Substrate processing apparatus and substrate processing method using the same

Abstract

The present invention provides a substrate processing apparatus with improved efficiency and productivity. The substrate processing apparatus of the present invention includes a stage extending in a first direction and moving a substrate in the first direction, the stage having an air floating system; a gantry extending above the stage in a second direction crossing the first direction; a head module disposed on the gantry and movable in the second direction; and a displacement sensor disposed inside the head module and used to measure a distance between the substrate and the stage, wherein at a first position, the head module discharges ink to the substrate and the displacement sensor measures a first separation distance between the substrate and the stage, and at a second position different from the first position, the head module discharges ink to the substrate and the displacement sensor measures a second separation distance between the substrate and the stage.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method using the substrate processing apparatus. Background Technology

[0002] Typically, in order to manufacture flat panel displays (FPDs) such as electronic circuit components or liquid crystal display panels, it is necessary to use photoresist liquid or metal paste such as copper (Cu), silver (Ag), and aluminum (Al) to form specific patterns such as electrodes or dots on the glass surface or printed circuit board (PCB).

[0003] As a method for forming a specific pattern on a substrate, one can use two rollers to directly pattern the specific pattern using offset printing or by ejecting ink droplets. Here, the inkjet printing system that ejects ink droplets onto the substrate is similar to a general inkjet printer, which uses a method of directly patterning a specific pattern on the substrate through nozzles.

[0004] An inkjet printing system moves a substrate in a predetermined direction while ejecting ink droplets onto the substrate. For the ink droplets to be ejected to the desired location, the substrate's levitation level must be constant. If the substrate's levitation level is not constant, the ink droplets may not be ejected precisely to the desired location. Summary of the Invention

[0005] Technical problems to be solved

[0006] The technical problem to be solved by the present invention is to provide a substrate processing apparatus with improved efficiency and productivity.

[0007] Another technical problem to be solved by the present invention is to provide a substrate processing method with improved efficiency and productivity.

[0008] The problems to be solved by the present invention are not limited to those described above. Other problems not mentioned can be clearly understood by those skilled in the art through the following description.

[0009] Solution

[0010] To solve the above-mentioned technical problems, a substrate processing apparatus according to one aspect of the present invention includes: a worktable extending along a first direction and moving a substrate in the first direction, the worktable having an air flotation system; a gantry extending above the worktable along a second direction intersecting the first direction; a head module disposed on the gantry and movable in the second direction; and a displacement sensor disposed inside the head module and used to measure the distance between the substrate and the worktable, wherein, at a first position, the head module discharges ink to the substrate and the displacement sensor measures a first interval distance between the substrate and the worktable, and at a second position different from the first position, the head module discharges ink to the substrate and the displacement sensor measures a second interval distance between the substrate and the worktable.

[0011] In some embodiments, when the difference between the first interval distance and the second interval distance is greater than a predetermined value, the workbench is maintained / repaired.

[0012] In some embodiments, the head module includes a nozzle unit that discharges ink toward the substrate, and the vertical distance between the stage and the nozzle unit is the same as the vertical distance between the stage and the displacement sensor.

[0013] The substrate processing apparatus also includes a clamp disposed on one side of the worktable and used to clamp the substrate.

[0014] In some embodiments, a displacement sensor is used to measure the flatness of the gripper.

[0015] In some embodiments, the first position and the second position are spaced apart from each other in a second direction.

[0016] The substrate processing apparatus also includes a control module that can monitor the first interval distance and the second interval distance in real time.

[0017] In some embodiments, the workbench includes a first region and a second region between the first region, and a first position and a second position overlap with the second region of the workbench.

[0018] In some embodiments, the first region is the region in which air is sprayed toward the substrate, and the second region is the region in which air is sprayed toward the substrate and air is drawn between the substrate and the worktable.

[0019] To solve the above-mentioned technical problems, a substrate processing apparatus according to another aspect of the present invention includes: a worktable extending along a first direction and moving a substrate in the first direction, the worktable having an air flotation system; a clamp disposed on one side of the worktable and used to clamp the substrate; a gantry extending above the worktable along a second direction intersecting the first direction; a head module disposed on the gantry and movable in the second direction; and a displacement sensor disposed inside the head module and used to measure the distance between the substrate and the worktable, wherein, at a first position, the head module discharges ink to the substrate and the displacement sensor measures a first gap distance between the substrate and the worktable; at a second position different from the first position, the head module discharges ink to the substrate and the displacement sensor measures a second gap distance between the substrate and the worktable; and at a third position different from the first and second positions, the displacement sensor measures the flatness of the clamp.

[0020] In some embodiments, the first position and the second position are spaced apart from each other in a second direction.

[0021] The substrate processing apparatus also includes a control module that can monitor the first interval distance and the second interval distance in real time.

[0022] In some embodiments, the workbench includes a first region and a second region between the first region, and a first position and a second position overlap with the second region of the workbench.

[0023] In some embodiments, the first region is the region in which air is sprayed toward the substrate, and the second region is the region in which air is sprayed toward the substrate and air is drawn between the substrate and the worktable.

[0024] In some embodiments, the head module includes a nozzle unit that discharges ink toward the substrate, and the vertical distance between the stage and the nozzle unit is the same as the vertical distance between the stage and the displacement sensor.

[0025] To solve the above-mentioned technical problems, a substrate processing method according to one aspect of the present invention includes: providing a worktable that extends along a first direction and moves a substrate in the first direction; providing a head module above the worktable that is movable along a second direction intersecting the first direction; measuring a first interval distance between the substrate and the worktable at a first position by means of a displacement sensor disposed inside the head module; measuring a second interval distance between the substrate and the worktable at a second position different from the first position by means of a displacement sensor; and monitoring the difference between the first interval distance and the second interval distance.

[0026] The substrate processing method further includes: maintaining / repairing the worktable when the difference between the first interval distance and the second interval distance is greater than a predetermined value.

[0027] The substrate processing method further includes: measuring a third interval distance between the substrate and the worktable at a third position different from the first position and the second position using a displacement sensor.

[0028] The substrate processing method further includes monitoring the differences between the first spacing distance, the second spacing distance, and the third spacing distance.

[0029] In some embodiments, the head module includes a nozzle unit that discharges ink toward the substrate, and the vertical distance between the stage and the nozzle unit is the same as the vertical distance between the stage and the displacement sensor.

[0030] Specific details of other embodiments are included in the description and drawings of this invention. Attached Figure Description

[0031] Figure 1 This is a schematic plan view of a substrate processing apparatus according to some embodiments of the present invention.

[0032] Figure 2 It is used for explanation Figure 1 Example diagram of the workbench.

[0033] Figure 3 It is along Figure 2 A sectional view taken from lines AA and BB.

[0034] Figure 4 and Figure 5 This is an exemplary cross-sectional view of a substrate processing apparatus according to some embodiments, taken along a second direction.

[0035] Figure 6 This is an exemplary cross-sectional view of a substrate processing apparatus according to some embodiments, taken along a first direction.

[0036] Figure 7 This is an exemplary flowchart illustrating a substrate processing method according to some embodiments.

[0037] Figures 8 to 13 This is a diagram illustrating the operation method of a substrate processing apparatus according to some embodiments.

[0038] Explanation of reference numerals in the attached figures

[0039] 110: Worktable; 150: Substrate

[0040] 200: Gantry 300: Head Module

[0041] 310: Main body; 320: Nozzle unit

[0042] 330: Displacement sensor; 400: Clamping device

[0043] 500: Conveyor track; 600: Control module Detailed Implementation

[0044] Preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings. The advantages and features of the invention, as well as the methods of achieving these advantages and features, will become apparent from the embodiments described in detail below in conjunction with the accompanying drawings. However, the invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and these embodiments are provided only to complete the disclosure of the invention and to fully inform those skilled in the art of the scope of the invention, and the invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0045] When an element or layer is referred to as being "above" or "on top of" another element or layer, it includes not only being directly above the other element or layer, but also the case where another layer or element is intervening in between. Conversely, when an element is referred to as being "directly above" or "right above," it indicates that there is no other element or layer intervening in between.

[0046] Spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” can be used to describe the relationship between one element or component and other elements or components as shown in the figure. Spatial relative terms should be understood to include terms indicating different orientations of the element during use or operation, in addition to those shown in the figure. For example, in the case where the element shown in the figure is flipped, an element described as “below” or “under” another element can be positioned “above” another element. Therefore, the exemplary term “below” can include both lower and upper orientations. Element can also be oriented in other directions, and therefore spatial relative terms can be interpreted according to orientation.

[0047] Although terms such as "first," "second," etc., are used to describe various elements, constituent elements, and / or parts, it is clear that these elements, constituent elements, and / or parts are not limited by these terms. These terms are used only to distinguish one element, constituent element, or part from other elements, constituent elements, or parts. Therefore, within the technical concept of this invention, the first element, first constituent element, or first part mentioned below can obviously also be a second element, second constituent element, or second part.

[0048] The terminology used in this specification is for describing embodiments and is not intended to limit the invention. In this specification, the singular form also includes the plural form unless otherwise specified in the sentence. The terms "comprises" and / or "comprising" as used in this specification mean including the mentioned constituent elements, steps, operations, and / or components, without excluding the presence or addition of more than one other constituent element, step, operation, and / or component.

[0049] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) are to be understood in the sense that would be commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, unless explicitly defined otherwise, terms defined in commonly used dictionaries should not be interpreted in an idealized or excessive manner.

[0050] In the following description, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, the same or corresponding constituent elements will be given the same reference numerals, regardless of the drawing numbers, and repeated descriptions thereof will be omitted.

[0051] In the following text, reference will be made to Figures 1 to 6 A substrate processing apparatus according to some embodiments is described. The substrate processing apparatus according to some embodiments may be an inkjet printing system.

[0052] Figure 1 This is a schematic plan view of a substrate processing apparatus according to some embodiments of the present invention. Figure 2 It is used for explanation Figure 1 Example diagram of the workbench. Figure 3 It is along Figure 2 A sectional view taken from lines AA and BB.

[0053] First, refer to Figure 1 According to some embodiments, the substrate processing apparatus may include a worktable 110, a gantry 200, a head module 300, a gripper 400, a conveyor track 500, and a control module 600.

[0054] The worktable 110 is an area for supporting and moving the substrate 150. The method of moving the substrate 150 on the worktable 110 is not limited to a specific method. Although a substrate processing apparatus in this specification is illustrated, in which the substrate 150 is held and moved by the clamp 400, it is not limited thereto. For example, the substrate 150 can also be moved by a plate that moves in a roll-to-roll manner.

[0055] The worktable 110 may extend along a first direction X. For example, the worktable 110 may include a short side extending along a second direction Y and a long side extending along the first direction X. In this specification, the first direction X and the second direction Y may be directions that intersect each other. The third direction Z may be a direction that intersects the first direction X and the second direction Y. For example, the first direction X, the second direction Y, and the third direction Z may be substantially perpendicular to each other.

[0056] On the worktable 110, the substrate 150 can move along the first direction X. Here, the substrate 150 can also be a transparent substrate (e.g., a glass substrate) used in a display device. For example, the substrate 150 can be a glass substrate for mass production.

[0057] Reference Figure 2 and Figure 3 The workbench 110 may include a first region I and a second region II. The second region II may be sandwiched between the first region I. That is, the first region I may be arranged in the edge region of the workbench 110, while the second region II may be arranged in the central region of the workbench 110.

[0058] For example, the workbench 110 may have an air-floating system. That is, the workbench 110 may be an air-floating system comprising a first region I and a second region II. The first region I and the second region II of the workbench 110 may be continuous. However, the technical concept of the present invention is not limited thereto. Furthermore, although the second region II is shown in this specification as sandwiched between the first regions I, the present invention is not limited thereto, and the second region II and the first region I may also be arranged on one side and the other side of the workbench 110, respectively.

[0059] The first region I of the worktable 110 can be a region in which air is sprayed in a third direction Z. The first region I of the worktable 110 can also be a region where air is not drawn from the first region I. The first region I can be a region in which the substrate 150 is loaded onto or unloaded from the worktable. The first region I can be a region in which no printing process is performed. The printing process can be a process in which ink is dispensed onto the substrate 150. For example, the first region I can be a region in which the head module 300 does not dispense ink onto the substrate 150.

[0060] The second region II of the worktable 110 can be a region in which air is sprayed along a third direction Z while air is drawn from the second region II. For example, the second region II of the worktable 110 can be a region in which air is sprayed toward the substrate 150 while air is drawn between the substrate 150 and the worktable 110. Furthermore, the second region II can be a region in which a printing process is performed. The second region II can also be a region in which the head module 300 discharges ink to the substrate 150.

[0061] In some embodiments, the worktable 110 may include a plurality of holes 110H. The holes 110H may be holes for injecting air or holes for drawing air. For example, in a first region I of the worktable 110, only holes for injecting air may be arranged. In a second region II of the worktable 110, holes for injecting air and holes for drawing air may be arranged alternately.

[0062] exist Figure 3 In the worktable 110, the hole 110H may include a first hole 110H_1 and a second hole 110H_2. The first hole 110H_1 may be a hole for injecting air. The second hole 110H_2 may be a hole for drawing air.

[0063] The second region II of the workbench 110 may include a first hole 110H_1 for upward air injection and a second hole 110H_2 for air suction. Although the first hole 110H_1 and the second hole 110H_2 are shown to be arranged alternately, this is not a limitation. The first region I of the workbench 110 may include only the first hole 110H_1 for upward air injection.

[0064] Re-reference Figure 1 The conveyor track 500 can be arranged on one side of the worktable 110. The conveyor track 500 can extend into a long strip along the first direction X. The conveyor track 500 is a track that enables the substrate 150 to move along the first direction X. For example, the gripper 400 can grip one side of the substrate 150 and move along the conveyor track 500. Since the gripper 400 grips the substrate 150, the substrate 150 can move along the conveyor track 500 in the first direction X when the gripper 400 moves along the conveyor track 500 in the first direction X.

[0065] A clamp 400 may be disposed on one side of a substrate 150 and clamp the substrate 150. The clamp 400 may be coupled to a transfer track 500 for movement along a first direction X. The clamp 400 may clamp and transfer the substrate 150. The clamp 400 may adsorb and fix the substrate 150. The substrate 150 may include an adsorption portion 150a adsorbed onto the clamp 400. The adsorption portion 150a may be one side of the substrate 150. For example, when the substrate 150 includes a long side extending along the first direction X and a short side extending along the second direction Y, the adsorption portion 150a may be one of the long sides of the substrate 150. That is, the clamp 400 may adsorb and fix one of the long sides of the substrate 150.

[0066] The gantry 200 can be arranged across the worktable 110 above it. For example, the gantry 200 can extend in the second direction Y. The gantry 200 can be arranged above the second area II of the worktable 110.

[0067] The head module 300 can be mounted on the gantry 200 and can move along the gantry 200. The head module 300 can move in a second direction Y, but is not limited thereto.

[0068] In some embodiments, although not shown, the distance in the third direction Z between the substrate 150 and the head module 300 can be reduced when the head module 300 moves along the second direction Y. That is, the distance in the third direction Z between the substrate 150 and the head module 300 can be greater when the head module 300 is in a waiting state than when the head module 300 is in a moving state. When the head module 300 is in a moving state, as the distance between the substrate 150 and the head module 300 decreases, the nozzle unit ( Figure 4 The 320) can accurately discharge ink toward the substrate 150.

[0069] The control module 600 can monitor the gap between the substrate 150 and the worktable 110 in real time. The control module 600 can also monitor the flatness of the gripper 400 in real time. By monitoring the aforementioned gap and flatness, the control module 600 can determine whether to perform maintenance / repair on the worktable 110 and the gripper 400.

[0070] Figure 4 and Figure 5 This is an exemplary cross-sectional view of a substrate processing apparatus according to some embodiments, taken along a second direction. Figure 6 This is an exemplary cross-sectional view of a substrate processing apparatus according to some embodiments, taken along a first direction.

[0071] In the following text, reference will be made to Figures 4 to 6A substrate processing apparatus and exemplary operation methods of the substrate processing apparatus according to some embodiments are described in more detail.

[0072] Reference Figures 4 to 6 The head module 300 includes a body 310, a nozzle unit 320, and a displacement sensor 330. The body 310 may be a portion connected to the gantry 200. The body 310 may be fixed to the gantry 200. The body 310 may also fix the nozzle unit 320 and the displacement sensor 330. The nozzle unit 320 may be a portion that discharges ink to the substrate 150. The displacement sensor 330 may be a sensor used to measure the amount of ink suspended on the substrate 150.

[0073] In some embodiments, the nozzle unit 320 may include a plurality of nozzles. The ink discharged by the head module 300 may be, for example, quantum dot (QD) ink, but is not limited thereto. The plurality of nozzles of the nozzle unit 320 may discharge a plurality of ink droplets onto the substrate 150 (see reference numeral 325).

[0074] In some embodiments, displacement sensor 330 can measure the amount of suspension of substrate 150 (see reference numeral 335). The amount of suspension of substrate 150 can refer to the distance d between substrate 150 and worktable 110 in the third direction Z. Displacement sensor 330 can measure the amount of suspension of substrate 150 and send it to control module 600. Control module 600 can monitor the amount of suspension of substrate 150 in real time. Control module 600 can determine whether to perform maintenance / repair operations on the substrate processing apparatus according to some embodiments by monitoring the amount of suspension of substrate 150.

[0075] For example, the amount of suspension of the substrate 150 can be measured at a first position, the amount of suspension of the substrate 150 can be measured at a second position, and the difference between the two amounts of suspension can be monitored. When the difference in the amount of suspension exceeds a preset value, the substrate processing apparatus can perform maintenance / repair operations on the worktable 110.

[0076] More specifically, the stage 110 with the air flotation system may include a precise suspension area. For example, the area where the head module 300 discharges ink toward the substrate 150 may be a precise suspension area (e.g., Figure 2 (Second region). In the precise suspension region, the suspension amount of substrate 150 must be constant in order to accurately dispense ink. Displacement sensor 330 can measure the suspension amount of substrate 150 in real time and send it to control module 600, which can monitor the suspension amount in real time. When the monitoring result shows that the suspension amount of substrate 150 is not constant, the substrate processing device can perform maintenance / repair operations.

[0077] In some embodiments, the operation of the nozzle unit 320 discharging ink onto the substrate 150 and the operation of the displacement sensor 330 measuring the suspension amount of the substrate 150 can be performed simultaneously. Furthermore, the third-direction Z-distance between the substrate 150 and the displacement sensor 330 can be equal to the third-direction Z-distance between the substrate 150 and the head module 300 or the third-direction Z-distance between the substrate 150 and the nozzle unit 320. Therefore, the conditions for discharging ink onto the substrate 150 can be the same as the conditions for measuring the suspension amount of the substrate 150.

[0078] In some embodiments, the displacement sensor 330 can measure the flatness of the gripper 400. Measuring the flatness of the gripper 400 can be, but is not limited to, measuring the flatness of the substrate 150 held by the gripper 400.

[0079] exist Figure 4 In the process, when the displacement sensor 330 is located at a position on the third direction Z that overlaps with the substrate 150, the displacement sensor 330 can measure the distance d between the substrate 150 and the worktable 110.

[0080] exist Figure 5 In the process, when the displacement sensor 330 is located at a position on the third direction Z that overlaps with the adsorption portion 150a, the displacement sensor 330 can measure the flatness of the clamp 400.

[0081] exist Figure 6 During the measurement of the distance d between the substrate 150 and the worktable 110 by the displacement sensor 330, the substrate 150 can move along the first direction X (see reference numeral 151). That is, the distance d between the substrate 150 and the worktable 110 can be continuously measured in the first direction X while the substrate 150 moves along the first direction X.

[0082] The following is for reference Figures 7 to 13 This describes a substrate processing method according to some embodiments.

[0083] Figure 7 This is an exemplary flowchart illustrating a substrate processing method according to some embodiments. Figures 8 to 13 This is a diagram illustrating the operation method of a substrate processing apparatus according to some embodiments.

[0084] Reference Figure 7 According to some embodiments, a substrate processing method may include: loading a substrate onto a worktable (S100); measuring a first gap distance between the substrate and the worktable at a first position (S200); moving a head module to a second position (S300); measuring a second gap distance between the substrate and the worktable at the second position (S400); and monitoring the difference between the first gap distance and the second gap distance (S500).

[0085] Reference Figure 7 and Figure 8 The substrate 150 can be loaded onto the worktable 110 (S100).

[0086] The substrate 150 can be loaded into the first region I of the worktable 110. The substrate 150 can be loaded while moving along the first direction X (refer to reference numeral 151). The gripper 400 does not hold the substrate 150 until it is fully loaded. When the substrate 150 is fully loaded, the gripper 400 can hold and align the substrate 150. Although not shown, the substrate 150 may include alignment marks. Alignment marks can be used to align the substrate 150. Aligning the substrate 150 may include: aligning the substrate 150 parallel to a plane extending from the first direction X and the second direction Y; and aligning the direction in which the long side of the substrate 150 extends parallel to the first direction X.

[0087] Reference Figure 9 The substrate 150 can be moved from the first region I to the second region II (see reference numeral 151 in the figure).

[0088] The substrate 150 can be moved along the first direction X to move it to the second region II. Specifically, the gripper 400 grips the adsorption portion 150a of the substrate 150. Then, the gripper 400 moves along the transfer track 500 in the first direction X. Since the gripper 400 grips the substrate 150, the substrate 150 can move when the gripper 400 moves.

[0089] Figure 10 This is a plan view of a substrate according to some embodiments.

[0090] Reference Figure 10 The substrate 150 may include a first position P1 to a fourth position P4. The second position P2 to the fourth position P4 may be used when a displacement sensor ( Figure 4 The position of the displacement sensor (330) in the second direction Y when measuring the suspension amount of the substrate 150. The first position P1 refers to the position when the displacement sensor ( Figure 4 The position of the clamp 400 in the second direction Y when measuring the flatness of the clamp 400 (330). The operation method of the substrate processing apparatus according to some embodiments will be described in more detail below.

[0091] Reference Figure 10 and Figure 11 The head module 300 can be moved to the first position P1.

[0092] The movement of the head module 300 to the first position P1 can mean that the displacement sensor 330 of the head module 300 has moved to a position that overlaps with the first position P1 in the third direction Z. The first position P1 can overlap with the adsorption portion 150a of the substrate 150 in the first direction X. The first position P1 can extend along the first direction X on the adsorption portion 150a of the substrate 150.

[0093] Next, the displacement sensor 330 measures the flatness of the gripper 400 (see reference numeral 335). The displacement sensor 330 can continuously measure the flatness of the gripper 400 during the movement of the substrate 150 along the first direction X.

[0094] While the displacement sensor 330 is measuring the flatness of the clamp 400, the nozzle unit 320 can dispense ink onto the substrate 150 (see reference numeral 325). That is, the operation of the nozzle unit 320 dispensing ink onto the substrate 150 and the operation of the displacement sensor 330 measuring the flatness of the clamp 400 can be performed simultaneously.

[0095] Reference Figure 10 and Figure 12 The head module 300 can be moved to a second position P2 (see reference numeral 301). The second position P2 can overlap with the displacement sensor 330 of the head module 300 in the third direction Z. The second position P2 can extend on the substrate 150 along the first direction X.

[0096] Displacement sensor 330 can measure the first gap distance d1 between substrate 150 and worktable 110 at the second position P2. Figure 7 (S200). The first gap distance d1 can represent the gap distance in the third direction Z between the substrate 150 and the worktable 110. The first gap distance d1 can be the amount of suspension of the substrate 150 at the second position P2.

[0097] At the second position P2, during the period when the displacement sensor 330 measures the levitation amount of the substrate 150 (see reference numeral 335), the nozzle unit 320 can discharge ink onto the substrate 150 (see reference numeral 325). That is, the operation of the nozzle unit 320 discharging ink onto the substrate 150 and the operation of the displacement sensor 330 measuring the levitation amount of the substrate 150 can be performed simultaneously.

[0098] Reference Figure 10 and Figure 13 The head module 300 can be moved to the third position P3. Figure 7 (S300).

[0099] In other words, the head module 300 can move from the second position P2 to the third position P3 in the second direction Y (see reference numeral 301). The third position P3 can overlap with the displacement sensor 330 of the head module 300 in the third direction Z. The third position P3 can extend along the first direction X on the substrate 150.

[0100] Displacement sensor 330 can measure the second gap distance d2 between substrate 150 and worktable 110 at the third position P3. Figure 7 (S400). The second spacing distance d2 can represent the spacing distance in the third direction Z between the substrate 150 and the worktable 110. The second spacing distance d2 can be the amount of suspension of the substrate 150 at the third position P3.

[0101] At the third position P3, during the period when the displacement sensor 330 measures the levitation amount of the substrate 150 (see reference numeral 335), the nozzle unit 320 can discharge ink onto the substrate 150 (see reference numeral 325). That is, the operation of the nozzle unit 320 discharging ink onto the substrate 150 and the operation of the displacement sensor 330 measuring the levitation amount of the substrate 150 can be performed simultaneously.

[0102] Although not shown, the head module 300 can be moved to a fourth position P4. The head module 300 can move along the second direction Y (see reference numeral 301). At the fourth position P4, the displacement sensor 330 can measure a third gap distance between the substrate 150 and the worktable 110. Although the gap distance between the substrate 150 and the worktable 110 is measured at the second position P2 to the fourth position P4 in this specification, the technical concept of the present invention is not limited thereto.

[0103] Next, the control module ( Figure 1 The 600) can monitor the difference between the first interval distance d1 and the second interval distance d2. Figure 7 (S500). If the difference between the first spacing distance d1 and the second spacing distance d2 is close to 0, it can be determined that the suspension amount of the substrate 150 is constant. However, if there is a difference between the first spacing distance d1 and the second spacing distance d2, it can be determined that the suspension amount of the substrate 150 is not constant. When the suspension amount of the substrate 150 is not constant, the efficiency and accuracy of the printing process may decrease, therefore, maintenance / repair of the substrate processing apparatus is required in this case.

[0104] According to some embodiments of the substrate processing apparatus, maintenance / repair operations can be performed on the worktable 110 when the difference between the first interval distance d1 and the second interval distance d2 exceeds a predetermined value. By using the substrate processing apparatus according to some embodiments of the present invention, the suspension amount of the substrate 150 can be monitored in real time, thereby providing a substrate processing apparatus with improved efficiency and reliability, as well as a substrate processing method using the substrate processing apparatus.

[0105] In some embodiments, if the displacement sensor 330 measures n interval distances at n locations, the control module 600 can monitor the differences between the n interval distances. The more interval distances measured, the higher the accuracy in determining whether the suspension amount of the substrate 150 is constant.

[0106] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A substrate processing apparatus, comprising: A worktable extends along a first direction and moves a substrate in the first direction, the worktable having an air flotation system; A gantry extends above the workbench along a second direction intersecting the first direction; A head module, disposed on the gantry and movable in the second direction, includes a nozzle unit that discharges ink toward the substrate; as well as A displacement sensor, disposed inside the head module, is used to measure the distance between the substrate and the worktable. At the first position, the head module discharges ink onto the substrate, while the displacement sensor measures the first gap distance between the substrate and the worktable. At a second position different from the first position, the head module discharges ink onto the substrate, while the displacement sensor measures a second gap distance between the substrate and the worktable. The vertical distance between the worktable and the nozzle unit is the same as the vertical distance between the worktable and the displacement sensor.

2. The substrate processing apparatus according to claim 1, wherein, When the difference between the first interval distance and the second interval distance is greater than a predetermined value, the workbench is maintained and repaired.

3. The substrate processing apparatus according to claim 1, further comprising: A clamp is disposed on one side of the worktable and is used to clamp the substrate.

4. The substrate processing apparatus according to claim 3, wherein, The displacement sensor is used to measure the flatness of the clamp.

5. The substrate processing apparatus according to claim 1, wherein, The first position and the second position are spaced apart from each other in the second direction.

6. The substrate processing apparatus according to claim 1, further comprising: The control module is capable of monitoring the first interval distance and the second interval distance in real time.

7. The substrate processing apparatus according to claim 1, wherein, The workbench includes a first region and a second region between the first region, and The first position and the second position overlap with the second area of ​​the worktable.

8. The substrate processing apparatus according to claim 7, wherein, The first region is the region in which air is sprayed toward the substrate, and The second region is the area in which air is sprayed toward the substrate and the air between the substrate and the worktable is drawn in.

9. A substrate processing apparatus, comprising: A worktable extends along a first direction and moves a substrate in the first direction, the worktable having an air flotation system; A clamp is disposed on one side of the worktable and is used to clamp the substrate; A gantry extends above the workbench along a second direction intersecting the first direction; A head module, disposed on the gantry and movable in the second direction, includes a nozzle unit that discharges ink toward the substrate; as well as A displacement sensor, disposed inside the head module, is used to measure the distance between the substrate and the worktable. At the first position, the head module discharges ink onto the substrate, while the displacement sensor measures the first gap distance between the substrate and the worktable. At a second position different from the first position, the head module discharges ink onto the substrate, while the displacement sensor measures a second gap distance between the substrate and the worktable. At a third position, different from the first and second positions, the displacement sensor measures the flatness of the gripper; The vertical distance between the worktable and the nozzle unit is the same as the vertical distance between the worktable and the displacement sensor.

10. The substrate processing apparatus according to claim 9, wherein, The first position and the second position are spaced apart from each other in the second direction.

11. The substrate processing apparatus according to claim 9, further comprising: The control module is capable of monitoring the first interval distance and the second interval distance in real time.

12. The substrate processing apparatus according to claim 9, wherein, The workbench includes a first region and a second region between the first region, and The first position and the second position overlap with the second area of ​​the worktable.

13. The substrate processing apparatus according to claim 12, wherein, The first region is the region in which air is sprayed toward the substrate, and The second region is the area in which air is sprayed toward the substrate and the air between the substrate and the worktable is drawn in.

14. A substrate processing method, comprising: A worktable is provided, the worktable extending along a first direction and moving a substrate in the first direction; A head module is provided above the worktable, and the head module is movable along a second direction that intersects the first direction; At the first position, a first gap distance between the substrate and the worktable is measured by a displacement sensor disposed inside the head module, and ink is discharged to the substrate through the head module at the same time; At a second position different from the first position, the displacement sensor measures a second gap distance between the substrate and the worktable, while ink is simultaneously discharged onto the substrate via the head module; and Monitor the difference between the first interval distance and the second interval distance; The head module includes a nozzle unit that discharges ink toward the substrate, and the vertical distance between the worktable and the nozzle unit is the same as the vertical distance between the worktable and the displacement sensor.

15. The substrate processing method according to claim 14, further comprising: When the difference between the first interval distance and the second interval distance is greater than a predetermined value, the workbench is maintained / repaired.

16. The substrate processing method according to claim 14, further comprising: At a third position, different from the first and second positions, the displacement sensor measures a third gap distance between the substrate and the worktable.

17. The substrate processing method according to claim 16, further comprising: Monitor the differences between the first interval distance, the second interval distance, and the third interval distance.

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