A synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system

Abstract

The application discloses a synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system, and belongs to the field of material dynamic mechanical property characterization under high-speed impact loading. The application comprises a high-precision optical coding time expression module, a high-speed infrared temperature measurement module, a two-way light splitting optical module, a high-speed camera module and an impact loading module. The high-speed infrared temperature measurement module comprises an infrared optical sub-module, a planar array high-speed infrared detector and an infrared field coupling device. The application uses optical signal time coding and a planar array infrared temperature measurement module to mark high-precision time signals in a high-speed camera dynamic field and a two-dimensional infrared temperature measurement field respectively, matches the time of collected images of the deformation field and the temperature field by analyzing the time information of the collected images, realizes high-precision time sequence synchronization of impact loading, two-dimensional temperature field measurement and deformation field measurement, and further realizes high-precision time sequence synchronous measurement of the deformation field and the two-dimensional temperature field of the material under impact loading.

Description

TECHNICAL FIELD

[0001] The present application relates to a synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system, in particular to an experimental system for realizing loading, synchronous observation of deformation by a high-speed camera module and synchronous temperature measurement by a high-speed infrared temperature measurement module based on a split Hopkinson bar with visible light and infrared light time encoders, and belongs to the field of material dynamic mechanical property characterization under high-speed impact loading. BACKGROUND

[0002] In dynamic scenarios such as explosion, impact, high-speed cutting, materials under high-speed impact loading will produce complex failure behaviors different from static loading or quasi-static loading. The research on the deformation process and failure mechanism in the dynamic failure process of materials has become one of the research hotspots in solid mechanics, and has important scientific significance and engineering practical value for evaluating the dynamic mechanical properties of materials. Unlike static or quasi-static loading, the failure process of materials under dynamic impact loading is a process of coupling of force and heat. A large amount of heat is generated in the material interior under high strain rate, causing adiabatic temperature rise, and then affecting the mechanical properties of the material, so that it is difficult to accurately evaluate the dynamic performance of the material using static strength. Therefore, it is necessary to carry out time and space synchronous high-speed infrared temperature measurement and deformation measurement experiments to further study the deformation failure mechanism and dynamic strength of materials under dynamic loading.

[0003] At present, a few researchers use high-speed cameras and high-speed infrared temperature measurement instruments or commercial high-speed infrared cameras to observe the failure behavior of materials under dynamic loading, and measure the evolution of loading force, deformation field and temperature field in the dynamic failure process of materials. However, due to the wide plastic deformation region, large deformation gradient and extremely short failure process time in the dynamic failure process of some materials, the existing test system cannot simultaneously realize the synchronous measurement of two-dimensional temperature field and deformation field with high precision of 1us time resolution, which makes the existing equipment have certain limitations in studying the dynamic behavior of materials under dynamic loading. Moreover, when using high-speed cameras and high-speed infrared temperature measurement instruments at the same time, due to the different and random acquisition response time difference between the two devices, it is difficult to realize the synchronous measurement of deformation field information and temperature field information, so it is impossible to realize the impact loading, deformation field measurement and two-dimensional temperature field measurement with 1us time resolution accuracy. SUMMARY

[0004] In order to solve the problems of synchronous impact loading, deformation field observation and infrared temperature measurement, the impact loading, deformation field and two-dimensional temperature field observation with 1 microsecond time resolution cannot be realized. The main purpose of the present application is to provide a synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system, which uses optical signal time coding and face array infrared temperature measurement module to mark high-precision time signals in the high-speed camera dynamic field and two-dimensional infrared temperature measurement field respectively, realizes the time matching of the collected images of the deformation field and temperature field by analyzing the time information of the collected images, realizes the high-precision time sequence synchronization of impact loading, two-dimensional temperature field measurement and deformation field measurement, and further realizes the high-precision time sequence synchronous measurement of the deformation field and two-dimensional temperature field under the impact loading of the material, so as to improve the evaluation accuracy and efficiency of the dynamic failure mechanism and dynamic strength of the material.

[0005] The purpose of the present application is realized by the following technical solutions.

[0006] The synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system disclosed by the present application comprises a high-precision optical coding time expression module, a high-speed infrared temperature measurement module, a two-way light splitting optical module, a high-speed camera module and an impact loading module.

[0007] The high-speed infrared temperature measurement module and the high-speed camera module are arranged on the two sides of the impact loading module.

[0008] The two-way light splitting optical module is located between the high-speed infrared temperature measurement module and the impact loading module.

[0009] The high-speed camera module comprises a high-speed camera, a first lens, a second lens, a visible light field coupling device, a first high-brightness flash and a second high-brightness flash. The first lens is used for collecting light on the surface of the sample. The second lens is used for collecting a visible light high-precision coding signal. The visible light field coupling device comprises a light splitting prism and a coaxial light splitting adapter. The light splitting prism is located between the high-speed camera and the first lens, and realizes the coupling of the visible light high-precision coding signal into the field of view of the high-speed camera module. The coaxial light splitting adapter is used for mounting the light splitting prism and the first lens and the second lens.

[0010] The high-precision light coding time expression module comprises a visible light time coding signal generating unit and an infrared light time coding signal generating unit. The high-precision light coding time expression module is used to generate visible light high-precision time coding signals and infrared light high-precision time coding signals. The visible light time coding signal generating unit is located on one side of a high-speed camera module; the infrared light time coding signal generating unit is located on one side of a high-speed infrared temperature measurement module. The visible light time coding signal generating unit is composed of a first high-frequency time sequence coding signal driving circuit and a visible light source integrated array. The visible light source integrated array and the first high-frequency driving circuit are connected through a plug-in mode, so that different power, different number and different arrangement of visible light source arrays can be freely replaced to adapt to different acquisition scenes. The first high-frequency time sequence coding signal driving circuit has more than 5 high-frequency electrical signal output ports, and the electrical signal output from each port is a periodical square wave signal. The period of the electrical signal output from the No. 1 port is sequentially increased in a binary rule, so as to form a binary coding of the electrical signal, and the coding mode can be selected as a binary code or a Gray code. Each electrical signal output port of the first high-frequency time sequence coding signal driving circuit corresponds to a light source on the visible light source array. For the electrical signal output from any port, when the high level, the visible light source is in a high-brightness state; when the low level, the visible light source is in a non-brightness state; when the high level is converted into the low level, the visible light source is converted from bright to non-bright; conversely, the visible light source is converted from non-bright to bright. The light on / off state of the visible light source integrated array and the high / low level of the electrical signal output from the first high-frequency time sequence coding signal driving circuit present a mapping relationship, so as to convert the binary coding electrical signal of the first high-frequency time sequence coding signal driving circuit into the binary coding of the light signal of the visible light source integrated array. The visible light source has different on / off states at different times, so as to realize the binary high-precision coding expression of the visible light signal to time. The infrared light time coding signal generating unit is composed of a second high-frequency time sequence coding signal driving circuit and an infrared light source integrated array. The infrared light source integrated array and the second high-frequency driving circuit are connected through a plug-in mode, so that different power, different number and different arrangement of infrared light source arrays can be freely replaced to adapt to different acquisition scenes. The second high-frequency time sequence coding signal driving circuit has more than 5 high-frequency electrical signal output ports, and the electrical signal output from each port is a periodical square wave signal. The period of the electrical signal output from the No. 1 port is sequentially increased in a binary rule, so as to form a binary coding of the electrical signal, and the coding mode can be selected as a binary code or a Gray code. Each electrical signal output port of the second high-frequency time sequence coding signal driving circuit corresponds to a light source on the visible light source array. For the electrical signal output from any port, when the high level, the infrared light source is in a high-brightness state; when the low level, the infrared light source is in a non-brightness state; when the high level is converted into the low level, the infrared light source is converted from bright to non-bright; conversely, the infrared light source is converted from non-bright to bright.The on / off state of the light source of the infrared light source integrated array is in mapping relationship with the high / low level of the output electric signal of the second high frequency time sequence coding signal driving circuit, realizing the conversion of the binary coding electric signal of the second high frequency time sequence coding signal driving circuit into the binary coding of the light signal of the infrared light source integrated array. At different times, the visible light source has different on / off states, thereby realizing the binary high precision coding representation of the infrared light signal to time. The visible light time coding generation unit is used for realizing the flicker period adjustment of the binary coding light signal, thereby realizing the expression of visible light coding information with different time precision. The infrared light time coding generation unit is used for realizing the flicker period adjustment of the binary coding light signal, thereby realizing the expression of infrared light coding information with different time precision.

[0011] The high-speed infrared temperature measurement module comprises an infrared optical sub-module, a face array high-speed infrared detector and an infrared field coupling device. The infrared optical sub-module is used for collecting and transmitting the infrared signal and the infrared light coding time signal radiated by the measured object in the deformation process, and is composed of a 1x reflection type light path and a plane mirror. The face array high-speed infrared detector is used for collecting a two-dimensional infrared temperature image. The infrared field coupling device is used for miniaturizing the transmission of the infrared light high-precision coding signal and realizing the spatial array arrangement. The infrared field coupling device comprises a multi-in-one beam combining optical fiber and an optical fiber coupling mirror.

[0012] The bidirectional light splitting optical module is used for transmitting infrared light radiated by the object surface to the field of view of the high-speed infrared temperature measuring module, synchronously transmitting the light coding signal, and filtering the light interference of the high-brightness flash light in the field of view of the high-speed infrared temperature measuring module. The light interference of the high-brightness flash light includes the light interference entering the area array type high-speed infrared detector through the infrared optical sub-module and the light interference directly entering the infrared optical sub-module. The bidirectional light splitting optical module comprises a first dichroic mirror, a second dichroic mirror, an adjusting device and a light shielding plate. The first dichroic mirror and the second dichroic mirror filter the light interference entering the area array type infrared detector through the optical system. The first dichroic mirror reflects the visible light in the 460nm-760nm wave band reflected and radiated by the measured object surface, and the reflectivity is above 85%; only the infrared light in the 2.5um-5.0um wave band is transmitted, and the transmittance is above 85%; and the transmittance of the light in the 760nm-2.5um wave band is less than 5%. The second dichroic mirror transmits the infrared light in the 2.5um-5.0um wave band and reflects the light in the 950nm±50nm wave band, and the reflectivity is greater than 90%, and the light is transmitted to the field of view of the infrared optical sub-module. The plane mirror is used for reflecting the visible light wave band reflected by the first dichroic mirror to the field of view of the high-speed camera, and the reflectivity is greater than 90%. The adjusting device is used for mounting the first dichroic mirror and the second dichroic mirror, and realizing position adjustment. The light shielding plate is located between the infrared optical sub-module and the impact loading module, and comprises a square hole which can transmit the light beams of the first dichroic mirror and the second dichroic mirror, and realizes shielding of the interference light directly propagating to the area array type high-speed infrared detector.

[0013] After the infrared optical sub-module and the bidirectional light splitting optical module are respectively assembled, the optical axes are in the coaxial state, so that the infrared light coding signal can be coupled into the field of view of the area array type infrared detector according to the preset requirements.

[0014] The working method of the synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system disclosed by the application comprises the following steps:

[0015] Step one: adjusting the position of the light shielding plate, simultaneously adjusting the adjusting device to realize the relative position adjustment of the first dichroic mirror and the 1x reflective light path, so that the center position of the second dichroic mirror is consistent with the optical axis position of the 1x reflective light path, realizing the filtering of the light interference of the high-brightness flash light on the high-speed infrared temperature measuring module, and avoiding the shielding of the infrared temperature measuring field caused by the misplacement of different devices, and facilitating focusing.

[0016] Step two: adjusting the relative spatial position of the high-speed infrared temperature measuring module, so that the center position of the first dichroic mirror is consistent with the center position of the sample; realizing the clear focusing of the high-speed infrared temperature measuring module on the sample to be tested, and facilitating the accurate acquisition of the two-dimensional temperature field.

[0017] Step three: adjust the spatial position of the fiber coupling mirror so that the focal point of the fiber coupling mirror is located on the infrared light source of the infrared light source integrated array, reduce the light intensity loss of the infrared light encoding signal in the field coupling process, and improve the time resolution accuracy of the infrared light encoding signal.

[0018] Step four: adjust the spatial position of the multi-in-one beam combining fiber to realize clear imaging of the coded light signal by the area array type high-speed infrared detector, and the light signal array imaging position is located at the lower right of the field of view of the area array type high-speed infrared detector, so as to couple the infrared light encoding information into the two-dimensional temperature field collected by the high-speed infrared temperature measurement module, and save the effective field of view range of the high-speed infrared temperature measurement module on the sample.

[0019] Step five: adjust the relative spatial position of the first high-brightness flash lamp, the second high-brightness flash lamp and the sample in the high-speed camera module to realize clear imaging of the sample by the high-speed camera, and facilitate accurate acquisition of the deformation field.

[0020] Step six: adjust the second lens so that the high-speed camera can clearly image the visible light source on the visible light source integrated array; and adjust the positions of the visible light source array and the second high-frequency time sequence encoding signal driving circuit so that the imaging of the visible light source array is located at the bottom of the field of view of the high-speed camera; so as to couple the visible light encoding information into the deformation field collected by the high-speed camera module, and save the effective field of view range of the high-speed camera module on the sample.

[0021] Step seven: perform dynamic impact loading experiment to obtain visible light images and infrared temperature measurement images carrying high-precision light encoding time information, and realize time value expressed by high-precision light encoding time information in the images through the light encoding information time resolution module.

[0022] Step 7.1: identify the visible light encoding signal light source position and the infrared light encoding signal light source position in the collected visible light images and infrared temperature measurement images respectively;

[0023] Step 7.2: obtain the gray values of the visible light source and the infrared light source from the collected visible light images and infrared temperature measurement images respectively;

[0024] Step 7.3: determine the upper and lower limits of the visible light source and the infrared light source gray threshold value respectively, and normalize the visible light encoding light signal and the infrared light encoding light signal gray value to 0-1 value; wherein the value between 0 and 1 represents that the light source experiences the conversion process from bright to dark or from dark to bright within 1 μs of the collected image; the value represents the length of time before and after the conversion, which is calculated by the ratio of the bright-dark gray difference value and the light source flicker period, to realize the restoration of the visible light encoding signal and the infrared light encoding signal to binary time encoding respectively;

[0025] Step 7.4: the size of the decimal time coded binary time coded signal reduced back to the visible light encoding signal and the infrared light encoding signal is calculated respectively, and the time value corresponding to the image collected by the high-speed camera module and the high-speed infrared temperature measurement module is analyzed.

[0026] Step eight: according to the time value expressed by the high-precision light coding time information in the image analyzed in step seven, the visible light image and the infrared temperature measurement image with similar time are matched as the deformation field information and the two-dimensional temperature field information at the rounded time; the temperature field image collected by the high-speed infrared temperature measurement module can correspond to the deformation field image collected by the high-speed camera module one by one, and the collected deformation field information and the collected two-dimensional temperature field information are synchronized with 1us time resolution accuracy.

[0027] Step nine: according to the return signal when the high-speed camera collects the image, the time of each frame of the image of the high-speed camera relative to the loading time is determined, the image collected by the high-speed camera is matched with the loading information time, 1us time synchronization of the deformation field and the loading history is realized, and then 1us time resolution accuracy is realized. Synchronous test of impact loading, deformation field and two-dimensional temperature field.

[0028] Advantages:

[0029] 1. The synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system disclosed by the application is based on a high-precision light coding time expression module, a high-speed infrared temperature measurement module, a two-way split optical module, a high-speed camera module and an impact loading module, realizes two-dimensional temperature field measurement through the high-speed infrared temperature measurement module, realizes visible light deformation field observation through the high-speed camera module, realizes marking high-precision time signals in the high-speed camera dynamic field and the two-dimensional infrared temperature measurement field through light signal time coding and face array infrared temperature measurement module, realizes time matching of the collected images of the deformation field and the temperature field through analyzing the light coding time information in the collected images, and then realizes 1us time resolution time sequence synchronous impact loading, two-dimensional temperature field measurement and in-situ measurement of deformation field information, and then analyzes the dynamic failure mechanism and dynamic strength of the material.

[0030] 2. The synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system disclosed by the application realizes the transmission of light from the surface of an object to a high-speed infrared temperature measurement module and a high-speed camera module through a two-way light splitting optical module, and filters out the light interference of a high-brightness flash lamp on the infrared optical sub-module of the high-speed infrared temperature measurement module. The light interference of the high-brightness flash lamp directly entering the area array type high-speed infrared detector is filtered out by arranging a light shield plate between the high-speed infrared temperature measurement module and the impact loading module. The synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system disclosed by the application realizes in-situ measurement of two-dimensional temperature field information and deformation field information on the surface of a sample, and further analyzes the dynamic failure mechanism and dynamic strength of the material.

[0031] 3. The synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system disclosed by the application realizes the transmission of infrared light high-precision encoding signals to the infrared optical sub-module through a multi-in-one beam combining optical fiber, and realizes miniaturization and array arrangement of the light encoding signals, effectively saves the infrared field measurement range, facilitates adjustment of the coupling position of the light encoding signals in the infrared field, and reduces the actual test operation difficulty.

[0032] 4. The synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system disclosed by the application is applied to high-precision time sequence synchronous measurement of the deformation field and two-dimensional temperature field under material impact loading, and further analyzes the dynamic failure mechanism and dynamic strength of the material. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 The synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system;

[0034] Figure 2 The multi-in-one beam combining optical fiber;

[0035] Figure 3 The synchronous impact loading, deformation field and two-dimensional temperature field measurement time sequence alignment diagram, wherein: Figure 3 (a) is a loading information-time curve (loading information time: 79.0 μs), 3(b) is a high-speed camera module image acquisition (visible light encoding information analysis deformation field acquisition time: 79.3 μs), and 3(c) is a high-speed infrared temperature measurement module image acquisition (infrared light encoding information analysis two-dimensional temperature field acquisition time: 79.2 μs);

[0036] Wherein: 1-1-First high-brightness flash lamp, 1-2-First lens, 1-3-Coaxial beam splitter, 1-4-Beam splitter prism, 1-5-High-speed camera, 1-6-Second lens, 1-7-Second high-brightness flash lamp; 2-1-Visible light source integrated array, 2-2-First high-frequency timing code signal driving circuit, 2-3-Second high-frequency timing code signal driving circuit, 2-4-Infrared light source integrated array; 3-1-Fiber optic coupler; 3-2-Multi-in-one bundled fiber, 3-3-1×reflective optical path; 3-4-Plane reflector, 3-5-Area array high-speed infrared detector; 4-1-First dichroic mirror; 4-2-Second dichroic mirror; 4-3-Adjustment device, 4-4-Light shield; 5-1-Impact rod, 5-2-Incident rod, 5-3-Transmission rod; 6-Sample. Detailed Implementation

[0037] To better illustrate the purpose and advantages of the present invention, the invention will be further described below in conjunction with the accompanying drawings and examples.

[0038] The specific embodiments of the present invention will now be further described with reference to the accompanying drawings:

[0039] like Figure 1 As shown in the figure, this embodiment discloses a synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system, including a high-precision optical coding time expression module 2, a high-speed infrared temperature measurement module 3, a two-dimensional beam splitting optical module 4, a high-speed camera module 1 and an impact loading module 5.

[0040] The high-speed camera module includes a high-speed camera 1-5, a first lens 1-2, a second lens 1-6, a field-of-view coupling device (including a coaxial beam splitter 1-3 and a beam splitter prism 1-4), a first high-brightness flash 1-1, and a second high-brightness flash 1-7. The first lens 1-2 is used to collect light from the sample surface. The second lens 1-6 is used to acquire high-precision coded signals of visible light.

[0041] The high-precision optical coding time expression module includes a visible light time-coded signal generation unit (including a visible light source integrated array 2-1 and a first high-frequency timing coding signal driving circuit 2-2) and an infrared light time-coded signal generation unit (including a second high-frequency timing coding signal driving circuit 2-3 and an infrared light source integrated array 2-4). The high-precision optical coding time expression module is used to generate high-precision visible light time-coded signals and high-precision infrared light time-coded signals.

[0042] The high-speed infrared temperature measurement module comprises a 1x reflective light path 3-3, a plane mirror 3-4, a planar array high-speed infrared detector 3-5 and an infrared field coupling device (including a fiber coupling mirror 3-1 and a multi-in-one beam combining optical fiber 3-2). The infrared optical sub-module is used for collecting and transmitting the infrared signals and infrared light encoding time signals radiated by the measured object during the deformation process, and the planar array high-speed infrared detector 3-5 is used for collecting and transmitting the infrared temperature image. The infrared field coupling device is used for miniaturized transmission of the high-precision infrared light encoding signal and realization of spatial array arrangement.

[0043] The dichroic optical module 4 is used to transmit visible light reflected from the surface of the sample 6 to the field of view of the high-speed camera module 1, transmit infrared light radiated from the surface of the sample 6 to the field of view of the infrared thermography module 3, achieve synchronous transmission of optically encoded signals, and filter out light interference from the first high-brightness flash lamp 1-1 and the second high-brightness flash lamp 1-2 in the field of view of the infrared thermography module 3. The dichroic optical system 4 includes a first dichroic mirror 4-1, a second dichroic mirror 4-2, an adjustment device 4-3, and a light-shielding plate 4-4. The first dichroic mirror 4-1 and the second dichroic mirror 4-2 filter out light interference entering the area array infrared detector 3-5 through the 1×reflective optical path 3-3. The first dichroic mirror 4-1 is a 60mm*60mm square, tilted at 45° to the optical axis. It reflects visible light in the 460nm–760nm wavelength range from the surface of the test sample 6, with a reflectivity of over 85%. It transmits only infrared light in the 2.5μm–5.0μm wavelength range, with a transmittance of over 85%. For light in the 760nm–2.5μm wavelength range, the transmittance is less than 10%. The second dichroic mirror 4-2 is also a 60mm*60mm square, tilted at 45° to the optical axis. It transmits infrared light in the 2.5μm–5.0μm wavelength range and reflects light in the 950nm±50nm wavelength range, with a reflectivity greater than 90%. For light in the 760nm–2.5μm wavelength range, the transmittance is less than 10%, and it transmits the light to the field of view of the infrared temperature measurement module 3. The adjustment device 4-3 is used to install the first dichroic mirror 4-1 and the second dichroic mirror 4-2 and to adjust their positions. The light-shielding plate 4-4, located between the infrared optical submodule and the impact loading module 5, is an aluminum plate with a length of 500mm, a height of 500mm, and a thickness of 2mm. Its surface is coated with black paint to reduce light reflectivity. It includes a 45mm*65mm square hole through which the light beams of the first dichroic mirror 4-1 and the second dichroic mirror 4-2 can pass, thus blocking interference light directly propagating to the area array high-speed infrared detector 3-5. The adjustment device allows for three-dimensional position adjustment in the x, y, and z directions. It has internal grooves for fixing the first and second dichroic mirrors 4-1 and 4-2; its external dimensions are 45mm*65mm*10mm. After assembly, it fits tightly with the hole on the top of the light-shielding plate 4-4.

[0044] The impact loading module 5 includes an impact rod 5-1, an incident rod 5-2, and a transmission rod 5-3. The rods have a diameter of 14 mm, an impact rod length of 300 mm, an incident rod length of 1200 mm, and a transmission rod length of 1200 mm. It can realize impact loading on the sample 6.

[0045] according to Figure 1 The overall structural diagram shown illustrates the construction of the experimental platform;

[0046] The method for high-precision time sequence synchronous measurement of deformation field and two-dimensional temperature field under material impact loading is based on the high-precision time sequence synchronous impact loading, deformation field and two-dimensional temperature field in-situ measurement system based on light coding disclosed in the embodiment, and the specific implementation steps are as follows:

[0047] Step one: adjust the position of the light shield 4-4, adjust the device 4-3 at the same time, realize the adjustment of the relative position of the first dichroic mirror 4-1 and the 1x reflective light path 3-3, make the center position of the second dichroic mirror 4-2 consistent with the optical axis position of the 1x reflective light path 3-3, realize the filtering of the light interference of the first high-brightness flash lamp 1-1 and the second high-brightness flash lamp 1-2 on the high-speed infrared temperature measurement module 3, avoid the shielding of the infrared temperature measurement field caused by the misplacement of different devices, and facilitate focusing.

[0048] Step two: adjust the relative spatial position of the high-speed infrared temperature measurement module 3, so that the center position of the first dichroic mirror 4-1 is consistent with the center position of the sample 6; realize the clear focusing of the high-speed infrared temperature measurement module 3 on the test sample 6, and facilitate accurate acquisition of the two-dimensional temperature field.

[0049] Step three: adjust the spatial position of the optical fiber coupling mirror 3-1, so that the focal point position of the optical fiber coupling mirror 3-1 is located on the infrared light source of the infrared light source integrated array 2-4, reduce the light intensity loss of the infrared light coding signal in the field coupling process, and improve the time resolution accuracy of the infrared light coding signal.

[0050] Step four: adjust the spatial position of the multi-in-one beam combiner 3-2, realize clear imaging of the coded light signal by the area array type high-speed infrared detector 3-5, and the light signal array imaging position is located at the lower right of the field of view of the area array type high-speed infrared detector 3-5, realize the coupling of the infrared light coding information in the two-dimensional temperature field collected by the high-speed infrared temperature measurement module 3, and save the effective field of view range of the high-speed infrared temperature measurement module 3 on the sample 6.

[0051] Step five: adjust the relative spatial position of the first high-brightness flash lamp 1-1, the second high-brightness flash lamp 1-7 and the sample 6 in the high-speed camera module 1, realize clear imaging of the sample 6 by the high-speed camera 1-5, and facilitate accurate acquisition of the deformation field;

[0052] Step six: adjust the second lens 1-6, so that the high-speed camera 1-5 can clearly image the visible light source on the visible light source integrated array 2-1; and adjust the positions of the visible light source integrated array 2-1 and the second high-frequency time sequence coding signal driving circuit 2-2, so that the imaging of the visible light source integrated array 2-1 is located at the bottom of the field of view of the high-speed camera 1-5; realize the coupling of the visible light coding information in the deformation field collected by the high-speed camera module 1, and save the effective field of view range of the high-speed camera module 1 on the sample 6.

[0053] Step seven: dynamic impact loading experiment is carried out, visible light image (b) and two-dimensional infrared temperature measurement image (c) carrying high-precision light coding time information are obtained, and time value expressed by high-precision light coding time information in the image is analyzed through a light coding information time analysis module;

[0054] Step 7.1: visible light image (b) and infrared temperature measurement image (c) collected are respectively identified to obtain visible light coding signal light source position and infrared light coding signal light source position;

[0055] Step 7.2: visible light image (b) and infrared temperature measurement image (c) collected are respectively obtained to obtain visible light source and infrared light source gray value;

[0056] Step 7.3: visible light source and infrared light source gray threshold upper and lower limits are respectively determined, and visible light coding light signal and infrared light coding light signal gray value are normalized to 0-1 value; wherein the value between 0 and 1 represents that the light source experiences a conversion process from bright to dark or from dark to bright within 1 μs of the collected image; the value size represents the length of time before and after the conversion. Visible light coding signal and infrared light coding signal are restored to binary time coding.

[0057] Step 7.4: the size of the decimal number time value of the binary time coding restored by the visible light coding signal and the infrared light coding signal is calculated, and the time value corresponding to the image collected by the high-speed camera module 1 and the high-speed infrared temperature measurement module 3 can be analyzed.

[0058] Step eight: the test result is shown in Figure 3 According to the analyzed time value with 0.1 μs precision, visible light image (b) and infrared temperature measurement image (c) with similar time are selected and matched, as the deformation field information and two-dimensional temperature field information at the rounded time; the temperature field image collected by the high-speed infrared temperature measurement module 3 can be corresponded to the deformation field image collected by the high-speed camera module 1, and the collected deformation field information and two-dimensional temperature field information are synchronized with 1 μs time resolution precision.

[0059] Step nine: according to the return signal of the high-speed camera 1-5 when collecting the image, the time of each frame of the high-speed camera 1-5 relative to the loading time is determined, the image collected by the high-speed camera module 1 can be corresponded to the collected loading information time, 1 μs time synchronization of the deformation field and the loading history is realized. Further, the synchronous test of impact loading, deformation field and two-dimensional temperature field with 1 μs time resolution precision is realized. Finally, the purpose of analyzing the dynamic failure mechanism and dynamic strength of the material is realized.

[0060] The above detailed description of the specific description, the purpose, technical scheme and beneficial effects of the application are further described in detail, it should be understood that the above description is only a specific embodiment of the application, and is not used to limit the protection scope of the application, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the application should be included in the protection scope of the application.

Claims

1. A system for in-situ measurement of simultaneous shock loading, deformation field and two-dimensional temperature field, characterized by: The high-precision light coding time expression module, the high-speed infrared temperature measurement module, the two-way light splitting optical module, the high-speed camera module and the impact loading module are included. The high-speed infrared temperature measurement module and the high-speed camera module are arranged on the two sides of the impact loading module. The two-way light splitting optical module is located between the high-speed infrared temperature measurement module and the impact loading module. The high-speed camera module includes a high-speed camera, a first lens, a second lens, a visible light field coupling device, a first high-brightness flash and a second high-brightness flash; the first lens is used for collecting light on the surface of a sample; the second lens is used for collecting a high-precision coding signal of visible light; the visible light field coupling device includes a light splitting prism and a coaxial light splitting adapter; The light splitting prism is located between the high-speed camera and the first lens, and is used for coupling the high-precision coding signal of visible light into the field of view of the high-speed camera module; the coaxial light splitting adapter is used for mounting the light splitting prism, the first lens and the second lens; The high-precision light coding time expression module comprises a visible light time coding signal generating unit and an infrared light time coding signal generating unit; the high-precision light coding time expression module is used to generate visible light high-precision time coding signals and infrared light high-precision time coding signals; the visible light time coding signal generating unit is located on one side of the high-speed camera module; the infrared light time coding signal generating unit is located on one side of the high-speed infrared temperature measurement module; the visible light time coding signal generating unit is composed of a first high-frequency time sequence coding signal driving circuit and a visible light source integrated array; the visible light source integrated array and the first high-frequency driving circuit are connected through a plug-in mode, so that different power, different number and different arrangement of visible light source arrays can be freely replaced to adapt to different collection scenes; the first high-frequency time sequence coding signal driving circuit has more than 5 high-frequency electrical signal output ports, and the electrical signal output from each port is a periodically changing square wave signal; the period of the electrical signal output from the No. 1 port starts to increase in a binary rule, so that binary coding of the electrical signal is formed, and the coding mode can be selected as binary code or Gray code; each electrical signal output port of the first high-frequency time sequence coding signal driving circuit corresponds to a light source on the visible light source array; for the electrical signal output from any port, when the high level, the visible light source is in a high-brightness state; when the low level, the visible light source is in a non-brightness state; when the high level is converted into the low level, the visible light source is converted from bright to non-bright; conversely, the visible light source is converted from non-bright to bright; the light on / off state of the visible light source integrated array and the high / low level of the electrical signal output from the first high-frequency time sequence coding signal driving circuit present a mapping relationship, so that the binary coding electrical signal of the first high-frequency time sequence coding signal driving circuit is converted into the binary coding of the light signal of the visible light source integrated array; the visible light source has different on / off states at different times, so that the binary high-precision coding representation of the time by the visible light signal is realized; the infrared light time coding signal generating unit is composed of a second high-frequency time sequence coding signal driving circuit and an infrared light source integrated array; the infrared light source integrated array and the second high-frequency driving circuit are connected through a plug-in mode, so that different power, different number and different arrangement of infrared light source arrays can be freely replaced to adapt to different collection scenes; the second high-frequency time sequence coding signal driving circuit has more than 5 high-frequency electrical signal output ports, and the electrical signal output from each port is a periodically changing square wave signal; the period of the electrical signal output from the No. 1 port starts to increase in a binary rule, so that binary coding of the electrical signal is formed, and the coding mode can be selected as binary code or Gray code; each electrical signal output port of the second high-frequency time sequence coding signal driving circuit corresponds to a light source on the visible light source array; for the electrical signal output from any port, when the high level, the infrared light source is in a high-brightness state; when the low level, the infrared light source is in a non-brightness state; when the high level is converted into the low level, the infrared light source is converted from bright to non-bright; conversely, the infrared light source is converted from non-bright to bright.The on / off state of the light source of the infrared light source integrated array is in a mapping relationship with the high / low level of the output electrical signal of the second high-frequency time sequence coding signal driving circuit, so as to realize the conversion of the binary coding electrical signal of the second high-frequency time sequence coding signal driving circuit into the binary coding of the light signal of the infrared light source integrated array; the visible light source has different on / off states at different times, thereby realizing the binary high-precision coding representation of the infrared light signal on time; the visible light time coding signal generation unit is used for realizing the flicker period adjustment of the binary coding light signal, thereby realizing the expression of visible light coding information with different time precisions; the infrared light time coding signal generation unit is used for realizing the flicker period adjustment of the binary coding light signal, thereby realizing the expression of infrared light coding information with different time precisions. The high-speed infrared temperature measurement module includes an infrared optical sub-module, a planar array high-speed infrared detector and an infrared field coupling device; the infrared optical sub-module is used for collecting and transmitting infrared signals and high-precision time coding signals of infrared light radiated by a measured object during deformation, and is composed of a 1x reflective light path and a plane mirror; the planar array high-speed infrared detector is used for collecting a two-dimensional infrared temperature image; the infrared field coupling device is used for miniaturized transmission and spatial array arrangement of the high-precision time coding signals of infrared light; the infrared field coupling device includes a multi-in-one beam combiner and a fiber coupling mirror; The two-way light splitting optical module is used for transmitting infrared light radiated by an object surface to the field of view of the high-speed infrared temperature measurement module, synchronously transmitting light coding signals, and filtering out light interference of high-brightness flashes in the field of view of the high-speed infrared temperature measurement module; After the infrared optical sub-module and the two-way light splitting optical module are respectively assembled, the optical axes are in a coaxial state, so that the infrared light coding signals can be coupled into the field of view of the planar array high-speed infrared detector according to preset requirements.

2. A system for in-situ measurement of shock loading, deformation field and two-dimensional temperature field according to claim 1, characterized in that: In the two-way light splitting optical module, the light interference of the high-brightness flashes includes light interference entering the planar array high-speed infrared detector through the infrared optical sub-module and light interference directly entering the infrared optical sub-module; the two-way light splitting optical module includes a first dichroic mirror, a second dichroic mirror, an adjusting device and a light shield plate; the first dichroic mirror and the second dichroic mirror filter out the light interference entering the planar array high-speed infrared detector through the optical system; the first dichroic mirror reflects visible light in a 460nm-760nm wave band reflected and radiated by a measured object surface, and the reflectivity is above 85%. The infrared light of 2.5-5.0 μm band is transmitted with a transmittance of more than 85%, and the light of 760-2.5 μm band is transmitted with a transmittance of less than 5%; the second dichroic mirror transmits the infrared light of 2.5-5.0 μm band and reflects the light of 950 nm±50 nm with a reflectivity of more than 90%, and transmits the light into the field of view of the infrared optical sub-module; the plane mirror is used for reflecting the visible light reflected by the first dichroic mirror to the field of view of the high-speed camera with a reflectivity of more than 90%; the adjusting device is used for mounting the first dichroic mirror and the second dichroic mirror and adjusting the positions; the light shield is located between the infrared optical sub-module and the impact loading module, and comprises a square hole which can transmit the light beams of the first dichroic mirror and the second dichroic mirror, so as to shield the interference light directly transmitted to the surface array high-speed infrared detector.

3. A method for in-situ measurement of shock loading, deformation field and two-dimensional temperature field simultaneously, based on the system for in-situ measurement of shock loading, deformation field and two-dimensional temperature field simultaneously according to claim 1 or 2, characterized in that: The method comprises the following steps, Step one: adjusting the position of the light shield and the relative position of the first dichroic mirror and the 1× reflection optical path by adjusting the adjusting device, so that the center position of the second dichroic mirror is consistent with the optical axis position of the 1× reflection optical path, the high-brightness flash light is filtered to avoid the interference of the high-brightness flash light on the high-speed infrared temperature measurement module, and the infrared temperature measurement field is not shielded due to the misplacement of different devices, and the focusing is facilitated; Step two: adjusting the relative spatial position of the high-speed infrared temperature measurement module, so that the center position of the first dichroic mirror is consistent with the center position of the sample; The high-speed infrared temperature measurement module is clearly focused on the sample to be tested, and the two-dimensional temperature field is accurately obtained; Step three: adjusting the spatial position of the optical fiber coupling mirror, so that the focal point position of the optical fiber coupling mirror is located on the infrared light source of the infrared light source integrated array, the light intensity loss of the infrared light encoding signal in the field coupling process is reduced, and the time resolution accuracy of the infrared light encoding signal is improved; Step four: adjusting the spatial position of the multi-in-one beam combining optical fiber, so that the surface array high-speed infrared detector clearly images the encoding light signal, and the imaging position of the light signal array is located at the lower right of the field of view of the surface array high-speed infrared detector, the infrared light encoding information is coupled into the two-dimensional temperature field collected by the high-speed infrared temperature measurement module, and the effective field of view range of the high-speed infrared temperature measurement module on the sample is saved; Step five: adjusting the relative spatial position of the first high-brightness flash light, the second high-brightness flash light and the sample in the high-speed camera module, so that the high-speed camera clearly images the sample, and the deformation field is accurately obtained; Step six: adjusting the second lens, so that the high-speed camera clearly images the visible light source on the visible light source integrated array; and adjusting the positions of the visible light source array and the second high-frequency time sequence encoding signal driving circuit, so that the imaging of the visible light source array is located at the bottom of the field of view of the high-speed camera; the visible light encoding information is coupled into the deformation field collected by the high-speed camera module, and the effective field of view range of the high-speed camera module on the sample is saved; Step seven: performing a dynamic impact loading experiment, obtaining a visible light image and an infrared temperature measurement image carrying high-precision light encoding time information, and realizing the time value expressed by the high-precision light encoding time information in the image through a light encoding information time resolution module. Step eight: according to the time value expressed by the high-precision light coding time information in the image parsed in step seven, the visible light image and the infrared temperature measurement image with similar time are matched, as the deformation field information and two-dimensional temperature field information at the next time; The temperature field image collected by the high-speed infrared temperature measurement module can be one-to-one corresponding to the deformation field image collected by the high-speed camera module, and the collected deformation field information and the collected two-dimensional temperature field information are synchronized with 1us time resolution accuracy; Step nine: according to the return signal when the high-speed camera collects the image, the time of each frame of image of the high-speed camera relative to the loading time is determined, the image collected by the high-speed camera module is corresponding to the loading information time, the 1us time synchronization of the deformation field and the loading history is realized, and then the synchronous test of impact loading, deformation field and two-dimensional temperature field with 1us time resolution accuracy is realized.

4. The method of claim 3, wherein: the method further comprises: determining a temperature of the sample at the location of the sample at the time of the impact; and determining a temperature of the sample at the location of the sample at the time of the impact. The implementation method of step seven is, Step 7.1: the visible light coding signal light source position and the infrared light coding signal light source position are respectively identified in the collected visible light image and infrared temperature measurement image; Step 7.2: the visible light source and infrared light source gray value are respectively obtained in the collected visible light image and infrared temperature measurement image; Step 7.3: the upper and lower limits of the visible light source and infrared light source gray threshold value are respectively determined, and the visible light coding light signal and infrared light coding light signal gray value are normalized to 0~1 value; wherein the value between 0 and 1 represents that the light source experiences the conversion process from bright to dark or from dark to bright within 1us of the collected image; the size of the value represents the length of time before and after conversion, which is calculated by the ratio of the bright-dark gray difference value and the light source flicker period, so as to restore the visible light coding signal and infrared light coding signal to binary time coding respectively; Step 7.4: the size of the decimal time value of the binary time coding restored by the visible light coding signal and infrared light coding signal is calculated respectively, and the time value corresponding to the image collected by the high-speed camera module and the high-speed infrared temperature measurement module is parsed.

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