooves at intervals, suitable for containing polishing fluid; the transmission assembly 3 is also provided with a fourth air outlet 9 on the side facing the polishing pad 1, which is connected to the second pump body or the first pump body, and the fourth air outlet 9 is adapted to discharge air toward the grooves. Specifically, the grooves are annular, and a plurality of the grooves are concentrically arranged. There are multiple fourth air outlets 9, such as... Figure 1 As can be seen, the distance between two adjacent fourth air outlets 9 on the side of the transmission assembly 3 is equal to the distance between two adjacent grooves. The fourth air outlet 9 is connected to the second pump body or the first pump body via a connecting pipe, and the second pump body or the first pump body is adapted to output pure nitrogen gas. Optionally, the distance between the fourth air outlet 9 and the abrasive pad 1 is approximately 2-3 cm, for example, 2 cm or 3 cm, and the output pressure of the second pump body or the first pump body is 5-6 psi, for example, 5 psi or 6 psi, thus preventing insufficient cleaning power due to insufficient pressure, or excessive pressure causing residue to splash on the surface of the abrasive pad 1. In one specific embodiment, when the number of fourth air outlets 9 is less than the number of grooves, the transmission assembly 3 drives the fourth air outlets 9 to reciprocate along the center to the edge of the abrasive pad 1 for cleaning; in another specific embodiment, when the number of fourth air outlets 9 is equal to the number of grooves, the fourth air outlets 9 can directly discharge gas for cleaning, and the transmission assembly 3 does not need to move.

[0070] By providing the fourth air outlet 9 on the side of the transmission assembly 3 to vent air toward the groove, the cleaning of the abrasive pad 1 is facilitated, and the drying of the abrasive pad 1 is also accelerated.

[0071] A method of use, applicable to the above-mentioned polishing pad dresser, includes the following steps: S1. Outputting polishing fluid to the polishing pad 1; S2. Polishing and adjusting the roughness of the polishing pad 1; S3. Cleaning the polishing pad 1. Step S2 includes: the dressing head 42 entering a first dressing state and adjusting the roughness of the polishing pad 1 through the diamond dressing layer, and the dressing head 42 entering a second dressing state and adjusting the roughness of the polishing pad 1 by venting air through the first air outlet 5. During polishing, the polishing fluid flow rate is 190–210 ml / min, the downward pressure of the dressing head 42 contacting the polishing pad 1 is 5–5.5 psi, and the polishing time is typically about 45–50 seconds. Specifically, the polishing fluid flow rate can be 190 ml / min, the downward pressure of the dressing head 42 contacting the polishing pad 1 can be 5 psi, and the polishing time can be 45 seconds. Alternatively, the flow rate of the polishing fluid can be 210 ml / min, the downward pressure of the trimming head 42 contacting the polishing pad 1 can be 5.5 psi, and the polishing time can be 50 seconds.

[0072] In one specific implementation, the adjustment time for both the diamond dressing layer and the first air outlet 5 is half the grinding time, for example, 25 seconds, and the diamond dressing layer is adjusted first, followed by the adjustment of the first air outlet 5. In another specific implementation, the adjustment time for both the diamond dressing layer and the first air outlet 5 is half the grinding time, for example, 23 seconds, and the first air outlet 5 is adjusted first, followed by the adjustment of the diamond dressing layer. In yet another specific implementation, the diamond dressing layer and the first air outlet 5 are adjusted alternately, for example, the diamond dressing layer is adjusted for 5 minutes, then the first air outlet 5 is adjusted for 5 minutes, and this cycle continues until grinding is complete. In yet another specific implementation, the diamond dressing layer and the first air outlet 5 are adjusted simultaneously to improve the dressing efficiency of the dressing head 42, resulting in a better polishing effect for the polishing pad 1 and improving the polishing quality.

[0073] By adding the first air outlet 5, the roughness adjustment method of the dressing head 42 is increased. The roughness of the grinding pad 1 is maintained by combining the friction of the diamond dressing layer with the air outlet 5. This not only extends the service life of the diamond dressing layer, but also retains the effect of uniform grinding fluid and cleaning grinding residue. Moreover, the structure is simple and the improvement cost is low.

[0074] Optionally, the abrasive pad trimmer provided in this embodiment also includes an infusion tube 12, one end of which extends above the abrasive pad 1 and is adapted to output abrasive fluid or high-pressure water to the abrasive pad 1. As an alternative implementation, the high-pressure water can also be other cleaning fluids, which will not be further described here.

[0075] Optionally, the polishing pad dressing device provided in this embodiment further includes a second air outlet 6, which is disposed on the side of the main body 41 and connected to the passage through a second branch; and a third air outlet 7, which is disposed on the side of the main body 41 and spaced apart from the second air outlet 6, and connected to the passage through a third branch; in step S2, air is released through the first air outlet 5 to adjust the roughness of the polishing pad 1 while cleaning the residue, and the second air outlet 6 and the third air outlet 7 are opened to release air.

[0076] Air is released from the side of the trimming head 42 through the second air outlet 6 and the third air outlet 7 to clean the grinding residue on the grinding head 8 and the grinding pad 1, respectively. While adjusting the air output from the first air outlet 5, the cleanliness of the grinding pad 1 is maintained to prevent the wafer from being scratched by the grinding residue.

[0077] Optionally, the transmission assembly 3 is further provided with a fourth air outlet 9 on the side facing the grinding pad 1, which is connected to the second pump body or the first pump body; a pre-cleaning step is also included before step S1: the transmission assembly 3 rotates around the base 2, and the fourth air outlet 9 releases air above the grinding pad 1 to pre-clean the grinding pad 1.

[0078] The fourth air outlet 9 is used to clean the residue or dust on the polishing pad 1 before polishing begins, ensuring the polishing quality of the wafer and improving the yield.

[0079] Optionally, the transmission assembly 3 is further provided with a fourth air outlet 9 on the side facing the grinding pad 1, which is connected to the second pump body or the first pump body; step S3 includes: spraying high-pressure water onto the grinding pad 1, and opening the fourth air outlet 9 to assist in cleaning and accelerate the drying of the grinding pad 1. The fourth air outlet 9 can be opened first to clean the grinding pad 1, and then high-pressure water can be sprayed for cleaning, or the fourth air outlet 9 and high-pressure water can be sprayed simultaneously for cleaning. Preferably, high-pressure water is sprayed first for cleaning, and then the fourth air outlet 9 is opened for cleaning and drying.

[0080] By adding the fourth air outlet 9, water resources can be saved or eliminated, and the grinding pad 1 is dried while the cleaning work is completed.

[0081] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A polishing pad conditioner characterized by, include: A polishing pad (1) has a plurality of protrusions on its surface, the protrusions being adapted to rub the wafer when the polishing pad (1) rotates; The base (2) is located on the side of the grinding pad (1); The transmission assembly (3) is rotatably connected at one end to the base (2); The dressing component (4) includes a body (41) and a dressing head (42). One end of the body (41) is connected to the other end of the transmission component (3), and the other end is movably connected to the dressing head (42). The dressing head (42) has a diamond dressing layer at one end near the polishing pad (1). Driven by the transmission component (3), the dressing head (42) has a first dressing state in which it descends to rub against the polishing pad (1) and rotates and reciprocates along the center to the edge of the polishing pad (1), and a second dressing state in which it rises to be spaced apart from the polishing pad (1) and reciprocates along the center to the edge of the polishing pad (1). The first air outlet (5) is located on the dressing head (42) on one side near the grinding pad (1); the body part (41) has a passage inside, the passage is connected to the first pump body, the first air outlet (5) is connected to the passage, and is adapted to be opened when the dressing head (42) is in the second dressing state. The second air outlet (6) is provided on the side of the main body (41) and is connected to the passage through a second branch; the second air outlet (6) is adapted to discharge air toward the edge of the grinding pad (1) when it is close to the edge of the grinding pad (1); The third air outlet (7) is provided on the side of the main body (41) and spaced apart from the second air outlet (6), and is connected to the passage through a third branch; the third air outlet (7) is adapted to emit air toward the grinding head (8) when it is close to the grinding head (8).

2. The polishing pad conditioner of claim 1, wherein The first air outlet (5) has multiple outlets, which are spaced apart on the trimming head (42). Each first air outlet (5) is connected to the passage through a first branch.

3. The polishing pad conditioner of claim 1, wherein The angle between the air outlet direction of the second air outlet (6) and the air outlet direction of the third air outlet (7) and the air outlet direction of the first air outlet (5) is 35° to 45°.

4. The abrasive pad dresser according to any one of claims 1-3, characterized in that, The grinding pad (1) is provided with several grooves at intervals, which are suitable for containing grinding fluid; The transmission assembly (3) is also provided with a fourth air outlet (9) on the side facing the grinding pad (1). The fourth air outlet (9) is connected to the second pump body or the first pump body. The fourth air outlet (9) is adapted to discharge air toward the groove.

5. A method of use, characterized in that, The abrasive pad dressing tool applicable to any one of claims 1-4 comprises the following steps: S1: Output polishing fluid to the polishing pad (1); S2: Grind and adjust the roughness of the grinding pad (1); S3: Clean the abrasive pad (1); Step S2 includes: the dressing head (42) entering the first dressing state and adjusting the roughness of the polishing pad (1) through the diamond dressing layer, and the dressing head (42) entering the second dressing state and adjusting the roughness of the polishing pad (1) by venting through the first air outlet (5).

6. The method of use of claim 5, wherein, The grinding pad trimmer also includes a second air outlet (6), which is located on the side of the main body (41) and is connected to the passage through a second branch; and a third air outlet (7), which is located on the side of the main body (41) and is spaced apart from the second air outlet (6) and is connected to the passage through a third branch. In step S2, while adjusting the roughness of the grinding pad (1) by venting air through the first air outlet (5), the second air outlet (6) and the third air outlet (7) are opened to vent air and clean up the residue.

7. The method of use of claim 5, wherein, The transmission assembly (3) is also provided with a fourth air outlet (9) on the side facing the grinding pad (1), and the fourth air outlet (9) is connected to the second pump body or the first pump body; A pre-cleaning step is included before step S1: the transmission assembly (3) rotates around the base (2), and the fourth vent (9) vents air above the abrasive pad (1) to pre-clean the abrasive pad (1).

8. The method of use of claim 5, wherein, The transmission assembly (3) is also provided with a fourth air outlet (9) on the side facing the grinding pad (1), and the fourth air outlet (9) is connected to the second pump body or the first pump body; Step S3 includes: spraying high-pressure water onto the abrasive pad (1) and opening the fourth air outlet (9) to assist in cleaning and accelerate the drying of the abrasive pad (1).

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