Photomask logo and manufacturing method thereof

Abstract

A photomask identification and a method for forming the same, wherein the photomask identification comprises: a transparent substrate, the transparent substrate comprising an exposure area and an edge area; a plurality of identification grooves in the edge area of ​​the transparent substrate, each of the identification grooves comprising a plurality of main grooves arranged in rows and columns and sub-grooves connecting adjacent main grooves, the width of the sub-grooves being smaller than the width of the main grooves, some of the main grooves and sub-grooves in one identification groove being filled with opaque material to form an identification code, and the corresponding plurality of identification codes in the plurality of identification grooves forming an identification. The existing identification code of the present application can subsequently be changed to another identification code by removing part of the opaque material, or the opaque material can be removed and then the corresponding main grooves and sub-grooves are refilled with opaque material to form another identification code, so that the modification of the identification can be easily implemented to meet the management requirements during the mask production process.

Description

Technical Field

[0001] This application relates to the field of photomasks, and more particularly to a modifiable photomask identifier and a method for manufacturing the same. Background Technology

[0002] Photolithography is an indispensable and crucial technology in integrated circuit manufacturing. The photolithography process typically includes the following steps: first, a photoresist or other photosensitive material is coated onto the wafer surface; after the photoresist material dries, a mask pattern on a photomask is exposed onto the photoresist photosensitive material using a specific light source through an exposure machine; subsequently, the photoresist photosensitive material is developed with a developer, forming a photoresist pattern on the wafer surface. This photoresist pattern serves as a mask pattern in subsequent ion implantation or etching processes.

[0003] Existing photomasks generally include: a transparent substrate; a plurality of discrete masking patterns (or masking patterns) formed on the surface of the transparent substrate; an annular frame on the surface of the transparent substrate, the annular frame surrounding the masking patterns; and a protective film on the top surface of the annular frame, the protective film and the annular frame being used to seal the photomask.

[0004] Currently, before the photomask is fabricated, the formation date and batch number of the transparent substrate need to be marked. The existing markings are directly etched on the transparent substrate and cannot be changed in subsequent processes, which brings many inconveniences to the management of the photomask fabrication process. Summary of the Invention

[0005] Some embodiments of this application provide an identifier for a photomask, including:

[0006] A transparent substrate, the transparent substrate including an exposure area and an edge area surrounding the exposure area;

[0007] The edge region of the transparent substrate has multiple marking grooves. Each marking groove includes multiple main grooves arranged in rows and columns and secondary grooves connecting adjacent main grooves. The width of the secondary grooves is smaller than the width of the main grooves. Some of the main grooves and secondary grooves in a marking groove are filled with opaque material to form an identification code. Multiple identification codes corresponding to multiple marking grooves form an identification.

[0008] In some embodiments, the plurality of main grooves in each of the marking slots are arranged in a 3x3, 4x4 or 5x5 row and column configuration, and adjacent main grooves are connected by a secondary groove in both the row and column directions.

[0009] In some embodiments, the width of the secondary groove is 1 / 3 to 2 / 3 of the width of the main groove.

[0010] In some embodiments, the identification code is any one of the numbers 0-9, or any one of the letters A, Z.

[0011] In some embodiments, an existing identification code is modified to another identification code after removing some of the opaque material from the main groove and / or sub-groove, or an existing identification code is modified to another identification code after removing all the opaque material from the main groove and sub-groove and then filling the corresponding main groove and sub-groove with opaque material.

[0012] In some embodiments, the opaque material is an opaque metal or ink.

[0013] In some embodiments, the identifier includes one or more of the following: product batch number, serial number, factory code, date, and customer code.

[0014] In some embodiments, the width of the marking groove is 6-12 mm.

[0015] In some embodiments, the surface of the exposure area of ​​the transparent substrate has a plurality of discrete masking patterns; the edge surface of the exposure area of ​​the transparent substrate has an annular frame surrounding the masking patterns; the top surface of the annular frame has a protective film that closes the space within the annular frame.

[0016] This application also provides a method for manufacturing an identifier on a photomask, comprising:

[0017] A transparent substrate is provided, the transparent substrate including an exposure area and an edge area surrounding the exposure area;

[0018] Multiple marking grooves are formed in the edge region of the transparent substrate. Each marking groove includes multiple main grooves arranged in rows and columns and secondary grooves connecting adjacent main grooves. The width of the secondary grooves is smaller than the width of the main grooves.

[0019] Some of the main and secondary grooves in the marking groove are filled with opaque material to form an identification code in the marking groove. The multiple identification codes formed in the multiple marking grooves constitute an identification.

[0020] In some embodiments, the opaque material is an opaque metal or ink.

[0021] In some embodiments, the method further includes forming a plurality of discrete masking patterns on the surface of the exposure area of ​​the transparent substrate.

[0022] In some embodiments, the process of forming the masking pattern and the identification code includes: forming an opaque metal layer on the surface of the edge region and the exposure region of the transparent substrate; forming a patterned mask layer on the opaque metal layer, the patterned mask layer exposing the area of ​​the opaque metal layer that needs to be removed; using the patterned mask layer as a mask, etching away the exposed opaque metal layer; forming a plurality of discrete masking patterns on the surface of the exposure region of the transparent substrate; filling some main grooves and sub-grooves in the identification grooves in the edge region with opaque material; forming an identification code in the identification grooves; and the plurality of identification codes formed correspondingly in the plurality of identification grooves constitute an identification.

[0023] In some embodiments, when the opaque material is ink, the opaque material is filled into certain main grooves and secondary grooves in the marking groove by a dot coating process.

[0024] In some embodiments, the identification code is any one of the numbers 0-9, or any one of the letters A, Z.

[0025] In some embodiments, the existing identification code is modified to another identification code by removing some of the opaque material from the main groove and / or sub-groove of an existing identification code, or by removing all the opaque material from the main groove and sub-groove of a formed identification code and then filling the corresponding main groove and sub-groove with opaque material to modify the existing identification code to another identification code.

[0026] In some embodiments, the plurality of main grooves in each of the marking slots are arranged in a 3x3, 4x4 or 5x5 row and column configuration, and adjacent main grooves are connected by a secondary groove in both the row and column directions.

[0027] In some embodiments, the width of the secondary groove is 1 / 3 to 2 / 3 of the width of the main groove, and the width of the marking groove is 6-12 mm.

[0028] In some embodiments, it further includes: an annular frame surrounding the masking pattern on the edge surface of the exposure area of ​​the transparent substrate; and a protective film on the top surface of the annular frame that closes the space within the annular frame.

[0029] The photomask markings in some of the foregoing embodiments of this application include: a transparent substrate, the transparent substrate including an exposure area and an edge area surrounding the exposure area; the edge area of ​​the transparent substrate has multiple marking slots, each marking slot including multiple main grooves arranged in rows and columns and secondary grooves connecting adjacent main grooves, the width of the secondary grooves being smaller than the width of the main grooves; some main grooves and secondary grooves in one marking slot are filled with opaque material to form an identification code, and multiple identification codes corresponding to multiple marking slots constitute an identification. The existing identification codes in this application can be modified by removing some opaque material to change to other identification codes, or the opaque material can be removed and then refilled with opaque material in the corresponding main grooves and secondary grooves to become other identification codes, which can easily achieve modification of the markings to meet the management needs in the photomask manufacturing process. Furthermore, the aforementioned specific structure of the marking groove facilitates the identification of the marking code formed after being filled with opaque material. On the other hand, different numbers (0-9) or different letters (AZ) can be formed in a marking groove of the aforementioned specific structure by different filling methods of the main groove and the secondary groove, so as to meet the needs of different markings. Attached Figure Description

[0030] Figures 1-8 , Figure 11 This is a structural schematic diagram of the photomask marking process in some embodiments of this application;

[0031] Figure 9 This is an illustration of the identification codes for the digits 0-9 in some embodiments of this application;

[0032] Figure 10 This is an illustration of the identification code for the letters AZ in some embodiments of this application. Detailed Implementation

[0033] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. In describing the embodiments of this application in detail, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this application. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0034] This application first provides a method for manufacturing a photomask mark, and the photomask manufacturing process will be described in detail below with reference to the accompanying drawings.

[0035] refer to Figure 1 and Figure 2 ,in Figure 2 for Figure 1A cross-sectional structural schematic diagram along the cutting line AB shows a transparent substrate 201, which includes an exposure area 21 and an edge area 22 surrounding the exposure area 21.

[0036] The transparent substrate 201 serves as the carrier of the photomask. The transparent substrate 201 is made of a light-transmitting material with a light transmittance greater than 90%. In some embodiments, the transparent substrate 201 can be made of quartz glass or soda glass. In other embodiments, the transparent substrate 201 can also be made of fused silica, calcium fluoride, silicon nitride, titanium dioxide alloy, or sapphire.

[0037] In some embodiments, the transparent substrate 201 includes an exposure region 21 and an edge region 22 surrounding the exposure region 21. The exposure region 21 may be square, circular, or other suitable shapes, and the edge region 22 is annular, surrounding the exposure region 21. The surface of the exposure region 21 is used to form a masking pattern (or light-shielding pattern) 202. The surface of the exposure region 21 may also be used to form a phase-shifting layer. The edge surface around the exposure region 21 is subsequently used to form an annular frame, and the edge region 22 of the transparent substrate 201 is used to form a modifiable mark.

[0038] The identifier is used to mark the manufactured photomasks as identification or distinguishing information for different photomasks. In some embodiments, the identifier may include one or more of the following: product batch number, serial number, factory code, date, and customer code. For example, some identifiers may include a serial number, factory code, and date; some identifiers may include a batch number, factory code, and date; and some identifiers may include a batch number, factory code, date, and customer code.

[0039] The identifier consists of multiple identifier codes, each of which can be a number or a letter. The number is any one of 0-9 (0, 1, 2, 3, 4, 5, 6, 7, 8, 9), and the letter is any one of AZ (A, B, C, D, E, F, G, H, I, J, K, L, M, N, O, P, Q, R, S, T, U, V, W, X, Y, Z). In some embodiments, the identifier may consist of multiple numbers, multiple letters, or a combination of multiple numbers and letters.

[0040] refer to Figures 3-5 ,in Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure along the cutting line AB. Figure 5 for Figure 3A cross-sectional view along the cutting line CD shows that multiple marking grooves 210 are formed in the edge region 22 of the transparent substrate 201. Each marking groove 210 includes multiple main grooves 211 arranged in rows and columns, and secondary grooves 212 connecting adjacent main grooves 211. The width W1 of the secondary groove 212 is smaller than the width W2 of the main groove 211.

[0041] One of the marking slots 210 is subsequently filled with opaque material to form a marking code, and multiple marking slots 210 are subsequently filled with opaque material to form multiple marking codes.

[0042] Each of the aforementioned marking slots 210 includes multiple main grooves 211 arranged in rows and columns, and secondary grooves 212 connecting adjacent main grooves 211. The width W1 of the secondary groove 212 is smaller than the width W2 of the main groove 211. On the one hand, the marking slots 210 with the aforementioned specific structure can facilitate the identification of the marking codes formed after being filled with opaque material. On the other hand, different numbers (0-9) or different letters (AZ) can be formed in a marking slot 210 with the aforementioned specific structure by different filling methods of the main grooves 211 and secondary grooves 212, so as to meet the needs of different markings.

[0043] In some embodiments, the width W1 of the secondary groove 212 is 1 / 3 to 2 / 3 of the width W2 of the main groove 211.

[0044] In some embodiments, the depth of the main groove 211 and the depth of the secondary groove 212 are the same. In other embodiments, the depth of the main groove 211 and the depth of the secondary groove 212 may be different. Specifically, the depth of the main groove 211 may be greater than or less than the depth of the secondary groove 212. After subsequent filling with opaque metal material, the surface height of the opaque metal material in the main groove 211 is different from the surface height of the opaque metal material in the secondary groove 212, making the formed identification code more three-dimensional and easier to identify.

[0045] In some embodiments, the plurality of main grooves 211 in each of the marking slots 210 are arranged in a 3x3, 4x4, or 5x5 row and column configuration, and adjacent main grooves 211 are connected by a secondary groove 212 in both the row and column directions. In this embodiment, the nine main grooves 211 in each of the marking slots 210 are arranged in a 3x3 row and column configuration, and adjacent main grooves 211 are connected by a secondary groove 212 in both the row and column directions, that is, a total of 10 secondary grooves 212 are needed to connect the nine main grooves 211 in both the row and column directions.

[0046] In some embodiments, the width of the marking groove 210 is 6-12 mm. The width of the marking groove 210 is the distance between the two outermost main grooves 211 on the transverse direction (row direction or direction parallel to the cutting line CD).

[0047] In some embodiments, the formation process of the marking groove 210 is as follows: a patterned mask layer (not shown in the figure) is formed on the surface of the transparent substrate 201. The patterned mask layer has a plurality of mask openings that expose the surface of the edge region of the transparent substrate 201. Each mask opening includes a plurality of main first openings arranged in rows and columns and a second opening connecting adjacent first openings. The width of the second opening is smaller than the width of the first opening. The position of the first opening corresponds to the position of the main groove, and the position of the second opening corresponds to the position of the sub-groove. Using the patterned mask layer as a mask, the transparent substrate 201 is etched along the mask openings to form a plurality of marking grooves 210 in the edge region of the transparent substrate 201. Each marking groove 210 includes a plurality of main grooves 211 arranged in rows and columns and a sub-groove 212 connecting adjacent main grooves 211. The width W1 of the sub-groove 212 is smaller than the width W2 of the main groove 211. In this embodiment, the formation of four marking grooves 210 in the edge region 22 is used as an example for illustration. In other embodiments, other numbers of marking slots may be formed in the edge region 22.

[0048] refer to Figures 6-8 ,in Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure along the cutting line AB. Figure 8 for Figure 6 A cross-sectional structural diagram along the cutting line CD shows that some main grooves 211 and secondary grooves 212 in the marking groove 210 are filled with opaque material, and marking codes 213 are formed in the marking groove 210. The multiple marking codes 213 formed in the multiple marking grooves 210 constitute a marking.

[0049] By filling some (all or part) of the main grooves 211 and secondary grooves 212 in one of the marking grooves 210 with an opaque material, an identification code 213 can be formed in the marking groove 210.

[0050] Different identifiers 213 can be formed by different filling combinations in the main groove 211 and the secondary groove 212 of an identifier slot 210. The identifier 213 can be a number or a letter. The number is any one of 0-9 (0, 1, 2, 3, 4, 5, 6, 7, 8, 9). For details, please refer to [reference needed]. Figure 9 , Figure 9The diagram, from left to right and top to bottom, shows the structural diagrams of the identification codes 0, 1, 2, 3, 4, 5, 6, 7, 8, and 9 after the identification slots are filled with opaque material. The letters are any one of AZ (A, B, C, D, E, F, G, H, I, J, K, L, M, N, O, P, Q, R, S, T, U, V, W, X, Y, Z). Please refer to the specific details. Figure 11 For details, please refer to Figure 10 , Figure 10 The diagrams, from left to right and top to bottom, show the structural diagrams of the identification codes A, B, C, D, E, F, G, H, I, J, K, L, M, N, O, P, Q, R, S, T, U, V, W, X, Y, and Z after the identification slots are filled with opaque material. That is, the identification slots 210 of this application, with their specific structure, can form both numbers and letters through different combinations of filling the main grooves 211 and secondary grooves 212, satisfying the need for diverse identification. In this embodiment, the identification code formed after filling the four identification slots 210 with opaque material is: 7CI1.

[0051] Continue to refer to Figures 6-8 In some embodiments, all the marking slots 210 can be filled to form a marking code. In other embodiments, only some of the marking slots 210 can be filled to form a marking code. If the marking needs to be modified in subsequent processes, such as adding new information, only the remaining marking slots 210 need to be filled with opaque material to form a marking code.

[0052] In some embodiments, when modifying the identifier according to process requirements, this application can easily modify the existing identifier code to meet the process requirements. Specifically, by removing some of the opaque material from the main groove and / or secondary groove of an existing identifier code, the existing identifier code can be modified into another identifier code, which is more efficient than... Figure 6 In this process, removing the two sides of the third letter identifier "I" can form the numerical identifier "1". Alternatively, by removing all the opaque material from the main and secondary grooves of an existing identifier and then filling the corresponding main and secondary grooves with opaque material, the existing identifier can be modified into another identifier. Figure 6 All the opaque material of one or more of these identification codes is removed, and then opaque material is filled into the corresponding main groove and secondary groove to modify the existing identification code into another identification code.

[0053] The opaque material is an opaque metal or ink. In some embodiments, the opaque material is the same as the material of the masking pattern 202 to be formed in the exposure area 21, both being opaque metals. The opaque metal is one or more of chromium, nickel, aluminum, ruthenium, molybdenum, titanium, tantalum, copper, tungsten, silver, and platinum, or one or more of chromium, nickel, aluminum, ruthenium, molybdenum, titanium, tantalum, copper, tungsten, silver, platinum, chromium oxide, iron oxide, niobium oxide, chromium nitride, molybdenum trioxide, molybdenum nitride, chromium oxide, titanium nitride, zirconium nitride, titanium oxide, tantalum nitride, tantalum oxide, silicon dioxide, niobium nitride, silicon nitride, silicon oxynitride, amorphous carbon, silicon carbide, neutral alumina, and alumina. The masking pattern 202 and the identification code 213 can be a single-layer or multi-layer stacked structure (e.g., a two-layer or higher stacked structure).

[0054] In some embodiments, the identification code 213 of the edge region 22 is formed simultaneously with the masking pattern 202 of the exposure region 21 to achieve the integration of the identification code process and the masking pattern process, thereby saving costs. In a specific embodiment, the formation process of the identification code 213 of the edge region 22 and the masking pattern 202 of the exposure region 21 includes: forming an opaque metal layer (not shown in the figure) on the surface of the edge region 22 and the exposure region 21 of the transparent substrate 201; forming a patterned mask layer (not shown in the figure) on the opaque metal layer, the patterned mask layer exposing the area of ​​the opaque metal layer that needs to be removed; using the patterned mask layer as a mask, etching to remove the exposed opaque metal layer, forming a plurality of discrete masking patterns 202 on the surface of the exposure region 21 of the transparent substrate 201, filling some main grooves and sub-grooves in the identification grooves 210 of the edge region 22 with opaque material, forming an identification code 213 in the identification grooves 210, and the plurality of identification codes 213 formed in the plurality of identification grooves 210 constituting an identification.

[0055] In other embodiments, when the opaque material is ink, the opaque material is filled into certain main and secondary grooves in the marking groove by a dot coating process.

[0056] In some embodiments, reference Figure 11 It also includes: forming an annular frame 204 surrounding the masking pattern 202 on the edge surface of the exposure area 21 of the transparent substrate 201; and forming a protective film 206 that closes the space inside the annular frame 204 on the top surface of the annular frame 204.

[0057] The annular frame 204 is used to support the protective film that is subsequently formed. The annular frame 204 and the protective film that are subsequently formed can isolate the masking pattern 202 on the photomask 201 and the surface of the middle area of ​​the photomask 201 from the external environment, preventing pollution from the external environment.

[0058] The annular frame 204 is a hollow ring, and the material of the annular frame 204 is a material with a certain mechanical strength. In some embodiments, the material of the annular frame 204 is aluminum. In other embodiments, the material of the annular frame 204 can be aluminum alloy, ceramic, carbon steel, or other suitable metallic or non-metallic materials.

[0059] In some embodiments, the annular frame 204 is adhered to the edge region of the transparent substrate by an adhesive layer 203.

[0060] The material of the adhesion layer 203 is an organic adhesive. In some embodiments, the organic adhesive is a rubber adhesive, a polyurethane adhesive, an acrylic adhesive, a SEBS (styrene-vinyl butene-styrene) adhesive, a SEPS (styrene-vinyl propylene-styrene) adhesive, or a siloxane adhesive.

[0061] The protective film 206 is made of a light-transmitting material.

[0062] Some embodiments of this application also provide a photomask identifier, see reference. Figures 6-8 ,in Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure along the cutting line AB. Figure 8 for Figure 6 A cross-sectional structural diagram along the cutting line CD, including:

[0063] A transparent substrate 201, the transparent substrate 201 including an exposure area 21 and an edge area 22 located around the exposure area 21;

[0064] The edge region 22 of the transparent substrate 201 has a plurality of marking grooves 210. Each marking groove 210 includes a plurality of main grooves 211 arranged in rows and columns and a secondary groove 212 connecting adjacent main grooves 211. The width of the secondary groove 212 is smaller than the width of the main groove 211. Some of the main grooves 211 and secondary grooves 212 in a marking groove 210 are filled with opaque material to form an identification code 213. The plurality of identification codes 213 corresponding to the plurality of marking grooves 210 constitute an identification.

[0065] In some embodiments, the plurality of main grooves 211 in each of the marking grooves 210 are arranged in rows and columns of 3x3, 4x4 or 5x5, and adjacent main grooves 211 are connected by a secondary groove 212 in both the row and column directions.

[0066] In some embodiments, the width W1 of the secondary groove 212 is 1 / 3 to 2 / 3 of the width W2 of the main groove 211.

[0067] In some embodiments, reference Figure 9 The identifier is any one of the digits 0-9. In some embodiments, reference is made to... Figure 10 The identifier code is any one of the letters A, Z, or Z.

[0068] In some embodiments, an existing identification code is modified to another identification code after removing some of the opaque material from the main groove and / or sub-groove, or an existing identification code is modified to another identification code after removing all the opaque material from the main groove and sub-groove and then filling the corresponding main groove and sub-groove with opaque material.

[0069] In some embodiments, the opaque material is an opaque metal or ink.

[0070] In some embodiments, the identifier includes one or more of the following: product batch number, serial number, factory code, date, and customer code.

[0071] In some embodiments, the width of the marking groove 210 is 6-12 mm.

[0072] In some embodiments, reference Figure 11 It also includes: a plurality of discrete masking patterns 202 located on the surface of the exposure area 21 of the transparent substrate 201; an annular frame 204 located on the edge surface of the exposure area 21 of the transparent substrate 201 surrounding the masking patterns 202; and a protective film 206 located on the top surface of the annular frame 204 to close the space inside the annular frame 204.

[0073] It should be noted that the limitations or descriptions of the same or similar parts in some embodiments of the photomask of this application and some embodiments of the aforementioned photomask formation method will not be repeated here. For details, please refer to the limitations or descriptions of the corresponding parts in some embodiments of the aforementioned photomask formation method.

[0074] Although this application has been disclosed above with reference to preferred embodiments, it is not intended to limit this application. Any person skilled in the art can make possible changes and modifications to the technical solutions of this application by utilizing the methods and techniques disclosed above without departing from the spirit and scope of this application. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall fall within the protection scope of the technical solutions of this application.

Claims

1. A photomask identifier, characterized in that, include: A transparent substrate, the transparent substrate including an exposure area and an edge area surrounding the exposure area; The edge region of the transparent substrate has multiple marking grooves. Each marking groove includes multiple main grooves arranged in rows and columns and secondary grooves connecting adjacent main grooves. The width of the secondary grooves is smaller than the width of the main grooves. Some main grooves and secondary grooves in a marking groove are filled with opaque material to form an identification code. Multiple identification codes corresponding to multiple marking grooves form an identification. An existing identification code can be modified to another identification code after removing some of the opaque material from the main groove and / or sub-groove, or an existing identification code can be modified to another identification code after removing all the opaque material from the main groove and sub-groove and then filling the corresponding main groove and sub-groove with opaque material.

2. The photomask marking as described in claim 1, characterized in that, The multiple main grooves in each of the marking slots are arranged in rows and columns of 3x3, 4x4 or 5x5, and adjacent main grooves are connected by a secondary groove in both the row and column directions.

3. The photomask marking as described in claim 1, characterized in that, The width of the secondary groove is 1 / 3 to 2 / 3 of the width of the main groove.

4. The photomask marking as described in claim 1, characterized in that, The identification code is any one of the numbers 0-9, or any one of the letters A, Z, or E.

5. The photomask marking as described in claim 1, characterized in that, The opaque material is an opaque metal or ink.

6. The photomask marking as described in claim 1, characterized in that, The identifier includes one or more of the following: product batch number, serial number, factory code, date, and customer code.

7. The photomask marking as described in claim 1, characterized in that, The width of the marking groove is 6-12mm.

8. The photomask marking as described in claim 1, characterized in that, The transparent substrate has several discrete masking patterns on the surface of the exposure area; the edge surface of the exposure area of ​​the transparent substrate has an annular frame surrounding the masking patterns; the top surface of the annular frame has a protective film that closes the space inside the annular frame.

9. A method for manufacturing a photomask mark, characterized in that, include: A transparent substrate is provided, the transparent substrate including an exposure area and an edge area surrounding the exposure area; Multiple marking grooves are formed in the edge region of the transparent substrate. Each marking groove includes multiple main grooves arranged in rows and columns and secondary grooves connecting adjacent main grooves. The width of the secondary grooves is smaller than the width of the main grooves. Some of the main and secondary grooves in the marking groove are filled with opaque material to form an identification code in the marking groove. The multiple identification codes formed in multiple marking grooves constitute an identification. The existing identification code can be modified into another identification code by removing some of the opaque material from the main groove and / or sub-groove of an existing identification code, or by removing all the opaque material from the main groove and sub-groove of a formed identification code and then filling the corresponding main groove and sub-groove with opaque material.

10. The method for manufacturing a photomask mark as described in claim 9, characterized in that, The opaque material is an opaque metal or ink.

11. The method for manufacturing a photomask mark as described in claim 10, characterized in that, Also includes: Several discrete masking patterns are formed on the surface of the exposure area of ​​the transparent substrate.

12. The method for manufacturing a photomask mark as described in claim 11, characterized in that, The process of forming the masking pattern and identification code includes: forming an opaque metal layer on the surface of the edge region and the exposure region of the transparent substrate; A patterned mask layer is formed on the opaque metal layer, exposing the area of ​​the opaque metal layer that needs to be removed. Using the patterned mask layer as a mask, the exposed opaque metal layer is etched away, and several discrete masking patterns are formed on the surface of the exposed area of ​​the transparent substrate. Some main grooves and sub-grooves in the marking grooves in the edge region are filled with opaque material, and identification codes are formed in the marking grooves. Multiple identification codes formed in multiple marking grooves constitute an identification.

13. The method for manufacturing a photomask mark as described in claim 10, characterized in that, When the opaque material is ink, it is filled into some of the main and secondary grooves in the marking groove by a dot coating process.

14. The method for manufacturing a photomask mark as described in claim 9, characterized in that, An identifier can be any one of the numbers 0-9, or any one of the letters A, Z, or E.

15. The method for manufacturing a photomask mark as described in claim 9, characterized in that, The multiple main grooves in each of the marking slots are arranged in rows and columns of 3x3, 4x4 or 5x5, and adjacent main grooves are connected by a secondary groove in both the row and column directions.

16. The method for manufacturing a photomask mark as described in claim 9, characterized in that, The width of the secondary groove is 1 / 3 to 2 / 3 of the width of the main groove, and the width of the marking groove is 6-12mm.

17. The method for manufacturing a photomask mark as described in claim 11, characterized in that, It also includes: an annular frame surrounding the masking pattern on the edge surface of the exposure area of ​​the transparent substrate; A protective membrane located on the top surface of the annular frame to enclose the space inside the annular frame.

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