Substrate processing device capable of replacing consumables

Abstract

The present invention discloses a substrate processing device capable of replacing consumables, providing a support solution for replacing consumables such as nozzles and focus rings while maintaining the chamber process environment of the substrate processing device. The substrate processing device capable of replacing consumables according to the present invention comprises: a process chamber having a processing space for performing a substrate processing process; a lifting component disposed in the process chamber and supporting the consumables within the processing space while simultaneously lifting and lowering the consumables; a door unit disposed on a side wall of the process chamber and selectively providing a passageway connected to the processing space as it opens and closes; and a transport unit for transporting consumables through the passageway of the door unit.

Description

[0001] Technical Area

[0002] The present invention relates to a substrate processing device capable of replacing consumables, and more particularly, to a support solution capable of replacing consumables such as a nozzle and a focus ring while maintaining a chamber process environment of the substrate processing device. Background Art

[0003] Plasma processing devices generally include capacitively coupled plasma sources, inductively coupled plasma sources, helicon plasma sources, and microwave plasma sources. Among these, inductively coupled plasma processing devices are widely used because they can easily form high-density plasma.

[0004] Plasma processing apparatuses are used in various fields, and are particularly used in various processes such as vapor deposition and etching in semiconductor manufacturing, which requires high density and high integration.

[0005] When a substrate evaporation process is performed through a plasma processing device, the reaction products are not only evaporated on the substrate, but also coated on the nozzle of the process chamber, thereby contaminating the nozzle. In addition, when an etching process is performed through a plasma processing device, the by-products generated by the etching results of the substrate are deposited on the surface of the nozzle, thereby contaminating the nozzle.

[0006] Therefore, the contaminated nozzles need to be replaced or cleaned regularly. However, in order to replace or clean the nozzles, the processing process itself needs to be interrupted, especially in order to rebuild the chamber process environment, which requires a corresponding amount of time.

[0007] Furthermore, a focus ring is used to ensure uniform plasma distribution. However, due to damage or wear of the focus ring, the focus ring needs to be replaced regularly.

[0008] Since the processing process needs to be interrupted to open the process chamber and replace the focus ring in order to replace the focus ring, there is a problem that it takes a considerable amount of time to rebuild the chamber process environment, just like the case of the showerhead.

[0009] Therefore, a solution is needed to maintain the internal process environment of the process chamber while replacing consumables. Summary of the Invention

[0010] The present invention is proposed to solve the problems of the prior art as described above, and its purpose is to provide a solution that can replace consumables such as nozzles or focus rings.

[0011] In particular, the problem of interrupting the processing process of the substrate processing device itself when replacing or cleaning a contaminated nozzle or replacing a focus ring is solved, and the problem of taking corresponding time to rebuild the subsequent process environment after opening the process chamber is solved.

[0012] The purpose of the present invention is not limited to the above description, and other purposes and advantages of the present invention that are not mentioned will be understood through the following description.

[0013] It can be that according to an embodiment of the present invention, a substrate processing device capable of replacing consumables includes: a process chamber, which is provided with a processing space for performing a substrate processing process; a lifting component, which is arranged in the process chamber and supports the consumables in the processing space while lifting and lowering the consumables; a door unit, which is provided on a side wall of the process chamber and selectively provides a channel connected to the processing space as it is opened and closed; and a transportation unit, which transports the consumables through the channel of the door unit.

[0014] Preferably, the lifting component may include: a lifting shaft for supporting the consumables in the processing space of the process chamber and lifting the consumables; and a lifting driver for lifting the lifting shaft.

[0015] Alternatively, the process chamber may include a door disposed on a side wall of the process chamber and selectively opening or closing a passage connected to the processing space; and a door driver driving the door to open and close.

[0016] Furthermore, the substrate processing apparatus capable of replacing consumables may further include a buffer chamber connected to the passage of the door unit and configured to maintain the processing environment of the process chamber when the passage is open.

[0017] Preferably, the transport unit may include: a transport robot located in the buffer chamber and capable of entering and exiting the processing space through a passage of the door unit to carry consumables.

[0018] Furthermore, the substrate processing apparatus capable of replacing consumables may further include a storage unit disposed in the buffer chamber and storing the consumables.

[0019] As an example, the consumables may include a focus ring installed outside the substrate supporting unit of the process chamber.

[0020] Preferably, the lifting component may be located below the focus ring and enables the focus ring to be lifted and lowered, thereby supporting installation and separation of the focus ring.

[0021] As another example, the consumables may include a nozzle disposed above the processing space.

[0022] Preferably, the lifting component may be located below the nozzle and enables the nozzle to be lifted and lowered, thereby supporting installation and separation of the nozzle.

[0023] Furthermore, the substrate processing device capable of replacing consumables may further include a loading and unloading unit for installing and separating the nozzle in the process chamber.

[0024] As an example, the nozzle may include a stacked fixed plate and a replacement plate, and the mounting and dismounting unit may mount and detach the replacement plate on the fixed plate.

[0025] Preferably, the lifting component may lift the replacement plate to support the combination or separation of the replacement plate and the fixed plate.

[0026] As an example, the loading and unloading unit may install and separate the shower head in a clamping and fastening manner in the process chamber.

[0027] Here, the mounting and dismounting unit may include: a fastening component provided with a thread fastened to the nozzle; and a fastening driving unit connected to a distal end of the fastening component and causing the fastening component to rotate.

[0028] Furthermore, the loading and unloading unit may include a torque measuring instrument for measuring the bonding strength of the nozzle.

[0029] As an example, in the nozzle, either the fixed plate or the replacement plate is provided with a fastening protrusion, and the other is provided with a fastening groove, and the loading and unloading unit rotates the replacement plate so that the fastening protrusion is fastened to or detached from the fastening groove, thereby installing and separating the replacement plate on the fixed plate.

[0030] Preferably, the lifting component may raise the consumables to a height of a passage of the door unit, and the transport unit may allow the consumables to exit or enter through the passage of the door unit.

[0031] Furthermore, the substrate processing device capable of replacing consumables may also include: a buffer chamber, provided with a storage portion for storing consumables, the lifting component is arranged in the process chamber, and causes used consumables to rise to support separation, and causes new consumables provided from the buffer chamber to fall to support installation, the transport unit moves out the used consumables supported by the lifting component and stores them in the storage portion of the buffer chamber, and provides new consumables stored in the storage portion of the buffer chamber to the lifting component.

[0032] A preferred embodiment of a substrate processing apparatus capable of replacing consumables according to the present invention may include: a process chamber having a processing space for performing a substrate processing process; a focus ring mounted outside a substrate support unit of the process chamber; a shower head disposed above the processing space; a loading and unloading unit for mounting and detaching the shower head within the process chamber; a lifting component located below the focus ring and supporting the mounting and detachment of the focus ring or shower head; a door unit disposed on a side wall of the process chamber and selectively providing a passageway connected to the processing space by opening and closing; a buffer chamber connected to the passageway of the door unit to maintain the processing environment of the process chamber when the passageway is open and provided with a storage portion for storing consumables; and a transport unit located in the buffer chamber and capable of transporting the focus ring or shower head into and out of the processing space through the passageway of the door unit.

[0033] As described above, according to the present invention, consumables such as a shower head and a focus ring can be replaced while maintaining the process environment of the chamber of the substrate processing apparatus.

[0034] In particular, when a used shower head or a used focus ring is replaced with a new shower head or a new focus ring, since the environment of the process chamber is maintained, there is no need to rebuild the subsequent process environment, thereby improving process efficiency.

[0035] In addition, the nozzle head is composed of a plurality of plates, so that the used plates can be removed in sequence and the process can be continued with the remaining plates, while reducing the weight of the nozzle head when replacing it.

[0036] The effects of the present invention are not limited to those described above, and those having ordinary knowledge in the technical field to which the present invention pertains can clearly understand other effects not described from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 An embodiment of a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0038] Figure 2An example of raising and lowering a focus ring by a lifting member in a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0039] Figure 3 A structure for attaching and detaching a shower head by a detaching unit in a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0040] Figure 4 An example of attaching and detaching a shower head and raising and lowering the shower head in a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0041] Figure 5 as well as Figure 6 Another embodiment of a shower head and a loading and unloading unit in a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0042] Figure 7 as well as Figure 8 Still another embodiment of a shower head and a loading and unloading unit in a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0043] Figure 9 Another embodiment of a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0044] Figure 10 A process of separating and carrying out a used focus ring by the substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0045] Figure 11 A process of introducing and installing a new focus ring through the substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0046] Figure 12 A process of separating and carrying out a used shower head by the substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0047] Figure 13 A process of introducing and installing a new shower head through the substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0048] (Explanation of Reference Numerals)

[0049] 100: Substrate processing equipment

[0050] 110: Process chamber

[0051] 140: Nozzle

[0052] 141: Fixed plate

[0053] 144: Replacement board

[0054] 150: Focus ring

[0055] 210: Door unit

[0056] 230: Lifting parts

[0057] 240: Loading and unloading unit

[0058] 250: Buffer chamber

[0059] 260: Transport unit DETAILED DESCRIPTION

[0060] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or restricted by the embodiments.

[0061] In order to illustrate the present invention and the advantages of the present invention in operation and the objectives achieved by the implementation of the present invention, preferred embodiments of the present invention will be illustrated below and described with reference to the embodiments.

[0062] First, the terms used in this application are only used to illustrate specific embodiments and are not intended to limit the present invention. Unless there is a clearly different definition in the context, a singular expression may include a plural expression. In addition, in this application, terms such as "including" or "having" are used to specify the existence of features, numbers, steps, operations, constituent elements, parts, or combinations recorded in the specification, and should be understood as not excluding in advance the possibility of the existence or addition of one or more other features or numbers, steps, operations, constituent elements, parts, or combinations.

[0063] When describing the present invention, if it is determined that a detailed description of a related well-known structure or function may obscure the main points of the present invention, the detailed description will be omitted.

[0064] The present invention proposes a solution for replacing consumables arranged in a process chamber while supporting the maintenance of a chamber process environment of a substrate processing device.

[0065] In the following embodiments of the present invention, consumables are limited to nozzles and focusing rings for description, but are not limited to this. Consumables may include various components such as various rings and gaskets that are arranged in the internal space of the process chamber and become contaminated or worn during the process and require periodic replacement.

[0066] Figure 1 An embodiment of a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0067] The substrate processing apparatus 100 may include a process chamber 110 , a substrate supporting unit 120 , plasma generating units 130 a and 130 b , a shower head 140 , a first gas supply unit 160 a , a second gas supply unit 160 b , and a liner (or wall-liner) 170 .

[0068] The substrate processing apparatus 100 may be an apparatus for processing a substrate using a dry etching process, for example, the substrate processing apparatus 100 may process a substrate using a plasma process.

[0069] The process chamber 110 may provide a processing space for performing a plasma process and may be provided with an exhaust hole 111 at a lower portion of the process chamber 110 .

[0070] The exhaust hole 111 may be connected to an exhaust line 113 equipped with a pump 112. The exhaust hole 111 may exhaust reaction byproducts generated during the plasma process and gas remaining inside the process chamber 110 to the outside of the process chamber 110 through the exhaust line 113. In this case, the internal space of the process chamber 110 may be decompressed to a predetermined pressure.

[0071] The process chamber 110 may be provided with a door unit 210 on a sidewall thereof. The door unit 210 may function as a passage for transporting consumables into an internal processing space of the process chamber 110 .

[0072] The door unit 210 may include a door 211 and a door driver 213. The door 211 may form a portion of the outer wall of the process chamber 110 and may be opened and closed according to the drive of the door driver 213, thereby selectively providing a passage to the processing space of the process chamber 110. The door driver 213 may include a hydraulic cylinder / pneumatic cylinder, a motor, etc., and may be configured to raise and lower the door 211.

[0073] The substrate support unit 120 can be disposed in the lower area of ​​the process chamber 110. The substrate support unit 120 can be an electrostatic chuck that supports the substrate using electrostatic force. Alternatively, the substrate support unit 120 can be a unit that supports the substrate using various methods. For example, the substrate support unit 120 can support the substrate using various methods, such as mechanical clamping or vacuum.

[0074] A focus ring 150 may be disposed outside the substrate support unit 120. The focus ring 150 is provided in a ring shape and can be configured to support the edge region of the substrate. The focus ring 150 can be made of silicone and can focus the plasma on the substrate. The focus ring 150 can be secured to the base 121 of the substrate support unit 120 using a clamp, an O-ring, or the like.

[0075] At the same time, an insulating ring (not shown) surrounding the focus ring 150 and an edge ring (not shown) closely attached to the edge of the focus ring 150 may be disposed outside the focus ring 150 .

[0076] The first gas supply unit 160 a may supply gas for removing foreign substances remaining on an upper portion of the focus ring 150 or the substrate supporting unit 120 .

[0077] The first gas supply unit 160a can provide nitrogen gas (N2 gas) as a gas for removing foreign matter, but is not limited thereto. For example, the first gas supply unit 160a can also provide other gases or cleaning agents.

[0078] When a process is performed inside the process chamber 110, a heating member 124 and a cooling member 125 of the substrate supporting unit 120 may be provided to maintain the substrate at a process temperature. To this end, the heating member 124 may include a heating wire, and the cooling member 125 may include a cooling wire through which a refrigerant flows.

[0079] In order to enable the substrate to maintain the process temperature, a heating member 124 and a cooling member 125 may be disposed inside the substrate supporting unit 120 .

[0080] The plasma generating units 130 a and 130 b may generate plasma from gas remaining in the discharge space. Here, the discharge space may be a space located above the substrate supporting unit 120 in the processing space of the process chamber 110 .

[0081] Alternatively, the plasma generating units 130a and 130b may generate plasma in the discharge space within the process chamber 110 using a capacitively coupled plasma (CCP) source. In this case, the plasma generating units 130a and 130b use the showerhead 140 as an upper electrode, and when the substrate supporting unit 120 provides an electrostatic chuck, the electrostatic chuck serves as a lower electrode.

[0082] As another example, the plasma generating units 130a and 130b may utilize an inductively coupled plasma (ICP) source to generate plasma in the discharge space within the process chamber 110. In this case, the plasma generating units 130a and 130b use an antenna (not shown) provided above the process chamber 110 as an upper electrode and an electrostatic chuck of the substrate support unit 120 as a lower electrode.

[0083] The plasma generating units 130 a , 130 b may include an upper electrode, a lower electrode, an upper power source, and a lower power source.

[0084] When the plasma generating units 130a and 130b utilize a capacitively coupled plasma (CCP) source, the shower head 140 may function as an upper electrode, and the electrostatic chuck of the substrate support unit 120 may function as a lower electrode. The shower head 140 functioning as the upper electrode and the electrostatic chuck functioning as the lower electrode may be disposed vertically opposite each other within the process chamber 110. The shower head 140 may include a plurality of gas feeding holes for injecting gas into the process chamber 110.

[0085] The nozzle 140 may be formed of a silicone material or a metal material.

[0086] Meanwhile, a loading and unloading unit (not shown) may be provided to install or detach the shower head 140 in the process chamber 110. As an example, the loading and unloading unit may install and detach the shower head 140 by clamping and fastening.

[0087] The upper plasma generating unit 130b can be configured to control plasma characteristics. For example, it can be configured to adjust ion bombardment energy. The upper plasma generating unit 130b can also be provided with multiple power supplies. In this case, a first matching network (not shown) electrically connected to the multiple power supplies of the upper plasma generating unit 130b can also be included.

[0088] The first matching network may match frequency powers of different magnitudes input from each upper power source and apply them to the showerhead 140 .

[0089] The lower plasma generating unit 130a may apply power to the electrostatic chuck of the substrate supporting unit 120. The power supply of the lower plasma generating unit 130a may function as a plasma source for generating plasma, or may function to control the power supply of the upper plasma generating unit 130b and the characteristics of the plasma.

[0090] The lower plasma generating unit 130 a may include a plurality of power sources, and may further include a second matching network (not shown) electrically connected to the plurality of power sources.

[0091] The second matching network may match frequency powers of different magnitudes input from each lower power source and apply it to the electrostatic chuck of the substrate supporting unit 120 .

[0092] The second gas supply unit 160b may provide process gas to the internal processing space of the process chamber 110 through the shower head 140. The second gas supply unit 160b may include a second gas supply source and a second gas supply line.

[0093] The second gas supply unit 160b can supply an etching gas for processing a substrate as a process gas. The second gas supply unit 160b can supply a gas containing fluorine as the etching gas. For example, SF6, CF4, or the like can be supplied as the etching gas.

[0094] The second gas supply unit 160 b may provide process gas to the shower head 140 , and the etching gas flows into the inner space of the process chamber 110 through the gas injection holes of the shower head 140 .

[0095] On the other hand, when the nozzle 140 is divided into a center zone, a middle zone, an edge zone, etc., the second gas supply unit 160b may also include a gas distributor (not shown) and a gas distribution line (not shown) in order to provide process gas to each area of ​​the nozzle 140.

[0096] The second gas supply unit 160 b may further include a second gas supply source (not shown) for supplying a deposition gas.

[0097] The second gas source can provide gas to the shower head 140 to protect the side of the substrate pattern and enable anisotropic etching. Such a second gas source can supply C4F8, C2F4 or other gases as evaporation gases.

[0098] The liner 170 can protect the inner side of the process chamber 110 from arc discharge generated during process gas excitation, impurities generated during substrate processing, etc. The liner 170 can be provided in the process chamber 110 in a cylindrical shape with upper and lower portions open, respectively.

[0099] The lifting component 230 can support the consumables in the processing space and lift the consumables. The lifting component 230 can include a lifting shaft 231 and a lifting driver 233.

[0100] The lifting shaft 231 is driven by the lifting driver 233 to rise or fall, so that consumables can be installed at corresponding positions or consumables separated from corresponding positions can be located at the channel height of the door unit 210.

[0101] As an example, in order to replace the focus ring 150, the lifting component 230 raises the used focus ring, thereby supporting the use of the focus ring to be moved out through the channel of the door unit 210, and the lifting component 230 can lower the new focus ring introduced through the channel of the door unit 210 and install it on the outside of the substrate support unit 120.

[0102] In addition, in order to replace the nozzle 140, the lifting component 230 can lower the used nozzle head, thereby supporting the use of the nozzle head to be moved out through the channel of the door unit 210, and the lifting component 230 can raise the new nozzle head introduced through the channel of the door unit 210, thereby supporting its installation on the process chamber 110.

[0103] The substrate processing apparatus 100 described above includes consumables that may become contaminated or worn during the substrate processing process. For example, the showerhead and focus ring may become contaminated and worn during the evaporation and etching processes. Therefore, these consumables need to be regularly replaced or cleaned.

[0104] The substrate processing apparatus 100 according to the present invention can install or detach consumables such as the focus ring 150 or the shower head 140 and lift them using the lifting member 230. Furthermore, the focus ring or shower head can be moved out to a passage opened and closed by the door unit 210, and a new focus ring or shower head can be moved into the passage opened and closed by the door unit 210. In this case, consumables such as the focus ring or shower head can be transported by a transport unit (not shown).

[0105] By way of example, a structure of separating or installing consumables and transferring the consumables in the substrate processing apparatus 100 according to the present invention will be described in a little more detail.

[0106] Figure 2 An example of raising and lowering a focus ring by a lifting member in a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0107] The lifting member 230 may support the consumables within the processing space of the process chamber and simultaneously lift the consumables.

[0108] In the Figure 2 When the focus ring 150 is to be separated or installed, the focus ring 150 can be raised or lowered by the lifting member 230 disposed below the focus ring 150 .

[0109] The lifting member 230 may include a lifting shaft 231 and a lifting driver 233 .

[0110] A plurality of lifting shafts 231 may be arranged along the periphery of the focus ring 150 to support the focus ring 150 . The lifting driver 233 may move the lifting shafts 231 in the vertical direction to move the focus ring 150 up and down.

[0111] Meanwhile, the elevating member 230 includes an elevating member control part 235 that controls the elevating driver 233 so that the focus ring 150 can be installed or separated around the substrate supporting unit 120 of the process chamber 110 according to the movement of the elevating shaft 231 .

[0112] For example, the lifting member control unit 235 controls the lifting driver 233 to lift the lifting shaft 231 , thereby separating the used focus ring supported by the lifting shaft 231 from the substrate support unit 120 and positioning it at the passage height of the door unit 210 .

[0113] In addition, the lifting member control unit 235 lowers the lifting shaft 231 by controlling the lifting driver 233 , so that a new focus ring supported by the lifting shaft 231 can be installed around the substrate support unit 120 .

[0114] Figure 3 The structure of attaching and detaching the nozzle head by the attaching and detaching unit in the substrate processing apparatus capable of replacing consumables according to the present invention is shown. Figure 4 An example of attaching and detaching a shower head and raising and lowering the shower head in a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0115] The shower head 140 may be installed above the processing space of the process chamber 110 , and a loading and unloading unit 240 may be disposed above the processing space of the process chamber 110 .

[0116] As an example, the attachment and detachment unit 240 may include a fastening member 241 having a thread and being fastened by rotation, and a fastening driving unit 243 connected to the end of the fastening member 241 to rotate the fastening member 241. The showerhead 140 may be provided with a plurality of fastening members 143 along the outer circumference of the gas injection hole 142. The fastening members 143 of the showerhead 140 may be fastened correspondingly to the fastening members 241.

[0117] At the same time, the loading and unloading unit 240 includes a loading and unloading unit control part 245, which controls the fastening driving part 243, so that as the fastening part 241 is rotated by the fastening driving part 243, the fastening part 241 can be fastened to the fastening part 143 of the nozzle 140 or separated from the fastening part 143 of the nozzle 140.

[0118] Furthermore, when the fastening component 241 is fastened to the nozzle 140 , a torque meter (not shown) may be provided to measure the bonding strength, and the loading and unloading unit control unit 245 controls the fastening drive unit 243 based on the measured bonding strength, thereby fastening the nozzle 140 on the fastening component 241 .

[0119] The lifting shaft 231 of the lifting component 230 can rise to the bottom of the nozzle 140 installed above the processing space of the process chamber 110, and multiple lifting shafts 231 are arranged around the outer shell of the nozzle 140, so that the nozzle 140 can be supported when installing or separating the nozzle 140.

[0120] For example, when the mounting and dismounting unit 240 detaches the spray head 140, it may support the spray head 140 detached by the elevating shaft 231. In addition, the mounting and dismounting unit 240 may install the spray head 140 while being supported by the elevating shaft 231.

[0121] At the same time, the lifting member control unit 235 of the lifting member 230 controls the lifting driver 233 to lift the lifting shaft 231 , thereby moving the nozzle 140 between the installation position and the passage position of the door unit 210 .

[0122] Figure 5 as well as Figure 6 Another embodiment of a shower head and a loading and unloading unit in a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0123] The nozzle head 140a may be constructed as a stacked structure of a fixed plate 141a and a replacement plate 144a.

[0124] The fixed plate 141a and the replacement plate 144a are respectively provided with gas injection holes 142a, 145a and fastening parts 143a, 146a corresponding to and connected to each other. The nozzle 140a can be arranged on the fastening component 241a of the loading and unloading unit 240a with the fixed plate 141a and the replacement plate 144a fastened and stacked in sequence.

[0125] According to the driving of the fastening driving portion 243 , the fixed plate 141 a and the replacement plate 144 a may be fastened to the fastening member 241 a in sequence. In addition, according to the driving of the fastening driving portion 243 , only the replacement plate 144 a may be detached from or fastened to the fastening member 241 a.

[0126] Furthermore, when the fastening component 241a is fastened to the nozzle 140a, a torque meter (not shown) for measuring the bonding strength may be provided, and the loading and unloading unit control unit may control the fastening drive unit 243a based on the measured bonding strength, thereby fastening the nozzle 140a on the fastening component 241a.

[0127] The replacement plate 144a is directly exposed to the processing space of the process chamber 110, and thus may be relatively more contaminated than the fixed plate 141a according to the progress of the process. Therefore, the replacement plate 144a may be replaced only periodically according to the degree of contamination.

[0128] Alternatively, the replacement plate 144a may be used first in the nozzle 140a and removed when it is contaminated, and then the fixed plate 141a may be used. When the fixed plate 141a also needs to be replaced due to contamination, the used fixed plate 141a is removed and a new fixed plate 141a and a new replacement plate 144a are installed.

[0129] At the same time, the fixing plate 141a and the replacement plate 144a are supported by the lifting components described above, and the fixing plate 141a and the replacement plate 144a are lifted and lowered, so that the fixing plate 141a and the replacement plate 144a can be replaced.

[0130] Furthermore, the fixing plate 141 a and the replacement plate 144 a of the nozzle 140 a can be installed and separated in a clamping and fastening manner, and accordingly, a loading and unloading unit can be provided.

[0131] Figure 7 as well as Figure 8 Still another embodiment of a shower head and a loading and unloading unit in a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0132] In the Figure 7 as well as Figure 8 In the figure, the nozzle head 140b is a structure in which a fixed plate 141b and a replacement plate 144b are stacked, and a fastening protrusion 146b is engaged with a fastening groove 143b to be fastened.

[0133] Alternatively, a fastening groove 143b may be provided on the outer periphery of the fixed plate 141b, and a fastening protrusion 146b may be provided on the outer periphery of the replacement plate 144b, so that the replacement plate 144b is combined with the fixed plate 141b.

[0134] Then, the loading and unloading unit may include a rotating ring 147a, and a loading and unloading groove 148a engaged with the fastening protrusion 146b of the replacement plate 144b is provided on the rotating ring 147a.

[0135] The rotating ring 147a rotates in a state where the fastening protrusions 146b of the replacement plate 144b are engaged with the mounting and dismounting grooves 148a of the rotating ring 147a, so that the replacement plate 144b can be fastened to or detached from the fixed plate 141b.

[0136] At the same time, the fixing plate 141b and the replacement plate 144b can be supported by the lifting components described above and simultaneously lifted and lowered, thereby achieving replacement of the fixing plate 141b and the replacement plate 144b.

[0137] As mentioned above, consumables such as focusing rings and nozzles can have various structures and can be deformed in various ways to facilitate replacement.

[0138] Figure 9 Another embodiment of a substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0139] In the description Figure 2 When the embodiment is described above, the above description is omitted. Figure 1 The examples repeat part of the description.

[0140] A buffer chamber 250 may be provided outside a consumables transport passage provided through the door 211 of the door unit 210. The buffer chamber 250 may be provided to abut against an outer wall of the process chamber 110 to seal the interior of the process chamber 110.

[0141] The internal space of the buffer chamber 250 may be constructed in the same environment as the internal process environment of the process chamber 110. As the door 211 of the door unit 210 is opened, when the internal space of the process chamber 110 and the internal space of the buffer chamber 250 are communicated, the internal space of the buffer chamber 250 and the process environment of the process chamber 110 are formed in the same environmental conditions, thereby maintaining the process environment formed in the internal space of the process chamber 110.

[0142] The buffer chamber 250 may be provided with a transport unit 260 that may include a transport robot that removes used consumables from the process chamber 110 into the buffer chamber 250 and loads new consumables from the buffer chamber 250 into the process chamber 110 .

[0143] As an example, the transport robot may include a robot arm 264 and a robot arm driving unit 263 .

[0144] Through the control of the robot driving unit 263, the robot 264 adopts a structure in which its length is multi-stage extended or a structure in which multiple joints rotate, etc., and can enter the inner space of the process chamber 110 from the inner space of the buffer chamber 250 through the channel formed by the door unit 210.

[0145] When the lifting shaft 231 rises to the height of the passage formed by the door unit 210 while supporting the used consumables, the robot arm 264 can enter the interior space of the process chamber 110 and take over the used consumables supported by the lifting member 230. In addition, when the robot arm 264 introduces new consumables into the passage formed by the door unit 210, the lifting shaft 231 can rise and take over the new consumables supplied by the robot arm 264.

[0146] Furthermore, a storage unit (not shown) for storing consumables may be provided within the interior of the buffer chamber 250. When the transport robot unloads used consumables from the process chamber 110 and transports them to the buffer chamber 250, the used consumables may be stored in the storage unit (not shown). Furthermore, the transport robot may also supply new consumables stored in the storage unit (not shown) to the interior of the process chamber 110.

[0147] With the substrate processing apparatus capable of replacing consumables according to the present invention as described above, consumables can be replaced while maintaining the process environment of the process chamber.

[0148] A process of replacing consumables using the substrate processing apparatus capable of replacing consumables according to the present invention will be described in more detail with reference to an embodiment.

[0149] The process of replacing consumables is the same as described above. Figure 9 The embodiments of the present invention are described below.

[0150] Figure 10 A process of separating and carrying out a used focus ring by the substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0151] When the focus ring 150 is contaminated or worn and needs to be replaced, as described Figure 10 As shown in (a), the lifting shaft 231 of the lifting member 230 located below the focus ring 150 rises, thereby separating the focus ring 150 installed around the substrate support unit 120 and raising the focus ring 150. The lifting shaft 231 can rise so that the focus ring 150 is at the height of the door 211 of the door unit 210.

[0152] When the used focus ring 150 is raised to the height of the door 211, the door 211 of the door unit 210 can be opened to form a passage. Figure 10 As in (b), the robot arm 264 of the transport unit 260 may enter the interior of the process chamber 110 through the passage, thereby taking over the used focus ring 150 supported by the lifting shaft 231 .

[0153] Then, as described Figure 10As shown in (c), the robot arm 264 can return to the inner space of the buffer chamber 250 while supporting the used focus ring 150. The used focus ring 150 can be stored in a storage unit (not shown) provided in the buffer chamber 250.

[0154] Figure 11 A process of introducing and installing a new focus ring through the substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0155] As described Figure 11 As in (a), the robot arm 264 of the transport unit 260 can support the new focus ring 150 in the buffer chamber 250. The new focus ring 150 can be withdrawn from the storage portion provided in the buffer chamber 250.

[0156] As described Figure 11 As in (b), the door 211 of the door unit 210 may be opened to form a passage, and the robot arm 264 of the transport unit 260 may enter the interior of the process chamber 110 through the passage while supporting the new focus ring 150 .

[0157] When the robot arm 264 moves the new focus ring 150 into the process chamber 110, as described above, Figure 11 As shown in (c), the lifting shaft 231 of the lifting member 230 can be raised to the channel height to receive the new focus ring 150 supported by the robot arm 264. After transferring the new focus ring 150 to the lifting shaft 231 of the lifting member 230, the robot arm 264 can return to the interior of the buffer chamber 250.

[0158] Then, the elevating shaft 231 of the elevating member 230 may descend and install a new focus ring 150 around the substrate supporting unit 120 .

[0159] Figure 12 A process of separating and carrying out a used shower head by the substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0160] When the nozzle 140 is contaminated and needs to be replaced, as described Figure 12 As shown in (a), the lifting shaft 231 of the lifting member 230 can rise to the bottom of the nozzle head 140 and support the nozzle head 140.

[0161] The nozzle 140 may be a structure in which a fixed plate 141 and a replacement plate 144 are stacked. When the replacement plate 144 is supported by the lifting shaft 231 of the lifting component 230 , a loading and unloading unit (not shown) may only separate the used replacement plate 144 .

[0162] In a state where the used replacement plate 144 is separated and supported by the lifting shaft 231 of the lifting member 230, as described above Figure 12As shown in (b), the lifting shaft 231 can be lowered to the height of the door 211 of the door unit 210.

[0163] When the used replacement plate 144 is lowered to the height of the door 211, the door 211 of the door unit 210 can be opened to form a passage, and the robot arm 264 of the transport unit 260 can enter the interior of the process chamber 110 through the passage and take over the used replacement plate 144 supported by the lifting shaft 231.

[0164] Then, as described Figure 12 As shown in (c), the robot arm 264 can return to the internal space of the buffer chamber 250 while supporting the used replacement plate 144. The used replacement plate 144 can be stored in a storage portion (not shown) provided in the buffer chamber 250.

[0165] Figure 13 A process of introducing and installing a new shower head through the substrate processing apparatus capable of replacing consumables according to the present invention is shown.

[0166] As described Figure 13 As in (a), the robot arm 264 of the transport unit 260 can support the new replacement plate 144 in the buffer chamber 250. The new replacement plate 144 can be withdrawn from the storage portion provided in the buffer chamber 250.

[0167] As described Figure 13 As in (b), the door 211 of the door unit 210 may be opened to form a passage, and the robot arm 264 of the transport unit 260 may enter the interior of the process chamber 110 through the passage while supporting the new replacement plate 144 .

[0168] While the robot arm 264 is transferring the newly replaced plate 144 into the process chamber 110, the lifting shaft 231 of the lifting member 230 may rise to the height of the passage and receive the newly replaced plate 144 supported by the robot arm 264. After transferring the newly replaced plate 144 to the lifting shaft 231 of the lifting member 230, the robot arm 264 may return to the buffer chamber 250.

[0169] Then, as described Figure 13 As shown in (c), the lifting shaft 231 of the lifting member 230 rises, and in a state where the new replacement plate 144 is in contact with the fixed plate 141, the loading and unloading unit (not shown) can install the new replacement plate 144 under the fixed plate 141.

[0170] If the installation of the new replacement plate 144 is completed, the lifting shaft 231 of the lifting member 230 may be lowered and returned to the original position.

[0171] According to the present invention, consumables such as the shower head and the focus ring can be replaced while maintaining the process environment of the chamber of the substrate processing apparatus.

[0172] In particular, when a used shower head or a used focus ring is replaced with a new shower head or a new focus ring, the environment of the process chamber is maintained, so there is no need to rebuild the subsequent process environment, thereby improving process efficiency.

[0173] The above description is merely an example of the technical concept of the present invention. Anyone with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and variations without departing from the essential characteristics of the present invention. Therefore, the embodiments described in the present invention are not intended to limit the technical concept of the present invention, but to illustrate the technical concept of the present invention, and the technical concept of the present invention is not limited to these embodiments. The scope of protection of the present invention should be interpreted in accordance with the attached claims, and all technical concepts within the scope of equivalents should be interpreted as included in the scope of rights of the present invention.

Claims

1. A substrate processing device capable of replacing consumables, characterized in that: include: A process chamber is provided with a processing space for performing a substrate processing process; A nozzle including a fixed plate and a replacement plate arranged in a stacked manner and provided with a fastening portion corresponding to the fastening component; a loading and unloading unit for mounting and detaching the nozzle in the process chamber, and comprising: a fastening component provided with a thread fastened to the nozzle; a fastening drive unit connected to a distal end of the fastening component and causing the fastening component to rotate; a torque meter for measuring the bonding strength of the nozzle; and a loading and unloading unit control unit for controlling the fastening drive unit based on the measured bonding strength to fasten the nozzle, thereby mounting and detaching the replacement plate on the fixing plate; a lifting component disposed in the process chamber and supporting a consumable, i.e., a replacement plate for a showerhead, in the processing space while lifting the consumable; a door unit, disposed on a side wall of the process chamber and selectively providing a passage connected to the processing space as it opens and closes; a transport unit for transporting consumables through the passage of the door unit; and The buffer chamber is connected to the passage of the door unit and maintains the processing environment of the process chamber when the passage is open.

2. A substrate processing device capable of replacing consumables, characterized in that: include: A process chamber is provided with a processing space for performing a substrate processing process; The nozzle comprises a stacked fixed plate provided with a fastening groove and a replacement plate provided with a fastening protrusion corresponding to the fastening groove; a loading and unloading unit for installing and detaching the nozzle in the process chamber, comprising a rotating ring provided with a loading and unloading groove engaged with the fastening protrusion, and rotating the rotating ring when the fastening protrusion is engaged with the loading and unloading groove of the rotating ring to fasten or detach the fastening protrusion from the fastening groove, thereby installing and detaching the replacement plate on the fixed plate; a lifting component disposed in the process chamber and supporting a consumable, i.e., a replacement plate for a showerhead, in the processing space while lifting the consumable; a door unit, disposed on a side wall of the process chamber and selectively providing a passage connected to the processing space as it opens and closes; a transport unit for transporting consumables through the passage of the door unit; as well as The buffer chamber is connected to the passage of the door unit and maintains the processing environment of the process chamber when the passage is open.

3. The substrate processing apparatus capable of replacing consumables according to claim 1 or 2, wherein: The lifting component includes: a lifting shaft for supporting and lifting consumables in a processing space of the process chamber; and The lifting drive moves the lifting shaft up and down.

4. The substrate processing apparatus capable of replacing consumables according to claim 1 or 2, wherein: The door unit comprises: a door, disposed on a side wall of the process chamber and selectively opening or closing a passage connected to the processing space; and A door driver drives the door to open and close.

5. The substrate processing apparatus capable of replacing consumables according to claim 1 or 2, wherein: The transport unit comprises: The transport robot is located in the buffer chamber and is capable of entering and exiting the processing space through the passage of the door unit to carry consumables.

6. The substrate processing apparatus capable of replacing consumables according to claim 1 or 2, wherein: The substrate processing device capable of replacing consumables further comprises: The storage unit is disposed in the buffer chamber and stores consumables.

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