Photomask substrate polishing disc inspection and leveling system

Abstract

The present invention discloses a photomask substrate polishing disc detection and leveling system, comprising a center positioning sleeve, two leveling bodies, a positioning assembly, a positioning plate, a reflector and a balance plate, wherein a movable cylinder is arranged between the center positioning sleeve and the leveling body, the positioning plate is located inside the spherical groove of the center positioning sleeve, the balance plate is connected to the positioning plate, the leveling body comprises a leveling plate, a contact plate and a positioning sleeve, the contact plate is movably connected to the positioning sleeve, the position of the induction plate inside the contact plate corresponds to the position of the balance plate, and a plurality of contact rods are further arranged at the upper end of the contact plate. The photomask substrate polishing disc detection and leveling system of the present invention can be fixed on the polishing disc, automatically level the polishing disc, and perform flatness detection during the leveling process to ensure the flatness of the polishing disc, while realizing vertical positioning of the polishing surface and the rotating shaft of the polishing disc.

Description

Technical Field

[0001] The invention relates to the technical field of photomask production auxiliary equipment, and in particular to a photomask substrate polishing disc detection and leveling system. Background Art

[0002] Quartz glass has become an important basic material due to its excellent physical and chemical properties such as high purity, high light transmittance and low thermal expansion. The photomask is composed of a glass substrate, a chrome layer and a photoresist layer. The glass substrate of the photomask needs to be subsequently coated and photolithographic, so the flatness of its surface is required to be high.

[0003] During the production process of the photomask substrate, the surface of the glass substrate needs to be polished by a polishing device to obtain a flat and smooth surface of the glass substrate. During the use of the polishing disc of the polishing device, the working surface of the polishing disc will become uneven due to long-term use. At this time, the polishing disc needs to be leveled to ensure that the polishing disc works efficiently and stably.

[0004] When performing the polishing disc flattening process, the polishing disc is generally ground with a flattening plate that meets the flatness standard, and then measured with other flatness detection devices to obtain a polishing disc surface with qualified flatness. The process is relatively cumbersome and the processing efficiency is low. Moreover, this flatness can only guarantee the flatness of the polishing disc itself, regardless of whether the polishing disc is perpendicular to the rotating shaft, and the eccentric motion is not conducive to the overall long-term stable plane processing of the glass substrate by the polishing equipment. Summary of the invention

[0005] The purpose of the present invention is to improve the efficiency of the prior art in the workshop in leveling the grinding wheel of the photomask substrate plane polishing equipment, and a photomask substrate polishing grinding wheel detection and leveling system is proposed, which is used to improve the leveling efficiency and at the same time realize the perpendicularity of the polishing grinding wheel and the grinding wheel rotation axis, which helps the polishing equipment as a whole to form long-term and stable plane processing of the photomask substrate.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] The photomask substrate polishing grinding disc detection and leveling system comprises a center positioning sleeve, two leveling bodies, a positioning assembly, a positioning plate, a reflector and a balance plate. The center positioning sleeve and the two leveling bodies are located on the positioning assembly, and the center positioning sleeve and the leveling bodies are connected by a movable cylinder.

[0008] Furthermore, a spherical groove is provided inside the central positioning sleeve, the positioning plate is located inside the spherical groove, and the side of the positioning plate is movably connected to the spherical groove. A balance plate is provided inside the leveling body, and the bottom of the balance plate is connected to the leveling body through an adjustment cylinder. The positioning plate is fixedly connected to a first extension rod, and the balance plate is fixedly connected to a second extension rod, the first extension rod includes a transverse rod portion parallel to the positioning plate and a longitudinal rod portion parallel to the second extension rod, and the lower end of the second extension rod is slidably connected to the transverse rod portion of the first extension rod.

[0009] Furthermore, three cocircular and non-colinear sensing elements are arranged on the positioning plate, and the reflecting element includes two first reflection points and a second reflection point. The reflecting element is installed on the polishing grinding wheel shaft and keeps the reflection points on the central axis of the polishing grinding wheel shaft. The sensing element is used to emit and receive laser, and the reflection points are used to reflect laser.

[0010] When positioning the balance plate, first the three sensors of the positioning plate emit lasers, and the reflection points of the reflection parts reflect the lasers. When each sensor receives the reflected lasers from the first reflection point at the same time, and each sensor receives the reflected lasers from the second reflection point at the same time, it indicates that the positioning plate is perpendicular to the polishing disc shaft. The position of the balance plate is adjusted by adjusting the cylinder. The balance plate drives the positioning plate to move synchronously through two extensions, and the balance plate is perpendicular to the polishing disc shaft with the positioning plate as the reference.

[0011] Furthermore, the leveling body includes a leveling plate, a contact plate and a positioning sleeve, the leveling plate is fixedly connected to the top of the contact plate, the side of the contact plate is slidably connected to the inner wall of the positioning sleeve, the inner wall of the positioning sleeve is an arc surface, the contact plate can move relative to the positioning sleeve to adjust the position of the contact plate, and the positioning sleeve is provided as a positioning piece for the contact plate.

[0012] Further, the balance plate is located below the contact plate, and a sensing plate is arranged inside the contact plate, the sensing plate is an electrode plate, and the position of the sensing plate corresponds to the position of the balance plate. Preferably, the balance plate includes a metal plate, a glass plate and an electrode plate, the metal plate is opposite to the contact plate, and the sensing plate and the electrode plate carry opposite charges.

[0013] When the contact plate is parallel to the balance plate, the capacitance between the electrode plate and the induction plate is C1; when the contact plate is not parallel to the balance plate, the capacitance C1 between the electrode plate and the induction plate changes. At this time, the contact plate adjusts the position of the induction plate by relative positioning sleeve movement to maintain the parallel state between the contact plate and the balance plate, that is, to keep the repairing plane of the repairing plate perpendicular to the rotating axis of the polishing grinding disc during the repairing process, so as to avoid the influence of vibration on the position state of the repairing plate during the repairing process.

[0014] Furthermore, a plurality of contact rods are provided at the upper end of the contact plate, and the contact end of the contact rod points upward. The contact rod is provided with a dial indicator and a stopper, the detection end of the dial indicator is the contact end, and the stopper is used to limit the axial movement of the contact end. First, based on the flat plate, the contact ends of all contact rods are kept in contact with the flat plate, and the dial indicator is zeroed. At this time, all contact rods are in the same plane, and then the stopper is used to limit the contact end of the contact rod, so that the contact end of the contact rod is kept in the same plane and in the same plane as the repairing plane of the repairing plate.

[0015] Preferably, the contact plates are provided with a synchronization box whose number and position correspond to the contact rod. A synchronization block is provided inside the synchronization box, one end of which is fixedly connected to the contact rod, and the other end of which is connected to the inner wall of the synchronization box through a compression spring, and the compression spring is used to press the synchronization block toward the repairing plate.

[0016] Furthermore, the synchronization box is connected to the balance board through a telescopic sleeve, and the telescopic sleeve includes a sleeved inner rod and an outer rod. A spherical joint is arranged on the top of the inner rod, and a movable plate is arranged on the bottom of the synchronization box, and the movable plate is provided with a concave spherical surface that is cocentric with and matches the spherical joint. The concave spherical surface and the spherical joint can realize spherical articulation, and combined with the telescopic sleeve, it is used to maintain the connection between the synchronization box and the balance board when the contact plate moves microscopically relative to the balance board.

[0017] Furthermore, the spherical joint and the synchronous block are connected by a pull rope. When the connecting rod is perpendicular to the axis of the contact plate, the distance between the synchronous block and the spherical joint is the farthest. At this time, the compression spring is at the maximum extension and the pull rope is straightened. When the upper contact plate and the lower contact plate are not parallel to the balance plate, the position of the synchronous box is twisted, the length of the connecting pipe changes, the movable plate of the synchronous box moves, the spherical joint on the inner rod rotates relative to the concave spherical surface of the synchronous box, the spherical joint pulls the synchronous block away from the repairing plate through the pull rope, the synchronous block drives the contact rod to move, and the contact end of the contact rod leaves the plane where the repairing plane of the repairing plate is located. At this time, the contact end of the contact rod is not used for detecting the plane, avoiding invalid flatness measurement of the contact rod when the contact plate is not parallel to the balance plate.

[0018] Preferably, the positioning assembly includes an upper positioning plate, a positioning cylinder and a lower positioning plate, the upper positioning plate and the lower positioning plate are parallel to each other, the positioning cylinder connects the upper positioning plate and the lower positioning plate, and the positioning cylinder adjusts the position between the upper positioning plate and the lower positioning plate so that the positioning assembly can be fixed on the polishing grinding wheel.

[0019] Furthermore, the center positioning sleeve is fixedly connected to the lower positioning plate, the two movable cylinders are synchronously extended and retracted, and the leveling body is symmetrically arranged about the center positioning sleeve. The leveling body is movably connected to the lower positioning plate, so that the movable cylinder can adjust the radial position of the leveling body in the polishing disc.

[0020] The beneficial effects of the present invention are:

[0021] 1. This photomask substrate polishing disc inspection and leveling system can be fixed on the polishing disc to automatically level the polishing disc with high leveling efficiency; and flatness detection is performed during the leveling process to ensure the flatness of the polishing disc and the leveling accuracy is guaranteed.

[0022] 2. This photomask substrate polishing disc inspection and leveling system not only maintains the flatness of the polishing disc on the photomask substrate polishing surface, but also realizes the vertical positioning of the polishing surface and the polishing disc rotating shaft, avoiding the polishing surface from tilting during rotation and causing the glass substrate to form an inclined plane processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a structural schematic diagram of the polishing disc detection and leveling system;

[0024] Figure 2 This is a structural schematic diagram of the leveling body of the polishing disc detection and leveling system;

[0025] Figure 3 This is a schematic diagram of the structure of the contact rod of the polishing disc detection and leveling system;

[0026] Figure 4 This is a schematic diagram of the positioning principle of the positioning plate;

[0027] Figure 5 Schematic diagram of the parallel relationship between the balance plate and the sensor plate.

[0028] In the figure: 1. center positioning sleeve; 2. leveling body; 3. movable cylinder; 4. positioning assembly; 5. positioning plate; 6. reflector; 7. contact rod; 8. balance plate; 9. synchronization box; 10. telescopic sleeve rod; 21. repairing plate; 22. contact plate; 23. positioning sleeve; 24. induction plate; 25. adjustment cylinder; 41. upper positioning plate; 42. positioning cylinder; 43. lower positioning plate; 51. first extension rod; 71. contact end; 72. stopper; 81. second extension rod; 91. synchronization block; 92. compression spring; 93. movable plate; 94. concave spherical surface; 95. pull rope; 111. inner rod; 112. outer rod; 801. metal plate; 802. glass plate; 803. electrode plate. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0030] Reference Figure 1The photomask substrate polishing grinding disc detection and leveling system includes a center positioning sleeve 1, two leveling bodies 2, a positioning component 4, a positioning plate 5, a reflector 6 and a balance plate 8.

[0031] In this embodiment, there are two groups of positioning components 4, which are symmetrically arranged about the central positioning sleeve 1. The positioning components 4 include an upper positioning plate 41, a positioning cylinder 42 and a lower positioning plate 43. The upper positioning plate 41 and the lower positioning plate 43 are parallel to each other. The positioning cylinder 42 connects the upper positioning plate 41 and the lower positioning plate 43. The positioning cylinder 42 adjusts the position between the upper positioning plate 41 and the lower positioning plate 43 so that the positioning components 4 can be fixed on the polishing grinding disc.

[0032] Furthermore, the center positioning sleeve 1 is connected to the leveling body 2 via a movable cylinder 3. The center positioning sleeve 1 is fixedly connected to the lower positioning plate 43, the two movable cylinders 3 are synchronously extended and retracted, and the leveling body 2 is symmetrically arranged about the center positioning sleeve 1. The leveling body 2 is movably connected to the lower positioning plate 43, so that the movable cylinder 3 can adjust the radial position of the leveling body 2 in the polishing disc.

[0033] Furthermore, a spherical groove is provided inside the center positioning sleeve 1, the positioning plate 5 is located inside the spherical groove, and the side of the positioning plate 5 is movably connected to the spherical groove. A balancing plate 8 is provided inside the leveling body 2, and the bottom of the balancing plate 8 is connected to the leveling body 2 through an adjustment cylinder 25. The positioning plate 5 is fixedly connected to a first extension rod 51, and the balancing plate 8 is fixedly connected to a second extension rod 81. The first extension rod 51 includes a transverse rod portion parallel to the positioning plate 5 and a longitudinal rod portion parallel to the second extension rod 81, and the lower end of the second extension rod 81 is slidably connected to the transverse rod portion of the first extension rod 51.

[0034] refer to Figure 4 Three cocircular and non-colinear sensing elements O1, O2 and O3 are arranged on the positioning plate 5, and the reflecting element 6 includes two first reflecting points M1 and a second reflecting point M2. The reflecting element 6 is installed on the polishing grinding wheel shaft and keeps the reflecting points on the central axis of the polishing grinding wheel shaft. The sensing element is used to emit and receive laser, and the reflecting points are used to reflect laser.

[0035] When positioning the balance plate 8, firstly, the three sensing elements O1, O2 and O3 of the positioning plate 5 emit lasers, and the reflection point of the reflection element 6 reflects the lasers. The position state of the positioning plate 5 is adjusted, when the time for each sensing element to receive the laser reflected from the first reflection point M1 is the same, that is, the distance between M1O1, the distance between M1O2 and the distance between M1O3 are equal, and the time for each sensing element to receive the laser reflected from the second reflection point M2 is the same, that is, the distance between M2O1, the distance between M2O2 and the distance between M2O3 are equal, since M1 and M2 are both located on the central axis of the polishing disc shaft, the positioning plate 5 in the plane where O1, O2 and O3 are located is perpendicular to the polishing disc shaft.

[0036] In this embodiment, the position state of the balancing plate 8 is adjusted by adjusting the cylinder 25. The balancing plate 8 drives the positioning plate 5 to move synchronously through two extensions, and the balancing plate 8 is perpendicular to the polishing disc shaft with the positioning plate 5 as a reference.

[0037] refer to Figure 2 The leveling body 2 includes a leveling plate 21, a contact plate 22 and a positioning sleeve 23. The leveling plate 21 is fixedly connected to the top of the contact plate 22. The side of the contact plate 22 is slidably connected to the inner wall of the positioning sleeve 23. The inner wall of the positioning sleeve 23 is an arc surface. The contact plate 22 can move relative to the positioning sleeve 23 to adjust the position of the contact plate 22. The positioning sleeve 23 is provided as a positioning piece for the contact plate 22.

[0038] Furthermore, the balance plate 8 is located below the contact plate 22, and a sensing plate 24 is disposed inside the contact plate 22. The sensing plate 24 is an electrode plate, and the position of the sensing plate 24 corresponds to the position of the balance plate 8. Figure 5 The balance plate 8 includes a metal plate 801, a glass plate 802 and an electrode plate 803. The metal plate 801 is opposite to the contact plate 22, and the induction plate 24 and the electrode plate 803 carry opposite charges.

[0039] When the contact plate 22 is parallel to the balance plate 8, the capacitance between the electrode plate 803 and the induction plate 24 is C1; when the contact plate 22 is not parallel to the balance plate 8, the capacitance C1 between the electrode plate 803 and the induction plate 24 changes. At this time, the contact plate 22 adjusts the position of the induction plate 24 by relative positioning sleeve 23 to maintain the parallel state between the contact plate 22 and the balance plate 8, that is, to keep the repairing plane of the repairing plate 21 perpendicular to the rotating axis of the polishing grinding disc during the repairing process, so as to avoid the influence of vibration on the position state of the repairing plate 21 during the repairing process.

[0040] Furthermore, a plurality of contact rods 7 are disposed at the upper end of the contact plate 22, and the contact ends 71 ​​of the contact rods 7 point upward. Figure 3The contact rod 7 is provided with a dial indicator and a stopper 72, the detection end of the dial indicator is the contact end 71, and the stopper 72 is used to limit the axial movement of the contact end 71. First, based on the flat plate, the contact ends 71 ​​of all contact rods 7 are kept in contact with the flat plate, and the dial indicator is zeroed. At this time, all contact rods 7 are in the same plane, and then the stopper 72 is used to limit the contact ends 71 ​​of the contact rods 7, so that the contact ends of the contact rods 7 are kept in the same plane and in the same plane as the repairing plane of the repairing plate.

[0041] In this embodiment, the contact plates 22 are provided with a synchronization box 9 whose number and position correspond to the contact rod 7. A synchronization block 91 is provided inside the synchronization box 9, one end of the synchronization block 91 is fixedly connected to the contact rod 7, and the other end of the synchronization block 91 is connected to the inner wall of the synchronization box 9 through a compression spring 92, and the compression spring 92 is used to press the synchronization block 91 toward the repairing plate 21.

[0042] Furthermore, the synchronization box 9 is connected to the balance board 8 through a telescopic sleeve rod 11, and the telescopic sleeve rod 11 includes a sleeved inner rod 111 and an outer rod 112. A spherical joint is provided on the top of the inner rod 111, and a movable plate 93 is provided on the bottom of the synchronization box 9. The movable plate 93 is provided with a concave spherical surface 94 that is cocentric with the spherical joint and matches the spherical joint. The concave spherical surface 94 and the spherical joint can realize spherical articulation, and combined with the telescopic sleeve rod 11, it is used to maintain the connection between the synchronization box 9 and the balance board 8 when the contact plate 22 moves microscopically relative to the balance board 8.

[0043] Furthermore, the spherical joint and the synchronous block 91 are connected by a pull rope 95. When the connecting rod 11 is perpendicular to the axis of the contact plate 22, the distance between the synchronous block 91 and the spherical joint is the farthest. At this time, the compression spring 92 is at the maximum extension, and the pull rope 95 is straightened. When the upper contact plate 24 and the lower contact plate 25 are not parallel to the balance plate 8, the position of the synchronous box 9 is twisted, the length of the connecting tube 11 changes, the movable plate 93 of the synchronous box 9 moves, and the spherical joint on the inner rod 111 rotates relative to the concave spherical surface 94 of the synchronous box 9. The spherical joint pulls the synchronous block 91 away from the repairing plate 21 through the pull rope 95. The synchronous block 91 drives the contact rod 7 to move, and the contact end 71 of the contact rod 7 leaves the plane where the repairing plane of the repairing plate 21 is located. At this time, the contact end 71 of the contact rod 7 is not used for detecting the plane, avoiding invalid flatness measurement of the contact rod 7 when the contact plate 22 is not parallel to the balance plate 8.

[0044] The photomask substrate polishing disc inspection and leveling system in this embodiment includes the following working steps:

[0045] Step 1: The upper positioning plate 41 is placed on the frame of the polishing disc, the repairing plate 21 is attached to the polishing surface of the polishing disc, the positioning cylinder 42 is retracted, and the repairing body 2 and the center positioning sleeve 1 are fixed on the frame of the polishing disc;

[0046] The reflector 6 is mounted on the polishing disc rotating shaft and the reflection point is kept on the central axis of the polishing disc rotating shaft.

[0047] Step 2: The three sensing elements O1, O2 and O3 of the positioning plate 5 emit lasers, and the reflection point of the reflecting element 6 reflects the lasers. The position of the balancing plate 8 and the positioning plate 5 is adjusted by adjusting the cylinder 25, so that the positioning plate 5 is perpendicular to the rotating axis of the polishing disc, and the balancing plate 8 is perpendicular to the rotating axis of the polishing disc. At this time, the positioning of the balancing plate 8 is completed;

[0048] At the same time, the position of the contact plate 22 is adjusted, and the contact plate 22 moves relative to the positioning sleeve 23 to keep the contact plate 22 parallel to the balance plate 8.

[0049] Step 3: Start the polishing equipment, the polishing disc rotates, and the repairing plate 21 performs a single-side polishing and leveling operation on the polishing disc;

[0050] At this time, the movable cylinder 3 is extended and retracted, so that the leveling body 2 can move in the radial direction of the polishing disc, and the leveling plate 21 can be kept leveling the polishing disc comprehensively.

[0051] In the above process, when the contact plate 22 is not parallel to the balance plate 8, the capacitance value C1 between the induction plates 24 changes. At this time, the contact plate 22 adjusts the position of the induction plate 24 by relative positioning sleeve 23 to maintain the parallel state between the contact plate 22 and the balance plate 8, that is, the repairing plane of the repairing plate is kept perpendicular to the polishing surface rotation axis of the polishing grinding disc, so as to obtain a polishing grinding disc surface perpendicular to the polishing surface rotation axis;

[0052] The contact end 71 of the contact rod 7 can be used as a detection piece for the flatness of the polishing disc surface. When all the contact ends 71 ​​have the contact pressure applied by the polishing disc surface, the flattening work of the polishing disc surface is completed.

[0053] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. Photomask substrate polishing disc inspection and leveling system, characterized in that: It comprises a center positioning sleeve (1), two leveling bodies (2), a positioning assembly (4), a positioning plate (5), a reflector (6) and a balancing plate (8), wherein a movable cylinder (3) is arranged between the center positioning sleeve (1) and the leveling body (2), and the balancing plate (8) is located inside the leveling body (2); A spherical groove is arranged inside the center positioning sleeve (1), the positioning plate (5) is located inside the spherical groove, and the side surface of the positioning plate (5) is movably connected to the spherical groove; The flattening body (2) comprises a flattening plate (21), a contact plate (22) and a positioning sleeve (23); the flattening plate (21) is fixedly connected to the top of the contact plate (22); the side surface of the contact plate (22) is slidably connected to the inner wall of the positioning sleeve (23); and the inner wall of the positioning sleeve (23) is an arc surface; The balancing plate (8) is located below the contact plate (22); a sensing plate (24) is arranged inside the contact plate (22); the position of the sensing plate (24) corresponds to the position of the balancing plate (8); the bottom of the balancing plate (8) is connected to the leveling body (2) via an adjustment cylinder (25); a plurality of contact rods (7) are arranged at the upper end of the contact plate (22); the contact ends (71) of the contact rods (7) point upward; The positioning plate (5) is fixedly connected to a first extension rod (51), and the balancing plate (8) is fixedly connected to a second extension rod (81); the first extension rod (51) comprises a transverse rod portion parallel to the positioning plate (5) and a longitudinal rod portion parallel to the second extension rod (81); and the lower end of the second extension rod (81) is slidably connected to the transverse rod portion of the first extension rod (51).

2. The photomask substrate polishing disc detection and leveling system according to claim 1, characterized in that: The positioning plate (5) is provided with three cocircular, non-colinear sensing elements, the reflecting element (6) comprises two reflecting points, the reflecting element (6) is mounted on the polishing disc rotating shaft and keeps the reflecting points located on the central axis of the polishing disc rotating shaft, the sensing element is used to emit and receive laser light, and the reflecting points are used to reflect laser light.

3. The photomask substrate polishing disc detection and leveling system according to claim 2, characterized in that: The balancing plate (8) comprises a metal plate (801), a glass plate (802) and an electrode plate (803); the metal plate (801) is opposite to the contact plate (22); and the sensing plate (24) and the electrode plate (803) carry opposite charges.

4. The photomask substrate polishing disc detection and leveling system according to claim 3, characterized in that: The contact rod (7) is provided with a dial indicator and a stopper (72); the detection end of the dial indicator is the contact end (71); and the stopper (72) is used to limit the axial movement of the contact end (71).

5. The photomask substrate polishing disc inspection and leveling system according to claim 4, characterized in that: The upper contact plate and the lower contact plate are both provided with synchronization boxes (9) whose number and position correspond to the contact rods (7); A synchronization block (91) is disposed inside the synchronization box (9), one end of the synchronization block (91) is fixedly connected to the contact rod (7), and the other end of the synchronization block (91) is connected to the inner wall of the synchronization box (9) via a compression spring (92); The synchronization box (9) is connected to the balance plate (8) via a telescopic sleeve (11), the telescopic sleeve (11) comprising an inner rod (111) and an outer rod (112) which are sleeved together, a spherical joint being arranged at the top of the inner rod (111), and a movable plate (93) being arranged at the bottom of the synchronization box (9), wherein the movable plate (93) is provided with a concave spherical surface (94) which is coaxial with and matches the spherical joint, and the spherical joint and the synchronization block (91) are connected via a pull rope (95); When the axis of the connecting rod (11) and the contact plate (22) are perpendicular, the synchronous block (91) is at the farthest distance from the spherical joint, and the compression spring (92) is at its maximum extension.

6. The photomask substrate polishing disc inspection and leveling system according to any one of claims 1 to 5, characterized in that: The positioning assembly (4) comprises an upper positioning plate (41), a positioning cylinder (42) and a lower positioning plate (43); the upper positioning plate (41) and the lower positioning plate (43) are parallel to each other; the positioning cylinder (42) connects the upper positioning plate (41) and the lower positioning plate (43); the center positioning sleeve (1) is fixedly connected to the lower positioning plate (43); and the leveling body (2) is movably connected to the lower positioning plate (43).

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