Capturing device and substrate processing device including the same

Abstract

A substrate processing apparatus capable of stably controlling the position of a meniscus is provided. The apparatus includes a head unit for discharging liquid chemicals; a reservoir for storing the liquid chemicals and supplying the liquid chemicals to the head unit; a pressure regulating unit for regulating the pressure within the reservoir; and a capture unit disposed between the reservoir and the pressure regulating unit and for capturing mist generated from the reservoir.

Description

Technical Field

[0001] The present invention relates to a capturing device and a substrate processing device comprising the capturing device. Background Art

[0002] To manufacture display devices such as LCD panels, PDP panels, and LED panels, inkjet heads are used to print on substrates. The position of the meniscus in the inkjet head's nozzle is a key factor in determining the ink jetting characteristics. This meniscus position can be controlled using a meniscus pressure controller (MPC). Summary of the Invention

[0003] Technical problems solved

[0004] The technical problem to be solved by the present invention is to provide a substrate processing device that can stably control the position of the meniscus without causing erroneous operations.

[0005] Another technical problem to be solved by the present invention is to provide a capture device for the above substrate processing device.

[0006] The objects of the present invention are not limited to the above-mentioned objects, and those skilled in the art will clearly understand other objects not mentioned from the following description.

[0007] Workaround

[0008] To solve the above technical problems, a substrate processing device according to one aspect of the present invention includes: a head unit for discharging liquid chemicals; a reservoir for storing liquid chemicals and supplying the liquid chemicals to the head unit; a pressure regulating unit for regulating the pressure inside the reservoir; and a capture unit arranged between the reservoir and the pressure regulating unit and for capturing mist generated from the reservoir.

[0009] To solve the above technical problems, a substrate processing device according to another aspect of the present invention includes: a stage for processing a substrate; a gantry arranged across the stage; and an inkjet head module, arranged on the gantry and used to discharge ink to the substrate, and wherein the inkjet head module includes: a head unit for discharging ink; a reservoir for storing ink and supplying the ink to the head unit; a pressure regulating unit for regulating the pressure inside the reservoir; and a capture unit arranged between the reservoir and the pressure regulating unit and capturing mist generated in the reservoir, wherein the capture unit includes: a main body; a first pipeline arranged in the main body, connected to the reservoir, and extending in a first direction; a second pipeline arranged in the main body, connected to the pressure regulating unit, and extending in a second direction; a third pipeline arranged to pass through the first pipeline and the second pipeline from the upper surface of the main body; and a capture layer arranged on the inner wall of the first pipeline or the inner wall of the second pipeline and used to capture the mist.

[0010] In order to solve the other technical problem mentioned above, the capture device according to one aspect of the present invention includes: a main body; a first pipeline, arranged in the main body, connected to the inlet, and extending in one direction; a second pipeline, arranged in the main body, connected to the outlet, and extending in the one direction; a third pipeline, arranged to pass through the first pipeline and the second pipeline from the upper surface of the main body; and a capture layer, arranged on the inner wall of the first pipeline or the inner wall of the second pipeline, and used to capture mist.

[0011] Specific details of other embodiments are included in the detailed description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a block diagram for illustrating a substrate processing apparatus according to some embodiments of the present invention.

[0013] Figure 2 It is shown in detail Figure 1 Diagram of the supply reservoir, capture unit and pressure regulating unit.

[0014] Figure 3 is a cross-sectional view for explaining a collection unit according to a first embodiment of the present invention.

[0015] Figure 4 Is used to illustrate Figure 3 Diagram of the movement of mist in the capture unit.

[0016] Figure 5 is a cross-sectional view for explaining a collection unit according to a second embodiment of the present invention.

[0017] Figure 6is a cross-sectional view for explaining a collection unit according to a third embodiment of the present invention.

[0018] Figure 7 is a cross-sectional view for explaining a collection unit according to a fourth embodiment of the present invention.

[0019] Figure 8 is a cross-sectional view for explaining a collection unit according to a fifth embodiment of the present invention.

[0020] Figure 9 FIG. 1 is an exemplary diagram for explaining an apparatus to which a substrate processing apparatus according to some embodiments of the present invention is applied.

[0021] Figure 10 is a flowchart for illustrating a substrate processing method according to some embodiments of the present invention. DETAILED DESCRIPTION

[0022] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the present invention and methods for achieving the advantages and features will become clear with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and the present embodiment is provided only to complete the disclosure of the present invention and to fully inform those skilled in the art of the present invention of the scope of the invention, and the present invention is limited only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0023] Spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used to describe the relationship of one element or constituent element to other elements or constituent elements as shown in the figures. Spatially relative terms should be understood to include terms that refer to different orientations of an element when in use or in operation, in addition to the orientation shown in the figures. For example, where the elements shown in the figures are flipped, an element described as being "below" or "beneath" another element may be positioned "above" the other element. Thus, the exemplary term "below" may include both below and above orientations. Elements may also be oriented in other orientations, and thus spatially relative terms may be interpreted based on orientation.

[0024] Although the terms "first," "second," etc. are used to describe various elements, constituents, and / or parts, it is clear that these elements, constituents, and / or parts are not limited by these terms. These terms are only used to distinguish one element, constituent, or part from other elements, constituents, or parts. Therefore, within the technical concept of the present invention, the first element, first constituent, or first part mentioned below may also be the second element, second constituent, or second part.

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when describing with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals regardless of the figure numbers, and repeated description thereof is omitted.

[0026] Figure 1 is a block diagram of a substrate processing apparatus according to some embodiments of the present invention. Figure 2 It is shown in detail Figure 1 Diagram of the supply reservoir, capture unit and pressure regulating unit.

[0027] First, refer to Figure 1 , a substrate treating apparatus 1 according to some embodiments of the present invention includes a head unit 210 , a supply reservoir 220 , a pressure adjusting unit 230 , a buffer reservoir 240 , and a capture unit 100 .

[0028] The head unit 210 receives liquid chemicals from the supply reservoir 220 and discharges the received liquid chemicals onto the substrate. The head unit 210 has a plurality of nozzles for discharging the liquid chemicals onto the substrate. The liquid chemicals supplied to the head unit 210 can be provided by gravity from the supply reservoir 220 located above the head unit 210, but are not limited thereto.

[0029] The supply tank 220 is provided above the head unit 210. The supply tank 220 receives and stores liquid chemicals from a buffer tank 240 located above the supply tank 220.

[0030] The pressure regulating unit 230 is connected to the supply reservoir 220 to regulate the pressure inside the supply reservoir 220. The pressure regulating unit 230 may be a meniscus pressure controller (MPC).

[0031] The pressure regulating unit 230 regulates the pressure inside the supply reservoir 220 by providing positive pressure and / or negative pressure to the supply reservoir 220 .

[0032] Specifically, the pressure regulating unit 230 can control the supply of the liquid chemical from the supply reservoir 220 to the head unit 210 by regulating the pressure inside the supply reservoir 220. For example, the supply of the liquid chemical from the supply reservoir 220 to the head unit 210 is achieved by gravity, and the supply of the liquid chemical is stopped by applying negative pressure to the inside of the supply reservoir 220 by the pressure regulating unit 230.

[0033] Furthermore, the pressure adjustment unit 230 adjusts the pressure so that the liquid chemical forms a concave meniscus at the ends of the multiple nozzles provided in the head unit 210 (i.e., the surface of the liquid chemical is higher in the center than in the periphery due to surface tension). When the liquid chemical forms a concave meniscus, the liquid chemical does not flow out of the nozzle ends, thereby reducing substrate defects.

[0034] Buffer reservoir 240, on the other hand, receives and stores liquid chemicals from an external liquid chemical supply source (not shown), and then supplies the received liquid chemicals to supply reservoir 220. When liquid chemicals are supplied from the liquid chemical supply source (not shown) to buffer reservoir 240, the interior of the liquid chemical supply source is pressurized. If the liquid chemical supply source were directly connected to supply reservoir 220, the internal pressure of supply reservoir 220 would be affected by the liquid chemical supply source. However, the presence of buffer reservoir 240 between the liquid chemical supply source and supply reservoir 220 prevents the liquid chemical supply source from affecting supply reservoir 220.

[0035] The capturing unit 100 is provided between the supply reservoir 220 and the pressure regulating unit 230. The capturing unit 100 captures mist generated in the supply reservoir 220.

[0036] Here, refer to Figure 2 A heater 222 is provided on the supply reservoir 220 to adjust the temperature of the liquid chemical. Figure 2 2 shows a case where the heater 222 is provided on the bottom surface of the supply reservoir 220 , but the present invention is not limited thereto. That is, the heater 222 may also be provided on the side wall or the upper surface of the supply reservoir 220 .

[0037] The pressure regulating unit 230 is connected to the supply reservoir 220 via tubular members 229 and 239. An interlock sensor 232 is provided on the tubular member 239. For example, the interlock sensor 232 may be a liquid detection sensor. The pressure regulating unit 230 is susceptible to the influence of liquids (i.e., liquid chemicals, etc.). When the pressure regulating unit 230 is exposed to liquids, malfunctions may occur or the meniscus control may become inaccurate. Therefore, if the interlock sensor 232 detects liquid before the liquid reaches the pressure regulating unit 230, an interlock for stopping operation will occur.

[0038] In addition, the capture unit 100 is disposed between the supply reservoir 220 and the pressure regulating unit 230. That is, the capture unit 100 is connected to the supply reservoir 220 through the tubular member 229 and is connected to the pressure regulating unit 230 through the tubular member 239.

[0039] As described above, since the supply reservoir 220 is provided with the heater 222, mist (i.e., liquid chemical mist or vaporized liquid chemical) can be generated by the heating operation of the heater 222. When this mist is transmitted to the pressure regulating unit 230, it may cause the pressure regulating unit 230 to malfunction. Alternatively, the purpose of the interlock sensor 232 is to sense whether an overflow has occurred, but if the interlock sensor 232 senses mist, an interlock may also occur. Even if the liquid chemical has not overflowed from the supply reservoir 220, the interlock sensor 232 may identify it as a liquid chemical overflow (i.e., the interlock sensor 232 has malfunctioned).

[0040] Therefore, the capturing unit 100 is located at a lower position than the interlock sensor 232 to block the mist generated from the supply reservoir 220 , thereby preventing the mist from being transferred to the interlock sensor 232 or the pressure regulating unit 230 .

[0041] The capture unit 100 is inclined at an acute angle θ relative to the upper surface 220a of the supply reservoir 220. As described below, this is to increase the contact surface between the mist and the capture unit 100, enabling the capture unit 100 to capture more mist. Furthermore, when the liquid chemical liquefied in the capture unit 100 drips into the supply reservoir 220, it flows slowly along the inclined tubular member 229, thereby preventing bubbles from forming in the supply reservoir 220.

[0042] In the following, reference will be made to Figures 3 to 7 Various embodiments of the capture unit 100 are described.

[0043] Figure 3 is a cross-sectional view for explaining a collection unit according to a first embodiment of the present invention. Figure 4 For instruction manual Figure 3 Diagram of the movement of mist in the capture unit.

[0044] First, refer to Figure 3 The capture unit 100 according to the first embodiment of the present invention includes a body 105, a first pipeline 110, a second pipeline 120, a third pipeline 130, a first capture layer 116, a second capture layer 126, and the like.

[0045] The main body 105 may be made of metal, for example, and may have a first pipeline 110 , a second pipeline 120 , a third pipeline 130 , etc. disposed therein.

[0046] The first line 110 is connected to the supply reservoir ( Figure 2220) and extends along a first direction. A first trapping layer 116 is provided on the inner wall of the first pipeline 110 for trapping mist. For example, the first trapping layer 116 may include at least one of a mesh structure, a membrane structure, and a filter structure, but is not limited thereto. For example, the mesh structure may be made of a metal such as stainless steel (SUS). The membrane structure and the filter structure may include internal pores to contain the mist, but are not limited thereto.

[0047] The second pipeline 120 is connected to the pressure regulating unit 230 and extends along a second direction. As shown in the figure, the first direction and the second direction can be substantially the same (i.e., parallel), but are not limited thereto. A second trapping layer 126 is provided on the inner wall of the second pipeline 120 to capture mist. For example, the second trapping layer 126 can include at least one of a mesh structure, a membrane structure, and a filter structure, but is not limited thereto.

[0048] The third pipeline 130 connects the first pipeline 110 and the second pipeline 120 to each other. For example, the third pipeline 130 may penetrate the first pipeline 110 and the second pipeline 120 from the upper surface of the main body 105. A cover 140 may be provided on the upper surface of the main body 105 to open or seal one side of the third pipeline 130. For example, the cover 140 may be a screw, but is not limited thereto.

[0049] The first pipeline 110 includes a first connection port 111 connected to the third pipeline 130. The first pipeline 110 includes an inlet 118 and a first buffer zone 119. The inlet 118 is located on a first side (e.g., the left side) relative to the center of the first connection port 111, and the first buffer zone 119 is located on a second side (e.g., the right side) relative to the center of the first connection port 111. A first connecting member 110a is provided at the inlet 118 for connection to the tubular member 229. The first connecting member 110a can be inserted into and secured within the main body 105.

[0050] Similarly, the second pipeline 120 includes a second connection port 121 connected to the third pipeline 130. The second pipeline 120 includes an outlet 128 and a second buffer zone 129. The outlet 128 is located on a second side (e.g., the right side) relative to the center of the second connection port 121, and the second buffer zone 129 is located on a first side (e.g., the left side) relative to the center of the second connection port 121. A second connecting member 120a is provided at the outlet 128 for connecting to the tubular member 239. The second connecting member 120a can be inserted into and secured within the main body 105.

[0051] As described above, the movement path of the mist can be maximized by forming the first, second, and third pipelines 110, 120, and 130. By extending the movement path of the mist, the mist can be liquefied inside the capture unit 100 while moving along the movement path.

[0052] Here, refer to Figure 4 The movement of mist in the collection unit 100 will be described. The description will be made by taking as an example the case where the first collection layer 116 and the second collection layer 126 are a mesh structure formed of metal (SUS).

[0053] The mist generated from the supply reservoir 220 is introduced into the capturing unit 100 through the first connection member 110a and the inlet 118 (see reference sign G1).

[0054] A portion of the mist introduced into the collection unit 100 rises to the first buffer zone 119 and is confined therein (see reference symbol G2). The mist confined in the first buffer zone 119 is liquefied while contacting the first collection layer 116, which has a relatively low temperature. The liquefied liquid chemical flows downward along the extending direction of the first pipeline 110 and flows to the outside of the inlet 118.

[0055] In addition, a portion of the mist introduced into the collection unit 100 reaches the third pipeline 130 (see reference numeral G3). To move along the third pipeline 130, the mist must pass through the first collection layer 116 having a relatively low temperature. In the process of passing through the first collection layer 116, the temperature of the mist may decrease or the mist may liquefy.

[0056] In addition, a portion of the mist introduced into the third pipeline 130 reaches the second pipeline 120 (see reference numerals G4 and G5). To move along the second pipeline 120, the mist must pass through the second collecting layer 126 having a relatively low temperature. While passing through the second collecting layer 126, the temperature of the mist may decrease or the mist may liquefy.

[0057] A portion of the mist that reaches the second pipeline 120 reaches the second buffer zone 129 and is confined therein (see reference symbol G5). The mist confined therein comes into contact with the second collecting layer 126 having a relatively low temperature and is liquefied. The liquefied liquid chemical can be collected in the second buffer zone 129 or can flow out through the third pipeline 130.

[0058] A portion of the mist that reaches the second pipeline 120 can move toward the outlet 128 (see reference symbol G4). However, as the mist travels along the long path, it continuously contacts the relatively low-temperature trapping layers 116 and 126. Therefore, most of the mist cannot reach the outlet 128 and is liquefied.

[0059] Additionally, the liquefied liquid chemical remains within the capture unit 100 or moves to the supply reservoir 220 through the tubular member 229 .

[0060] When the cover 140 is opened, one side of the third pipeline 130 extending to the upper surface of the body 105 is opened. Therefore, the liquid chemicals remaining in the capture unit 100 can be discharged through the third pipeline 130 extending to the upper surface of the body 105.

[0061] Furthermore, the capture unit 100 is inclined at an acute angle θ relative to the upper surface 220a of the supply reservoir 220. Consequently, the tubular member 229 connecting the capture unit 100 and the supply reservoir 220 is also inclined. As a result, the liquefied liquid chemical flows slowly along the inclined tubular member 229 and falls into the supply reservoir 220. As a result, bubbles are not generated in the supply reservoir 220.

[0062] As a result, the capture unit 100 blocks the mist generated from the supply reservoir 220 to prevent the mist from being transferred to the interlock sensor 232 or the pressure regulating unit 230. Therefore, malfunction of the interlock sensor 232 can be prevented, and the pressure regulating unit 230 can be stably operated.

[0063] Figure 5 is a cross-sectional view for explaining a capture unit according to a second embodiment of the present invention. Figure 3 and Figure 4 The descriptions differ.

[0064] Reference Figure 5 In the capture unit 101 according to the second embodiment of the present invention, the first capture layer 116 may not be provided on the entire inner wall of the first pipeline 110, but may be provided on only a portion of the inner wall of the first pipeline 110. The second capture layer 126 may not be provided on the entire inner wall of the second pipeline 120, but may be provided on only a portion of the inner wall of the second pipeline 120.

[0065] exist Figure 5 , the first trapping layer 116 is shown as being disposed near the inlet 118 and not in the first buffer 119 , but the present invention is not limited thereto. For example, the first trapping layer 116 may be disposed in the first buffer 119 instead of near the inlet 118 .

[0066] Although the second trapping layer 126 is shown as being disposed near the outlet 128 and not in the second buffer zone 129 , the present invention is not limited thereto. For example, the second trapping layer 126 may be disposed in the second buffer zone 129 instead of near the outlet 128 .

[0067] Even if the capture layers 116 and 126 are provided only on a portion of the first pipeline 110 and the second pipeline 120 , the mist may be liquefied while passing through a long path.

[0068] Figure 6 is a cross-sectional view for explaining a collection unit according to a third embodiment of the present invention. Figure 7 is a cross-sectional view for explaining a capture unit according to a fourth embodiment of the present invention. Figures 3 to 5 The descriptions differ.

[0069] Reference Figure 6 Unlike the capture unit 100 according to the first embodiment, the capture unit 102 according to the third embodiment may not have a first buffer zone (see Figure 3 119). Figure 7 Unlike the capture unit 100 according to the first embodiment, the capture unit 103 according to the fourth embodiment may not have a second buffer zone (see Figure 3 129).

[0070] Figure 8 is a cross-sectional view for explaining a capture unit according to a fifth embodiment of the present invention. Figure 3 and Figure 4 The descriptions differ.

[0071] Reference Figure 8 , the third pipelines 131, 132 and 135 of the capture unit 104 according to the fifth embodiment of the present invention have a Figure 3 The third line 130 is shown as a long path.

[0072] For example, the first pipeline 110 and the second pipeline 120 may be parallel to each other, and the third pipelines 131, 132, and 135 may include an intermediate pipeline 135, a first vertical pipeline 131, and a second vertical pipeline 132. The intermediate pipeline 135 is arranged between the first pipeline 110 and the second pipeline 120 and is parallel to the first pipeline 110 and the second pipeline 120. The first vertical pipeline 131 connects the intermediate pipeline 135 and the first pipeline 110 to each other. The second vertical pipeline 132 connects the intermediate pipeline 135 and the second pipeline 120 to each other.

[0073] The mist entering the inlet 118 reaches the outlet 128 after passing through the first pipeline 110, the first vertical pipeline 131, the middle pipeline 135, the second vertical pipeline 132, and the second pipeline 120. That is, since the internal path of the capture unit 100 becomes quite long, the mist is liquefied while passing through the internal path without reaching the interlock sensor 232 or the pressure regulating unit 230.

[0074] Figure 9 FIG. 1 is an exemplary diagram for explaining an apparatus to which a substrate processing apparatus according to some embodiments of the present invention is applied.

[0075] like Figure 9 As shown, the apparatus includes a stage PT, a gantry 410, an inkjet head module 420, a control unit 450, and the like.

[0076] The stage PT extends longitudinally along a first direction Y and is capable of moving a substrate G (see reference numeral S) along the first direction Y. For example, a plurality of holes may be formed in the stage PT, through which gas may be exhausted, thereby suspending the substrate for manufacturing. While the substrate for manufacturing is suspended, the holder may clamp and move the substrate, but is not limited thereto.

[0077] The gantry 410 is arranged above the stage PT. The gantry 410 is arranged across the stage PT. The gantry 410 is arranged to extend in a second direction X different from the first direction Y.

[0078] The inkjet head module 420 is disposed on the gantry 410 and can move in the second direction X (refer to the reference symbol W) along the gantry 410. The inkjet head module 420 corresponds to the reference symbol Figures 1 to 8 Description of the device 1.

[0079] That is, the inkjet head module 420 includes a head unit for ejecting ink, a reservoir for storing ink and supplying ink (i.e., liquid chemical) to the head unit, a pressure regulating unit for regulating the pressure inside the reservoir, and a capturing unit arranged between the reservoir and the pressure regulating unit and for capturing mist generated in the reservoir.

[0080] Here, the capture unit may include: a main body; a first pipeline disposed within the main body, connected to the reservoir, and extending in a first direction; a second pipeline disposed within the main body, connected to the pressure regulating unit, and extending in a second direction; a third pipeline disposed from the upper surface of the main body through the first and second pipelines; and a capture layer disposed on the inner wall of the first or second pipeline and configured to capture mist. Here, the main body is inclined at an acute angle relative to the upper surface of the reservoir.

[0081] The first pipeline includes a first connection port connected to the third pipeline, the first pipeline further including an inlet arranged on a first side relative to a center of the first connection port and a first buffer zone arranged on a second side relative to the center of the first connection port. The second pipeline includes a second connection port connected to the third pipeline, the second pipeline further including an outlet arranged on a second side relative to a center of the second connection port and a second buffer zone arranged on a first side relative to the center of the second connection port.

[0082] In addition, the inkjet head module 420 discharges droplets onto the substrate G while moving in the second direction X while the substrate G on the stage PT moves in the first direction Y (ie, swath movement).

[0083] The control unit 450 controls the table PT, the inkjet head module 420, etc. The control unit 450 is connected to a memory (not shown) in which instructions for operating the table PT, the inkjet head module 420, etc. are stored.

[0084] Figure 10 is a flowchart for illustrating a substrate processing method according to some embodiments of the present invention.

[0085] Reference Figures 1 to 3 as well as Figure 10 , a substrate processing apparatus 1 including a head unit 210 , a supply reservoir 220 , a pressure adjustment unit 230 , and a capture unit 100 is prepared.

[0086] Next, the temperature of the liquid chemical in the supply tank 220 is adjusted by the heater 222 provided in the supply tank 220 ( S401 ).

[0087] The mist (ie, liquid chemical mist or vaporized liquid chemical) is generated by the heating operation of the heater 222 (S403).

[0088] Next, the mist generated from the supply reservoir 220 is transferred to the capture unit 100 through the tubular member 229. The mist is liquefied while moving along the path inside the capture unit 100. That is, the mist can be liquefied through the capture layers 116 and 126 and / or the long movement path (i.e., the first pipeline 110, the second pipeline 120, and the third pipeline 130). The liquefied liquid chemical returns to the supply reservoir 220 along the tubular member 229 or is captured in the capture unit 100 (S405).

[0089] Next, the liquid chemicals remaining in the capture unit 100 are removed (S407). When the cover 140 for sealing one side of the third pipeline 130 is opened, the one side of the third pipeline 130 extending to the upper surface of the main body 105 is opened. Therefore, the liquid chemicals remaining in the capture unit 100 can be discharged through the third pipeline 130 extending to the upper surface of the main body 105.

[0090] While the embodiments of the present invention have been described above with reference to the accompanying drawings, it should be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the above embodiments are illustrative in all respects and not restrictive.

Claims

1. A substrate processing device, comprising: a head unit for discharging liquid chemicals; a reservoir for storing the liquid chemical and supplying the liquid chemical to the head unit; a pressure regulating unit, for regulating the pressure inside the reservoir; as well as a capture unit, arranged between the reservoir and the pressure regulating unit, and capturing mist generated from the reservoir, The capture unit comprises: main body; a first pipeline, disposed in the main body, connected to the reservoir, and extending along a first direction; a second pipeline, disposed in the main body, connected to the pressure regulating unit, and extending along a second direction; a third pipeline, arranged to penetrate the first pipeline and the second pipeline from the upper surface of the main body; a collecting layer, disposed on the inner wall of the first pipeline or the inner wall of the second pipeline, and used to collect the mist; and The cover is provided on the upper surface of the main body and is used to open or close one side of the third pipeline.

2. The substrate processing apparatus according to claim 1, wherein: The capture layer includes at least one of a grid structure, a membrane structure, and a filter structure.

3. The substrate processing apparatus according to claim 1, wherein: The body is inclined at an acute angle relative to an upper surface of the reservoir.

4. The substrate processing apparatus according to claim 1, wherein: The first pipeline includes a first connection port connected to the third pipeline, an inlet arranged at a first side relative to a center of the first connection port, and a first buffer area arranged at a second side relative to the center of the first connection port.

5. The substrate processing apparatus according to claim 1, wherein: The second pipeline includes a second connection port connected to the third pipeline, an outlet arranged on a second side relative to a center of the second connection port, and a second buffer area arranged on a first side relative to a center of the second connection port.

6. The substrate processing apparatus according to claim 1, wherein: The first pipeline and the second pipeline are parallel to each other, and The third pipeline includes: an intermediate pipeline, arranged between the first pipeline and the second pipeline and parallel to the first pipeline and the second pipeline; a first vertical pipeline connecting the intermediate pipeline and the first pipeline; and A second vertical pipeline connects the middle pipeline and the second pipeline.

7. The substrate processing apparatus according to claim 1, wherein: The reservoir is provided with a heater for adjusting the temperature of the liquid chemical.

8. The substrate processing apparatus according to claim 1, wherein: An interlocking sensor is provided at a tubular member connecting the capturing unit and the pressure regulating unit.

9. A substrate processing device comprising: a stage for processing a substrate; a gantry arranged across the table; as well as an inkjet head module disposed on the gantry and configured to discharge ink onto the substrate, and Wherein, the inkjet head module includes: a head unit for discharging the ink; a reservoir for storing the ink and supplying the ink to the head unit; a pressure regulating unit for regulating the pressure inside the reservoir; and a capture unit, arranged between the reservoir and the pressure regulating unit and used to capture the mist generated from the reservoir, Wherein, the capture unit comprises: main body; a first pipeline, disposed in the main body, connected to the reservoir, and extending along a first direction; a second pipeline, disposed in the main body, connected to the pressure regulating unit, and extending along a second direction; a third pipeline, arranged to penetrate the first pipeline and the second pipeline from the upper surface of the main body; a collecting layer, disposed on the inner wall of the first pipeline or the inner wall of the second pipeline, and used to collect the mist; and The cover is provided on the upper surface of the main body and is used to open or close one side of the third pipeline.

10. The substrate processing apparatus according to claim 9, wherein: The body is inclined at an acute angle relative to an upper surface of the reservoir.

11. The substrate processing apparatus according to claim 9, wherein: The first pipeline includes a first connection port connected to the third pipeline, an inlet arranged on a first side relative to a center of the first connection port, and a first buffer zone arranged on a second side relative to the center of the first connection port, and The second pipeline includes a second connection port connected to the third pipeline, an outlet arranged on a second side relative to a center of the second connection port, and a second buffer area arranged on a first side relative to a center of the second connection port.

12. A capture device comprising: main body; a first pipeline, disposed in the main body, connected to the inlet, and extending in one direction; a second pipeline, disposed in the main body, connected to the outlet, and extending along the one direction; a third pipeline, arranged to penetrate the first pipeline and the second pipeline from the upper surface of the main body; a collecting layer, disposed on the inner wall of the first pipeline or the inner wall of the second pipeline, and used to collect mist; as well as The cover is provided on the upper surface of the main body and is used to open or close one side of the third pipeline.

13. The capture device according to claim 12, further comprising: The cover is provided on the upper surface of the main body and is used to open or seal one side of the third pipeline.

14. The capture device according to claim 12, wherein: The capture layer includes at least one of a grid structure, a membrane structure, and a filter structure.

15. The capture device according to claim 12, wherein: The first pipeline includes a first connection port connected to the third pipeline, the inlet disposed on a first side relative to a center of the first connection port, and a first buffer zone disposed on a second side relative to the center of the first connection port.

16. The capture device according to claim 12, wherein: The second pipeline includes a second connection port connected to the third pipeline, the outlet arranged on a second side relative to a center of the second connection port, and a second buffer area arranged on a first side relative to a center of the second connection port.

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