Electronic devices

Abstract

The embodiment of the present application provides an electronic device, which relates to the technical field of electronic devices and is used to realize the lightweight design of electronic devices. The electronic device includes: a display screen, a first circuit board, a second circuit board, a shell, and a reinforcement member; the first circuit board includes a first opening and a first hole; the second circuit board includes a microphone, a second hole, and a sound pickup hole, the second circuit board is stacked with the first circuit board, and is coupled to the first circuit board; in the thickness direction of the second circuit board, the second circuit board overlaps with the first opening in at least a partial area; the reinforcement member includes a body and a pin, the pin is inserted into the first hole and the second hole, and is fixedly connected to the first hole and the second hole respectively; the shell includes a sound pickup channel; the microphone picks up sound through the sound pickup channel and the sound pickup hole; the sound pickup channel includes a first part extending from the shell surface into the shell and intersecting with the plane where the first circuit board is located; in the thickness direction of the second circuit board, the sound pickup channel, the second circuit board, and at least a partial area of ​​the display screen overlap.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the rapid development of the information technology (IT) industry, users have increasingly higher requirements on the performance and structure of electronic equipment.

[0003] In the assembly of electronic devices, surface mounted devices (SMD) without pins or short leads are usually integrated on the surface of printed circuit boards (PCBs) using surface mount technology (SMT) to form internal structures with different functions. As users have increasingly higher demands for diversified performance and thinner structures of electronic devices, a large number of electronic devices need to be arranged in the electronic devices in order to achieve diversified performance of electronic devices. However, the thinner structure of electronic devices will limit the internal space of the electronic devices.

[0004] Therefore, how to improve the internal space utilization of electronic devices and thereby achieve a lightweight and thin design of electronic devices has become a technical problem that needs to be urgently solved by those skilled in the art. Summary of the invention

[0005] An embodiment of the present application provides an electronic device, which is used to achieve a lightweight and thin design of the electronic device.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions:

[0007] An electronic device provided in an embodiment of the present application includes a display screen, a first circuit board having a first opening and a first hole, a second circuit board stacked and coupled with the first circuit board, a shell having a sound pickup channel, and a reinforcement member having a body and a pin. The second circuit board includes a microphone, a second hole, and a sound pickup hole. The microphone recognizes sound through the sound pickup channel and the sound pickup hole. The first part of the sound pickup channel extends from the surface of the shell into the interior of the shell and intersects with the plane where the first circuit board is located. The pin is fixedly connected to the first hole and the second hole, respectively, to increase the connection force between the first circuit board and the second circuit board. In the thickness direction of the second circuit board, the second circuit board and the first opening have at least a partial area overlapping, and the sound pickup channel, the second circuit board and the display screen have at least a partial area overlapping.

[0008] The electronic device provided by the embodiment of the present application forms a first opening on the first circuit board to reserve a position for the sound pickup channel. Then a second circuit board coupled to the first circuit board is arranged on the first circuit board, and a microphone is arranged on the second circuit board, and the signal communication between the microphone and the first circuit board is realized through the second circuit board. It is equivalent to raising the microphone to increase the setting space of the sound pickup channel. In this way, although the space between the first circuit board and the display screen is reduced after the electronic device is made thinner and lighter, the first opening is arranged on the first circuit board, and after the microphone is raised, it is equivalent to utilizing the space in the thickness direction of the electronic device, and increasing the space between the microphone and the display screen. Therefore, even if the space between the display screen and the first circuit board is reduced, this arrangement method of setting the first opening on the first circuit board and raising the microphone will not affect the integrity and sealing of the sound pickup channel, so that the design requirements of the light and thin electronic device can be realized. Moreover, the pins on the reinforcing member are used to realize the fixed connection with the first circuit board and the second circuit board, which can improve the pulling force between the pins of the reinforcing member and the first circuit board and the second circuit board, thereby improving the connection force between the first circuit board and the second circuit board.

[0009] In some embodiments, the first portion is inclined toward the display screen, thereby utilizing the space in the thickness direction of the electronic device and saving the internal space of the electronic device.

[0010] In some embodiments, the body is disposed on a side of the second circuit board away from the first circuit board; the body cover is disposed above the microphone; and the body is welded to the second circuit board. The body may be a shielding cover for shielding electrical signals to prevent external electromagnetic waves from affecting the microphone in the body, and may also shield the electromagnetic waves generated by the microphone from radiating outward. Providing pins on the shielding cover not only improves the connection effect between the first circuit board and the second circuit board, but also does not increase the number of components of the electronic device.

[0011] In some embodiments, the body is disposed on a side of the second circuit board away from the first circuit board; the body is sleeved on the outside of the microphone and exposes part of the side of the microphone. The body can be a reinforcing plate used to enhance the strength of the circuit board of the electronic device and improve the firmness of the circuit board. Providing pins on the reinforcing plate not only improves the connection effect between the first circuit board and the second circuit board, but also does not increase the number of components of the electronic device.

[0012] In some embodiments, the body is disposed on a side of the second circuit board away from the first circuit board; the body is disposed around the periphery of the microphone. The body may be a gasket used to improve the uneven thickness of the circuit board in the electronic device. Providing pins on the reinforcing plate not only improves the connection effect between the first circuit board and the second circuit board, but also does not increase the number of components of the electronic device.

[0013] The shielding cover, reinforcing plate, gasket and other reinforcing parts are all inherent structures on the circuit board. On the one hand, there is no need to add additional structures and corresponding processing procedures, saving costs and time required for assembly and processing. On the other hand, there is no need to reserve an area for matching with the first circuit board and the second circuit board, which can avoid wasting the area of ​​the first circuit board and the second circuit board, thereby minimizing the area of ​​the second circuit board, saving layout space, and then improving the area utilization of the first circuit board layout, thereby improving the integration of electronic equipment, further improving the space utilization of the electronic equipment 1, and realizing the light and thin design of the electronic equipment.

[0014] In some embodiments, the pins are welded or bonded to the first holes and the second holes respectively, thereby increasing the pulling force between the pins of the reinforcement and the first circuit board and the second circuit board, thereby increasing the connection force between the first circuit board and the second circuit board.

[0015] In some embodiments, the surface of the pin is at least partially uneven. Solder or adhesive wrapping the uneven surface of the pin can further increase the pulling force between the pin of the reinforcement and the first circuit board and the second circuit board, thereby increasing the connection force between the first circuit board and the second circuit board.

[0016] In some embodiments, the pin further has a third hole, and the solder or adhesive used to weld the pin to the first hole and the second hole respectively also fills the third hole, so as to improve the pulling force between the pin of the reinforcement and the first circuit board and the second circuit board, thereby improving the connection force between the first circuit board and the second circuit board.

[0017] In some embodiments, the pin is in a sheet shape, and the bottom of the pin has a chamfer, which serves as a guide to facilitate the pin to be inserted into the first hole and the second hole.

[0018] In some embodiments, the reinforcing member includes a plurality of pins, and the plurality of pins are arranged on different sides of the body. Arranging a plurality of pins on the body can further increase the pulling force between the pins and the first circuit board and the second circuit board, thereby increasing the connection force between the first circuit board and the second circuit board.

[0019] In some embodiments, the first hole passes through the first circuit board. The process is simple and easy to manufacture.

[0020] In some embodiments, the bottom of the pin has a barb, which passes through the first hole and the second hole and is snap-connected with the first circuit board. The requirement for the dimensional accuracy of the pin and the first hole is relatively low, and the processing cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0022] Figure 2A for Figure 1 A partial enlarged view of the

[0023] Figure 2B for Figure 2A A schematic cross-sectional view in the O1-O2 direction;

[0024] Figure 3 for Figure 2A Another cross-sectional schematic diagram in the O1-O2 direction;

[0025] Figure 4A A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0026] Figure 4B A schematic diagram of the structure of a first circuit board provided in an embodiment of the present application;

[0027] Figure 4C A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0028] Figure 4D for Figure 4A A cross-sectional schematic diagram in the direction A1-A2;

[0029] Figure 5A A schematic diagram of the structure of a first hole and a second hole in an electronic device provided in an embodiment of the present application;

[0030] Figure 5B A schematic diagram of the structure of a first hole and a second hole in another electronic device provided in an embodiment of the present application;

[0031] Figure 5C A schematic diagram of the structure of a first hole and a second hole in another electronic device provided in an embodiment of the present application;

[0032] Figure 5D A schematic diagram of the structure of a first hole and a second hole in another electronic device provided in an embodiment of the present application;

[0033] Fig. 6A A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0034] Figure 6B for Fig. 6A An exploded diagram of an electronic device is provided;

[0035] Figure 6C for Fig. 6A A top view of an electronic device is provided;

[0036] Fig.6D for Figure 6C A cross-sectional schematic diagram in the B1-B2 direction;

[0037] Fig. 7A A structural schematic diagram of a reinforcement plate provided in an embodiment of the present application;

[0038] Figure 7B A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0039] Figure 7C for Figure 7B An exploded diagram of an electronic device is provided;

[0040] Fig. 8A A schematic diagram of the structure of another reinforcement plate provided in an embodiment of the present application;

[0041] Figure 8B A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0042] Fig.9A A schematic diagram of the structure of another reinforcement plate provided in an embodiment of the present application;

[0043] Fig. 9B A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0044] Fig. 10A A side view of a reinforcement plate provided in an embodiment of the present application;

[0045] Fig. 10B A side view of another reinforcement plate provided in an embodiment of the present application;

[0046] Fig.11A A top view of another electronic device provided in an embodiment of the present application;

[0047] Fig. 11B for Fig.11A A cross-sectional schematic diagram in the C1-C2 direction;

[0048] Fig. 11C for Fig.11A Another cross-sectional schematic diagram in the C1-C2 direction;

[0049] Fig. 12A An exploded diagram of another electronic device provided in an embodiment of the present application;

[0050] Fig. 12B for Fig. 12A A top view of an electronic device is provided;

[0051] Fig. 12C for Fig. 12B A cross-sectional schematic diagram in the direction D1-D2;

[0052] Fig.12D for Fig. 12B Another cross-sectional schematic diagram along the D1-D2 direction;

[0053] Fig.12E for Fig. 12B Another cross-sectional schematic diagram along the D1-D2 direction;

[0054] Fig.12F for Fig. 12B Another cross-sectional schematic diagram along the D1-D2 direction;

[0055] Fig.13A A schematic diagram of the structure of another reinforcement plate provided in an embodiment of the present application;

[0056] Fig. 13B A schematic diagram of the structure of another reinforcement plate provided in an embodiment of the present application;

[0057] Fig. 13C for Fig. 13B A cross-sectional schematic diagram in the direction E1-E2;

[0058] Fig.14 for Fig. 12B Another cross-sectional schematic diagram along the D1-D2 direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] 1-electronic device; 2-display screen; 3-housing; 31-pickup channel; 4-back cover; 5-cover plate; 10'-printed circuit board; 101'-first pickup hole; 11-seal; 10-first circuit board; 101-first opening; 102-first hole; 20-second circuit board; 201-second hole; 202-pickup hole; 30-microphone; 301-sound inlet hole; 40-reinforcement; 401-second opening; 403-third opening; 41-body; 42-pin; 421-chamfer; 422-hook; 423-third hole; 50-solder or adhesive. DETAILED DESCRIPTION

[0061] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0062] In the following, the terms "second", "first", etc. are used only for convenience of description and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "second", "first", etc. may explicitly or implicitly include one or more of the feature. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0063] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" may be defined including but not limited to the orientation relative to the schematic placement of the components in the drawings. It should be understood that these directional terms may be relative concepts, which are used for relative description and clarification, and may change accordingly according to changes in the orientation of the components in the drawings.

[0064] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. In addition, the term "coupled" can be a direct electrical connection or an indirect electrical connection through an intermediate medium. The term "contact" can be a direct contact or an indirect contact through an intermediate medium.

[0065] In the embodiments of the present application, "and / or" describes the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B may be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0066] The embodiment of the present application provides an electronic device, which may be a terminal device with a display interface such as a mobile phone, a television, a display, a tablet computer, a car computer, or a smart display wearable device such as a smart watch or a smart bracelet. The embodiment of the present application does not impose any special restrictions on the specific form of the above-mentioned electronic device. For the convenience of explanation, the following embodiments are all illustrated by taking the electronic device as a mobile phone as an example.

[0067] An example of an electronic device structure is shown in FIG. Figure 1 As shown, the electronic device 1 mainly includes a display panel (DP) 2, a housing 3, a back cover (or battery cover) 4 and a cover plate 5.

[0068] The display screen 2 has a light emitting side where a display image can be seen and a backlight side arranged opposite to the light emitting side. The housing 3 is used to support and protect the display screen 2. The cover plate 5 is arranged on the light emitting side of the display screen 2. The rear cover 4 is arranged on the backlight side of the display screen 2.

[0069] In a possible embodiment of the present application, the display screen 2 is a liquid crystal display (LCD). In this case, the display screen 2 further includes a backlight unit (BLU) located at the back of the LCD (away from the side of the LCD for displaying images).

[0070] The backlight module can provide light source to the liquid crystal display screen, so that each subpixel in the liquid crystal display screen can emit light to realize image display.

[0071] Alternatively, in another possible embodiment of the present application, the display screen 2 is an organic light emitting diode (OLED) display screen. Since an electroluminescent layer is provided in each sub-pixel of the OLED display screen, the OLED display screen can realize self-luminescence after receiving the operating voltage. In this case, the above-mentioned backlight module does not need to be provided in the OLED display screen.

[0072] The cover plate 5 is located on the side of the display screen 2 away from the back cover 4 . The cover plate 5 may be, for example, a cover glass (CG), and the cover glass may have a certain toughness.

[0073] In some embodiments, the housing 3 may include a middle frame and a frame, and the frame is arranged around the middle frame. The frame and the middle frame may be integrally formed structural members. Alternatively, the frame and the middle frame may also be two separate structural members, and the frame and the middle frame may be assembled by one or more combinations of assembly methods such as snap-on, adhesive-bonding, and welding. This embodiment of the present application does not limit this.

[0074] The middle frame is located between the display screen 2 and the back cover 4. The surface of the middle frame away from the display screen 2 is used to install internal components such as batteries, printed circuit boards (PCB) 10', microphones, cameras, antennas, etc. After the back cover 4 is covered with the middle frame, the above internal components are located between the back cover 4 and the middle frame, and the printed circuit board 10' is fixedly connected to the middle frame.

[0075] The frame is arranged around the outline of the display screen 2 , and is combined with the cover plate 5 and the back cover 4 to form a sealed housing, thereby protecting the display screen 2 .

[0076] In a possible embodiment, the electronic device 1 may further include a bracket. The bracket may be disposed on a side of the printed circuit board 10' close to the back cover 4 to support the back cover 4, thereby preventing the back cover 4 from being deformed or broken under external force. The housing 3, the bracket and the back cover 4 cooperate with each other to integrate internal components such as the printed circuit board 10' and the microphone inside the body.

[0077] The electronic device 1 also includes electronic devices such as a processor (center processing unit, CPU) chip, a radio frequency chip, a radio frequency power amplifier (power amplifier, PA), a system on a chip (system on a chip, SOC), a power management chip (power management integrated circuits, PMIC), a storage chip (such as a high bandwidth memory (high bandwidth memory, HBM)), an audio processor, a touch screen controller, NAND flash (flash memory), an image sensor and a microphone, which are arranged on a printed circuit board 10'. The printed circuit board 10' is used to carry the above-mentioned electronic devices and complete signal interaction with the above-mentioned electronic devices.

[0078] like Figure 2A As shown in FIG. 1 , a microphone 30 is disposed on the printed circuit board 10 ′. Figure 2B As shown, Figure 2B for Figure 2A In the cross-sectional view along the line O1-O2, the microphone 30 has a sound inlet 301 on one side close to the printed circuit board 10'. Sound is transmitted into the microphone 30 through the sound inlet 301, and the microphone 30 converts the sound signal into an electrical signal and performs further processing.

[0079] At the same time, a first sound pickup hole 101' is also required to be provided at a position on the printed circuit board 10' corresponding to the sound inlet hole 301. The housing 3 of the electronic device 1 is also provided with a sound pickup channel 31, which extends from the surface of the housing 3 to the inside of the housing 3, and is connected to the sound inlet hole 301 through the first sound pickup hole 101', so that the microphone 30 can be connected to the external environment, and the microphone 30 picks up sound through the sound pickup channel 31 and the first sound pickup hole 101'.

[0080] In the embodiment of the present application, the microphone 30 is firstly arranged on the printed circuit board 10' by surface mounted technology (SMT), and then the first pickup hole 101' of the printed circuit board 10' and the pickup channel 31 are sealed by a sealing member 11 such as foam or silicone sleeve to form a sealed pickup circuit.

[0081] As users' requirements for the performance and structure of electronic devices 1 continue to increase, in order to make electronic devices 1 thinner and lighter, such as Figure 3 As shown, the printed circuit board 10' in the electronic device 1 needs to be arranged as close as possible to the display screen 2. The sound pickup channel 31 includes a first portion 311 inclined toward the display screen 2 and a second portion 312 connecting the first portion 311 and the first sound pickup hole 101'.

[0082] However, as the existing electronic device 1 gradually develops towards a narrow frame or even no frame, the display screen 2 is very close to the edge of the shell 3. Figure 3 As shown, the projection of the microphone 30 and other electronic devices in the thickness direction of the display screen 2 will overlap with the display screen 2. Then, the sound pickup channel 31 needs to be connected to the microphone 30, and the projection of the sound pickup channel 31 in the thickness direction of the display screen 2 will overlap with the display screen 2. Normally, the position of the sound pickup channel 31 is limited between the printed circuit board 10' and the display screen 2. Therefore, the thin and light design of the electronic device 1 will cause the space between the printed circuit board 10' and the display screen 2 to become smaller, that is, the printed circuit board 10' will be set close to the display screen 2. This results in a smaller space between the printed circuit board 10' and the display screen 2 where the sound pickup channel 31 can be set. If the space between the printed circuit board 10' and the display screen 2 is excessively reduced, such as Figure 3 As shown in the figure, the first part 311 of the sound pickup channel 31 will intersect with the printed circuit board 10', which will damage the sound pickup loop of the microphone 30 and make it difficult to form a sealed sound pickup loop. Therefore, how to further reduce the space between the printed circuit board 10' and the display screen 2 without affecting the integrity of the sound pickup channel 31 has become a technical problem that those skilled in the art need to solve.

[0083] In order to accommodate a large number of internal components and structural parts in the limited internal space of the electronic device 1, it is necessary to optimize the structural space of the electronic device 1 and improve the space utilization of the electronic device 1 so that the whole device can be assembled in a smaller space. At the same time, it is necessary to avoid damaging the internal structure of the electronic device 1, so it is necessary to make full use of the internal space of the electronic device 1.

[0084] Based on this, in some embodiments, such as Figure 4A As shown, an electronic device 1 is provided, which mainly includes a display screen 2, a housing 3, a first circuit board 10 and a second circuit board 20.

[0085] The display screen 2 may be any of the above-mentioned display screens. Please refer to the above description about the display screen 2, which will not be repeated here.

[0086] The first circuit board 10 can be understood as the printed circuit board 10' in the above-mentioned electronic device 1. The second circuit board 20 can be understood as a circuit board provided with a microphone 30. The second circuit board 20 is electrically connected to the first circuit board 10, and is used to complete the signal transmission between the first circuit board 10 and the microphone 30. The electronic device 1 provided in the embodiment of the present application can also include multiple circuit boards, which can be reasonably overlapped and arranged as needed.

[0087] like Figure 4BAs shown, the first circuit board 10 has a first opening 101. The embodiment of the present application does not limit the shape of the first opening 101. The first opening 101 can be a hole or a Figure 4B The structure shown is connected to the boundary of the first circuit board 10.

[0088] like Figure 4C As shown, the second circuit board 20 is stacked with the first circuit board 10 , that is, the second circuit board 20 is arranged on a side of the first circuit board 10 away from the display screen 2 .

[0089] The second circuit board 20 is coupled to the first circuit board 10. For example, the second circuit board 20 can be coupled to the first circuit board 10 by welding, bonding or conductive adhesive connection in the overlapped area of ​​the first circuit board 10 and the second circuit board 20, thereby realizing signal transmission between the second circuit board 20 and the first circuit board 10.

[0090] like Figure 4C As shown, in the thickness direction of the second circuit board 20 , at least a portion of the second circuit board 20 overlaps with the first opening 101 .

[0091] The embodiment of the present application does not limit the area where the second circuit board 20 overlaps with the first opening 101. For example, the area where the second circuit board 20 overlaps with the first opening 101 may be a circle around the first opening 101.

[0092] Alternatively, illustratively, the area where the second circuit board 20 overlaps with the first opening 101 may also be a portion of the side edge of the first opening 101 .

[0093] In some embodiments, the second circuit board 20 further includes a microphone 30 , which is disposed on a side of the second circuit board 20 away from the first circuit board 10 .

[0094] In some embodiments, Figure 4C As shown, in the thickness direction of the second circuit board 20 , the microphone 30 overlaps with the first opening 101 in at least a portion of its area, so as to facilitate the communication between the microphone 30 and the sound pickup channel 31 .

[0095] like Figure 4D As shown, Figure 4D for Figure 4A A cross-sectional view along A1 - A2 . The second circuit board 20 has a sound pickup hole 202 , which penetrates the second circuit board 20 , and the projection of the sound pickup hole 202 in the thickness direction of the display screen 2 is located on the microphone 30 , and is connected to the sound inlet hole 301 .

[0096] That is, in the thickness direction of the second circuit board 20, the projection of the sound pickup hole 202 in the thickness direction of the display screen 2 is located at the first opening 101. The microphone 30 has a sound inlet hole 301 on one side close to the second circuit board 20. The sound inlet hole 301 is connected to the sound pickup hole 202.

[0097] A sound pickup channel 31 is provided in the shell 3 . The sound pickup channel 31 extends from the surface of the shell 3 to the inside of the shell 3 and is communicated with the sound pickup hole 202 .

[0098] That is to say, the sound inlet 301 on the microphone 30 is connected to the sound pickup hole 202, the sound pickup hole 202 is connected to the sound pickup channel 31, and the sound pickup hole 202 and the sound pickup channel 31 are sealed by the seal 11 to form a sealed sound pickup circuit from the outside of the shell 3 to the microphone 30, so that the microphone 30 can be connected to the external environment.

[0099] On this basis, if Figure 4D As shown, in the thickness direction of the second circuit board 20 , the sound pickup channel 31 , the second circuit board 20 and at least a portion of the display screen 2 overlap.

[0100] The sound pickup channel 31, the second circuit board 20 and the display screen 2 overlap in at least some areas. It can be understood that the projection of the sound pickup channel 31 in the thickness direction of the display screen 2, the projection of the second circuit board 20 in the thickness direction of the display screen 2 and the display screen 2 overlap in some areas.

[0101] The sound pickup channel 31 includes a first portion 311 extending from the surface of the housing 3 into the interior of the housing 3 and intersecting with the plane where the first circuit board 10 is located, and a second portion 312 communicating with the first portion 311 and the sound pickup hole 202 respectively.

[0102] Exemplarily, the first portion 311 of the sound pickup channel 31 may be inclined toward the display screen 2 .

[0103] Alternatively, illustratively, the first portion 311 of the sound pickup channel 31 may be tilted away from the display screen 2 .

[0104] Alternatively, illustratively, the first portion 311 of the sound pickup channel 31 is arranged in parallel with the display screen 2. This embodiment of the present application does not limit this.

[0105] The first portion 311 of the sound pickup channel 31 at least partially intersects with the plane where the first circuit board 10 is located, and a portion of the first portion 311 is located between the second circuit board 20 and the display screen 2, passing through the first opening 101 in the first circuit board 10. The first portion 311 of the sound pickup channel 31 is disposed in the housing 3, and the housing 3 is at least partially disposed in the first opening 101 of the first circuit board 10.

[0106] The embodiment of the present application does not limit the structure and material of the housing 3 . The housing 3 , the cover plate 5 , and the back cover 4 are combined to form a sealed housing to protect the display screen 2 .

[0107] The embodiment of the present application does not limit the location of the sound pickup channel 31 on the housing 3 . The sound pickup channel 31 , for example, may be located on a side of the electronic device 1 opposite to the side where the camera is located.

[0108] In addition, the embodiment of the present application does not limit the trajectory and shape of the sound pickup channel 31. The sound pickup channel 31 shown in the figure is only a schematic diagram and does not impose any limitation.

[0109] In the embodiment of the present application, a first opening 101 is formed on the first circuit board 10 to reserve a position for the sound pickup channel 31. Then, a second circuit board 20 coupled to the first circuit board 10 is arranged on the first circuit board 10, and a microphone 30 is arranged on the second circuit board 20, and the signal communication between the microphone 30 and the first circuit board 10 is realized through the second circuit board 20. It is equivalent to raising the microphone 30 to increase the setting space of the sound pickup channel 31. In this way, although the space between the first circuit board 10 and the display screen 2 is reduced after the electronic device 1 is made thinner, the first opening 101 is arranged on the first circuit board 10, and the microphone 30 is raised, which is equivalent to utilizing the space in the thickness direction of the electronic device 1, and increasing the space between the microphone 30 and the display screen 2. Therefore, even if the space between the display screen 2 and the first circuit board 10 is reduced, this arrangement of setting the first opening 101 on the first circuit board 10 and raising the microphone 30 will not affect the integrity and sealing of the sound pickup channel 31, so that the design requirements of the electronic device 1 can be achieved.

[0110] In some embodiments, the first circuit board 10 and the second circuit board 20 are connected by a reinforcement member, that is, a reinforcement member is provided at a portion where the first circuit board 10 and the second circuit board 20 are stacked.

[0111] Based on this, Figure 5A As shown, the first circuit board 10 includes at least one first hole 102, and the second circuit board 20 includes at least one second hole 201. The first hole 102 and the second hole 201 have at least a partial through area, and the through area of ​​the first hole 102 and the second hole 201 is located in the area where the first circuit board 10 and the second circuit board 20 are stacked.

[0112] In some embodiments, Figure 5A As shown, the first hole 102 is a blind hole, and the first hole 102 penetrates the first circuit board 10. In the embodiment of the present application, there is no limitation on the depth of the first hole 102 penetrating the first circuit board 10, as long as the first hole 102 at least penetrates a portion of the thickness of the first circuit board 10.

[0113] In other embodiments, Figure 5B As shown, the first hole 102 is a through hole, and the first hole 102 passes through the first circuit board 10. The first hole 102 made in this way has a simple process and is easy to manufacture.

[0114] Take the first hole 102 passing through the first circuit board 10 as an example. Figure 5B As shown, the first hole 102 and the second hole 201 constitute straight holes.

[0115] Or, for example, Figure 5C As shown, the first hole 102 and the second hole 201 constitute offset holes. At this time, the first hole 102 and the second hole 201 have a connecting area, which enables the pin 42 to be inserted into the first hole 102 and the second hole 201.

[0116] Or, for example, Figure 5D As shown, the first hole 102 and the second hole 201 constitute a stepped hole.

[0117] The embodiment of the present application does not limit the number and shape of the first holes 102 and the second holes 201 , and only two first holes 102 and two second holes 201 are taken as examples.

[0118] Regarding the structure of the reinforcement, such as Fig. 6A and Figure 6B As shown, the reinforcing member 40 includes a body 41 and a pin 42. The body 41 is disposed on the side of the second circuit board 20 away from the first circuit board 10, and the pin 42 is inserted into the first hole 102 and the second hole 201, and is fixedly connected to the first hole 102 and the second hole 201 respectively.

[0119] In some embodiments, Figure 6B As shown, the reinforcement member 40 is a screw.

[0120] That is, the body 41 of the reinforcement member 40 is the screw head of the screw, and the pin 42 of the reinforcement member 40 is the screw rod of the screw.

[0121] In this case, if Figure 6B As shown, the inner walls of the first hole 102 and the second hole 201 are both provided with threads.

[0122] The screws are inserted into the first hole 102 and the second hole 201 to combine the first circuit board 10 with the second circuit board 20 and realize a locking and fixed connection with the housing 3, thereby realizing a reliable connection between the first circuit board 10 and the second circuit board 20 and effectively preventing the first circuit board 10 from detaching from the second circuit board 20.

[0123] In this electronic device 1, the first circuit board 10 and the second circuit board 20 are fixedly connected using screws, which can strengthen the connection relationship between the first circuit board 10 and the second circuit board 20, and can effectively avoid the problem of the microphone 30 failing to function due to the first circuit board 10 and the second circuit board 20 being separated, thereby causing damage to the electronic device 1.

[0124] However, although the above-mentioned first circuit board 10 and second circuit board 20 fixedly connected by screws can alleviate the above-mentioned separation and failure problems, the introduction of screws will bring new problems.

[0125] like Figure 6C As shown, using screws to strengthen the connection between the first circuit board 10 and the second circuit board 20 requires a large area to be reserved at the overlapped portion of the first circuit board 10 and the second circuit board 20 for locking with the screws, which wastes the area of ​​the first circuit board 10 and the second circuit board 20. Fig.6D As shown, Fig.6D for Figure 6C In the cross-sectional view along B1-B2, the area between the second circuit board 20 and the screw head, and the area between the first circuit board 10 and the second circuit board 20 are unable to support the chip packaging structure, resulting in a waste of area of ​​the first circuit board 10 and the second circuit board 20, resulting in low integration of the first circuit board 10 and the inability of the electronic device 1 to achieve a lightweight design.

[0126] Moreover, if Fig.6D As shown, since the screws need to be locked in the threaded holes, the housing 3 needs to have a threaded hole structure so that the screws pass through the first circuit board 10 and are locked in the housing 3 with the second circuit board 20, which increases the complexity of the housing 3. In addition, since the preparation of the screws requires additional materials for the screws, and a separate process needs to be arranged for the locking of the screws, the cost of the electronic device 1 is increased.

[0127] In other embodiments, Fig. 7A As shown, the body 41 of the reinforcement member 40 is disposed above the microphone 30. In this case, the body 41 may be a shielding cover.

[0128] like Figure 7B and Figure 7C As shown, the shielding cover forms a groove, which is buckled on the second circuit board 20, and the microphone 30 is located in the groove formed by the shielding cover.

[0129] In some embodiments, the shielding cover serving as the main body 41 is welded to the second circuit board 20 and electrically connected to the second circuit board 20 , thereby being able to shield signals.

[0130] At this time, if Fig. 7AAs shown, the pin 42 is an extension of the side wall of the shielding cover. The pin 42 is inserted into the first hole 102 and the second hole 201 and is fixedly connected to the first hole 102 and the second hole 201 respectively.

[0131] in, Fig. 7A The shape of the shielding cover shown is only for illustration and is not intended to be limiting.

[0132] The shielding cover can be used to shield the electrical signal, prevent the external electromagnetic waves from affecting the microphone 30 in the body 41, and also shield the electromagnetic waves generated by the microphone 30 from radiating outward. Therefore, the pins 42 are provided on the shielding cover, which not only improves the connection effect between the first circuit board 10 and the second circuit board 20, but also does not increase the number of components of the electronic device 1.

[0133] In some other embodiments, Fig. 8A As shown, the body 41 of the reinforcement member 40 is sleeved on the outside of the microphone 30 and exposes a part of the side surface of the microphone 30. In this case, the body 41 can be a reinforcement plate, and the reinforcement plate has a second opening 402.

[0134] like Figure 8B As shown, the microphone 30 is located in the second opening 402 of the reinforcing plate. The embodiment of the present application does not limit the shape of the second opening 402, and it can be reasonably set according to needs.

[0135] At this time, the pin 42 is an extension of the reinforcing plate toward the second circuit board 20 , and the pin 42 is inserted into the first hole 102 and the second hole 201 , and is fixedly connected to the first hole 102 and the second hole 201 , respectively.

[0136] The reinforcing plate can be used to enhance the strength of the circuit board in the electronic device 1 and improve the firmness of the circuit board. Therefore, making the pins 42 on the reinforcing plate can improve the connection effect between the first circuit board 10 and the second circuit board 20 without increasing the number of components of the electronic device 1.

[0137] In some other embodiments, Fig.9A As shown, the body 41 of the reinforcement member 40 is disposed around the periphery of the microphone 30. In this case, the body 41 may be a gasket, and the gasket has a third opening 403.

[0138] like Fig. 9B As shown, the microphone 30 is located in the third opening 403 on the gasket. The embodiment of the present application does not limit the shape of the third opening 403, and it can be reasonably set according to needs.

[0139] At this time, the pins 42 are extensions of the gasket on both sides toward the second circuit board 20 , and the pins 42 are inserted into the first hole 102 and the second hole 201 , and are fixedly connected to the first hole 102 and the second hole 201 , respectively. .

[0140] The gasket can be used to improve the uneven thickness of the circuit board in the electronic device 1. Therefore, the pins 42 are formed on the gasket, which not only improves the connection effect between the first circuit board 10 and the second circuit board 20, but also does not increase the number of components of the electronic device 1.

[0141] The reinforcing members 40 such as the shielding cover, the reinforcing plate and the gasket are all inherent structures on the circuit board. On the one hand, there is no need to add additional structures and corresponding processing steps, saving costs and time required for assembly processing. On the other hand, there is no need to reserve an area for the additional structure to cooperate with the first circuit board 10 and the second circuit board 20, which can avoid wasting the area of ​​the first circuit board 10 and the second circuit board 20, thereby minimizing the area of ​​the second circuit board 20, saving layout space, and further improving the area utilization of the first circuit board 10 layout, thereby improving the integration of the electronic device 1, further improving the space utilization of the electronic device 1, and realizing the light and thin design of the electronic device 1.

[0142] Regarding the position of the pin 42 on the body 41, in some embodiments, as shown in FIG. Fig.9A As shown, the pin 42 is located at the edge of the body 41 and at the side of the body 41 facing the second circuit board 20 .

[0143] In some other embodiments, the pins 42 are located in the middle area of ​​the body 41 and on the side of the body 41 facing the second circuit board 20 .

[0144] The embodiment of the present application does not limit the number of the pins 42. The reinforcement member 40 includes a plurality of pins 42. The plurality of pins 42 are disposed on different sides of the body 41.

[0145] For example, Fig. 7A As shown, the reinforcement member 40 includes two pins 42 .

[0146] Correspondingly, the first circuit board 10 includes two first holes 102 , and the second circuit board 20 includes two second holes 201 .

[0147] Alternatively, for example, the reinforcing member 40 includes three or four pins 42. This embodiment of the present application does not limit this, and it can be reasonably configured according to needs.

[0148] Regarding the relative position of the pins 42, in some embodiments, as Fig.9A As shown, the plurality of pins 42 of the reinforcement member 40 are disposed on different sides of the body 41 .

[0149] Exemplarily, the reinforcement member 40 includes two pins 42. Fig.9A As shown, the two pins 42 may be located on opposite sides of a diagonal line of the body 41 .

[0150] Alternatively, illustratively, the two pins 42 may also be symmetrical about the middle of the body 41 .

[0151] Alternatively, for example, the two pins 42 may also be located on two adjacent sides of the body.

[0152] The pins 42 are arranged on opposite sides of the body 41 , which can improve the pulling force between the pins 42 of the reinforcement member 40 and the first circuit board 10 and the second circuit board 20 , thereby improving the connection force between the first circuit board 10 and the second circuit board 20 .

[0153] Regarding the shape of the pin 42, in some embodiments, as Fig. 10A As shown, the pin 42 is in a sheet shape, and the bottom of the pin 42 has a chamfer 421 .

[0154] Regarding the structure of the chamfer 421, for example, Fig. 10A As shown, the chamfer surface a of the chamfer 421 is a curved surface.

[0155] Or, for example, Fig. 10B As shown, the chamfered surface a of the chamfer 421 is a plane.

[0156] The embodiments of the present application do not limit this, and can be reasonably set according to needs.

[0157] In addition, the embodiment of the present application does not limit the size of the chamfer angle α of the chamfer 421, and the chamfer angle α can range from 30° to 70°. For example, the chamfer angle α can be 45°, 60° or 63°. The chamfer angle α can be understood as the angle between the chamfer surface a and the side of the pin 42 away from the body 41.

[0158] The chamfer 421 plays a guiding role. Therefore, by providing the chamfer 421 at the bottom of the pin 42 , the pin 42 can be easily inserted into the first hole 102 and the second hole 201 .

[0159] According to the different structures of the first hole 102, the pin 42 is fixedly connected to the first hole 102 and the second hole 201 in different ways. In some embodiments, the first hole 102 is a through hole. In other embodiments, the first hole 102 is a blind hole.

[0160] Regarding the manner in which the pin 42 is fixedly connected to the first hole 102 and the second hole 201, in some embodiments, such as Fig.11A and Fig. 11B As shown, the first hole 102 is a through hole, that is, the first hole 102 passes through the first circuit board 10. The bottom of the pin 42 may also have a barb 422, which passes through the first hole 102 and is snap-connected with the first circuit board 10.

[0161] The pin 42 is a forked structure, which shrinks inward when an external force is applied. A barb 422 is provided on the side of the forked structure away from the body 41. The forked structure is applied inward, so that the barb 422 passes through the second hole 201 and the first hole 102, and then the external force is removed to restore the forked structure to its original state. At this time, the barb 422 is snap-fitted to the side of the first circuit board 10 away from the second circuit board 20.

[0162] In this way, the barb 422 only needs to be able to pass through the first hole 102, and the requirement for the dimensional accuracy of the matching between the pin 42 and the first hole 102 is relatively low, and the processing cost is low.

[0163] In other embodiments, Fig. 11C As shown, the first hole 102 can be a through hole or a blind hole. The pin 42 penetrates the first hole 102 and the second hole 201 and is respectively connected with the first circuit board 10 and the second circuit board 20 by interference fit.

[0164] In some other embodiments, Fig. 12A and Fig. 12B As shown, the first hole 102 can be a through hole or a blind hole. The pin 42 is welded or bonded to the first hole 102 and the second hole 201 respectively, that is, the pin 42 is fixedly connected to the first hole 102 and the second hole 201 through solder or adhesive 50, and the pin 42 is welded or bonded to the first circuit board 10 and the second circuit board 20 respectively, so that the pin 42 is fixedly connected to the first circuit board 10 and the second circuit board 20 respectively through solder or adhesive 50, wherein the solder can be solder.

[0165] In this way, the pin 42 is welded or bonded to the first circuit board 10 and the second circuit board 20 respectively to achieve a fixed connection, which can increase the pulling force between the pin 42 of the reinforcement 40 and the first circuit board 10 and the second circuit board 20, thereby increasing the connection force between the first circuit board 10 and the second circuit board 20.

[0166] Exemplarily, the pins 42 are respectively soldered to the first circuit board 10 and the second circuit board 20. At this time, the soldering material may include solder (eg, tin).

[0167] Alternatively, illustratively, the pins 42 are respectively bonded to the first circuit board 10 and the second circuit board 20. In this case, the bonding material may include an adhesive.

[0168] The exposed copper portions in the first hole 102 of the first circuit board 10 and the second hole 201 of the second circuit board 20 facilitate the attachment of tin.

[0169] On this basis, in some embodiments, when the first hole 102 is a through hole, illustratively, as Fig. 12CAs shown, the solder or adhesive 50 overflows the first hole 102 and the second hole 201 , covering the surfaces of the first circuit board 10 and the second circuit board 20 .

[0170] Or, for example, Fig.12D As shown, the solder or adhesive 50 overflows the second hole 201 and covers the surface of the second circuit board 20 .

[0171] Or, for example, Fig.12E As shown, the solder or adhesive 50 overflows the first hole 102 and covers the surface of the first circuit board 10 .

[0172] This application does not limit this, and it can be set reasonably according to needs.

[0173] In some other embodiments, when the first hole 102 is a blind hole, Fig.12F As shown, at one end close to the second circuit board 20 , the solder or adhesive 50 overflows the second hole 201 and covers the surface of the second circuit board 20 .

[0174] Part of the solder or adhesive 50 overflows the first hole 102 and covers the surfaces of the first circuit board 10 and the second circuit board 20 , thereby improving the connection force between the first circuit board 10 and the second circuit board 20 .

[0175] In some embodiments, Fig.13A As shown, the surface of the pin 42 of the reinforcement member 40 is at least partially uneven.

[0176] For example, Fig.13A As shown, the surface b1 and the surface b2 of the pin 42 are uneven.

[0177] Alternatively, illustratively, the side surfaces of the pin 42 where they intersect the surface b1 and the surface b2 are uneven.

[0178] Alternatively, illustratively, the bottom surface of the pin 42 which is away from the body 41 and intersects the surface b1 and the surface b2 is uneven.

[0179] In the embodiment of the present application, each surface of the pin 42 may be uneven, and the embodiment of the present application does not limit this.

[0180] In this way, the solder or adhesive 50 wraps the uneven surface of the pin 42, which can further improve the pulling force between the pin 42 of the reinforcement 40 and the first circuit board 10 and the second circuit board 20, thereby improving the connection force between the first circuit board 10 and the second circuit board 20.

[0181] In some embodiments, Fig. 13B As shown, the pin 42 of the reinforcement member 40 further has a third hole 423 .

[0182] For example, Fig. 13C As shown, Fig. 13C for Fig. 13B The third hole 423 may be a through hole penetrating the side surface of the pin 42 .

[0183] Alternatively, illustratively, the third hole 423 may also be a blind hole penetrating into the side surface of the pin 42 .

[0184] The embodiment of the present application does not limit the shape and number of the third hole 423. There may be multiple third holes 423 on the side of the pin 42. The third hole 423 may also be a circular hole or a square hole.

[0185] like Fig.14 As shown, the solder or adhesive 50 also fills the third hole 423 , which can further increase the pulling force between the pin 42 of the reinforcement 40 and the first circuit board 10 and the second circuit board 20 , thereby increasing the connection force between the first circuit board 10 and the second circuit board 20 .

[0186] The electronic device 1 provided in the embodiment of the present application forms a first opening 101 on the first circuit board 10 to reserve a position for the sound pickup channel 31. Then, a second circuit board 20 coupled to the first circuit board 10 is arranged on the first circuit board 10, and a microphone 30 is arranged on the second circuit board 20, and the signal communication between the microphone 30 and the first circuit board 10 is realized through the second circuit board 20. It is equivalent to raising the microphone 30 to increase the setting space of the sound pickup channel 31. In this way, although the space between the first circuit board 10 and the display screen 2 is reduced after the electronic device 1 is made thinner, the first opening 101 is arranged on the first circuit board 10, and the microphone 30 is raised, which is equivalent to utilizing the space in the thickness direction of the electronic device 1, and increasing the space between the microphone 30 and the display screen 2. Therefore, even if the space between the display screen 2 and the first circuit board 10 is reduced, this arrangement of setting the first opening 101 on the first circuit board 10 and raising the microphone 30 will not affect the integrity and sealing of the sound pickup channel 31, so that the design requirements of the electronic device 1 can be achieved.

[0187] Moreover, by using the pins 42 on the reinforcement 40 to achieve a fixed connection with the first circuit board 10 and the second circuit board 20, the pulling force between the pins 42 of the reinforcement 40 and the first circuit board 10 and the second circuit board 20 can be improved, thereby improving the connection force between the first circuit board 10 and the second circuit board 20.

[0188] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: Display screen (2), first circuit board (10), second circuit board (20), housing (3), reinforcement member (40); The first circuit board (10) comprises a first opening (101) and a first hole (102); The second circuit board (20) comprises a microphone (30), a second hole (201) and a sound pickup hole (202); the second circuit board (20) is stacked with the first circuit board (10) and coupled to the first circuit board (10); in the thickness direction of the second circuit board (20), at least a portion of the second circuit board (20) overlaps with the first opening (101); The reinforcing member (40) comprises a body (41) and a pin (42), wherein the pin (42) is inserted into the first hole (102) and the second hole (201), and is fixedly connected to the first hole (102) and the second hole (201) respectively; The housing (3) comprises a sound pickup channel (31); the microphone (30) picks up sound through the sound pickup channel (31) and the sound pickup hole (202); the sound pickup channel (31) comprises a first portion (311) extending from the surface of the housing (3) into the interior of the housing (3) and intersecting with the plane where the first circuit board (10) is located; In the thickness direction of the second circuit board (20), the sound pickup channel (31), the second circuit board (20) and at least a partial area of ​​the display screen (2) all overlap.

2. The electronic device according to claim 1, characterized in that: The first part (311) is inclined toward the display screen (2).

3. The electronic device according to claim 1, characterized in that: The body (41) is arranged on a side of the second circuit board (20) away from the first circuit board (10); the body (41) is covered at least partially above the microphone (30); and the body (41) is welded to the second circuit board (20).

4. The electronic device according to claim 1, characterized in that: The body (41) is arranged on a side of the second circuit board (20) away from the first circuit board (10); the body (41) surrounds at least part of the periphery of the microphone (30).

5. The electronic device according to claim 1, characterized in that: The pin (42) is welded or bonded to the first hole (102) and the second hole (201) respectively.

6. The electronic device according to claim 1, characterized in that: The surface of the pin (42) is at least partially uneven.

7. The electronic device according to claim 1, characterized in that: The pin (42) also has a third hole (423), and the first hole (102) and the second hole (201) are connected to the third hole (423) by solder or adhesive.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The plug pin (42) is in a sheet shape, and the bottom of the plug pin (42) has a chamfer (421).

9. The electronic device according to any one of claims 1 to 7, characterized in that: The reinforcing member (40) includes a plurality of pins (42), and the plurality of pins (42) are arranged on different sides of the body (41).

10. The electronic device (1) according to any one of claims 1 to 7, characterized in that: The first hole (102) passes through the first circuit board (10).

11. The electronic device according to claim 10, characterized in that: The bottom of the pin (42) is provided with a barb (422), and the barb (422) passes through the first hole (102) and the second hole (201) and is snap-connected with the first circuit board (10).

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