PCB manufacturing method and PCB

Abstract

The invention relates to the technical field of circuit board manufacturing, and discloses a PCB manufacturing method and a PCB.The PCB manufacturing method comprises the steps that a PCB is provided, the PCB comprises a base material, the base material is provided with a connecting face, the connecting face is provided with a circuit, an OSP bonding pad and a to-be-plated part, the PCB is provided with a solder mask layer, the solder mask layer is provided with a first window, a sunken part and a second window, the OSP bonding pad is exposed out of the first window, and the OSP bonding pad is exposed out of the sunken part; a first character is arranged in the concave part, and the second window exposes the to-be-plated part; a protective layer is arranged on the solder mask layer, the protective layer shields the first window and shields the sunken part, the protective layer and the first character are arranged at intervals in the direction perpendicular to the connecting face, the protective layer is provided with a third window, and the to-be-plated part is exposed out of the third window; performing electrogilding treatment on the to-be-plated part; and removing the protective layer. According to the PCB manufacturing method and the PCB provided by the invention, the problem that the OSP bonding pad is easily gilded after the gold finger and the like are subjected to electrogilding in the related technology can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board manufacturing, and particularly to a method for manufacturing a PCB and a PCB. Background Art

[0002] With the rapid development of electronic technology, a single surface treatment process on the same PCB (Printed Circuit Board) can no longer meet the requirements. A selective plating board designed with electroplated gold plus OSP (Organic Solderability Preservatives) can balance functions and costs, and can meet the products with requirements for both plugging and unplugging and soldering at the same time.

[0003] Among them, when electroplating gold on gold fingers, etc. on a selective plating board with electroplated gold plus OSP, the OSP pads need to be covered with an anti-electroplated gold dry film to prevent gold plating on the OSP pads. However, when printing characters, the character ink is prone to cross-linking reaction with the anti-electroplated gold dry film during the exposure of the anti-electroplated gold dry film, and they are integrated together. In the subsequent film stripping process, the anti-electroplated gold dry film on the characters cannot be stripped cleanly, resulting in blurred characters and scrapping.

[0004] The conventional solution is to open a window in the dry film at the position of the characters to expose the characters. Although it can avoid the cross-linking reaction between the characters and the anti-electroplated gold dry film during the exposure of the dry film and their integration, after electroplating gold on gold fingers, etc., it is still easy to cause gold plating on the OSP pads. Summary of the Invention

[0005] The present application provides a method for manufacturing a PCB and a PCB, which can improve the problem that gold plating on the OSP pads is likely to occur after electroplating gold on gold fingers, etc. in the related art.

[0006] In a first aspect, an embodiment of the present application provides a method for manufacturing a PCB, including:

[0007] Providing a PCB board, the PCB board includes a substrate, the substrate has a connection surface, a circuit, an OSP pad, and a part to be plated are arranged on the connection surface, the circuit, the OSP pad, and the part to be plated are distributed at intervals, a solder mask layer is arranged on the PCB board, the solder mask layer covers the circuit, the solder mask layer is provided with a first window, a recessed part, and a second window, the first window exposes the OSP pad, the recessed part is located between the circuit and the OSP pad, a first character is arranged in the recessed part, and the second window exposes the part to be plated;

[0008] A protective layer is provided on the solder mask layer. The protective layer shields the first opening and the recess, and the protective layer and the first character are spaced apart in a direction perpendicular to the connection surface. The protective layer is provided with a third opening, and the third opening exposes the portion to be plated;

[0009] Electroplate the portion to be plated with gold;

[0010] Remove the protective layer.

[0011] In some embodiments, before providing the PCB board, the PCB manufacturing method includes:

[0012] Provide a substrate, and the substrate includes the base material;

[0013] Provide the solder mask layer on the substrate;

[0014] Provide the first character in the recess.

[0015] In some embodiments, when providing the solder mask layer on the substrate, a printing screen with 36T - 43T is used; or, the solder mask layer is formed by printing the solder mask ink on the substrate 2 - 3 times.

[0016] In some embodiments, when providing the first character in the recess, the dotting range is 20% - 50%.

[0017] In some embodiments, the distance between the protective layer and the first character in a direction perpendicular to the connection surface is L1, and L1 ≥ 0.005 mm.

[0018] In some embodiments, the solder mask layer includes a planar layer. The recess is recessed towards the connection surface compared to the planar layer. A second character is provided above the planar layer, and the second character is connected to the first character; when providing the protective layer on the solder mask layer, the protective layer is provided with a fourth opening, and the fourth opening exposes the second character. At the connection between the second character and the first character, the distance between the circuit and the protective layer that shields the recess in a direction parallel to the connection surface is W1, and W1 is 0.05 mm - 0.10 mm.

[0019] In some embodiments, the maximum height of the solder mask layer covering the circuit layer compared to the bottom surface of the recess is W2, and W2 is 0.020 mm - 0.025 mm. The thickness of the first character is H2, and H2 is 0.010 mm - 0.015 mm.

[0020] In some embodiments, the protective layer is a dry film.

[0021] In some of these embodiments, the portion to be plated includes pads and / or gold fingers.

[0022] In a second aspect, an embodiment of the present application provides a PCB manufactured by the PCB manufacturing method as described in the first aspect.

[0023] The beneficial effect of the PCB manufacturing method provided by the embodiments of the present application is as follows: Since the circuit, the OSP pad, and the portion to be plated are spaced apart, the solder mask covers the circuit, the first opening of the solder mask exposes the OSP pad, the recess is located between the circuit and the OSP pad, and the first character is provided in the recess. Therefore, when a protective layer is provided on the solder mask, when the protective layer shields the recess, the protective layer can be closely attached to the solder mask above the circuit and the solder mask around the OSP pad and its surroundings. Thus, when electroplating gold on the portion to be plated, the protective layer can provide good protection for the OSP pad and prevent gold from plating on the OSP pad. Moreover, since the protective layer and the first character are spaced apart in the direction perpendicular to the connection surface, the protective layer will not react crosslinkedly with the first character in the recess and merge into one body.

[0024] For the beneficial effects of the PCB provided by the present application compared with the prior art, reference can be made to the beneficial effects of the PCB manufacturing method provided by the present application compared with the prior art, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0026] Figure 1 is a partial top view of a PCB in the related art;

[0027] Figure 2 is the Figure 1 cross-sectional view of the PCB shown after covering with a dry film;

[0028] Figure 3 is the Figure 2 cross-sectional view of the PCB shown after electroplating gold;

[0029] Figure 4 is the flowchart of the PCB manufacturing method in one embodiment of the present application;

[0030] Figure 5 is a partial top view of a substrate in one embodiment of the present application;

[0031] Figure 6 It is a schematic diagram of setting a protective layer on the solder mask layer of the substrate shown in Figure 5 ;

[0032] Figure 7 It is Figure 6 a cross-sectional view of the substrate and the protective layer shown in

[0033] Figure 8 It is a schematic diagram of removing the protective layer shown in Figure 7 ;

[0034] The meanings of the marks in the figure are as follows:

[0035] 1. Substrate; 2. OSP pad; 3. Circuit; 4. Solder mask layer; 5. Character; 6. Solder mask opening; 7. Pit; 8. Dry film; 9. Nickel-gold layer;

[0036] 10. Substrate; 11. Connection surface; 20. Circuit; 30. OSP pad; 40. Solder mask layer; 41. First opening; 42. Depressed part; 50. First character; 51. Second character; 60. Protective layer. Specific embodiments

[0037] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0039] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0040] References to "one embodiment", "some embodiments", or "an embodiment" in the description of the present application mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. In addition, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0041] To illustrate the technical solutions of the present application, the following will be described in conjunction with specific drawings and embodiments.

[0042] With the rapid development of electronic technology, a single surface treatment process on the same PCB can no longer meet the requirements. However, a selective board with gold plating plus OSP design can take into account both functions and costs, and can simultaneously meet the products with plugging and unplugging requirements and welding requirements.

[0043] Among them, when electroplating gold on the gold fingers of a selective board with gold plating plus OSP, the OSP pads need to be covered with an anti-gold plating dry film to prevent gold from plating on the OSP pads. When making the printed characters during gold plating, since the characteristics of the printed character ink are UV (Ultraviolet) curable ink and non-thermosetting ink, using the method of UV light curing plus post-baking after printing the characters cannot completely cure it. Generally, only about 80% of the curing degree of the character ink can be achieved, and some components in the character ink cannot be completely cured, and they are crosslinked with the anti-gold plating dry film during exposure and integrated into one body. In the subsequent film stripping process, the dry film on the characters cannot be stripped clean, resulting in blurred characters and scrapping.

[0044] Please refer to Figure 1 、 Figure 2 and Figure 3 , Figure 1 which is a partial top view of a PCB in the related art, Figure 2 is a cross-sectional view of the PCB shown in Figure 1 covered with a dry film 8, Figure 3 is a cross-sectional view of the PCB shown in Figure 2 after gold plating treatment.

[0045] In the related art, an OSP pad 2 and a circuit 3 are provided on a substrate 1, a solder mask layer 4 is provided on the circuit 3, the solder mask layer 4 covers the circuit 3, and a solder mask opening 6 exposing the OSP pad 2 is provided on the solder mask layer 4. Characters 5 are located on the solder mask layer 4 above the circuit 3. Since there is a height difference between the OSP pad 2 and the circuit 3, there is a pit 7 in the solder mask layer 4 between the OSP pad 2 and the circuit 3.

[0046] To avoid the ink of character 5 crosslinking with and integrating into the dry film 8, resulting in incomplete stripping of the dry film 8, a conventional solution is to design the dry film 8 at the position of character 5 not to be exposed, that is, to make a window in the dry film 8. The window in the dry film 8 exposes character 5, and no crosslinking reaction will occur between the dry film 8 and character 5. When developing, the ink on character 5 can be stripped off. However, when character 5 is designed at the position of the circuit 3 (including the position directly above the circuit 3 and the position at the upper edge of the circuit 3), since the solder mask 4 between the OSP pad 2 and the circuit 3 has a pit 7, this will cause the dry film 8 not to fit tightly at the pit 7, and there is a gap between the dry film 8 and the solder mask 4. During the pretreatment before gold plating, the chemical solution seeps into the dry film 8 along the gap at the window of the dry film 8, resulting in the warping or peeling off of the dry film 8, and thus forming a nickel-gold layer 9 on the OSP pad 2 at the window of the dry film 8 during gold plating of the gold finger, etc., that is, gold on the OSP pad 2.

[0047] In addition, when making a window in the dry film 8 at the position of character 5, in order to ensure the appearance of the gold finger, the surface of the PCB will be sandblasted after the dry film 8 is developed. After sandblasting, the dry film 8 at the edge of character 5 will be damaged, resulting in the damaged dry film 8 adhering to the unplated finger, causing the position where the finger adheres to the dry film 8 to be anti-plated, and thus resulting in the exposure of copper on the gold finger. Moreover, sandblasting may also damage the dry film 8 on the OSP pad 2, resulting in gold on the OSP pad 2.

[0048] In view of this, the present application provides a PCB manufacturing method and a PCB. Since the circuit, the OSP pad, and the part to be plated are spaced apart, the solder mask covers the circuit, the first window of the solder mask exposes the OSP pad, the recessed part is located between the circuit and the OSP pad, and the first character is arranged in the recessed part, a protective layer is provided on the solder mask. When the protective layer shields the recessed part, the protective layer can closely adhere to the solder mask above the circuit and the solder mask around the OSP pad and its surroundings. Therefore, when performing gold plating treatment on the part to be plated, the protective layer can better protect the OSP pad and avoid gold on the OSP pad. And since the protective layer and the first character are spaced apart in the direction perpendicular to the connection surface, the protective layer will not crosslink with and integrate into the first character in the recessed part.

[0049] Please refer to Figures 4 to 8 , Figure 4 which is a flowchart of the PCB manufacturing method in one embodiment of the present application, Figure 5 which is a partial top view of the substrate in one embodiment of the present application, Figure 6 which is a schematic diagram of setting the protective layer 60 on the solder mask 40 of the substrate shown in Figure 5 , Figure 7 which is Figure 6 a cross-sectional view of the substrate and the protective layer 60 shown in Figure 8 which is to remove Figure 7Schematic diagram of the protective layer 60 shown

[0050] In a first aspect, an embodiment of the present application provides a PCB manufacturing method, including:

[0051] S100: Provide a PCB board, the PCB board includes a substrate 10, the substrate 10 has a connection surface 11, on the connection surface 11, there are provided circuits 20, OSP pads 30 and parts to be plated (not shown in the figure), the circuits 20, OSP pads 30 and parts to be plated are spaced apart, on the PCB board, there is provided a solder mask layer 40, the solder mask layer 40 covers the circuits 20, the solder mask layer 40 is provided with a first opening 41, a recess 42 and a second opening (not shown in the figure), the first opening 41 exposes the OSP pad 30, the recess 42 is located between the circuit 20 and the OSP pad 30, a first character 50 is provided in the recess 42, and the second opening exposes the part to be plated.

[0052] Specifically, one or more OSP pads 30 can be provided, and some of the OSP pads 30 can be connected to some of the circuits 20 and electrically conductive. The part to be plated can include pads to be plated and / or gold fingers to be plated.

[0053] S200: Provide a protective layer 60 on the solder mask layer 40, the protective layer 60 shields the first opening 41 and shields the recess 42, and the protective layer 60 and the first character 50 are spaced apart in a direction perpendicular to the connection surface 11, the protective layer 60 is provided with a third opening (not shown in the figure), and the third opening exposes the part to be plated.

[0054] Specifically, the protective layer 60 can be set as a dry film, which is simple and convenient in structure. The protective layer 60 can also be set as other materials. A conventional laminating machine (non-vacuum laminating machine) can be used for laminating to avoid direct contact between the dry film and the first character 50 in the recess 42 during laminating, and corresponding materials are used for exposure to ensure that the dry film corresponding to the recess 42 does not have an opening, avoiding breakage of the dry film due to suspension. The exposed dry film is developed to remove the unexposed dry film and form a third opening.

[0055] Since the first character 50 is provided inside the recess 42, the protective layer 60 can closely adhere to the solder mask layer 40 above the circuit 20 and the solder mask layer 40 around the OSP pad 30 to better protect the OSP pad 30.

[0056] By controlling the thickness of the solder mask layer 40 and the thickness of the first character 50, the protective layer 60 that shields the recess 42 will not directly contact the character, that is, the protective layer 60 and the first character 50 are spaced apart in a direction perpendicular to the connection surface 11. This part of the protective layer 60 is not opened, and there will be no problem of breakage of the protective layer 60 caused by suspension after opening. The rest of the position is closely combined with the solder mask layer 40, so there will be no situation of breakage of the protective layer 60.

[0057] Since the protective layer 60 and the first character 50 are spaced apart in a direction perpendicular to the connection surface 11, the protective layer 60 will not react crosslinkedly with the first character 50 in the recess 42 and merge into one body.

[0058] S300: Electroplate the part to be plated with gold.

[0059] Specifically, the part to be plated that is not covered by the protective layer 60 is electroplated with a nickel-gold layer of a specified thickness through a chemical reaction, and the OSP pad 30 covered by the protective film cannot be electroplated with the nickel-gold layer.

[0060] S400: Remove the protective layer 60.

[0061] Specifically, when the protective layer 60 is set as a dry film, the dry film can be washed off cleanly by an organic stripping solution, and there will be no problem of incomplete stripping.

[0062] As can be seen from the above, in the PCB manufacturing method provided by the embodiment of the present application, since the circuit 20, the OSP pad 30, and the part to be plated are spaced apart, the solder mask layer 40 covers the circuit 20, the first opening 41 of the solder mask layer 40 exposes the OSP pad 30, the recess 42 is located between the circuit 20 and the OSP pad 30, and the first character 50 is arranged in the recess 42. Therefore, when the protective layer 60 is arranged on the solder mask layer 40 and the protective layer 60 shields the recess 42, the protective layer 60 can closely adhere to the solder mask layer 40 above the circuit 20 and the solder mask layer 40 around the OSP pad 30. Thus, when electroplating the part to be plated with gold, the protective layer 60 can better protect the OSP pad 30 and prevent gold plating on the OSP pad 30. Moreover, since the protective layer 60 and the first character 50 are spaced apart in a direction perpendicular to the connection surface 11, the protective layer 60 will not react crosslinkedly with the first character 50 in the recess 42 and merge into one body.

[0063] The PCB manufacturing method provided by the embodiment of the present application solves the problem of incomplete stripping of the dry film on the first character 50, as well as the problems of exposed copper on the gold finger and gold plating on the OSP pad 30, by adjusting the position of the first character 50 and making a non-opening design for the dry film between the circuit 20 and the OSP pad 30 to avoid the problem of dry film breakage caused by dry film opening.

[0064] Optionally, after arranging the protective layer 60 on the solder mask layer 40 and before electroplating the part to be plated with gold, the part to be plated that is not covered by the protective layer 60 can be sandblasted, such as using materials such as emery for sandblasting, to clean the surface of the part to be plated and increase the surface roughness of the part to be plated, facilitating electroplating with a nickel-gold layer of a specified thickness.

[0065] Optionally, after removing the protective layer 60, processes such as routing the dry film, chamfering, electrical testing, OSP, FQC (Final Quality Control), FQA (Factory Quality Assurance), and packaging can be continued.

[0066] In this embodiment, before providing the PCB board, the PCB manufacturing method includes:

[0067] First, provide a substrate, which includes a base material 10.

[0068] Specifically, the substrate may have already undergone processes such as cutting, inner layer circuit 20, AOI (Automated Optical Inspection), lamination, drilling targets, milling edges, drilling holes, electroplating holes, and circuit manufacturing.

[0069] Second, apply a solder mask layer 40 on the substrate.

[0070] Then, set a first character 50 in the recess 42.

[0071] By adopting the above solution, it is possible to relatively conveniently set the first character 50 in the recess 42.

[0072] Optionally, when applying the solder mask layer 40 on the substrate, a printing screen with 36T - 43T is used; alternatively, the solder mask ink is printed on the substrate 2 - 3 times to form the solder mask layer 40.

[0073] With such settings, using a screen with a smaller T number or increasing the number of ink printing times during printing can both appropriately increase the thickness of the solder mask layer 40 by adjusting the solder mask printing parameters, ensuring that the protective layer 60 and the first character 50 are spaced apart in the direction perpendicular to the connection surface 11.

[0074] Optionally, when setting the first character 50 in the recess 42, the inkjet dotting is set, and the dotting range is 20% - 50%, such as 20%, 25%, 30%, 35%, 45%, or 50%, etc.

[0075] With such settings, it is possible to conveniently control the thickness of the first character 50, ensuring that the protective layer 60 and the first character 50 are spaced apart in the direction perpendicular to the connection surface 11.

[0076] Please refer to Figure 7 , in this embodiment, the distance between the protective layer 60 and the first character 50 in the direction perpendicular to the connection surface 11 is L1, and L1 ≥ 0.005 mm, such as 0.005 mm, 0.006 mm, or 0.007 mm, etc.

[0077] By adopting the above solution, it is possible to ensure that there is a certain distance between the protective layer 60 and the first character 50 in the direction perpendicular to the connection surface 11, avoiding the cross-linking reaction between the protective layer 60 and the first character 50 and their integration into one body.

[0078] Optionally, the solder mask layer 40 includes a planar layer (not shown in the figure). The recessed portion 42 is recessed towards the connection surface 11 compared to the planar layer. A second character 51 is provided above the planar layer, and the second character 51 is connected to the first character 50. When the protective layer 60 is provided on the solder mask layer 40, the protective layer 60 is provided with a fourth opening window that exposes the second character 51. At the connection between the second character 51 and the first character 50, the distance between the circuit line 20 and the protective layer 60 covering the recessed portion 42 in the direction parallel to the connection surface 11 is W1, and W1 is 0.05 mm - 0.10 mm, such as 0.05 mm, 0.07 mm, or 0.10 mm, etc.

[0079] With such a setting, it is possible to avoid the cross-linking reaction between the protective layer 60 and the second character 51 and their integration into one body due to the too-close distance between the protective layer 60 and the second character 51.

[0080] It should be noted that the second character 51 and the first character 50 can form a character frame. The function of the character frame is to identify the OSP pad 30, and there is no strict position tolerance for the character frame. It only needs to ensure that it plays the role of identification, that is, the selected area does not need to be adjusted.

[0081] The protective layer 60 does not cover the second character 51, and at the connection between the second character 51 and the first character 50, the protective layer 60 and the second character 51 have a sufficient distance.

[0082] Optionally, the maximum height of the solder mask layer 40 covering the circuit line 20 compared to the bottom surface of the recessed portion 42 is W2, and W2 is 0.020 mm - 0.025 mm, such as 0.020 mm, 0.022 mm, 0.024 mm, or 0.025 mm, etc. The thickness of the first character 50 is H2, and H2 is 0.010 mm - 0.015 mm, such as 0.010 mm, 0.012 mm, 0.014 mm, or 0.015 mm, etc.

[0083] With such a setting, it is possible to ensure that there is a certain distance between the protective layer 60 and the first character 50 in the direction perpendicular to the connection surface 11, avoiding the cross-linking reaction between the protective layer 60 and the first character 50 and their integration into one body.

[0084] It can be understood that W2 is equal to the sum of H2, L1, and the thickness of the protective layer 60. If the distance between the protective layer 60 covering the recessed portion 42 and the bottom surface of the recessed portion 42 is H1, then H1 = H2 + L1.

[0085] In a second aspect, an embodiment of the present application provides a PCB, which is processed by the PCB manufacturing method as described in the first aspect.

[0086] For the PCB provided by the embodiment of the present application, since the circuit 20, the OSP pad 30, and the plating portion to be plated are spaced apart, the solder mask layer 40 covers the circuit 20, the first opening 41 of the solder mask layer 40 exposes the OSP pad 30, the recessed portion 42 is located between the circuit 20 and the OSP pad 30, and the first character 50 is provided in the recessed portion 42. Therefore, when the protective layer 60 is provided on the solder mask layer 40 and the protective layer 60 shields the recessed portion 42, the protective layer 60 can be closely attached to the solder mask layer 40 above the circuit 20 and the solder mask layer 40 around the OSP pad 30 and its surroundings. Thus, when electroplating gold on the plating portion to be plated, the protective layer 60 can provide good protection for the OSP pad 30 and prevent gold from plating on the OSP pad 30. Moreover, since the protective layer 60 and the first character 50 are spaced apart in the direction perpendicular to the connection surface 11, the protective layer 60 will not react crosslinkedly with the first character 50 in the recessed portion 42 and merge into one body.

[0087] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A PCB manufacturing method, characterized in that, Including: Providing a PCB board, the PCB board includes a substrate, the substrate has a connection surface, on the connection surface, there are circuits, OSP pads and parts to be plated, the circuits, the OSP pads and the parts to be plated are distributed at intervals, a solder mask layer is provided on the PCB board, the solder mask layer covers the circuits, the solder mask layer is provided with a first opening window, a recessed part and a second opening window, the first opening window exposes the OSP pad, the recessed part is located between the circuit and the OSP pad, a first character is provided in the recessed part, and the second opening window exposes the part to be plated; Providing a protective layer on the solder mask layer, the protective layer shields the first opening window and the recessed part, and the protective layer and the first character are spaced apart in a direction perpendicular to the connection surface, the protective layer is provided with a third opening window, and the third opening window exposes the part to be plated; Performing electroplating gold treatment on the part to be plated; Removing the protective layer.

2. The PCB manufacturing method according to claim 1, wherein Before providing the PCB board, the PCB manufacturing method includes: Providing a substrate, the substrate includes the said substrate; Providing the solder mask layer on the substrate; Providing the first character in the recessed part.

3. The PCB manufacturing method according to claim 2, characterized in that, When providing the solder mask layer on the substrate, a printing screen with 36T - 43T is used; or, the solder mask layer is formed by printing the solder mask ink on the substrate 2 - 3 times.

4. The PCB manufacturing method according to claim 2, wherein When providing the first character in the recessed part, the dotting range is 20% - 50%.

5. The PCB manufacturing method according to claim 1, characterized in that, The distance between the protective layer and the first character in a direction perpendicular to the connection surface is L1, and L1≥0.005mm.

6. The PCB manufacturing method according to claim 1, characterized in that, The solder mask layer includes a planar layer, the recessed part is recessed towards the connection surface compared with the planar layer, a second character is provided above the planar layer, and the second character is connected to the first character; when providing the protective layer on the solder mask layer, the protective layer is provided with a fourth opening window, the fourth opening window exposes the second character, and at the connection of the second character and the first character, the distance between the circuit and the protective layer shielding the recessed part in a direction parallel to the connection surface is W1, and W1 is 0.05mm - 0.10mm.

7. The PCB manufacturing method according to claim 1, wherein The maximum height of the solder mask layer covering the circuit layer compared with the bottom surface of the recessed part is W2, and W2 is 0.020mm - 0.025mm, the thickness of the first character is H2, and H2 is 0.010mm - 0.015mm.

8. The PCB manufacturing method according to claim 1, characterized in that, The protective layer is a dry film.

9. The PCB manufacturing method according to any one of claims 1 to 8, characterized in that, The part to be plated includes pads and / or gold fingers.

10. A PCB, characterized in that, The PCB is processed by the PCB manufacturing method according to any one of claims 1 to 9.

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