Laser projection device

By using a novel electrical connection method between the laser assembly and the adapter board, the problem of the large size of laser projection equipment has been solved, achieving miniaturization and portability of the equipment.

CN116107145BActive Publication Date: 2026-05-22QINGDAO HISENSE LASER DISPLAY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
QINGDAO HISENSE LASER DISPLAY CO LTD
Filing Date
2022-12-08
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

The current packaging method of laser projection equipment results in a large size of the equipment, making it difficult to miniaturize.

Method used

A novel electrical connection method is adopted between the laser assembly and the adapter plate. The electrical connection between the mounting substrate and the conductive layer of the adapter plate reduces the need for fixing of the connectors around the laser assembly, simplifies the electrical connection structure, and reduces the overall size of the light source.

Benefits of technology

This enables the miniaturization of laser projection equipment, improves portability, and simplifies the installation and maintenance of laser components.

✦ Generated by Eureka AI based on patent content.

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Abstract

A laser projection device includes a light source, an optical engine, a lens and a main board. The light source includes a housing, an adapter board and at least one laser component. The adapter board includes a board body and a hollowed area, and the board body has a third surface. The laser component includes a mounting substrate, at least one light emitting component and at least one connecting piece. The mounting substrate includes a first surface, a first area and a second area. The first area is spaced apart from the second area, and the first area is in conduction with the second area. The light emitting component is electrically connected with the first area. One end of the connecting piece is in conduction with the second area, and the other end of the connecting piece is in conduction with the adapter board, so as to make the mounting substrate in conduction with the adapter board.
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Description

[0001] This application claims priority to Chinese patent application No. 202210346829.1, filed on March 31, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of laser projection technology, and more particularly to a laser projection device. Background Technology

[0003] With the widespread application of laser projection equipment, consumer demand for miniaturized laser projection devices is gradually increasing. In order to achieve miniaturization of laser projection equipment, the design of light source products must not only realize basic lighting functions, but also take into account multiple aspects such as size, cost, and optical efficiency. Summary of the Invention

[0004] On one hand, a laser projection device is provided. The laser projection device includes a light source, an optical engine, a lens, and a motherboard. The light source is configured to emit an illumination beam. The optical engine is configured to modulate the illumination beam emitted by the light source to obtain a projection beam. The lens is configured to image the projection beam. The motherboard is configured to transmit control signals to control the laser projection device to display an image. The light source includes a housing, an adapter plate, and at least one laser assembly. The adapter plate is disposed on the housing and electrically connected to the motherboard. The adapter plate includes a plate body and a cutout area. The plate body has a third surface. The cutout area is disposed on the plate body and extends through the plate body. The laser assembly is disposed on the housing and located within the cutout area. The laser assembly includes a mounting substrate, at least one light-emitting component, and at least one connector. The mounting substrate includes a first surface, a first region, and a second region. The first surface is the surface of the mounting substrate adjacent to the housing. The first region and the second region are respectively located on the first surface. The first region and the second region are spaced apart and are electrically connected. The light-emitting component is disposed on the first surface and located within the first region. The light-emitting component is electrically connected to the first region and includes a plurality of light-emitting chips. The light-emitting component is configured to emit a laser beam. One end of the connector is electrically connected to the second region. The other end of the connector is electrically connected to the adapter plate to connect the mounting substrate to the adapter plate.

[0005] On the other hand, a laser projection device is provided. The laser projection device includes a light source, an optical engine, a lens, and a motherboard. The light source is configured to emit an illumination beam. The optical engine is configured to modulate the illumination beam emitted by the light source to obtain a projection beam. The lens is configured to image the projection beam. The motherboard has a third socket and is configured to transmit control signals to control the laser projection device to display an image. The light source includes a housing and at least one laser assembly. The laser assembly is disposed on the housing and includes a mounting substrate, at least one light-emitting component, and a connector. The mounting substrate includes a first surface, a first region, and a second region. The first surface is the surface of the mounting substrate adjacent to the housing. The first region and the second region are respectively located on the first surface. The first region and the second region are spaced apart and are electrically connected. The light-emitting component is disposed on the first surface and located within the first region. The light-emitting component is electrically connected to the first region. The light-emitting component includes a plurality of light-emitting chips and is configured to emit a laser beam. The connector includes a connecting wire, one end of which is connected to the first socket and the other end of which is connected to the third socket, so as to electrically connect the light-emitting component to the motherboard. Attached Figure Description

[0006] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. However, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below...

[0007] This is intended as a schematic diagram and is not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc., involved in the embodiments of this disclosure.

[0008] Figure 1 This is a structural diagram of a light source in related technologies;

[0009] Figure 2A This is a structural diagram of a laser assembly in related technologies;

[0010] Figure 2B for Figure 2A Internal structure diagram of the laser component in the image;

[0011] Figure 3 This is a structural diagram of a laser projection device according to some embodiments;

[0012] Figure 4 This is another structural diagram of a laser projection device according to some embodiments;

[0013] Figure 5 This is an optical path diagram of the light source, optical engine, and lens in a laser projection device according to some embodiments;

[0014] Figure 6 This is another optical path diagram of the light source, optical engine, and lens in a laser projection device according to some embodiments;

[0015] Figure 7 This is a diagram showing the arrangement of tiny reflective mirrors in a digital micromirror device according to some embodiments;

[0016] Figure 8 This is a structural diagram of another laser projection device according to some embodiments;

[0017] Figure 9 This is a structural diagram of a projection screen according to some embodiments;

[0018] Figure 10 This is a structural diagram of a light source according to some embodiments;

[0019] Figure 11 An exploded view of a light source according to some embodiments;

[0020] Figure 12 This is a structural diagram of the housing in a light source according to some embodiments;

[0021] Figure 13 This is a structural diagram of a laser assembly according to some embodiments;

[0022] Figure 14 This is a structural diagram of the laser assembly and adapter plate in a light source according to some embodiments;

[0023] Figure 15 This is a structural diagram of the adapter plate in a light source according to some embodiments;

[0024] Figure 16 This is another structural diagram of the laser assembly and adapter board in a light source according to some embodiments;

[0025] Figure 17 for Figure 16 Cross-sectional view;

[0026] Figure 18 This is yet another structural diagram of the laser assembly and adapter board in a light source according to some embodiments;

[0027] Figure 19 for Figure 18 Cross-sectional view;

[0028] Figure 20 This is yet another structural diagram of the laser assembly and adapter board in a light source according to some embodiments;

[0029] Figure 21 This is a structural diagram of a connecting piece according to some embodiments;

[0030] Figure 22 This is yet another structural diagram of the laser assembly and adapter board in a light source according to some embodiments;

[0031] Figure 23 This is yet another structural diagram of the laser assembly and adapter board in a light source according to some embodiments;

[0032] Figure 24 This is yet another structural diagram of the laser assembly and adapter board in a light source according to some embodiments;

[0033] Figure 25 This is a structural diagram of another laser assembly according to some embodiments;

[0034] Figure 26 This is a structural diagram of yet another laser assembly according to some embodiments;

[0035] Figure 27 This is yet another structural diagram of the laser assembly and adapter board in a light source according to some embodiments;

[0036] Figure 28 This is a structural diagram of another light source according to some embodiments. Detailed Implementation

[0037] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0038] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0039] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0040] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0041] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0042] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0043] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0044] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation as well as situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0045] Figure 1 This is a structural diagram of a light source in related technologies. Figure 2A This is a structural diagram of a laser component in related technologies. Figure 2B for Figure 2A Internal structure diagram of the laser component.

[0046] Usually, such as Figure 1 As shown, the light source 10' includes a laser assembly 2' and two adapter circuit boards 4'. The laser assembly 2' is a multi-chip laser diode (MCL) type laser assembly. The two adapter circuit boards 4' are respectively disposed on both sides of the laser assembly 2', and the two adapter circuit boards 4' are disposed perpendicular to the laser assembly 2'.

[0047] like Figure 2A and Figure 2B As shown, the laser assembly 2' is fully encapsulated. The laser assembly 2' includes a substrate 201', a frame 202', multiple light-emitting chips 2031', and conductive pins 204'. The frame 202' is disposed on the substrate 201' and surrounds the multiple light-emitting chips 2031'. The substrate 201' and the frame 202' form an accommodating space 1000'. The multiple light-emitting chips 2031' are disposed on the substrate 201' and located within the accommodating space 1000'. The conductive pins 204' are fixed to the frame 202'. One end of the conductive pin 204' is located within the accommodating space 1000' and is connected to the multiple light-emitting chips 2031' via a lead 1022'. The other end of the conductive pin 204' is located outside the frame 202' and is connected to the adapter circuit board 4'. In this way, the adapter circuit board 4' can be electrically connected to the laser assembly 2' via the conductive pin 204' to transmit signals to make the light-emitting chip 2031' emit light. However, this packaging method makes the light source 10' relatively large, resulting in a larger size of the laser projection device and making it difficult to miniaturize the laser projection device.

[0048] To address the aforementioned problems, some embodiments of this disclosure provide a laser projection device 100.

[0049] Figure 3 This is a structural diagram of a laser projection device according to some embodiments. Figure 3 As shown, the laser projection device 100 includes a housing 40 ( Figure 3 The image shows only a portion of the housing 40, including a light source 10, an optical engine 20, and a lens 30, all housed within the housing 40. The light source 10 is configured to provide an illumination beam (laser beam). The optical engine 20 is configured to modulate the illumination beam provided by the light source 10 using an image signal to obtain a projection beam. The lens 30 is configured to project the projection beam onto a screen or wall to form an image.

[0050] The light source 10, the optical engine 20, and the lens 30 are connected sequentially along the direction of light beam propagation, and each is enclosed by a corresponding housing. The housings of the light source 10, the optical engine 20, and the lens 30 support the corresponding optical components and ensure that each optical component meets certain sealing or airtight requirements.

[0051] Figure 4 This is another structural diagram of a laser projection device according to some embodiments. For example... Figure 4 As shown, one end of the optical engine 20 is connected to the light source 10, and the light source 10 and the optical engine 20 are aligned along the emission direction of the illumination beam of the laser projection device 100 (see reference). Figure 4 The optical engine 20 is set in the M direction. The other end of the optical engine 20 is connected to the lens 30, and the optical engine 20 and the lens 30 are aligned with the emission direction of the projection beam of the laser projection device 100 (refer to the M direction). Figure 4 The illumination beam's exit direction M is approximately perpendicular to the projection beam's exit direction N. This connection structure adapts to the optical path characteristics of the reflective light valve in the optical engine 20 and also helps shorten the optical path length in one dimension, facilitating the overall structural layout. For example, when the light source 10, optical engine 20, and lens 30 are positioned in one dimension (e.g., the M direction), the optical path length in that dimension becomes very long, which is detrimental to the overall structural layout. The reflective light valve will be described later.

[0052] In some embodiments, the light source 10 may provide three primary colors of light sequentially (or other colors of light may be added to the three primary colors of light). Due to the persistence of vision in the human eye, the human eye sees white light formed by the mixture of the three primary colors of light. Alternatively, the light source 10 may simultaneously output three primary colors of light, continuously emitting white light. The light source 10 includes a laser assembly that can emit laser beams of at least one color, such as a red laser beam, a blue laser beam, or a green laser beam.

[0053] Figure 5 This is an optical path diagram of the light source, optical engine, and lens in a laser projection device according to some embodiments. Figure 6 This is another optical path diagram of the light source, optical engine, and lens in a laser projection device according to some embodiments. The illumination beam emitted from the light source 10 enters the optical engine 20. (As shown...) Figure 5 and Figure 6As shown, the optomechanical system 20 includes a light guide 210, a reflector 220, a lens assembly 230, a prism assembly 240, and a digital micromirror device (DMD) 250. The light guide 210 receives and homogenizes the illumination beam provided by the light source 10. Furthermore, the exit of the light guide 210 can be rectangular, thus providing a beam shaping effect. The reflector 220 reflects the illumination beam to the lens assembly 230. The lens assembly 230 converges the illumination beam to the prism assembly 240. The prism assembly 240 reflects the illumination beam to the digital micromirror device 250, which modulates the illumination beam to obtain a projection beam and reflects the projection beam into the lens 30. Of course, the light guide 210 can also be replaced by a compound eye lens or other components with homogenizing functions; this disclosure does not limit this.

[0054] In the optomechanical system 20, the digital micromirror device 250 modulates the illumination beam provided by the light source 10 using image signals. Specifically, it controls the projection beam to display different brightness and grayscale levels for different pixels of the image to be displayed, ultimately forming an optical image. Therefore, the digital micromirror device 250 is also called an optical modulator or optical valve. Depending on whether the optical modulator (or optical valve) transmits or reflects the illumination beam, optical modulators can be classified as transmissive optical modulators or reflective optical modulators. For example, Figure 6 The digital micromirror device 250 shown reflects the illumination beam, thus it is a reflective light modulator. The liquid crystal light valve, on the other hand, transmits the illumination beam, therefore it is a transmissive light modulator. Furthermore, depending on the number of light modulators used in the optomechanism 20, the optomechanism 20 can be classified as a single-chip system, a dual-chip system, or a triple-chip system. In some embodiments of this disclosure, the light modulator is the digital micromirror device 250.

[0055] Figure 7 This is a diagram showing the arrangement of tiny reflective mirrors in a digital micromirror device according to some embodiments.

[0056] like Figure 7As shown, the digital micromirror device 250 comprises thousands of individually rotatable micromirrors 2501 arranged in an array. Each micromirror 2501 (e.g., each micromirror 2501) corresponds to a pixel in the projected image to be displayed. The image signal is processed and converted into digital codes such as 0 and 1. In response to these digital codes, the micromirrors 2501 can oscillate. By controlling the duration of each micromirror 2501 in its on and off states, the grayscale of each pixel in a frame of image is achieved. In this way, the digital micromirror device 250 can modulate the illumination beam, thereby realizing the display of the projected image. The on state of the micromirrors 2501 is the state in which the illumination beam emitted by the light source 10 enters the lens 30 after being reflected by the micromirrors 2501, and can be maintained. The off state of the micro reflector 2501 is the state in which the micro reflector 2501 is located and can be maintained when the illumination beam emitted by the light source 10 is reflected by the micro reflector 2501 and does not enter the lens 30.

[0057] The light guide 210, reflector 220 and lens assembly 230 at the front end of the digital micromirror device 250 form an illumination optical path. The illumination beam emitted by the light source 10 forms a beam size and incident angle that meet the requirements of the digital micromirror device 250 after passing through the illumination optical path.

[0058] In some embodiments, such as Figure 5 As shown, lens 30 comprises a combination of multiple lenses, typically divided into three sections: a front group, a middle group, and a rear group, or a two-section structure with a front group and a rear group. The front group is located closer to the light-emitting side of the laser projection device 100 (i.e., Figure 5 The middle lens 30 is the lens group on the side away from the optical engine 20 along the N direction, and the rear lens group is the lens group on the side closer to the light output of the optical engine 20 (i.e., Figure 5 The lens group 30 (located on the side of the optical engine 20 in the opposite direction to the N direction) is a type of lens. Lens 30 can be a zoom lens, a fixed-focus adjustable lens, or a fixed-focus lens. In some embodiments, the laser projection device 100 is an ultra-short-throw projection device, and lens 30 is an ultra-short-throw projection lens. The throw ratio of lens 30 is typically less than 0.3, such as 0.24. A smaller throw ratio means that, at the same projection distance, the projected image from the laser projection device 100 is larger. Ultra-short-throw lenses with small throw ratios can adapt to narrower spaces while maintaining projection quality. Thus, the laser projection device 100 can achieve a large-size projection display with a relatively small throw ratio.

[0059] Figure 8 This is a structural diagram of another laser projection device according to some embodiments. For example, such as... Figure 8As shown, the laser projection device 100 includes a projection screen 60. The projection screen 60 is disposed in the light output path of the lens 30 and can reflect the projection beam emitted from the lens 30 to display the projected image. The lens 30 includes a refractive mirror group and a reflector. After correcting and amplifying the projection beam, the lens 30 reflects the projection beam to the projection screen 60 for imaging.

[0060] Figure 9 This is a structural diagram of a projection screen according to some embodiments.

[0061] In some embodiments, the projection screen 60 may be an optical screen, such as... Figure 9 As shown, the projection screen 60 includes a support plate 601 and a diaphragm 605. The diaphragm 605 is disposed on the support plate 601. For example, the support plate 601 can be bonded to the diaphragm 605 by an adhesive layer (such as a double-sided adhesive layer or an adhesive layer) to fix the diaphragm 605.

[0062] The diaphragm 605 can be an optical diaphragm including a Fresnel lens layer. For example, in the direction away from the support plate 601, the diaphragm 605 includes a diffusion layer 602, a substrate layer 603, and a Fresnel lens layer 604 stacked sequentially; or, the diaphragm 605 includes a substrate layer 603, a diffusion layer 602, and a Fresnel lens layer 604 stacked sequentially. The substrate layer 603 is a transparent film. When the projection beam is incident on the projection screen 60, the projection beam is dispersed by the diffusion layer 602 and reflected by the Fresnel lens layer 604 to the human eye, thereby projecting an image onto the projection screen 60.

[0063] like Figure 3 As shown, the laser projection device 100 also includes a power system architecture.

[0064] 50. Figure 3 This only illustrates the general location of the circuit system architecture 50; the specific location of the circuit system architecture 50 may vary in different laser projection devices 100. The circuit system architecture 50 includes multiple printed circuit boards (PCBAs), such as power boards, TV (television) boards, control boards, and display boards. These multiple circuit boards are typically stacked. It should be noted that one of these circuit boards is the mainboard 500 (e.g., ...). Figure 27 The motherboard 500 is configured to transmit control signals to control the laser projection device 100 to display images.

[0065] For ease of description, some embodiments of this disclosure are mainly illustrated by the example of the time-sequential output of three primary color light by the light source 10 and the use of a digital micromirror device 250 as the optical modulation device in the optomechanical system 20. However, this should not be construed as a limitation of this disclosure. The light source 10 in some embodiments of this disclosure is described in detail below.

[0066] Figure 10 This is a structural diagram of a light source according to some embodiments. Figure 11 This is an exploded view of a light source according to some embodiments. Figure 12 This is a structural diagram of the housing in a light source according to some embodiments.

[0067] In some embodiments, such as Figure 10 As shown, the light source 10 includes a housing 1 and a laser assembly 2, with the laser assembly 2 disposed on the housing 1. The housing 1 is configured to support the optical components of the light source 10 and ensure that the optical components meet certain sealing or airtight requirements. The laser assembly 2 is configured to emit a laser beam. For example, as... Figure 11 As shown, the housing 1 includes a housing body 111 and a light outlet 104. The housing body 111 includes a first side plate 101 (as shown in the image). Figure 4 The first side plate 101 and the second side plate 102 are arranged opposite to each other. The multiple third side plates 103 are disposed between the first side plate 101 and the second side plate 102, and are respectively connected to the first side plate 101 and the second side plate 102. The first side plate 101, the second side plate 102, and the multiple third side plates 103 form an accommodating space 1000 (e.g., ...). Figure 12 ).

[0068] like Figure 10 As shown, the laser assembly 2 is mounted on one of the plurality of third side plates 103. Figure 12 As shown, the light exit port 104 is disposed on another third side plate 103 among a plurality of third side plates 103. The light exit port 104 communicates with the accommodating space 1000 of the light source 10 and the light inlet of the optical engine 20, respectively, so that the illumination beam emitted from the light source 10 is incident on the optical engine 20.

[0069] In some embodiments, the third side plate 103 corresponding to the light outlet 104 is disposed opposite to the third side plate 103 corresponding to the laser assembly 2, or the third side plate 103 corresponding to the light outlet 104 is perpendicular to the third side plate 103 corresponding to the laser assembly 2. For example, Figure 12As shown, the plurality of third side plates 103 include a first sub-side plate 1031, a second sub-side plate 1032, a third sub-side plate 1033, a fourth sub-side plate 1034, and a fifth sub-side plate 1035. Adjacent pairs of the first sub-side plate 1031, second sub-side plate 1032, third sub-side plate 1033, fourth sub-side plate 1034, and fifth sub-side plate 1035 are connected. The laser assembly 2 is disposed on the first sub-side plate 1031, and the light outlet 104 is disposed on the third sub-side plate 1033, with the third sub-side plate 1033 perpendicular to the first sub-side plate 1031.

[0070] In some embodiments, the light source 10 further includes a lens group and a reflector group, which are disposed in an accommodating space 1000 within the housing 1. The lens group is configured to converge and diverge the laser beam emitted by the laser assembly 2, and the reflector group is configured to reflect the laser beam emitted by the laser assembly 2 to change the transmission path of the laser beam. It should be noted that the laser beam emitted by the laser assembly 2, after passing through the lens group and the reflector group, serves as the illumination beam of the light source 10 and exits from the light outlet 104.

[0071] The light source 10 is configured to emit a laser beam of at least one color. For example, the laser assembly 2 emits a laser beam of one color, in which case the light source 10 is a monochromatic laser light source. Of course, the laser assembly 2 can also emit laser beams of at least two colors, in which case the light source 10 can be a dual-color laser light source or a multi-color laser light source.

[0072] In some embodiments, the light source 10 may include a laser component 2. A laser component 2 may emit a laser beam of one color or multiple colors. Alternatively, the light source 10 may include multiple laser components 2. In this case, one of the multiple laser components 2 may emit a laser beam of one color, and the multiple laser components 2 may emit a laser beam of the same color. Of course, the multiple laser components 2 may also emit laser beams of different colors, or each of the multiple laser components 2 may emit laser beams of at least two colors; this disclosure does not limit this. It should be noted that when the multiple laser components 2 emit one or two colors of laser beams, the light source 10 may also include a fluorescent wheel, which is disposed in the accommodating space 1000 of the housing 1. Under the illumination of the laser beam emitted by the laser component 2, the fluorescent wheel may produce fluorescence of other colors to meet the display requirements of the projected image.

[0073] Figure 13 This is a structural diagram of a laser assembly according to some embodiments. Figure 14This is a structural diagram of a laser assembly and an adapter plate in a light source according to some embodiments. In some embodiments, such as Figure 13 and Figure 14 As shown, the laser assembly 2 includes a mounting substrate 201, a light-emitting component 203, and a connector 205. The mounting substrate 201 includes a first surface 2011 and a second surface 2012 (e.g., ...). Figure 10 As shown, the first surface 2011 and the second surface 2012 are disposed opposite to each other. The first surface 2011 is the surface of the mounting substrate 201 that is close to the housing 1. The second surface 2012 is the surface of the mounting substrate 201 that is away from the housing 1. Of course, in some embodiments, the first surface 2011 may also be the surface of the mounting substrate 201 that is away from the housing 1, and the second surface 2012 may also be the surface of the mounting substrate 201 that is close to the housing 1.

[0074] In some embodiments, the mounting substrate 201 includes a substrate, a conductive layer, and an insulating layer, wherein the substrate, the conductive layer, and the insulating layer are stacked sequentially. The substrate may be made of an insulating material with good thermal conductivity. The conductive layer may be made of a metal (such as copper). The conductive layer has a conductive pattern formed by an etching process, and the connector 205 is electrically connected to the light-emitting component 203 through the conductive pattern. The portions of the conductive layer that are electrically connected to the light-emitting component 203 and the connector 205 (such as solder pads) are exposed, while the remaining portion of the conductive layer is covered by the insulating layer to protect the conductive layer.

[0075] In some embodiments, such as Figure 13 As shown, the mounting substrate 201 includes a first region 2011A and a second region 2011B, with the first region 2011A and the second region 2011B respectively located on a first surface 2011. The first region 2011A and the second region 2011B are spaced apart and are electrically connected. For example, the first region 2011A and the second region 2011B are portions of the conductive layer not covered by the insulating layer, and the first region 2011A and the second region 2011B can be electrically connected through the conductive pattern in the conductive layer.

[0076] A light-emitting component 203 is disposed on a first surface 2011 of a mounting substrate 201 and located within a first region 2011A. The light-emitting component 203 is electrically connected to the first region 2011A and is configured to emit a laser beam. For example, the first region 2011A includes a third pad, and the light-emitting component 203 includes a connection area corresponding to the first region 2011A. The connection area is soldered (e.g., brazed) to the third pad to electrically connect the light-emitting component 203 to the first region 2011A.

[0077] In some embodiments, the light-emitting component 203 includes a plurality of light-emitting chips 2031. For example, such as Figure 13 As shown, four light-emitting chips 2031 are packaged into one light-emitting component 203, and the four light-emitting chips 2031 are connected in series. Of course, the light-emitting component 203 may also include one, two, three or more light-emitting chips 2031, and this disclosure does not limit this.

[0078] In some embodiments, the laser assembly 2 may include one or more light-emitting components 203. The multiple light-emitting components 203 may be connected in series, or they may be connected in parallel.

[0079] For example, when multiple light-emitting components 203 emit laser beams of the same color, the multiple light-emitting components 203 are connected in series. When multiple light-emitting components 203 emit laser beams of different colors, the light-emitting components 203 emitting laser beams of different colors are connected in parallel, and the light-emitting components 203 emitting laser beams of the same color are connected in series.

[0080] In some embodiments, one end of the connector 205 is conductive to the second region 2011B in the mounting substrate 201. The other end of the connector 205 is conductive to the motherboard 500. The connector 205 is configured to make the mounting substrate 201 conductive to the motherboard 500. The light-emitting component 203 is electrically connected to the connector 205 through the mounting substrate 201, so that control signals from the motherboard 500 can be transmitted to the light-emitting component 203 to control the light-emitting component 203 to emit a laser beam. For example, as Figure 13 As shown, the mounting substrate 201 includes a first welding portion 2013, which constitutes a second region 2011B. One end of the connector 205 is welded to the first welding portion 2013, or the connector 205 may abut against the first welding portion 2013 to make the connector 205 conductive with the second region 2011B. In this way, the light-emitting component 203 can be electrically connected to the connector 205 through the conductive layer on the mounting substrate 201, and the connection reliability between the light-emitting component 203 and the connector 205 is good.

[0081] In some embodiments, connector 205 includes a connecting wire (such as a ribbon cable), one end of which can be connected to a socket (such as a receptacle). Figure 25 The first socket 2052 in the middle is connected to the second area 2011B, and the other end of the connecting wire is connected through another socket (such as...). Figure 27The third socket 501 in the laser projection device 100 is directly electrically connected to the motherboard 500, or the connector 205 is electrically connected to the motherboard 500 via an adapter circuit board in the laser projection device 100. It should be noted that the adapter circuit board can be mounted on the housing 1 to connect the motherboard 500 and the connector 205. Of course, the adapter circuit board can also be mounted in other locations.

[0082] In some embodiments of this disclosure, the light-emitting component 203 and the connector 205 are electrically connected through the conductive layer in the mounting substrate 201, thereby allowing the light-emitting component 203 to be electrically connected to the motherboard 500 in the laser projection device 100 via the connector 205. In this way, the light-emitting component 203 can receive control signals from the motherboard 500 to emit a laser beam, eliminating the need for a side plate surrounding the mounting substrate 201 to fix the connector 205. This results in a smaller laser component 2 and a smaller overall size of the light source 10, facilitating miniaturization of the laser projection device 100 and improving its portability.

[0083] In addition, the connector 205 is connected to the mounting base plate 201 by patch welding, which facilitates the installation and removal of the laser assembly 2 and the housing 1, and facilitates the maintenance and replacement of the laser assembly 2.

[0084] The connection between the motherboard 500 and the laser assembly 2 in some embodiments of this disclosure is described in detail below.

[0085] Figure 15 This is a structural diagram of the adapter plate in a light source according to some embodiments.

[0086] In some embodiments, such as Figure 15 As shown, the light source 10 also includes an adapter board 3. The layer structure of the adapter board 3 is similar to that of the mounting substrate 201, and will not be described in detail here. The adapter board 3 is electrically connected to the main board 500. For example, the adapter board 3 is provided with a fourth socket, which is electrically connected to the main board 500 via a wire.

[0087] like Figure 15 As shown, the adapter board 3 includes a board body 300 and a cutout area 301. The cutout area 301 is disposed on the board body 300 and extends through the board body 300. The laser assembly 2 is located within the cutout area 301. For example, the inner sidewall of the cutout area 301 is in contact with the outer sidewall of the mounting substrate 201. In this way, the connection between the mounting substrate 201 and the adapter board 3 is compact, improving the reliability of the connection between the mounting substrate 201 and the adapter board 3. It should be noted that the adapter board 3 may refer to the aforementioned adapter circuit board.

[0088] In some embodiments, such as Figure 14As shown, the plate body 300 has a third surface 302, which is the surface of the plate body 300 closest to the housing 1. Of course, the third surface 302 can also be other surfaces of the plate body 300. For example, the third surface 302 can be the surface of the plate body 300 furthest from the housing 1, and this disclosure does not limit this.

[0089] The third surface 302 is flush with the first surface 2011 of the mounting substrate 201. This flush alignment means that the first surface 2011 and the third surface 302 are coplanar. For example, when the mounting substrate 201 and the adapter plate 3 have the same thickness, they are coplanar. This results in smaller dimensions of the laser assembly 2 and the adapter plate 3 in the thickness direction, and better overall flatness of the laser assembly 2 and the adapter plate 3 after installation.

[0090] Of course, in some embodiments, the first surface 2011 and the third surface 302 may not be coplanar.

[0091] Figure 16 This is another structural diagram of the laser assembly and adapter board in a light source according to some embodiments. Figure 17 for Figure 16 Cross-sectional view. Figure 18 This is yet another structural diagram of the laser assembly and adapter board in a light source according to some embodiments. Figure 19 for Figure 18 Cross-sectional view.

[0092] For example, such as Figure 16 and Figure 17 As shown, the adapter plate 3 is located on the side of the mounting substrate 201 away from the light-emitting component 203 (as shown above), and the plate body 300 of the adapter plate 3 is spaced apart from the mounting substrate 201.

[0093] For example, such as Figure 18 and Figure 19 As shown, the adapter plate 3 is located on the side of the mounting substrate 201 closest to the light-emitting component 203 (as shown below), and the plate body 300 of the adapter plate 3 is spaced apart from the mounting substrate 201. In this case, the other part of the connector 205 is provided on the fourth surface 305 to communicate with the adapter plate 3. The fourth surface 305 is the side opposite to the third surface 302 of the plate body 300.

[0094] It should be noted that since the plate body 300 and the mounting substrate 201 are spaced apart, the laser assembly 2 does not need to be disposed within the cutout area 301. Thus, the cutout area 301 of the adapter plate 3 is optional and can be omitted. That is, in some embodiments, the adapter plate 3 does not include the cutout area 301.

[0095] When the light source 10 includes an adapter plate 3, one end of the connector 205 is connected to the second region 2011B, and the other end of the connector 205 is connected to the adapter plate 3, thereby connecting the mounting substrate 201 and the adapter plate 3. For example, the mounting substrate 201 includes a first conductive portion, and the adapter plate 3 also includes a second conductive portion. The first conductive portion is located in and connected to the second region 2011B. The second conductive portion is disposed on the board body 300 and corresponds to the first conductive portion. One end of the connector 205 is connected to the first conductive portion, and the other end of the connector 205 is connected to the second conductive portion. In this way, control signals from the main board 500 can be transmitted to the light-emitting component 203 through the adapter plate 3 and the mounting substrate 201. In addition, the second region 2011B may be located at the edge of the mounting substrate 201, and the second region 2011B is closer to the adapter plate 3 than the first region 2011A, to facilitate the installation of the connector 205.

[0096] In some embodiments, such as Figure 14 As shown, the connector 205 includes multiple connecting pieces 2051. The connecting pieces 2051 can be made of conductive metal material and are integral parts. One end of the connecting piece 2051 is disposed on the first surface 2011 and is conductive to the mounting substrate 201, and the other end of the multiple connecting pieces 2051 is disposed on the third surface 302 and is conductive to the adapter plate 3.

[0097] For example, the two ends of the multiple connecting pieces 2051 are rigidly connected to the mounting base plate 201 and the adapter plate 3, respectively. Alternatively, the two ends of the multiple connecting pieces 2051 are connected to the mounting base plate 201 and the adapter plate 3 by welding, and are fixed to the mounting base plate 201 and the adapter plate 3, respectively.

[0098] In some embodiments, such as Figure 13 As shown, the mounting substrate 201 includes a plurality of first soldering portions 2013, and the first conductive portion includes a plurality of first soldering portions 2013. The plurality of first soldering portions 2013 are disposed on the first surface 2011, and the plurality of first soldering portions 2013 are electrically connected to a plurality of light-emitting chips 2031 in the light-emitting component 203. In this case, as... Figure 14 and Figure 15 As shown, the adapter plate 3 includes a plurality of second welding portions 304, and the second conductive portion includes a plurality of second welding portions 304. The plurality of second welding portions 304 are disposed on the third surface 302 and correspond to a plurality of first welding portions 2013.

[0099] For example, when the mounting substrate 201 includes two first welding portions 2013, the adapter plate 3 includes two second welding portions 304, and the connector 205 includes two connecting pieces 2051. Thus, the two second welding portions 304 can be electrically connected to the two first welding portions 2013 through the two connecting pieces 2051, thereby enabling the mounting substrate 201 and the adapter plate 3 to be electrically connected. In this way, the light-emitting component 203 and the main board 500 only require a small number of connecting pieces 2051 to achieve electrical connection, which is simple and convenient. Of course, the two ends of the multiple connecting pieces 2051 can also be electrically connected to the mounting substrate 201 and the adapter plate 3 in other ways and fixed to the mounting substrate 201 and the adapter plate 3. In this way, when the adapter plate 3 is electrically connected to the main board 500, the light-emitting component 203 in the laser assembly 2 can be electrically connected to the main board 500, thereby receiving control signals from the main board 500 to emit a laser beam.

[0100] It should be noted that one laser component 2 can correspond to two connecting pieces 2051. In this case, the multiple light-emitting chips 2031 in the light-emitting component 203 are connected in series. Alternatively, one laser component 2 can also correspond to three or more connecting pieces 2051, in which case the multiple light-emitting chips 2031 in the light-emitting component 203 can be connected in parallel.

[0101] In some embodiments, such as Figure 15 As shown, the adapter plate 3 also includes a plurality of first mounting holes 303. The plurality of first mounting holes 303 are respectively disposed on a plurality of second welding portions 304. The first mounting holes 303 penetrate the plate body 300. For example, the first mounting hole 303 is a through hole. Of course, the first mounting hole 303 may not penetrate the plate body 300. For example, the first mounting hole 303 is a blind hole.

[0102] Figure 20 This is yet another structural diagram of the laser assembly and adapter plate in a light source according to some embodiments. Figure 21 This is a structural diagram of a connecting piece according to some embodiments. Figure 22 This is yet another structural diagram of the laser assembly and adapter plate in a light source according to some embodiments. Figure 23 This is yet another structural diagram of the laser assembly and adapter plate in a light source according to some embodiments.

[0103] In some embodiments, such as Figure 17 , Figure 19 and Figure 20 As shown, the connecting piece 2051 includes a main body 20511, a first connecting part 20512, and a second connecting part 20513.

[0104] like Figure 21As shown, the main body 20511 has a first end 20511A and a second end 20511B, which are disposed opposite to each other. One end of the first connecting portion 20512 is connected to the first end 20511A, and the other end of the first connecting portion 20512 is welded to the first welding portion 2013. For example, the first connecting portion 20512 includes a first sub-connecting portion 20512A and a second sub-connecting portion 20512B, which are disposed perpendicularly to each other. The first sub-connecting portion 20512A is fitted to and welded to the first welding portion 2013. One end of the second sub-connecting portion 20512B is connected to the first end 20511A, and the other end is connected to the first sub-connecting portion 20512A. Of course, the first connecting portion 20512 can also be in other shapes. For example, as shown in... Figure 19 As shown, the first connecting part 20512 is strip-shaped and abuts against the first welding part 2013.

[0105] One end of the second connecting portion 20513 is connected to the second end 20511B, and the other end of the second connecting portion 20513 mates with the first mounting hole 303 and is welded to the second welding portion 304. For example, the second connecting portion 20513 is strip-shaped, inserted into the first mounting hole 303, and fixedly connected to the second welding portion 304 by welding. In this way, with the connecting piece 2051 having a certain structural strength, the connecting piece 2051 can undergo elastic deformation, which facilitates the connection of both ends of the connecting piece 2051 to the mounting base plate 201 and the adapter plate 3, respectively.

[0106] In some embodiments, such as Figure 21 As shown, the first connecting portion 20512 and the second connecting portion 20513 are perpendicular to the main body portion 20511. Of course, the preset included angle between the first connecting portion 20512 (or the second connecting portion 20513) and the main body portion 20511 can also be an acute angle or an obtuse angle.

[0107] In some embodiments, when the first mounting hole 303 is a through hole penetrating the plate body 300, such as Figure 21 As shown, the connecting piece 2051 also includes a protrusion 20514. The protrusion 20514 is disposed on one side of the second connecting portion 20513 and protrudes in a direction away from the second connecting portion 20513. The protrusion 20514 abuts against the third surface 302 to limit the connection piece 2051. For example, as... Figure 21 As shown, the connecting piece 2051 includes two protrusions 20514, which are respectively disposed on both sides of the second connecting portion 20513 and are symmetrically arranged with respect to the second connecting portion 20513. In this way, by providing the protrusions 20514, the connection stability between the connecting piece 2051 and the adapter plate 3 can be improved.

[0108] It should be noted that, Figure 20 The illustration is given with the first surface 2011 and the third surface 302 being coplanar. However, if the first surface 2011 and the third surface 302 are not coplanar, as shown... Figure 22 and Figure 23 As shown, the connecting piece 2051 can still be connected to the mounting base plate 201 and the adapter plate 3 using the above connection method.

[0109] However, in some embodiments, the connecting piece 2051 may also directly abut against the second welding portion 304 of the adapter plate 3. In this case, the first mounting hole 303 is optional and can be omitted. That is, in some embodiments, the adapter plate 3 does not include the first mounting hole 303. For example, as Figure 17 and Figure 19 As shown, the other end of the first connecting portion 20512 of the connecting piece 2051 abuts against the first welding portion 2013, and the other end of the second connecting portion 20513 of the connecting piece 2051 abuts against the second welding portion 304.

[0110] Of course, there can be other connection methods between the connecting piece 2051, the mounting base plate 201, and the adapter plate 3.

[0111] Figure 24 This is yet another structural diagram of the laser assembly and adapter plate in a light source according to some embodiments. Figure 25 This is a structural diagram of another laser assembly according to some embodiments. Figure 26 This is a structural diagram of yet another laser assembly according to some embodiments. Figure 27 This is yet another structural diagram of the laser assembly and adapter plate in a light source according to some embodiments.

[0112] In some embodiments, such as Figure 24 As shown, the connecting piece 2051 includes a main body 20511 and a plurality of third connecting parts 20515. The main body 20511 is connected to the housing 1 and has a first end 20511A and a second end disposed opposite to each other.

[0113] 20511B. A plurality of third connecting portions 20515 are respectively connected to both ends (first end 20511A and second end 20511B) of the main body portion 20511, and are located on the same side of the main body portion 20511 (such as the side of the main body portion 20511 away from the housing 1). The plurality of third connecting portions 20515 abut against a plurality of first welding portions 2013 and a plurality of second welding portions 304.

[0114] For example, such as Figure 24As shown, the light source 10 includes two connecting pieces 2051, each of which includes two third connecting portions 20515. Each third connecting portion 20515 includes a third sub-connecting portion 21, a fourth sub-connecting portion 23, and a bent portion 22. The two ends of the bent portion 22 are connected to the third sub-connecting portion 21 and the fourth sub-connecting portion 23, respectively, and the surface of the bent portion 22 away from the housing 1 abuts against the first welding portion 2013 or the second welding portion 304. The bent portion 22 is arc-shaped, and its arc-shaped opening faces the housing 1. Thus, given a certain structural strength, the connecting piece 2051 can undergo elastic deformation, facilitating communication between the connecting piece 2051 and the mounting base plate 201 and the adapter plate 3, and facilitating installation and disassembly.

[0115] In some embodiments, the third connecting portion 20515 is disposed at a predetermined angle to the main body portion 20511. For example, the third connecting portion 20515 is disposed perpendicular to the main body portion 20511. Of course, the predetermined angle between the third connecting portion 20515 and the main body portion 20511 can also be other angles.

[0116] It should be noted that, Figure 24 The illustration is given with the first surface 2011 and the third surface 302 being coplanar. However, even when the first surface 2011 and the third surface 302 are not coplanar, the connecting piece 2051 can still abut against the mounting substrate 201 and the adapter plate 3 using the above connection method.

[0117] Furthermore, in some embodiments of this disclosure, the connector 205 is not limited to the connector piece 2051; the connector 205 can also be replaced with a metal wire (such as a gold wire, silver wire, or copper wire). In this case, the mounting substrate 201 and the adapter plate 3 are connected via the metal wire. For example, the connector 205 includes a connecting wire, one end of which is connected to the second region 2011B (such as the first soldering part 2013), and the other end of which is connected to a portion of the adapter plate 3 (such as the second soldering part 304).

[0118] Of course, in some embodiments, the connector 205 can also be directly electrically connected to the motherboard 500, in which case the adapter circuit board (such as adapter board 3) is not required. For example, as Figure 25 and Figure 26 As shown, the mounting substrate 201 includes a first socket 2052, which is disposed on a first surface 2011 and located within a second region 2011B. The first socket 2052 is electrically connected to the second region 2011B. For example, the first socket 2052 is soldered to the first surface 2011 in a surface mount configuration. It should be noted that the first conductive portion includes the first socket 2052.

[0119] In this case, such as Figure 27As shown, the motherboard 500 is provided with a third socket 501, and the connector 205 includes a connecting cable 2053 (such as a ribbon cable). One end of the connecting cable 2053 is connected to the first socket 2052, and the other end of the connecting cable 2053 is connected to the third socket 501 to electrically connect the light-emitting component 203 to the motherboard 500.

[0120] Of course, in some embodiments, the laser assembly 2 can also be electrically connected to the adapter plate 3 via the first socket 2052. For example, the adapter plate 3 includes a second socket disposed on the plate body 300 and connected to the first socket 2052 via a wire. It should be noted that the second conductive part includes the second socket. In addition, when the adapter plate 3 includes the second socket, the adapter plate 3 may also include the aforementioned second welding part 304.

[0121] The preceding description primarily uses a single laser component 2 as an example of a light source 10. Of course, in some embodiments, the light source 10 may also include multiple laser components 2 to increase the power of the light source 10. The mounting substrates 201 of the multiple laser components 2 abut against each other, and the mounting substrates 201 of the multiple laser components 2 are coplanar. The multiple light-emitting components 203 of the multiple laser components 2 are respectively disposed on their respective mounting substrates 201. Alternatively, the multiple light-emitting components 203 of the multiple laser components 2 may share the same mounting substrate 201; that is, the multiple light-emitting components 203 of the multiple laser components 2 are disposed on the same mounting substrate 201.

[0122] For example, such as Figure 14 As shown, the light source 10 includes a first laser assembly 2A and a second laser assembly 2B. In either the first laser assembly 2A or the second laser assembly 2B, a plurality of first welded portions 2013 are located on the same side of the light-emitting component 203. For example, the mounting substrate 201 is rectangular, and the light-emitting component 203 is located on the mounting substrate 201 along its width direction (e.g., ...). Figure 13 At one end of the mounting substrate 201 (in the RS direction), a plurality of first weld portions 2013 are located at the other end of the mounting substrate 201 along the width direction. Furthermore, in the adapter plate 3, a plurality of second weld portions 304 electrically connected to the same laser assembly 2 are also located on the same side of the cutout area 301. For example, as... Figure 14 As shown, the first laser assembly 2A and the second laser assembly 2B are disposed in the hollow area 301, and the plurality of second welding parts 304 in the adapter plate 3 are respectively located on both sides of the hollow area 301. The second welding part 304 electrically connected to the first laser assembly 2A is located on one side of the hollow area 301, and the second welding part 304 electrically connected to the second laser assembly 2B is located on the other side of the hollow area 301.

[0123] like Figure 14As shown, the mounting substrate 201 of the first laser assembly 2A abuts against the mounting substrate 201 of the second laser assembly 2B, and the first surface 2011 of the first laser assembly 2A and the first surface 2011 of the second laser assembly 2B are coplanar. For example, the side of the mounting substrate 201 of the first laser assembly 2A away from the first welding portion 2013 abuts against the side of the mounting substrate 201 of the second laser assembly 2B away from the first welding portion 2013. Furthermore, the side of the mounting substrate 201 of the first laser assembly 2A near the first welding portion 2013 and the side of the mounting substrate 201 of the second laser assembly 2B near the first welding portion 2013 respectively abut against the inner sidewall of the hollow area 301. In this way, by splicing the two laser assemblies 2 together and placing them in a hollow area 301, the power of the illumination beam emitted by the light source 10 can be increased. It should be noted that... Figure 14 The light source 10 includes two laser components 2 as an example. Of course, the light source 10 may also include three, four or more laser components 2.

[0124] The following explanation uses the light source 10, which includes two laser components 2, as an example.

[0125] In some embodiments, such as Figure 12 As shown, the housing 1 includes a light inlet 110, which is disposed on the third side plate 103. The light inlet 110 communicates with the accommodating space 1000, and at least a portion of the laser assembly 2 is located within the light inlet 110. The light inlet 110 is configured to transmit the laser beam emitted by the laser assembly 2, so that the laser beam emitted by the laser assembly 2 is incident into the accommodating space 1000. The laser beam incident into the accommodating space 1000 can exit through the lens group and the reflector group to the light outlet 104, and then enter the optomechanical unit 20 through the light outlet 104.

[0126] In some embodiments, such as Figure 12 As shown, when the light source 10 includes two laser components 2, the light inlet 110 includes a second mounting hole 105 and a third mounting hole 106. The second mounting hole 105 and the third mounting hole 106 are disposed on the first sub-side plate 1031, and at least a portion of the first laser component 2A and at least a portion of the second laser component 2B are respectively disposed in the second mounting hole 105 and the third mounting hole 106.

[0127] Figure 28 This is a structural diagram of another light source according to some embodiments. For example, such as... Figure 28 As shown, the inner wall of the second mounting hole 105 surrounds the light-emitting component 203 in the first laser assembly 2A, and the inner wall of the third mounting hole 106 surrounds the light-emitting component 203 in the second laser assembly 2B.

[0128] In this case, in order to seal the light source 10 and improve the airtightness of the accommodating space 1000 in the housing 1, such as Figure 28 As shown, the light source 10 also includes a sealing element 4. The sealing element 4 can be made of silicone and has good heat resistance. The sealing element 4 is located between the housing 1 and the mounting substrate 201, and abuts against both the housing 1 and the mounting substrate 201 to seal the gap between them. Thus, by pressing the sealing element 4 against the mounting substrate 201 of the laser assembly 2, the housing 1 of the light source 10 can be sealed, facilitating installation and disassembly. For example, as... Figure 14 As shown, the sealing element 4 includes a sealing element body 400, a first through hole 401, and a second through hole 402. The first through hole 401 and the second through hole 402 are disposed on the sealing element body 400, and the inner sidewall of the first through hole 401 surrounds the light-emitting component 203 of the first laser assembly 2A, and the inner sidewall of the second through hole 402 surrounds the light-emitting component 203 of the second laser assembly 2B.

[0129] In some embodiments, the first through hole 401 and the second through hole 402 in the sealing member 4 are spaced apart. In this way, the sealing member 4 can seal the first laser assembly 2A and the second laser assembly 2B respectively, improving the sealing effect, and the sealing member 4 is also smaller in size.

[0130] In some embodiments, such as Figure 12 As shown, the housing 1 also includes a support portion 109. The support portion 109 is disposed on the third side plate 103, and at least a portion of at least one of the laser assembly 2 or the adapter plate 3 is disposed on the support portion 109.

[0131] For example, such as Figure 12 As shown, the support portion 109 includes a first support portion 107 and a second support portion 108. The first support portion 107 and the second support portion 108 are disposed on the first sub-side plate 1031, and the second support portion 108 is disposed around the first support portion 107. The laser assembly 2 is disposed on the first support portion 107, and the adapter plate 3 is disposed on the second support portion 108.

[0132] In some embodiments, such as Figure 12 As shown, the first support portion 107 includes a first boss 107A and a second boss 107B, which are disposed opposite to each other. The two bosses protrude in a direction away from the first sub-side plate 1031, and the surfaces (e.g., top surfaces) of the two bosses away from the first sub-side plate 1031 are coplanar. The top surfaces of the two bosses abut against the first surface 2011 of the mounting substrate 201 of the laser assembly 2 to support the laser assembly 2.

[0133] The second support portion 108 includes a plurality of threaded posts disposed on the first sub-side plate 1031. The surfaces (e.g., the top surface) of the plurality of threaded posts that are away from the first sub-side plate 1031 are coplanar, and the top surfaces of the threaded posts abut against the third surface 302 of the adapter plate 3 to support the adapter plate 3. Furthermore, the adapter plate 3 can be fixed to the plurality of threaded posts by means of threaded components (e.g., screws).

[0134] In some embodiments, the light inlet 110 is located between the two protrusions (i.e., the first protrusion 107A and the second protrusion 107B). For example, as Figure 12 As shown, when the light source 10 includes two laser components 2, the two protrusions are located on both sides of the light inlet 110 formed by the second mounting hole 105 and the third mounting hole 106, and are close to the light inlet 110. Furthermore, the shortest distance between each protrusion and the inner wall of the light inlet 110 is the same as the thickness of the portion of the sealing body 400 of the sealing member 4 between the protrusion and the light inlet 110. For example, the minimum distance between the inner wall of the first through hole 401 and the outer wall of the sealing body 400 of the sealing member 4 is the same as the shortest distance between the first protrusion 107A (or the second protrusion 107B) and the inner wall of the light inlet 110. In this way, the two protrusions can limit the sealing member 4, improving the reliability of the sealing of the sealing member 4.

[0135] In some embodiments, such as Figure 12 As shown, the housing 1 includes a plurality of first threaded holes 1071, and the plurality of first threaded holes 1071 are disposed on the first support portion 107. Figure 13 As shown, the laser assembly 2 includes a plurality of fourth mounting holes 204. The plurality of fourth mounting holes 204 are disposed on the mounting substrate 201 and correspond to a plurality of first threaded holes 1071. In this case, as... Figure 10 and Figure 11 As shown, the light source 10 includes a plurality of fasteners 5, one fastener 5 passing through a fourth mounting hole 204 and fixedly connected to a first threaded hole 1071 to mount the laser assembly 2 onto the housing 1.

[0136] For example, such as Figure 13 As shown, the plurality of fourth mounting holes 204 include two fourth mounting holes 204, and the two fourth mounting holes 204 are symmetrically arranged along the length direction of the mounting substrate 201 (e.g., Figure 13 At both ends of the JK direction in the middle.

[0137] In the case where the light source 10 includes two laser assemblies 2, the housing 1 includes four first threaded holes 1071 and four fasteners 5 to correspond to a plurality of fourth mounting holes 204 in the two laser assemblies 2.

[0138] In some embodiments, the fastener 5 includes a screw whose shank passes through a fourth mounting hole 204 and is threaded into a first threaded hole 1071, and whose nut abuts against a second surface 2012 of the mounting substrate 201.

[0139] In some embodiments, such as Figure 13 As shown, the laser assembly 2 also includes a plurality of first positioning portions 206, and the plurality of first positioning portions 206 are disposed on the mounting substrate 201. The housing 1 also includes a plurality of second positioning portions 6 (such as... Figure 12 (As shown). Multiple second positioning parts 6 are disposed on the third side plate 103 and respectively cooperate with multiple first positioning parts 206. For example, as... Figure 13 As shown, the laser assembly 2 includes two first positioning portions 206, which are symmetrically arranged at both ends of the mounting substrate 201 along its length. When the light source 10 includes two laser assemblies 2, the housing 1 includes four second positioning portions 6 to correspond to the plurality of first positioning portions 206 in the two laser assemblies 2.

[0140] Thus, when the laser assembly 2 is installed on the housing 1, the second positioning part 6 can cooperate with the first positioning part 206 to pre-position the laser assembly 2, and then the fixing member 5 can fix the laser assembly 2 to the housing 1, facilitating the installation between the laser assembly 2 and the housing 1. In some embodiments, one of the first positioning part 206 and the second positioning part 6 is a positioning post, and the other is a positioning hole.

[0141] In some embodiments, such as Figure 28 As shown, the light source 10 also includes a heat sink 7. The heat sink 7 is connected to the housing 1 and is in contact with the second surface 2012 of the mounting substrate 201. In this way, the laser assembly 2 can be cooled by the heat sink 7 to ensure that the laser assembly 2 operates normally.

[0142] For example, the heat sink 7 includes a heat-conducting section 700, a heat-conducting pipe 701, and heat dissipation fins 702. One end of the heat-conducting pipe 701 is connected to the heat-conducting section 700, and the other end of the heat-conducting pipe 701 is connected to the heat dissipation fins 702. The heat-conducting section 700 is disposed on the side of the laser assembly 2 away from the housing 1, and the heat-conducting section 700 is in contact with the mounting substrate 201 to dissipate heat from the laser assembly 2. It should be noted that a portion of the heat-conducting pipe 701 is disposed within the heat-conducting section 700. Of course, the heat sink 7 may also include a cold head and a cold radiator that are interconnected, the cold head being in contact with the second surface 2012 to cool the laser assembly 2.

[0143] In some embodiments, such as Figure 11 As shown, the light source 10 also includes a plurality of sound-absorbing components 8 (such as sound-absorbing foam), the plurality of sound-absorbing components 8 being located along the thickness direction of the adapter plate 3 (such as...). Figure 11 On both sides (vertical direction). Multiple sound-absorbing elements 8 are configured to reduce the noise generated by the light source 10. Figure 11 The following description uses an example where the light source 10 includes two sound-absorbing components 8, and these two sound-absorbing components 8 are respectively disposed on both sides of the adapter plate 3. Of course, the light source 10 may also include one, three or more sound-absorbing components 8, and the sound-absorbing components 8 may also be other components with noise reduction functions. The sound-absorbing components 8 may also be disposed in other positions of the light source 10, and this disclosure does not limit this.

[0144] Those skilled in the art will understand that the scope of this invention is not limited to the specific embodiments described above, and that modifications and substitutions can be made to certain elements of the embodiments without departing from the spirit of this application. The scope of this application is limited by the appended claims.

Claims

1. A laser projection device, characterized in that, include: A light source configured to emit an illumination beam; An optical engine configured to modulate the illumination beam emitted by the light source to obtain a projection beam; A lens configured to image the projected beam; as well as A motherboard configured to transmit control signals to control the laser projection device to display images; in The light source includes: case; An adapter board, disposed on the housing, is electrically connected to the main board, and the adapter board includes: The plate body has a third surface; and A cutout area is provided on the plate body and extends through the plate body; and At least one laser component is disposed on the housing and located within the hollowed-out area, the laser component comprising: The mounting substrate is wherein the inner wall of the cutout area is attached to the outer surface of the mounting substrate, including: The first surface is the surface of the mounting substrate adjacent to the housing; A first region, located on the first surface; and The second region is located on the first surface, and the first region and the second region are spaced apart and connected to each other; At least one light-emitting component is disposed on the first surface and located within the first region, the light-emitting component is electrically connected to the first region, the light-emitting component includes a plurality of light-emitting chips, and the light-emitting component is configured to emit a laser beam; and At least one connector, one end of which is connected to the second region and the other end of which is connected to the adapter plate, to connect the mounting base plate to the adapter plate; The mounting substrate includes a first conductive portion, which is located in and connected to a second region. The adapter plate also includes a second conductive portion, which is disposed on the plate body and corresponds to the first conductive portion. The first conductive part includes a plurality of first welded parts, and the second conductive part includes a plurality of second welded parts; The connector includes a connecting piece, which is an integral piece. The connecting piece includes a main body and a plurality of third connecting parts. The main body has a first end and a second end that are disposed opposite to each other. The plurality of third connecting parts are respectively connected to the first end and the second end and are located on the same side of the main body. The plurality of third connecting parts are respectively disposed at a preset angle to the main body. The main body is connected to the housing, and the plurality of third connecting parts respectively abut against the first welding part and the second welding part; The third connecting part includes: Third sub-connector; Fourth sub-connector; and The curved portion is arc-shaped, and its two ends are respectively connected to the third sub-connecting portion and the fourth sub-connecting portion. The surface of the curved portion away from the housing abuts against the first welding portion or the second welding portion, and the arc-shaped opening of the curved portion faces the housing.

2. The laser projection device according to claim 1, characterized in that, The second region is located at the edge of the mounting substrate and is closer to the adapter plate than the first region.

3. The laser projection device according to claim 1 or 2, characterized in that, The adapter plate and the mounting base plate satisfy one of the following: The first surface of the mounting substrate and the third surface of the adapter plate are coplanar.

4. The laser projection device according to claim 1 or 2, characterized in that, The at least one light-emitting component includes a plurality of light-emitting components, wherein the plurality of light-emitting components satisfy one of the following: The plurality of light-emitting components are configured to emit laser beams of different colors, with a portion of the light-emitting components emitting laser beams of the same color connected in series and another portion of the light-emitting components emitting laser beams of different colors connected in parallel. or The plurality of light-emitting components are configured to emit laser beams of the same color, and the plurality of light-emitting components are connected in series.

5. The laser projection device according to claim 1 or 2, characterized in that, The light source also includes: A sealing element is located between the housing and the mounting base, and abuts against the housing and the mounting base respectively, to seal the gap between the housing and the mounting base.

6. The laser projection device according to claim 5, characterized in that, The housing includes: The shell itself has accommodating space; A light inlet is disposed on the housing body and communicates with the accommodating space; at least a portion of the laser assembly is located within the light inlet to allow the transmission of a laser beam emitted by the laser assembly; and A light outlet is disposed on the housing body, and the light outlet is configured to emit an illumination beam emitted by the light source to the optomechanism.

7. The laser projection device according to claim 6, characterized in that, The number of laser components is multiple; The plurality of first welding portions are located on the same side of the corresponding light-emitting components; Multiple second welded portions connected to the same laser component are located on the same side of the hollowed-out area; in The mounting substrates of the plurality of laser components are interconnected, and the light-emitting components of the plurality of laser components are respectively disposed on the corresponding mounting substrates; Alternatively, the plurality of light-emitting components of the plurality of laser assemblies may be disposed on the same mounting substrate.

8. The laser projection device according to claim 7, characterized in that, The light inlet includes multiple mounting holes, which are spaced apart, and the inner walls of the multiple mounting holes respectively surround the multiple light-emitting components of the multiple laser assemblies.

9. The laser projection device according to claim 8, characterized in that, The plurality of laser components include a first laser component and a second laser component, wherein the mounting substrate of the first laser component abuts against the mounting substrate of the second laser component, or the first laser component and the second laser component are disposed on the same mounting substrate; The plurality of mounting holes include: A second mounting hole, the inner wall of which surrounds the light-emitting component of the first laser assembly; and The third mounting hole has its inner wall surrounding the light-emitting component of the second laser assembly, and the second mounting hole and the third mounting hole are spaced apart. The sealing element includes: Seal body; A first through hole is provided on the sealing body, and the inner sidewall of the first through hole surrounds the light-emitting component of the first laser assembly; and A second through hole is provided on the sealing body, and the inner wall of the second through hole surrounds the light-emitting component of the second laser assembly.

10. The laser projection device according to claim 6, characterized in that, The housing also includes a support portion disposed on the housing body, and at least a portion of at least one of the laser assembly or the adapter plate is disposed on the support portion.

11. The laser projection device according to claim 10, characterized in that, The supporting part must satisfy at least one of the following: The bearing portion includes: The first protrusion; and The second protrusion is disposed opposite to the first protrusion. The first protrusion and the second protrusion are respectively located on both sides of the light inlet. The first protrusion and the second protrusion protrude in a direction away from the shell body, and the surface of the first protrusion away from the shell body and the surface of the second protrusion away from the shell body are coplanar. or, The bearing portion includes a plurality of threaded posts, the surfaces of the plurality of threaded posts that are away from the shell body are coplanar, and the plurality of threaded posts abut against the adapter plate.

12. The laser projection device according to claim 6, characterized in that, The laser assembly also includes a plurality of first positioning parts disposed on the mounting base plate; The housing also includes a plurality of second positioning parts disposed on the housing body. The plurality of second positioning parts cooperate with the plurality of first positioning parts to position the laser assembly.

13. The laser projection device according to claim 1, characterized in that, The light source also includes multiple sound-absorbing components, which are located on both sides of the adapter plate along the thickness direction.