A compatible wafer carrier device

Abstract

The present invention relates to a compatible wafer carrier device, which includes a support tabletop and a product carrier. The product carrier is installed at the middle position on the support tabletop through a carrier base. Along the circumferential direction on the support tabletop outside the product carrier, a plurality of support seats with arc-shaped structures are evenly arranged. Two smoothing mechanisms are installed on the support seats, one smoothing mechanism is located on the side close to the product carrier, and the other smoothing mechanism is located on the side far from the product carrier. The present invention fills the gaps in the designs of the bare wafer loading table device and the wafer belt processing carrier device, and adds the smoothing operation of the smoothing mechanism to the bare wafer and the wafer belt. The present invention can select different smoothing devices and make adjustments according to the product warpage height and product size without disassembly and assembly.

Description

Technical Field

[0001] The present invention relates to the technical field related to wafer processing, and particularly to a compatible wafer stage device. Background Art

[0002] After a large amount of retrieval, it is found that the prior art publication number is CN217444361U, which discloses a quartz rotary adsorption stage, which successively includes a grooved quartz carrier plate, a quartz mounting plate, a stage base, a rotary motor and a rotary shaft backing plate from top to bottom. The rotary motor is installed at the middle position on the rotary shaft backing plate, and the driving end at the top of the rotary motor is drivingly connected to the upper stage base. A quartz mounting plate is installed on the stage base, and a grooved quartz carrier plate is installed on the inner side of the top of the quartz mounting plate. A plurality of sucker brackets are uniformly installed on the stage base along the circumferential direction, and suckers are installed on the sucker brackets. The present invention is a stage for adsorbing and fixing the processed products by a wafer cutting device, which solves the problem of adsorption flatness, has a firm adsorption and uniform adsorption force for the products, and at the same time provides a lighting source, and the backlight cooperates with the image to improve the positioning accuracy. The rotary shaft is matched with a grating scale system, which greatly improves the positioning accuracy.

[0003] On the current market, the processing stages for bare wafers (8 inches and 12 inches) and wafers with Fame (8-inch wafers with Fame, 12-inch wafers with Fame) correspond to different product sizes and product warping methods. Taking wafers with Fame as an example, most of them are processed by back cutting and front pressing, and the main method is to replace the stage and the pressing plate. However, during the laser processing of wafer products, precision processing processes such as grooving and edge cutting are mainly carried out, and convenient operation is required. Therefore, the above methods have the following problems:

[0004] When replacing the stage according to products of different sizes, due to the relatively strict processing process requirements of wafer products, the perpendicularity between the processing optical path and the processing stage device is less than 0.01 mm. However, after the processing stage device is disassembled and assembled, the flatness will change, and an included angle will appear with the corrected cutting optical path. Therefore, it is necessary to re-correct the flatness of the processing stage device and the perpendicularity with the processing optical path after trial cutting the product and measuring the actual size according to the image system. Therefore, when switching different models or series of products during the production process of wafer products, the disassembly and assembly time of the device is relatively long, the calibration workload is relatively large, and in the case of omission or mistake by the operator, it will cause batch defects in product processing.

[0005] In the processing of bare wafers, a vacuum circuit area is formed between the main product and the carrier table surface, and the warping is dealt with by forming a pressure difference on both sides of the product. In the processing of wafers with Fame, in order to prevent the influence of Fame warping on wafer processing, it is necessary to deal with not only wafer warping but also Fame warping, and simply coping with it by vacuum adsorption cannot meet the requirements. Since the connection between the wafer and Fame is mainly through a layer of sticky blue film without connection rigidity. Therefore, in the current market, processing is mainly carried out from the bottom, and the Fame is flattened by a pressing plate on the front side. However, flattening the warping by the pressing plate method will make the mechanism of the wafer processing carrier device complex, inconvenient for personnel to pick and place products, difficult for maintenance and replacement of product models, consuming too much manpower and time. At the same time, it is impossible to observe the processing and cutting optical states in real time, and it is troublesome to check abnormal processing.

[0006] In view of the above defects, the inventor actively conducts research and innovation in order to create a compatible wafer carrier device with higher industrial utilization value. Summary of the Invention

[0007] To solve the above technical problems, the object of the present invention is to provide a compatible wafer carrier device.

[0008] To achieve the above object, the present invention adopts the following technical solutions:

[0009] A compatible wafer carrier device includes a support table surface and a product carrier table. The product carrier table is installed at the middle position on the support table surface through a carrier table base. Along the circumferential direction on the support table surface outside the product carrier table, a number of support seats with an arc-shaped structure are evenly arranged. Two flattening mechanisms are installed on the support seats. One flattening mechanism is located on the side close to the product carrier table, and the other flattening mechanism is located on the side far from the product carrier table.

[0010] As a further improvement of the present invention, the flattening mechanism includes a cylinder mounting substrate, a lifting cylinder and a pressing plate. The lifting cylinder is installed on the support seat through the cylinder mounting substrate. The piston rod at the top of the lifting cylinder is connected to the pressing plate above. The pressing plate can be arranged to be in contact with the edge of the product carrier table or the edge of the support seat.

[0011] As a further improvement of the present invention, the first side of the pressing plate is connected to the piston rod below through a first connecting arm mechanism, and the second side of the pressing plate is connected to the cylinder mounting substrate and the piston rod below through a second connecting arm mechanism.

[0012] As a further improvement of the present invention, the first connecting arm mechanism includes a first connecting block and a second connecting block. The piston rod is connected to the upper first connecting block. The first side of the first connecting block is connected to the upper second connecting block through a rotating shaft. The second connecting block is connected to the first side of the upper pressing plate through a rotating shaft. The second connecting arm mechanism includes a third connecting block and a fourth connecting block. The second side of the pressing plate is connected to the first side of the lower third connecting block through a rotating shaft. The middle part of the third connecting block is connected to the lower fourth connecting block through a rotating shaft. The fourth connecting block is connected to the second side of the lower first connecting block through a rotating shaft. The second side of the third connecting block is connected to the lower cylinder mounting substrate through a rotating shaft.

[0013] As a further improvement of the present invention, a substrate adjusting block is further provided at the bottom of the cylinder mounting substrate. The substrate adjusting block is mounted on the support seat. The substrate adjusting block is connected to the upper cylinder mounting substrate through a plurality of substrate adjusting screws.

[0014] As a further improvement of the present invention, four arc-shaped support seats are evenly arranged along the circumferential direction on the outside of the product carrier.

[0015] As a further improvement of the present invention, one of the flattening mechanisms close to the product carrier is located on one side of the support seat, and the other flattening mechanism far from the product carrier is located in the middle of the support seat.

[0016] By means of the above solution, the present invention has at least the following advantages:

[0017] 1. The present invention fills the gaps in the designs of the bare wafer loading platform device and the wafer belt processing carrier platform device, and adds a flattening mechanism to perform flattening operations on the bare wafer and the wafer belt.

[0018] 2. The present invention can select different flattening devices and make adjustments according to the warpage height and size of the product without disassembly.

[0019] 3. The present invention is compatible with multiple sizes and can process multiple series of products, facilitating the switching of equipment processing and model change, and saving labor costs.

[0020] 4. The present invention avoids multiple debugging and repetitive work, has a simple structure, low cost, facilitates personnel maintenance, and improves work efficiency.

[0021] The above description is only an overview of the technical solution of the present invention. In order to be able to understand the technical means of the present invention more clearly and implement it in accordance with the content of the specification, the following further details the preferred embodiments of the present invention in conjunction with the drawings. Description of the Drawings

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0023] Figure 1 is a schematic structural diagram of a compatibility wafer carrier device of the present invention;

[0024] Figure 2 is Figure 1 the top view of;

[0025] Figure 3 is Figure 1 or Figure 2 the schematic structural diagram of the flattening mechanism in;

[0026] Figure 4 is the partial structural diagram of the product carrier, support base and flattening mechanism of the present invention in the normal state;

[0027] Figure 5 is Figure 4 the schematic structural diagram of the flattening mechanism in;

[0028] Figure 6 is the partial structural diagram of the product carrier, support base and flattening mechanism of the present invention in the working state;

[0029] Figure 7 is Figure 6 the schematic structural diagram of the flattening mechanism in.

[0030] Among them, the meanings of the reference numerals in the drawings are as follows.

[0031] Support table surface 1, carrier base 2, product carrier 3, support base 4, flattening mechanism 5, cylinder mounting substrate 6, substrate adjustment block 7, substrate adjustment screw 8, lifting cylinder 9, piston rod 10, first connection block 11, second connection block 12, pressing plate 13, third connection block 14, fourth connection block 15, rotating shaft 16. Specific embodiments

[0032] The following will further describe in detail the specific embodiments of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0033] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the present invention described and illustrated herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0034] Embodiment

[0035] As Figures 1 to 7 shown,

[0036] A compatible wafer stage device includes a support table 1 and a product stage 3. The product stage 3 is installed at the middle position on the support table 1 through a stage base 2. A plurality of arc-shaped support seats 4 are evenly arranged along the circumferential direction on the support table 1 outside the product stage 3. Two leveling mechanisms 5 are installed on the support seats 4. One leveling mechanism 5 is located on the side close to the product stage 3, and the other leveling mechanism 5 is located on the side far from the product stage 3. Among them, the leveling mechanism 5 close to the product stage 3 is located at one side position on the support seat 4, and the other leveling mechanism 5 far from the product stage 3 is located at the middle position on the support seat 4.

[0037] Among them, the specific description of the leveling mechanism 5:

[0038] The leveling mechanism 5 includes a cylinder mounting substrate 6, a lifting cylinder 9, and a pressing plate 13. The lifting cylinder 9 is installed on the support seat 4 through the cylinder mounting substrate 6. The piston rod 10 at the top of the lifting cylinder 9 is connected to the upper pressing plate 13. The pressing plate 13 can be arranged to contact the edge of the product stage 3 or the edge of the support seat 4. A substrate adjusting block 7 is further provided at the bottom of the cylinder mounting substrate 6. The substrate adjusting block 7 is installed on the support seat 4. The substrate adjusting block 7 is connected to the upper cylinder mounting substrate 6 through a plurality of substrate adjusting screws 8.

[0039] The first side of the pressing plate 13 is connected to the piston rod 10 below through the first connecting arm mechanism, and the second side of the pressing plate 13 is connected to the cylinder mounting substrate 6 and the piston rod 10 below through the second connecting arm mechanism. Among them, the first connecting arm mechanism includes a first connecting block 11 and a second connecting block 12. The piston rod 10 is connected to the upper first connecting block 11. The first side of the first connecting block 11 is connected to the upper second connecting block 12 through a rotating shaft 16, and the second connecting block 12 is connected to the first side of the upper pressing plate 13 through the rotating shaft 16. The second connecting arm mechanism includes a third connecting block 14 and a fourth connecting block 15. The second side of the pressing plate 13 is connected to the first side of the lower third connecting block 14 through a rotating shaft 16. The middle of the third connecting block 14 is connected to the lower fourth connecting block 15 through a rotating shaft 16. The fourth connecting block 15 is connected to the second side of the lower first connecting block 11 through a rotating shaft 16. The second side of the third connecting block 14 is connected to the lower cylinder mounting substrate 6 through a rotating shaft 16.

[0040] Refer to Figures 1 to 2 As shown, a compatible wafer carrier device includes a support table 1, a product carrier 3, and a support base 4. The main features are as follows: The product carrier 3 is fixed to the support table 1 by bolts, so that the component device is fixed on the equipment moving axis, and cooperates with the other axes of the equipment to process the entire area of the product. The product carrier 3 is used to support the processed product, compatible with 8-inch and 12-inch bare wafers and 8-inch wafer tapes. The product is fixed through the adsorption groove, and a vacuum cavity is formed between the adsorption groove and the product to cope with the warping of the wafer product. The support base 4 is used to support the 12-inch wafer tape product and fix the flattening mechanism 5 at the same time. The flattening mechanism 5 is used to cope with the warping of the processed product wafer tape.

[0041] The lifting cylinder 9 of the flattening mechanism 5 is fixed to the support base 4 through the cylinder mounting substrate 6. At the same time, the device buffer pad is fixed to the piston rod 10 of the lifting cylinder 9, which is used to absorb the vibration generated by the movement of the lifting Z device and achieve the silent effect of the movement of the lifting Z device. The first connecting arm mechanism and the second connecting arm mechanism are fixed in a hinge structure manner with the lifting cylinder 9 and the cylinder mounting substrate 6 as the main body. Through the rotation of the rotating shaft 16 and the mutual limiting and matching method with the pressing plate 13, the first connecting block 11, the second connecting block 12, the third connecting block 14, and the fourth connecting block 15 can all achieve two-degree-of-freedom movement. As Figure 4 and Figure 5 shown, in the normal state, when the piston rod 10 of the lifting cylinder 9 is in the retracted state, the first connecting block 11, the second connecting block 12, the third connecting block 14, and the fourth connecting block 15 form an angle as Figure 4 and Figure 5 , and the pressing plate 13 forms an angle with the horizontal direction, which is convenient for preventing the product from being accidentally bumped.

[0042] AsFigure 6 and Figure 7 As shown in Figure 6 and Figure 7 , when the piston rod 10 of the lifting cylinder 9 is in the extended state during the working state, the first connecting block 11, the second connecting block 12, the third connecting block 14 and the fourth connecting block 15 form an angle as shown in Figure 6 and Figure 7 , and the pressing plate 13 is parallel to the horizontal direction or has a negative included angle, so that the warpage of the wafer tape can be completely smoothed out. Figure 6 and Figure 7 The substrate adjusting block 7 and the substrate adjusting screw 8 mainly adjust the lifting cylinder 9 to cope with the warpage height of products with different thicknesses according to the horizontal heights of the pressing plate 13, the product stage 3 and the support seat 4. As shown in Figure 6 and Figure 7 , in the working state of the flattening mechanism 5, the pressing plate 13 is in close contact with the product stage 3 and the support seat 4.

[0043] The present invention can realize the compatible processing of two series of four products, namely bare wafers (8 inches and 12 inches) and wafer tapes (8 inches and 12 inches). When processing other model products, after the stage and the optical path cutting are vertically corrected at one time, there is no need to replace the stage later and re-correct the verticality and a series of problems, avoiding batch defects in product processing and unnecessary property losses. Figure 6 and Figure 7 As shown in Figure 6 and Figure 7 , in the working state of the flattening mechanism 5, the pressing plate 13 is in close contact with the product stage 3 and the support seat 4.

[0044] The present invention can realize the compatible processing of two series of four products, namely bare wafers (8 inches and 12 inches) and wafer tapes (8 inches and 12 inches). When processing other model products, after the stage and the optical path cutting are vertically corrected at one time, there is no need to replace the stage later and re-correct the verticality and a series of problems, avoiding batch defects in product processing and unnecessary property losses.

[0045] The present invention mainly solves the processing compatibility of wafer tapes (8 inches and 12 inches) and the complex problem of flattening the warpage of wafer tapes. Through a simple mechanical flattening device, the wafer tapes with different warpage heights and different thicknesses are flattened in segments to avoid the influence of the warpage of the wafer tapes on the wafer processing process. The processing and the flattening mechanism are on the same side of the front, which is convenient for personnel to manually pick and place products, debug the working condition of the equipment, observe the processing state and process accuracy of the equipment, timely correct the processing performance, reduce the equipment manufacturing cost, simplify the equipment structure, facilitate the later maintenance by personnel, improve the work efficiency of personnel, and improve the processing capacity of the equipment.

[0046] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0047] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific circumstances.

[0048] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the technical principle of the present invention, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A compatible wafer carrier device, comprising a support tabletop (1) and a product carrier (3). The product carrier (3) is installed at the middle position on the support tabletop (1) through a carrier base (2). The product carrier (3) is used to support bare wafers and wafer tapes. Characterized in that, On the support tabletop (1) outside the product carrier (3), a number of support seats (4) with an arc-shaped structure are evenly arranged along the circumferential direction. Two flattening mechanisms (5) are installed on the support seats (4). One of the flattening mechanisms (5) is located on the side close to the product carrier (3), and the other flattening mechanism (5) is located on the side far from the product carrier (3). The flattening mechanism (5) includes a cylinder mounting substrate (6), a lifting cylinder (9) and a pressing plate (13). The lifting cylinder (9) is installed on the support seat (4) through the cylinder mounting substrate (6). The piston rod (10) at the top of the lifting cylinder (9) is connected to the pressing plate (13) above. The pressing plate (13) can be arranged to contact the edge of the product carrier (3) or the edge of the support seat (4). The first side of the pressing plate (13) is connected to the piston rod (10) below through a first connecting arm mechanism. The second side of the pressing plate (13) is connected to the cylinder mounting substrate (6) and the piston rod (10) below through a second connecting arm mechanism. A substrate adjusting block (7) is further provided at the bottom of the cylinder mounting substrate (6). The substrate adjusting block (7) is installed on the support seat (4). The substrate adjusting block (7) is connected to the cylinder mounting substrate (6) above through a number of substrate adjusting screws (8).

2. A compatible wafer carrier device according to claim 1, Characterized in that, The first connecting arm mechanism includes a first connecting block (11) and a second connecting block (12). The piston rod (10) is connected to the first connecting block (11) above. The first side of the first connecting block (11) is connected to the second connecting block (12) above through a rotating shaft (16). The second connecting block (12) is connected to the first side of the pressing plate (13) above through a rotating shaft (16). The second connecting arm mechanism includes a third connecting block (14) and a fourth connecting block (15). The second side of the pressing plate (13) is connected to the first side of the third connecting block (14) below through a rotating shaft (16). The middle part of the third connecting block (14) is connected to the fourth connecting block (15) below through a rotating shaft (16). The fourth connecting block (15) is connected to the second side of the first connecting block (11) below through a rotating shaft (16). The second side of the third connecting block (14) is connected to the cylinder mounting substrate (6) below through a rotating shaft (16).

3. A compatible wafer carrier device according to claim 1, Characterized in that, Four support seats (4) with an arc-shaped structure are evenly arranged along the circumferential direction on the outside of the product carrier (3).

4. A compatible wafer carrier device according to claim 1, Characterized in that, One side of the flattening mechanism (5) close to the product stage (3) is located at a position on the support base (4), and the other flattening mechanism (5) far from the product stage (3) is located at the middle position on the support base (4).

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