A method for repairing metal circuit pattern

Abstract

The present invention relates to the field of circuit repair technology, specifically a method for repairing metal circuit patterns, comprising the following steps: S1, applying a protective film to the metal circuit to be repaired; S2, opening holes in the protective film using a laser; S3, removing oil and dirt from the surface of the substrate in the area to be repaired; S4, further increasing the bonding strength between the plating layer and the substrate surface; S5, removing residual etching chemicals from the substrate surface; S6, immersing the area to be repaired in an acidic treatment solution at room temperature to protect the catalyst; S7, immersing the area to be repaired in a gel solution at 60°C to catalyze the substrate surface; S8, performing chemical plating on the substrate surface; S9, forming a black metal oxide protective layer on the surface of the substrate in the area to be repaired; and S10, removing residual chemicals from the surface. The present invention repairs fine metal circuits using chemical plating technology, which is performed entirely at low temperatures and does not damage the substrate of the metal circuit. After repair, the metal circuit has excellent electrical conductivity.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit repair, and in particular to a method for repairing a metal circuit pattern. Background Art

[0002] Metal traces are widely present in various electronic components, such as printed circuit boards and metal mesh conductive films. As metal traces become increasingly sophisticated, they are prone to damage during the production and processing of electronic components. This damage can lead to various cracks and fractures, resulting in poor conductivity or even disconnection, reducing product yield and profits. Therefore, repairing these problematic traces is crucial for improving product yield and reducing production costs.

[0003] Patent document CN02115937.8 proposes using lasers to bond, melt, or soften electronic paste. After the laser beam is removed, the bonding phase re-solidifies or solidifies to form a conductive circuit. However, this type of technology is limited by the size of the metal particles in the paste, making it difficult to repair fine circuits at the micron level. Patent document 201911157684.5 proposes using micro-nano metal powder prepared by a spark ablation device to repair fine circuits. However, this method requires heating the circuit board to be repaired to complete the sintering of the micro-nano metal powder on the repaired circuit, so it cannot be used on low-melting-point substrates such as PET. Patent document 202010092913.6 provides a method for repairing fine circuits by laser heating nano-metal paste solder. However, this repair process requires heating the nano-metal paste solder to melt it and then dripping it onto the area to be repaired, so it cannot be used on low-melting-point substrates such as PET. Patent document 202210069547.1 uses high-temperature annealing or laser sintering to solidify the repair material, but this method is not suitable for low-melting-point substrates such as PET. Patent document 202110458518.X proposes using an ITO wire to rub the area to be repaired, generating frictional heat to melt the ITO wire. However, this method is difficult to use for repairing micro-nanometallic circuits and may damage adjacent metal circuits. Patent document 200910201844.1 proposes using a focused particle beam electron microscope to repair circuits. This method requires expensive equipment and can only repair relatively small objects. Patent document 201810843038.3 proposes using a laser to ablate residual copper in the repaired area. This method is also unsuitable for low-melting-point substrates such as PET. Furthermore, for some fine circuits, there may not be enough residual copper in the repaired area to repair the circuit. Furthermore, this method requires an expensive image acquisition system to focus the laser on the repaired area. Patent document 202010647142.2 provides a method for repairing circuits by applying UV-curing coating to the disconnected position using a coating device, and then using UV laser to cure the repair coating. This method may not necessarily meet the requirements for repairing micron-level circuits, and the conductivity of UV-curing coatings is also general, which cannot meet the repair requirements for all conductive circuits. Patent document 202011216935.5 uses nano-copper as the interconnection material between the bonding wire and the circuit by ablating a groove at the end of the circuit, confining the bonding wire and nano-copper paste in the groove, and then using a laser to ablate the nano-copper material to repair the fine circuit. The high-temperature sintering of this method makes it impossible to use it on low-melting-point substrates to be repaired, such as PET.

[0004] The present invention provides a method for repairing fine metal circuits, which does not require the use of expensive repair equipment and has no requirements on the size of the object to be repaired. It can also be used to repair circuits on low-melting-point substrates such as PET. Summary of the Invention

[0005] The purpose of the present invention is to provide a method for repairing metal circuit patterns to achieve the purpose of low-temperature repair and circuit aging resistance, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a method for repairing a metal circuit pattern, the method comprising the following steps:

[0007] S1, use a protective film to stick on the metal circuit to be repaired to protect the metal circuit;

[0008] S2, using laser to open holes in the protective film at the fracture of the metal line to be repaired;

[0009] S3, immersing the substrate in the area to be repaired in an alkaline treatment solution at 60° C. for 20-30 minutes to remove oil and dirt from the surface of the substrate in the area to be repaired and to increase the bonding strength between the coating and the substrate surface;

[0010] S4, immersing the substrate surface in the area to be repaired in an etching solution at 60° C. for 20-30 minutes to etch the substrate surface, thereby further increasing the bonding strength between the coating and the substrate surface;

[0011] S5, immersing the area to be repaired in an alkaline treatment solution at 60° C. for 5-10 minutes to remove the etching chemical reagent remaining on the surface of the substrate;

[0012] S6, immersing the area to be repaired in an acidic treatment solution at room temperature for 5-10 minutes to protect the catalyst;

[0013] S7, immersing the area to be repaired in a gel solution at 60° C. for 20-30 minutes to catalyze the substrate surface;

[0014] S8, immersing the area to be repaired in an electroless plating solution at 60° C. for 30-60 minutes to perform electroless plating on the substrate surface;

[0015] S9, immersing the surface of the substrate in the area to be repaired in an acidic treatment solution at room temperature for 2-5 minutes to oxidize the surface to form a black metal oxide protective layer;

[0016] S10, rinse the repaired area with deionized water at room temperature for 2-5 minutes to remove residual chemical reagents on the surface.

[0017] Preferably, the alkaline treatment solution in step S1 and step S5 is a 5% NaOH aqueous solution.

[0018] Preferably, the etching solution in step S4 is a 5% H2SO4 and 5% H2O2 aqueous solution.

[0019] Preferably, the acidic treatment solution in step S6 is a 5% HCl aqueous solution.

[0020] Preferably, the gel solution in step S7 is a PdCl2 and SnCl2 solution.

[0021] Preferably, the acidic treatment solution in step S9 is a 5% H2SO4 solution.

[0022] Preferably, the chemical plating in step S8 is any one of chemical copper plating, silver plating and nickel plating.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. Repair fine metal circuits through chemical plating technology, which is carried out at low temperature and will not damage the substrate of the metal circuit. After repair, the conductivity of the metal circuit is very good.

[0025] 2. The bonding force between the repair material and the substrate is very strong after repair. After aging for 1000 hours at 85°C / 85% RH, the repaired circuit will not fall off and the change in conductivity does not exceed 10%. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of an electroless plating device;

[0027] Figure 2 Schematic diagram of the device structure to be repaired. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments. It should be noted that the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] See also Figures 1 to 2 The present invention provides a technical solution: a method for repairing fine metal circuits, the repair steps are as follows:

[0030] (1) Use a protective film to stick on the metal circuit to be repaired to protect the metal circuit;

[0031] (2) Using laser to make holes in the protective film at the fracture of the metal line to be repaired;

[0032] (3) Immerse the substrate in the area to be repaired in a 5% NaOH aqueous solution at 60°C for 20-30 minutes to remove oil and dirt from the surface of the substrate in the area to be repaired and increase the bonding strength between the coating and the substrate surface;

[0033] (4) Immersing the substrate surface in the area to be repaired in a 5% H2SO4 and 5% H2O2 aqueous solution at 60°C for 20-30 minutes to etch the substrate surface to further increase the bonding strength between the coating and the substrate surface;

[0034] (5) Immerse the area to be repaired in a 5% NaOH aqueous solution at 60°C for 5-10 minutes to remove the residual etching chemical reagents on the substrate surface;

[0035] (6) Immerse the area to be repaired in 5% HCl aqueous solution at room temperature for 5-10 minutes to protect the catalyst;

[0036] (7) Immerse the area to be repaired in a PdCl2 and SnCl2 gel solution at 60°C for 20-30 minutes to catalyze the substrate surface;

[0037] (8) Immerse the area to be repaired in a chemical plating solution at 60°C for 30-60 minutes to perform chemical plating on the substrate surface. Chemical copper plating, silver plating, or nickel plating can be selected.

[0038] (9) Immerse the surface of the substrate in the area to be repaired in a 5% H2SO4 solution at room temperature for 2-5 minutes for surface oxidation to form a black metal oxide protective layer;

[0039] (10) Rinse the repaired area with deionized water at room temperature for 2-5 minutes to remove residual chemical reagents on the surface.

[0040] Example 1

[0041] A method for repairing fine metal circuits, the repair steps are as follows:

[0042] (1) Use a protective film to stick on the metal circuit to be repaired to protect the metal circuit;

[0043] (2) Using laser to make holes in the protective film at the fracture of the metal line to be repaired;

[0044] (3) Immerse the substrate in the area to be repaired in a 5% NaOH aqueous solution at 60°C for 20 minutes to remove oil and dirt from the surface of the substrate in the area to be repaired and increase the bonding strength between the coating and the substrate surface;

[0045] (4) Immersing the substrate surface in the area to be repaired in a 5% H2SO4 and 5% H2O2 aqueous solution at 60°C for 20 minutes to etch the substrate surface, further increasing the bonding strength between the coating and the substrate surface;

[0046] (5) Immerse the area to be repaired in a 5% NaOH aqueous solution at 60°C for 5 minutes to remove the residual etching chemical reagents on the substrate surface;

[0047] (6) Immerse the area to be repaired in 5% HCl aqueous solution at room temperature for 5 minutes to protect the catalyst;

[0048] (7) Immerse the area to be repaired in a PdCl2 and SnCl2 gel solution at 60°C for 20 minutes to catalyze the substrate surface;

[0049] (8) Immersing the area to be repaired in an electroless copper plating solution at 60° C. for 30 minutes to electrolessly plate copper on the substrate surface;

[0050] (9) Immerse the surface of the substrate in the area to be repaired in a 5% H2SO4 solution at room temperature for 2 minutes for surface oxidation to form a black copper oxide protective layer;

[0051] (10) Rinse the repaired area with deionized water at room temperature for 2 minutes to remove residual chemical reagents on the surface.

[0052] Example 2

[0053] A method for repairing fine metal circuits, the repair steps are as follows:

[0054] (1) Use a protective film to stick on the metal circuit to be repaired to protect the metal circuit;

[0055] (2) Using laser to make holes in the protective film at the fracture of the metal line to be repaired;

[0056] (3) Immerse the substrate in the area to be repaired in a 5% NaOH aqueous solution at 60°C for 25 minutes to remove oil and dirt from the surface of the substrate in the area to be repaired and increase the bonding strength between the coating and the substrate surface;

[0057] (4) Immersing the substrate surface in the area to be repaired in a 5% H2SO4 and 5% H2O2 aqueous solution at 60°C for 25 minutes to etch the substrate surface to further increase the bonding strength between the coating and the substrate surface;

[0058] (5) Immerse the area to be repaired in a 5% NaOH aqueous solution at 60°C for 7 minutes to remove the residual etching chemical reagents on the substrate surface;

[0059] (6) Immerse the area to be repaired in 5% HCl aqueous solution at room temperature for 7 minutes to protect the catalyst;

[0060] (7) Immerse the area to be repaired in a PdCl2 and SnCl2 gel solution at 60°C for 25 minutes to catalyze the substrate surface;

[0061] (8) Immersing the area to be repaired in a chemical silver plating solution at 60° C. for 45 minutes to chemically silver plate the substrate surface;

[0062] (9) Immerse the surface of the substrate in the area to be repaired in a 5% H2SO4 solution at room temperature for 3 minutes for surface oxidation to form a black silver oxide protective layer;

[0063] (10) Rinse the repaired area with deionized water at room temperature for 33 minutes to remove residual chemical reagents on the surface.

[0064] Example 3

[0065] A method for repairing fine metal circuits, the repair steps are as follows:

[0066] (1) Use a protective film to stick on the metal circuit to be repaired to protect the metal circuit;

[0067] (2) Using laser to make holes in the protective film at the fracture of the metal line to be repaired;

[0068] (3) Immerse the substrate in the area to be repaired in a 5% NaOH aqueous solution at 60°C for 30 minutes to remove oil and dirt from the surface of the substrate in the area to be repaired and increase the bonding strength between the coating and the substrate surface;

[0069] (4) Immersing the substrate surface in the area to be repaired in a 5% H2SO4 and 5% H2O2 aqueous solution at 60°C for 30 minutes to etch the substrate surface, further increasing the bonding strength between the coating and the substrate surface;

[0070] (5) Immerse the area to be repaired in a 5% NaOH aqueous solution at 60°C for 10 minutes to remove the residual etching chemical reagents on the substrate surface;

[0071] (6) Immerse the area to be repaired in 5% HCl aqueous solution at room temperature for 10 minutes to protect the catalyst;

[0072] (7) Immerse the area to be repaired in a PdCl2 and SnCl2 gel solution at 60°C for 30 minutes to catalyze the substrate surface;

[0073] (8) immersing the area to be repaired in a chemical nickel plating solution at 60° C. for 60 minutes to perform chemical nickel plating on the substrate surface;

[0074] (9) Immerse the surface of the substrate in the area to be repaired in a 5% H2SO4 solution at room temperature for 5 minutes for surface oxidation to form a black nickel oxide protective layer;

[0075] (10) Rinse the repaired area with deionized water at room temperature for 5 minutes to remove residual chemical reagents on the surface.

[0076] The metal circuits repaired by the above three embodiments have very good conductivity after repair, and the bonding force between the repair material and the substrate is very strong. After 1000 hours of aging under 85°C / 85% RH conditions, the repaired circuits will not fall off, and the change in conductivity does not exceed 10%.

[0077] The above embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Various changes made by ordinary technicians in this field based on the above concepts without creative work fall within the scope of protection of the present invention.

Claims

1. A method for repairing a metal circuit pattern, characterized in that: The method comprises the following steps: S1, use a protective film to stick on the metal circuit to be repaired to protect the metal circuit; S2, using laser to open holes in the protective film at the fracture of the metal line to be repaired; S3, immersing the substrate in the area to be repaired in an alkaline treatment solution at 60° C. for 20-30 minutes to remove oil and dirt from the surface of the substrate in the area to be repaired and to increase the bonding strength between the coating and the substrate surface; S4, immersing the substrate surface in the area to be repaired in an etching solution at 60° C. for 20-30 minutes to etch the substrate surface, thereby further increasing the bonding strength between the coating and the substrate surface; S5, immersing the area to be repaired in an alkaline treatment solution at 60° C. for 5-10 minutes to remove the etching chemical reagent remaining on the surface of the substrate; S6, immersing the area to be repaired in an acidic treatment solution at room temperature for 5-10 minutes to protect the catalyst; S7, immersing the area to be repaired in a gel solution at 60°C for 20-30 minutes to catalyze the substrate surface, wherein the gel solution is a PdCl2 and SnCl2 solution; S8, immersing the area to be repaired in a chemical plating solution at 60° C. for 30-60 minutes to perform chemical plating on the surface of the substrate, wherein the chemical plating is selected from any one of chemical copper plating, silver plating, and nickel plating; S9, immersing the surface of the substrate in the area to be repaired in an acidic treatment solution at room temperature for 2-5 minutes to oxidize the surface to form a black metal oxide protective layer; S10, rinse the repaired area with deionized water at room temperature for 2-5 minutes to remove residual chemical reagents on the surface.

2. The method for repairing a metal circuit pattern according to claim 1, wherein: The alkaline treatment solution in step S1 and step S5 is 5% NaOH aqueous solution.

3. The method for repairing a metal circuit pattern according to claim 1, wherein: The etching solution in step S4 is a 5% H2SO4 and 5% H2O2 aqueous solution.

4. The method for repairing a metal circuit pattern according to claim 1, wherein: The acidic treatment solution in step S6 is a 5% HCl aqueous solution.

5. The method for repairing a metal circuit pattern according to claim 1, wherein: The acidic treatment solution in step S9 is a 5% H2SO4 solution.

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