System and method for ic adjacent pin short and gold finger contact detection

Abstract

The application belongs to the technical field of chip testing, and discloses an IC adjacent pin short circuit and gold finger contact detection system and method. The IC testing system is used for generating control instructions and measurement instructions, and the control instructions and the measurement instructions are respectively sent to a control module and a measurement module. The control module is used for receiving the control instructions generated by the IC testing system, and sending the control instructions to a to-be-tested IC chip through a control interface of a DUT board, so that the to-be-tested IC chip works according to the control instructions. The measurement module is used for receiving the measurement instructions generated by the IC testing system, and measuring the to-be-tested IC chip through a measurement interface of the DUT board to obtain measurement data, and feeding back the measurement data to the IC testing system to generate a test result. According to the control module and the measurement module, the test parameters can be accurately controlled, the measurement data of the chip can be accurately measured, and a more accurate test result can be obtained.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a system and method for detecting short circuits between adjacent pins and contact between gold fingers in an IC. Background Technology

[0002] Existing testing methods are insufficient for current product testing. They cannot promptly detect issues such as incomplete lead cutting or short circuits between adjacent pins caused by solder plating during IC packaging. A new testing technology is needed to meet current testing requirements. During testing, poor contact between the IC and the gold fingers is unavoidable. Poor contact creates impedance. For constant current drive ICs, every 1Ω increase in resistance causes a deviation in the test current. We adjust the IC based on the current value to achieve the ideal current. If the current value deviates at this point, the adjusted IC will also deviate and fail to reach the required current value. Adjusted ICs cannot be corrected further. This new method can detect ICs with poor contact before adjustment, preventing them from being adjusted and ensuring IC quality.

[0003] The above content is only used to help understand the technical solution of the present invention and does not represent an admission that the above content is prior art. Summary of the Invention

[0004] The main objective of this invention is to provide a system and method for detecting short circuits between adjacent pins and contact between gold fingers in an IC, aiming to solve the technical problem that existing technologies cannot detect short circuits that occur in IC chips during the packaging process in a timely manner.

[0005] To achieve the above objectives, the present invention provides an IC adjacent pin short circuit and gold finger contact detection system, the IC adjacent pin short circuit and gold finger contact detection system comprising: a computer host, an IC testing system, a DUT board and an IC chip under test;

[0006] The IC testing system is mounted on the computer host. The IC testing system includes a control module and a measurement module, and is connected to the control interface and measurement interface provided by the DUT board. The IC chip under test is held by gold fingers, so that the control interface and output measurement interface of the DUT board are connected to the IC chip under test.

[0007] The IC testing system is used to generate control commands and measurement commands, and send the control commands and measurement commands to the control module and the measurement module respectively.

[0008] The control module is used to receive control commands generated by the IC test system and send the control commands to the IC chip under test through the control interface of the DUT board, so that the IC chip under test can work according to the control commands.

[0009] The measurement module is used to receive measurement instructions generated by the IC test system, and to measure the IC chip under test through the measurement interface of the DUT board to obtain measurement data, and to feed the measurement data back to the IC test system to generate test results.

[0010] Optionally, the control module includes a power supply unit and a relay control unit, and the DUT board includes several relay groups;

[0011] The power supply unit is used to supply power to the relay group;

[0012] The power supply unit is also used to supply power to the IC chip under test through the power supply interface of the DUT board;

[0013] The relay control unit is used to control the on / off state of the relay group through the relay control interface of the DUT board.

[0014] Optionally, the power supply unit and the relay control unit are respectively connected to a plurality of relays in the relay group through corresponding interfaces. One end of the relay group is connected to the corresponding pin of the IC chip under test, and the other end is grounded.

[0015] Optionally, the measurement module includes a measurement unit;

[0016] The measurement unit is connected to the IC chip under test through the measurement interface of the DUT board to obtain the pin voltage of the IC chip under test.

[0017] Optionally, the measurement module further includes a voltage measurement unit;

[0018] The power supply unit is connected to the output pin of the IC chip under test through the voltage measurement interface of the DUT board;

[0019] The voltage measurement unit is connected to the REXT pin of the IC chip under test through the first terminal of the relay group, and the second terminal of the relay group is grounded through a resistor;

[0020] The ground pin of the IC chip under test is grounded.

[0021] Optionally, the computer host includes a PCI card, and the computer host controls the control unit and measurement unit of the IC testing system through the PCI card.

[0022] Furthermore, to achieve the above objectives, this invention also proposes a method for detecting short circuits and gold finger contact between adjacent IC pins. This method is applied to the aforementioned IC adjacent pin short circuit and gold finger contact detection system. The IC adjacent pin short circuit and gold finger contact detection system includes a computer host, an IC testing system, a DUT board, and an IC chip under test. The IC testing system is mounted on the computer host and includes a control module and a measurement module, which are correspondingly connected to the control interface and measurement interface provided by the DUT board. The IC chip under test is held by gold fingers, allowing the control interface and output measurement interface of the DUT board to connect to the IC chip under test.

[0023] The method for detecting short circuits between adjacent IC pins and gold finger contact includes:

[0024] The IC testing system generates control commands and measurement commands, and sends the control commands and measurement commands to the control module and the measurement module respectively;

[0025] The control module receives control commands generated by the IC test system and sends the control commands to the IC chip under test through the control interface of the DUT board, so that the IC chip under test can work according to the control commands.

[0026] The measurement module receives the measurement command generated by the IC test system, and uses the measurement command to measure the IC chip under test through the measurement interface of the DUT board to obtain measurement data. The measurement data is then fed back to the IC test system to generate test results.

[0027] Optionally, the control module includes a power supply unit and a relay control unit. The control module receives control commands generated by the IC test system and sends the control commands to the IC chip under test (DUT) through the control interface of the DUT board, causing the DUT to operate according to the control commands, including:

[0028] The power supply unit obtains a power supply command based on the received control command, and supplies power to the relay group and the IC chip under test through the power supply interface of the DUT board according to the power supply command.

[0029] The relay control unit obtains relay control instructions based on the received control instructions, and controls the on / off state of the corresponding relays through the relay control interface of the DUT board according to the relay control instructions.

[0030] Optionally, the measurement module includes a measurement unit. The measurement module receives measurement commands generated by the IC test system, and uses the measurement commands to measure the IC chip under test through the measurement interface of the DUT board to obtain measurement data. The measurement data is then fed back to the IC test system to generate test results, including:

[0031] The measurement unit determines the pin number of the IC chip under test connected to the interface of the measurement unit according to the relay control command of the relay control unit.

[0032] The measurement unit applies current to the pins of the chip under test that is in a connected state;

[0033] The measurement unit measures the voltage of the pins of the chip under test that is in a connected state, and obtains the pin voltage data;

[0034] The measurement unit feeds back the pin voltage data to the IC testing system, enabling the IC testing system to generate test results based on the pin voltage data.

[0035] Optionally, the measurement module further includes a voltage measurement unit. The measurement module receives measurement commands generated by the IC test system, and uses the measurement commands to measure the IC chip under test (DUT) through the measurement interface of the DUT board to obtain measurement data. It then feeds the measurement data back to the IC test system to generate test results. The module also includes:

[0036] The power supply unit provides an initial voltage to the IC chip under test, causing the REXT pin of the IC chip under test to generate an initial pin voltage;

[0037] The voltage measurement module measures the voltage of the REXT pin of the IC chip under test to obtain the initial pin voltage, and feeds the initial pin voltage back to the IC test system;

[0038] The power supply unit provides the operating voltage to the IC chip under test, so that the REXT pin of the IC chip under test generates the operating pin voltage.

[0039] The voltage measurement module measures the voltage of the REXT pin of the IC chip under test to obtain the working pin voltage, and feeds the working pin voltage back to the IC test system;

[0040] The IC testing system generates test results based on the initial pin voltage and the operating pin voltage.

[0041] This invention utilizes an IC testing system to generate control and measurement commands. These commands are then sent to a control module and a measurement module, respectively. The control module receives the control commands generated by the IC testing system and sends them to the IC chip under test (DUT) via the control interface of the DUT board, enabling the DUT to operate according to the commands. The measurement module receives the measurement commands generated by the IC testing system and uses the measurement interface of the DUT board to measure the DUT chip, obtaining measurement data. This measurement data is then fed back to the IC testing system to generate test results. By using the control and measurement modules, test parameters can be accurately controlled, and chip measurement data can be precisely measured, resulting in more accurate test results. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the connection of an IC adjacent pin short circuit and gold finger contact detection system according to the present invention;

[0043] Figure 2 This is a schematic diagram of the component connections of an IC adjacent pin short circuit and gold finger contact detection system according to the present invention;

[0044] Figure 3 This is a schematic diagram of the connection of the control part of the IC adjacent pin parity test circuit of the IC adjacent pin short circuit and gold finger contact detection system of the present invention.

[0045] Figure 4 This is a schematic diagram of the IC adjacent pin parity test circuit connection of the IC adjacent pin short circuit and gold finger contact detection system of the present invention.

[0046] Figure 5 This invention provides a detection circuit and control circuit diagram for an IC that burns out due to poor contact between the IC and the gold finger.

[0047] Figure 6 This is a flowchart illustrating a method for detecting short circuits between adjacent pins and contact between gold fingers in an IC according to the present invention.

[0048] Explanation of icon numbers:

[0049] label name label name 10 Computer host 20 IC Testing System 30 DUT board 40 IC chip under test 20a Measurement module 20b Control module 30a Measurement module interface 30b Control module interface 101 Computer host_IC test system control software (K1-K9) (K11-K20) (K21-K23) UR relay group 102 PCI Card - Connectivity IC Test System 401 Golden Finger 201 IC Testing System 402 IC chips 202 DPS power supply unit PIN(1,3,5,7,9,11,13,15,17,19) Odd number of pins 203 UR relay control unit PIN(2,4,6,8,12,14,16,18,20) Even number of pins 204 PMU measurement unit PIN10 GND pin ground 205 DVM Voltage Measurement Unit PIN1 OUT1 foot 301 DUT board PIN19 REXT pin 302 DPS interface PIN20 VDD feet 303 UR interface R1 Precision resistors 304 PMU interface R2 Analog impedance 302 DVM interface

[0050] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0051] It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention.

[0052] This invention provides a short circuit detection system for adjacent pins and gold finger contact in an IC, as described in the following embodiments. Figure 1 , Figure 1 This invention provides a schematic diagram of a short circuit detection system for adjacent IC pins and gold finger contact detection.

[0053] In this embodiment, the IC adjacent pin short circuit and gold finger contact detection system includes: a computer host 10, an IC testing system 20, a DUT board 30, and an IC chip under test 40. The IC testing system 20 is mounted on the computer host 10 and includes a control module 20a and a measurement module 20b. The control module 20a and the measurement module 20b converge on the DUT board to obtain corresponding control module interface 30a and measurement module interface 30b. The control module 20a and the measurement module 20b are correspondingly connected to the control module interface 30a and the measurement module interface 30b, and the control module interface 30a and the measurement module interface 30b are connected to the IC chip under test 40 held by the gold fingers.

[0054] The IC testing system 20 can receive test commands generated by the computer host 10, analyze and process the test commands to obtain control commands and measurement commands that can be processed by the control module 20a and the measurement module 20b, and send the control commands and measurement commands to the corresponding control module and measurement module respectively. The control module can send the control commands generated by the IC testing system 20 to the IC chip under test 40 connected to the DUT board 30 through the control interface on the DUT board 30 connected to the IC testing system 20, so that the IC chip under test 40 can work according to the received control commands. The measurement module can measure the working status of the IC chip under test 40 through the measurement interface on the DUT board 30 connected to the IC testing system 20 according to the measurement commands generated by the IC testing system 20, obtain the voltage or current data of the IC chip under test 40 when it is working, and feed back the measured data to the IC testing system 20, so that the IC testing system 20 can generate test results based on the received measurement data.

[0055] In a specific implementation, the computer host 10 can obtain the current testing method and testing mode from the outside. The computer host 10 can generate corresponding test instructions based on the test information input from the outside. The test instructions include the control of the voltage and current of the IC chip under test and the pin connection control of the IC chip under test. According to different test instructions, the control module on the IC test system 20 can control each pin of the IC chip under test, determine the connection method of the pins of the IC chip under test that establish a connection relationship with the IC test system 20, and provide specific voltages or currents to several pins specified by the control instructions, so that the IC chip under test 40 can be in the expected test working state. Then, the measurement module in the IC test system 20 measures the voltage or current on the specific pins of the IC chip under test, obtains the working data of the IC chip under test in the current test working state, and feeds back the measured data to the IC test system 20, so that the IC test system 20 can generate corresponding test results based on the measurement data.

[0056] This embodiment utilizes an IC testing system to generate control and measurement commands. These commands are then sent to a control module and a measurement module, respectively. The control module receives the control commands generated by the IC testing system and sends them to the IC chip under test (DUT) via the control interface of the DUT board, enabling the DUT to operate according to the commands. The measurement module receives the measurement commands generated by the IC testing system and uses the measurement interface of the DUT board to measure the DUT chip, obtaining measurement data. This measurement data is then fed back to the IC testing system to generate test results. By utilizing the control and measurement modules, the operating and connection states of the DUT chip can be precisely controlled according to various test conditions, accurately controlling test parameters and precisely measuring chip data, thereby obtaining more accurate test results.

[0057] Furthermore, in order to ensure the establishment of communication between the computer host 10 and the IC test system 20, the computer host includes a PCI card, and the computer host controls the control unit and measurement unit of the IC test system through the PCI card.

[0058] In the specific implementation, refer to Figure 2 , Figure 2This is a schematic diagram of the component connections for an IC adjacent pin short circuit and gold finger contact detection system. The computer host 10 of this invention includes IC test system control software 101 and a PCI card 102. The IC test system control software 101 can receive external test information and generate test commands based on the test information. The PCI card 102 is used to connect the IC test system control software 101 to the IC test system 20, transmitting the test commands generated by the IC test system control software 101 to the IC test system 20, and also transmitting the test results obtained by the IC test system 20 back to the IC test system control software 101, thus realizing a data communication connection between the computer host 10 and the IC test system control software 20.

[0059] Furthermore, referring to Figure 3 , Figure 3 This is a schematic diagram of the control section of an IC adjacent pin parity test circuit in an IC adjacent pin short circuit and gold finger contact detection system. (Refer to...) Figure 2 The control module also includes a DPS power supply unit 202 and a UR relay control unit 203. The measurement module includes a PMU measurement unit 204 and a DVM voltage measurement unit 205. The corresponding interfaces provided on the DUT board are the DPS power supply unit interface 302, the UR relay control unit interface 303, the PMU measurement unit interface 304, and the DVM voltage measurement unit interface 305. (Refer to...) Figure 3 The pins of the IC chip under test 402 are grounded through relay groups K1~K9 and K11~K20 on the DUT board. The UR relay control unit interface 303 controls the connection and disconnection states of the relay groups K1~K9 and K11~K20. The DPS power supply unit interface 302 supplies power to the relay groups and the IC chip under test. When the DPS power supply unit 202 and the UR relay control unit 203 receive a control command, they can instruct the UR relay control unit 203 to change the connection state between the specific relay and the IC chip under test 40 according to the control command, so that the DPS power supply unit 202 provides a specific voltage value.

[0060] Furthermore, referring to Figure 4 , Figure 4This is a schematic diagram of the IC adjacent pin parity test circuit connection for an IC adjacent pin short circuit and gold finger contact detection system. The measurement module includes a PMU measurement unit 204, which is connected to a PMU measurement unit interface 304 via a DUT board. The PMU measurement unit interface 304 is connected to the IC chip under test (DUT) and can acquire the pin voltages on each pin of the DUT. The DUT has 20 pins, named PIN1 to PIN20. PIN1 to PIN9 are connected to relays K1 to K9, and PIN11 to PIN20 are connected to relays K11 to K20. Pin PIN10 of the DUT is grounded. When the DPS power supply unit interface supplies power to the relays and the DUT, the measurement unit can measure the current pin voltages of the connected chip pins.

[0061] Furthermore, to detect cases where poor contact between the IC chip under test and the gold foil causes accidental IC burn-out, the measurement module also includes a DVM voltage measurement unit 205. This voltage measurement unit is connected to the DVM voltage measurement unit interface 305 via the DUT board. Figure 5 , Figure 5 This is a diagram of the detection and control circuits for preventing IC burnout due to poor contact between the IC and the gold fingers. The IC test system control software controls the UR relay control unit 203, closing relays K21, K22, and K23. PIN20 is connected to the DPS interface 302 to power the IC. PIN19 is connected to GND via K23 through a precision resistor R1, preferably with a resistance of 400Ω. PIN19 is connected to the DVM interface 305 via K22, PIN1 is connected to the DPS interface 302 via K21, and PIN10 is connected to GND. During testing, a 5V DC voltage can be applied to the IC via PIN20. The IC is not yet in working mode. The DVM voltage measurement unit interface can measure the voltage value of PIN19. This measurement is not affected by the contact impedance R2. According to the test requirements, the IC is put into working mode. The DPS interface 302 measures the current of PIN1. The test current is significantly affected by the contact impedance R2, as is the voltage value of PIN19. The measured voltage value is then fed back to the IC test system.

[0062] refer to Figure 6 , Figure 6 This is a flowchart illustrating a method for detecting short circuits between adjacent pins and contact between gold fingers in an IC according to the present invention.

[0063] Based on the first embodiment described above, the IC adjacent pin short circuit and gold finger contact detection method of this embodiment is applied to the IC adjacent pin short circuit and gold finger contact detection system described in the above embodiment. The IC adjacent pin short circuit and gold finger contact detection system includes a computer host, an IC testing system, a DUT board, and an IC chip under test. The IC testing system is mounted on the computer host and includes a control module and a measurement module, which are correspondingly connected to the control interface and measurement interface provided by the DUT board. The IC chip under test is held by gold fingers, so that the control interface and output measurement interface of the DUT board are connected to the IC chip under test.

[0064] In this embodiment, the method for detecting short circuits between adjacent IC pins and the contact of gold fingers includes the following steps:

[0065] Step S10: The IC test system generates control commands and measurement commands, and sends the control commands and measurement commands to the control module and the measurement module respectively.

[0066] Step S20: The control module receives the control command generated by the IC test system and sends the control command to the IC chip under test through the control interface of the DUT board, so that the IC chip under test can work according to the control command.

[0067] Step S30: The measurement module receives the measurement command generated by the IC test system, and uses the measurement command to measure the IC chip under test through the measurement interface of the DUT board to obtain measurement data, and feeds the measurement data back to the IC test system to generate test results.

[0068] In its implementation, the IC test system control software runs on a computer host. The IC test machine system includes the necessary DPS power supply unit, UR relay control unit, PMU measurement unit, and DVM voltage measurement unit. The DUT board integrates the DPS power supply units into a DPS interface group, the UR relay control units into a UR interface group, the PMU measurement units into a PMU interface group, and the DVM voltage measurement units into a DVM interface group. Gold fingers clamp the IC chip pins for testing. The DPS power supply unit powers the UR relay group on the DUT and the VDD pin of the IC chip. The UR relay control unit controls the UR relays on the DUT. The circuit is switched on and off; the PMU measurement unit is used to measure and judge the voltage of the IC chip; the DVM voltage measurement unit is specifically used to measure the voltage of the REXT pin; the IC test system control software runs on the computer host and controls the DPS power supply unit, UR relay control unit, PMU measurement unit and DVM voltage measurement unit on the IC test system through the PCI card. The DUT board connects the DPS power supply unit, UR relay control unit, PMU measurement unit and DVM voltage measurement unit together through connecting wires. The circuit measures and judges the IC chip pins to detect whether adjacent pins are short-circuited and whether poor contact between the IC and the gold finger causes the IC to burn out.

[0069] Furthermore, the method further includes the following steps when performing short circuit detection on adjacent IC pins and gold finger contact detection:

[0070] The power supply unit obtains a power supply command based on the received control command, and supplies power to the relay group and the IC chip under test through the power supply interface of the DUT board according to the power supply command.

[0071] The relay control unit obtains relay control instructions based on the received control instructions, and controls the on / off state of the corresponding relays through the relay control interface of the DUT board according to the relay control instructions.

[0072] The measurement unit determines the pin number of the IC chip under test connected to the interface of the measurement unit according to the relay control command of the relay control unit.

[0073] The measurement unit applies current to the pins of the chip under test that is in a connected state.

[0074] The measurement unit measures the voltage of the pins of the chip under test that is in a connected state, and obtains the pin voltage data.

[0075] The measurement unit feeds back the pin voltage data to the IC testing system, enabling the IC testing system to generate test results based on the pin voltage data.

[0076] In the specific implementation, during the parity test of adjacent IC pins, the IC test system control software controls the UR relay control unit. First, relays K2, K4, K6, K8, K12, K14, K16, K18, and K20 are closed. At this time, even-numbered pins PIN2, PIN4, PIN6, PIN8, PIN12, PIN14, PIN16, PIN18, and PIN20 are connected to GND. The IC test system control software then controls the PMU measurement unit, using the circuitry on the DUT board to test odd-numbered pins PIN1 and PIN3 respectively. Apply a current of -100uA to pins PIN5, PIN7, PIN9, PIN11, PIN13, PIN15, PIN17, and PIN19. The PMU measurement unit will measure a voltage and feed the voltage value back to the IC test system control software for result judgment. If the measured voltage value is between -1.3V and -0.3V, it indicates that the pins are not short-circuited. If the measured value is greater than -0.3V, it indicates that the pins are short-circuited. Alternatively, odd-numbered pins can be connected to GND, and even-numbered pins can be connected to the PMU measurement unit to apply a current of -100uA for testing. This embodiment does not impose specific restrictions on the grounding of odd and even pins.

[0077] Furthermore, in order to detect IC burnout caused by poor contact between the IC and the gold fingers, the following steps are also included:

[0078] The power supply unit provides an initial voltage to the IC chip under test, causing the REXT pin of the IC chip under test to generate an initial pin voltage;

[0079] The voltage measurement module measures the voltage of the REXT pin of the IC chip under test to obtain the initial pin voltage, and feeds the initial pin voltage back to the IC test system;

[0080] The power supply unit provides the operating voltage to the IC chip under test, so that the REXT pin of the IC chip under test generates the operating pin voltage.

[0081] The voltage measurement module measures the voltage of the REXT pin of the IC chip under test to obtain the working pin voltage, and feeds the working pin voltage back to the IC test system;

[0082] The IC testing system generates test results based on the initial pin voltage and the operating pin voltage.

[0083] In the specific implementation, the IC test system control software controls the UR relay control unit, controlling relays K21, K22, and K23 to close. PIN20 connects to the DPS interface to power the IC. PIN19 is connected to GND via K23 through resistor R1_400Ω. PIN19 is connected to the DVM interface via K22. PIN1 is connected to the DPS interface via K21, and PIN10 is connected to GND. R2_1Ω represents the impedance generated when there is poor contact between the gold fingers and the IC. In the detection circuit, a 5V DC voltage is applied to PIN20 to power the IC. At this time, the IC is not in working state. The first measurement of PIN19 via the DVM interface is approximately 0.9629V. This measurement value is not affected by the contact impedance R2_1Ω. According to the test requirements, the IC is put into working mode. The current measured at PIN1 via the DPS interface is approximately 45.53678mA, indicating that the IC has entered working mode. At this time, the test current is significantly affected by the contact impedance R2_1Ω, and the voltage value at PIN19 is also affected by the contact impedance R2_1Ω. The impact is significant. The second measurement of the PIN19 pin via the DVM interface shows a value of approximately 0.96852V. Subtracting the first measurement from the second PIN19 voltage value results in approximately 5.620093mV, indicating that R2_1Ω is less than 1Ω, and the burn-in test can proceed. If the second PIN19 pin measurement via the DVM interface shows a value of approximately 0.974153V, subtracting the first measurement from the second PIN19 voltage value results in approximately 11.253mV. The IC with values ​​exceeding the 0-10mV voltage range set in the program can be controlled to prevent burn-in testing.

[0084] This embodiment generates control and measurement commands through an IC testing system, and sends these commands to a control module and a measurement module, respectively. The control module receives the control commands generated by the IC testing system and sends them to the IC chip under test (DUT) via the control interface of the DUT board, causing the DUT chip to operate according to the control commands. The measurement module receives the measurement commands generated by the IC testing system and uses the measurement interface of the DUT board to measure the DUT chip, obtaining measurement data. This measurement data is then fed back to the IC testing system to generate test results. By utilizing the control and measurement modules, this embodiment not only solves the problems of incomplete lead cutting and short circuits between adjacent pins caused by solder plating during IC packaging, but also... This test circuit method can detect short circuits between adjacent pins immediately and notify the packaging factory to troubleshoot the problem, effectively avoiding excessive losses. It also solves the problem of incorrect IC burn-out during testing. Since poor contact with the gold fingers is unavoidable during testing, poor contact will generate impedance. For constant current drive ICs, every 1Ω increase in resistance will cause a deviation in the test current. We will burn-out the IC according to the current value to achieve the ideal current value. If the current value deviates at this time, the burned-out IC will also deviate and will not reach the required current value. The burned-out IC cannot be corrected. This method can detect ICs with poor contact before burning-out and prevent them from being burned-out, thus ensuring the quality of the IC.

[0085] It should be understood that the above are merely illustrative examples and do not constitute any limitation on the technical solutions of the present invention. In specific applications, those skilled in the art can make settings as needed, and the present invention does not impose any restrictions on this.

[0086] It should be noted that the workflow described above is merely illustrative and does not limit the scope of protection of this invention. In practical applications, those skilled in the art can select some or all of the workflow to achieve the purpose of this embodiment according to actual needs, and no restrictions are imposed here.

[0087] Furthermore, it should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0088] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0089] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as read-only memory (ROM) / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0090] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A short circuit detection system for adjacent pins and gold finger contact detection in an IC, characterized in that, The IC adjacent pin short circuit and gold finger contact detection system includes: a computer host, an IC testing system, a DUT board, and the IC chip under test; The IC testing system is mounted on the computer host. The IC testing system includes a control module and a measurement module, and is connected to the control interface and measurement interface provided by the DUT board. The IC chip under test is held by gold fingers, so that the control interface and output measurement interface of the DUT board are connected to the IC chip under test. The IC testing system is used to generate control commands and measurement commands, and send the control commands and measurement commands to the control module and the measurement module respectively. The control module is used to receive control commands generated by the IC test system and send the control commands to the IC chip under test through the control interface of the DUT board, so that the IC chip under test can work according to the control commands. The measurement module is used to receive measurement commands generated by the IC test system, and to measure the IC chip under test through the measurement interface of the DUT board to obtain measurement data, and to feed the measurement data back to the IC test system to generate test results; The control module includes a power supply unit and a relay control unit. The control module receives control commands generated by the IC testing system and sends these commands to the IC chip under test (DUT) via the control interface of the DUT board, causing the DUT to operate according to the control commands, including: The power supply unit obtains a power supply command based on the received control command, and supplies power to the relay group and the IC chip under test through the power supply interface of the DUT board according to the power supply command. The relay control unit obtains relay control instructions based on the received control instructions, and controls the on / off state of the corresponding relays through the relay control interface of the DUT board according to the relay control instructions. The measurement module further includes a voltage measurement unit. The measurement module receives measurement commands generated by the IC test system, and uses the measurement commands to measure the IC chip under test (DUT) through the measurement interface of the DUT board to obtain measurement data. The measurement data is then fed back to the IC test system to generate test results. The module also includes: The power supply unit provides an initial voltage to the IC chip under test, causing the REXT pin of the IC chip under test to generate an initial pin voltage; The voltage measurement module measures the voltage of the REXT pin of the IC chip under test to obtain the initial pin voltage, and feeds the initial pin voltage back to the IC test system; The power supply unit provides the operating voltage to the IC chip under test, so that the REXT pin of the IC chip under test generates the operating pin voltage. The voltage measurement module measures the voltage of the REXT pin of the IC chip under test to obtain the working pin voltage, and feeds the working pin voltage back to the IC test system; The IC testing system generates test results based on the initial pin voltage and the operating pin voltage.

2. The system as described in claim 1, characterized in that, The control module includes a power supply unit and a relay control unit, and the DUT board includes several relay groups; The power supply unit is used to supply power to the relay group; The power supply unit is also used to supply power to the IC chip under test through the power supply interface of the DUT board; The relay control unit is used to control the on / off state of the relay group through the relay control interface of the DUT board.

3. The system as described in claim 2, characterized in that, The power supply unit and the relay control unit are respectively connected to a number of relays in the relay group through corresponding interfaces. One end of the relay group is connected to the corresponding pin of the IC chip under test, and the other end is grounded.

4. The system as described in claim 3, characterized in that, The measurement module includes a measurement unit; The measurement unit is connected to the IC chip under test through the measurement interface of the DUT board to obtain the pin voltage of the IC chip under test.

5. The system as described in claim 4, characterized in that, The measurement module also includes a voltage measurement unit; The power supply unit is connected to the output pin of the IC chip under test through the voltage measurement interface of the DUT board; The voltage measurement unit is connected to the REXT pin of the IC chip under test through the first terminal of the relay group, and the second terminal of the relay group is grounded through a resistor; The ground pin of the IC chip under test is grounded.

6. The system as described in claim 1, characterized in that, The computer host includes a PCI card, and the computer host controls the control unit and measurement unit of the IC testing system through the PCI card.

7. A method for detecting short circuits and gold finger contact between adjacent pins of an IC, characterized in that, The IC adjacent pin short circuit and gold finger contact detection method is applied to the IC adjacent pin short circuit and gold finger contact detection system as described in claims 1-6. The IC adjacent pin short circuit and gold finger contact detection system includes a computer host, an IC testing system, a DUT board, and an IC chip under test. The IC testing system is mounted on the computer host and includes a control module and a measurement module, which are correspondingly connected to the control interface and measurement interface provided by the DUT board. The IC chip under test is held by gold fingers, so that the control interface and the output measurement interface of the DUT board are connected to the IC chip under test. The method for detecting short circuits between adjacent IC pins and gold finger contact includes: The IC testing system generates control commands and measurement commands, and sends the control commands and measurement commands to the control module and the measurement module respectively; The control module receives control commands generated by the IC test system and sends the control commands to the IC chip under test through the control interface of the DUT board, so that the IC chip under test can work according to the control commands. The measurement module receives the measurement command generated by the IC test system, and uses the measurement command to measure the IC chip under test through the measurement interface of the DUT board to obtain measurement data. The measurement data is then fed back to the IC test system to generate test results. The control module includes a power supply unit and a relay control unit. The control module receives control commands generated by the IC testing system and sends these commands to the IC chip under test (DUT) via the control interface of the DUT board, causing the DUT to operate according to the control commands, including: The power supply unit obtains a power supply command based on the received control command, and supplies power to the relay group and the IC chip under test through the power supply interface of the DUT board according to the power supply command. The relay control unit obtains relay control instructions based on the received control instructions, and controls the on / off state of the corresponding relays through the relay control interface of the DUT board according to the relay control instructions. The measurement module further includes a voltage measurement unit. The measurement module receives measurement commands generated by the IC test system, and uses the measurement commands to measure the IC chip under test (DUT) through the measurement interface of the DUT board to obtain measurement data. The measurement data is then fed back to the IC test system to generate test results. The module also includes: The power supply unit provides an initial voltage to the IC chip under test, causing the REXT pin of the IC chip under test to generate an initial pin voltage; The voltage measurement module measures the voltage of the REXT pin of the IC chip under test to obtain the initial pin voltage, and feeds the initial pin voltage back to the IC test system; The power supply unit provides the operating voltage to the IC chip under test, so that the REXT pin of the IC chip under test generates the operating pin voltage. The voltage measurement module measures the voltage of the REXT pin of the IC chip under test to obtain the working pin voltage, and feeds the working pin voltage back to the IC test system; The IC testing system generates test results based on the initial pin voltage and the operating pin voltage.

8. The method as described in claim 7, characterized in that, The measurement module includes a measurement unit. The measurement module receives measurement commands generated by the IC test system, and uses the measurement commands to measure the IC chip under test (DUT) through the measurement interface of the DUT board to obtain measurement data. The measurement data is then fed back to the IC test system to generate test results, including: The measurement unit determines the pin number of the IC chip under test connected to the interface of the measurement unit according to the relay control command of the relay control unit. The measurement unit applies current to the pins of the chip under test that is in a connected state; The measurement unit measures the voltage of the pins of the chip under test that is in a connected state, and obtains the pin voltage data; The measurement unit feeds back the pin voltage data to the IC testing system, enabling the IC testing system to generate test results based on the pin voltage data.

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