A heating substrate for a thermal print head and a manufacturing method thereof

Abstract

The present invention discloses a heating substrate for a thermal print head and a manufacturing method thereof, the manufacturing method comprising: forming a thermal print head assembly, wherein the thermal print head assembly comprises a plurality of conductive patterns; the conductive patterns comprise a first common electrode pattern, at least one lead electrode and a second common electrode pattern; forming a first conductive layer electrically connected to each first common electrode pattern and each second common electrode pattern, wherein the first conductive layer surrounds the first side, back and second side of the insulating substrate and is electrically connected to each first common electrode pattern and each second common electrode pattern; forming an insulating protective layer on a side of the plurality of conductive patterns away from the insulating substrate; cutting along a first cutting line to form a plurality of heating substrates for thermal print heads. The present invention can manufacture a plurality of heating substrates for thermal print heads at the same time, thereby improving the manufacturing efficiency, and the manufactured heating substrates for thermal print heads are easy to splice and have a high energy tolerance performance.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal print heads, and in particular to a heating substrate for a thermal print head and a manufacturing method thereof. Background Art

[0002] The heating substrate for the thermal print head includes an insulating substrate with an amorphous glaze coating formed on the surface, a heating resistor layer is provided on the amorphous glaze coating, and a wire layer covers the heating resistor layer. During the manufacturing process, the wire layer is formed into an electrode wire through photoengraving technology, and the heating resistor layer is formed into a plurality of heating resistors arranged along the main printing direction. The electrode wires can be divided into common electrode wires and individual electrode wires according to their functions. The common electrode wires are connected to an external power supply for powering the thermal print head through a wiring cable, and the individual electrode wires are connected to a driver IC that controls the operation of the heating resistor. For independent thermal print heads that do not require splicing, there is usually sufficient space on the surface of the insulating substrate where the wire layer is located for setting the common electrode wires.

[0003] Figure 1 This is a schematic diagram of the structure of a heating substrate for an existing thermal print head. Figure 1 For a structure of a spliced ​​thermal print head that requires multiple independent thermal print heads to be spliced ​​to form a larger printing width, the common electrode wire 11 and the individual electrode wire 12 of the existing thermal print head heating substrate are designed together into a circuitous reciprocating structure, so as not to affect the splicing effect of the splicing points of the independent thermal print heads.

[0004] However, the common electrode wire 11 and the individual electrode wire 12 are designed together as a heating substrate for a thermal print head with a circuitous structure, and its heating resistor 14 also needs to be designed as a heating unit structure with more than two heating points 13 connected in series. There is a certain gap in its printing effect and energy tolerance effect compared with the heating resistors of independent points, which affects the application of the heating substrate for spliced ​​thermal print heads to a certain extent. Summary of the invention

[0005] The present invention provides a heating substrate for a thermal print head and a manufacturing method thereof, which can simultaneously manufacture a plurality of heating substrates for thermal print heads, thereby improving manufacturing efficiency; and the manufactured heating substrates for thermal print heads are easy to splice and have high energy tolerance performance.

[0006] According to one aspect of the present invention, a method for manufacturing a heating substrate for a thermal print head is provided, the manufacturing method comprising: forming a thermal print head assembly, wherein the thermal print head assembly comprises an insulating substrate, a heat storage glaze coating layer located on one side of the insulating substrate, a plurality of heating resistor patterns located on the same side of the insulating substrate and the heat storage glaze coating layer, and a plurality of conductive patterns located on a side of the plurality of heating resistor patterns away from the insulating substrate; the conductive pattern comprises a first common electrode pattern, at least one extraction electrode, and a second common electrode pattern; the heating resistor pattern comprises at least one heating resistor located on a surface of the heat storage glaze coating layer;

[0007] forming a first conductive layer electrically connected to each of the first common electrode patterns and each of the second common electrode patterns, wherein the first conductive layer surrounds the first side surface, the back side surface, and the second side surface of the insulating substrate and is electrically connected to each of the first common electrode patterns and each of the second common electrode patterns, and the first side surface is arranged opposite to the second side surface;

[0008] forming an insulating protective layer on a side of the plurality of conductive patterns away from the insulating substrate, wherein the insulating protective layer covers the heating resistor, a portion of the conductive patterns and a portion of the first conductive layer;

[0009] Cutting is performed along a first cutting line to form a plurality of heating substrates for thermal print heads, wherein a vertical projection of the first cutting line on the film layer where the heating resistor pattern is located is located between two adjacent heating resistor patterns, and a vertical projection of the first cutting line on the film layer where the conductive pattern is located is located between two adjacent conductive patterns.

[0010] Optionally, forming the thermal print head assembly specifically includes:

[0011] Providing an insulating substrate, and forming a plurality of heat storage glaze coatings distributed at intervals on the same side of the insulating substrate;

[0012] Forming a heating resistor layer and a second conductive layer in sequence on the same side of the insulating substrate and the plurality of thermal storage glaze coatings distributed at intervals;

[0013] The second conductive layer is patterned to form a plurality of conductive patterns arranged in an array, and the heating resistor layer is patterned to form a plurality of heating resistor patterns arranged in an array, wherein the heating resistor patterns are arranged in one-to-one correspondence with the conductive patterns;

[0014] Cutting is performed along a second cutting line to obtain a plurality of thermal print head assemblies, wherein a vertical projection of the second cutting line on the film layer where the heating resistor pattern is located is located between two adjacent heating resistor patterns, a vertical projection of the second cutting line on the film layer where the conductive pattern is located is located between two adjacent conductive patterns, and the second cutting line is parallel to the first side surface.

[0015] Optionally, after forming a plurality of heat storage glaze coatings distributed at intervals on one side of the insulating substrate, the method further includes:

[0016] A base glaze coating is formed on the surface of the insulating substrate where the heat storage glaze coating is not provided, wherein the base glaze coating and the heat storage glaze coating are located on the same side of the insulating substrate.

[0017] Optionally, forming a first conductive layer electrically connected to each of the first common electrode patterns and each of the second common electrode patterns specifically includes:

[0018] A photosensitive resin protection pattern is formed on a side of each of the conductive patterns away from the insulating substrate, wherein the photosensitive resin protection pattern exposes a partial area of ​​each of the first common electrode patterns close to the first side edge and a partial area of ​​each of the second common electrode patterns close to the second side edge;

[0019] Using a vacuum film forming process, a conductive material is deposited on a side of the conductive pattern away from the insulating substrate, and on a first side, a back side, and a second side of the insulating substrate to form a first conductive transition layer;

[0020] The photosensitive resin protection pattern and the conductive material on the surface of the photosensitive resin protection pattern are removed to form a first conductive layer.

[0021] Optionally, after forming the insulating protection layer on a side of the plurality of conductive patterns away from the insulating substrate, the method further comprises:

[0022] An antistatic protective layer is formed on a side of the insulating protective layer away from the insulating substrate, wherein a vertical projection of the antistatic protective layer on the insulating substrate covers a vertical projection of the thermal storage glaze coating on the insulating substrate.

[0023] Optionally, after forming the antistatic protective layer on a side of the insulating protective layer away from the insulating substrate, the method further includes:

[0024] A resin protective layer is formed, wherein the resin protective layer includes a first resin protective sublayer, a second resin protective sublayer and a third resin protective sublayer, the first resin protective sublayer is located on a partial area of ​​a side of the antistatic protective layer away from the insulating substrate, the second resin protective sublayer is located on a side of the first conductive layer at the first side, and the third resin protective sublayer is located on a side of the first conductive layer at the back side.

[0025] Optionally, the resin protective layer includes aluminum nitride powder;

[0026] The average particle size of the aluminum nitride powder is 0.8 μm;

[0027] The ratio of the mass of the aluminum nitride powder to the mass of the resin protective layer is 0.12.

[0028] Optionally, the heating substrate for the thermal print head formed after cutting along the first cutting line further includes an antistatic protective layer and a resin protective layer.

[0029] Optionally, the conductive material includes at least one of aluminum, silver, tungsten, nickel, titanium, chromium and molybdenum.

[0030] According to another aspect of the present invention, a heating substrate for a thermal print head is provided, the heating substrate for a thermal print head comprising: an insulating substrate; a heat storage glaze coating layer, located on one side of the insulating substrate; a heating resistor pattern, located on the same side of the insulating substrate and the heat storage glaze coating layer, wherein the heating resistor pattern comprises at least one heating resistor located on the surface of the heat storage glaze coating layer;

[0031] A conductive pattern located on a side of the heating resistor pattern away from the insulating substrate; wherein the conductive pattern includes a first common electrode pattern, at least one lead-out electrode and a second common electrode pattern; the heating resistor is exposed at a gap between the first common electrode pattern and the lead-out electrode; a first conductive layer, wherein the first conductive layer surrounds the first side, back and second side of the insulating substrate and is electrically connected to the first common electrode pattern and the second common electrode pattern, and the first side is arranged opposite to the second side; an insulating protective layer located on a side of the conductive pattern away from the insulating substrate, the insulating protective layer covering the heating resistor, part of the conductive pattern and part of the first conductive layer.

[0032] The present embodiment provides a method for manufacturing a heating substrate for a thermal print head, the manufacturing method comprising: first forming a thermal print head assembly, wherein the conductive pattern in the thermal print head assembly corresponds to the heating resistor pattern one by one, the heating resistor is exposed between the first common electrode pattern and the lead-out electrode in the conductive pattern, and the heating resistor is located on the surface of the heat storage glaze coating. Then, forming a first conductive layer, the formed first conductive layer is electrically connected to the first common electrode pattern and the second common electrode pattern of each conductive pattern. The first conductive layer surrounds the first side, back and second side of the insulating substrate, and there is no need to set a circuitous structure to electrically connect the first common electrode pattern and the second common electrode pattern, so that the heating resistor can be set separately, which is conducive to improving the energy tolerance performance of the heating resistor. In addition, the first conductive layer is not set on the surface where the conductive pattern is located, thereby saving the area of ​​the surface where the conductive pattern is located, which is convenient for the subsequent splicing of the heating substrate for the thermal print head. Then, forming an insulating protective layer to protect part of the conductive pattern, the heating resistor and part of the first conductive layer from damage. Finally, cutting along the first cutting line can separate a plurality of heating substrates for thermal print heads. In summary, the manufacturing method provided in this embodiment can manufacture multiple heating substrates for thermal print heads at the same time, thereby improving the manufacturing efficiency. Moreover, the manufactured heating substrates for thermal print heads are easy to splice and have high energy tolerance performance.

[0033] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 It is a schematic diagram of the structure of a heating substrate for an existing thermal print head;

[0036] Figure 2 It is a schematic flow chart of a method for manufacturing a heating substrate for a thermal print head provided in accordance with an embodiment of the present invention;

[0037] Figure 3 is a schematic diagram of a top view of a thermal print head assembly provided according to an embodiment of the present invention;

[0038] Figure 4 is a schematic top view of another thermal print head assembly provided according to an embodiment of the present invention;

[0039] Figure 5 is a schematic cross-sectional structural diagram of a thermal print head assembly provided according to an embodiment of the present invention;

[0040] Figure 6 is a schematic top view of a thermal print head assembly including a first conductive layer provided according to an embodiment of the present invention;

[0041] Figure 7 is a schematic cross-sectional structural diagram of a thermal print head assembly including a first conductive layer provided according to an embodiment of the present invention;

[0042] Figure 8 is a schematic structural diagram of a heating substrate for a thermal print head provided according to an embodiment of the present invention;

[0043] Fig. 9 It is a schematic structural diagram of a spliced ​​heating substrate for a thermal print head provided in an embodiment of the present invention;

[0044] Figures 10 to 12 A schematic diagram of the process structure of forming a thermal print head assembly;

[0045] Fig.13 and Fig.14 A schematic diagram of the process structure of forming a first conductive layer;

[0046] Fig.15 is a schematic structural diagram of a thermal print head assembly including an antistatic protective layer provided according to an embodiment of the present invention;

[0047] Fig.16 Schematic diagram of the structure of a thermal print head assembly including a resin protective layer provided according to an embodiment of the present invention. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0049] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0050] Figure 2 FIG. 1 is a flow chart of a method for manufacturing a heating substrate for a thermal print head according to an embodiment of the present invention, with reference to FIG. Figure 2 The manufacturing method provided in this embodiment includes the following steps:

[0051] S110. Form a thermal print head assembly, wherein the thermal print head assembly includes an insulating substrate, a heat storage glaze coating located on one side of the insulating substrate, a plurality of heating resistor patterns located on the same side of the insulating substrate and the heat storage glaze coating, and a plurality of conductive patterns located on a side of the plurality of heating resistor patterns away from the insulating substrate; the conductive pattern includes a first common electrode pattern, at least one lead electrode, and a second common electrode pattern; the heating resistor pattern includes at least one heating resistor located on a surface of the heat storage glaze coating.

[0052] Specifically, Figure 3 is a schematic top view of a thermal print head assembly provided according to an embodiment of the present invention, Figure 4 is a top view of another thermal print head assembly provided according to an embodiment of the present invention. Figure 5 is a schematic cross-sectional view of a thermal print head assembly provided according to an embodiment of the present invention, with reference to Figure 3-Figure 5 , Figure 3 A heating resistor pattern (the heating resistor pattern is covered by the conductive pattern 102, and only the heating resistor 41 in the heating resistor pattern is exposed) and a conductive pattern 102 in the thermal print head assembly 100 are exemplarily shown, and the remaining heating resistor patterns 101 and conductive patterns 102 are shown with abbreviated symbols. In order to facilitate understanding, the thermal print head assembly 100 includes a plurality of heating resistor patterns 101 and a plurality of conductive patterns 102. Figure 4The arrangement directions of the multiple heating resistor patterns 101 and the multiple conductive patterns 102 in the thermal print head assembly 100 are shown as examples. In the thermal print head assembly 100, the multiple heating resistor patterns 101 are arranged along the first direction Y, and two adjacent heating resistor patterns 101 can be connected as a whole or spaced apart, and the insulating substrate 10 can be exposed between the spaced heating resistor patterns 101. The multiple conductive patterns 102 are also arranged along the first direction Y, and two adjacent conductive patterns 102 can be connected as a whole or spaced apart, and the insulating substrate 10 can be exposed between the spaced conductive patterns 102. The number of the conductive patterns 102 is equal to the number of the heating resistor patterns 101 and corresponds one to one.

[0053] Continue to refer Figure 3 and Figure 5 The thermal print head assembly 100 may further include a substrate glaze coating 30, and the substrate glaze coating 30 and the heat storage glaze coating 20 are located on the same side of the insulating substrate 10. In the conductive pattern 102, the first common electrode pattern 51, the extraction electrode 52, and the second common electrode pattern 53 are spaced apart along the second direction X. The conductive pattern 102 may include a plurality of extraction electrodes 52, and the plurality of extraction electrodes 52 may be spaced apart along the first direction Y, and the extension direction of the extraction electrode 52 is parallel or approximately parallel to the second direction X, and the first direction Y intersects the second direction X. There is an opening between the first common electrode pattern 51 and the extraction electrode 52 in the conductive pattern 102, and the region of the heating resistor pattern 101 sandwiched by the opening constitutes a heating resistor 41 for generating Joule heat.

[0054] In this embodiment, a plurality of separate heating resistors 41 are arranged in each heating resistor pattern 101. Compared with the heating resistor composed of two spaced heating points connected in series in the prior art, the heating resistor 41 provided in this embodiment can be arranged in a larger area, thereby improving the energy tolerance performance of the heating resistor 41. The heating substrate for a thermal print head including the heating resistor 41 of this embodiment is applied to a printer, which can improve the printing effect of the printer.

[0055] S120, forming a first conductive layer electrically connected to each first common electrode pattern and each second common electrode pattern, wherein the first conductive layer surrounds the first side, back and second side of the insulating substrate and is electrically connected to each first common electrode pattern and each second common electrode pattern, and the first side is arranged opposite to the second side.

[0056] Specifically, Figure 6 is a schematic top view of a thermal print head assembly including a first conductive layer provided according to an embodiment of the present invention, Figure 7 is a schematic cross-sectional view of a thermal print head assembly including a first conductive layer provided according to an embodiment of the present invention, with reference to Figure 6 and Figure 7 After the first conductive layer 60 is formed, the first common electrode pattern 51 can be electrically connected to the second common electrode pattern 53. The first direction Y is parallel to the first side surface of the insulating substrate 10 and the second side surface of the insulating substrate 10, and the back surface of the insulating substrate 10 is the surface away from the first common electrode pattern 51.

[0057] Since the thermal print head assembly 100 provided in step S110 includes a plurality of conductive patterns 102 and a plurality of heating resistor patterns 101, the first conductive layer 60 produced in step S120 can simultaneously make each conductive pattern 102 contact with the first conductive layer 60. Compared with separately producing the first conductive layer 60 for each conductive pattern 102, the production method provided in this embodiment can achieve mass production and improve production efficiency.

[0058] In addition, the first conductive layer 60 provided in this embodiment contacts the conductive pattern 102 along the first side, back side and second side of the insulating substrate 10, and there is no need to reserve an area for the wires connecting the first common electrode pattern 51 and the second common electrode pattern 53 on the surface where the conductive pattern 102 is located, thereby avoiding increasing the area of ​​the surface where the conductive pattern 102 is located.

[0059] S130, forming an insulating protection layer on a side of the plurality of conductive patterns away from the insulating substrate, wherein the insulating protection layer covers the heating resistor, a portion of the conductive patterns and a portion of the first conductive layer.

[0060] Specifically, the insulating protective layer is used to prevent the heating resistor and at least part of the conductive pattern and the first conductive layer from being damaged by mechanical or chemical action. The insulating protective layer exposes a part of the lead-out electrode near the second common electrode pattern, and the exposed lead-out electrode is used to be electrically connected to related components in the printer. The insulating protective layer covers the first conductive layer located on the surface of the conductive pattern.

[0061] S140, cutting along the first cutting line to form a plurality of heating substrates for thermal print heads, wherein a vertical projection of the first cutting line on the film layer where the heating resistor pattern is located is located between two adjacent heating resistor patterns, and a vertical projection of the first cutting line on the film layer where the conductive pattern is located is located between two adjacent conductive patterns.

[0062] For details, please refer to Figure 4 The first cutting line A1A2 may be located between two adjacent conductive patterns 102. After cutting along the first cutting line A1A2, two adjacent heating resistor patterns and two adjacent conductive patterns 102 may be separated.

[0063] Figure 8 is a schematic structural diagram of a heating substrate for a thermal print head provided according to an embodiment of the present invention. Figure 8 The heating substrate for the thermal print head formed after executing step S140 is also shown in FIG. Figure 8 The heating substrate for a thermal print head manufactured by the manufacturing method provided in this embodiment includes an insulating substrate 10, a heating resistor pattern 101, a first common electrode pattern 51, at least one extraction electrode 52, a second common electrode pattern 53, a first conductive layer 60 and an insulating protective layer 70. It should be noted that: Figure 8 The insulating substrate 10, the first conductive layer 60 and the insulating protection layer 70 are all cut structures.

[0064] The cutting position of the first cutting line can be determined before any step of step S110 to step S140. After cutting along the first cutting line, a plurality of heat-generating substrates for thermal print heads that can be spliced ​​can be formed. For example, Fig. 9 is a schematic diagram of the structure of a spliced ​​heating substrate for a thermal print head provided according to an embodiment of the present invention, with reference to Fig. 9 The two heating substrates for thermal print heads provided by this embodiment can be directly spliced ​​together to form a new heating substrate for thermal print heads.

[0065] The present embodiment provides a method for manufacturing a heating substrate for a thermal print head, the manufacturing method comprising: first forming a thermal print head assembly, wherein the conductive pattern in the thermal print head assembly corresponds to the heating resistor pattern one by one, the heating resistor is exposed between the first common electrode pattern and the lead-out electrode in the conductive pattern, and the heating resistor is located on the surface of the heat storage glaze coating. Then, forming a first conductive layer, the formed first conductive layer is electrically connected to the first common electrode pattern and the second common electrode pattern of each conductive pattern. The first conductive layer surrounds the first side, back and second side of the insulating substrate, and there is no need to set a circuitous structure to electrically connect the first common electrode pattern and the second common electrode pattern, so that the heating resistor can be set separately, which is conducive to improving the energy tolerance performance of the heating resistor. In addition, the first conductive layer is not set on the surface where the conductive pattern is located, thereby saving the area of ​​the surface where the conductive pattern is located, which is convenient for the subsequent splicing of the heating substrate for the thermal print head. Then, forming an insulating protective layer to protect part of the conductive pattern, the heating resistor and part of the first conductive layer from damage. Finally, cutting along the first cutting line can separate a plurality of heating substrates for thermal print heads. In summary, the manufacturing method provided in this embodiment can manufacture multiple heating substrates for thermal print heads at the same time, thereby improving the manufacturing efficiency. Moreover, the manufactured heating substrates for thermal print heads are easy to splice and have high energy tolerance performance.

[0066] Optional, reference Figures 10 to 12 The steps of forming a thermal print head assembly specifically include:

[0067] S111, providing an insulating substrate, and forming a plurality of heat storage glaze coatings distributed at intervals on the same side of the insulating substrate.

[0068] Specifically, refer to Fig.10 , Fig.10 The schematic diagram of the structure after forming a plurality of heat storage glaze coatings 20 distributed at intervals is formed. Fig.10 The structure shown can be specifically as follows: a parallel plate-shaped insulating substrate 10 composed of aluminum oxide is prepared, a glass glaze slurry is printed on a partial area of ​​the insulating substrate 10, and sintered to form a plurality of spaced thermal storage glaze coatings 20 on the surface of the insulating substrate 10. After the thermal storage glaze coating 20 is formed, a substrate glaze coating 30 can also be formed.

[0069] S112, forming a heating resistor layer and a second conductive layer in sequence on the same side of the insulating substrate and a plurality of thermal storage glaze coatings distributed at intervals.

[0070] Specifically, refer to Fig.11 , Fig.11 Schematic diagram of the structure of forming the heating resistor layer 40 and the second conductive layer 50. A metal ceramic target material, such as a composite material target material formed by tantalum and silicon dioxide, can be used to form the heating resistor layer 40 on the surface of the thermal storage glaze coating 20 by a vacuum film forming method. Then, an aluminum target material is used to form the second conductive layer 50 on the surface of the heating resistor layer 40 away from the insulating substrate 10 by a vacuum film forming method.

[0071] S113, patterning the second conductive layer to form a plurality of conductive patterns arranged in an array, and patterning the heating resistor layer to form a plurality of heating resistor patterns arranged in an array, wherein the heating resistor patterns and the conductive patterns are arranged in a one-to-one correspondence.

[0072] Specifically, refer to Fig.11 and reference Fig.12 According to the necessary information such as printing resolution, a photolithography plate for photolithography is designed and manufactured. The heating resistor layer 40 and the second conductive layer 50 are patterned by photolithography combined with etching to form a plurality of conductive patterns 102 arranged in an array. A plurality of heating resistor patterns arranged in an array (refer to Fig.12 ). By adopting the manufacturing method provided in this embodiment, multiple heating resistor patterns and multiple conductive patterns 102 can be formed by one deposition and one photolithography. It can be seen that the manufacturing method provided in this embodiment is convenient for large-scale production and improves manufacturing efficiency.

[0073] S114. Cut along the second cutting line to obtain multiple thermal print head assemblies, wherein the vertical projection of the second cutting line on the film layer where the heating resistor pattern is located is located between two adjacent heating resistor patterns, the vertical projection of the second cutting line on the film layer where the conductive pattern is located is located between two adjacent conductive patterns, and the second cutting line is parallel to the first side.

[0074] For details, please refer to Fig.12 , the second cutting line B1B2 can be located at Fig.12 The second cutting line B1B2 may be determined before step S114. The second cutting line B1B2 intersects with the first cutting line, and after cutting along the second cutting line B1B2, a plurality of thermal print head assemblies may be formed.

[0075] Optionally, after forming a plurality of spaced-apart heat storage glaze coatings on one side of the insulating substrate, the method further includes: forming a substrate glaze coating on a surface of the insulating substrate where no heat storage glaze coating is provided, wherein the substrate glaze coating and the heat storage glaze coating are located on the same side of the insulating substrate.

[0076] Specifically, in order to prevent the heating resistor layer directly attached to the first surface from falling off due to the roughness of the first surface of the insulating substrate, the present embodiment provides a substrate glaze coating. After the substrate glaze coating is formed, the heating resistor layer is made, so that the heating resistor layer can be better fixed and the surface of the heating resistor layer located on the surface of the substrate glaze coating can be made smoother. The specific method of forming the substrate glaze coating is: printing the glass glaze slurry on the area of ​​the first surface of the insulating substrate where the heat storage glaze coating is not provided and sintering to form the substrate glaze coating. The first surface of the insulating substrate is the surface provided with the heat storage glaze coating.

[0077] Optionally, forming a first conductive layer electrically connected to each first common electrode pattern and each second common electrode pattern specifically includes: forming a photosensitive resin protection pattern on a side of each conductive pattern away from the insulating substrate, wherein the photosensitive resin protection pattern exposes a partial area of ​​each first common electrode pattern close to the first side and a partial area of ​​the second common electrode pattern close to the second side; using a vacuum film forming process to deposit a conductive material on a side of the conductive pattern away from the insulating substrate, and on the first side, back side and second side of the insulating substrate to form a first conductive transition layer; removing the photosensitive resin protection pattern and the conductive material on the surface of the photosensitive resin protection pattern to form a first conductive layer.

[0078] Specifically, the material of the photosensitive resin protection pattern may be photoresist. Fig.13 and Fig.14 For a schematic diagram of the process structure of forming the first conductive layer, refer to Fig.13 and Fig.14Before forming the photosensitive resin protection pattern 61, a photosensitive resin protection layer may be formed first, and then the photosensitive resin protection layer may be photolithographically processed to form the photosensitive resin protection pattern 61 (refer to Fig.13 ), Fig.13 The photosensitive resin protection pattern 61 covers the heating resistor 41, a portion of the first common electrode pattern 51 close to the heating resistor 41, the lead-out electrode 52, and a portion of the second common electrode pattern 53 close to the lead-out electrode 52. The area not covered by the photosensitive resin protection pattern 61 is used to deposit the conductive material of the first conductive layer.

[0079] The formed photosensitive resin protection pattern 61 can prevent the conductive material from covering the heating resistor 41 , the extraction electrode 52 , and the gap between the extraction electrode 52 and the second common electrode pattern 53 when the conductive material of the first conductive layer is deposited. Fig.14 Schematic diagram of the structure of forming the first conductive transition layer 62 after depositing the conductive material. When removing the photosensitive resin protection pattern 61, the conductive material on the surface of the photosensitive resin protection pattern 61 can be removed to form the first conductive layer 60 (i.e., forming Figure 7 structure shown).

[0080] Optionally, after forming an insulating protective layer on the side of the multiple conductive patterns away from the insulating substrate, it also includes: forming an antistatic protective layer on the side of the insulating protective layer away from the insulating substrate, wherein the vertical projection of the antistatic protective layer on the insulating substrate covers the vertical projection of the thermal storage glaze coating on the insulating substrate.

[0081] Specifically, Fig.15 is a schematic structural diagram of a thermal print head assembly including an antistatic protective layer provided according to an embodiment of the present invention, with reference to Fig.15 , an antistatic protective layer 80 may be formed before step S140. The antistatic protective layer 80 has an antistatic effect. Since the heat storage glaze coating layer 20 is relatively convex, it is easy for the heat generating substrate for a thermal print head made in this embodiment to generate static electricity due to friction when used in a printer. Therefore, the vertical projection of the antistatic protective layer 80 on the insulating substrate 10 covers the vertical projection of the heat storage glaze coating layer 20 on the insulating substrate 10, which can improve the static electricity problem caused by friction.

[0082] Optionally, after forming an antistatic protective layer on the side of the insulating protective layer away from the insulating substrate, it also includes: forming a resin protective layer, wherein the resin protective layer includes a first resin protective sublayer, a second resin protective sublayer and a third resin protective sublayer, the first resin protective sublayer is located in a partial area on the side of the antistatic protective layer away from the insulating substrate, the second resin protective sublayer is located on one side of the first conductive layer at the first side edge, and the third resin protective sublayer is located on one side of the first conductive layer at the back side.

[0083] Specifically, Fig.16 is a schematic structural diagram of a thermal print head assembly including a resin protective layer provided according to an embodiment of the present invention, with reference to Fig.16 , part of the first resin protection sublayer 91 is located on the surface of the antistatic protection layer 80 away from the insulating substrate 10. Part of the first resin protection sublayer 91 is located on the surface of part of the extraction electrode 52, and the first resin protection sublayer 91 covering part of the surface of the extraction electrode 52 has the same function as the insulating protection layer 70. The second resin protection sublayer 92 and the third resin protection sublayer 93 are used to protect the first conductive layer 60 from being damaged.

[0084] Optionally, the resin protective layer includes aluminum nitride powder; the average particle size of the aluminum nitride powder is 0.8 μm; and the ratio of the mass of the aluminum nitride powder to the mass of the resin protective layer is 0.12.

[0085] Specifically, adding aluminum nitride powder to the resin protective layer can provide a thermal conductive effect for the resin protective layer, thereby improving the heat dissipation performance of the insulating substrate.

[0086] Optionally, the heating substrate for the thermal print head formed after cutting along the first cutting line further includes an antistatic protective layer and a resin protective layer.

[0087] Specifically, along Fig.16 Another heating substrate for a thermal print head provided in this embodiment can be formed after cutting along the first cutting line in the embodiment. The cross-sectional schematic diagram of the heating substrate for a thermal print head formed is similar to Fig.16 same.

[0088] Optionally, the conductive material includes at least one of aluminum, silver, tungsten, nickel, titanium, chromium and molybdenum.

[0089] Specifically, aluminum, silver, tungsten, nickel, titanium, chromium and molybdenum are easy to obtain and have good conductivity. The first conductive layer made of at least one of aluminum, silver, tungsten, nickel, titanium, chromium and molybdenum can improve the conductivity and reduce the production cost.

[0090] The heating substrate for a thermal print head provided in this embodiment includes: an insulating substrate; a heat storage glaze coating, located on one side of the insulating substrate; a heating resistor pattern, located on the same side of the insulating substrate and the heat storage glaze coating, wherein the heating resistor pattern includes at least one heating resistor located on the surface of the heat storage glaze coating; a conductive pattern, located on the side of the heating resistor pattern away from the insulating substrate; wherein the conductive pattern includes a first common electrode pattern, at least one lead-out electrode and a second common electrode pattern; the heating resistor is exposed at the interval between the first common electrode pattern and the lead-out electrode; a first conductive layer, wherein the first conductive layer surrounds the first side, back and second side of the insulating substrate and is electrically connected to the first common electrode pattern and the second common electrode pattern, and the first side and the second side are arranged opposite to each other; an insulating protective layer, located on the side of the conductive pattern away from the insulating substrate, and the insulating protective layer covers the heating resistor, part of the conductive pattern and part of the first conductive layer.

[0091] For details, please refer to Figure 8 , Figure 8 This is a schematic structural diagram of a heating substrate for a thermal print head provided in this embodiment.

[0092] The heating substrate for a thermal print head provided in this embodiment has corresponding beneficial effects as does the method for manufacturing the heating substrate for a thermal print head provided in any embodiment of the present invention. For technical details not detailed in this embodiment, please refer to the method for manufacturing the heating substrate for a thermal print head provided in any embodiment of the present invention.

[0093] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0094] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a heating substrate for a thermal print head, characterized in that: include: A thermal print head assembly is formed, wherein the thermal print head assembly comprises an insulating substrate, a heat storage glaze coating located on one side of the insulating substrate, a plurality of heating resistor patterns located on the same side of the insulating substrate and the heat storage glaze coating, and a plurality of conductive patterns located on a side of the plurality of heating resistor patterns away from the insulating substrate; the conductive pattern comprises a first common electrode pattern, at least one lead electrode, and a second common electrode pattern; the heating resistor pattern comprises at least one heating resistor located on a surface of the heat storage glaze coating; forming a first conductive layer electrically connected to each of the first common electrode patterns and each of the second common electrode patterns, wherein the first conductive layer surrounds the first side surface, the back surface, and the second side surface of the insulating substrate and is electrically connected to a partial area of ​​each of the first common electrode patterns close to the first side surface and a partial area of ​​each of the second common electrode patterns close to the second side surface, the first side surface is arranged opposite to the second side surface; the back surface is adjacent to the first side surface and the second side surface; forming an insulating protective layer on a side of the plurality of conductive patterns away from the insulating substrate, wherein the insulating protective layer covers the heating resistor, a portion of the conductive patterns and a portion of the first conductive layer; Cutting is performed along a first cutting line to form a plurality of heating substrates for thermal print heads, wherein a vertical projection of the first cutting line on the film layer where the heating resistor pattern is located is located between two adjacent heating resistor patterns, and a vertical projection of the first cutting line on the film layer where the conductive pattern is located is located between two adjacent conductive patterns.

2. The method according to claim 1, characterized in that: The forming of the thermal print head assembly specifically comprises: Providing an insulating substrate, and forming a plurality of heat storage glaze coatings distributed at intervals on the same side of the insulating substrate; Forming a heating resistor layer and a second conductive layer in sequence on the same side of the insulating substrate and the plurality of thermal storage glaze coatings distributed at intervals; The second conductive layer is patterned to form a plurality of conductive patterns arranged in an array, and the heating resistor layer is patterned to form a plurality of heating resistor patterns arranged in an array, wherein the heating resistor patterns are arranged in one-to-one correspondence with the conductive patterns; Cutting is performed along a second cutting line to obtain a plurality of thermal print head assemblies, wherein a vertical projection of the second cutting line on the film layer where the heating resistor pattern is located is located between two adjacent heating resistor patterns, a vertical projection of the second cutting line on the film layer where the conductive pattern is located is located between two adjacent conductive patterns, and the second cutting line is parallel to the first side surface.

3. The method according to claim 2, characterized in that: After forming a plurality of heat storage glaze coatings spaced apart on the same side of the insulating substrate, the method further comprises: A base glaze coating is formed on the surface of the insulating substrate where the heat storage glaze coating is not provided, wherein the base glaze coating and the heat storage glaze coating are located on the same side of the insulating substrate.

4. The method according to claim 1, characterized in that: The forming of the first conductive layer electrically connected to each of the first common electrode patterns and each of the second common electrode patterns specifically includes: A photosensitive resin protection pattern is formed on a side of each of the conductive patterns away from the insulating substrate, wherein the photosensitive resin protection pattern exposes a partial area of ​​each of the first common electrode patterns close to the first side surface and a partial area of ​​each of the second common electrode patterns close to the second side surface; Using a vacuum film forming process, a conductive material is deposited on a side of the conductive pattern away from the insulating substrate, and on a first side, a back side, and a second side of the insulating substrate to form a first conductive transition layer; The photosensitive resin protection pattern and the conductive material on the surface of the photosensitive resin protection pattern are removed to form a first conductive layer.

5. The production method according to any one of claims 1 to 4, characterized in that: After forming the insulating protection layer on the side of the plurality of conductive patterns away from the insulating substrate, the method further comprises: An antistatic protective layer is formed on a side of the insulating protective layer away from the insulating substrate, wherein a vertical projection of the antistatic protective layer on the insulating substrate covers a vertical projection of the thermal storage glaze coating on the insulating substrate.

6. The method according to claim 5, characterized in that: After the antistatic protective layer is formed on a side of the insulating protective layer away from the insulating substrate, the method further includes: A resin protective layer is formed, wherein the resin protective layer includes a first resin protective sublayer, a second resin protective sublayer and a third resin protective sublayer, the first resin protective sublayer is located in a partial area of ​​the antistatic protective layer on a side away from the insulating substrate, the second resin protective sublayer is located on a side of the first conductive layer at the first side, and the third resin protective sublayer is located on a side of the first conductive layer at the back side.

7. The manufacturing method according to claim 6, characterized in that: The resin protective layer includes aluminum nitride powder; The average particle size of the aluminum nitride powder is 0.8 μm; The ratio of the mass of the aluminum nitride powder to the mass of the resin protective layer is 0.

12.

8. The manufacturing method according to claim 6, characterized in that: The heat generating substrate for the thermal print head formed after cutting along the first cutting line further includes an antistatic protective layer and a resin protective layer.

9. The manufacturing method according to claim 4, characterized in that: The conductive material includes at least one of aluminum, silver, tungsten, nickel, titanium, chromium and molybdenum.

10. A heating substrate for a thermal print head, characterized in that: include: Insulating substrate; A heat storage glaze coating is located on one side of the insulating substrate; A heating resistor pattern is located on the same side of the insulating substrate and the heat storage glaze coating, wherein the heating resistor pattern includes at least one heating resistor located on the surface of the heat storage glaze coating; A conductive pattern, located on a side of the heating resistor pattern away from the insulating substrate; wherein the conductive pattern includes a first common electrode pattern, at least one extraction electrode and a second common electrode pattern; the heating resistor is exposed at a gap between the first common electrode pattern and the extraction electrode; A first conductive layer, wherein the first conductive layer surrounds the first side surface, the back surface and the second side surface of the insulating substrate and is electrically connected to a partial area of ​​the first common electrode pattern close to the first side surface and a partial area of ​​the second common electrode pattern close to the second side surface, the first side surface is arranged opposite to the second side surface; the back surface is adjacent to the first side surface and the second side surface; The insulating protection layer is located on a side of the conductive pattern away from the insulating substrate, and the insulating protection layer covers the heating resistor, a part of the conductive pattern and a part of the first conductive layer.

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