Electronic device and circuit board module therefor

Abstract

A circuit board module includes a circuit board, a metal substrate, and a heating element. The circuit board includes a substrate, and a surface of the substrate has an assembly area. The metal substrate is disposed on the assembly area, and includes a first circuit layer and a second circuit layer. The first circuit layer and the second circuit layer are electrically connected to each other, and the second circuit layer is electrically connected to the circuit board. A thermal conductivity of the metal substrate is greater than a thermal conductivity of the substrate. The heating element is disposed on the metal substrate and is electrically connected to the first circuit layer.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic assembly, and in particular, to a circuit board module and an electronic device having the same. BACKGROUND

[0002] Electronic components are usually disposed on the circuit board of an electronic device. For example, a light source (e.g., a light emitting diode) is often used as an auxiliary illuminator for a camera. The light source can provide more clear images for the camera when capturing images, and can also provide sufficient brightness for shooting in the dark or insufficient light environment.

[0003] However, high-power electronic components (e.g., the light source) usually generate high temperature when operating. The higher the power of the electronic component, the higher the heat generated. Therefore, the high temperature generated by the electronic component can not only affect the operating efficiency and service life of the electronic component itself, but also affect the operation of other components around the electronic component, especially for components that are not heat-resistant, which can easily lead to damage, failure, or even self-ignition. SUMMARY

[0004] In view of the above, in one embodiment, a circuit board module includes a circuit board, a metal substrate, and a heat-generating component. The circuit board includes a substrate having an assembly area on a surface thereof. The metal substrate is disposed on the assembly area and includes a first circuit layer and a second circuit layer electrically connected to each other, and the second circuit layer is electrically connected to the circuit board, wherein the thermal conductivity of the metal substrate is greater than the thermal conductivity of the substrate. The heat-generating component is disposed on the metal substrate and electrically connected to the first circuit layer.

[0005] In another embodiment, an electronic device includes a housing and the above-mentioned circuit board module. The circuit board module is disposed inside the housing.

[0006] In summary, according to the circuit board module of the present application, the heat generated by the heat-generating component during operation can be quickly conducted to the substrate of the circuit board through the metal substrate, thereby avoiding the situation of excessively high temperature of the heat-generating component. In addition, the metal substrate is only disposed on a local area of the substrate in the present application, which can greatly reduce the cost of the circuit board module compared to using a metal substrate as a whole, and the thermal conductivity of the substrate is less than that of the metal substrate, which can further avoid the influence of the heat generated by the heat-generating component on the operation of other electronic components on the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a perspective view of an embodiment of an electronic device of the present application.

[0008] Figure 2is an exploded perspective view of an embodiment of the electronic device of the present invention.

[0009] Figure 3 is an exploded perspective view of an embodiment of the circuit board module of the present invention.

[0010] Figure 4 is a cross-sectional view of an embodiment of the circuit board module of the present invention.

[0011] Figure 5 is a plan view of an embodiment of the circuit board module of the present invention.

[0012] Figure 6 is a plan view of an embodiment of the electronic device of the present invention.

[0013] Figure 7 is a partial enlarged cross-sectional view of Figure 6

[0014] BRIEF DESCRIPTION OF THE DRAWINGS

[0015] 1 electronic device

[0016] 10 housing

[0017] 11 light-transmissive portion

[0018] 12 thermally-conductive cover plate

[0019] 121 inner metal cover plate

[0020] 122 outer metal cover plate

[0021] 15 camera module

[0022] 16 light-transmissive cover

[0023] 20 circuit board module

[0024] 21 circuit board

[0025] 211 substrate

[0026] 212 assembly area

[0027] 213 circuit area

[0028] 215 electronic component

[0029] 216 protective cover

[0030] 25 metal substrate

[0031] 251 first circuit layer

[0032] 252 thermally-conductive metal layer

[0033] 253 second circuit layer

[0034] ​254 first spacer layer

[0035] 255 second spacer layer

[0036] 26 heat-generating element

[0037] 30 conductive adhesive layer DETAILED DESCRIPTION

[0038] Various embodiments are presented in the following detailed description and drawings designed to provide a complete understanding of the application. However, the application is not limited to the embodiments described and shown. In addition, the drawings are not to scale and some elements can have been omitted or simplified in order to clearly illustrate the features of the application.

[0039] Figure 1 FIG. 1 is a perspective view of an electronic device according to an embodiment of the present application, Figure 2 FIG. 2 is an exploded perspective view of the electronic device according to an embodiment of the present application. As shown in Figure 1 and Figure 2 The electronic device 1 according to an embodiment of the present application includes a housing 10 and a circuit board module 20. The circuit board module 20 is disposed inside the housing 10, for example, the circuit board module 20 can be fixedly installed inside the housing 10 by locking, adhering or snapping. In some embodiments, the electronic device 1 can be a doorbell device (e.g., a wired doorbell, a wireless doorbell or a smart doorbell) for installation at an entrance of a residential house, an office or a commercial building to serve as a communication medium between the indoor and the outdoor. Alternatively, the electronic device 1 can be an IP camera, a CCTV or an analog surveillance camera for installation at various locations (e.g., a nursery, an office, a shop, a highway, etc.) to perform security monitoring or record personnel activities. However, the above embodiments are merely examples, and the electronic device 1 can be various appliances with the circuit board module 20 installed.

[0040] Figure 3 FIG. 3 is an exploded perspective view of the circuit board module according to an embodiment of the present application, as shown in Figure 2 and Figure 3 The circuit board module 20 includes a circuit board 21, at least one metal substrate 25 and at least one heat-generating element 26. The circuit board 21 includes a substrate 211 having an assembly area 212 and a circuit area 213 on a surface thereof. Specifically, the assembly area 212 and the circuit area 213 are different regions on the surface of the substrate 211, wherein the assembly area 212 is for mounting the metal substrate 25 and the heat-generating element 26, and the circuit area 213 is for disposing other electronic components (e.g., conductive circuits, microprocessors, microphones, resistors or capacitors, etc.).

[0041] In some embodiments, the shape of the circuit board 21 can be configured according to actual needs. For example, as shown in Figure 2 As shown in Figure 3 In this embodiment, the housing 10 of the electronic device 1 is provided with a camera module 15, which can include a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or a CMOS active pixel sensor, for example. The substrate 211 of the circuit board 21 of the circuit board module 20 is a ring-shaped substrate (for example, a circular ring in this embodiment, but can also be a square ring, an elliptical ring, or other irregular ring), and the ring-shaped substrate 211 surrounds the camera module 15, but this is not limited, and the substrate 211 can also be in other non-ring shapes. In some embodiments, the circuit board 21 can also include a plurality of substrates 211, which are arranged at intervals and surround the camera module 15, and the plurality of substrates 211 can be independently arranged or electrically connected to each other.

[0042] In addition, as shown in Figure 2 In this embodiment, the electronic device 1 also includes a light-transmitting cover 16 to cover the outside of the camera module 15, so that the camera module 15 can be protected by the light-transmitting cover 16. For example, the light-transmitting cover 16 can be made of transparent material, such as polycarbonate (PC), polymethyl methacrylate (PMMA), or glass material, so that external light can pass through the light-transmitting cover 16 to reach the camera module 15, thereby enabling the camera module 15 to successfully sense and obtain external images.

[0043] In some embodiments, the number of assembly areas 212, circuit areas 213, metal substrates 25, and heat-generating components 26 can be configured according to actual needs. For example, as shown in Figure 5 As shown in the plan view of an embodiment of the circuit board module of the present application, in this embodiment, the number of assembly areas 212, the number of metal substrates 25, and the number of heat-generating components 26 are all multiple (six in this embodiment, but this is not intended to limit the present application), the multiple assembly areas 212 are located at different positions on the surface of the substrate 211 and are arranged in a ring around the camera module 15, and the multiple metal substrates 25 and the multiple heat-generating components 26 are respectively mounted on the multiple assembly areas 212. The number of circuit areas 213 is also multiple and is respectively located between the multiple assembly areas 212. However, the above embodiment is only an example, and in some embodiments, the number of assembly areas 212, circuit areas 213, metal substrates 25, and heat-generating components 26 can all be one, depending on the actual product needs.

[0044] Figure 4 FIG. 1 is a cross-sectional view of an embodiment of a circuit board module of the present invention. Figure 3 and Figure 4 As shown, taking one group of metal substrates 25 and heating elements 26 as an example, the metal substrates 25 are stacked on the assembly area 212 of the substrate 211, and the metal substrate 25 includes a first circuit layer 251, a first spacer layer 254, a metal thermal conductive layer 252, a second spacer layer 255 and a second circuit layer 253 stacked on each other, the metal thermal conductive layer 252 is between the first circuit layer 251 and the second circuit layer 253, the first spacer layer 254 is sandwiched between the first circuit layer 251 and the metal thermal conductive layer 252, and the second spacer layer 255 is sandwiched between the metal thermal conductive layer 252 and the second circuit layer 253, wherein the first circuit layer 251 is the top layer of the metal substrate 25, and the second circuit layer 253 is the bottom layer of the metal substrate 25 and is adjacent to the substrate 211 of the circuit board 21 relative to the first circuit layer 251.

[0045] like Figure 3 and Figure 4 As shown, the heating element 26 is arranged on the metal substrate 25 and is electrically connected to the first circuit layer 251, and the first circuit layer 251 and the second circuit layer 253 of the metal substrate 25 are electrically connected to each other, and the second circuit layer 253 is electrically connected to the circuit board 21, so that the heating element 26 can be indirectly electrically connected to the circuit board 21 via the first circuit layer 251 and the second circuit layer 253.

[0046] In some embodiments, the heating element 26 may be a light-emitting element, such as a light-emitting diode (LED), an infrared lamp, an incandescent lamp or a halogen lamp, etc., wherein each heating element 26 can adjust the irradiation direction or angle of the light it emits to meet the needs of different products. For example, the irradiation direction or angle of the light can be adjusted by changing the placement angle of the heating element 26 itself. Alternatively, a light-guiding structure may be provided inside the heating element 26 to adjust the irradiation direction or angle of the light through the light-guiding structure. Alternatively, the metal substrate 25 may be tilted on the assembly area 212 of the substrate 211 to adjust the irradiation direction or angle of the light of the heating element 26 by the tilt angle or tilt direction of the metal substrate 25.

[0047] In some embodiments, the first circuit layer 251 and the second circuit layer 253 of the metal substrate 25 can be copper circuit layers or silver paste circuit layers and have the function of electrical conduction, wherein the first circuit layer 251 and the second circuit layer 253 can be formed by etching or printing. That is, the first circuit layer 251 and the second circuit layer 253 respectively include circuit lines formed by etching or printing. The metal heat conduction layer 252 of the metal substrate 25 can be a metal plate (for example, a copper plate or an aluminum plate) and has good heat conduction and heat dissipation effects, for example, the thermal conductivity of the metal heat conduction layer 252 is 200 W / m.K or more. The first spacing layer 254 and the second spacing layer 255 can keep the first circuit layer 251 and the second circuit layer 253 away from the metal heat conduction layer 252, respectively, to avoid the first circuit layer 251, the second circuit layer 253 and the metal heat conduction layer 252 from contacting each other, so as to prevent the heating element 26 from short circuiting.

[0048] In some embodiments, the materials of the first spacing layer 254 and the second spacing layer 255 can be inorganic insulating materials (for example, ceramics, asbestos), organic insulating materials (for example, resin, rubber, silk cotton, paper) or composite insulating materials processed from the above two insulating materials. Alternatively, the first spacing layer 254 and the second spacing layer 255 can be heat-conducting insulating layers, for example, the first spacing layer 254 and the second spacing layer 255 can be heat-conducting adhesive layers and can simultaneously achieve the effects of bonding, insulation and good heat conduction, for example, the thermal conductivity of the first spacing layer 254 and the second spacing layer 255 can be 1 W / m.K or more. However, the above embodiments are only examples, and in some embodiments, the first spacing layer 254 and the second spacing layer 255 can also be heat-conducting insulating pieces (for example, heat-conducting silica gel pieces or carbon fiber heat-conducting gaskets).

[0049] In addition, as shown in Figure 3 In addition, as shown in Figure 4 The thermal conductivity of the metal substrate 25 is greater than the thermal conductivity of the substrate 211, for example, the thermal conductivity of the metal substrate 25 as a whole can be 3 W / m.K or more, and the substrate 211 of the circuit board 21 can be a resin substrate (for example, an FR-4 epoxy resin substrate), and the thermal conductivity of the substrate 211 is 0.4 W / m.K or less, which is much smaller than the thermal conductivity of the metal substrate 25. Therefore, the thermal conductivity of the metal substrate 25 is much higher than the thermal conductivity of the substrate 211.

[0050] Therefore, by arranging the heat-generating element 26 on the metal substrate 25 instead of directly on the substrate 211, the heat energy generated by the heat-generating element 26 during operation can be quickly conducted and dissipated by the high thermal conductivity of the metal substrate 25, so as to avoid the temperature of the heat-generating element 26 from being too high to affect its own operation efficiency and service life. In addition, the thermal conductivity coefficient of the substrate 211 of the circuit board 21 is less than that of the metal substrate 25, that is, the thermal resistance value of the substrate 211 is much higher than that of the metal substrate 25. Therefore, although the metal substrate 25 is arranged on the substrate 211, the heat energy generated by the heat-generating element 26 during operation can be conducted to the substrate 211 through the metal substrate 25, but due to the thermal conductivity coefficient of the substrate 211 is less than that of the metal substrate 25, the overall temperature of the substrate 211 will not be too high due to the heat energy generated by the heat-generating element 26, thereby avoiding the heat energy generated by the heat-generating element 26 affecting the operation of other electronic elements on the substrate 211.

[0051] For example, as shown in Figure 2 and Figure 3 In the present embodiment, the electronic element 215 arranged on the circuit area 213 of the substrate 211 may, for example, be a lower-temperature-resistant element (such as a microphone element, which enables the electronic device 1 to have the function of receiving external sound information), that is, the maximum allowable temperature of the electronic element 215 during correct operation is less than the maximum allowable temperature of the heat-generating element 26. Therefore, by arranging the heat-generating element 26 that generates high temperature during operation on the metal substrate 25 and arranging the lower-temperature-resistant electronic element 215 on the circuit area 213 of the substrate 211, the heat-generating element 26 can be quickly conducted and dissipated through the metal substrate 25, and the temperature of the substrate 211 will not be too high due to the temperature generated by the heat-generating element 26, thereby avoiding the electronic element 215 arranged on the substrate 211 from exceeding its maximum allowable temperature and causing damage, failure, even self-ignition, and the like.

[0052] As shown in Figure 3 The electronic element 215 on the circuit area 213 of the substrate 211 can also be covered by a protective cover 216, for example, the protective cover 216 can be a rubber cover or a plastic cover, so that the electronic element 215 can be further protected by the protective cover 216.

[0053] For example, as shown in Figure 4As shown, the heating element 26 and the first circuit layer 251 of the metal substrate 25 can be electrically connected to each other via the conductive adhesive layer 30. For example, the heating element 26 is soldered and fixed to the first circuit layer 251 using surface-mount technology (SMT) to electrically connect to the first circuit layer 251. Specifically, the conductive adhesive layer 30 can be a solder paste layer and is disposed between the heating element 26 and the first circuit layer 251. After the conductive adhesive layer 30 is melted at high temperature and solidified by cooling, the heating element 26 can be soldered and fixed to the first circuit layer 251. In this way, the heating element 26 and the first circuit layer 251 are electrically connected via the conductive adhesive layer 30. Compared to other fixing methods (such as locking or spot welding), it can ensure that the entire bottom surface of the heating element 26 is in contact with the metal substrate 25, thereby increasing the heat conduction area and improving the heat dissipation efficiency. Moreover, after the heating element 26 is soldered and fixed, it is not easy to warp or skew. In addition, the heating element 26 can be quickly mounted on the first circuit layer 251 through surface mounting technology, thereby reducing manpower and time costs.

[0054] Figure 6 is a plan view of an embodiment of an electronic device of the present invention, Figure 7 for Figure 6 A partial enlarged cross-sectional view of Figure 2 、 Figure 6 and Figure 7 As shown, in this embodiment, the housing 10 of the electronic device 1 includes a light-transmitting portion 11, the circuit board module 20 is arranged inside the housing 10, and each heating element 26 is a light-emitting element and corresponds to the light-transmitting portion 11, so that the light emitted by each heating element 26 can pass through the light-transmitting portion 11 to achieve the effect of auxiliary lighting. For example, the light-transmitting portion 11 can be a hollow hole or a transparent plate. For example, the transparent plate can be made of a transparent material such as polycarbonate (PC), acrylic plastic (PMMA) or glass material, so that visible light can pass through the light-transmitting portion 11. Alternatively, the light-transmitting portion 11 can also be a filter plate, so that light within a specific wavelength range (for example, infrared light with a specific wavelength range of 650nm to 1000nm) can pass through the light-transmitting portion 11.

[0055] In some embodiments, the shape of the light-transmitting portion 11 may correspond to the shape of the circuit board 21, for example Figure 2 As shown, in this embodiment, the light-transmitting portion 11 is annular to correspond to the annular circuit board 21. Alternatively, the light-transmitting portion 11 may also be a plurality of light-transmitting areas to correspond to the plurality of heating elements 26, respectively.

[0056] For example Figure 2 、 Figure 6 and Figure 7As shown, the housing 10 of the electronic device 1 further comprises at least one heat-conductive cover plate 12, and each metal substrate 25 of the circuit board module 20 further contacts the heat-conductive cover plate 12, so that the heat energy of each metal substrate 25 can be further conducted to the heat-conductive cover plate 12 to enhance the heat dissipation effect. In some embodiments, the material of the heat-conductive cover plate 12 can be copper, aluminum, iron or other metal alloy (e.g. aluminum alloy) with high thermal conductivity (e.g. thermal conductivity of 200 W / m.K or above) to further improve the heat conduction and heat dissipation effect.

[0057] As shown, Figure 6 With Figure 7 As shown, in the present embodiment, the heat-conductive cover plate 12 comprises an inner metal cover plate 121 and an outer metal cover plate 122, and the material of the inner metal cover plate 121 and the outer metal cover plate 122 can be copper, aluminum, iron or other metal alloy, respectively. The light-transmitting portion 11 is connected between the inner metal cover plate 121 and the outer metal cover plate 122, and one side of each metal substrate 25 contacts the inner metal cover plate 121, and the other side of each metal substrate 25 contacts the outer metal cover plate 122. For example, in the present embodiment, the partial surface of one side of each metal substrate 25 contacts the inner metal cover plate 121 to increase the heat conduction area, and the side edge of the other side of each metal substrate 25 protrudes from the substrate 211 and contacts the outer metal cover plate 122. In this way, the heat energy of each metal substrate 25 can be simultaneously conducted to multiple metal cover plates (the inner metal cover plate 121 and the outer metal cover plate 122) to further enhance the heat dissipation effect. In some embodiments, the metal substrate 25 can only contact one of the inner metal cover plate 121 or the outer metal cover plate 122, which is not limited.

[0058] In summary, according to the circuit board module of the present embodiment, by arranging the heat-generating component on the metal substrate, the heat energy generated by the heat-generating component during operation can be quickly conducted to the substrate of the circuit board through the metal substrate, so as to avoid the situation that the temperature of the heat-generating component is too high. In addition, the present embodiment only arranges the metal substrate on the local area of the substrate, which can greatly reduce the cost of the circuit board module compared with the overall use of the metal substrate, and the thermal conductivity coefficient of the substrate is smaller than that of the metal substrate, so as to further avoid the influence of the heat energy generated by the heat-generating component on the operation of other electronic components on the substrate.

[0059] Although the technical content of the present application has been disclosed as above with reference to the preferred embodiments, it is not intended to limit the present application, and any person skilled in the art can make some changes and modifications without departing from the spirit of the present application, which should be covered by the scope of the present application. Therefore, the protection scope of the present application should be subject to the scope defined by the appended claims.

Claims

1. A circuit board module, characterized in that: include: A circuit board includes a substrate and an electronic component. The surface of the substrate has an assembly area and a circuit area. The circuit area and the assembly area are located in different areas of the surface of the substrate. The electronic component is arranged on the circuit area. a metal substrate disposed on the assembly area, the metal substrate comprising a first circuit layer and a second circuit layer, the first circuit layer and the second circuit layer being electrically connected to each other, the second circuit layer being electrically connected to the circuit board, wherein the thermal conductivity of the metal substrate is greater than the thermal conductivity of the substrate; as well as A heating element is disposed on the metal substrate and electrically connected to the first circuit layer; Wherein, the maximum allowable temperature of the electronic component is lower than the maximum allowable temperature of the heating element.

2. The circuit board module according to claim 1, wherein: The metal substrate also includes a first spacing layer, a metal heat-conducting layer and a second spacing layer. The metal heat-conducting layer is between the first circuit layer and the second circuit layer. The first spacing layer is sandwiched between the first circuit layer and the metal heat-conducting layer. The second spacing layer is sandwiched between the metal heat-conducting layer and the second circuit layer.

3. The circuit board module according to claim 2, wherein: The first spacing layer and the second spacing layer are respectively heat-conducting insulation layers.

4. The circuit board module according to claim 1, wherein: The substrate is a resin substrate.

5. The circuit board module according to claim 1, wherein: The electronic component is a microphone component.

6. The circuit board module according to claim 1, wherein: The heating element and the first circuit layer are electrically connected to each other via a conductive adhesive layer.

7. An electronic device, characterized in that: include: case; as well as The circuit board module according to any one of claims 1 to 6, wherein the circuit board module is arranged inside the housing.

8. The electronic device according to claim 7, wherein: The housing includes a light-transmitting portion, and the heat-generating element of the circuit board module is a light-emitting element and corresponds to the light-transmitting portion.

9. The electronic device according to claim 7, wherein: A camera module is arranged in the shell, and the substrate of the circuit board of the circuit board module surrounds the camera module.

10. The electronic device according to claim 7, wherein: The number of the assembly areas of the substrate, the number of the metal substrates and the number of the heating elements are respectively multiple, the assembly areas are arranged in a ring around the camera module, the metal substrates are respectively arranged on the assembly areas, and the heating elements are respectively arranged on the metal substrates.

11. The electronic device according to claim 7, wherein: The housing includes at least one heat-conducting cover plate, and the metal substrate of the circuit board module contacts the at least one heat-conducting cover plate.

12. The electronic device according to claim 11, wherein: The at least one heat-conducting cover plate includes an inner metal cover plate and an outer metal cover plate. One side of the metal base plate contacts the inner metal cover plate, and the other side of the metal base plate contacts the outer metal cover plate.

13. An electronic device, characterized in that: include: case; as well as A circuit board module is disposed inside the housing, and includes: A circuit board includes a substrate having a mounting area on a surface of the substrate; a metal substrate disposed on the assembly area, the metal substrate comprising a first circuit layer and a second circuit layer, the first circuit layer and the second circuit layer being electrically connected to each other, the second circuit layer being electrically connected to the circuit board, wherein the metal substrate has a greater thermal conductivity than the substrate; and A heating element is disposed on the metal substrate and electrically connected to the first circuit layer; Among them, the number of the assembly areas of the substrate, the number of the metal substrates and the number of the heating elements are respectively multiple, the assembly areas are arranged around the camera module, the metal substrates are respectively set on the assembly areas, and the heating elements are respectively set on the metal substrates.

14. An electronic device, characterized in that: include: case; as well as A circuit board module is disposed inside the housing, and includes: A circuit board includes a substrate having a mounting area on a surface of the substrate; a metal substrate disposed on the assembly area, the metal substrate comprising a first circuit layer and a second circuit layer, the first circuit layer and the second circuit layer being electrically connected to each other, the second circuit layer being electrically connected to the circuit board, wherein the metal substrate has a greater thermal conductivity than the substrate; and A heating element is disposed on the metal substrate and electrically connected to the first circuit layer; The housing includes at least one heat-conducting cover plate, and the metal substrate of the circuit board module contacts the at least one heat-conducting cover plate.

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