Substrate apparatus and method

Abstract

A substrate support apparatus can include a monitoring device configured to monitor a position of a suction device of a plurality of suction devices. In some embodiments, a substrate packaging apparatus for packaging a tilted stack of substrates can include a substrate support structure and a hold-down device. In some embodiments, a method can include: stacking a plurality of substrates to form a tilted stack of substrates; imaging a feature of the tilted stack of substrates; and determining a characteristic of the tilted stack of substrates using information obtained during the imaging. In some embodiments, a method can include: stacking an additional substrate on a tilted stack of substrates; and determining a characteristic of the tilted stack of substrates with a substrate support apparatus while the substrate support apparatus engages the additional substrate.

Description

[0001] This application claims the benefit of priority under 35 U.S.C. § 119 to U.S. Provisional Application Serial No. 63 / 049,852, filed July 9, 2020, the contents of which are hereby incorporated by reference in their entirety for all purposes. TECHNICAL FIELD

[0002] The present application relates generally to substrate apparatuses and methods; more specifically, the present application relates to substrate support apparatuses, substrate packaging apparatuses, and methods. BACKGROUND

[0003] It is known to store substrates as a tilted stack of substrates. Typically, the tilted stack of substrates is created by continuously placing individual substrates against each other until the stack is complete. In some embodiments, the tilted stack of substrates can be packaged for transport, storage, and / or handling. During the stacking process, undesirable fanning can occur in which one or more substrates in the tilted stack of substrates are not parallel to one or more other substrates in the stack of substrates such that a thickness at one location of the tilted stack of substrates is different than a thickness at another location of the tilted stack of substrates. It is desirable to control the fanning of the tilted stack of substrates to maintain proper positioning of all substrates in the tilted stack and / or to protect one or more substrates in the tilted stack of substrates from damage due to excessive stress concentration, which can be inherent because of excessive fanning. SUMMARY

[0004] A simplified summary of the application is presented below to provide a basic understanding of some embodiments described in the application.

[0005] In some embodiments, the substrate support apparatus used to stack substrates on the tilted stack of substrates can also be used to determine a characteristic (e.g., fanning) of the tilted stack of substrates. Because each substrate is stacked on the tilted stack of substrates with the substrate support apparatus, this dual functionality can allow for determining the characteristic with the substrate support apparatus. Thus, the steps of determining the characteristic can be performed in a reduced amount of time and can be performed after each additional substrate is stacked.

[0006] In some embodiments, a pinching device can be used to reduce fan-out when stacking substrates to form a tilted stack of substrates. In some embodiments, a single pinching cycle can be provided, which can be beneficial to reduce fan-out while minimizing the time required to perform the pinching process. In further embodiments, the pinching process can include two pinching cycles after each substrate is stacked. The two pinching cycles can further reduce fan-out as compared to a single pinching cycle. During each of the two pinching cycles, a reduced pinching pressure can also achieve a reduced fan-out as compared to a single pinching cycle using a larger pinching pressure, thereby reducing potential stress cracking.

[0007] In some embodiments, a substrate support apparatus can include a base and a plurality of suction devices. Each suction device of the plurality of suction devices can be movably mounted to the base. The substrate support apparatus can further include a monitoring device configured to monitor a position of a suction device of the plurality of suction devices.

[0008] In some embodiments, the monitoring device is configured to monitor a position of the suction device relative to the base.

[0009] In some embodiments, the monitoring device can include an ultrasonic sensor.

[0010] In some embodiments, the ultrasonic sensor can be fixedly mounted to the base.

[0011] In some embodiments, each suction device of the plurality of suction devices can be movably mounted to the base to translate relative to the base along an adjustment direction.

[0012] In some embodiments, the plurality of suction devices can include a column of suction devices. Each suction device of the column of suction devices can be spaced apart from another suction device of the column of suction devices along a column axis that is perpendicular to the adjustment direction.

[0013] In some embodiments, at least one suction device of the plurality of suction devices can be independently movable relative to at least one additional suction device of the plurality of suction devices.

[0014] In some embodiments, a substrate packaging apparatus for packaging a tilted stack of substrates can include a substrate support structure configured to support the tilted stack of substrates. The substrate support structure can include a back surface configured to support a major surface of the substrates of the tilted stack of substrates. The substrate support structure can further include a lower surface extending away from the back surface and configured to support a lower edge of the substrates of the tilted stack of substrates. The substrate packaging apparatus can further include a pinching device including a pinching shaft extending along a width of the back surface.

[0015] In some embodiments, the substrate packaging apparatus can include a plurality of actuators configured to apply a force to a lower portion of the tilted stack of substrates along the pressing axis.

[0016] In some embodiments, the pressing device can include a plurality of actuators configured to apply a varying force to a lower portion of the tilted stack of substrates along the pressing axis.

[0017] In some embodiments, at least one of the plurality of actuators can be operated independently of at least one other of the plurality of actuators.

[0018] In some embodiments, the pressing device can include a plurality of apertures in communication with a fluid pressure chamber.

[0019] In some embodiments, the method can include stacking a plurality of substrates on a substrate support structure to form a tilted stack of substrates. The method can further include imaging a feature of the tilted stack of substrates and using information obtained during the imaging to determine a characteristic of the tilted stack of substrates.

[0020] In some embodiments, the characteristic of the tilted stack of substrates can include a fan-out of the tilted stack of substrates.

[0021] In some embodiments, the method can further include stacking an additional substrate on the tilted stack of substrates with a substrate support apparatus supporting the additional substrate and pressing the tilted stack of substrates by engaging the additional substrate with the pressing device.

[0022] In some embodiments, the pressing device can apply a pressure along the pressing axis when pressing the tilted stack of substrates.

[0023] In some embodiments, the pressing axis can be positioned along a lower portion of the tilted stack of substrates when pressing the tilted stack of substrates.

[0024] In some embodiments, the pressing device can apply a varying pressure to the additional substrate along the pressing axis when pressing the tilted stack of substrates.

[0025] In some embodiments, the pressing device can create a fluid cushion between the additional substrate and the pressing device when pressing the tilted stack of substrates.

[0026] In some embodiments, the pressing can be performed while the substrate support apparatus supports the additional substrate.

[0027] In some embodiments, the method can further include disengaging the substrate support apparatus from the additional substrate.

[0028] In some embodiments, the substrate support apparatus can be disengaged from the additional substrate while the tilted stack of substrates is being pressed with the pressing device.

[0029] In some embodiments, the method can further comprise disengaging the hold-down device from the additional substrate.

[0030] In some embodiments, the method can further comprise re-engaging the additional substrate with the hold-down device.

[0031] In some embodiments, the method can comprise stacking the additional substrate on the tilted stack of substrates, wherein the substrate support apparatus engages the additional substrate. The method can further comprise determining a characteristic of the tilted stack of substrates with the substrate support apparatus while the substrate support apparatus engages the additional substrate.

[0032] In some embodiments, the plurality of suction devices of the substrate support apparatus can be removably attached to the additional substrate while the additional substrate is stacked on the tilted stack of substrates.

[0033] In some embodiments, the step of determining the characteristic can comprise moving one of the plurality of suction devices relative to another of the plurality of suction devices.

[0034] In some embodiments, determining the characteristic can comprise monitoring a position of one of the suction devices.

[0035] In some embodiments, the position of one of the suction devices can be monitored with an ultrasonic sensor.

[0036] In some embodiments, the method can further comprise compacting the tilted stack of substrates with the hold-down device pressing against the additional substrate.

[0037] In some embodiments, the step of compacting the tilted stack of substrates can comprise applying a pressure with the hold-down device to the additional substrate along a compacting axis.

[0038] In some embodiments, the compacting axis can be positioned along a lower portion of the tilted stack of substrates when compacting the tilted stack of substrates.

[0039] In some embodiments, the hold-down device can apply a varying pressure to the additional substrate along the compacting axis when compacting the tilted stack of substrates.

[0040] In some embodiments, the hold-down device can create a fluid cushion between the tilted stack of substrates and the hold-down device when compacting the tilted stack of substrates.

[0041] In some embodiments, the compacting can be performed while the substrate support apparatus engages the additional substrate.

[0042] In some embodiments, the method can further comprise stopping the application of pressure to the additional substrate with the hold-down device for a period of time, followed by reapplying the pressure to the additional substrate with the hold-down device along the compacting axis.

[0043] In some embodiments, the method can include disengaging the substrate support apparatus from the additional substrate prior to reapplying the pressure. The reapplying of the pressure can be performed while the substrate support apparatus is disengaged from the additional substrate.

[0044] Additional features and advantages of the embodiments disclosed herein will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art who practice the embodiments described herein, including the detailed description which follows, the claims, as well as the appended drawings. It is to be understood that both the foregoing summary of the disclosure and the following detailed description are of exemplary embodiments, and are intended to provide an overview or framework for understanding the nature and character of the embodiments disclosed herein. The accompanying drawings are included to provide a further understanding of the various embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments of the present application and, together with the description, explain the principles and operations of the various embodiments of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0045] These and other features, aspects, and advantages of the present application will become better understood when the following detailed description is read with reference to the accompanying drawings in conjunction with the appended claims, wherein:

[0046] Figure 1 is a schematic view of a substrate support apparatus placing a supported substrate on an inclined stack of substrates in accordance with aspects of the present application;

[0047] Figure 2 shows a plan view of a substrate to be placed on an inclined stack of substrates of Figure 1 ;

[0048] Figure 3 schematically illustrates an imaging apparatus for determining characteristics of an inclined stack of substrates;

[0049] Figure 4 is a schematic view of another substrate support apparatus placing a supported substrate on an inclined stack of substrates in accordance with aspects of the present application;

[0050] Figure 5 schematically illustrates a base of the substrate support apparatus taken along a line 5-5 of Figure 1 and Figure 4 ;

[0051] Figure 6 schematically illustrates a substrate support apparatus of Figure 4 for determining characteristics of an inclined stack of substrates;

[0052] Figure 7 schematically illustrates a substrate support apparatus placing a supported substrate on an inclined stack of substrates with a compacting device disengaged from the inclined stack of substrates;Figure 4 Substrate support equipment;

[0053] Figure 8 The diagram schematically illustrates the process of placing a supported substrate onto an inclined stack of substrates after a pressing device, which presses against the supported substrate to compress the inclined substrate stack, has been used. Figure 7 Substrate support equipment;

[0054] Figure 9 Schematic illustration along Figure 7 A cross-sectional view of the clamping device and the inclined substrate stack, taken from line 9-9;

[0055] Figure 10 Schematic illustration along Figure 8 A cross-sectional view of the clamping device and the inclined substrate stack, taken from line 10-10;

[0056] Figures 11-12 It shows the use of Figures 7-10 An embodiment of the step of using a clamping device to clamp an inclined stack of substrates;

[0057] Figure 13 Schematic illustration along Figure 7 A cross-sectional view of the clamping device and the inclined substrate stack of another embodiment, taken by line 9-9;

[0058] Figure 14 Schematic illustration along Figure 8 The line cut from 10-10 Figure 13 A cross-sectional view of the clamping device and the inclined substrate stack;

[0059] Figure 15 It is along Figure 13 The line cut at 15-15 Figures 13-14 A partial front view of the clamping device;

[0060] Figure 16 It is along Figure 15 The line 16-16 was cut Figures 13-15 A schematic cross-sectional view of the clamping device;

[0061] Figure 17 The diagram schematically illustrates a clamping device that continues to press against a previously supported substrate while the substrate support device disengages from the previously supported substrate in an inclined substrate stack.

[0062] Figure 18 The diagram schematically illustrates the situation after the clamping device detaches from the tilted stack of substrates. Figure 17 A stack of pressed, tilted substrates; and

[0063] Figures 19-20This is a graph comparing experimental results of fan-shaped unfolding relative to the number of substrates when the substrates are stacked in an inclined substrate stack. Detailed Implementation

[0064] Embodiments will now be described more fully below with reference to the accompanying drawings, in which exemplary embodiments are shown. The same reference numerals will be used throughout the drawings to refer to the same or similar parts whenever possible. However, this application may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0065] In some embodiments, methods for handling substrates during substrate packaging processes can be provided to help monitor the stacking condition and improve the quality of the substrate stack. The substrate of this application may include a glass substrate, although it may be a glass-ceramic, ceramic, silicon substrate, or other substrate material. In some embodiments, the substrate may include a glass substrate having multiple compositions, including but not limited to soda-lime glass, borosilicate glass, aluminoborosilicate glass, alkali-containing glass, or alkali-free glass. In some embodiments, the glass substrate can be produced by separating the glass substrate from a glass ribbon produced by glass manufacturing equipment or other glass ribbon manufacturing equipment, such as a channeling device, a floating channeling device, a pull-down device, an up-pull device, a rolling device, or a pressing device. Substrates containing glass substrates may be suitable for further processing into desired applications, such as display applications. For example, glass substrates can be used in a wide range of display applications, including liquid crystal displays (LCDs), electrophoretic displays (EPDs), organic light-emitting diode displays (OLEDs), and plasma display panels (PDPs). It may be necessary to transport the glass substrate from one location to another. The substrate (e.g., a glass substrate) may be transported as a tilted substrate stack throughout the scope discussed in this application. In addition, an intermediate material may optionally be placed between each substrate (e.g., a glass substrate) to help prevent contact and thus maintain the original surface of the substrate.

[0066] like Figures 1-2 As shown, substrate 101 (e.g., a glass substrate) may include a length "L" and a width "W" perpendicular to the length. As... Figure 2As shown, the substrate 101 can include a periphery comprising a rectangular shape, where a length "L" can be defined between two parallel end edges 201a, 201b and a width "W" can be defined between two parallel side edges 203a, 203b. As shown, each end edge 201a, 201b can extend in a direction that is perpendicular to the direction in which each side edge 203a, 203b extends. In some embodiments, the width "W" of the substrate 101 can be greater than or equal to about 20 mm, such as greater than or equal to about 50 mm, such as greater than or equal to about 100 mm, such as greater than or equal to about 500 millimeters, such as greater than or equal to about 1000 millimeters, such as greater than or equal to about 2000 millimeters, such as greater than or equal to about 3000 millimeters, and such as greater than or equal to about 4000 millimeters, although other widths less than or greater than the above widths can be provided in further embodiments. For example, in some embodiments, the width "W" of the substrate 101 can be from about 20 mm to about 4000 mm, such as from about 50 mm to about 4000 mm, such as from about 100 mm to about 4000 mm, such as from about 500 mm to about 4000 mm, such as from about 1000 mm to about 4000 mm, such as from about 2000 mm to about 4000 mm, such as from about 3000 mm to about 4000 mm, such as from about 20 mm to about 3000 mm, such as from about 50 mm to about 3000 mm, such as from about 100 mm to about 3000 mm, such as from about 500 mm to about 3000 mm, such as from about 1000 mm to about 3000 mm, such as from about 2000 mm to about 3000 mm, such as from about 2000 mm to about 2500 mm, and all ranges and sub-ranges therebetween.

[0067] The substrate 101 (e.g., a glass substrate) can include a first major surface 103a and a second major surface 103b facing in an opposite direction and defining a thickness "T" (e.g., an average thickness) of the substrate 101. In some embodiments, the thickness "T" of the substrate 101 can be less than or equal to about 2 millimeters (mm), less than or equal to about 1 mm, less than or equal to about 0.5 mm, such as less than or equal to about 300 micrometers (pm), less than or equal to about 200 pm, or less than or equal to about 100 pm, although other thicknesses can be provided in further embodiments. For example, in some embodiments, the thickness "T" of the substrate 101 can be from about 50 pm to about 750 pm, from about 100 pm to about 700 pm, from about 200 pm to about 600 pm, from about 300 pm to about 500 pm, from about 50 pm to about 500 pm, from about 50 pm to about 700 pm, from about 50 pm to about 600 pm, from about 50 pm to about 500 pm, from about 50 pm to about 400 pm, from about 50 pm to about 300 pm, from about 50 pm to about 200 pm, from about 50 pm to about 100 pm, including all ranges and sub-ranges of thickness therebetween.

[0068] Figure 1 、 Figures 3-4 、 Figures 6-8 and Figures 17-18 An embodiment of a substrate support stand 107 of a substrate packaging apparatus 105, 401 according to aspects of the present application is shown. The substrate support stand 107 can be configured to support a stack 109 of tilted substrates 101. The substrate support stand 107 can include a back surface 111 configured to support major surfaces 103b of the substrates 101 of the stack 109 of tilted substrates 101. For example, as shown, in some embodiments, a back plate 113 can include the back surface 111. The back plate 113 can include a continuous plate or lattice of support members defining the back surface 111. The substrate support stand 107 can further include a lower surface 115 extending away from the back surface 111 and configured to support lower edges of the substrates 101 of the stack 109 of tilted substrates 101. For example, as shown, in some embodiments, a lower plate 117 can include the lower surface 115. The lower plate 117 can include a continuous plate or lattice of support members defining the lower surface 115. As shown, the lower surface 115 can extend away from the back surface 111 at substantially 90°, although in other embodiments, the lower surface 115 can extend away from the back surface 111 at other angles. The back plate 113 and / or the lower plate 117 can include stainless steel, plastic, wood, or other materials that can support the stack 109 of tilted substrates 101. As shown, the substrate support stand 107 can include a plurality of substrate support stands 107 arranged in a grid pattern. The substrate support stands 107 can be configured to support a plurality of stacks 109 of tilted substrates 101. For example, as shown, in some embodiments, a plurality of substrate support stands 107 can be arranged in a grid pattern to support a plurality of stacks 109 of tilted substrates 101. The substrate support stands 107 can be configured to support a plurality of stacks 109 of tilted substrates 101. For example, as shown, in some embodiments, a plurality of substrate support stands 107 can be arranged in a grid pattern to support a plurality of stacks 109 of tilted substrates 101. Figure 1As shown, the back surface 111 can extend at an angle "A" relative to the direction of gravity "G". The angle "A" can range from greater than 0° to about 60°, such as from greater than 0° to about 45°, such as from greater than 0° to about 30°, such as from greater than 0° to 20°, such as from greater than 0° to 20°, and all ranges and sub-ranges therebetween. In further embodiments, the angle "A" can range from about 10° to about 60°, such as from about 10° to about 45°, such as from about 10° to about 30°, such as from about 10° to about 20°, and all ranges and sub-ranges therebetween. In further embodiments, the angle "A" can range from about 20° to about 60°, such as from about 20° to about 45°, such as from about 20° to about 30°, and all ranges and sub-ranges therebetween. For the purposes of this application, a stack of substrates is considered to be an "inclined stack of substrates" if the substrates in the stack have major surfaces oriented at any of the above-mentioned angles "A" relative to the direction of gravity "G". Thus, by stacking substrates against the back surface 111 (the back surface 111 extending at an angle "A" relative to the direction of gravity "G" within the above-mentioned ranges), the stack of substrates can comprise an inclined stack of substrates supported by the substrate support rack 107. For example, a major surface of a back substrate in the inclined stack of substrates can be supported against the back surface 111, and like the back surface 111, this major surface can be supported at an orientation in which the major surface of the back substrate extends at an angle "A" relative to the direction of gravity "G" within the above-mentioned ranges. Thus, the stack of substrates would be considered to be an inclined stack of substrates because at least the major surface of the back substrate extends at an angle "A" relative to the direction of gravity "G" within the above-mentioned ranges.

[0069] As shown, the bracket 119 can be designed to support the back surface 111 at the desired angle "A". For example, the bracket 119 can support the position of the back plate 113 and the lower plate 117 relative to one another, as well as support the weight of the back plate 113, the lower plate 117, and the inclined stack of substrates 101 109. In some embodiments, the bracket 119 can comprise a support surface 120, which can be on a horizontal surface such that the support surface 120 is perpendicular to the direction of gravity "G". In some embodiments, the angle "B" between the support surface 120 and the back surface 111 can be equal to the angle "A" subtracted from 90°.

[0070] Figure 1 The illustrated substrate handling apparatus 105 can comprise a substrate support apparatus 121 configured to assist in building the inclined stack of substrates 101 109 on the substrate support rack 107. In some embodiments, as shown, the substrate support apparatus 121 can comprise a plurality of suction devices 123 mounted to a base 125. Figure 5 As shown, the substrate support apparatus 121 can be configured to support the back surface 111 of the back substrate 101 in the inclined stack of substrates 101 109. For example, the substrate support apparatus 121 can be configured to support the back surface 111 of the back substrate 101 in the inclined stack of substrates 101 109 at an angle "A" relative to the direction of gravity "G". In some embodiments, the substrate support apparatus 121 can be configured to support the back surface 111 of the back substrate 101 in the inclined stack of substrates 101 109 at an angle "A" relative to the direction of gravity "G" within the above-mentioned ranges. In some embodiments, the substrate support apparatus 121 can be configured to support the back surface 111 of the back substrate 101 in the inclined stack of substrates 101 109 at an angle "A" relative to the direction of gravity "G" within the above-mentioned ranges. Figure 1of one embodiment of the base 125 viewed along the line 5-5. As shown, the base 125 can include parallel side rails 503a, 503b that can support the suction devices 123 along respective columns of the suction devices. The parallel side rails 503a, 503b can be mounted to a central rail 505 that can be manipulated by a robot 129 (see Figure 1 ) in some embodiments, the suction devices 123 can each include a suction cup 127. The suction cup 127 can be placed in communication with a fluid source to control a suction force associated with each suction cup 127 to cause selective attachment and release of the first major surface 103a of the substrate 101. In some embodiments, a vacuum (e.g., from a negative pressure source) can be associated with one or more of the suction cups. The vacuum can be used to increase the adhesion between the suction cup and the first major surface 103a. In further embodiments, the vacuum source can be adjustable to increase or decrease the attachment force. In some embodiments, the fluid source can include a positive pressure source to eject the substrate from the suction cup when the substrate is properly placed on the tilted stack of substrates. In some embodiments, the fluid source (e.g., the positive pressure source and / or the negative pressure source) can provide the same positive pressure / vacuum force for all of the suction cups of each column or can provide the same positive pressure / vacuum force for all of the suction cups of all of the columns. In further embodiments, one or more of the suction cups can have a suction force that can be operated independently of the other suction cups.

[0071] In operation, the robot 129 can move the base 125 and the corresponding suction devices 123 to pick up a substrate 101 to be stacked. The substrate to be picked up can be traveling along a conveyor, can be detached from the conveyor after the conveyor is generated, or can be in another location. To pick up the substrate 101, the robot 129 can manipulate the base 125 until the suction cups 127 of the suction devices 123 engage the first major surface 103a of the substrate 101. It will be appreciated that the suction cups 127 can engage proximate to the outer side edges 203a, 203b (see Figure 2 ) of the substrate to help preserve the pristine nature of the central portion of the major surface 103a of the substrate 101. As shown, the robot can move the substrate 101 into position so that the substrate 101 is added to the tilted stack 109 of substrates 101 in a tilted orientation. Figure 1

[0072] ​After a large number of substrates 101 have been stacked, a fan-out can unfortunately occur in which a location of the tilted stack 109 has a maximum thickness "Tl" in a direction normal to the back surface 111 that is greater than a minimum thickness "T2" of another location of the tilted stack 109 in the direction normal to the back surface 111. As shown, the location having the maximum thickness "Tl" can be at a middle location of the tilted stack 109, although the maximum thickness "Tl" can be near or at an upper end of the tilted stack 109, or near or at a lower end of the tilted stack 109. Throughout the application, the fan-out is considered to be the difference between the maximum thickness "Tl" and the minimum thickness "T2".

[0073] In some embodiments, an overall fan-out can exist across a surface area of the tilted stack 109 of substrates 101, in which the overall tilted stack 109 of substrates 101 includes a single maximum thickness "Tl" and a single minimum thickness "T2", in which the overall fan-out of the tilted stack 109 of substrates 101 is considered to be the difference between the single maximum thickness "Tl" and the single minimum thickness "T2". In further embodiments, a longitudinal fan-out can vary at different locations along a width "W" of the substrates 101. For example, a longitudinal fan-out can exist at a location along the width "W" that extends along a linear longitudinal axis that extends through the location in a direction of a length "L" of an outer substrate 101 of the tilted stack 109 of substrates 101. In such an example, the longitudinal fan-out at the location along the width "W" is considered to be the difference between a maximum thickness "Tl" along the linear longitudinal axis through the location and a minimum thickness "T2" along the linear longitudinal axis through the location.

[0074] Figure 4 and Figures 6-8 An additional embodiment of a substrate support apparatus 403 of a substrate processing apparatus 401 is shown. The substrate support apparatus 403 can include a base 125 (e.g., as shown and described with reference to Figure 5 Each suction device 405 of the plurality of suction devices 405 can be movably mounted to the base 125. In some embodiments, each suction device 405 of the plurality of suction devices 405 can be movably mounted to the base 125 to translate relative to the base 125 along an adjustment direction. For example, as shown in FIG. 4, each suction device 405 of the plurality of suction devices 405 can be movably mounted to the base 125 to translate relative to the base 125 along an adjustment direction "A" that is parallel to the length "L" of the outer substrate 101 of the tilted stack 109 of substrates 101. Figure 4As shown, each of the plurality of suction devices 405 is translatable along a first adjustment direction 407a to extend relative to the base 125 and / or along a second adjustment direction 407b to retract relative to the base 125. As shown, in some embodiments, each suction device 405 may include a guide rod 409; the guide rod 409 can be slidably mounted to the base 125 using a suction cup 127 positioned at one end of the guide rod 409. In some embodiments, although not shown, each suction device 405 may include a biasing device (e.g., a compression spring) that biases each suction device 405 in the first adjustment direction 407a to... Figure 4 The extended position shown.

[0075] like Figure 4 As shown, the substrate support device 403 may also include a base. For example, as mentioned above... Figure 5 The base 125 under discussion may also include along... Figure 4 The base of the substrate support device 403 is shown as a section of line 5-5. The base 125 may include parallel side rails 503a, 503b, which support the suction devices 405 along corresponding columns of suction devices. Although two rows of suction devices are shown, in other embodiments, three or more columns of suction devices may be provided. For example, the base 125 may include three or more parallel side rails that support the suction devices. In some embodiments, multiple suction devices 405 (see...) Figure 4 The plurality of suction devices 405 may include suction devices 405 positioned along a first column axis 501a of the first column. In some embodiments, the plurality of suction devices 405 may further include suction devices 405 positioned along a second column axis 501b of the second column in the second row. Although not shown, in some embodiments, the plurality of suction devices may include three or more columns of suction devices positioned along corresponding column axes. Figure 5As shown, each of the plurality of suction devices 405 may be spaced apart from another suction device 405. For example, each suction device 405 may be positioned between a pair of suction devices 405, each of the pair of suction devices 405 being adjacent to the other suction device 405. Column axes 501a, 501b may be perpendicular to the adjustment directions 407a, 407b of the suction devices 405. In some embodiments, parallel side rails 503a, 503b may be mounted to a center rail 505 that can be manipulated by the robot 129. Two parallel side rails 503a, 503b are shown simultaneously; in other embodiments, three or more parallel side rails that can be manipulated by the robot 129 may be provided (e.g., mounted to the center rail 505). Each parallel side rail may be provided on a corresponding column axis, wherein the suction devices may be spaced apart along the corresponding column axis. In some embodiments, each of the suction devices 405 may include a suction cup 127. The suction cup 127 can be positioned in communication with a fluid source to induce selective attachment and release to the first primary surface 103a of the substrate 101.

[0076] In some embodiments, at least one of the plurality of suction devices 405 may be moved independently relative to at least one additional suction device among the plurality of suction devices 405. For example, as Figure 4 At least one suction device 405 shown is movable along adjustment directions 407a, 407b, while one or more of the remaining suction devices remain stationary relative to the base 125. In some embodiments, each suction device may be movable independently relative to the remaining suction devices (e.g., along adjustment directions 407a, 407b).

[0077] like Figure 4 and Figures 6-8 As shown, the substrate support device 403 may also include a monitoring device 411 configured to monitor the position of one of a plurality of suction devices 405. In some embodiments, the monitoring device 411 may be configured to monitor the position of the suction device 405 relative to the base 125. For example, the monitoring device may be designed to monitor the position of the guide rod 409 relative to the base 125. In some embodiments, the monitoring device may be designed to directly monitor the suction cup 127 of the suction device 405, or to monitor the suction cup 127 of the suction device 405 via the position of the guide rod 409 relative to the base 125. In some embodiments, the monitoring device may include a proximity sensor capable of monitoring the position of the suction device 405 relative to the base 125 without physical contact, although physical contact sensors may also be incorporated according to aspects of this application. Embodiments of the proximity sensor may include optical sensors (e.g., laser sensors), ultrasonic sensors, or other types of proximity sensors. Figure 4Illustratively, in some embodiments, the monitoring device 411 can include an ultrasonic sensor 413 configured to monitor the position of the suction device 405 relative to the base 125 without requiring physical contact between the suction device 405 and the base 125 to monitor the position. In some embodiments, a proximity sensor (e.g., an ultrasonic sensor 413) can be fixedly mounted to the base 125 to monitor the position of a portion of the suction device 405 relative to the base. In some embodiments, the end of the guide rod 409 can be provided with a marker 415 that extends across the sensing path of the proximity sensor. For example, as shown, an ultrasonic wave 417a can be propagated to intersect the marker 415 positioned across the sensing path of the ultrasonic sensor 413. The reflected ultrasonic wave 417b reflected from the marker 415 can then be returned to be sensed by the ultrasonic sensor 413. A signal can then be sent back to the processor 137 to calculate the position of the marker 415 of the suction device 405 relative to the base 125. Although not shown, the ultrasonic sensor can be mounted to the guide rod (e.g., at the end of the guide rod) with the ultrasonic wave reflecting from the base 125. However, fixedly mounting the ultrasonic sensor to the base 125 can simplify the construction of the device as the communication path from the ultrasonic sensor 413 to the processor 137 can be supported by the base 125.

[0078] As shown, the monitoring device can monitor the position of one or any of a plurality of suction devices. For example, as shown, the monitoring device 411 can monitor the position of each of a plurality of suction devices 405 relative to the base 125. For example, as shown, each of the plurality of suction devices 405 can be provided with a proximity sensor (e.g., an ultrasonic sensor). In embodiments in which one or all of the suction devices 405 can move independently relative to one another, providing a sensor (e.g., a proximity sensor) for each suction device 405 can allow each suction device to be tracked independently. Figure 4

[0079] In some embodiments, the substrate packaging apparatus 105, 401 can be provided with a hold-down device. For discussion purposes, embodiments of the substrate packaging apparatus 401 of Figure 4 and Figures 6-18 will be discussed as optionally including a hold-down device 701 Figures 9-12 ), 1301 Figures 13-16 . Although not shown, the substrate packaging apparatus 105 of Figure 1 and Figure 3 may also include a hold-down device 701, 1301 having similar or identical features and functionality as discussed more fully below. As Figure 9 and Figure 13 ​As shown, the clamping devices 701 and 1301 may include a clamping shaft 901 extending along the width "WR" of the rear surface 111. In some embodiments, the outer surface of the pressing member may include the clamping shaft. Figure 9 and Figure 13 As shown, the width "WR" of the rear surface 111 can be the same as the width "W" of the substrate 101 (see...). Figure 2 While essentially the same, in other embodiments, the width "WR" of the rear surface 111 may be greater than or less than the width "W" of the substrate 101. Setting the width "WR" of the rear surface 111 to be greater than or equal to the width "W" of the substrate 101 helps to fully support the entire width of the substrate 101, thereby reducing stress concentration and potential damage to the substrate 101. In some embodiments, the clamping shaft 901 may include a substantially straight clamping shaft 901. For example, in some embodiments, the rear surface 111 may include a substantially flat surface, wherein a substantially straight clamping shaft 901 helps to distribute the clamping force evenly across the width of the substrate 101 throughout the clamping process. In other embodiments, the rear surface 111 may include a convex or concave surface, wherein a flat surface (made by...) Figure 9 and Figure 13 The straight line at 111 (represented by a line) will be curved and represented by an arc. Setting the rear surface as convex or concave can facilitate bending the substrate stack into a curved shape corresponding to the convex or concave rear surface. Bending the substrate into a curved orientation can strengthen the substrate and / or help prevent movement of the substrate relative to the rear surface 111. In embodiments where the rear surface 111 is concave or convex, the clamping shaft 901 may include a bending shaft having a width “WR” along the rear surface that matches the curved shape of the convex or concave rear surface.

[0080] In some embodiments, the clamping device may include at least one actuator. For example, such as Figure 7 As shown, the base member 703 of the clamping device may include at least one actuator configured to extend and retract pressing members 705, 1305, which define a clamping shaft 901 of the clamping devices 701, 1301. As shown, in some embodiments, the clamping devices 701, 1301 may include abutment devices 904, 1304, which include pressing members 705, 1305. In some embodiments, the actuator of the base member 703 may provide extension of the abutment devices 904, 1304 in direction 707a and retraction in direction 707b. In some embodiments, directions 707a, 707b may be substantially perpendicular to the rear surface 111. In other embodiments, in addition to or in place of the actuator of the base member, the abutment devices 904, 1304 may include one or more actuators 903 (see [reference]). Figure 9One or more actuators 903 are configured to provide extension / retraction of pressing members 705, 1305 relative to support members 907 in directions 707a, 707b. In some embodiments, as shown, one or more actuators 903 may selectively extend rod 902 and pressing members 705, 1305 associated with rod 902 in direction 707a. As shown, in some embodiments, clamping devices 701, 1301 may include a plurality of actuators configured to apply force along clamping axis 901 toward the lower portion of the inclined substrate 101 stack 109.

[0081] like Figure 9 and Figure 13 As shown, in some embodiments, one or more actuators 903 of the clamping devices 701, 1301 may include a plurality of actuators 903. As shown, in some embodiments, the plurality of actuators 903 may include a row of actuators 903 sequentially spaced apart from each of the plurality of actuators 903, the plurality of actuators 903 positioned adjacent to an adjacent actuator or located between two adjacent actuators. In some embodiments, each of the plurality of actuators 903 is configured to apply a varying force along the clamping axis 901 toward the lower portion of the inclined substrate 101 stack 109, but in other embodiments each actuator may apply the same force. Furthermore or alternatively, in some embodiments, at least one or all of the plurality of actuators may operate dependently or independently of at least one other actuator (e.g., all other actuators). For example, if the pressing member comprises a single rigid pressing member, all actuators of the plurality of actuators 903 can operate simultaneously and provide the same force, causing the length of the pressing member to move in the extension / retraction directions 707a, 707b. In another embodiment, such as Figures 11-12 As shown, the pressing member 705 may include a flexible pressing member, wherein a portion of the pressing member is movable relative to another portion of the pressing member in the extension / retraction directions 707a, 707b. In a further embodiment, the pressing member may include a segmented pressing member, wherein multiple segments of the pressing member are configured to move relative to each other. For example, as Figure 13 As shown, the pressing member 1305 may include segments 1307a, 1307b, and 1307c, which are movable relative to each other in the extension / retraction directions 707a and 707b.

[0082] In some implementations, such as Figure 10 As shown, the pressing member 705 can be designed such that when a force is applied to the lower portion of the inclined substrate 101 stack 109, the pressing member 705 physically contacts the lower portion of the outer substrate of the inclined substrate 101 stack 109. In an alternative embodiment, as...Figure 14 As shown, the pressing member 1305 can be designed to apply force to the lower portion of the tilted stack 109 of substrates 101 in a non-contact manner in which the pressing member 1305 creates a fluid cushion 1401 that applies force to the lower portion of the outer substrate of the tilted stack 109 of substrates without the pressing member 1305 physically contacting the outer substrate of the tilted stack 109 of substrates. Applying force in a non-contact manner can help prevent damage to the substrates that can otherwise occur if the pressing member were to physically contact the substrate(s). As shown, Figures 15-16 As shown, the presser device can provide the pressing member 1305 with a plurality of holes 1501 in communication with a fluid pressure chamber 1601. As shown, Figure 15 As shown, the plurality of holes can include a pattern of spaced apart holes 1501 to provide a desired fluid cushion configuration in use. Further, as shown, Figure 16 As shown, in some embodiments, the fluid pressure chamber 1601 can include a plurality of fluid pressure chambers, but in other embodiments a single fluid pressure chamber can be provided. Each pressure chamber 1601 can include one or more inlets 1602 for pressurized fluid to enter the pressure chamber 1601. If a plurality of pressure chambers is provided, the pressurized fluid in each chamber can be adjusted relative to one another to provide a fluid cushion having properties that vary along the overall length of the pressing member 1305. As shown, Figure 16 As shown, each segment 1307a, 1307b can include one or more pressure chambers; the one or more pressure chambers can be independently pressurized to allow each segment to apply a unique fluid cushion. Providing a plurality of holes 1501 associated with a corresponding pressure chamber can also be beneficial to help provide more control over the properties of the fluid cushion (e.g., the pressure profile applied by the fluid cushion).

[0083] In some embodiments, the methods of the present application can include stacking a plurality of substrates 101 on a substrate support structure (e.g., substrate support rack 107) to form a tilted stack 109 of substrates 101. In some embodiments, a robot 129 can be provided that can pick up individual substrates 101 (e.g., glass substrates) from a conveyor or other location, or can support the substrates while they are separated from a ribbon (e.g., a glass ribbon) during ribbon formation. The robot 129 can then manipulate the substrates into the appropriate orientation so that, as shown, Figure 1 As shown, the substrates 101 supported by the substrate support apparatus 121 are substantially parallel to the back surface 111 and / or the existing tilted stack 109 of substrates. As shown, Figure 1As shown, in some embodiments, multiple suction cups 127 can be removably attached to substrate 101, supporting and moving the substrate to stack with other substrates in an inclined substrate stack 109. In some embodiments, a negative pressure source can be positioned in communication with the suction region of the suction cups to further enhance and maintain the attachment of the suction cups to the substrate, helping to prevent unintentional detachment of the suction cups from substrate 101. Once the robot 129 has correctly positioned the supported substrate, the suction cups can release the substrate. For example, a positive pressure source can increase the pressure within the suction region of the suction cups, causing the suction cups to release the substrate into place. Then, from such... Figure 3 The robot is retracted near the tilted substrate stack 109 shown.

[0084] In some embodiments, the method of this application may further include: determining the characteristics of the tilted substrate stack without contacting any substrate 101. For example, as Figure 3 As shown, robot 129 can be removed from the vicinity of the tilted substrate stack 109. Imaging device 131 can then be used to image the features of substrate 101 (e.g., the outermost substrate), and the information obtained during imaging can be used to determine the characteristics of the tilted substrate stack 109. In some embodiments, the characteristics of the tilted substrate stack 109 may include a fan-shaped unfolding of the tilted substrate stack 109. In some embodiments, the fan-shaped unfolding may include the overall fan-shaped unfolding of the tilted substrate stack 109. For example, the overall fan-shaped unfolding may include a "T2" subtracted from "T1", where the maximum thickness "T1" of the tilted substrate stack 109 may not be aligned with the minimum thickness "T2" along the same linear axis (which extends in the direction of length "L"). Therefore, the overall fan-shaped unfolding may include a value associated with the surface area of ​​the main surface of the outermost substrate. In another embodiment, the fan-shaped unfolding may include a longitudinal fan-shaped unfolding, which may include "T2" subtracted from "T1", wherein "T1" is aligned with "T2" along the same linear axis extending in the direction of length "L". In such an embodiment, the inclined substrate 101 stack 109 may include a longitudinal fan-shaped unfolding at each location along the width of the inclined stack 109 of substrate 101.

[0085] In one implementation, such as Figure 1 and Figure 3As shown, the fan-out can be determined by imaging device 131. In some embodiments, imaging device 131 can include a digital image correlation device, which can include light source 133 and a pair of cameras 135. One available imaging device 131 can include an ARAMIS digital image correlation device, available from Trilion Quality Systems. The digital image correlation device can be designed to determine the three-dimensional positions of various markers associated with the outer surface of tilted substrate 101 stack 109. In some embodiments, the markers can include reflective patches adhered to a major surface of substrate 101. For example, referring to Figure 2 In such an example, imaging device 131 can determine the fan-out in the longitudinal direction at two locations along the width "W" of substrate 101. In some embodiments, the markers 205 can be provided on one or more substrates 101. In further embodiments, the substrate including markers 205 can be reused for multiple periodic measurements. For example, the substrate including markers 205 can be placed with substrate support device 121 for a fan-out measurement. Once imaging device 131 has completed the measurement, substrate support device 121 can remove the substrate including markers 205, and then proceed to stack additional substrates, if appropriate. Such measurements can be designed to measure the fan-out after a selected number of substrates are stacked (e.g., after 10, 20, 40, 60, etc. substrates are stacked). Furthermore, while the substrate with markers can include the same type of substrate as the substrates in the tilted stack 109 of tilted substrates, in further embodiments, the substrate with markers 205 can include a different material that can be more durable or less expensive than the substrates stacked in the tilted stack 109 of substrates 101.

[0086] As Figure 3As shown, once the substrate with the markers 205 is placed, the light 301 emitted from the illumination device 133 of the digital image correlation device can reflect off each marker 205 to be detected (not shown) along the width "W" by a pair of cameras 135 spaced apart from each other. The reflected light received by the cameras 135 is then processed by a processor 137 to determine the position of the markers 205 and output to an output device 303, such as a storage unit for digitally storing the data or a display device for visually displaying the data. As shown, the results of each periodic measurement using the digital correlation device can be displayed in a graph, where the vertical axis 305 indicates the marker number and the horizontal axis 307 indicates the thickness of the tilted stack 109 of the tilted substrates 101. As shown, the last measurement indicates a maximum stack thickness "Ti" of about 46 at marker #5 and a minimum stack thickness "T2" of about 32 at marker #1, where the fan spread in the vertical direction at the last measurement is about 14 (i.e., 46-32). In some embodiments, an alert can be issued if the fan spread reaches a predetermined maximum allowed fan spread. In further embodiments, the substrate support apparatus 121 can stop loading additional substrates 101 once the fan spread reaches the predetermined maximum allowed fan spread.

[0087] Figure 4 and Figure 6 A further embodiment of determining a characteristic of the stack 109 of tilted substrates 101 is illustrated. As shown, a substrate support apparatus 403 can be used to stack a plurality of substrates 101, where the characteristic can be determined as the next substrate is stacked onto the tilted stack 109. For example, Figure 4 The stacking of additional substrates 101 supported and joined by the substrate support apparatus 403 onto the tilted stack 109 of substrates 101 is shown. In some embodiments, the first and second columns of suction cups 127 (see Figure 5The suction cups 127 can selectively attach to portions of the main surface of substrate 101 (e.g., the outer edge portions of the main surface). By engaging the outer portions, the original properties of the central portion of the main surface can be preserved without damage due to scratches or other defects that may be introduced by the suction cups 127. In some embodiments, the suction cups 127 may be positioned in communication with a fluid source to control the suction force associated with each suction cup 127, thereby selectively attaching and releasing the first main surface 103a of substrate 101. In some embodiments, a vacuum source may be associated with one or more suction cups. The vacuum source may be used to provide suction force that increases the adhesion between the suction cups and the first main surface 103a. In other embodiments, the vacuum source may be adjustable to increase or decrease the adhesion force. In some embodiments, the fluid source may include a positive pressure source to eject the substrate from the suction cups when the substrate is properly placed on an inclined stack of substrates. In some embodiments, the fluid source (e.g., a pressure source and / or a vacuum source) may provide the same pressure / vacuum force for all suction cups in each column, or may provide the same pressure / vacuum force for all suction cups in all columns. In another embodiment, one or more suction cups may have suction force that can operate independently of other suction cups.

[0088] In operation, robot 129 can move base 125 and corresponding suction device 123 to pick up substrates 101 to be stacked. The substrates to be picked up can travel along a conveyor belt, can be separated from the belt after production, or be in other locations. To pick up substrate 101, robot 129 can manipulate base 125 until the suction cup 127 of suction device 123 engages the first main surface 103a of substrate 101. It should be understood that the suction cup 127 can engage adjacent to the outer edges 203a, 203b of the substrate to help maintain the original properties of the central portion of the main surface 103a of substrate 101. Figure 1 As shown, the robot can move the substrate 101 into place such that the substrate 101 is added to the tilted substrate 101 stack 109 in an inclined direction.

[0089] like Figure 6 As shown, the characteristics of the tilted substrate stack 109 can be determined by the substrate support device 403 when the substrate support device 403 engages the additional substrate 101 and before the placed additional substrate 101 detaches from the substrate support device 403. As previously discussed, the plurality of suction devices 405 of the substrate support device 103 can be removably attached to the additional substrate while the additional substrate is stacked on the tilted substrate stack. Figure 4As shown, the substrate support device 103 can be moved by robot 129 in direction 402. In some embodiments, each of the plurality of suction devices 405 can be moved relative to one or more other suction devices among the plurality of suction devices 405 and relative to base 125 in a first adjustment direction 407a or a second adjustment direction 407b. Thus, the supported additional substrate 101 can conform to the shape of the outer stacked substrate of the inclined substrate stack 109, while the suction devices 405 can move independently relative to each other and relative to base 125. In practice, each suction device 405 can be biased outward (e.g., by compression springs) such that the suction device compresses and thereby conforms to the supported additional substrate 101 to match the shape of the outermost substrate in the substrate stack. Figure 6 Schematably, the increased thickness of the substrate 101 stack 109 tilted at "T1" causes the corresponding suction device 405 to move in the second adjustment direction 407b, causing the corresponding suction cup 127 to retract toward the base 125. As the suction device 405 moves in the second adjustment direction 407b, the corresponding guide rod 409 moves the corresponding mark 415 away from the base 125 in the second adjustment direction 407b. In some embodiments, the sensor of the ultrasonic sensor 413, as illustrated, can monitor the position of the suction device 405. For example, as... Figure 4 As shown, ultrasonic waves 417a can be emitted from ultrasonic sensor 413, and ultrasonic waves 417a bounce off marker 415 and return to the sensor as reflected ultrasonic waves 417b for sensing by ultrasonic sensor 413. The signal can then be sent back to processor 137 to calculate the position of marker 415 of suction device 405 relative to base 125. In this way, corresponding characteristics (e.g., fan-shaped expansion) can be determined by monitoring the position of each suction device 405. In some embodiments, these positions can be relayed to output device 303 discussed above, such as a storage unit for digitally storing data or a display device for visually displaying data. In some embodiments, an alarm can be issued if the fan-shaped expansion reaches a predetermined maximum permissible fan-shaped expansion. In other embodiments, once the fan-shaped expansion reaches a predetermined maximum permissible fan-shaped expansion, substrate support device 403 can stop loading additional substrates 101.

[0090] In some implementations, it is possible to obtain from Figure 1 Imaging device 131 or Figure 4The monitoring device 411 is selected to determine the characteristics of the tilted substrate stack 109 (e.g., fan-shaped unfolding). However, in some embodiments, the monitoring device 411 can monitor each substrate 101 as it is added to the tilted substrate stack 109, and the monitoring device 411 does not need to place substrates with markings 205 for periodic monitoring. Therefore, the monitoring device 411 can provide continuous feedback and thus quickly detect problems with the development of fan-shaped unfolding without process interruption or the additional cost of providing substrates with markings 205, which can only be used for periodic testing.

[0091] The method of this application may also include a clamping device designed to reduce the fan-shaped unfolding of tilted substrate stacks. In some embodiments, the clamping device of this application may be combined with... Figures 1-3 The imaging device 131 is used in conjunction with it. In another embodiment, the clamping device of this application can be used with... Figure 4 The substrate support device 403 and the monitoring device 411 are used together.

[0092] Now we will understand that the clamping device can be connected with Figures 1-3 In cases where imaging device 131 is used in conjunction with similar or identical means, the discussion will focus on... Figure 4 An embodiment of the clamping devices 701 and 1301 used in conjunction with the substrate support device 403 and the monitoring device 411. (See reference...) Figure 7 The substrate support device 403 can place the additional substrate 101, which is engaged and supported by the suction device 405, onto the inclined substrate 101 stack 109. Once placed, as Figure 7 and Figure 9 As shown, the abutment devices 904 and 1304 can extend in direction 707a via the actuator of the base member 703, so as to bring the pressing members 705 and 1305 close to the inclined substrate 101 stack 109. Figure 10 As shown, one or more actuators 903 can provide an extension of pressing members 705, 1305 in direction 707a via rod 902 until the pressing members 705, 1305 press and apply force onto the substrate 101 engaged and supported by the substrate support device 403. Figure 8 and Figure 10 As shown, the forces applied by the pressing members 705 and 1305 press the inclined substrate 101 stack 109 together.

[0093] like Figure 8As shown, the press members 705, 1305 of the hold down apparatus 701, 1301 can be used to hold down the tilted stack 109 of substrates 101 while the substrates 101 are still engaged and / or supported by the substrate support apparatus 403. While not shown, some alternative embodiments can disengage the substrate support apparatus 403 from the supported substrates prior to the previously supported substrates initially contacting the press members 705, 1305 of the hold down apparatus 701, 1301. However, disengaging the substrate support apparatus 403 from the substrates while the tilted stack of substrates is being held down by the hold down apparatus can help remove the substrate support apparatus 403 from the tilted stack of substrates without inadvertently pulling one or more substrates away from the stack as the substrate support apparatus is removed. In fact, the press members 705, 1305 can act to hold the supported substrates in place while the substrate support apparatus 403 is pulled away from the stack, thereby maintaining a compact configuration and reducing inadvertent fanning out that can occur when the substrate support apparatus 403 is pulled away from contact with the tilted stack 109 of substrates 101. Figure 17 Embodiments are shown in which the substrate support apparatus 403 is pulled away while the press members 705 of the hold down apparatus 701 continue to press against the outer substrates in the tilted stack 109 of substrates 101.

[0094] Figure 18 The hold down apparatus 701, 1301 is shown disengaging from the outer substrates of the tilted stack 109 of substrates 101. In some embodiments, the process can include a single hold down cycle in which the hold down apparatus 701, 1301 presses against the outer substrates of the placed stack for a single time. After the hold down apparatus 701, 1301 (see Figure 18 ) is disengaged, the substrate support apparatus 403 can place additional substrates on the tilted stack 109 of substrates 101 and similarly proceed as described above to perform a single hold down cycle to again hold down the tilted stack 109 of substrates 101 using the hold down apparatus 701, 1301. The process then continues until the stack is complete after a predetermined number of substrates have been stacked or after a predetermined maximum fanning out level is detected.

[0095] In alternative embodiments, two or more hold down cycles can be performed on the substrates placed on the tilted stack of substrates. For example, after the press members 705, 1305 of the hold down apparatus 701, 1301 are disengaged from the outer substrates of the tilted stack 109 of substrates 101, a second hold down cycle can be performed in which the press members 705, 1305 press against the outer substrates of the tilted stack 109 of substrates 101 by again being pressed against the outer substrates of the tilted stack 109 of substrates 101 along the direction of the tilt of the stack 109 of substrates 101. Figure 17The direction 707a shown extends to re-engage the same outer substrate. In some embodiments, the method can apply pressure to the outer substrate of the stack 109 of tilted substrates 101 with the pressing member 705, 1305 of the compacting device 701, 1301 for a period of time to compact the stack 109 of tilted substrates 101, then the compacting device 701, 1301 can stop applying pressure to the substrates for a period of time (e.g., by retracting the pressing member 705, 1305 as shown), and then re-apply pressure to the same substrates with the compacting device 701, 1301 along the compacting axis 901. In some embodiments, the substrate support apparatus can disengage from the outer substrate prior to re-applying pressure, where the re-applying pressure is performed while the substrate support apparatus is disengaged from the additional substrates (e.g., see Figure 18 ). In alternative embodiments, the substrate support apparatus can remain engaged with the outer substrate during two or more compacting cycles (e.g., see Figure 17 ). Figure 8

[0096] Figures 19-20 is a graph comparing experimental results of the fan-out (represented by the vertical y-axis, e.g., in millimeters) relative to the number of substrates in the stack of tilted substrates (represented by the horizontal x-axis). Figure 19 represents two experimental trials of stacking 330 substrates in a stack of tilted substrates, where the package performance was measured periodically after a number of substrates had been stacked. Curve 1901 represents an experimental trial without compacting, while curve 1903 represents an experimental trial where a single compacting cycle of 30 pounds per square inch (207 kiloPascals) was applied to the lower portion of the stack of tilted substrates after each substrate was stacked. As shown, the stack with the single compacting cycle (see curve 1903) was compared to the stack without compacting (see curve 1901), where the single compacting cycle can significantly reduce the fan-out from greater than 7 millimeters (mm) to less than 4 mm.

[0097] Figure 20 represents two experimental trials of stacking 110 substrates in a stack of tilted substrates, where the package performance was measured periodically after a number of substrates had been stacked. Curve 2001 represents an experimental trial where a single compacting cycle of 30 pounds per square inch (207 kiloPascals) was applied to the lower portion of the stack of tilted substrates after each substrate was stacked. Curve 2003 represents an experimental trial where there were two compacting cycles after each substrate was stacked, where each of the two compacting cycles applied 10 pounds per square inch (69 kiloPascals) to the lower portion of the stack of tilted substrates, where there was a 5 second delay between each of the two compacting cycles. As shown, the stack with the two compacting cycles (see curve 2003) was compared to the stack with the single compacting cycle (see curve 2001), where the stack with the two compacting cycles can significantly reduce the fan-out from approximately 12 mm to approximately 6 mm.​

[0098] Therefore, as Figure 19 As shown, a single compression cycle applying 30 pounds per square inch (207 kPa) of pressure to the lower portion of a tilted stack provides reduced fan-out unfolding compared to a stack without a single compression cycle. Furthermore, as... Figure 20 As shown, performance can be further improved by applying only 1 / 3 of the pressure to the lower portion of the tilted stack through two compression cycles. In some implementations, a single cycle can be used to reduce fan-out when a rapid formation of a substrate stack with improved fan-out is required. Furthermore, while two cycles may require additional time to produce the substrate stack, performing two cycles at lower pressure after placing each substrate on the tilted substrate stack further reduces fan-out, while also reducing the chance of stress fracture due to the lower pressure used when compressing the tilted substrate stack.

[0099] As described above, a single clamping cycle can apply a pressure of 30 pounds per square inch (207 kPa) to the tilted substrate stack using a clamping member, but in some embodiments, the pressure can range from about 10 pounds per square inch (psi) (69 kPa) to about 80 psi (552 kPa), such as from about 20 psi (138 kPa) to about 40 psi (276 kPa). As described above, each of two clamping cycles can apply a pressure of 10 psi (69 kPa) to the tilted substrate stack using a clamping member, but in some embodiments, the pressure can range from about 5 psi (34 kPa) to about 20 psi (138 kPa), such as from about 8 psi (55 kPa) to about 12 psi (83 kPa).

[0100] In some embodiments, the clamping shaft 901 may extend along the outer surface of the pressing members 705, 1305. In other embodiments, the outer surface of the pressing members 705, 1305 may include the clamping shaft 901, wherein the clamped inclined substrate stack 101 109 includes applying pressure to the substrate supported by the substrate support device 403 along the clamping shaft 901 using the clamping devices 701, 1301. Figures 7-8 As shown, when the inclined substrate stack is pressed, the pressing shaft 901 can be positioned along the lower portion of the inclined substrate stack 101 109. In some embodiments, the lower portion of the inclined substrate stack may include the lower 50%, 40%, 30%, 20%, or 10% of the length "L" of the inclined substrate stack 101 109. Although not shown, the pressing shaft 901 may be located at the center or upper portion of the inclined substrate stack 109. In further embodiments, multiple pressing members may be provided at the lower, center, and / or upper portions of the inclined substrate stack 109.

[0101] In some embodiments, when clamping a stack of tilted substrates, the clamping device can apply a substantially constant pressure along the length of the clamping axis. For example, as shown, in Figure 9 In some embodiments, all actuators 903 can push the pressing member 705 in a substantially equal direction of extension 707a, such that the entire outer surface of the pressing member 705 simultaneously engages the outer surface of the outer substrate 101 of the inclined stack 109 (e.g., along the entire width "W" of the inclined substrate stack 109). Figure 10 As shown, the pressing member 705 can maintain a substantially constant clamping pressure along the width "W" of the inclined substrate stack 109 to provide uniform encapsulation along the width "W" of the inclined stack 109. In some embodiments, the pressing member 705 may be substantially rigid to allow the pressing member 705 to apply consistent pressure between the levers 902. In some embodiments, the pressing member 705 may comprise plastic, metal, or other materials.

[0102] In some embodiments, when pressing a stack of tilted substrates, the pressing device can apply varying pressure to the additional substrate along the pressing axis 901. For example, in some embodiments, the pressing member 705 can be flexible or segmented to allow the outer portion of the pressing member 705 to engage the outer substrate at different times. For example, as Figures 11-12 As shown, the pressing member 705 may initially contact one side of the outer substrate and then continue to engage the outer substrate continuously across the width "W" until the other side is reached. In an alternative embodiment, the middle portion of the outer substrate may be engaged, wherein the pressing member 705 continues to engage additional portions continuously towards the opposite side of the outer substrate in the opposite direction. In this way, fan-out is reduced because gas (e.g., air) can be expelled from the stack without being trapped within the stack as an air pocket. In some embodiments, once engagement is complete, a constant pressure can be maintained across the width "W" of the inclined substrate stack 109 to provide consistent compression of the inclined stack 109.

[0103] In some implementations, the method may include pressing without direct contact between the pressing member and the outer substrate. For example, as... Figure 15As shown, the press member 1305 can include a plurality of holes 1501 designed to provide a fluid cushion between the press member 1305 and the outer substrate. In operation, a gas (e.g., compressed air) can be introduced into the fluid pressure chamber 1601 through the inlet port. The fluid pressure chamber 1601 can supply a uniform flow of compressed gas through the holes 1501 in fluid communication with the fluid pressure chamber. As shown, in some embodiments, the press member 1305 can include a plurality of segments 1307a, 1307b, 1307c. In some embodiments, the configuration of each segment 1307a, 1307b, 1307c can be similar, but in further embodiments different configurations can be provided. Further, while a plurality of segments are shown, in further embodiments a single segment can be provided. However, a plurality of segments can allow for independent control of the pressure within each pressure chamber 1601 of each segment, which can provide different air cushion profiles due to different rates at which pressurized gas can flow through the holes 1501. A plurality of segments can also allow for independent movement of each segment 1307a, 1307b, 1307c in the direction 707a to allow the press member 1305 to continuously engage the outer substrate (e.g., by preventing excessive fan-out by avoiding trapped air pockets). As Figure 14 As shown, when the stack 109 of tilted substrates 101 is pressed, the press member 1305 can create a fluid cushion 1401 (e.g., air cushion) between the stack 109 of tilted substrates 101 and the press member 1305 of the pressing device 1301. In some embodiments, the fluid cushion 1401 can facilitate the application of force to the stack 109 of tilted substrates 101 without actually mechanically contacting any of the substrates.

[0104] It should be understood that, even though various embodiments have been described herein with regard to certain illustrative and specific examples, the application should not be deemed limited thereto, as many modifications and combinations of the disclosed features are possible without departing from the scope of the following claims.

Claims

1. A substrate support device for generating an inclined substrate stack by sequentially placing individual substrates onto a substrate support structure, the substrate support device comprising: Base; Multiple suction devices are provided for suctioning the substrate, each of the multiple suction devices being movably mounted to the base; as well as A monitoring device configured to monitor any position of one of the plurality of suction devices. The characteristic of the inclined substrate stack, including its fan-shaped unfolding, is determined by monitoring the arbitrary position of each suction device.

2. The substrate support device of claim 1, wherein the monitoring device is configured to monitor the position of the suction device relative to the base.

3. The substrate support device as claimed in claim 1, wherein the monitoring device includes an ultrasonic sensor.

4. The substrate support device of claim 1, wherein each of the plurality of suction devices is movably mounted to the base for translation relative to the base in an adjustment direction.

5. The substrate support device of claim 4, wherein the plurality of suction devices comprises a row of suction devices, wherein each suction device in the row of suction devices is spaced apart from another suction device in the row of suction devices along a column axis, the column axis being perpendicular to the adjustment direction.

6. The substrate support device of claim 1, wherein the base includes side rails, each of the side rails extending along an outer edge of the substrate, and the suction device is positioned spaced apart from each other along a column axis of each of the side rails.

7. A substrate packaging apparatus for encapsulating tilted substrate stacks, the substrate packaging apparatus comprising: A substrate support structure configured to support the tilted substrate stack, the substrate support structure including a rear surface and a lower surface, the rear surface being configured to support the main surface of the substrate of the tilted substrate stack, and the lower surface extending away from the rear surface and configured to support the lower edge of the substrate of the tilted substrate stack. as well as A clamping device, the clamping device comprising a clamping shaft extending along the width of the rear surface, When the inclined substrate stack is pressed together, the pressing device generates a fluid pad between the inclined substrate stack and the pressing device.

8. The substrate packaging apparatus of claim 7, wherein the clamping device includes a plurality of actuators configured to apply force to the lower portion of the inclined substrate stack along the clamping axis.

9. The substrate packaging apparatus of claim 7, wherein the clamping device includes a plurality of actuators configured to apply a varying force to the lower portion of the inclined substrate stack along the clamping axis.

10. The substrate packaging apparatus of claim 7, wherein the clamping device includes a plurality of holes communicating with a fluid pressure chamber.

11. A method for determining the characteristics of a tilted substrate stack, comprising: Multiple substrates are stacked on a substrate support structure to form an inclined substrate stack; The features of the tilted substrate stack are imaged; Information obtained during the imaging process is used to determine the characteristics of the tilted substrate stack, wherein the characteristics of the tilted substrate stack include the fan-shaped unfolding of the tilted substrate stack. as well as The additional substrates are stacked on the inclined substrate stack using a substrate support device that supports additional substrates, and the inclined substrate stack is pressed together by engaging the additional substrates with a pressing device. When the inclined substrate stack is pressed together, the pressing device applies pressure along the pressing axis and creates a fluid pad between the additional substrate and the pressing device.

12. The method of claim 11, wherein when the inclined substrate stack is pressed, the pressing shaft is positioned along the lower portion of the inclined substrate stack.

13. The method of claim 11, wherein when the inclined substrate stack is pressed, the pressing device applies varying pressure to the additional substrate along the pressing axis.

14. A method for determining the characteristics of a tilted substrate stack, comprising: Additional substrates are stacked on an inclined substrate stack, wherein a substrate support device engages with the additional substrates. When the substrate support device engages the additional substrate, the characteristics of the tilted substrate stack are determined using the substrate support device, and The inclined stack of substrates is pressed together by a clamping device that presses against the additional substrate. The step of pressing the inclined substrate stack includes: applying pressure to the additional substrate along the pressing axis using the pressing device. When the inclined substrate stack is pressed together, the pressing device generates a fluid pad between the inclined substrate stack and the pressing device.

15. The method of claim 14, wherein when the additional substrate is stacked on the inclined substrate stack, a plurality of suction devices of the substrate support device are removably attached to the additional substrate.

16. The method of claim 15, wherein the step of determining the characteristic comprises: One of the plurality of suction devices is moved relative to another suction device among the plurality of suction devices.

17. The method of claim 16, wherein the step of determining the characteristic comprises: Monitor the position of the suction device.

18. The method of claim 17, wherein the position of the suction device is monitored by an ultrasonic sensor.

19. The method of claim 14, wherein when the inclined substrate stack is pressed, the pressing shaft is positioned along the lower portion of the inclined substrate stack.

20. The method of claim 14, wherein when the inclined substrate stack is pressed, the pressing device applies varying pressure to the additional substrate along the pressing axis.

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