Mounting device and parallelism detection method in mounting device

Abstract

A mounting device (100) and a parallelism detection method in the mounting device, a triangular pin (41) is arranged at point A of a placement surface (12) of a stage (10), a mounting head (20) is lowered and a height of the mounting head (20) when a holding surface (23) contacts a front end (42) of the triangular pin (41) is detected by using an encoder (25), then the triangular pin (41) is moved to point B, the mounting head (20) is lowered and the height of the mounting head (20) when the holding surface (23) contacts the front end (42) of the triangular pin (41) is detected by using the encoder (25), and the parallelism between the placement surface (12) of the stage (10) and the holding surface (23) of the mounting head (20) is calculated based on the detected heights of point A and point B. The mounting device and the parallelism detection method in the mounting device can accurately detect the actual parallelism between the placement surface of the stage and the holding surface of the mounting head.

Description

TECHNICAL FIELD

[0001] The present application relates to a structure of a mounting apparatus which mounts a semiconductor chip on a mounting object such as a substrate, and a method of detecting parallelism between a mounting surface of a stage of the mounting apparatus and a holding surface of a mounting head. BACKGROUND

[0002] It is widely known that there is a mounting apparatus which drives a mounting head in a state where a semiconductor chip is held by suction to a holding surface at a front end of the mounting head, in order to mount the semiconductor chip to a substrate which is held by suction to a mounting surface of a stage. In such a mounting apparatus, in order to well join the semiconductor chip to a surface of the substrate, it is required that the mounting surface of the stage and the holding surface of the mounting head which holds the semiconductor chip are parallel with high precision.

[0003] Therefore, there is proposed a method of detecting inclination of a suction surface of a joining tool mounted to the mounting head and the mounting surface of the stage. For example, there is proposed in Patent Literature 1 a method of burying a contact pin in the mounting surface of the stage, and performing the following operation at a plurality of positions of the suction surface, that is, while moving the stage, the suction surface of the joining tool is brought into contact with the upper end of the buried pin, and the height at this time is found, thereby finding the inclination of the mounting surface of the stage and the suction surface of the joining tool.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Laid-Open No. 2014-17328 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] However, the method of Patent Literature 1 merely measures parallelism between the moving direction of the stage and the suction surface of the joining tool, and it is difficult to accurately detect parallelism between the mounting surface of the stage and the holding surface of the mounting head.

[0009] Therefore, an object of the present application is to accurately detect actual parallelism between the mounting surface of the stage and the holding surface of the mounting head.

[0010] MEANS OF SOLVING THE PROBLEM

[0011] The parallelism detection method of the present application is a parallelism detection method for a mounting apparatus that mounts a semiconductor chip on a mounting object, the parallelism detection method characterized by comprising: a preparation step of preparing the mounting apparatus, the mounting apparatus including a stage, a mounting head, and an encoder, the stage including a placement surface on which the mounting object is placed, the mounting head sucking and holding the semiconductor chip with a holding surface facing the placement surface of the stage and moving in a Z direction in which the placement surface of the stage is approached / detached, and the encoder detecting a height of the mounting head; a height detection step of repeatedly performing the following actions at a plurality of measurement positions: disposing a measurement tool of a prescribed height at one measurement position of the placement surface of the stage, lowering the mounting head and detecting a height of the mounting head at which the holding surface contacts an upper end of the measurement tool with the encoder, and then moving the measurement tool to another measurement position of the placement surface, thereby detecting a plurality of heights of the mounting head at which the holding surface contacts the upper end of the measurement tool at the plurality of measurement positions; and a parallelism calculation step of calculating parallelism of the placement surface of the stage and the holding surface of the mounting head based on the detected plurality of heights.

[0012] Thus, the actual parallelism of the placement surface of the stage and the holding surface of the mounting head can be accurately detected.

[0013] In the parallelism detection method of the present application, the plurality of measurement positions can be within a range facing the holding surface in a plane of the placement surface, and the parallelism calculation step can calculate the parallelism as an absolute value of a difference of the plurality of heights at the plurality of measurement positions.

[0014] Thus, the actual parallelism of the placement surface of the stage and the holding surface of the mounting head can be accurately detected with a simple method.

[0015] In the parallelism detection method of the present application, the plurality of measurement positions can be a pair of positions arranged in an X direction and another pair of positions arranged in a Y direction, and the parallelism calculation step can calculate an X-direction parallelism as an absolute value of a difference of a pair of heights at the pair of positions arranged in the X direction, calculate a Y-direction parallelism as an absolute value of a difference of another pair of heights at the other pair of positions arranged in the Y direction, and calculate the parallelism as a sum of the X-direction parallelism and the Y-direction parallelism.

[0016] Moreover, in the parallelism detection method of the present application, the plurality of measurement positions can be four positions arranged in a lattice shape in the X direction and the Y direction, and the parallelism calculation step can be: calculating a first group X difference of a pair of heights at a first group of one pair of positions arranged in the X direction, and a second group X difference of a pair of heights at a second group of one pair of positions arranged in the X direction; calculating an average of the first group X difference and the second group X difference as an X difference, and calculating the parallelism in the X direction as an absolute value of the X difference; calculating a third group Y difference of a pair of heights at a third group of one pair of positions arranged in the Y direction, and a fourth group Y difference of a pair of heights at a fourth group of one pair of positions arranged in the Y direction; calculating an average of the third group Y difference and the fourth group Y difference as a Y difference, and calculating the parallelism in the Y direction as an absolute value of the Y difference; and calculating the parallelism as a sum of the parallelism in the X direction and the parallelism in the Y direction. At this time, the holding surface can be four surfaces, and the plurality of measurement positions can be positions corresponding to the four corners of the holding surface.

[0017] Thus, the parallelism considering the tilt in the X direction and the tilt in the Y direction can be detected.

[0018] The mounting device of the present application mounts a semiconductor chip to a mounting object, and is characterized by including: a stage including a placement surface on which the mounting object is placed; a mounting head that aspirates and holds the semiconductor chip using a holding surface facing the placement surface of the stage, and that moves in a Z direction in which the placement surface of the stage is approached / detached; an encoder that detects a height of the mounting head; a measurement tool of a prescribed height that is disposed on the placement surface of the stage; an actuator that moves the measurement tool in a plane of the placement surface; and a control section that adjusts movement of the mounting head and movement of the measurement tool, and calculates parallelism of the placement surface of the stage and the holding surface of the mounting head based on the height of the mounting head detected by the encoder, the control section repeatedly performing the following actions at a plurality of measurement positions, namely, disposing the measurement tool at one measurement position of the placement surface of the stage by the actuator, lowering the mounting head, and detecting a height of the mounting head when the holding surface contacts an upper end of the measurement tool by the encoder, moving the measurement tool to another measurement position of the placement surface by the actuator, and thereby detecting a plurality of heights of the mounting head when the holding surface contacts the upper end of the measurement tool at the plurality of measurement positions, and calculating the parallelism of the placement surface of the stage and the holding surface of the mounting head based on the plurality of detected heights.

[0019] In the mounting device of the present application, the plurality of measurement positions can be within a range facing the holding surface in the plane of the placement surface, and the control section can calculate a difference of the plurality of heights at the plurality of measurement positions, and calculate the parallelism as an absolute value of the difference.

[0020] Effects of the Invention

[0021] The present application can accurately detect the actual parallelism of the placement surface of the stage and the holding surface of the mounting head. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a configuration diagram of a mounting device used for implementation of the parallelism detection method.

[0023] Figure 2 is an explanatory diagram showing a height detection process in the detection of parallelism between the placement surface of the stage and the holding surface of the mounting head in the mounting device of Figure 1

[0024] Figure 3 is an enlarged explanatory diagram of the height detection process shown in Figure 2

[0025] Figure 4 is an explanatory diagram showing a height detection process at four measurement positions arranged in a lattice shape in the detection of parallelism between the placement surface of the stage and the holding surface of the mounting head in the mounting device shown in Figure 1

[0026] Figure 5 is an explanatory diagram showing a height detection process at four measurement positions arranged in a cross shape in the X direction and the Y direction in the detection of parallelism between the placement surface of the stage and the holding surface of the mounting head in the mounting device shown in Figure 1

[0027] Figure 6 is a configuration diagram of the mounting device of the embodiment.

[0028] Figure 7 is an explanatory diagram showing a process of setting the triangular pin to a prescribed position using the triangular pin assembly 45 that fixes the bottom surface of the triangular pin to the base.

[0029] Explanation of Symbols

[0030] 10: stage

[0031] 12: placement surface

[0032] 14: substrate

[0033] 15: semiconductor chip

[0034] 19: reference surface

[0035] 20: mounting head

[0036] 21: body

[0037] 22: mounting tool

[0038] 23: holding surface

[0039] 24: movement mechanism

[0040] 25: encoder​​​​

[0041] 30: Control Department

[0042] 31: CPU

[0043] 32: Memory

[0044] 41: Triangular pin

[0045] 42: Front-end

[0046] 44: Base

[0047] 44a: Upper surface

[0048] 45: Triangular pin assembly

[0049] 50: Positioning parts

[0050] 60: Actuator

[0051] 100, 200: Installation device Detailed Implementation

[0052] Hereinafter, with reference to the accompanying drawings, a method for detecting the parallelism between the mounting surface 12 of the stage 10 and the holding surface 23 of the mounting head 20 using the mounting device 100 will be described.

[0053] First, the installation device 100 will be described. For example... Figure 1 As shown, the mounting apparatus 100 includes a stage 10, a mounting head 20, an encoder 25, and a control unit 30, and is an apparatus for mounting a semiconductor chip 15 on a substrate 14. In the following description, a direction along the mounting surface 12 of the stage 10 will be defined as the X direction, a direction perpendicular to the X direction along the mounting surface 12 will be defined as the Y direction, and a direction approaching / moving away from the mounting surface 12 will be defined as the Z direction or the up-down direction.

[0054] The stage 10 includes a mounting surface 12 on its upper side, on which a substrate 14, which is to be mounted, is placed. When a semiconductor chip 15 is mounted onto the substrate 14, the substrate 14 is vacuum-adsorbed onto the mounting surface 12 and heated by a heater (not shown) installed inside.

[0055] The mounting head 20 includes a body 21, a mounting tool 22, and a moving mechanism 24. The body 21 is movable in XYZ directions by the moving mechanism 24. The moving mechanism 24 is not particularly specified in structure as long as it is configured to move the body 21 in XYZ directions, but if an example is indicated, it can include a gantry frame movable in a Y direction, a slide block mounted to the gantry frame and movable in an X direction, and a Z direction motor mounted to the slide block and moving the body 21 in a Z direction. The mounting tool 22 is mounted to a lower end of the body 21 and sucks and holds the semiconductor chip 15 with a holding surface 23 facing the placement surface 12 of the stage 10. The mounting head 20 heats the semiconductor chip 15 sucked and held by the mounting tool 22 with a heater not shown and presses it to the substrate 14, thereby mounting the semiconductor chip 15 to the substrate 14.

[0056] The encoder 25 detects the height of the mounting head 20. The encoder 25 can be configured to detect the heights of a plurality of portions of the mounting head 20, but in the mounting apparatus 100 of the embodiment, it is described that the height H of the mounting tool 22 from the reference surface 19 is detected. The reference surface 19 is an imaginary surface set to the mounting apparatus 100.

[0057] The control section 30 is a computer including a processor, i.e., a central processing unit (CPU) 31, which performs information processing, and a memory 32 which stores programs or data for executing the programs, in the inside. The moving mechanism 24 is connected to the control section 30 and moves the body 21 of the mounting head 20 in XYZ directions according to the instructions of the control section 30. Also, the encoder 25 inputs the detected height H to the control section 30. The CPU 31 of the control section 30 processes the data of the height H input from the encoder 25 to perform the calculation of the parallelism of the placement surface 12 of the stage 10 and the holding surface 23 of the mounting head 20.

[0058] Hereinafter, the mounting apparatus 100 will be described with reference to Figure 2 , Figure 3This section describes a method for detecting the parallelism between the mounting surface 12 of the platform 10 and the holding surface 23 of the mounting head 20 in the mounting device 100. The following description explains how the parallelism between the mounting surface 12 and the holding surface 23 is detected by measuring the height of points A and B on the mounting surface 12, which are at different coordinate positions in the X direction. Here, the XY coordinates of point A are (x1, y1), and the XY coordinates of point B are (x2, y1). Furthermore, the distance (x1-x2) between points A and B in the X direction is shorter than the width of the mounting tool 22 in the X direction. Therefore, points A and B are located within the mounting surface 12, facing the holding surface 23 of the mounting tool 22. Moreover, the XY coordinates (x1, y1) of point A and (x2, y1) of point B are two measurement positions. Figure 2 , Figure 3 In the diagram, dotted line 43a and dotted line 43b are lines that extend in the Z direction from points A and B, respectively.

[0059] First, let me explain the height inspection process. For example... Figure 2 As shown, the triangular pin 41, which serves as a measuring tool, is positioned such that its center is located at point A on the mounting surface 12 of the stage 10. Alternatively, the triangular pin 41 can be positioned such that the positioning part 50, which defines the position of the triangular pin 41, is vacuum-adsorbed onto the mounting surface 12, and the side of the triangular pin 41 is pressed against the positioning part 50.

[0060] The triangular pin 41 has a pointed cone at the front end 42, such as... Figure 2 As shown, when the bottom surface of the triangular pin 41 is placed on the mounting surface 12, the pointed front end 42 becomes the upper end of the measuring tool. In this embodiment, the measuring tool is described as a cone with a pointed front end 42, but as long as the front end 42 is pointed, it can be any shape.

[0061] The CPU 31 of the control unit 30 moves the mounting head 20 along the XY direction by means of the moving mechanism 24, with the height of the holding surface 23 of the mounting tool 22 being higher than the front end 42 of the triangular pin 41. The position of the mounting head 20 in the XY direction is set so that the end of the mounting tool 22 on the negative side of the X direction becomes the XY coordinate (x1, y1) of point A.

[0062] Next, as Figure 3As shown by a solid line in FIG. 6, the CPU 31 of the control section 30 lowers the mounting head 20 by the moving mechanism 24 so that the holding surface 23 of the mounting tool 22 abuts against the front end 42 of the triangular pin 41. At this time, the front end 42 of the triangular pin 41 contacts a point 23a of the holding surface 23, which is an intersection of a one-dot chain line 43a extending in the Z direction through a point A and the holding surface 23, i.e., an end portion of the holding surface 23 on the negative side of the X direction. Also, the CPU 31 of the control section 30 acquires the height of the mounting tool 22 detected by the encoder 25 as the height HA of the point A when the front end 42 of the triangular pin 41 contacts the holding surface 23.

[0063] The detection that the holding surface 23 abuts against the front end 42 of the triangular pin 41 can be detected by various methods, for example, it can be detected when a prescribed difference is generated between the height command value outputted to the moving mechanism 24 by the CPU 31 and the height H detected by the encoder 25, or it can be detected by the fact that the detected height inputted from the encoder 25 does not change even if a command to lower the mounting head 20 is outputted to the moving mechanism 24. Also, a load sensor (not shown) that detects the load in the Z direction applied to the mounting tool 22 can be installed in advance in the body 21, and abutment can be detected when the Z direction load detected by the load sensor reaches a prescribed threshold value or more.

[0064] Next, the CPU 31 of the control section 30 raises the mounting head 20, and then stands by the mounting head 20 at the raised position. Subsequently, as shown by a solid line in FIG. 7, the CPU 31 of the control section 30 lowers the mounting head 20 by the moving mechanism 24 so that the holding surface 23 of the mounting tool 22 abuts against the front end 42 of the triangular pin 41. At this time, the front end 42 of the triangular pin 41 contacts a point 23b of the holding surface 23, which is an intersection of a one-dot chain line 43b extending in the Z direction through a point B and the holding surface 23, i.e., an end portion of the holding surface 23 on the positive side of the X direction. Also, the CPU 31 of the control section 30 acquires the height of the mounting tool 22 detected by the encoder 25 as the height HB of the point B when the front end 42 of the triangular pin 41 contacts the holding surface 23. Figure 2 、 Figure 3 As shown by a one-dot chain line in FIG. 6, the triangular pin 41 is moved in the X direction so that the center position of the triangular pin 41 becomes the position of the point B of the placement surface 12. Then, as shown by a solid line in FIG. 6, the CPU 31 of the control section 30 lowers the mounting head 20 by the moving mechanism 24 so that the holding surface 23 of the mounting tool 22 abuts against the front end 42 of the triangular pin 41. At this time, the front end 42 of the triangular pin 41 contacts a point 23a of the holding surface 23, which is an intersection of a one-dot chain line 43a extending in the Z direction through a point A and the holding surface 23, i.e., an end portion of the holding surface 23 on the negative side of the X direction. Also, the CPU 31 of the control section 30 acquires the height of the mounting tool 22 detected by the encoder 25 as the height HA of the point A when the front end 42 of the triangular pin 41 contacts the holding surface 23. Figure 3 、

[0065] The CPU 31 of the control section 30 acquires the height HA of the point A and the height HB of the point B, and then ends the height detection process and starts the parallelism calculation process.

[0066] The CPU 31 of the control section 30 calculates the difference AH of the height HA of the point A and the height HB of the point B.

[0067] AH = HA - HB (Formula 1)

[0068] Further, the CPU 31 of the control section 30 calculates the parallelism as an absolute value of the difference AH.

[0069] Parallelism = | AH - HB | (Equation 2)

[0070] After the parallelism is calculated, the CPU 31 of the control section 30 ends the parallelism calculation process.

[0071] As explained above, the parallelism detection method of the embodiment can accurately detect the actual parallelism of the placement surface 12 of the stage 10 and the holding surface 23 of the mounting head 20 using a simple method of detecting the height H of the mounting head 20 when the front end 42 of the triangular pin 41 contacts the holding surface 23 at a plurality of measurement positions on the placement surface 12.

[0072] In the above explanation, the case where the heights of the points A and B on the placement surface 12 having different coordinate positions in the X direction are detected to detect the parallelism of the placement surface 12 and the holding surface 23 was explained, and next, the case where the heights of the four points A, B, C, and D arranged in a lattice shape in the X and Y directions are detected to detect the parallelism of the placement surface 12 and the holding surface 23 as the four aspects will be explained with reference to Figure 4 Figure 2 Figure 3 As explained above, the points A to D are each a measurement position.

[0073] As explained above with reference to Figure 2 Figure 3 As explained above, the triangular pin 41 is arranged so that the center of the triangular pin 41 as a measurement tool is on the point A on the placement surface 12 of the stage 10. Subsequently, the CPU 31 of the control section 30 lowers the mounting head 20 by the moving mechanism 24, and after the holding surface 23 of the mounting tool 22 abuts against the front end 42 of the triangular pin 41, acquires the height of the mounting tool 22 detected by the encoder 25 as the height HA of the point A.

[0074] After the height HA is acquired, the CPU 31 of the control section 30 raises the mounting head 20, and then stands by the mounting head 20 at the raised position. Next, the triangular pin 41 is moved in the X direction so that the center position of the triangular pin 41 becomes the position of the point B of the placement surface 12. Then, as in the case of the point A, the CPU 31 of the control section 30 lowers the mounting head 20 by the moving mechanism 24, and after the holding surface 23 of the mounting tool 22 abuts against the front end 42 of the triangular pin 41, acquires the height of the mounting tool 22 detected by the encoder 25 as the height HB of the point B. ​​​

[0075] Next, the center position of the triangular pin 41 is moved to the point C and the point D, and the mounting head 20 is lowered, and after the holding surface 23 of the mounting tool 22 abuts against the front end 42 of the triangular pin 41, the height of the mounting tool 22 detected by the encoder 25 is acquired as the height HC of the point C and the height HD of the point D (height acquisition process).

[0076] Next, the CPU 31 of the control section 30 executes the parallelism calculation process. The CPU 31 calculates the first group X difference as follows. The first group X difference is the difference between the heights HA and HB of the points A and B arranged at a pair of positions of the first group arranged in the X direction, and is calculated using Equation 3. Also, the second group X difference is the difference between the heights HC and HD of the points C and D arranged at a pair of positions of the second group arranged in the X direction, and is calculated using Equation 4 described below.

[0077] First group X difference = HA - HB (Equation 3)

[0078] Second group X difference = HC - HD (Equation 4)

[0079] Also, the CPU 31 of the control section 30 calculates the X difference which is the average of the first group X difference and the second group X difference using Equation 5.

[0080] X difference = (first group X difference + second group X difference) / 2 = [(HA - HB) + (HC - HD)] / 2 (Equation 5)

[0081] Next, the CPU 31 of the control section 30 calculates the X direction parallelism as the absolute value of the X difference using Equation 6.

[0082] X direction parallelism = |X difference| (Equation 6)

[0083] With respect to the Y direction as well, the third group Y difference which is the difference between the heights of the points A and C arranged at a pair of positions of the third group arranged in the Y direction, the fourth group Y difference which is the difference between the heights of the points B and D arranged at a pair of positions of the fourth group arranged in the Y direction, the Y difference which is the average of the third group Y difference and the fourth group Y difference, and the Y direction parallelism which is the absolute value of the Y difference are calculated using Equations 7 to 10 described below.

[0084] Third group Y difference = HA - HC (Equation 7)

[0085] Fourth group Y difference = HB - HD (Equation 8)

[0086] Y difference = (third group Y difference + fourth group Y difference) / 2 = [(HA - HC) + (HB - HD)] / 2 (Equation 9)

[0087] Y-direction parallelism = |Y difference| (Equation 10)

[0088] Finally, the CPU 31 of the control section 30 calculates the parallelism of the placement surface 12 and the holding surface 23 as the sum of the X-direction parallelism and the Y-direction parallelism as shown in Equation 11 below.

[0089] Parallelism = X-direction parallelism + Y-direction parallelism = |X difference| + |Y difference| (Equation 11)

[0090] As explained above, in the case where the four points A, B, C, and D arranged in a lattice shape in the X-direction and the Y-direction detect the height of the mounting tool 22 to detect the parallelism of the placement surface 12 and the holding surface 23, the parallelism of the placement surface 12 of the stage 10 and the holding surface 23 of the mounting tool 22 can be detected taking into account the X-direction parallelism and the Y-direction parallelism, and thus the detection of the parallelism can be performed more accurately.

[0091] Furthermore, as shown in Figure 5 , the four points can be arranged in a cross shape in the X-direction and the Y-direction. As shown in Figure 5 , the four points can also include the two points E and F arranged on a line 95 extending in the X-direction, and the two points G and H arranged on a line 96 extending in the Y-direction in a manner orthogonal to the line 95. At this time, the points E and F correspond to a pair of positions arranged in the X-direction, and the points G and H correspond to another pair of positions arranged in the Y-direction. The coordinates of the point E are (x3, y3), the coordinates of the point F are (x4, y3), the coordinates of the point G are (x5, y4), and the coordinates of the point H are (x5, y5).

[0092] At this time, as with the explanation with reference to Figure 4 , the center position of the triangular pin 41 is moved to the points E, F, G, and H, and the mounting head 20 is lowered, and after the holding surface 23 of the mounting tool 22 contacts the front end 42 of the triangular pin 41, the height of the mounting tool 22 detected by the encoder 25 is acquired as the height HE of the point E, the height HF of the point F, the height HG of the point G, and the height HH of the point H.

[0093] The CPU 31 of the control section 30 calculates the X-direction parallelism as the absolute value of the difference between the height HE of the point E and the height HF of the point F, calculates the Y-direction parallelism as the absolute value of the difference between the height HG of the point G and the height HH of the point H, and calculates the parallelism of the placement surface 12 and the holding surface 23 as the sum of the X-direction parallelism and the Y-direction parallelism.

[0094] X-direction parallelism = |HE - HF| (Equation 12)

[0095] Y-direction parallelism = |HG - HH| (Equation 13)

[0096] Parallelism = X-direction parallelism + Y-direction parallelism (Equation 14)

[0097] Compared to the previously explained height detection of the mounting tool 22 at the four points A, B, C, and D arranged in a lattice shape in the X-direction and the Y-direction, the present method has a smaller calculation amount and can consider the X-direction parallelism and the Y-direction parallelism to detect the parallelism of the placement surface 12 of the stage 10 and the holding surface 23 of the mounting tool 22.

[0098] Next, the mounting apparatus 200 of the embodiment will be explained while referring to Figure 6 , which is the same as the mounting apparatus 100 explained previously with reference to Figure 1 . The same symbols are marked on the same parts as the mounting apparatus 100 explained previously and the explanation will be omitted.

[0099] The mounting apparatus 200 includes the actuator 60 that moves the triangular pin 41 arranged on the placement surface 12 on the placement surface 12 in the mounting apparatus 100 explained previously. The actuator 60 is connected to the control section 30 and operates according to the instruction of the CPU 31 of the control section 30 to move the position of the triangular pin 41.

[0100] The parallelism detection operation of the mounting apparatus 200 is the same as the operation of the mounting apparatus 100 explained previously except that the CPU 31 of the control section 30 moves the position of the triangular pin 41 to the points A to H.

[0101] The mounting apparatus 200 can automatically perform the detection of the parallelism and thus the detection of the parallelism can be easily performed.

[0102] In the above explanation, the movement of the triangular pin 41 by the actuator 60 is explained, but it is not limited thereto. For example, the triangular pin assembly 45 shown in Figure 7 may be used. The triangular pin assembly 45 is a triangular pin assembly 45 that fixes the bottom surface of the triangular pin 41 to the base 44. The base 44 extends toward the direction away from the triangular pin 41 and the triangular pin 41 does not interfere with the mounting tool 22 and can be adsorptively held to the holding surface 23 of the upper surface 44a. In the state that the upper surface 44a of the base 44 is adsorptively held to the holding surface 23 of the mounting tool 22, the mounting head 20 is moved to the prescribed position as the arrow 99 and when the vacuum adsorption of the mounting tool 22 is stopped, the triangular pin assembly 45 can be set to the prescribed position on the placement surface 12.

Claims

1. A parallelism detection method, which is a method for detecting the parallelism of a semiconductor chip mounted in a mounting device, characterized in that the parallelism detection method includes: The preparation process involves preparing the mounting device, which includes a stage, a mounting head, and an encoder. The stage includes a mounting surface for placing the object to be mounted. The mounting head uses a holding surface facing the mounting surface of the stage to suction and hold the semiconductor chip, and moves in the Z direction in a direction that approaches / moves away from the mounting surface of the stage. The encoder detects the height of the mounting head. The height detection process involves repeatedly performing the following actions at multiple measurement positions: placing a measuring tool of a specified height at one measurement position on the mounting surface of the stage; lowering the mounting head and using the encoder to detect the height of the mounting head when the holding surface contacts the upper end of the measuring tool; raising the mounting head; then, keeping the mounting head in a standby position at the raised position; subsequently, moving the measuring tool horizontally relative to the mounting surface to another measurement position on the mounting surface; lowering the mounting head and using the encoder to detect the height of the mounting head when the holding surface contacts the upper end of the measuring tool; thereby detecting multiple heights of the mounting head when the holding surface contacts the upper end of the measuring tool at multiple measurement positions. The distance in the horizontal movement direction between one measurement position and the other measurement position on the mounting surface is shorter than the width of the holding surface in the horizontal movement direction; and the one measurement position and the other measurement position on the mounting surface are within a range facing the holding surface of the mounting head within the surface of the mounting surface. The parallelism calculation process calculates the parallelism between the mounting surface of the platform and the holding surface of the mounting head based on the detected multiple heights.

2. The parallelism detection method according to claim 1, characterized in that... Multiple measurement positions are located within the plane of the mounting surface, facing the holding surface. The parallelism calculation process involves calculating the difference between multiple heights at multiple measurement locations, and using the parallelism as the absolute value of the difference.

3. The parallelism detection method according to claim 2, characterized in that... Multiple measurement locations consist of a pair of locations arranged along the X direction and another pair of locations arranged along the Y direction. The process for calculating the parallelism is as follows: The parallelism in the X direction is calculated as the absolute value of the difference between a pair of heights at the pair of positions arranged along the X direction. The parallelism in the Y direction is calculated as the absolute value of the difference between the other pair of heights at the other pair of positions arranged along the Y direction. The parallelism is calculated as the sum of the parallelism in the X direction and the parallelism in the Y direction.

4. The parallelism detection method according to claim 2, characterized in that... The multiple measurement locations are four positions arranged in a grid pattern along the X and Y directions. The process for calculating the parallelism is as follows: Calculate the first set of X differences for a pair of heights at the first pair of positions arranged along the X direction, and the second set of X differences for a pair of heights at the second pair of positions arranged along the X direction. The average of the first group's X-difference and the second group's X-difference is used as the X-difference. The parallelism in the X direction is calculated as the absolute value of the X difference. Calculate the third set of Y-differences for a pair of heights at the third pair of positions arranged along the Y direction, and the fourth set of Y-differences for a pair of heights at the fourth pair of positions arranged along the Y direction. The average of the third group of Y differences and the fourth group of Y differences is calculated as the Y difference. The parallelism in the Y direction is calculated as the absolute value of the Y difference. The parallelism is calculated as the sum of the parallelism in the X direction and the parallelism in the Y direction.

5. The parallelism detection method according to claim 4, characterized in that... The retaining surface has four aspects. The multiple measurement positions are the positions corresponding to the four corners of the holding surface.

6. A mounting apparatus for mounting a semiconductor chip to a mount body, the mounting apparatus characterized by comprising: A platform, comprising a mounting surface on which the object to be mounted is placed; The mounting head uses a holding surface facing the mounting surface of the stage to draw and hold the semiconductor chip, and moves in the Z direction toward / away from the mounting surface of the stage. The encoder detects the height of the mounting head; A measuring tool of a specified height is disposed on the mounting surface of the stage; An actuator that moves the measuring tool within the plane of the mounting surface; as well as The control unit adjusts the movement of the mounting head and the movement of the measuring tool, and calculates the parallelism between the mounting surface of the stage and the holding surface of the mounting head based on the height of the mounting head detected by the encoder. The control unit repeatedly performs the following actions at multiple measurement positions: First, it positions the measuring tool at one measurement position on the mounting surface of the stage using the actuator; then, it lowers the mounting head and uses the encoder to detect the height of the mounting head when the holding surface contacts the upper end of the measuring tool; next, it raises the mounting head; then, it remains in the raised position; and finally, it moves the measuring tool horizontally relative to the mounting surface to another measurement position on the mounting surface using the actuator; then, it lowers the mounting head and uses the encoder to detect the height of the holding surface when the holding surface contacts the upper end of the measuring tool. The height of the mounting head when the holding surface contacts the upper end of the measuring tool is measured, thereby detecting multiple heights of the mounting head when the holding surface contacts the upper end of the measuring tool at multiple measuring positions. The distance in the horizontal movement direction between one measuring position and another measuring position of the mounting surface is shorter than the width of the holding surface in the horizontal movement direction. Furthermore, the one measuring position and the other measuring position of the mounting surface are located within the surface of the mounting surface and face the holding surface of the mounting head. The parallelism between the mounting surface of the platform and the holding surface of the mounting head is calculated based on the detected multiple heights.

7. The installation device according to claim 6, characterized in that... Multiple measurement positions are located within the plane of the mounting surface, facing the holding surface. The control unit calculates the difference between multiple heights at multiple measurement locations, and uses the parallelism as the absolute value of the difference.

Images