A glue coating structure and method for improving the flatness of a printed circuit board mounting unit

Abstract

The present invention discloses a gluing structure and method for improving the flatness of a printed circuit board installation unit, and relates to a micro PCB manufacturing process. This solution is proposed to solve the problem of relatively large product flatness in the prior art. The gluing structure includes a plurality of installation units distributed in an array in a waste plate; a through groove is provided between the edge of each installation unit and the waste plate for segmentation, and the installation units are connected through a plurality of connecting parts; a flow blocking module is provided in the through groove, and at least a gap is left between the flow blocking module and the installation unit. The gluing method is to use the gluing structure to prevent leakage of the semi-cured film. The advantage is that the semi-cured film is blocked from flowing to the through groove, thereby improving the flatness of the installation unit.

Description

Technical Field

[0001] The invention relates to a manufacturing process of a micro PCB product, and in particular to a gluing structure and method for improving the flatness of a printed circuit board mounting unit. Background Art

[0002] The patent application with publication number CN115003009A shows the current technology's requirement for miniaturization of the PCS. Figure 1 and Figure 2 As shown, a large number of device units 20 are distributed in an array in the waste board 10. The edge of each installation unit 20 is separated from the waste board 10 by a through groove 11, and connected by a number of connecting parts 12. Before making the top copper coating, all PCS need to be covered with semi-cured film and then sealed. The flatness of a single PCS depends largely on the state of the semi-cured film after curing. Too high flatness will affect the accuracy of subsequent processes, such as a decrease in the copper rate of the whole board, a decrease in the dimensional stability of the product, and increased welding difficulty. The flatness is the height variance of several sampling points on the surface of the PCS. The industry requires the flatness to be as small as possible. In theory, the flatness is the minimum and the optimal value is 0.

[0003] Conventional PCS sizes are in the mm level, with a common width of 8 to 10 mm and a length of about 30 mm. The width of the through slot 11 is usually 0.8 to 1 mm. Before hot air curing, the semi-cured film is fluid. The hot air will cause the semi-cured film to flow from the mounting unit to the through slot, resulting in uneven film stock on the surface of the mounting unit, and finally forming an uneven curing result. Summary of the invention

[0004] The present invention aims to provide a gluing structure and method for improving the flatness of a printed circuit board mounting unit, so as to solve the problems existing in the above-mentioned prior art.

[0005] The gluing structure for improving the flatness of a printed circuit board mounting unit described in the present invention comprises a plurality of mounting units distributed in an array in a waste plate; a through groove is provided between the edge of each mounting unit and the waste plate for segmentation, and the two are connected by a plurality of connecting parts; a flow blocking module is provided in the through groove, and a gap is left at least between the flow blocking module and the mounting unit.

[0006] The flow blocking module is obtained by filling the through groove with copper.

[0007] The width of the flow blocking module is 0.3-0.5 mm.

[0008] The distance d1 between the blocking module and the installation unit is 0.1-0.3 mm, preferably 0.1-0.2 mm.

[0009] The gluing method for improving the flatness of the printed circuit board installation unit described in the present invention utilizes the gluing structure to prevent leakage of the semi-cured film.

[0010] The gluing structure and method for improving the flatness of a printed circuit board mounting unit described in the present invention have the advantages of preventing the semi-cured film from flowing toward the through groove, thereby improving the flatness of the mounting unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the structure in which the installed units are distributed in an array on the waste board in the prior art.

[0012] Figure 2 yes Figure 1 An enlarged schematic diagram of a single installed unit.

[0013] Figure 3 It is a structural schematic diagram of the gluing structure described in the present invention.

[0014] Figure 4 yes Figure 3 A local enlarged schematic diagram of point k in the middle.

[0015] Figure 5 It is a flatness curve diagram for comparison.

[0016] Reference numerals:

[0017] 10-waste plate, 11-through groove, 12-connecting part; 20-installation unit; 30-blocking module;

[0018] d0-the width of the through slot, d1-the distance between the choke module and the mounting unit, d2-the distance between the choke module and the waste plate. DETAILED DESCRIPTION

[0019] like Figure 3 and Figure 4 As shown, the gluing structure for improving the flatness of the mounting unit of the printed circuit board described in the present invention comprises a plurality of mounting units 20 distributed in an array in a waste plate 10. A through groove 11 is provided between the edge of each mounting unit 20 and the waste plate 10 for segmentation, and connected by a plurality of connecting parts 12. A flow blocking module 30 is provided in the through groove 11, and a gap is left at least between the flow blocking module 30 and the mounting unit 20. The flow blocking module 30 is obtained by filling the through groove 11 with copper.

[0020] Generally, the width d0 of the through groove 11 is about 0.8-1 mm, so the width of the blocking module 30 can be set to 0.3-0.5 mm. The distance d1 between the blocking module 30 and the installation unit 20 is 0.1-0.3 mm, preferably 0.1-0.2 mm. The setting of d1 not less than 0.1 mm is to avoid contact with the installation unit 20 and to avoid interference with the processing accuracy of the installation unit 20. When the semi-cured film is affected by wind force, since d1 is small enough, it can prevent the film material from flowing into the through groove 11 outside the installation unit 20, ensuring that the surface flatness of the installation unit 20 after curing is small enough. In the subsequent process, the blocking module 30 and the waste plate 10 are both waste materials, and the cured film can be laser cut to separate the blocking module 30, the waste plate 10 and the installation unit 20. The distance d2 between the blocking module 30 and the waste plate 10 can be 0 or greater than 0. Since both are subsequent waste materials, the size of d2 is not important.

[0021] A gluing method for improving the flatness of a printed circuit board installation unit in the present invention is to use the gluing structure to prevent leakage of the semi-cured film.

[0022] Comparative example: Figure 5 As shown, each batch of tests includes 100 PCS, the first 50 batches are tested using the structure in the prior art, and the last 50 batches are tested using the glue structure of the present invention. Through the flatness test and comparison of multiple batches of installed units, it can be seen that the glue structure and method of the present invention can significantly reduce the flatness.

[0023] For those skilled in the art, various other corresponding changes and deformations can be made according to the technical solutions and concepts described above, and all of these changes and deformations should fall within the protection scope of the claims of the present invention.

Claims

1. A gluing structure for improving the flatness of a printed circuit board mounting unit, comprising a plurality of mounting units (20) arranged in an array in a waste plate (10); a through groove (11) is provided between the edge of each mounting unit (20) and the waste plate (10) for segmentation, and a plurality of connecting parts (12) are used for connection; It is characterized in that A flow blocking module (30) is provided in the through groove (11), and a gap is left at least between the flow blocking module (30) and the mounting unit (20).

2. A gluing structure for improving the flatness of a printed circuit board mounting unit according to claim 1, characterized in that: The flow blocking module (30) is obtained by filling the through groove (11) with copper.

3. A gluing structure for improving the flatness of a printed circuit board mounting unit according to claim 1, characterized in that: The width of the flow blocking module (30) is 0.3-0.5 mm.

4. A gluing structure for improving the flatness of a printed circuit board mounting unit according to claim 1, characterized in that: The distance d1 between the flow blocking module (30) and the installation unit (20) is 0.1 to 0.3 mm.

5. A gluing structure for improving the flatness of a printed circuit board mounting unit according to claim 4, characterized in that: The distance d1 between the flow blocking module (30) and the installation unit (20) is 0.1 to 0.2 mm.

6. A gluing method for improving the flatness of a printed circuit board mounting unit, characterized in that: The semi-cured film is leak-proofed by using the gluing structure as described in any one of claims 1 to 5.

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