Method for manufacturing solid hole circuit board

Abstract

The invention discloses a method for manufacturing a solid hole circuit board, comprising: taking a first copper clad board, cutting it, reserving a conductive area on the board edge, and making a solid hole base copper circuit pattern; then applying a dry film layer → exposing → developing → first electroplating → film stripping to make a first electroplated solid hole copper; taking a second copper clad board, making an auxiliary circuit pattern, and performing typesetting → pressing with a circuit board to be pressed; performing controlled depth drilling to form blind holes; performing a second electroplating process, and then performing a forming process to form a solid hole circuit board as a whole; by layering the electroplated solid holes, the thickness of each electroplating is reduced, the overall processing difficulty is reduced, the aspect ratio is reduced, the machinability of the electroplated solid copper of the high aspect ratio hole is improved, the problems of insufficient electroplating, electroplating voids, and uneven electroplating are solved, the reliability of the solid copper hole is improved, and an effective and reliable processing process is formed.

Description

Technical Field

[0001] The present invention relates to the field of circuit board design and processing, and in particular to a method for manufacturing a circuit board with a solid hole. Background Art

[0002] With the development of higher-density circuit boards, the demand for specially designed circuit boards is increasing. Certain circuit boards in the high-frequency communications field require high heat dissipation, high strength, or high-density interconnection performance. Solid copper vias or special structures with embedded metal blocks are designed into the circuit board to enhance the board's heat dissipation characteristics.

[0003] As for solid copper holes, the circuit board is generally pressed together as a whole, then the through hole is drilled, and then the entire through hole is electroplated to form a solid copper hole.

[0004] This method is generally suitable for processing through-holes with larger diameters, or through-holes with a small aspect ratio (the ratio of circuit board thickness to hole diameter, that is, the ratio of hole height to hole diameter). For the production of blind solid holes, or for high-density holes that exceed the production capacity of laser drilling but are not enough to form through-holes with larger diameters, it is difficult to use direct drilling and electroplating methods. In particular, for holes with an aspect ratio greater than 5:1, direct drilling and electroplating of solid holes can easily cause problems such as incomplete electroplating, electroplating voids, and uneven electroplating.

[0005] However, when processing embedded metal blocks, a larger solid copper area will be formed, which is difficult to meet the needs of refined processing. In addition, the processing difficulty of the embedded metal block is increased and the reliability is limited.

[0006] Based on the above background technology, it is necessary to develop a technology that can effectively realize the production method and effect of solid copper holes in circuit boards. Summary of the Invention

[0007] The present invention aims to solve the problem that the existing technology of directly drilling and electroplating solid holes is difficult to meet the processing requirements of electroplated solid holes with high density or large thickness-to-diameter ratio. A method for manufacturing a solid hole circuit board is provided, characterized in that the manufacturing method includes the following steps:

[0008] S10: Taking a first copper-clad laminate, cutting the first copper-clad laminate, wherein the size of the cut piece is larger than the predetermined design size on one side, reserving a conductive area on the edge of the board, and forming a solid hole base copper circuit pattern on the first copper-clad laminate to form a first electroplated substrate;

[0009] S20: The substrate to be first electroplated is subjected to a dry film layer, exposure, and development process, wherein the development process is to remove the dry film layer corresponding to the pattern to be electroplated on the solid hole base copper circuit pattern, and then the first electroplating process is performed, followed by film stripping, to produce the first electroplated solid hole copper, thereby forming a circuit board to be pressed together;

[0010] S30: Take the second copper clad laminate and make an auxiliary circuit pattern, then perform layout and pressing with the circuit board to be pressed to form a circuit board to be drilled;

[0011] S40: performing controlled depth drilling on the circuit board to be drilled, wherein the blind holes formed by the controlled depth drilling correspond to the first electroplated solid copper holes, and the whole circuit board to be second electroplated is formed;

[0012] S50: performing a second electroplating process on the substrate to be second electroplated to produce a second electroplated solid hole copper, and then performing a forming process to form the solid hole circuit board as a whole.

[0013] Furthermore, the cut size is 5.0 mm to 20.0 mm larger on one side than the predetermined design size.

[0014] Furthermore, the processing flow of making the solid hole base copper circuit pattern on the first copper clad laminate is: first drilling → whole board electroplating → first dry film layer → first exposure → first development → first etching → first film stripping.

[0015] Furthermore, the whole-board electroplating includes electroplating the through-holes in the solid hole base copper circuit pattern area formed by the first drilling into solid holes in the first copper-clad board.

[0016] Furthermore, the conductive area at the edge of the board is 5.0 mm to 15.0 mm; the conductive area at the edge of the board is provided with a tool pattern and a tool hole, and the tool hole includes a pin hole; and the first electroplating includes electroplating the pin hole.

[0017] Furthermore, before the film stripping process, surface grinding is performed, and after the film stripping process, micro-etching is performed.

[0018] Furthermore, the single side size of the second copper clad laminate is smaller than that of the first copper clad laminate; the auxiliary circuit pattern includes a circular circuit pattern, and leads connecting the circular circuit pattern, and a copper layer area located in a certain area of ​​the board edge; the leads connect the circular circuit pattern with the copper layer area; each of the circular circuit patterns corresponds to each of the first electroplated solid hole coppers one by one; when performing the typesetting, the copper layer area partially overlaps with the conductive area of ​​the board edge; after the pressing process, the circular circuit pattern is stacked with the first electroplated solid hole copper, and the copper layer area is partially stacked with the conductive area of ​​the board edge.

[0019] Furthermore, the depth-controlled drilling uses pins to fix the circuit board to be drilled on a drilling platform with conductive properties; the drilling platform is electrically connected to a controller that controls drilling data, and is electrically connected to the drill bit, forming a depth-controlled drilling circuit connection; when the drill bit performs depth-controlled drilling and reaches the circular circuit pattern, the current signal is transmitted through the drill bit to the circular circuit pattern, and then to the conductive area of ​​the board edge, and then to the drilling platform through the pin hole and the pin, and then to the controller. After receiving the current signal, the controller issues an instruction to stop continuing the depth-controlled drilling, and issues a tool retraction instruction to complete the depth-controlled drilling process; the blind hole is formed.

[0020] Furthermore, after the blind hole formed by the depth-controlled drilling is formed, hole repair and drill smear removal processing is performed.

[0021] Furthermore, after the second electroplating process, a second micro-etching process is performed.

[0022] In the technical solution of the present invention, the electroplated solid holes are processed in layers and processed in a layer-by-layer electroplating manner. Compared with direct electroplating of solid copper, the thickness of each electroplating is reduced, thereby reducing the overall electroplating processing difficulty. In addition, by splitting the holes, the aspect ratio of the holes is reduced, thereby improving the machinability of electroplated solid copper of high aspect ratio holes, solving the problems of insufficient electroplating, electroplating voids, and uneven electroplating, and improving the reliability of solid copper holes. Compared with the processing of buried metal blocks, the processing precision is higher and the reliability is stronger. Specifically, by setting a conductive area on the edge of the board, and setting tool graphics, tool holes, and pin holes, the size difference between the second copper clad board and the first copper clad board is utilized to form a good conductive effect on the board edge, thereby achieving high-precision controlled depth drilling and electroplating conductive machinability, thereby forming an effective and reliable processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0024] Figure 1 A process flow chart of a manufacturing method according to an embodiment of the present invention;

[0025] Figure 2 This is a schematic cross-sectional view of a first electroplated substrate fabricated in accordance with an embodiment of the present invention;

[0026] Figure 3This is a schematic diagram of the cross-sectional structure of a workpiece after the first electroplating substrate is developed according to an embodiment of the present invention;

[0027] Figure 4 A schematic diagram of the cross-sectional structure of a circuit board to be pressed together is shown in an embodiment of the present invention;

[0028] Figure 5 This is a schematic cross-sectional structural diagram of the layout of the second copper-clad laminate and the circuit board to be pressed together according to an embodiment of the present invention;

[0029] Figure 6 For the embodiment of the present invention Figure 5 AA plane structure diagram in;

[0030] Figure 7 A schematic diagram of the cross-sectional structure of a circuit board to be drilled, produced in accordance with an embodiment of the present invention;

[0031] Figure 8 Schematic diagram of the depth-controlled drilling processing principle structure of an embodiment of the present invention;

[0032] Figure 9 Schematic diagram of the cross-sectional structure of a blind hole formed by depth-controlled drilling according to an embodiment of the present invention;

[0033] Figure 10 This is a schematic diagram of the cross-sectional structure of a solid hole circuit board manufactured in an embodiment of the present invention;

[0034] Figure 11 This is a schematic diagram of the cross-sectional structure of another solid hole circuit board manufactured according to an embodiment of the present invention.

[0035] Description of Figure Numbers:

[0036]

[0037]

[0038] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0040] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0041] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0042] See also Figure 1 ; Figure 1 The present invention is a process flow chart of the manufacturing method according to the embodiment of the present invention.

[0043] The embodiments of the present invention are described through the processing flow of specific examples. Please refer to the following for a description of the specific processing methods.

[0044] See also Figure 2 ; Figure 2 This is a schematic diagram of the cross-sectional structure of a first electroplated substrate manufactured according to an embodiment of the present invention.

[0045] An embodiment of the present invention provides a method for manufacturing a solid hole circuit board, comprising:

[0046] Step S10:

[0047] Take the first copper clad laminate 110 and cut it. The cut size is larger than the predetermined design size 100A on one side. A conductive area 1400 is reserved at the edge of the board. A solid hole base copper circuit pattern 1100 is made on the first copper clad laminate 110 to form the first electroplated substrate 100.

[0048] As can be seen from the general shape of the copper clad laminate, the first copper clad laminate 110 further includes an insulating dielectric layer 1200 , a copper layer is covered on the insulating dielectric layer 1200 , and a solid hole base copper circuit pattern 1100 is produced on the copper layer.

[0049] Regarding the cutting of the first copper clad laminate 110, since the circuit board needs to be panelized during the general processing process, the panelization will form the predetermined design size 100A of the workpiece during processing. A board edge tool area will be set on the size of the panel to distribute the alignment graphics, icons, tool holes and other auxiliary processing graphics during the processing. Therefore, after panelization, the circuit board forms an effective area within the board and a board edge tool area with the forming line 100B as the boundary; and in this embodiment, since the board edge will need to be used for depth-controlled drilling and electroplating conduction in the future, it is necessary to further expand the board edge tool area during panelization to form a board edge conductive area 1400.

[0050] The pin hole 1300 is a tool hole used in the subsequent depth-controlled drilling process, which enables the circuit board to form a circuit loop by depth-controlled drilling. Therefore, it needs to be set in the conductive area 1400 at the edge of the board.

[0051] In this embodiment, the single side of the cut size is 5.0mm to 20.0mm larger than the predetermined design size 100A; the board edge conductive area 1400 is 5.0mm to 15.0mm; the board edge conductive area 1400 is provided with a tool pattern and a tool hole, and the tool hole includes a pin hole 1300; the first electroplating includes electroplating the pin hole 1300.

[0052] The board edge conductive area 1400 is a portion or all of the cut size whose single side is larger than the predetermined design size 100A, and moving the tool graphics and tool holes to the board edge conductive area 1400 can effectively prevent the tool graphics and tool holes from being covered by the second copper clad laminate 310 when the second copper clad laminate 310 is subsequently pressed.

[0053] The processing flow of the solid hole base copper circuit pattern 1100 adopts the process flow of first drilling → whole board electroplating → first dry film layer → first exposure → first development → first etching → first film stripping, and the whole board electroplating includes electroplating the through holes in the solid hole base copper circuit pattern 1100 area formed by the first drilling into the first copper clad board solid hole 120.

[0054] It should be noted that if the first copper clad board 110 is a single-sided copper clad board, there is no need to perform the first drilling process, and the whole board electroplating process can be selected according to the processing requirements. Because the single-sided copper clad board has only one copper layer, the production of solid holes is carried out on one copper layer, and there is no need to perform the "drilling → electroplating" process of the copper layers on both sides; when the first copper clad board 110 is a double-sided copper clad board, or a multi-layer substrate that has been pressed, it is necessary to perform the first drilling → whole board electroplating process according to the processing requirements or needs (please refer to Figure 11); at this time, the through hole formed by drilling can be electroplated into a solid hole to form a basic copper layer for further adding a layer of electroplated solid holes. It can also be selected according to actual processing needs to only electroplate the through hole without forming a solid hole, and the through hole of this step can be electroplated into a solid hole in the process of subsequent adding a layer of electroplated solid holes. Since the through holes are distributed on the board surface, and the pin holes 1300 are also distributed on the board surface, generally, the hole diameter of the pin hole 1300 is 2.0mm to 3.0mm, and the diameter of the through hole formed by drilling is 0.15mm to 0.5mm. Therefore, the hole diameter of the pin hole 1300 is much larger than the through hole formed by drilling. Even when the through hole is electroplated into a solid hole, the pin hole 1300 will not be electroplated into a solid hole and cannot be used subsequently.

[0055] See also Figure 3 and Figure 4 ; Figure 3 Schematic diagram of the cross-sectional structure of a workpiece after the first electroplating substrate is developed according to an embodiment of the present invention; Figure 4 A schematic diagram of the cross-sectional structure of a circuit board to be pressed together is shown in an embodiment of the present invention;

[0056] Step S20:

[0057] The substrate 100 to be first electroplated is subjected to a process of applying a dry film layer 210, exposing, and developing. The development is to develop away the dry film layer 210 of the corresponding pattern 220 to be electroplated on the solid hole base copper circuit pattern 1100. Then, the first electroplating is performed, and the film stripping process is performed to produce the first electroplated solid hole copper 230, thereby forming the circuit board 200 to be pressed as a whole. Before the film stripping process, the surface is polished, and after the film stripping process, a micro-etching process is performed.

[0058] By attaching a dry film layer 210 , forming a pattern to be plated 220 , and performing electroplating processing, the pattern to be plated 220 is electroplated with copper to form a first electroplated solid hole copper 230 .

[0059] Generally, the thickness of the dry film layer 210 is 30μm to 50μm. If a thicker first electroplated solid hole copper 230 is required, it can be processed by wet film priming + dry film attachment. However, the first electroplated solid hole copper 230 should not be too thick. If it is too thick, the thickness of the wet film + dry film must be too thick, which may easily cause poor exposure and deformation of the pattern to be electroplated 220. In addition, if the first electroplated solid hole copper 230 is too thick, it will cause the solid copper to be skewed and deformed when the second copper clad board 310 is subsequently pressed.

[0060] The workpiece is polished after electroplating and before film stripping, and the surface of the first electroplated solid hole copper 230 can be smoothed by physical means. After film stripping, micro-etching is performed, and the first electroplated solid hole copper 230 can be corrected by chemical means to form a uniform and fine rough surface on its surface, providing a machinable surface foundation for subsequent processing.

[0061] See also Figure 5 and Figure 6 and Figure 7 ; Figure 5 This is a schematic cross-sectional structural diagram of the layout of the second copper-clad laminate and the circuit board to be pressed together according to an embodiment of the present invention; Figure 6 For the embodiment of the present invention Figure 5 AA plane structure diagram in; Figure 7 A schematic diagram of the cross-sectional structure of a circuit board to be drilled manufactured according to an embodiment of the present invention.

[0062] Step S30:

[0063] Take the second copper clad board 310 and make an auxiliary circuit pattern 3100, and then perform layout → pressing with the circuit board 200 to form the circuit board 300 to be drilled;

[0064] From the general shape of the copper clad laminate, it can be seen that the second copper clad laminate 310 also includes a second insulating dielectric layer 3200. In this embodiment, the second copper clad laminate 310 is a double-sided copper clad laminate, one side of the copper layer is used to make the auxiliary circuit pattern 3100, and the other side of the copper layer is the second circuit pattern 3300 formed in the established design of the circuit board. Therefore, it can be understood that the second copper clad laminate 310 itself is a single-sided copper clad laminate (or a prepreg + copper foil structure). In order to make the auxiliary circuit pattern 3100 and apply it to the subsequent depth-controlled drilling process, a double-sided copper clad laminate is used instead.

[0065] It should be noted that the copper layer on one side of the auxiliary circuit pattern 3100 is relatively thin, so as to form an electrical conductivity effect for subsequent controlled depth drilling. The copper thickness can be selected from 5μm to 15μm. The thinner copper layer can also avoid problems such as pressing slippage, poor bonding, and excessive board thickness caused by the circular circuit pattern 3110 on the auxiliary circuit pattern 3100 contacting the first electroplated solid hole copper 230 when pressing the second copper clad board 310.

[0066] In this embodiment, the processing flow of the auxiliary circuit pattern 3100 is as follows: applying a third dry film layer → third exposure → third development → third etching → third film stripping; this processing process is a general processing process for circuit patterns.

[0067] The single-side size of the second copper clad laminate 310 is smaller than that of the first copper clad laminate 110. Since the board edge conductive area 1400 of the first copper clad laminate 110 needs to be exposed, that is, the tool graphics and tool holes and pin holes 1300 of the board edge conductive area 1400 need to be exposed, the size of the second copper clad laminate 310 needs to be smaller than that of the first copper clad laminate 110, and sufficient space needs to be reserved for press-fitting overflow and press-fitting expansion and contraction.

[0068] The auxiliary circuit pattern 3100 includes a circular circuit pattern 3110, leads 3120 connecting the circular circuit patterns, and a copper layer area 3130 located in a certain area of ​​the board edge; the leads 3120 connect the circular circuit pattern 3110 to the copper layer area 3130; each of the circular circuit patterns 3110 corresponds to each of the first electroplated solid hole coppers 230.

[0069] The auxiliary circuit pattern 3100 is designed to use the lead 3120 to connect the circular circuit pattern 3110 to the copper layer area 3130. After the second copper clad board 310 is pressed, the copper layer area 3130 can partially overlap with the board edge conductive area 1400, thereby indirectly connecting the circular circuit pattern 3110 to the board edge conductive area 1400. During the subsequent depth-controlled drilling process, the circular circuit pattern 3110 can play the role of maximum downward drilling signal feedback of the drill bit for depth-controlled drilling; and each first electroplated solid hole copper 230 needs to undergo layer-added electroplated solid hole processing, and all of them need to undergo depth-controlled drilling processing. Therefore, each first electroplated solid hole copper 230 needs to be arranged corresponding to a circular circuit pattern 3110.

[0070] It should be noted that the lead 3120 is a newly designed graphic. In order not to affect the processing and use of the circuit board itself, the lead 3120 should be set as a thin line as possible when the processing process capability permits. It can be designed as a line of 10μm to 50μm, preferably 10μm, 15μm, 20μm or 25μm.

[0071] The circular circuit pattern 3110 is the deepest depth surface that the drill bit can drill during subsequent depth-controlled drilling. Since the circular circuit pattern 3110 corresponds to and overlaps with the first electroplated solid hole copper 230 during pressing, in order to make the pressing more secure, the circular circuit pattern 3110 can be designed to have a diameter smaller than the diameter of the first electroplated solid hole copper 230, generally less than 10μm to 30μm, or can also be designed as a mesh pattern, or a pattern in which various copper patterns and copper-free patterns are alternately distributed.

[0072] During the layout process, the copper layer area 3130 partially overlaps with the board edge conductive area 1400; after the pressing process, the circular circuit pattern 3110 is stacked with the first electroplated solid hole copper 230, and the copper layer area 3130 is partially stacked with the board edge conductive area 1400.

[0073] Since the single-side size of the second copper clad laminate 310 is smaller than that of the first copper clad laminate 110, and the second copper clad laminate 310 also needs to be able to cover the board edge tool area of ​​the established design size 100A to ensure that the effective area within the board can be effectively processed, the copper layer area 3130 partially overlaps with the board edge conductive area 1400, which can ensure that the auxiliary circuit pattern 3100 can form a contact connection effect with the board edge conductive area 1400, and ensure that the tool pattern, tool hole, and pin hole 1300 of the board edge conductive area 1400 are not covered.

[0074] See also Figure 8 and Figure 9 ; Figure 8 Schematic diagram of the depth-controlled drilling processing principle structure of an embodiment of the present invention; Figure 9 Schematic diagram of the cross-sectional structure of a blind hole formed by depth-controlled drilling according to an embodiment of the present invention.

[0075] Step S40:

[0076] Performing controlled depth drilling on the circuit board 300 to be drilled, wherein the blind holes 410 formed by the controlled depth drilling correspond to the first electroplated solid copper holes 230 , and the whole substrate 400 to be second electroplated is formed;

[0077] In this embodiment, depth-controlled drilling is performed, and a pin 3210 is used to fix the circuit board 300 to be drilled on a drilling platform 3220 with conductive properties; the drilling platform 3220 is electrically connected to a controller 3230 that controls drilling data, and is electrically connected to a drill bit 3240, forming a depth-controlled drilling circuit connection; when the drill bit 3240 performs depth-controlled drilling and reaches the circular circuit pattern 3110, a current signal is transmitted through the drill bit 3240 to the circular circuit pattern 3110, and then to the conductive area 1400 of the board edge, and then to the drilling platform 3220 through the pin hole 1300 and the pin 3210, and then to the controller 3230. After receiving the current signal, the controller 3230 issues an instruction to stop continuing the depth-controlled drilling and issues an instruction to retract the tool, completing the depth-controlled drilling process; the blind hole 410 is formed; after the blind hole 410 is formed by the depth-controlled drilling, hole repair and drill smear removal processing are performed.

[0078] Since the pin hole 1300 exists in the conductive area 1400 of the board edge after pressing, the circuit board 300 to be drilled is fixed by the pin 3210, and a connection of the circular circuit pattern 3110 → lead 3120 → copper layer area 3130 → conductive area 1400 of the board edge → pin hole 1300 → pin 3210 → drilling platform 3220 → controller 3230 → drill bit 3240 is formed. When the drill hole 3240 is drilled downward and the foundation reaches the circular circuit pattern 3110, a connection is formed. The current loop and the electrical signal are fed back to the controller 3230, which issues an instruction to stop the depth-controlled drilling and an instruction to retract the tool to complete the depth-controlled drilling process. Since the electroplated solid hole is a high-precision drilling process, it requires precise control of the drilling depth and a small drilling diameter. Therefore, this method is used for depth-controlled drilling, which can effectively avoid the use of the traditional fixed-depth depth-controlled drilling method, which can avoid problems such as drilling too deep, too shallow, or skewed due to uneven plate thickness, uneven pressing, warping, or bending.

[0079] Since the blind hole 410 is processed by drilling rather than by applying a dry film → making a pattern → electroplating, the depth of the blind hole is greater than that of the first electroplated solid hole copper 230, which can effectively increase the processing depth of the solid hole, meet processing and application requirements, and provide an effective processing depth guarantee for the production of electroplated solid holes using this embodiment.

[0080] See also Figure 10 , Figure 10 This is a schematic diagram of the cross-sectional structure of a solid hole circuit board manufactured according to an embodiment of the present invention.

[0081] Step S50:

[0082] The substrate 400 to be second-electroplated is subjected to a second electroplating process to produce a second electroplated solid hole copper 510, and then subjected to a forming process to form the solid hole circuit board 10 as a whole; after the second electroplating process, a second micro-etching process is performed.

[0083] Since the micro-etching process is performed after the second electroplating process, the second electroplated solid hole copper 510 can be effectively trimmed by chemical treatment, providing a board surface foundation for subsequent graphic processing or further layer-added electroplated solid hole processing.

[0084] See also Figure 11 , Figure 11 This is a schematic diagram of the cross-sectional structure of another solid hole circuit board manufactured according to an embodiment of the present invention.

[0085] In one embodiment, the first copper clad board 110 is a double-sided copper clad board, and the electroplated solid holes can be processed by double-sided build-up electroplating. At this time, the through holes formed by drilling the first copper clad board 110 can be electroplated solid holes to form the basic copper layer first copper clad board solid holes 120 for subsequent further build-up electroplated solid holes; or, according to actual processing needs, only through holes can be plated without forming solid holes, and in the process of subsequent build-up electroplating solid holes, the through holes in this step can be electroplated into solid holes; and then, the build-up electroplated solid holes can be processed according to the above-mentioned processing steps.

[0086] It should be noted that due to the different designs, processing, and application scenarios of circuit boards during the actual processing and application processes, the drawings of this embodiment are only used to illustrate the implementation process of the embodiment, and do not represent the size ratio of the actual product, nor do they represent a proportionally enlarged view according to the actual situation.

[0087] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a solid hole circuit board, characterized in that: The production method comprises the following steps: S10: Taking a first copper clad laminate, cutting the first copper clad laminate, wherein the size of the cut piece is larger than the predetermined design size on one side, reserving a conductive area at the edge of the board, and making a solid hole base copper circuit pattern on the first copper clad laminate, and making pin holes in the conductive area at the edge of the board, to form a substrate to be first electroplated; S20: applying a dry film layer to the substrate to be first electroplated, exposing it to light, and developing it. The development is to develop away the dry film layer corresponding to the pattern to be electroplated on the solid hole base copper circuit pattern. Then, a first electroplating and film stripping process is performed to produce a first electroplated solid hole copper. The first electroplating includes electroplating the pin holes, and the whole circuit board to be pressed is formed. S30: Take the second copper clad laminate and make an auxiliary circuit pattern, then perform layout and pressing with the circuit board to be pressed to form a circuit board to be drilled; S40: performing controlled depth drilling on the circuit board to be drilled, wherein the blind holes formed by the controlled depth drilling correspond to the first electroplated solid copper holes, and the whole circuit board to be second electroplated is formed; The single side size of the second copper clad laminate is smaller than that of the first copper clad laminate; The auxiliary circuit pattern includes a circular circuit pattern, leads connected to the circular circuit pattern, and a copper layer area located in a certain area of ​​the board edge; The lead connects the circular circuit pattern to the copper layer area; Each of the circular circuit patterns corresponds to each of the first electroplated solid copper holes; During the layout process, the copper layer area partially overlaps with the board edge conductive area; After the pressing process, the circular circuit pattern is laminated with the first electroplated solid hole copper, and the copper layer area is partially laminated with the board edge conductive area; The depth-controlled drilling includes: fixing the circuit board to be drilled on a drilling platform with conductive properties using pins; the drilling platform is electrically connected to a controller that controls drilling data and is electrically connected to a drill bit to form a depth-controlled drilling circuit connection; when the drill bit performs depth-controlled drilling and reaches the circular circuit pattern, a current signal is transmitted through the drill bit to the circular circuit pattern, then to the conductive area of ​​the board edge, and then to the drilling platform through the pin hole and the pin, and then to the controller; after receiving the current signal, the controller issues an instruction to stop the depth-controlled drilling and an instruction to retract the tool, thereby completing the depth-controlled drilling process; forming the blind hole; S50: performing a second electroplating process on the substrate to be second electroplated to produce a second electroplated solid hole copper, and then performing a forming process to form the solid hole circuit board as a whole.

2. The method for manufacturing a solid hole circuit board according to claim 1, wherein: The cut size is 5.0 mm to 20.0 mm larger on one side than the predetermined design size.

3. The method for manufacturing a solid hole circuit board according to claim 1, wherein: The processing flow for making a solid hole base copper circuit pattern on the first copper clad laminate is as follows: the first copper clad laminate is subjected to the following steps: first drilling → whole board electroplating → first dry film layer application → first exposure → first development → first etching → first film stripping; the first drilling includes drilling pin holes.

4. The method for manufacturing a solid hole circuit board according to claim 3, wherein: The first drilling includes drilling a through hole in the area of ​​the solid hole base copper circuit pattern; the whole board electroplating includes electroplating the through hole into a solid hole to form a first copper clad board solid hole.

5. The method for manufacturing a solid hole circuit board according to claim 1, wherein: The conductive area of ​​the board edge is 5.0mm to 15.0mm; The conductive area on the edge of the board is provided with a tool pattern and a tool hole, wherein the tool hole includes a pin hole; The first electroplating includes electroplating the pin hole.

6. The method for manufacturing a solid hole circuit board according to claim 1, wherein: Before the film stripping process, the surface is polished, and after the film stripping process, micro-etching is performed.

7. The method for manufacturing a solid hole circuit board according to claim 1, wherein: After the blind hole is formed by the depth-controlled drilling, the hole is repaired and the drill smear is removed.

8. The method for manufacturing a solid hole circuit board according to claim 1, wherein: After the second electroplating process, a second micro-etching process is performed.

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