A combined anti-cracking copper plating device for circuit board
By designing a crack-resistant modular circuit board copper plating device, and using motor-driven moving and clamping components, the problem of inconvenient handling of circuit boards on the basket was solved. This enabled rapid clamping and flexible fixing of circuit boards, expelling air bubbles, improving plating speed and quality, reducing defect rate, and enhancing plating flexibility and processing efficiency.
Patent Information
- Application Number
- CN202211639925.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-20
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2042-12-20
AI Technical Summary
Existing copper plating equipment makes it inconvenient to pick up and install circuit boards on the basket during the production process. The basket is also not flexible enough to adapt to different types of circuit boards, resulting in low production efficiency and increased product defect rate.
A crack-resistant modular circuit board copper plating device was designed. It uses a motor-driven moving component and a clamping component to quickly clamp and fix the circuit board. The vibration component removes air bubbles from the through holes, and the drying component accelerates the drying process of the circuit board after plating, thus achieving flexible fixation and efficient plating of the circuit board.
It improves electroplating speed and circuit board robustness, reduces product defect rate, enhances the flexibility of the electroplating process, improves electroplating efficiency, enables rapid drying, can accommodate different circuit board types, reduces the generation of bubble-like holes, lowers the defect rate, and enhances electroplating effect and processing efficiency.
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Figure CN116083992B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of circuit board processing, in particular to a crack-proof combined circuit board copper plating device. BACKGROUND
[0002] Circuit board, also known as line board, circuit board, aluminum substrate, high-frequency board, ultra-thin line board, ultra-thin circuit board, printed (copper etching) circuit board, etc., is an important electronic component, is the support of electronic components, and is the provider of electronic component circuit connection. Traditional circuit board adopts the printing etching resist method to make circuit lines and patterns, so it is called printed circuit board or printed line board. Due to the continuous miniaturization and refinement of electronic products, most of the current circuit boards are attached with etching resist (pressure film or coating), and after exposure and development, etching is used to make circuit boards. Circuit board, as a basic component of electronic products, is composed of multiple layers of conductor material and insulating material. The conductor material is copper and is attached to the insulating board by electroplating, and then etching process is performed for line drawing.
[0003] The existing copper plating device in the production process, the hanging basket used in the copper plating production line contains the circuit board to be plated. In the production process, the circuit board is inconvenient to take and install on the hanging basket, and the hanging basket can only cope with the same type of circuit board, and the flexibility is not enough.
[0004] Therefore, it is necessary to design a crack-proof combined circuit board copper plating device for the above problems. SUMMARY
[0005] The purpose of the present application is to provide a crack-proof combined circuit board copper plating device to solve the problems raised in the background art.
[0006] To achieve the above purpose, the present application provides the following technical scheme: a crack-proof combined circuit board copper plating device, comprising an electroplating device main body and a moving assembly: the left end of the electroplating device main body is provided with a circuit board placing table, and the upper front and rear ends of the electroplating device main body are provided with supports, the moving assembly is arranged at the upper end of the support, and the left lower end of the moving assembly is provided with a sliding block one, the lower end of the sliding block one is connected with a gas cylinder, and the lower end of the gas cylinder is provided with a clamping assembly, the clamping assembly comprises a box body, a sliding block two, a clamp body, a threaded rod two and a motor two, the inside of the box body is provided with a threaded rod two, and the right end of the threaded rod two is connected with a motor two, the outside of the threaded rod two is provided with a sliding block two at the left and right ends, and the lower end of the sliding block two is connected with a clamp body.
[0007] Further, the inside of the electroplating device main body is provided with a lifting assembly, and the upper end left side of the lifting assembly is connected with a rotating shaft.
[0008] Further, the internal front end of the ascending assembly is provided with a vibration motor body, and the internal middle part of the ascending assembly is provided with a fixing assembly, and the internal part of the fixing assembly is provided with a combined circuit board body.
[0009] Further, the right end of the electroplating device body is provided with a drying assembly, and the internal lower end of the drying assembly is provided with a conveying belt.
[0010] Further, the right end of the conveying belt is connected with a sliding plate, and the right end of the sliding plate is connected with a collection box.
[0011] Further, the moving assembly comprises a horizontal plate, a threaded rod one and a motor one, the internal part of the horizontal plate is provided with the threaded rod one, and the right end of the threaded rod one is connected with the motor one.
[0012] Further, the ascending assembly comprises a motor three, a gear, a rack and a basket, the left end of the motor three is connected with the gear, and the internal side of the gear is connected with the rack, and the internal side of the rack is provided with the basket.
[0013] Further, the drying assembly comprises a drying box and a fixing block, the internal upper wall of the drying box is provided with the fixing block, and the fixing block is provided with three.
[0014] Further, the drying assembly further comprises a motor four and a fan blade, the internal part of the fixing block is provided with the motor four, and the motor four is provided with three, the lower end of the motor four is connected with the fan blade, and the fan blade is provided with three.
[0015] Further, the fixing assembly comprises a fixing box, a sliding block three, a clamping block and a retracting rod, the internal left and right ends of the fixing box are both provided with the sliding block three, the upper end of the sliding block three is connected with the clamping block, and the internal side lower end of the clamping block is provided with the retracting rod.
[0016] Compared with the prior art, the device can quickly take the combined circuit board body during electroplating, improve the electroplating speed of the combined circuit board body, fix different combined circuit board bodies, effectively improve the firmness of the combined circuit board body and the flexibility of the electroplating device body, avoid bubbles in the through hole of the combined circuit board body, and effectively improve the processing efficiency of the combined circuit board body.
[0017] 1. This invention uses a motor to drive a threaded rod and a slider to move, which in turn moves the cylinder and the housing. Then, by turning on a second motor, the threaded rod rotates, which in turn moves the slider and the fixture body to clamp the modular circuit board body. This allows the modular circuit board body to be quickly removed during the electroplating process, thus improving the electroplating speed of the modular circuit board body.
[0018] 2. This invention uses a combination circuit board body to engage with a clamping block on a fixing box, which allows the clamping block to move the retractable rod and slider within the fixing box, thereby clamping and fixing the combination circuit board body. The retractable rod is used to fix different combination circuit board bodies, effectively improving the robustness of the combination circuit board body and the flexibility of the electroplating device.
[0019] 3. This invention uses the rotation of gears and shafts to drive the rack and basket to move up and down, allowing the combined circuit board body to sink into the electroplating device for electroplating. Then, by turning on the vibration motor, the rack and basket vibrate, which effectively removes air bubbles from the through holes of the combined circuit board body, thus preventing the formation of copper-free holes. This avoids the problem of air bubbles being difficult to remove from the through holes of the combined circuit board body, which can easily lead to bubble-type copper-free holes, resulting in increased product defect rates and affecting the electroplating effect and efficiency of the combined circuit board body during secondary copper plating.
[0020] 4. The present invention uses a clamp to hold the combined circuit board body to the conveyor belt, and then the conveyor belt drives the combined circuit board body to be transported. Next, the motor is turned on to drive the fan blades to rotate and blow air on the combined circuit board body, thereby enabling the combined circuit board body to be dried quickly in the drying oven and improving the processing efficiency of the combined circuit board body.
[0021] 5. In this invention, the modular circuit board body is clamped by the clamp body, which makes the modular circuit board body detach from the fixed box. Then, the modular circuit board body is transported by the conveyor belt, and the dried modular circuit board body slides down the slide plate into the collection box. The operator collects the modular circuit board body, which facilitates the subsequent processing of the modular circuit board body. Attached Figure Description
[0022] Figure 1 This is a front cross-sectional view of the anti-crack combined circuit board copper plating device of the present invention.
[0023] Figure 2 This invention relates to a crack-resistant combined circuit board copper plating device. Figure 1 Enlarged structural diagram at point A in the middle;
[0024] Figure 3 It is a rack side view enlarged structure schematic diagram of a kind of anti-cracking combined circuit board copper plating device of the present application;
[0025] Figure 4 It is a drying cabinet front view sectional view enlarged structure schematic diagram of a kind of anti-cracking combined circuit board copper plating device of the present application;
[0026] Figure 5 It is a basket top view enlarged structure schematic diagram of a kind of anti-cracking combined circuit board copper plating device of the present application;
[0027] Figure 6 It is a fixed box front view sectional view enlarged structure schematic diagram of a kind of anti-cracking combined circuit board copper plating device of the present application;
[0028] Figure 7 It is a clamping block three-dimensional enlarged structure schematic diagram of a kind of anti-cracking combined circuit board copper plating device of the present application.
[0029] In the figure: 1, plating device main body;2, circuit board placement table;3, support;4, moving assembly;401, horizontal plate;402, threaded rod one;403, motor one;5, sliding block one;6, air cylinder;7, clamping assembly;701, box body;702, sliding block two;703, clamp body;704, threaded rod two;705, motor two;8, ascending assembly;801, motor three;802, gear;803, rack;804, basket;9, drying assembly;901, drying cabinet;902, fixed block;903, motor four;904, fan blade;10, collection box;11, rotating shaft;12, transmission belt;13, sliding plate;14, fixed assembly;1401, fixed box;1402, sliding block three;1403, clamping block;1404, contraction rod;15, combined circuit board body;16, vibration motor body. DETAILED DESCRIPTION
[0030] As Figures 1 to 7As shown, the present application provides a technical scheme: a kind of anti-cracking combined circuit board copper deposition device, including plating device main body 1 and moving assembly 4: the left end of plating device main body 1 is provided with circuit board placing table 2, and the upper front and rear ends of plating device main body 1 are provided with support 3, moving assembly 4 is arranged at the upper end of support 3, and the left lower end of moving assembly 4 is provided with sliding block one 5, the lower end of sliding block one 5 is connected with cylinder 6, and the lower end of cylinder 6 is provided with clamping assembly 7, clamping assembly 7 includes box body 701, sliding block two 702, clamp body 703, threaded rod two 704 and motor two 705, the inside of box body 701 is provided with threaded rod two 704, and the right end of threaded rod two 704 is connected with motor two 705, the left and right ends of the outside of threaded rod two 704 are provided with sliding block two 702, and the lower end of sliding block two 702 is connected with clamp body 703, moving assembly 4 includes horizontal plate 401, threaded rod one 402 and motor one 403, the inside of horizontal plate 401 is provided with threaded rod one 402, and the right end of threaded rod one 402 is connected with motor one 403;
[0031] Specific operation is as follows, threaded rod one 402 and sliding block one 5 are moved by motor one 403, so as to drive cylinder 6 and box body 701 to move, then by opening motor two 705, threaded rod two 704 is driven to rotate, the rotation of threaded rod two 704 can make sliding block two 702 and clamp body 703 move to clamp combined circuit board body 15, so that combined circuit board body 15 can be quickly taken during plating process, and the plating speed of combined circuit board body 15 is improved.
[0032] As shown in the figure, Figures 5 to 7 The inside of fixed assembly 14 is provided with combined circuit board body 15, fixed assembly 14 includes fixed box 1401, sliding block three 1402, clamping block 1403 and contraction rod 1404, the left and right ends of the inside of fixed box 1401 are provided with sliding block three 1402, and the upper end of sliding block three 1402 is connected with clamping block 1403, and the inside lower end of clamping block 1403 is provided with contraction rod 1404;
[0033] Combined circuit board body 15 is clamped with clamping block 1403 on fixed box 1401, so that clamping block 1403 drives contraction rod 1404 and sliding block three 1402 to move in fixed box 1401, so as to clamp and fix combined circuit board body 15, and the firmness of combined circuit board body 15 and the flexibility of plating device main body 1 are effectively improved by contraction rod 1404 corresponding to different combined circuit board body 15.
[0034] As shown in the figure, Figure 1 And Figure 3As shown, the inside of the electroplating device body 1 is provided with an ascending assembly 8, and the upper end left side of the ascending assembly 8 is connected with a rotating shaft 11, the inside front end of the ascending assembly 8 is provided with a vibration motor body 16, and the inside middle part of the ascending assembly 8 is provided with a fixing assembly 14, the ascending assembly 8 includes a motor three 801, a gear 802, a rack 803 and a basket 804, the left end of the motor three 801 is connected with the gear 802, and the inside of the gear 802 is connected with the rack 803, and the inside of the rack 803 is provided with the basket 804;
[0035] The gear 802 and the rotating shaft 11 are driven to rotate by the motor three 801, and the rack 803 and the basket 804 are driven to move up and down by the rotation of the gear 802 and the rotating shaft 11, so that the combined circuit board body 15 is submerged in the electroplating device body 1 for electroplating, and then the rack 803 and the basket 804 are vibrated by opening the vibration motor body 16, and the bubbles in the through hole of the combined circuit board body 15 can be effectively discharged by vibration, which can effectively prevent the generation of hole copper, avoid the bubbles in the through hole of the combined circuit board body 15 not being easy to discharge and easy to produce bubble type hole copper, cause the product defective rate to rise, and the combined circuit board body 15 to be treated by secondary copper electroplating, which affects the electroplating effect and efficiency of the combined circuit board body 15.
[0036] As shown in Figure 2 and Figure 4 The right end of the electroplating device body 1 is provided with a drying assembly 9, and the inside lower end of the drying assembly 9 is provided with a conveying belt 12, the right end of the conveying belt 12 is connected with a sliding plate 13, and the right end of the sliding plate 13 is connected with a collection box 10, the drying assembly 9 includes a drying box 901 and a fixing block 902, the inside upper wall of the drying box 901 is provided with the fixing block 902, and the fixing block 902 is provided with three, the drying assembly 9 further includes a motor four 903 and a fan blade 904, the inside of the fixing block 902 is provided with the motor four 903, and the motor four 903 is provided with three, the lower end of the motor four 903 is connected with the fan blade 904, and the fan blade 904 is provided with three;
[0037] The combined circuit board body 15 is clamped to the conveying belt 12 by the clamp body 703, and then the combined circuit board body 15 is conveyed by the conveying belt 12, and then the fan blade 904 is driven to rotate by opening the motor four 903, and the combined circuit board body 15 is blown, so that the combined circuit board body 15 can be quickly dried in the drying box 901, and the processing efficiency of the combined circuit board body 15 is improved.
[0038] The combined circuit board body 15 is clamped by the clamp body 703, and the combined circuit board body 15 is separated from the fixing box 1401. The combined circuit board body 15 is transported by the conveying belt 12, and the dried combined circuit board body 15 slides into the collecting box 10 through the sliding plate 13. The operator collects the combined circuit board body 15, and the combined circuit board body 15 is convenient for subsequent processing.
[0039] Working principle: the operator will put the combined circuit board body 15 on the circuit board placing table 2, then the operator drives the threaded rod one 402 and the slider one 5 to move in the cross plate 401 by opening the motor one 403, the slider one 5 moves to drive the cylinder 6 and the box body 701 to move, the box body 701 moves to the circuit board placing table 2, then the threaded rod two 704 is driven to rotate by opening the motor two 705, the slider two 702 and the clamp body 703 are moved to clamp the combined circuit board body 15, so that the combined circuit board body 15 can be quickly taken during electroplating, then the combined circuit board body 15 is placed in the fixed box 1401 in the basket 804, then the clamping block 1403 drives the shrink rod 1404 and the slider three 1402 to move in the fixed box 1401 by clamping with the clamping block 1403 on the fixed box 1401, so as to clamp and fix the combined circuit board body 15, the shrink rod 1404 fixes different combined circuit board bodies 15, then the operator drives the gear 802 and the rotating shaft 11 to rotate by opening the motor three 801, the rack 803 and the basket 804 are moved up and down by the rotation of the gear 802 and the rotating shaft 11, so that the combined circuit board body 15 is immersed in the electroplating device main body 1 for electroplating, then the rack 803 and the basket 804 are vibrated by opening the vibration motor body 16, the bubbles in the through hole of the combined circuit board body 15 can be effectively discharged by vibration, which can effectively prevent the generation of hole without copper, then the operator drives the gear 802 and the rotating shaft 11 to rotate by opening the motor three 801, the rack 803 and the basket 804 are moved upward by the rotation of the gear 802 and the rotating shaft 11, so that the combined circuit board body 15 moves out of the electroplating device main body 1, then the basket 804 is drained, then the combined circuit board body 15 is clamped by the clamp body 703, so that the combined circuit board body 15 is separated from the fixed box 1401, then it is placed on the conveying belt 12, then the combined circuit board body 15 is conveyed by the conveying belt 12, then the fan blade 904 is driven to rotate by opening the motor four 903, the combined circuit board body 15 is blown, so that the combined circuit board body 15 can be quickly dried in the drying box 901, after drying, the combined circuit board body 15 is conveyed by the conveying belt 12, so that the dried combined circuit board body 15 falls into the collection box 10 by the slide plate 13, and the operator collects the combined circuit board body 15.
Claims
1. A combined anti-cracking copper plating device for circuit board, characterized in that, The utility model provides an electroplating device, including electroplating device main part (1) and mobile assembly (4), electroplating device main part (1) left end is provided with circuit board placing table (2), and the upper front and back both ends of electroplating device main part (1) are provided with support (3), mobile assembly (4) sets up in the upper end of support (3), and the left side lower end of mobile assembly (4) is provided with sliding block no.
2. The anti-cracking combined circuit board copper plating device according to claim 1, wherein, The inside front end of the lifting assembly (8) is provided with a vibration motor body (16), and the inside middle part of the lifting assembly (8) is provided with a fixing assembly (14), the inside of the fixing assembly (14) is provided with a combined circuit board body (15).
3. The anti-cracking combined circuit board copper plating device according to claim 1, wherein, The right end of the electroplating device main body (1) is provided with a drying assembly (9), and the inside lower end of the drying assembly (9) is provided with a conveying belt (12).
4. The anti-cracking combined circuit board copper plating device according to claim 3, characterized in that, The right end of the conveying belt (12) is connected with a sliding plate (13), and the right end of the sliding plate (13) is connected with a collection box (10).
5. The anti-cracking combined circuit board copper plating device according to claim 1, wherein, The mobile assembly (4) includes a horizontal plate (401), a threaded rod (402), and a motor (403), the inside of the horizontal plate (401) is provided with a threaded rod (402), and the right end of the threaded rod (402) is connected with a motor (403).
6. The anti-cracking combined circuit board copper plating device according to claim 3, characterized in that, The drying assembly (9) includes a drying box (901) and a fixing block (902), the inside upper wall of the drying box (901) is provided with a fixing block (902), and the fixing block (902) is provided with three.
7. The anti-cracking combined circuit board copper plating device according to claim 6, wherein, The drying assembly (9) further includes a motor (903) and a fan blade (904), the inside of the fixing block (902) is provided with a motor (903), and the motor (903) is provided with three, the lower end of the motor (903) is connected with a fan blade (904), and the fan blade (904) is provided with three.
8. The anti-cracking combined circuit board copper plating device according to claim 2, wherein, Said fixed assembly (14) includes fixed box (1401), sliding block three (1402), clamp block (1403) and shrink rod (1404), both ends of inside of fixed box (1401) are provided with sliding block three (1402), and upper end of sliding block three (1402) is connected with clamp block (1403), and inside lower end of clamp block (1403) is provided with shrink rod (1404).
Citation Information
Patent Citations
Electroplating device for printed circuit board
CN213680959U
Copper deposition electroplating device for PCB (Printed Circuit Board)
CN214937906U