Single wafer wet processing equipment

Abstract

The present invention provides a single-wafer wet processing equipment, comprising an operating shell, a driving mechanism and a lifting mechanism. The operating shell comprises a liquid collection chamber and a recovery duct and a first wastewater discharge pipe respectively connected to the liquid collection chamber, wherein the recovery duct further comprises a first recovery inner pipe and a second wastewater discharge pipe that are not connected to each other. The driving mechanism comprises a turntable for carrying the wafer and a driving assembly, and the turntable is arranged in the liquid collection chamber. The lifting mechanism comprises a recovery ring that moves relative to the operating shell and a second recovery inner pipe that moves with the recovery ring. The recovery ring moves along the inner wall of the operating shell, and the second recovery inner pipe is sleeved and moves relative to the first recovery inner pipe, so that wastewater will not seep from the recovery duct into the first recovery inner pipe, thereby contaminating the liquid storage tank.

Description

Technical Field

[0001] The present invention relates to a semiconductor wafer processing device; in particular, to a single wafer wet processing equipment. Background Art

[0002] The typical process of a single wafer spin cleaner involves spraying the wafer with various chemical solutions for cleaning or etching. Deionized water (DI Water) is then used between each chemical process to remove residual chemicals from the wafer from previous processes. Alternatively, DI Water is also used after cleaning or etching to remove residual chemicals from the wafer from previous processes. Finally, the wafer is rapidly spun dry and nitrogen is blown onto the wafer surface to ensure complete drying.

[0003] When single-wafer spin cleaning or etching equipment uses deionized water (DI Water) to clean wafers, the resulting wastewater is collected in the chamber bottom tray below the chemical recovery ring and discharged through the main wastewater drain pipe. However, some wastewater may seep into the chemical recovery pipe due to factors such as strong spraying, sputtering, or water vapor volatilization, resulting in wastewater contamination of the chemical recovery, making it impossible to reuse / use the recovered chemical, and increasing process costs. Summary of the Invention

[0004] One purpose of the present invention is to provide a single wafer wet processing equipment that can prevent wastewater from seeping from the recovery conduit into the first recovery inner tube and then contaminating the liquid storage tank used to recover the liquid.

[0005] In order to achieve the above-mentioned purpose, the present invention discloses a single-wafer wet processing equipment that sprays liquid on a wafer through a liquid supply device. The single-wafer wet processing equipment includes an operating shell, a driving mechanism, and a lifting mechanism. The operating shell includes a liquid collecting chamber and a recovery duct and a first wastewater discharge pipe respectively connected to the liquid collecting chamber, wherein the recovery duct further includes a first recovery inner pipe and a second wastewater discharge pipe that are not connected to each other. The driving mechanism includes a turntable that carries the wafer and a driving component that drives the turntable to rotate, and the turntable is arranged in the liquid collecting chamber. The lifting mechanism includes a recovery ring that moves relative to the operating shell and a second recovery inner pipe that moves with the recovery ring. The recovery ring moves along the inner wall of the operating shell, and the second recovery inner pipe moves relative to the first recovery inner pipe.

[0006] In one embodiment, the second recovery inner tube further includes a first tube portion and a second tube portion sleeved outside the first tube portion, one end of the first tube portion is inserted into the first recovery inner tube, and one end of the second tube portion is sleeved outside the first recovery inner tube, and the first tube portion and the second tube portion will move relative to the first recovery inner tube.

[0007] In one embodiment, the diameter of the first tube portion is smaller than the diameter of the first recovery inner tube, and the diameter of the first recovery inner tube is smaller than the diameter of the second tube portion.

[0008] In one embodiment, when the lifting mechanism drives the recovery ring to move to a first position, the operating shell exposes the turntable and causes the second recovery inner tube to overlap with the first recovery inner tube. When the lifting mechanism drives the recovery ring to move to a second position, the opening of the recovery ring is parallel to the wafer above the turntable and causes the second recovery inner tube to partially overlap with the first recovery inner tube. When the lifting mechanism drives the recovery ring to move to a third position, the opening of the recovery ring is higher than the wafer above the turntable. ， The second recovery inner tube is partially overlapped with the first recovery inner tube.

[0009] In one embodiment, the overlapping ratio of the second recovery inner tube and the first recovery inner tube in the second position is greater than the overlapping ratio of the second recovery inner tube and the first recovery inner tube in the third position.

[0010] In one embodiment, the recovery ring further includes a main body, a first guide portion, a second guide portion and a guide groove located between the first guide portion and the second guide portion, the first guide portion is annularly arranged on an opening end edge of the main body, and the second guide portion is annularly arranged on the inner wall of the main body away from the opening.

[0011] In one embodiment, the recovery ring further includes a connecting channel connected to the second recovery inner tube. The connecting channel is opened on a side surface of the second guide portion and connected to the guide groove.

[0012] In one embodiment, the first guiding portion and the second guiding portion are respectively an arc surface, an inclined surface, or a combination thereof, and the length of the first guiding portion is smaller than the length of the second guiding portion.

[0013] In one embodiment, the operating shell further includes a notch, the liquid collecting chamber is communicated with the second wastewater discharge pipe through the notch, and the recovery ring moves relative to the inner wall of the operating shell through the notch.

[0014] In one embodiment, the lifting mechanism further includes at least one piston cylinder and a connecting rod connected to the piston cylinder, the connecting rod is fixedly connected to the recovery ring, the driving assembly of the driving mechanism further includes a rotating shaft, an actuator and a belt, the brake is connected to the rotating shaft through the belt and transmits power to the rotating shaft, so that the rotating shaft rotates to support the turntable.

[0015] The present invention also provides a single-wafer wet processing equipment that sprays liquid on a wafer through a liquid supply device. The single-wafer wet processing equipment includes an operating shell and a lifting mechanism. The operating shell includes a liquid collection chamber and a recovery duct and a first wastewater discharge pipe respectively connected to the liquid collection chamber, wherein the recovery duct also includes a first recovery inner pipe and a second wastewater discharge pipe that are not connected to each other. The lifting mechanism includes a recovery ring arranged in the liquid collection chamber and a second recovery inner pipe that moves with the recovery ring, and the recovery ring moves along the inner wall of the operating shell, wherein one end of the first recovery inner pipe is connected to one end of the second recovery inner pipe, so that the first recovery inner pipe can be telescopically moved relative to the second recovery inner pipe.

[0016] In one embodiment, the system further comprises a telescopic hose, wherein the telescopic hose is connected to the first recovery inner tube and the second recovery inner tube respectively, so as to enable the first recovery inner tube to telescope and move with respect to the second recovery inner tube.

[0017] The present invention provides a second recovery inner tube (upper recovery conduit) having an inner and outer layer structure and capable of being raised and lowered synchronously with a recovery ring, wherein the second tube portion (outer tube) of the second recovery inner tube is always kept sheathed with the first recovery inner tube during the raising and lowering process of the recovery ring, so that wastewater will not infiltrate into the first recovery inner tube (lower recovery conduit) due to strong spraying, splashing, water vapor volatilization, droplets, etc., thereby effectively preventing the first recovery inner tube for recovering liquid from being contaminated by wastewater, achieving the effect of reusing / utilizing the liquid stored in the liquid storage tank and reducing costs. Furthermore, in the recovery conduit, because the second tube portion covers / sheathes the first recovery inner tube, the outer wall of the second tube portion and the outer wall of the first recovery inner tube can guide the wastewater to flow to the second wastewater discharge pipe for discharge, that is, the wastewater will flow to the second wastewater discharge pipe through the channel on the inner wall of the recovery conduit for discharge, and will not infiltrate into the first recovery inner tube due to splashing, droplets or volatilization of the wastewater. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To make the above contents of the present invention more clearly understood, preferred embodiments are described in detail below with reference to the accompanying drawings.

[0019] Figure 1 Schematic diagram of a first embodiment of a single wafer wet processing apparatus according to the present invention;

[0020] Figure 2 Schematic diagram of a second embodiment of a single wafer wet processing apparatus according to the present invention;

[0021] Figure 3 Schematic diagram of a third embodiment of a single wafer wet processing apparatus according to the present invention;

[0022] Figure 4 for Figure 2 a schematic perspective partial cross-sectional view of the recovery ring in the second position;

[0023] Figure 5 This is a partially enlarged view of the single wafer wet processing equipment of the present invention;

[0024] Figure 6 This is a schematic diagram of the appearance of a single wafer wet processing equipment of the present invention;

[0025] 7A to 7C A schematic diagram of the recovery ring of the single wafer wet processing equipment of the present invention being located at the first to third positions;

[0026] Figures 8A to 8C for 7A to 7C Schematic diagram of the recovery catheter being located at the first to third positions;

[0027] Figures 9A to 9C They are Figures 8A to 8C a partial cross-sectional schematic diagram of; and

[0028] Figure 10 FIG2 is another embodiment of the retrieval catheter of the present invention. DETAILED DESCRIPTION

[0029] Please refer to the above drawings, in which the same component symbols represent the same or similar components. The principles of the present invention are illustrated by implementing them in appropriate environments. The following description is based on the specific embodiments of the present invention illustrated, and should not be construed as limiting the present invention to other specific embodiments not described in detail herein.

[0030] The present invention relates to a single wafer wet processing equipment, which can be used to accommodate a plurality of wafers with specific size, specific thickness, and specific warpage.

[0031] like Figures 1 to 3The figures show schematic diagrams of first to third embodiments of a single-wafer wet processing system according to the present invention. The present invention provides a single-wafer wet processing system 100 that sprays a wafer W using a liquid supply device 1, such as a nozzle / spray head. The liquid supply device 1 includes a spraying cantilever (swing arm, not shown) disposed above a rotating table 132 for spraying various chemical liquids onto the wafer W. The single-wafer wet processing system 100 comprises an operating housing 110, a drive mechanism 130, and a lifting mechanism 170. The operating housing 110 includes a liquid collection chamber 112, a recovery conduit 120 and a first wastewater discharge pipe 114, both of which are connected to the liquid collection chamber 112. The recovery conduit 120 further includes a first recovery inner pipe 116 and a second wastewater discharge pipe 118, which are not connected to each other. The drive mechanism 130 includes a turntable 132 that supports the wafer W and a drive assembly 134 that drives the turntable 132 in rotation. The turntable 132 is disposed within the liquid collection chamber 112. The lifting mechanism 170 includes a recovery ring 150 that moves relative to the operating housing 110 and a second recovery inner tube 160 that moves following the recovery ring 150 . The recovery ring 150 moves along the inner wall of the operating housing 110 , and the second recovery inner tube 160 moves relative to the first recovery inner tube 120 .

[0032] In such Figure 1 In the illustrated embodiment, when the lifting mechanism 170 drives the recovery ring 150 to move to a first position 182, the operating housing 110 exposes the turntable 132 and causes the second recovery inner tube 160 to overlap with the first recovery inner tube 116. In other words, when the second recovery inner tube 160 and the first recovery inner tube 116 completely overlap, the recovery ring 150 is lowered to the lowest point by the lifting mechanism 170, so that the robot arm gripper (Robot Finger, not shown) has space / path to place the wafer W on the turntable 138 or remove the wafer W from the turntable 138. Figure 7A shown.

[0033] like Figure 2 As shown, when the lifting mechanism 170 drives the recovery ring 150 to move to a second position 184, the opening 153 of the recovery ring 150 is parallel to the wafer W above the turntable 132 and the second recovery inner tube 160 partially overlaps with the first recovery inner tube 116, thereby performing the first stage of etching or cleaning or other related operations on the wafer W, such as etching or photoresist stripping and cleaning processes using chemical solutions. Specifically, when the lifting mechanism 170 drives the recovery ring 150 to rise to the second position 184 (i.e., higher than the first position 182), the first guide portion 154 of the recovery ring 150 is aligned with the horizontal position of the wafer W, thereby being able to collect the chemical solution splashed out by the centrifugal force generated by the rotation of the wafer W by the turntable 132.

[0034] Further, please refer to Figure 4 and Figure 7B As shown, when the recovery ring 150 rises to the second position 184, the chemical liquid is simultaneously supplied from the liquid storage tank (not shown) to the liquid supply device 1, and the chemical liquid is sprayed onto the rotating wafer W on the turntable 132 through the nozzle, and the single wafer W is subjected to related processes such as rotary etching or cleaning. It should be noted that the driving component 134 of the driving mechanism 130 is composed of a rotating shaft 135, an actuator 136 (such as a motor) and a belt 137. Figure 5 As shown. The brake 136 is connected to the rotating shaft 135 through the belt 137 and transmits power to the rotating shaft 135, so that the rotating shaft 135 rotates the support turntable 132. When the actuator 136 drives the rotating shaft 135 to rotate via the belt 137, the wafer W located above the turntable 132 will rotate synchronously. At this time, above the wafer W, the spray cantilever connected and driving the nozzle to swing left and right (Swing Movement) will etch or clean the wafer W. The swing direction and speed of the spray cantilever are driven and controlled by a servo motor (not shown). The swing direction and speed can be edited and set through the operation interface (not shown) to set process parameters, such as moving from the center point of the wafer W to the edge of the wafer W, or from one side of the wafer W to the other side of the wafer W. This can ensure that the entire wafer W can achieve the purpose of chemical liquid etching or cleaning.

[0035] The lifting / lateral movement of the spraying cantilever is driven and controlled by a pneumatic cylinder or a rotary screw to control the distance between the nozzle and the wafer W. The driving and control of the spraying cantilever are prior art and will not be described in detail here. Furthermore, the operating shell 110 is also provided with a notch 119, so that the recovery ring 150 can move relative to the inner wall of the operating shell 110 through the notch 119. Although the recovery duct 120 is connected to the liquid collecting chamber 112 through the notch 119, part of the wastewater can be guided from the second pipe portion 164 and the outer wall of the first recovery inner pipe 116 to the second wastewater discharge pipe 118 for discharge. Since the second pipe portion 164 covers the first recovery inner pipe 116, the recovery duct 120 for recovering the liquid can be further prevented from being contaminated by wastewater.

[0036] Please refer to Figure 5 As shown, the recovery ring 150 further includes a body 152, a first guide portion 154, a second guide portion 156, and a guide groove 158 located between the first guide portion 154 and the second guide portion 156. The first guide portion 154 is annularly disposed at the edge of an opening 153 of the body 152, and the second guide portion 156 is also annularly disposed on the inner wall of the body 152 away from the opening 153. Figure 4In the embodiment shown, the first guide portion 154 and the second guide portion 156 are preferably each an arcuate surface to guide the liquid medicine in different processes. However, in other different embodiments, the first guide portion 154 and the second guide portion 156 can also be a combination of an inclined surface or an arcuate surface. In addition, the first guide portion 154 is mainly used to guide the liquid medicine to be stored in the guide groove 158 and to prevent the liquid medicine from splashing / spraying out of the opening 153, while the second guide portion 156 is used to guide the liquid medicine to flow toward the liquid collection chamber 112. Therefore, the length of the first guide portion 154 is preferably smaller than the length of the second guide portion 156. However, in this embodiment, this is not limited.

[0037] In such Figure 4 and Figure 7B In the illustrated embodiment, the recovery ring 150 further includes a connecting channel 159 that connects to the first tube portion 162 of the second recovery inner tube 160. The connecting channel 159 is formed on a side surface of the second guide portion 156 and communicates with the guide groove 158. When the recovery ring 150 rises to the second position 184, the first guide portion 154 corresponding to the wafer W guides the chemical liquid through the guide groove 158 and the connecting channel 159. The chemical liquid is then transported to a chemical liquid storage tank (not shown) via the first tube portion 162 and the first recovery inner tube 116 for collection and reuse.

[0038] Please refer to Figure 6 As shown, the lifting mechanism 170 further includes at least one piston cylinder 172 and a connecting rod 174 connected to the piston cylinder 172. The connecting rod 174 is fixedly connected to the top of the body 152 of the recovery ring 150. Figure 6 In the illustrated embodiment, the lifting mechanism 170 of the recovery ring 150 utilizes a single drive source (not shown). This single drive source provides stable lifting and lowering of the recovery ring 150, preventing asynchronous lifting and lowering of the recovery ring 150. Furthermore, this embodiment includes multiple clamping portions 138 disposed on the turntable 132, each of which is configured to clamp and position a single wafer W. The specific structure of the clamping portions 138 is conventional and will not be described in detail here.

[0039] like Figure 3 and Figure 7CAs shown, when the lifting mechanism 170 further drives the recovery ring 150 to move to a third position 186, the opening 153 of the recovery ring 150 is higher than the wafer W above the turntable 132, and the second recovery inner tube 160 partially overlaps with the first recovery inner tube 116. In this way, the wafer W undergoes a second stage of cleaning, such as a deionized water (DIWater) cleaning process on the wafer W, that is, removing the residual chemical solution on the wafer W in the first stage. Specifically, when the recovery ring 150 rises to the third position 186 higher than the second position 184, the liquid supply device 1 simultaneously sprays the wafer W on the turntable 132. At this time, the rotation of the turntable 132 drives the wafer W to generate centrifugal force, causing the deionized water and the residual chemical solution to mix into waste water, which is precisely aligned with the second guide portion 156 of the recovery ring 150. The second guide portion 156 with an arc-shaped or inclined surface guides the wastewater to flow into the liquid collecting chamber 112 , that is, most of the wastewater is collected by the liquid collecting chamber 112 in the operating housing 110 and discharged from the first wastewater discharge pipe 114 below the liquid collecting chamber 112 .

[0040] In this second stage, part of the wastewater will be sprayed by the nozzle to produce droplets, or water vapor will be volatilized, and then seep into the recovery pipe 120 of the recovery liquid, so that the first recovery inner pipe 116 of the recovery liquid is contaminated by the wastewater. Figure 3 、 Figure 5 and Figure 7C In the illustrated embodiment, a second inner recovery tube 160 (upper recovery conduit) is provided, having an inner and outer layer structure and capable of being raised and lowered synchronously with the recovery ring 150. The second tube portion 164 (outer tube) of the second inner recovery tube 160 maintains its sheath around the first inner recovery tube 116 (lower recovery conduit) during the raising and lowering of the recovery ring 150. This prevents wastewater from penetrating into the first inner recovery tube 116 due to strong spraying, splashing, vapor evaporation, or droplets. This effectively prevents contamination of the first inner recovery tube 116, which is used to recover the chemical solution, by the wastewater, thereby enabling the reuse of the chemical solution stored in the chemical solution storage tank and reducing costs. In other words, regardless of the position to which the lifting mechanism 170 raises and lowers the recovery ring 150, the second tube portion 164 of the second inner recovery tube 160 always maintains its sheath around the first inner recovery tube 116, preventing wastewater from penetrating into the first inner recovery tube 116 from the recovery conduit 120 and contaminating the chemical solution storage tank.

[0041] Please refer to Figures 8A to 9C, which are schematic diagrams of the recovery conduits located at the first to third positions and their partial cross-sectional diagrams. The second recovery inner tube 160 includes an integrally formed first tube portion 162 (inner tube) and a second tube portion 164. The first tube portion 162 is inserted into the first recovery inner tube 116, and the second tube portion 164 is sleeved outside the first recovery inner tube 116. When the second recovery inner tube 160 moves relative to the first recovery inner tube 116, the second tube portion 164 always covers the first recovery inner tube 116, so that wastewater can be prevented from seeping into the first recovery inner tube 116. Figures 8A to 9C In the illustrated embodiment, the diameter of the first tube portion 162 is smaller than the diameter of the first recovery inner tube 116, and the diameter of the first recovery inner tube 116 is smaller than the diameter of the second tube portion 164. It should be noted that the overlap ratio between the second recovery inner tube 160 and the first recovery inner tube 116 at the second position 184 is greater than the overlap ratio between the second recovery inner tube 160 and the first recovery inner tube 116 at the third position 186.

[0042] In summary, the first frame 200, the second frame 300, the first support plate 400, and the second support plate 500 of the single-wafer wet processing equipment of the present invention can be quickly disassembled and assembled through a plurality of connecting rods 600, thereby meeting the process requirements of special wafers, saving process preparation time, and thereby reducing the cost of purchasing multiple additional wafer boats, saving material costs. Furthermore, since only the first support plate 400 and the second support plate 500 need to be replaced, the flexibility of the process in using the wafer boat is increased, avoiding damage to wafers of special sizes and shapes, and improving the process yield. In addition, the single-wafer wet processing equipment of the present invention allows 8-inch and 12-inch wafer boats to have a shared design (i.e., the 8-inch wafer boat can be placed inside the 12-inch wafer boat), thereby increasing the flexibility of equipment application.

[0043] In this embodiment, since the second tube portion 164 of the second recovery inner tube 160 covers / sleeves the first recovery inner tube 116, the outer wall of the second tube portion 164 and the outer wall of the first recovery inner tube 116 can guide the wastewater to flow to the second wastewater discharge pipe 118 for discharge, that is, the wastewater will flow to the second wastewater discharge pipe 118 through the channel on the inner wall of the recovery conduit 120 and be discharged, and will not seep into the first recovery inner tube 116 due to wastewater splashing, droplets or volatilization.

[0044] It should be noted that the first-stage chemical liquid supply process also includes a chemical liquid supply system and a chemical liquid recycling system. The chemical liquid supply system draws chemical liquid from the liquid storage tank via a pump (not shown), filters impurities through at least one filter (not shown), and then enters the nozzle of the liquid supply device 1 to ensure the cleanliness of the chemical liquid. When the chemical liquid is sprayed from the nozzle onto the rotating wafer W on the turntable 132, the etching or cleaning process of the single wafer W is performed, and finally it is recovered through the first recovery inner tube 116 of the recovery duct 120. The chemical liquid recycling system recovers the chemical liquid after spraying and cleaning the wafer W through the second recovery inner tube 160 of the recovery ring 150 and the first recovery inner tube 116 of the operating shell 110 and transports it back to the chemical liquid storage tank for reuse, thereby saving the chemical liquid cost.

[0045] Please refer to Figure 10 FIG2 shows another embodiment of a recovery conduit according to the present invention. As shown in the figure, the present invention also provides a single-wafer wet processing apparatus that sprays a wafer W through a liquid supply device 1. The single-wafer wet processing apparatus includes an operating housing 110 and a lifting mechanism 170. The operating housing 170 includes a liquid collection chamber 112, a recovery conduit 120 and a first wastewater discharge pipe 114, both of which are connected to the liquid collection chamber 112. The recovery conduit 120 also includes a first recovery inner pipe 116 and a second wastewater discharge pipe 118, which are not connected to each other. The lifting mechanism 170 includes a recovery ring 150 disposed within the liquid collection chamber 112 and a second recovery inner pipe 160 that moves with the recovery ring 150. The recovery ring 150 moves along the inner wall of the operating housing 110. One end of the first recovery inner pipe 116 is connected to one end of the second recovery inner pipe 160, allowing the first recovery inner pipe 116 to telescope relative to the second recovery inner pipe 160.

[0046] like Figure 10 The illustrated embodiment further includes a telescopic hose 190. The telescopic hose 190 is connected to the first recovery inner tube 116 and the second recovery inner tube 160, respectively, so that the first recovery inner tube 116 and the second recovery inner tube 160 can telescope and move without creating a gap. In other words, only one layer of recovery conduit 120 structure is required between the first recovery inner tube 116 and the second recovery inner tube 160, which has a simple structure and low cost, while also preventing wastewater from contaminating the liquid medicine storage tank. Therefore, this embodiment achieves the purpose of preventing wastewater from seeping into the first recovery inner tube 116 by connecting the telescopic hose 190 to the first recovery inner tube 116 and the second recovery inner tube 160. For the remaining structures and process methods of this embodiment, please refer to the aforementioned embodiments and will not be repeated here.

[0047] Although examples of the present invention have been described with respect to specific embodiments, they are merely examples, and the present invention is not limited thereto and should be interpreted as having the broadest scope within the technical spirit disclosed in this specification. Those skilled in the art may implement the present invention in a form not described in the embodiments of the present invention by combining or replacing the disclosed embodiments, but it will not depart from the scope of the present invention. In addition, it is obvious that those skilled in the art may change or modify the disclosed embodiments based on this specification, and therefore, such changes or modifications fall within the scope of the present invention.

Claims

1. A single wafer wet processing equipment, characterized in that: A single wafer wet processing apparatus is provided for spraying a wafer through a liquid supply device, the single wafer wet processing apparatus comprising: An operating housing comprising a liquid collecting chamber and a recovery conduit and a first wastewater discharge pipe respectively connected to the liquid collecting chamber, wherein the recovery conduit further comprises a first recovery inner pipe and a second wastewater discharge pipe which are not connected to each other; a driving mechanism comprising a turntable for carrying the wafer and a driving assembly for driving the turntable to rotate, wherein the turntable is disposed in the liquid collecting chamber; and A lifting mechanism comprising a recovery ring that moves relative to the operating housing and a second recovery inner tube that moves following the recovery ring, wherein the recovery ring moves along the inner wall of the operating housing, and the second recovery inner tube moves relative to the first recovery inner tube; Among them, the second recovery inner tube has an inner and outer two-layer structure, including a first tube portion and a second tube portion sleeved outside the first tube portion. One end of the first tube portion is inserted into the first recovery inner tube, and one end of the second tube portion is sleeved outside the first recovery inner tube. The first tube portion and the second tube portion will move relative to the first recovery inner tube.

2. The single wafer wet processing equipment according to claim 1, wherein: The diameter of the first tube portion is smaller than the diameter of the first recovery inner tube, and the diameter of the first recovery inner tube is smaller than the diameter of the second tube portion.

3. The single wafer wet processing equipment according to claim 1, wherein: When the lifting mechanism drives the recovery ring to move to a first position, the operating shell exposes the turntable and makes the second recovery inner tube overlap with the first recovery inner tube; when the lifting mechanism drives the recovery ring to move to a second position, the opening of the recovery ring is parallel to the wafer above the turntable and makes the second recovery inner tube partially overlap with the first recovery inner tube; when the lifting mechanism drives the recovery ring to move to a third position, the opening of the recovery ring is higher than the wafer above the turntable and makes the second recovery inner tube partially overlap with the first recovery inner tube.

4. The single wafer wet processing equipment according to claim 3, wherein: The overlapping ratio of the second recovery inner tube and the first recovery inner tube at the second position is greater than the overlapping ratio of the second recovery inner tube and the first recovery inner tube at the third position.

5. The single wafer wet processing equipment according to claim 1, wherein: The recovery ring also includes a main body, a first guide part, a second guide part and a guide groove located between the first guide part and the second guide part. The first guide part is annularly arranged on an opening end edge of the main body, and the second guide part is annularly arranged on the inner wall of the main body away from the opening.

6. The single wafer wet processing equipment according to claim 5, wherein: The recovery ring further comprises a connection channel connected to the second recovery inner tube. The connection channel is opened on a side surface of the second guide portion and is connected to the guide groove.

7. The single wafer wet processing equipment according to claim 5, wherein: The first guiding portion and the second guiding portion are respectively an arc surface, an inclined surface or a combination thereof, and the length of the first guiding portion is smaller than the length of the second guiding portion.

8. The single wafer wet processing equipment according to claim 1, wherein: The operating shell further comprises a notch, the liquid collecting chamber is communicated with the second wastewater discharge pipe through the notch, and the recovery ring moves relative to the inner wall of the operating shell through the notch.

9. The single wafer wet processing equipment according to claim 1, wherein: The lifting mechanism also includes at least one piston cylinder and a connecting rod connected to the piston cylinder, the connecting rod is fixedly connected to the recovery ring, and the driving component of the driving mechanism also includes a rotating shaft, an actuator and a belt. The actuator is connected to the rotating shaft through the belt and transmits power to the rotating shaft, so that the rotating shaft rotates and supports the turntable.

10. A single wafer wet processing equipment, characterized in that: A single wafer wet processing apparatus is provided for spraying a wafer through a liquid supply device, the single wafer wet processing apparatus comprising: An operating housing comprising a liquid collecting chamber and a recovery conduit and a first wastewater discharge pipe respectively connected to the liquid collecting chamber, wherein the recovery conduit further comprises a first recovery inner pipe and a second wastewater discharge pipe which are not connected to each other; a lifting mechanism comprising a recovery ring disposed within the liquid collecting chamber and a second recovery inner tube moving in tandem with the recovery ring, wherein the recovery ring moves along the inner wall of the operating housing, wherein one end of the first recovery inner tube is connected to one end of the second recovery inner tube, allowing the first recovery inner tube to telescope relative to the second recovery inner tube; and A telescopic hose is connected to the first recovery inner tube and the second recovery inner tube respectively, so that the first recovery inner tube and the second recovery inner tube can move telescopically.

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