Automatic film tearing mechanism after wafer film pasting

Abstract

The application discloses an automatic film tearing mechanism for wafer after film pasting, comprising a film tearing arm, a film tearing table and a film placing and ironing assembly, the film tearing arm is arranged on one side of the film tearing table, and the film tearing arm and the film tearing table are arranged in parallel, the film placing and ironing assembly is installed above the film tearing table, the film is pressed by a film pressing cylinder, the second supporting plate is driven to extend by a supporting plate two cylinder, the supporting plate passes through the groove of the film pressing block, at the same time, the film placing motor is electrified to drive the belt, the coiled material adhesive tape is ensured to be in a taut state, the wafer with back adhesive is placed on the adsorption disc, the wafer is heated with the back adhesive upward, finally, the rotation motor drives the adsorption disc to rotate, and the film tearing process is facilitated. The application has compact structure, can realize automatic film tearing of wafer surface, can be integrated into an automatic assembly line of wafer processing at the same time, effectively improves work efficiency and reduces labor cost.

Description

Technical Field

[0001] This invention relates to an automatic film peeling mechanism for wafers after film lamination, belonging to the field of semiconductor chip processing technology. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. They are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, and high-power power conversion. From both a technological and economic development perspective, the importance of semiconductors is immense. Most electronic products, such as computers, mobile phones, and digital recorders, rely heavily on semiconductors as their core components. The government is also strongly supporting research and development by relevant enterprises and research institutions, and semiconductor processing equipment is gradually being localized.

[0003] Among them, wafers refer to silicon wafers used to manufacture silicon semiconductor circuits. The wafer manufacturing process is quite complex, involving many steps, with loading and unloading being a crucial one. Currently, most equipment is equipped with individual material boxes, which are manually changed. However, if the material is not changed in time, the machine must be stopped, reducing the efficiency of the production line.

[0004] Therefore, this case proposes an automatic film-removing mechanism for wafers after film lamination. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology and provide an automatic film peeling mechanism for wafers after film lamination.

[0006] The objective of this invention is achieved through the following technical solution: an automatic film peeling mechanism for wafer lamination, comprising a film peeling arm, a film peeling platform, and a film placement and heating assembly. The film peeling arm is located on one side of the film peeling platform and is arranged adjacent to and parallel to the film peeling platform. The film placement and heating assembly is installed directly above the film peeling platform.

[0007] The film-tearing arm includes a linear module, a cylinder, a clamping cylinder, and a nozzle. The linear module is equipped with a sliding block. The cylinder is movably connected to the sliding block through a cylinder fixing plate, and an arm plate is installed on the cylinder's slide. A lower clamping block is fixed to the arm plate, and a clamping cylinder is fixedly installed between the arm plate and the lower clamping block. The extended end of the clamping cylinder is fixedly connected to the end of the upper clamping block. The nozzle passes through a set screw and connects to the nozzle fixing block, which is then connected and fixed to the arm plate.

[0008] The film-tearing table includes a rotating table and a two-stage telescopic mechanism. The rotating table is fixed on the base, and the two-stage telescopic mechanism is installed at the bottom of the rotating table. The two-stage telescopic mechanism is equipped with a lifting support plate.

[0009] The film feeding and heating assembly includes a diaphragm clamping cylinder, a first lifting cylinder, a second lifting cylinder, a heating block lifting cylinder, and a film cutting cylinder. The first and second lifting cylinders are sequentially mounted on a fixed base plate. The extension rod of the first lifting cylinder is fixedly connected to the first lifting base plate. A film feeding motor is fixedly mounted on the upper surface of the first lifting base plate. The diaphragm clamping cylinder is installed adjacent to the film feeding motor and is fixed to the first lifting base plate via a film feeding roller. The lower surface of the first lifting base plate is sequentially equipped with a second support plate cylinder, a first support plate cylinder, a film guide block, and a pressure... The membrane cylinder includes a first pallet cylinder connected to a first pallet, whose retraction operation causes the first pallet to extend; a second pallet cylinder connected to a second pallet, whose forward operation causes the second pallet to extend; a membrane pressing block on the lower side of the second pallet; a second lifting cylinder whose extended end is fixedly mounted on a second lifting base plate; a heating block lifting cylinder mounted on the second lifting base plate via an L-shaped third fixing plate; a heating block on the extended end of the heating block lifting cylinder; and a membrane cutting cylinder mounted on the third fixing plate, with a membrane cutting knife on the extended end of the membrane cutting cylinder.

[0010] Furthermore, in the aforementioned automatic film-removing mechanism for wafer lamination, the base includes a base plate and a lead screw, with the lead screw fixedly installed on the inner side of the U-shaped base plate.

[0011] Furthermore, in the aforementioned automatic film-removing mechanism for wafer lamination, the rotating platform is provided with two sets of guide rails, a rotary motor, and an adsorption plate. The two sets of guide rails are respectively installed on the upper surfaces of both sides of the bottom of the rotating platform, and both sets of guide rails are connected to the base plate of the rotating platform. The rotary motor is fastened to the bottom of the rotating platform by a screw nut. The adsorption plate is fixed to the upper surface of the rotating platform, and a heating element is attached to the back of the adsorption plate.

[0012] Furthermore, in the aforementioned automatic film-removing mechanism for wafer lamination, the lifting tray includes a tray and a buffer cylinder, with the tray fixedly mounted on the slide of the buffer cylinder.

[0013] Furthermore, in the aforementioned automatic film-removing mechanism for wafer lamination, the two-stage telescopic mechanism includes a primary cylinder and a secondary cylinder. The primary cylinder and the secondary cylinder are respectively installed at the bottom of the rotary table. A first fixed plate is installed on the slider of the primary cylinder, and the secondary cylinder is fixedly installed to the second fixed plate through its own extension rod.

[0014] Compared with the prior art, the present invention has significant advantages and beneficial effects, specifically reflected in the following aspects:

[0015] This invention has a compact structure and, in addition to enabling automated film removal, can be integrated into automated wafer processing lines to improve overall operational efficiency.

[0016] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing specific embodiments of the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 : A schematic diagram of the overall structure of the present invention;

[0019] Figure 2 : A schematic diagram of the structure of the film-tearing arm of this invention;

[0020] Figure 3 : A partial structural schematic diagram of the film-tearing arm of this invention;

[0021] Figure 4 : A schematic diagram of the structure of the base of this invention;

[0022] Figure 5 : A schematic diagram of the structure of the rotary table of the present invention;

[0023] Figure 6 : A schematic diagram of the lifting platform of the present invention;

[0024] Figure 7 : A schematic diagram of the two-stage telescopic mechanism of the present invention;

[0025] Figure 8 : A schematic diagram of the left-side structure of the film-laying and film-heating assembly of the present invention;

[0026] Figure 9 : Right-side structural schematic diagram of the film-laying and heat-pressing assembly of the present invention

[0027] Figure 10 : A partial structural schematic diagram of the film-laying and film-heating assembly of the present invention.

[0028] The meanings of the various labels in the figures are shown in the table below:

[0029]

[0030] Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0032] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this invention, directional and ordinal terms are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] like Figure 1 As shown, the automatic film peeling mechanism for wafer lamination proposed in this case includes a film peeling arm 1, a film peeling table 2, and a film placement and heating assembly 3. The film peeling arm 1 is located on one side of the film peeling table 2, and the film peeling arm 1 and the film peeling table 2 are arranged adjacent to each other and parallel to each other. The film placement and heating assembly 3 is installed directly above the film peeling table 2.

[0034] Among them, such as Figure 2 and Figure 3 As shown, the film-tearing arm 1 includes a linear module 11, a cylinder 13, a clamping cylinder 15, and a nozzle 16. The linear module 11 is provided with a sliding block. The cylinder 13 is movably connected to the sliding block through a cylinder fixing plate 12. An arm plate 14 is installed on the slide of the cylinder 13. A lower clamping block 19 is fixed on the arm plate 14. A clamping cylinder 15 is fixedly installed between the arm plate 14 and the lower clamping block 19. The extended end of the clamping cylinder 15 is fixedly connected to the end of the upper clamping block 17. The nozzle 16 is connected to the nozzle fixing block 18 through a set screw. Blowing air through the nozzle 16 can prevent the tape from sticking to the clamping position of the film-tearing arm 1, ensuring that the waste film falls into the waste recycling area. The nozzle fixing block 18 is then connected and fixed to the arm plate 14.

[0035] Secondly, the film-tearing table 2 includes a rotating table 22 and a two-stage telescopic mechanism 24. The rotating table 22 is fixed on the base 21, and the two-stage telescopic mechanism 24 is installed at the bottom of the rotating table 22. The two-stage telescopic mechanism 24 is provided with a lifting support plate 23.

[0036] like Figure 4 As shown, the base 21 includes a base plate 211 and a lead screw 212. The lead screw 212 is fixedly installed on the inner side of the U-shaped base plate 211, and the suction plate 224 is moved by the lead screw 212.

[0037] like Figure 5 As shown, the rotary table 22 is equipped with two sets of guide rails 221, a rotary motor 222, and an adsorption plate 224. The two sets of guide rails 221 are respectively installed on the upper surfaces of the two sides of the bottom of the rotary table 22, and both sets of guide rails 221 are connected to the base plate of the rotary table 22. The rotary motor 222 is fastened to the bottom of the rotary table 22 by a screw nut. The adsorption plate 224 is fixed to the upper surface of the rotary table 22, and a heating element 223 is attached to the back of the adsorption plate 224 to ensure that the surface of the adsorption plate 224 maintains a constant temperature. The rotary motor 222 can be used to drive the adsorption plate 224 to rotate at a certain angle. The purpose is to peel off the film from the diagonal direction of a single wafer, which makes it easier to peel off and reduces the risk of tearing a single wafer.

[0038] like Figure 6 As shown, the lifting pallet 23 includes a pallet 231 and a buffer cylinder 232. The pallet 231 is fixedly installed on the slide of the buffer cylinder 232. The pallet 231 can be raised by the buffer cylinder 232. The surface of the pallet 231 is coated with an anti-stick coating to prevent the torn film from sticking to the wafer again.

[0039] like Figure 7 As shown, the two-stage telescopic mechanism 24 includes a first-stage cylinder 241 and a second-stage cylinder 243. The first-stage cylinder 241 and the second-stage cylinder 243 are respectively installed at the bottom of the rotary table 22. A first fixed plate 242 is installed on the slider of the first-stage cylinder 241, and the second-stage cylinder 243 is fixedly installed with the second fixed plate 244 through its own extension rod.

[0040] Finally, as Figures 8-10As shown, the film feeding and heating assembly 3 includes a diaphragm clamping cylinder 34, a first lifting cylinder 35, a second lifting cylinder 312, a heating block lifting cylinder 317, and a film cutting cylinder 319. The first lifting cylinder 35 and the second lifting cylinder 312 are sequentially mounted on a fixed base plate 31. The extension rod of the first lifting cylinder 35 is fixedly connected to the first lifting base plate 310. A film feeding motor 32 is fixedly mounted on the upper surface of the first lifting base plate 310. The diaphragm clamping cylinder 34 is installed adjacent to the film feeding motor 32 and is fixed to the first lifting base plate 310 via a film feeding roller 33. A second support plate cylinder 38, a first support plate cylinder 37, a film guide block 36, and a film pressing cylinder 39 are sequentially mounted on the lower surface of the first lifting base plate 310. The first support plate cylinder 37 is connected to the first support plate cylinder 310. The first pallet 313 is connected to the second pallet 315. The first pallet 313 is extended by the retraction of the first pallet cylinder 37. The second pallet 315 is connected to the second pallet cylinder 38. The second pallet cylinder 38 is extended by the push-up operation, which extends the second pallet 315. The second pallet 315 is provided with a film pressing block 314 on its lower side. The exposed roll of adhesive tape can be supported by the second pallet 315 to ensure that the tape does not sag. The extended end of the second lifting cylinder 312 is fixedly installed on the second lifting base plate 311. The heating block lifting cylinder 317 is installed on the second lifting base plate 311 through the L-shaped third fixing plate 316. The extended end of the heating block lifting cylinder 317 is provided with a heating block 318. The film cutting cylinder 319 is installed on the third fixing plate 316. The extended end of the film cutting cylinder 319 is provided with a film cutting knife 320.

[0041] In practical applications, on the one hand, the heating element 223 is energized for preheating, the roll of adhesive tape is fixedly sleeved on the film-laying roller 33, and the diaphragm clamping cylinder 34 is energized to further clamp the roll of adhesive tape, pulling the tape out a section and passing it through the guide block 36, then under the pressure cylinder 39, so that a portion of the tape protrudes outside the pressure block 314. When the pressure cylinder 39 is energized to press the tape, the control plate cylinder 38 is pushed forward, driving the second plate 315 to extend and pass through the groove of the pressure block 314. At the same time, the film-laying motor 32 is energized to perform film-laying. Belt drive ensures the roll of adhesive tape remains taut. The wafer with adhesive backing is placed on the suction tray 224, with the adhesive side facing upwards, for wafer heating. A rotary motor 222 drives the suction tray 224 to rotate, facilitating film removal. Simultaneously, a lead screw 212 drives the suction tray 224 along the guide rails 221 to stop directly below the film-laying and heating assembly 3. At this time, the film-removing arm 1 moves synchronously, controlling the lifting cylinder 35 to lower the lifting base plate 310. When the second pallet cylinder 38, the first pallet cylinder 37, the guide block 36, and the pressure cylinder 39 installed on the 0 all move to the lower position, the film-tearing arm 1 moves to the left, causing the lower clamping block 19 to push the second pallet 315 to also move to the left, allowing the tape to smoothly enter the clamping opening of the film-tearing arm 1. By pressing down and clamping the tape with the clamping cylinder 15, and simultaneously activating the pressure cylinder 39 to release the tape, the film-tearing arm 1 can then move to the right while holding the tape, thereby pulling out the tape and stopping it at the designated position. In addition, the second lifting cylinder 312 drives the second lifting arm 315 to move to the right while holding the tape with the film-tearing arm 1. The base plate 311 and the heating block lifting cylinder 317 installed on it descend together, causing the heating block lifting cylinder 317 to drive the heating block 318 to descend synchronously. While the heating block 318 presses the tape tightly, it heats the back adhesive of the wafer. After the tape and the back adhesive are heated and bonded, the tape is cut by the cutting cylinder 319 driving the cutting knife 320. The tearing arm 1 holds the tape and slowly moves to the left to tear the film. After it is completely torn off, the clamping cylinder 15 is released, and the cylinder 232 descends to lower and hide the support plate 231, completing the operation.

[0042] In summary, this invention features a unique and compact design, enabling automated film removal from wafer surfaces and seamless integration into automated wafer processing lines, thereby improving operational efficiency.

[0043] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the scope of protection of the invention. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0044] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

[0045] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. An automatic film peeling mechanism for wafer lamination, comprising a film peeling arm (1), a film peeling table (2), and a film placement and heating assembly (3), wherein the film peeling arm (1) is disposed on one side of the film peeling table (2), and the film peeling arm (1) and the film peeling table (2) are arranged adjacently and parallel to each other, and the film placement and heating assembly (3) is installed directly above the film peeling table (2), characterized in that: The film-tearing arm (1) includes a linear module (11), a cylinder (13), a clamping cylinder (15), and a nozzle (16). The linear module (11) is provided with a sliding block. The cylinder (13) is movably connected to the sliding block through a cylinder fixing plate (12). An arm plate (14) is installed on the slide of the cylinder (13). A lower clamping block (19) is fixed on the arm plate (14). A clamping cylinder (15) is fixedly installed between the arm plate (14) and the lower clamping block (19). The extended end of the clamping cylinder (15) is fixedly connected to the end of the upper clamping block (17). The nozzle (16) is connected to the nozzle fixing block (18) through a set screw. The nozzle fixing block (18) is then connected to... The arm plate (14) is connected and fixed; the film-tearing table (2) includes a rotating table (22) and a two-stage telescopic mechanism (24). The rotating table (22) is fixed on the base (21). The two-stage telescopic mechanism (24) is installed at the bottom of the rotating table (22), and a lifting support plate (23) is provided on the two-stage telescopic mechanism (24); the film-laying and film-heating assembly (3) includes a film clamping cylinder (34), a lifting cylinder one (35), a lifting cylinder two (312), a heating block lifting cylinder (317), and a film-cutting cylinder (319). The lifting cylinder one (35) and the lifting cylinder two (312) are installed on the fixed base plate (31) in sequence. The extension of the lifting cylinder one (35) The rod is fixedly connected to the first lifting base plate (310). A film-laying motor (32) is fixedly installed on the upper surface of the first lifting base plate (310). The diaphragm clamping cylinder (34) is installed adjacent to the film-laying motor (32). The diaphragm clamping cylinder (34) is fixed to the first lifting base plate (310) through the film-laying roller (33). The lower surface of the first lifting base plate (310) is sequentially equipped with a second support cylinder (38), a first support cylinder (37), a film guide block (36), and a film pressing cylinder (39). The first support cylinder (37) is connected to the first support plate (313). When the first support cylinder (37) retracts, it drives the first support plate (313) to extend. The second cylinder (38) is connected to the second support plate (315). The second cylinder (38) pushes the second support plate (315) to extend. The second support plate (315) has a pressing block (314) on its lower side. The extended end of the second lifting cylinder (312) is fixedly installed on the second lifting base plate (311). The heating block lifting cylinder (317) is installed on the second lifting base plate (311) through the L-shaped third fixing plate (316). The extended end of the heating block lifting cylinder (317) is provided with a heating block (318). The film cutting cylinder (319) is installed on the third fixing plate (316). The extended end of the film cutting cylinder (319) is provided with a film cutting knife (320). The rotating table (22) is provided with two sets of guide rails (221), a rotary motor (222) and an adsorption plate (224). The two sets of guide rails (221) are respectively installed on the upper surfaces of the bottom sides of the rotating table (22), and both sets of guide rails (221) are connected to the bottom plate of the rotating table (22). The rotary motor (222) is fastened to the bottom of the rotating table (22) by a screw nut. The adsorption plate (224) is fixed to the upper surface of the rotating table (22).

2. The automatic film peeling mechanism for wafer lamination according to claim 1, characterized in that: The base (21) includes a base plate (211) and a lead screw (212), which is fixedly installed on the inner side of the U-shaped base plate (211).

3. The automatic film peeling mechanism for wafer lamination according to claim 1, characterized in that: A heating element (223) is attached to the back of the adsorption plate (224).

4. The automatic film peeling mechanism for wafer lamination according to claim 1, characterized in that: The lifting pallet (23) includes a pallet (231) and a buffer cylinder (232), wherein the pallet (231) is fixedly installed on the slide of the buffer cylinder (232).

5. The automatic film peeling mechanism for wafer lamination according to claim 1, characterized in that: The two-stage telescopic mechanism (24) includes a first-stage cylinder (241) and a second-stage cylinder (243). The first-stage cylinder (241) and the second-stage cylinder (243) are respectively installed at the bottom of the rotary table (22). A first fixed plate (242) is installed on the slider of the first-stage cylinder (241), and the second-stage cylinder (243) is fixedly installed with the second fixed plate (244) through its own extension rod.

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