A transfer mechanism and a transfer method

Abstract

The present application discloses a transfer mechanism and a transfer method, belonging to the field of display technology. The transfer mechanism provided by the present application includes a transfer auxiliary plate and a transfer substrate. Among them, the transfer auxiliary plate includes opposite first and second surfaces, and a plurality of openings penetrating the first and second surfaces and arranged in an array are provided on the transfer auxiliary plate. One side surface of the transfer substrate is used to arrange a plurality of micro-elements to be transferred to a target substrate. When performing massive transfer using the transfer mechanism, the transfer auxiliary plate can be arranged between the target substrate and the transfer substrate, and a plurality of receiving areas arranged in an array on the bearing surface of the target substrate correspond to the plurality of openings one by one. Then, the plurality of micro-elements can be transferred to the receiving areas through the openings. The openings can limit the micro-elements, improve the alignment accuracy of the micro-elements with the target substrate, and make the movement space of the micro-elements in the openings small, reducing the probability of rotational deviation. Therefore, the present application can improve the transfer yield in the massive transfer process.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a transfer mechanism and a transfer method. Background Art

[0002] As a new generation of display technology, Micro-LED display technology has advantages such as high brightness, high luminous efficiency, low power consumption, and high stability, and has become a research hotspot for people to pursue a new generation of display technology. With the development of technology, the size of micro-components such as Micro-LED chips is continuously shrinking, the number of micro-components that need to be transferred in large quantities to a target substrate is increasing, and the challenges faced by the mass transfer technology are becoming increasingly difficult.

[0003] The inventors of this application found in long-term research on mass transfer that in the existing mass transfer process, the alignment accuracy between micro-components and the target substrate is relatively low, and the micro-components are prone to rotation and displacement during the transfer to the target substrate, resulting in a relatively low transfer yield in the mass transfer process. Summary of the Invention

[0004] The main technical problem to be solved by this application is to provide a transfer mechanism and a transfer method that can improve the transfer yield in the mass transfer process.

[0005] To solve the above technical problem, a technical solution adopted by this application is: to provide a transfer mechanism, including:

[0006] A transfer auxiliary plate, including opposite first and second surfaces, and a plurality of openings arranged in an array are provided on the transfer auxiliary plate, and the plurality of openings penetrate through the first surface and the second surface;

[0007] A transfer substrate, one side surface of which is used to arrange a plurality of micro-components to be transferred to a target substrate;

[0008] Wherein, the transfer auxiliary plate is used to be arranged between the target substrate and the transfer substrate, a plurality of receiving areas arranged in an array are provided on the bearing surface of the target substrate, the plurality of receiving areas correspond to the plurality of openings one by one, and the plurality of micro-components can be transferred to the receiving areas through the openings.

[0009] Wherein, in the direction from the first surface to the second surface, the cross-section of the opening is trapezoidal in reverse;

[0010] Preferably, the shapes of the opening on the first surface and the second surface are rectangular.

[0011] Wherein, the transfer mechanism further includes: a plurality of deformation members, one deformation member is arranged on the inner wall of one opening; wherein, the deformation member can undergo expansion deformation under preset conditions.

[0012] Wherein, in the direction from the first surface to the second surface, one end of the deformable member is flush with the first surface, and the other end of the deformable member is retracted relative to the second surface.

[0013] Wherein, the deformable member is annular and fits with the inner wall in the circumferential direction of the inner wall; or,

[0014] The deformation member includes a plurality of sub-deformation members, and the plurality of sub-deformation members are arranged at intervals along the circumference of the inner wall and are in contact with the inner wall;

[0015] Preferably, the deformation member includes two sub-deformation members arranged opposite to each other.

[0016] Wherein, the opening includes a first through hole and a second through hole which are interconnected, the first through hole is close to the first surface, the second through hole is close to the second surface, and the aperture of the first through hole is larger than the aperture of the second through hole; wherein the deformable member is arranged on the inner wall of the first through hole.

[0017] The transfer auxiliary plate is provided with a first alignment mark, which is located on the first surface and the second surface, and the transfer substrate is provided with a second alignment mark, and the first alignment mark is used to align with the second alignment mark and the third alignment mark respectively; wherein the third alignment mark is located on the target substrate;

[0018] Preferably, the alignment mark is in the shape of a cross.

[0019] In order to solve the above technical problems, another technical solution adopted by the present application is to provide a transfer method, comprising:

[0020] Providing the transfer mechanism described in the above technical solution, and setting the transfer auxiliary plate on the carrying surface of the target substrate, wherein the carrying surface is provided with a plurality of receiving areas arranged in an array, and the plurality of receiving areas correspond to the plurality of openings one by one;

[0021] The transfer substrate is arranged on a side of the transfer auxiliary plate away from the target substrate, and a plurality of micro-components are arranged on a side of the transfer substrate facing the transfer auxiliary plate, wherein one micro-component corresponds to one opening;

[0022] The plurality of micro-components are separated from the transfer substrate, and at least some of the micro-components are transferred to the receiving area through the corresponding openings.

[0023] Wherein, the transfer mechanism further comprises a plurality of deformable members, one of the deformable members is arranged on an inner wall of one of the openings, and the deformable member can expand and deform under preset conditions;

[0024] Before the step of separating the multiple micro-components from the transfer substrate, the method further includes:

[0025] Expanding and deforming the deformable member, and there is a gap between the deformable member after the expansion and deformation and the corresponding micro-component;

[0026] Wherein, after the multiple micro-components are separated from the transfer substrate, all the micro-components are transferred to the receiving area through the corresponding openings.

[0027] Wherein, the transfer mechanism further includes a plurality of deformable members, one deformable member is arranged on the inner wall of one opening, and the deformable member can expand and deform under preset conditions;

[0028] Before the step of separating the multiple micro-components from the transfer substrate, the method further includes:

[0029] Expanding and deforming the deformable member, and there is a gap between a part of the deformable member after the expansion and deformation and the corresponding micro-component, and the remaining part of the deformable member abuts against the corresponding micro-component;

[0030] Wherein, after the multiple micro-components are separated from the transfer substrate, only the micro-components corresponding to the part of the deformable members are transferred to the receiving area through the corresponding openings.

[0031] The beneficial effect of the present application is that: the transfer mechanism provided by the present application includes a transfer auxiliary plate and a transfer substrate. Among them, the transfer auxiliary plate includes opposite first and second surfaces, and a plurality of openings arranged in an array are provided on the transfer auxiliary plate, and the plurality of openings penetrate the first surface and the second surface. One side surface of the transfer substrate is used to arrange a plurality of micro-components to be transferred to the target substrate. When performing mass transfer by using the transfer mechanism provided by the present application, the transfer auxiliary plate can be arranged between the target substrate and the transfer substrate, and a plurality of receiving areas arranged in an array on the bearing surface of the target substrate correspond to the plurality of openings one by one, so that the plurality of micro-components can be transferred to the receiving area through the openings. During the transfer process, the openings provided on the transfer auxiliary plate can play a role in limiting the micro-components, which can improve the alignment accuracy of the micro-components and the target substrate, and the size of the openings can be set according to the size of the micro-components, so that during the process of the micro-components falling into the receiving area after being separated from the transfer substrate, the activity space of the micro-components in the openings is small, thereby reducing the probability of the micro-components rotating and deflecting. Therefore, the present application can improve the transfer yield during the mass transfer process. Description of the Drawings

[0032] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings. Among them:

[0033] Figure 1 It is a schematic structural diagram of an embodiment of the transfer mechanism of the present application;

[0034] Figure 2 It is a top view schematic diagram of an embodiment of the transfer auxiliary plate;

[0035] Figure 3 It is a schematic structural diagram of another embodiment of the transfer mechanism of the present application;

[0036] Figure 4 It is a schematic structural diagram of another embodiment of the transfer mechanism of the present application;

[0037] Figure 5 It is a schematic structural diagram of another embodiment of the transfer mechanism of the present application;

[0038] Figure 6 It is a top view schematic diagram of another embodiment of the transfer auxiliary plate;

[0039] Figure 7 It is a top view schematic diagram of another embodiment of the transfer auxiliary plate;

[0040] Figure 8 It is a schematic structural diagram of another embodiment of the transfer auxiliary plate;

[0041] Figure 9 It is a schematic flowchart of an embodiment of the transfer method of the present application;

[0042] Figure 10a For Figure 9 It is a schematic structural diagram corresponding to step S11 in an embodiment;

[0043] Figure 10b For Figure 9 It is a schematic structural diagram corresponding to step S12 in an embodiment;

[0044] Figure 10c For Figure 9 It is a schematic structural diagram corresponding to step S13 in an embodiment;

[0045] Figure 11 For Figure 9 It is a schematic structural diagram corresponding to another embodiment of step S13;

[0046] Figure 12 For Figure 9Schematic diagram corresponding to another embodiment of step S13. Detailed implementation mode

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0048] Please refer to Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the structure of an embodiment of the transfer mechanism of the present application, Figure 2 is a top view schematic diagram of an embodiment of the transfer auxiliary plate. The transfer mechanism includes a transfer auxiliary plate 11 and a transfer substrate 12. Among them, the transfer auxiliary plate 11 includes opposite first surface 111 and second surface 112, and a plurality of openings 113 arranged in an array are provided on the transfer auxiliary plate 11, and these plurality of openings 113 penetrate the first surface 111 and the second surface 112. One side surface of the transfer substrate 12 is used to set a plurality of micro-elements 120 to be transferred to the target substrate. To clearly illustrate the operation of the transfer mechanism, the target substrate 100 is drawn in Figure 1 . When it is necessary to transfer a plurality of micro-elements 120 to the target substrate 100, the micro-elements 120 can be first set on one side surface of the transfer substrate 12, and then the micro-elements 120 can be transferred to the bearing surface of the target substrate 100 in combination with the transfer auxiliary plate 11. Among them, the depth of the opening 113 is greater than the thickness of the micro-element 120, and the space formed by the opening 113 can completely accommodate the micro-element 120.

[0049] Specifically, the transfer auxiliary plate 11 is used to be arranged between the target substrate 100 and the transfer substrate 12. A plurality of receiving areas arranged in an array are provided on the bearing surface of the target substrate 100, and these plurality of receiving areas correspond one-to-one to the plurality of openings 113 provided on the transfer auxiliary plate 11, that is, the receiving areas on the bearing surface can be exposed from the openings 113.

[0050] In this embodiment, a first alignment mark M1 is provided on the transfer auxiliary plate 11, located on the first surface 111 and the second surface 112. A second alignment mark M2 is provided on the transfer substrate 12. In addition, a third alignment mark N is provided on the bearing surface of the target substrate 100. The first alignment mark M1 is respectively used to align with the second alignment mark M2 and the third alignment mark N. Preferably, each of the above alignment marks is in a cross shape. During the transfer process, the first alignment mark M1 located on the first surface 111 or the second surface 112 and the third alignment mark N on the target substrate 100 can be aligned first, so that the transfer auxiliary plate 11 is aligned with the target substrate 100. Then, the first alignment mark M1 on the other surface and the second alignment mark M2 on the transfer substrate 12 are aligned, so that the transfer auxiliary plate 11 is aligned with the transfer substrate 12. Then, the micro component 120 is transferred to the receiving area.

[0051] During the transfer process, the opening 113 can play a role in limiting the micro component 120, which can improve the alignment accuracy between the micro component 120 and the target substrate 100. Moreover, the size of the opening 113 can be set according to the size of the micro component 120, so that during the process that the micro component 120 separated from the transfer substrate 12 drops into the receiving area, the activity space of the micro component 120 in the opening 113 is small, thereby reducing the probability of rotation and deviation of the micro component 120. It can be seen that this embodiment can improve the transfer yield of the mass transfer process.

[0052] In one embodiment, please refer to Figure 3 , Figure 3 which is a schematic structural diagram of another embodiment of the transfer mechanism of the present application. The transfer mechanism includes a transfer auxiliary plate 11 and a transfer substrate 12. Among them, the transfer auxiliary plate 11 includes opposite first surface 111 and second surface 112, and a plurality of openings 113 arranged in an array are provided on the transfer auxiliary plate 11, and these plurality of openings 113 penetrate the first surface 111 and the second surface 112. Different from the above embodiment, in this embodiment, in the direction from the first surface 111 to the second surface 112, the cross section of the opening 113 is in an inverted trapezoid shape.

[0053] Preferably, the shapes of the opening 113 on the first surface 111 and the second surface 112 are rectangular, such as rectangular, square, etc., for adapting to the shapes of the micro components 120 in most application scenarios. Of course, it can also be set to other shapes such as circular for adapting to the transfer of micro components 120 with special shapes.

[0054] On the one hand, this embodiment can improve the alignment accuracy between the micro-component 120 and the target substrate 100 by using the opening 113. On the other hand, the inner diameter of one end of the opening 113 close to the first surface 111 is larger, which facilitates the alignment of the micro-component 120 disposed on the transfer substrate 12 with the opening. And the inner diameter of one end of the opening 113 close to the second surface 112 is smaller, which can further reduce the movement space of the micro-component 120 during the process of the micro-component 120 falling into the receiving area, thereby further reducing the probability of rotational misalignment of the micro-component 120 and improving the transfer yield of the mass transfer process.

[0055] In one embodiment, please refer to Figure 4 , Figure 4 which is a schematic structural diagram of another embodiment of the transfer mechanism of the present application. The transfer mechanism includes a transfer auxiliary plate 11, a transfer substrate 12, and a plurality of deformation members 13. The structures of the transfer auxiliary plate 11 and the transfer substrate 12 can refer to the above embodiments. In this embodiment, one deformation member 13 is disposed on the inner wall of one opening 113, and the deformation member 13 covers at least a part of the inner wall. Figure 4 The situation where the deformation member 13 covers the entire inner wall of the corresponding opening 113 is schematically drawn.

[0056] Among them, the deformation member 13 can undergo expansion deformation under preset conditions, so that the orthographic projection area of the hollow region S formed by the opening 113 and the corresponding deformation member 13 on the first surface 111 decreases. For example, the deformation member 13 is a photosensitive deformation material, which undergoes expansion deformation after receiving light irradiation of a preset wavelength.

[0057] After the deformation member 13 is disposed on the inner wall of the opening 113, the internal space of the opening 113 can completely accommodate the micro-component 120. After setting preset conditions to make the deformation member 13 expand and deform, the above internal space becomes smaller, but still can completely accommodate the micro-component 120, only the movement space of the micro-component 120 becomes further smaller, thereby further reducing the probability of rotational misalignment of the micro-component 120 and improving the transfer yield of the mass transfer process.

[0058] In one embodiment, please refer to Figure 5 , Figure 5 which is a schematic structural diagram of another embodiment of the transfer mechanism of the present application. The transfer mechanism includes a transfer auxiliary plate 11, a transfer substrate 12, and a plurality of deformation members 13. Different from the above embodiment, in this embodiment, one deformation member 13 covers a part of the inner wall of the corresponding opening 113. Specifically, in the direction from the first surface 111 to the second surface 112, one end of the deformation member 13 is flush with the first surface 111, and the other end of the deformation member 13 is retracted relative to the second surface 112.

[0059] Bonding electrodes (not labeled) for bonding with the micro-components 120 are provided on the receiving area of the target substrate 100. In this embodiment, the length of the deformation member 13 is set to be less than the depth of the opening 113, which can prevent the deformation member 13 from expanding and deforming and then contacting the bonding electrodes, which can reduce the probability of rotation and deviation of the micro-components 120 during the transfer process on one hand, improve the transfer yield, and on the other hand, can also improve the bonding effect between the micro-components 120 and the bonding electrodes and improve the bonding stability.

[0060] Specifically, in this application, the covering situation where the deformation member 13 covers a part of the inner wall corresponding to the opening 113 can also be set. Please refer to Figure 5 and Figure 6 and Figure 7 , both are top view schematic diagrams of an embodiment of the transfer auxiliary plate, and are top view schematic diagrams from the side of the first surface 111. Figure 6 In , the deformation member 13 is annular and fits with the inner wall in the circumferential direction of the corresponding inner wall, that is, the deformation member 13 fits with the inner wall along a circle close to the first surface 111 of the inner wall. Figure 7 In , the deformation member 13 includes a plurality of sub-deformation members, and the plurality of sub-deformation members are arranged at intervals in the circumferential direction of the corresponding inner wall and fit with the inner wall. Figure 7 Schematically shows the situation where the deformation member 13 includes two relatively arranged sub-deformation members.

[0061] After the deformation member 13 expands and deforms under preset conditions, the activity space of the micro-components 120 in the opening 113 becomes smaller, which can reduce the probability of rotation and deviation of the micro-components 120 during the transfer process. At the same time, the deformation member 13 does not contact the bonding electrodes provided on the receiving area, which is beneficial to removing the transfer substrate 12 and the transfer auxiliary plate 11 after the transfer, and can also improve the bonding effect between the micro-components 120 and the bonding electrodes.

[0062] In one embodiment, please refer to Figure 8 , Figure 8 is a structural schematic diagram of another embodiment of the transfer auxiliary plate. Different from the above embodiment, in this embodiment, the opening 113 includes a first through hole (not labeled) and a second through hole (not labeled) that communicate with each other. The first through hole is close to the first surface 111, the second through hole is close to the second surface 112, and the aperture of the first through hole is larger than the aperture of the second through hole. Among them, the deformation member 13 is arranged on the inner wall of the first through hole.

[0063] Specifically, a step may be provided on the inner wall of the opening 113, and the opening 113 is divided into a first through hole and a second through hole by the step. Among them, the inner diameter of the first through hole is larger than that of the second through hole, so as to avoid the internal space of the opening 113 being too small due to the arrangement of the deformation member 13, which reduces the difficulty of alignment during the process of aligning the micro-components 120 on the transfer substrate 12 with the opening 113. At the same time, the transfer yield can also be improved.

[0064] In the above Figures 3 to 8 In each of the above-described embodiments, the first alignment mark M1 and the second alignment mark M2 may also be provided on the transfer auxiliary plate 11 and the transfer substrate 12 to facilitate the alignment of the transfer auxiliary plate 11 with the transfer substrate 12 and the target substrate 100. The specific setting method may refer to the description above, Figures 3 - 8 which will not be drawn again.

[0065] Based on the same inventive concept, the present application also provides a transfer method. Please refer to Figure 9 , Figure 9 which is a schematic flow chart of an embodiment of the transfer method of the present application. The transfer method includes the following steps.

[0066] Step S11: Provide a transfer mechanism and set the transfer auxiliary plate on the bearing surface of the target substrate. Among them, a plurality of receiving areas arranged in an array are provided on the bearing surface, and the plurality of receiving areas correspond to the plurality of openings one by one.

[0067] Please combine Figures 1 - 3 and refer to Figure 10a , Figure 10a which is Figure 9 a schematic structural diagram corresponding to step S11 in

[0068] First, set the transfer auxiliary plate 11 on the bearing surface of the target substrate 100. Among them, the transfer auxiliary plate 11 includes opposite first surface 111 and second surface 112, and a plurality of openings 113 arranged in an array are provided on the transfer auxiliary plate 11. The plurality of openings 113 penetrate through the first surface 111 and the second surface 112, and the receiving areas on the bearing surface are exposed from the openings 113. Bonding electrodes for bonding are provided on the receiving areas. Specifically, the alignment of the transfer auxiliary plate 11 and the target substrate 100 can be achieved by aligning the first alignment mark M1 on the second surface 112 and the third alignment mark N on the bearing surface.

[0069] Please combine Figures 1 - 3 and refer to Figure 10b , Figure 10b which is Figure 9Schematic diagram corresponding to an embodiment of step S12. After the transfer auxiliary plate 11 is disposed on the bearing surface of the target substrate 100, the transfer substrate 12 is disposed on the side of the transfer auxiliary plate 11 away from the target substrate 100. A plurality of micro-components 120 are disposed on the side of the transfer substrate 12 facing the transfer auxiliary plate 11, and one micro-component 120 corresponds to one opening 113. At this time, there is a gap between the micro-components 120 and the receiving area on the target substrate 100. Specifically, the alignment of the transfer auxiliary plate 11 and the transfer substrate 12 can be achieved by aligning the first alignment mark M1 on the first surface 111 and the second alignment mark M2 on the transfer substrate 12.

[0070] Step S13: Separate the plurality of micro-components from the transfer substrate, and at least some of the micro-components are transferred to the receiving area through the corresponding openings.

[0071] Please refer to Figures 1 - 3 for reference Figure 10c , Figure 10c which is Figure 9 Schematic diagram corresponding to an embodiment of step S13 in. After the transfer auxiliary plate 11 and the transfer substrate 12 are sequentially disposed, the plurality of micro-components 120 are separated from the transfer substrate 12, and at least some of the micro-components 120 are transferred to the receiving area through the corresponding openings 113. Figure 10c Schematically shows the situation where all the micro-components 120 are separated from the transfer substrate 12 and fall onto the receiving area along the openings 113.

[0072] Among them, the micro-components 120 can be separated from the transfer substrate 12 by laser irradiation. Then, the transfer substrate 12 allows the laser to pass through, and the material is, for example, sapphire or glass, etc. Of course, other separation methods in the prior art can also be used, which will not be elaborated here.

[0073] Subsequently, the transfer auxiliary plate 11 and the transfer substrate 12 can be removed, and the micro-components 120 remain on the receiving substrate 100 to complete the transfer process. Subsequently, bonding conditions can be further set to bond the micro-components 120 with the bonding electrodes.

[0074] During the transfer process, the openings 113 play a limiting role on the micro-components 120, which can improve the alignment accuracy of the micro-components 120 with the target substrate 100. Moreover, during the process of the micro-components 120 being separated from the transfer substrate 12 and falling onto the receiving area, the movement space of the micro-components 120 in the openings 113 is small, thereby reducing the probability of the micro-components 120 rotating and deviating, and improving the transfer yield of the mass transfer process.

[0075] In one embodiment, please refer to Figures 4 - 8 for reference Figure 11 , Figure 11 which is Figure 9 Schematic diagram corresponding to another embodiment of step S13 in.Figure 4 Taking the transfer mechanism shown as an example for illustration, the transfer mechanism further includes a plurality of deformable members 13. One deformable member 13 is disposed on the inner wall of an opening 113 and covers at least a part of the inner wall. The deformable member 13 can undergo expansion deformation under preset conditions, so that the orthographic projection area of the hollow region jointly formed by the opening 113 and the corresponding deformable member 13 on the first surface 111 is reduced. For the specific setting form of the deformable member 13, reference can be made to the above embodiments, which will not be elaborated here. At this time, before the above step S13, that is, before the step of separating the plurality of micro-components 120 from the transfer substrate 12, the following steps may further be included:

[0076] Cause the deformable member 13 to undergo expansion deformation, and there is a gap between the deformable member 13 after the expansion deformation and the corresponding micro-component 120.

[0077] Among them, after the subsequent plurality of micro-components 120 are separated from the transfer substrate 12, all the micro-components 120 are transferred to the receiving area through the corresponding openings 113, as Figure 11 shown.

[0078] That is to say, in this embodiment, the deformation degrees of all the deformable members 13 are set to be the same, and the preset conditions are set to cause the deformable members 13 to expand and deform. The internal space of the opening 113 becomes smaller, but it can still completely accommodate the micro-components 120. Only the moving space of the micro-components 120 becomes smaller, but they can still freely fall onto the receiving area, thereby further reducing the probability of rotation and deviation of the micro-components 120 and improving the transfer yield of the mass transfer process.

[0079] In one embodiment, please refer to Figures 4 - 8 and Figure 12 , Figure 12 which is Figure 9 a schematic structural diagram corresponding to another embodiment of step S13 in Figure 8 . Taking the transfer mechanism shown as an example for illustration, when the deformable member 13 is disposed on the inner wall of the opening 113, before the above step S13, that is, before the step of separating the plurality of micro-components 120 from the transfer substrate 12, the following steps may further be included:

[0080] Cause the deformable member 13 to undergo expansion deformation, and there is a gap between some of the deformable members 13 after the expansion deformation and the corresponding micro-components 120, and the remaining deformable members 13 are in contact with the corresponding micro-components 120.

[0081] That is to say, in this embodiment, all the deformable members 13 are divided into two groups. One group has a smaller degree of deformation, which is the above-mentioned partial deformable members 13. After expansion and deformation, there is a gap between them and the corresponding micro-components 120, and the micro-components 120 can still freely fall onto the receiving area. The other group has a larger degree of deformation, which is the remaining part of the above-mentioned deformable members 13. After expansion and deformation, they are in contact with the corresponding micro-components 120, and the corresponding micro-components 120 cannot freely fall onto the receiving area. Thus, during the subsequent process of removing the transfer auxiliary plate 11 and the transfer substrate 12, the micro-components 120 corresponding to the remaining part of the deformable members 13 are removed accordingly. That is, after the micro-components 120 are separated from the transfer substrate 12, only the micro-components 120 corresponding to the partial deformable members 13 are transferred to the receiving area through the corresponding openings 113, as Figure 12 shown.

[0082] It can be seen that on the one hand, this embodiment can improve the transfer yield, and on the other hand, it can also achieve selective transfer by setting the degree of deformation of the deformable members 13.

[0083] The above description is only for the embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A transfer mechanism, characterized in that, include: A transfer auxiliary plate, comprising a first surface and a second surface opposite to each other, and the transfer auxiliary plate is provided with a plurality of openings arranged in an array, the plurality of openings passing through the first surface and the second surface; A transfer substrate, one side surface of which is used to arrange a plurality of micro-components to be transferred to a target substrate; A plurality of deformable members, one of the deformable members being disposed on an inner wall of one of the openings; The transfer auxiliary plate is used to be arranged between the target substrate and the transfer substrate, and a plurality of receiving areas arranged in an array are arranged on the carrying surface of the target substrate, and the plurality of receiving areas correspond to the plurality of openings one by one, and the plurality of micro-components can be transferred to the receiving areas through the openings; The deformation member can expand and deform under preset conditions.

2. The transfer mechanism according to claim 1, characterized in that In a direction from the first surface to the second surface, a cross section of the opening is in an inverted trapezoidal shape.

3. The transfer mechanism according to claim 2, characterized in that: The opening is rectangular in shape on the first surface and the second surface.

4. The transfer mechanism according to claim 1, characterized in that, In the direction from the first surface to the second surface, one end of the deformable member is flush with the first surface, and the other end of the deformable member is retracted relative to the second surface.

5. The transfer mechanism according to claim 4, characterized in that: The deformable member is annular and fits the inner wall in the circumferential direction of the inner wall; or, The deformation member includes a plurality of sub-deformation members, and the plurality of sub-deformation members are arranged at intervals along the circumference of the inner wall and are in contact with the inner wall.

6. The transfer mechanism according to claim 5, characterized in that: The deformation member includes two sub-deformation members which are arranged opposite to each other.

7. The transfer mechanism according to claim 4, characterized in that: The opening includes a first through hole and a second through hole that are interconnected, the first through hole is close to the first surface, the second through hole is close to the second surface, and the aperture of the first through hole is larger than the aperture of the second through hole; Wherein, the deformation member is arranged on the inner wall of the first through hole.

8. The transfer mechanism according to claim 1, characterized in that, A first alignment mark is provided on the transfer auxiliary plate, located on the first surface and the second surface, and a second alignment mark is provided on the transfer substrate, and the first alignment mark is used to align with the second alignment mark and the third alignment mark respectively; wherein the third alignment mark is located on the target substrate.

9. The transfer mechanism according to claim 8, characterized in that: The alignment mark is in a cross shape.

10. A transfer method, characterized in that, include: Providing the transfer mechanism according to any one of claims 1 to 9, and disposing the transfer auxiliary plate on a carrying surface of a target substrate, wherein a plurality of receiving areas arranged in an array are provided on the carrying surface, and the plurality of receiving areas correspond to the plurality of openings one by one; The transfer substrate is arranged on a side of the transfer auxiliary plate away from the target substrate, and a plurality of micro-components are arranged on a side of the transfer substrate facing the transfer auxiliary plate, wherein one micro-component corresponds to one opening; Separating the plurality of micro-components from the transfer substrate, and transferring at least some of the micro-components to the receiving area through the corresponding openings; The transfer mechanism further includes a plurality of deformation members, one of the deformation members is disposed on the inner wall of one of the openings, and the deformation member can undergo expansion deformation under preset conditions; Before the step of separating the plurality of micro-elements from the transfer substrate, the method further includes: causing the deformation member to undergo expansion deformation, and there is a gap between the deformed deformation member and the corresponding micro-element after the expansion deformation; wherein, after the plurality of micro-elements are separated from the transfer substrate, all the micro-elements are transferred to the receiving area through the corresponding openings; or, The transfer mechanism further includes a plurality of deformation members, one of the deformation members is disposed on the inner wall of one of the openings, and the deformation member can undergo expansion deformation under preset conditions; Before the step of separating the plurality of micro-elements from the transfer substrate, the method further includes: causing the deformation member to undergo expansion deformation, and there is a gap between some of the deformed deformation members and the corresponding micro-elements after the expansion deformation, and the remaining deformation members are in contact with the corresponding micro-elements; wherein, after the plurality of micro-elements are separated from the transfer substrate, only the micro-elements corresponding to the partial deformation members are transferred to the receiving area through the corresponding openings.

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